JP2013021029A - Electric power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which enables multiple power terminals to easily connect with a connected end part of a bus bar, reduces the space, and achieves the downsizing.SOLUTION: An electric power conversion apparatus 1 includes: semiconductor modules 2 having power terminals 21; and bus bars 4 with which the power terminals 21 connect. Each power terminal 21 includes a connection end part 213 connecting with the bus bar 4, and each bus bar 4 includes a connected end part 42 having an arrangement surface 421 where the connection end part 213 of the power terminal 21 is disposed and with which the connection end part 213 is connected. The connection end parts 213 of the multiple power terminals 21 are disposed in a lamination manner in the orthogonal direction X on the arrangement surface 421 of the bus bar 4. A non overlapping part 214, which does not overlap with the connection end parts 213 of the other power terminals 21 in the orthogonal direction X, is provided at a tip of the connection end part 213 of each power terminal 21. The non overlapping part 214 is welded to the connected end part 42 of the bus bar 4.

Description

  The present invention relates to a power conversion device including a plurality of semiconductor modules having power terminals and a plurality of bus bars to which the power terminals of the semiconductor modules are connected.

  An electric vehicle, a hybrid vehicle, or the like is equipped with a power conversion device such as an inverter or a converter for converting power supply power into drive power for driving a drive motor. As this power conversion device, for example, there is a device including a plurality of semiconductor modules having power terminals that are electrically connected to the semiconductor elements and a plurality of bus bars to which the power terminals are connected. Reference 1 etc.).

Japanese Patent No. 4052241

  In the power conversion device such as Patent Document 1 described above, one power terminal is connected to the connected end portion of the bus bar by welding. For example, when a plurality of power terminals are to be connected to a connected end portion of a bus bar by welding when trying to save space based on a request for downsizing of a power conversion device, three or more members are used. They must be welded together at the same time, which can make welding difficult.

  The present invention has been made in view of such a background, and can easily connect a plurality of power terminals to a connected end portion of a bus bar, and can achieve power saving and space saving. The device is to be provided.

One aspect of the present invention is a power conversion device including a plurality of semiconductor modules each having a power terminal electrically connected to the semiconductor element, and a plurality of bus bars to which the power terminal is connected. ,
The power terminal includes a connection end to be connected to the bus bar,
The bus bar includes a connection end portion to which the connection end portion of the power terminal is connected and has an arrangement surface on which the connection end portion of the power terminal is disposed.
On the arrangement surface of the bus bar, the connection end portions of a plurality of the power terminals are stacked in an orthogonal direction orthogonal to the arrangement surface of the bus bar,
The tip of the connection end of each power terminal is provided with a non-overlapping portion that does not overlap the connection end of the other power terminal in the orthogonal direction,
The non-overlapping portion of the connection end of each power terminal is welded to the connected end of the bus bar (Claim 1).

According to another aspect of the present invention, there is provided a power conversion device including a plurality of semiconductor modules each including a semiconductor element and having a power terminal electrically connected to the semiconductor element, and a plurality of bus bars to which the power terminal is connected. ,
The power terminal includes a connection end to be connected to the bus bar,
The bus bar includes a connection end portion to which the connection end portion of the power terminal is connected and has an arrangement surface on which the connection end portion of the power terminal is disposed.
On the arrangement surface of the bus bar, the connection end portions of the plurality of power terminals are arranged side by side so as not to overlap each other in an orthogonal direction perpendicular to the arrangement surface of the bus bar,
The power conversion device is characterized in that the connection end of each power terminal is welded to the connected end of the bus bar.

  In the power conversion device according to one aspect of the present invention, the connection end portions of the plurality of power terminals are stacked on the arrangement surface of the bus bar in the orthogonal direction perpendicular to the arrangement surface of the bus bar. In addition, a non-overlapping portion that does not overlap with the connection end of another power terminal in the orthogonal direction is provided at the tip of the connection end of each power terminal. That is, the non-overlapping portion of the connection end portion of each power terminal is disposed to face the connected end portion of the bus bar without overlapping with other power terminals in the orthogonal direction.

  Therefore, by connecting the non-overlapping parts of the connection ends of the plurality of power terminals to the connected ends of the bus bar, the connection ends of the plurality of power terminals can be easily connected to the connected ends of the bus bar. Can be connected. Moreover, each welding becomes welding of the to-be-connected end part of a bus bar, and the connection end part of one power terminal, ie, the welding between two members. Therefore, each welding can be performed easily.

