JP2013021606A - Solid-state imaging device and imaging device provided therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently hold an image sensor with an electric element disposed on its outer periphery.SOLUTION: A solid-state imaging device comprises: an image sensor such as a CCD or a CMOS; a holding member disposed on the outer periphery of the image sensor; and an electric element disposed between the image sensor and the holding member on at least one side of the image sensor. They are adhesively fixed between the image sensor and the holding member on a side on which the electric element is not disposed.

Description

  The present invention relates to a solid-state imaging device that holds an imaging element provided in an imaging device such as a digital camera and a mounting method of the solid-state imaging device.

  Digital cameras that can capture images in a memory are generally popular. In this digital camera, an image is acquired using an image sensor such as a CCD or a CMOS. The image sensor is disposed at a position where the photographing lens barrel is in focus. There are various methods for fixing these image sensors to the image sensor holder, but there is a problem that the fixing operation is troublesome.

  Several proposals have been made as a response. For example, in Patent Document 1, a plate-like position restricting member is disposed on the back surface of the image sensor, and a hole for the position restricting member is provided from the back surface to be bonded and fixed. Further, in Patent Document 2, a plate is arranged with a certain gap from a thin plate-like package in which a CCD is stored, and an adhesive is poured into the gap between the package and the plate to fix and hold each other. .

JP 11-261904 A JP 2006-173890 A

  However, in the prior art disclosed in Patent Document 1 described above, since the image sensor holder is disposed on the back surface of the image sensor, there is a problem in that the respective thicknesses are stacked and the overall thickness is increased. On the other hand, in the prior art disclosed in Patent Document 2, it is necessary to form a gap between the package and the plate (the image pickup device and the image pickup device holder) while maintaining a certain distance with respect to the four sides.

  However, in recent years, the processing capability of the image sensor has been increased and the number of pixels has increased, and there has been a demand to arrange an electrical element as close to the image sensor as possible. ing.

  In order to solve the above problems, a solid-state imaging device according to the present invention includes an imaging element, a holding member disposed on an outer periphery of the imaging element, and the imaging element and the holding member on at least one side of the imaging element. The image pickup device and the holding member are bonded and fixed at a side where the electric device is not arranged.

  ADVANTAGE OF THE INVENTION According to this invention, even when it wants to arrange | position an electrical element between an image pick-up element and an image pick-up element holder, fixation of an image pick-up element and an image pick-up element holder can be performed efficiently and reliably.

(A) It is a perspective view of the digital camera provided with the solid-state imaging device of this invention. (B) It is a rear view of the digital camera which is one Example of this invention. It is a block diagram which shows the principal part of a structure of the digital camera provided with the solid-state imaging device of this invention. It is a front view of the solid-state imaging device in the example of the present invention. It is a side view of the solid-state imaging device in the example of the present invention.

  Hereinafter, a digital camera including a solid-state imaging device as an example of an embodiment according to the present invention will be described in detail with reference to FIGS.

  1A and 1B show a digital camera 10 as an imaging apparatus having a solid-state imaging apparatus according to the present embodiment. 1A is a front perspective view of the digital camera 10, and FIG. 1B is a rear view of the digital camera 10. FIG. 2 is a block diagram showing a main configuration of the digital camera 10.

  A finder 11 that determines the composition of the subject, an auxiliary light 9 that assists the light source when performing photometric distance measurement, a strobe 12, and a photographic lens barrel 13 that includes a solid-state imaging device are configured in front of the digital camera 10. . On the top surface of the digital camera 10 of the present embodiment, a release button 6, a power switch button 8, and a zoom switch 7 are arranged. Operation buttons 16 to 21 are arranged on the back of the digital camera 10 so that various functions can be switched. In addition to the button shape, the operation button may be a dial or a touch panel on the display 15. An LCD display 15 and a viewfinder eyepiece 14 are arranged. The display 15 is an image display unit, and displays the image data stored in the memory 32 and the image data read from the memory card on the screen.

  Various components such as the release button 6, the operation buttons 16 to 21, the display 15, the memory 32, and the memory card drive 34 are connected to the control unit including the CPU 38, the ROM 37, and the RAM 39. The drive unit 35 is connected to the control unit via a bus 36, and is connected to the zoom mechanism 22, the focus drive mechanism 24, the shutter drive mechanism 26, the aperture drive mechanism 28, the imaging element 1 such as a CCD or CMOS, and the strobe 12. Yes. And each drive is controlled by the signal from a control part. The ROM 37 stores a program for controlling each functional component described above. The RAM 39 stores data necessary for each control program.