  Further, as described above, the connection end portions of the plurality of power terminals are arranged on the arrangement surface of the connected end portion of the bus bar. Therefore, space saving can be achieved as compared with the conventional case where one power terminal is arranged for the connected end portion of the bus bar. Thereby, size reduction of the whole power converter device is realizable.

In the power conversion device according to another aspect of the present invention described above, the connection end portions of the plurality of power terminals are arranged side by side so as not to overlap each other in the orthogonal direction perpendicular to the arrangement surface of the bus bar. .
Therefore, it is possible to easily connect the connection end portions of the plurality of power terminals to the connected end portion of the bus bar by welding the connection end portions of the plurality of power terminals to the connected end portions of the bus bar, respectively. it can. Moreover, each welding becomes welding of the to-be-connected end part of a bus bar, and the connection end part of one power terminal, ie, the welding between two members. Therefore, each welding can be performed easily.

  Further, as described above, the connection end portions of the plurality of power terminals are arranged on the arrangement surface of the connected end portion of the bus bar. Therefore, space saving can be achieved as compared with the conventional case where one power terminal is arranged for the connected end portion of the bus bar. Thereby, size reduction of the whole power converter device is realizable.

  Thus, according to the one aspect and the other aspect of the present invention, a plurality of power terminals can be easily connected to the connected end portion of the bus bar, and space saving and miniaturization are achieved. The power converter device which can be provided can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. Explanatory drawing which shows the connection part of the power terminal and bus bar in Example 1. FIG. Explanatory drawing which shows the connection edge part of a power terminal and the to-be-connected edge part of a bus bar in Example 1. FIG. Explanatory drawing which shows the welding part of the connection edge part of a power terminal and the to-be-connected edge part of a bus bar in Example 1. FIG. The circuit diagram of the power converter device in Example 1. FIG. Explanatory drawing which shows the connection part of the power terminal and bus bar in Example 2. FIG. Explanatory drawing which shows the welding part of the connection edge part of a power terminal and the to-be-connected edge part of a bus bar in Example 2. FIG. Explanatory drawing which shows the connection end part of a power terminal and the to-be-connected end part of a bus bar in Example 3. FIG. Explanatory drawing which shows the welding part of the connection edge part of a power terminal and the to-be-connected edge part of a bus bar in Example 3. FIG. Explanatory drawing which shows the connection end part of a power terminal and the to-be-connected end part of a bus bar in Example 4. FIG. Explanatory drawing which shows the welding part of the connection edge part of a power terminal and the to-be-connected edge part of a bus bar in Example 4. FIG. Explanatory drawing which shows the connection end part of a power terminal and the to-be-connected end part of a bus bar in Example 4. FIG. Explanatory drawing which shows the welding part of the connection edge part of a power terminal and the to-be-connected edge part of a bus bar in Example 4. FIG. FIG. 10 is an explanatory diagram showing a semiconductor module in Example 5. FIG. 10 is an explanatory diagram showing a semiconductor module in Example 5. Explanatory drawing which shows the connection part of the power terminal and bus bar in Example 5. FIG. FIG. 10 is an explanatory diagram showing a semiconductor module in Example 6. The circuit diagram of the power converter device in Example 6. FIG. FIG. 10 is an explanatory diagram showing a semiconductor module in Example 7. The circuit diagram of the power converter device in Example 7. FIG. FIG. 10 is an explanatory diagram showing a semiconductor module in Example 8. Explanatory drawing which shows the connection part of the power terminal and bus bar in Example 8. FIG. Explanatory drawing which shows the welding part of the connection end part of a power terminal and the to-be-connected end part of a bus bar in Example 8. FIG.

  In one aspect of the present invention, the non-overlapping portion of the connecting end portion of each power terminal is welded to the connected end portion of the bus bar. For example, the tips of the non-polymerized portion of the connecting end portion of the power terminal and the connected end portion of the bus bar are brought close to or in contact with each other, and the portions can be melted to join them.

  Further, the welded portions of the non-overlapping portion of the connecting end portion of the power terminal and the connected end portion of the bus bar can be formed in a pointed tip shape. In this case, when welding, an arc is likely to fly to the welded portion, and the heat capacity of the welded portion is reduced to facilitate melting. Thereby, weldability can be improved.

  In addition, connection end portions of the plurality of power terminals are stacked on the arrangement surface of the bus bar in the orthogonal direction. In other words, there is a distance between the power terminal outside the power terminal adjacent to the bus bar arrangement surface and the bus bar. Therefore, it is necessary to weld the non-overlapping portion of the connecting end portion of the power terminal close to or in contact with the connected end portion of the bus bar by bending the bus bar to the arrangement surface side of the bus bar.

In addition, at least a part of the non-overlapping portion of the connection end portion of the power terminal outside the power terminal adjacent to the arrangement surface of the bus bar is adjacent to the arrangement surface of the bus bar. It is possible to adopt a configuration in which the connection end portion is parallel and coplanar with the non-overlapping portion, and is close to or in contact with the arrangement surface of the bus bar.
In this case, the work of welding the non-overlapping portion of the connecting end portion of the power terminal on the outside to the connected end portion of the bus bar becomes easy.

  In addition, the non-overlapping portions of the connection end portions of the power terminal adjacent to the bus bar arrangement surface and the power terminal located outside thereof are parallel and on the same plane, and are close to or in contact with the bus bar arrangement surface. For example, the non-overlapping portion of the connection end portion of the power terminal on the outside can be bent by pressing or the like.

Further, the connected end portion of the bus bar is provided with a notched portion cut from the tip, and the notched portions are welded to the connected end portion of the bus bar. It can be set as the structure currently formed between the said non-polymerization parts of the said connection edge part of a power terminal (Claim 3).
In this case, when welding the non-overlapping portion of the connection end portion of the power terminal to the connected end portion of the bus bar, the non-overlapping portion of the connection end portion of the adjacent power terminal and the connected end portion of the bus bar It is possible to prevent arc jump to the welded portion.

  In another aspect of the present invention, the connection end of each power terminal is welded to the connected end of the bus bar. For example, the ends of the connection end of the power terminal and the connected end of the bus bar are brought close to or in contact with each other, and the portions can be melted to join them.

  In addition, the welded portions of the connecting ends of the power terminals and the connected end portions of the bus bars, for example, can have a sharpened tip shape. In this case, when welding, an arc is likely to fly to the welded portion, and the heat capacity of the welded portion is reduced to facilitate melting. Thereby, weldability can be improved.

Further, the connected end portion of the bus bar is provided with a notched portion cut from the tip, and the notched portions are welded to the connected end portion of the bus bar. It can be set as the structure currently formed between the said non-polymerization parts of the said connection edge part of a power terminal (Claim 5).
In this case, when welding the non-overlapping portion of the connection end portion of the power terminal to the connected end portion of the bus bar, the non-overlapping portion of the connection end portion of the adjacent power terminal and the connected end portion of the bus bar It is possible to prevent arc jump to the welded portion.

Example 1
The Example concerning a power converter device is described using figures.
As shown in FIGS. 1 to 6, the power conversion device 1 of this example includes a semiconductor element 23 and a plurality of semiconductor modules 2 having a power terminal 21 that is electrically connected to the semiconductor element 23, and the power terminal 21 is connected. A plurality of bus bars 4 are provided.

The power terminal 21 includes a connection end 213 that connects to the bus bar 4. The bus bar 4 has an arrangement surface 421 on which the connection end 213 of the power terminal 21 is disposed, and the connection end 213 of the power terminal 21 A connected end 42 to be connected is provided.
On the arrangement surface 421 of the bus bar 4, the connection end portions 213 of the plurality of power terminals 21 are laminated in the orthogonal direction X orthogonal to the arrangement surface 421 of the bus bar 4. A non-overlapping portion 214 that does not overlap with the connection end 213 of the other power terminal 21 in the orthogonal direction X is provided at the tip of the connection end 213 of each power terminal 21. The non-overlapping portion 214 of the connection end 213 of each power terminal 21 is welded to the connected end 42 of the bus bar 4.
This will be described in detail below.

As shown in FIG. 1, the power conversion device 1 of this example is configured by alternately stacking semiconductor modules 2 and cooling pipes 31, and the cooling pipes 31 are disposed in contact with both main surfaces of the semiconductor module 2.
Each cooling pipe 31 is provided with a refrigerant flow path through which a cooling medium such as water flows. The plurality of cooling pipes 31 are connected to each other by connecting pipes 32 at both ends in the longitudinal direction. In addition, a refrigerant introduction pipe 331 for introducing a cooling medium and a refrigerant discharge pipe 332 for discharging the cooling medium are connected to the cooling pipe 31 arranged at one end in the stacking direction.

  With the above configuration, the cooling medium introduced into the refrigerant introduction pipe 331 flows through the refrigerant flow paths of the plurality of cooling pipes 31. At this time, the cooling medium exchanges heat with the semiconductor module 2 to cool the semiconductor module 2. The cooling medium after the heat exchange is discharged from the refrigerant discharge pipe 332 through the connection pipe 32 from the other end of the cooling pipe 31.