  The analog signal processing circuit 29 performs analog processing on the captured image data and outputs it to the A / D converter 30. The A / D converter 30 converts the captured analog data into digital data. This digital data is output to the digital signal processing unit 31, where the digital data is processed. Finally, the digital data is stored in the memory 32.

  The image data stored in the memory 32 and the image data stored in the memory card drive 34 can be expanded by the compression / decompression unit 33, and the image data can be displayed on the display 15 via the bus 36. When the user views the data on the display 15 and determines that the image is unnecessary, the user can delete the image by operating the operation button 21.

  The configuration of the solid-state imaging device provided in the digital camera 10 will be described. FIG. 3 is a front view of the solid-state imaging device provided in the taking lens barrel of the digital camera 10. FIG. 4 shows a side view of the solid-state imaging device.

  An image sensor substrate 5 constituting an entire circuit is disposed on the back surface of the image sensor 1, and the image sensor 1 and the electric element 3 are mounted on the image sensor substrate 5. In the electric element 3, a plurality of resistors, capacitors, and the like for reducing noise and the like are arranged on the outer periphery of the imaging element 1.

  The electric elements 3 are arranged so as to be concentrated only on the two opposite sides of the imaging element 1. For this reason, the holding member 2 is provided with openings (not shown) so as to escape the electric elements 3 provided on the two opposite sides of the imaging element 1. In addition, a space with a constant interval is provided between the imaging element 1 and the holding member 2 with respect to two upper and lower opposing sides where the electric element 3 is not disposed.

  Next, details of a method for fixing the image sensor 1 and the holding member 2 will be described.

  In order to attach and fix the imaging device 1 to the solid-state imaging device, it is necessary to first fix the imaging device 1 to the holding member 2. For this reason, the holding member 2 is disposed on the outer periphery of the image sensor 1. Then, the holding member 2 is disposed within the thickness of the image sensor 1. Thereby, the thickness of the whole solid-state imaging device can be suppressed.

  Then, the adhesive 4 is poured into a space arranged at a constant interval between the image sensor 1 and the holding member 2 to fix the image sensor 1 and the holding member 2. By making the distance between the image sensor 1 and the holding member 2 constant, the adhesive can be easily poured and the adhesive fixing strength becomes uniform.

  In addition, the adhesive material extends over the side (left and right sides) where the electric element 3 is arranged among the corners 1a which are the ends of the sides (upper and lower sides) where the image pickup device 1 and the holding member 2 are bonded and fixed. When 4 is applied and fixed, it becomes possible to fix the adhesive more firmly. That is, it is also possible to bond and fix a part of the side where the electric element is disposed.

  By adopting the above configuration, even when the electric element 3 needs to be arranged around the image pickup element 1, the holding member 2 is arranged within the thickness of the image pickup element 1, so that the entire solid-state image pickup device is efficiently made thicker. Can be adhesively fixed.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary. For example, although the electric element 3 is concentrated on only the left and right sides of the image sensor 1, the electric element 3 may be concentrated only on one side of the image sensor 1 and bonded and fixed on the remaining three sides.

DESCRIPTION OF SYMBOLS 1 Image pick-up element 2 Holding member 3 Electric element 4 Adhesive material

Claims (5)

An image sensor;
A holding member disposed on an outer periphery of the imaging element;
Having at least one side of the image sensor, an electric element disposed between the image sensor and the holding member;
A solid-state image pickup device, wherein the image pickup element and the holding member are bonded and fixed at a side where the electric element is not disposed. The electrical element is disposed on two opposite sides of the imaging element,
The image pickup device and the holding member are bonded and fixed between the image pickup device and the holding member at two opposing sides where the electric element is not disposed. The solid-state imaging device described.   3. The solid-state imaging device according to claim 1, wherein a part of the side where the electric element is disposed is bonded and fixed at an end of the side to be bonded and fixed.   4. The solid-state imaging device according to claim 1, wherein the imaging element and the holding member are bonded and fixed at a constant interval. 5.   The imaging device provided with the solid-state imaging device of any one of Claim 1 thru | or 4.

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