  One semiconductor module 2 is disposed between a pair of adjacent cooling pipes 31. The plurality of semiconductor modules 2 include a semiconductor module 2 (2a) connected to the positive electrode side of the power source and a semiconductor module 2 (2b) connected to the negative electrode side of the power source. They are arranged adjacent to each other in the stacking direction of the module 2 and the cooling pipe 31.

  As shown in FIGS. 2A and 2B, the semiconductor module 2 (2a, 2b) has a main body 20 in which a semiconductor element 23 (FIG. 6) is built. The main body 20 has a card-like rectangular parallelepiped shape having a pair of main surfaces 201 and two pairs of end surfaces 202. A plurality of power terminals 21 are provided so as to protrude from one of a pair of opposed end surfaces 202, and a plurality of control terminals 22 are provided so as to protrude from the other.

  Moreover, the semiconductor element 23 (FIG. 6) built in the main-body part 20 consists of a switching element and a diode. In this example, an IGBT (insulated gate bipolar transistor) is used as the switching element. A flywheel diode is used as the diode.

  As shown in FIG. 2A, one semiconductor module 2a has a positive power terminal 21p connected to a positive bus bar (not shown). The positive side bus bar is connected to the positive side of the power supply. Further, the semiconductor module 2a has a U-phase power terminal 21u, a V-phase power terminal 21v, and a W-phase power terminal 21w connected to a U-phase bus bar, a V-phase bus bar, and a W-phase bus bar (all not shown). The U-phase bus bar, V-phase bus bar, and W-phase bus bar are connected to the U-phase, V-phase, and W-phase electrodes of the three-phase AC rotating electrical machine.

  As shown in FIG. 2B, the other semiconductor module 2b has a negative-side power terminal 21n connected to a negative-side bus bar (not shown). The negative side bus bar is connected to the negative side of the power source. Further, the semiconductor module 2b has a U-phase power terminal 21u, a V-phase power terminal 21v, and a W-phase power terminal 21w connected to a U-phase bus bar, a V-phase bus bar, and a W-phase bus bar (all not shown). The U-phase bus bar, V-phase bus bar, and W-phase bus bar are connected to the U-phase, V-phase, and W-phase electrodes of the three-phase AC rotating electrical machine.

Although not shown, the positive power terminal 21p of one semiconductor module 2a is connected to the positive bus bar by welding, and the negative power terminal 21n of the other semiconductor module 2b is connected to the negative bus bar. Are connected by welding.
In addition, the U-phase power terminals 21u are connected to the same U-phase bus bar by welding between the one semiconductor module 2a and the other semiconductor module 2b. The V-phase power terminals 21v and the W-phase power terminals 21w are also connected to the same V-phase bus bar and W-phase bus bar by welding.

  Hereinafter, as an example, as shown in FIG. 3, connection of W-phase power terminals 21 w (hereinafter simply referred to as power terminals 21) of both semiconductor modules 2 a and 2 b to W-phase bus bars (hereinafter simply referred to as bus bars 4). Will be described. The power terminal 21 of one semiconductor module 2 is referred to as a power terminal 21a, and the power terminal 21 of the other semiconductor module 2b is referred to as a power terminal 21b.

  As shown in the figure, the power terminals 21a and 21b are flat and have a protruding portion 211 protruding from the main body portion 20, an extending portion 212 extending at a right angle from the tip of the protruding portion 211, and an extending portion. 212 has a connection end 213 that is bent at a right angle from the tip of 212 and extends in the protruding direction of the protruding portion 211 and is connected to the bus bar 4.

  The bus bar 4 has a flat plate-like main body portion 41 and a connected end portion 42 that is bent at a right angle from the front end of the main body portion 41 and connected to the connection end portion 213 of the power terminal 21. The connected end 42 has an arrangement surface 421 on which one end of the connection end 213 of the power terminal 21 is arranged.

As shown in FIGS. 4 and 5, the arrangement surface 421 of the bus bar 4 has an orthogonal direction X in which the connection end portions 213 of the two power terminals 21 are orthogonal to the arrangement surface 421 of the bus bar 4 (hereinafter simply referred to as the orthogonal direction X). Are stacked so as to overlap each other.
A non-overlapping portion 214 that does not overlap with the connection end 213 of the other power terminal 21 in the orthogonal direction X is provided at the tip of the connection end 213 of each power terminal 21a, 21b.

  Specifically, as shown in FIG. 4, the non-overlapping portion 214 of one power terminal 21 a is formed by cutting out one side in the width direction at the distal end portion of the connection end portion 213, and forming it on the opposite side. Further, the non-overlapping portion 214 of the other power terminal 21b is formed by cutting away the other side in the width direction at the distal end portion of the connection end portion 213 and on the opposite side. That is, the non-overlapping portions of the power terminals 21a and 21b are formed alternately so as not to overlap in the orthogonal direction X.

As shown in FIG. 5, the non-overlapping portion 214 of the connection end 213 of each power terminal 21 a, 21 b is welded to the connected end 42 of the bus bar 4.
Specifically, the ends of the non-polymerized portion 214 of the connection end portion 213 of the power terminals 21a and 21b and the connected end portion 42 of the bus bar 4 are brought into contact with each other, and the two portions are melted to join each other. Yes (welded part 51 in the figure).

  At this time, the power terminal 21 a outside the power terminal 21 b adjacent to the arrangement surface 421 of the bus bar 4 has a distance from the bus bar 4. Therefore, the non-overlapping portion 214 of the connection end portion 213 of the outer power terminal 21a is bent toward the arrangement surface 421 side of the bus bar 4 and brought into contact with the connected end portion 42 of the bus bar 4 and welded.

Next, the circuit configuration of the power conversion device 1 of this example will be described.
As shown in FIG. 6, the power conversion device 1 includes a booster circuit 61 that boosts the DC voltage of the power supply 19 and an inverter circuit 62 that converts the boosted DC voltage into an AC voltage.
The booster circuit 61 includes a plurality of semiconductor elements 23. Each semiconductor element 23 includes a switching element (IGBT element) 231 and a flywheel diode 232 connected in reverse parallel to the switching element 231.

The inverter circuit 62 includes a plurality of semiconductor elements 23. Each semiconductor element 23 includes a switching element (IGBT element) 231 and a flywheel diode 232 connected in reverse parallel to the switching element 231. The semiconductor element 23 includes a positive-side semiconductor element 23p connected to the positive-side bus bar and a negative-side semiconductor element 23n connected to the negative-side bus bar.
One semiconductor module 2a (FIG. 2A) includes three positive-side semiconductor elements 23p, and the other semiconductor module 2b (FIG. 2B) includes three negative electrodes. A side semiconductor element 23n is incorporated.

Next, the effect in the power converter device 1 of this example is demonstrated.
In the power conversion device 1 of this example, the connection end portions 213 of the plurality of power terminals 21 are stacked on the arrangement surface 421 of the bus bar 4 in the orthogonal direction X orthogonal to the arrangement surface 421 of the bus bar 4. Further, a non-overlapping portion 214 that does not overlap with the connection end 213 of the other power terminal 21 in the orthogonal direction X is provided at the distal end of the connection end 213 of each power terminal 21. That is, the non-overlapping portion 214 of the connection end portion 213 of each power terminal 21 is disposed to face the connected end portion 42 of the bus bar 4 without overlapping with the other power terminals 21 in the orthogonal direction X. Become.

  Therefore, a plurality of power terminals are connected to the connected end portion 42 of the bus bar 4 by welding the non-overlapping portions 214 of the connection end portions 213 of the plurality of power terminals 21 to the connected end portions 42 of the bus bar 4 respectively. 21 connection end portions 213 can be easily connected. Each welding is welding of the connected end portion 42 of the bus bar 4 and the connecting end portion 213 of one power terminal 21, that is, welding between two members. Therefore, each welding can be performed easily.

  In addition, as described above, the connection end portions 213 of the plurality of power terminals 21 are arranged on the arrangement surface 421 of the connected end portion 42 of the bus bar 4. Therefore, space saving can be achieved compared with the conventional case where one power terminal 21 is arranged with respect to the connected end portion 42 of the bus bar 4. Thereby, size reduction of the whole power converter device 1 is realizable.

  Thus, according to this example, the power converter device can easily connect the plurality of power terminals 21 to the connected end portion 42 of the bus bar 4, and can achieve space saving and downsizing. 1 can be provided.

(Example 2)
In this example, as shown in FIGS. 7 and 8, the configuration of the connection end 213 of the power terminal 21 is changed.
In this example, as shown in the figure, the non-overlapping portion 214 of the connection end portion 213 of the power terminal 21 a located outside the power terminal 21 b adjacent to the arrangement surface 421 of the bus bar 4 is adjacent to the arrangement surface 421 of the bus bar 4. The connection end 213 of the power terminal 21b to be connected is parallel to and flush with the non-overlapping portion 214 and is close to (in contact with) the arrangement surface 421 of the bus bar 4.

The non-overlapping portion 214 of the connection end portion 213 of the outer power terminal 21a is bent in the orthogonal direction X toward the arrangement surface 421 side of the bus bar 4 and further parallel to the arrangement surface 421 of the bus bar 4 by pressing. It is bent in the direction. As a result, the non-overlapping portion 214 of the connection end portion 213 of the power terminal 21b adjacent to the arrangement surface 421 of the bus bar 4 is parallel to and on the same plane, and is close to (contacted with) the arrangement surface 421 of the bus bar 4.
Other configurations are the same as those in the first embodiment.

In the case of this example, the operation | work which welds the non-overlapping part 214 of the connection end part 213 of the power terminal 21a in the outer side with respect to the to-be-connected end part 42 of the bus bar 4 becomes easy.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIGS. 9 and 10, the configuration of the connected end 42 of the bus bar 4 is changed.
In this example, as shown in the figure, the connected end portion 42 of the bus bar 4 is provided with a notch portion 422 cut from the tip. The notch portion 422 is formed between the non-overlapping portions 214 of the connection end portions 213 of the two power terminals 21 a and 21 b welded to the connected end portion 42 of the bus bar 4. That is, the non-overlapping portions 214 of the connection end portions 213 of the power terminals 21a and 21b are respectively arranged and welded on both sides of the notch portion 422 of the connected end portion 42 of the bus bar 4.
Other configurations are the same as those in the first embodiment.

In the case of this example, when welding the non-overlapping part 214 of the connection end part 213 of each power terminal 21a, 21b with respect to the to-be-connected end part 42 of the bus bar 4, connection of adjacent power terminal 21a, 21b is carried out. Arc jump to the welded portion between the non-overlapping portion 214 of the end portion 213 and the connected end portion 42 of the bus bar 4 can be prevented.
In addition, the same effects as those of the first embodiment are obtained.

Example 4
In this example, as shown in FIGS. 11 to 14, the configuration of the connection end 213 of the power terminal 21 and the connected end 42 of the bus bar 4 is changed.
In this example, as shown in the figure, the welded portion between the non-overlapping portion 214 of the connecting end portion 213 of the power terminals 21a and 21b and the connected end portion 42 of the bus bar 4 has a pointed tip shape.

  That is, in the example shown in FIGS. 11 and 12, the non-overlapping portion 214 of the connection end portion 213 of both the power terminals 21a and 21b has a pointed tip shape. Further, in the connected end portion 42 of the bus bar 4, the portions where the non-overlapping portions 214 of the connection end portions 213 of the respective power terminals 21 a and 21 b are welded have pointed tips.

Moreover, in the example shown in FIG. 13, FIG. 14, the to-be-connected end part 42 of the bus bar 4 becomes a pointed tip shape. Further, the non-overlapping portion 214 of the connecting end portion 213 of both power terminals 21a and 21b has a shape that follows the shape of the tip of the connected end portion 42 of the bus bar 4, and is just the connected end portion of the bus bar 4. The shape is such that it is divided into two from the apex portion at the tip of 42.
Other configurations are the same as those in the first embodiment.

In the case of this example, when welding the tips of the non-polymerized portion 214 of the connection end portion 213 of the power terminals 21a and 21b and the connected end portion 42 of the bus bar 4, an arc can easily fly to the welded portion. The heat capacity of the welded portion is reduced and it is easy to melt. Thereby, weldability can be improved.
In addition, the same effects as those of the first embodiment are obtained.

(Example 5)
In this example, as shown in FIGS. 15 to 17, the configuration of the semiconductor module 2 is changed.
In this example, as shown in FIG. 17, in the stacking direction of the semiconductor module 2 and the cooling pipe 3, the semiconductor modules 2a connected to the positive electrode side of the power supply are arranged side by side so as to be adjacent to each other and are connected in parallel. . Further, the semiconductor modules 2b connected to the negative side of the power supply are arranged side by side so as to be adjacent to each other, and are connected in parallel.

As shown in FIG. 15A, one of the semiconductor modules 2a has a positive power terminal 21p connected to a positive bus bar (not shown). Further, the semiconductor module 2a has a U-phase power terminal 21u, a V-phase power terminal 21v, and a W-phase power terminal 21w connected to a U-phase bus bar, a V-phase bus bar, and a W-phase bus bar (all not shown).
As shown in FIG. 15B, the other of the semiconductor modules 2a is the same as the other.

  As shown in FIG. 17, in both semiconductor modules 2a, the positive power terminals 21p are connected to the positive bus bar by welding. The U-phase power terminals 21u, the V-phase power terminals 21v, and the W-phase power terminals 21w are also connected to the same U-phase bus bar, V-phase bus bar, and W-phase bus bar by welding. In FIG. 17, as an example, connection of the power terminals (W-phase power terminals) 21 of both semiconductor modules 2a to the bus bar (W-phase bus bar) 4 is shown.

As shown in FIG. 16A, one of the semiconductor modules 2b has a negative power terminal 21n connected to a negative bus bar (not shown). Further, the semiconductor module 2b has a U-phase power terminal 21u, a V-phase power terminal 21v, and a W-phase power terminal 21w connected to a U-phase bus bar, a V-phase bus bar, and a W-phase bus bar (all not shown).
As shown in FIG. 15B, the other of the semiconductor modules 2b is the same as the other.

  As shown in FIG. 17, in both the semiconductor modules 2b, the negative power terminals 21n are connected to the positive bus bar by welding. The U-phase power terminals 21u, the V-phase power terminals 21v, and the W-phase power terminals 21w are also connected to the same U-phase bus bar, V-phase bus bar, and W-phase bus bar by welding. In FIG. 17, as an example, connection of the power terminals (W-phase power terminals) 21 of both semiconductor modules 2b to the bus bar (W-phase bus bar) 4 is shown.

Furthermore, in this example, as shown in the figure, the power terminals 21a of both semiconductor modules 2a and the power terminals 21b of both semiconductor modules b are all connected to the same bus bar 4.
The other configuration is the same as that of the first embodiment, and has the same operation and effect.

(Example 6)
In this example, as shown in FIGS. 18 and 19, the configuration of the semiconductor module 2 is changed.
In this example, as shown in FIG. 18A, in the stacking direction of the semiconductor module 2 and the cooling pipe 3, one of the adjacent semiconductor modules 2 is connected to a positive-side bus bar (not shown). 21p and a negative electrode side power terminal 21n connected to a negative electrode bus bar (not shown). Moreover, it has the W-phase power terminal 21w connected to a W-phase bus bar (not shown). Instead of the W-phase power terminal 21w, a U-phase power terminal 21u and a V-phase power terminal 21v connected to the U-phase bus bar and the V-phase bus bar may be used.
As shown in FIG. 18B, the other of the semiconductor modules 2 is the same as the other.

  Although not shown, in both semiconductor modules 2, the positive power terminals 21p are connected to the same positive bus bar by welding. Further, the negative electrode side power terminals 21n are connected to the same negative electrode bus bar by welding. Further, the W-phase power terminals 21w are connected to the same W-phase bus bar by welding.

As shown in FIG. 19, the semiconductor module 2 includes one positive-side semiconductor element 23p and one negative-side semiconductor element 23n. The semiconductor modules 2 are connected in parallel.
The other configuration is the same as that of the first embodiment, and has the same operation and effect.

(Example 7)
In this example, as shown in FIGS. 20 and 21, the configuration of the semiconductor module 2 is changed.
In this example, as shown in FIG. 20A, in the stacking direction of the semiconductor module 2 and the cooling pipe 3, one of the adjacent semiconductor modules 2 is connected to a positive-side bus bar (not shown). 21p and a negative electrode side power terminal 21n connected to a negative electrode bus bar (not shown). In addition, it has a U-phase power terminal 21u, a V-phase power terminal 21v, and a W-phase power terminal 21w connected to a U-phase bus bar, a V-phase bus bar, and a W-phase bus bar (all not shown).
As shown in FIG. 20B, the other of the semiconductor modules 2 is the same as the other.

  Although not shown, in both semiconductor modules 2, the positive power terminals 21p are connected to the same positive bus bar by welding. Further, the negative electrode side power terminals 21n are connected to the same negative electrode bus bar by welding. The U-phase power terminals 21u, the V-phase power terminals 21v, and the W-phase power terminals 21w are connected to the same U-phase bus bar, V-phase bus bar, and W-phase bus bar by welding.

As shown in FIG. 21, the semiconductor module 2 includes three positive-side semiconductor elements 23p and three negative-side semiconductor elements 23n. The semiconductor modules 2 are connected in parallel.
The other configuration is the same as that of the first embodiment, and has the same operation and effect.

(Example 8)
The Example concerning a power converter device is described using figures.
As shown in FIGS. 22 to 24, the power conversion apparatus 1 of this example includes a semiconductor element 23 and a plurality of semiconductor modules 2 having a power terminal 21 that is electrically connected to the semiconductor element 23, and the power terminal 21 is connected. A plurality of bus bars 4 are provided.

The power terminal 21 includes a connection end 213 that connects to the bus bar 4. The bus bar 4 has an arrangement surface 421 on which the connection end 213 of the power terminal 21 is disposed, and the connection end 213 of the power terminal 21 A connected end 42 to be connected is provided.
On the arrangement surface 421 of the bus bar 4, the connection end portions 213 of the plurality of power terminals 21 are arranged side by side so as not to overlap each other in the orthogonal direction X orthogonal to the arrangement surface 421 of the bus bar 4. The connection end 213 of each power terminal 21 is welded to the connected end 42 of the bus bar 4.
This will be described in detail below.

As shown in FIG. 1, the power conversion apparatus 1 of this example is configured by alternately stacking semiconductor modules 2 and cooling pipes 31, and cooling pipes 3 are disposed in contact with both main surfaces of the semiconductor module 2.
Each cooling pipe 31 is provided with a refrigerant flow path through which a cooling medium such as water flows. The plurality of cooling pipes 31 are connected to each other by connecting pipes 32 at both ends in the longitudinal direction. In addition, a refrigerant introduction pipe 331 for introducing a cooling medium and a refrigerant discharge pipe 332 for discharging the cooling medium are connected to the cooling pipe 31 arranged at one end in the stacking direction.

  With the above configuration, the cooling medium introduced into the refrigerant introduction pipe 331 flows through the refrigerant flow paths of the plurality of cooling pipes 31. At this time, the cooling medium exchanges heat with the semiconductor module 2 to cool the semiconductor module 2. The cooling medium after the heat exchange is discharged from the other end of the cooling pipe 31 to the refrigerant discharge pipe 332 via the connecting pipe 32.

  One semiconductor module 2 is disposed between a pair of adjacent cooling pipes 31. The plurality of semiconductor modules 2 include a semiconductor module 2 (2a) connected to the positive electrode side of the power source and a semiconductor module 2 (2b) connected to the negative electrode side of the power source. They are arranged adjacent to each other in the stacking direction of the module 2 and the cooling pipe 31.

  As shown in FIGS. 22A and 22B, the semiconductor module 2 (2a, 2b) has a main body portion 20 containing a semiconductor element 23 (see FIG. 6). The main body 20 has a card-like rectangular parallelepiped shape having a pair of main surfaces 201 and two pairs of end surfaces 202. A plurality of power terminals 21 are provided so as to protrude from one of a pair of opposed end surfaces 202, and a plurality of control terminals 22 are provided so as to protrude from the other.

  In addition, the semiconductor element 23 (see FIG. 6) built in the main body 20 includes a switching element and a diode. In this example, an IGBT (insulated gate bipolar transistor) is used as the switching element. A flywheel diode is used as the diode.

  As shown in FIG. 22A, one semiconductor module 2a has a positive power terminal 21p connected to a positive bus bar (not shown). The positive side bus bar is connected to the positive side of the power supply. Further, the semiconductor module 2a has a U-phase power terminal 21u, a V-phase power terminal 21v, and a W-phase power terminal 21w connected to a U-phase bus bar, a V-phase bus bar, and a W-phase bus bar (all not shown). The U-phase bus bar, V-phase bus bar, and W-phase bus bar are connected to the U-phase, V-phase, and W-phase electrodes of the three-phase AC rotating electrical machine.

  As shown in FIG. 22B, the other semiconductor module 2b has a negative-side power terminal 21n connected to a negative-side bus bar (not shown). The negative side bus bar is connected to the negative side of the power source. Further, the semiconductor module 2b has a U-phase power terminal 21u, a V-phase power terminal 21v, and a W-phase power terminal 21w connected to a U-phase bus bar, a V-phase bus bar, and a W-phase bus bar (all not shown). The U-phase bus bar, V-phase bus bar, and W-phase bus bar are connected to the U-phase, V-phase, and W-phase electrodes of the three-phase AC rotating electrical machine.

Although not shown, the positive power terminal 21p of one semiconductor module 2a is connected to the positive bus bar by welding, and the negative power terminal 21n of the other semiconductor module 2b is connected to the negative bus bar. Are connected by welding.
In addition, the U-phase power terminals 21u are connected to the same U-phase bus bar by welding between the one semiconductor module 2a and the other semiconductor module 2b. The V-phase power terminals 21v and the W-phase power terminals 21w are also connected to the same V-phase bus bar and W-phase bus bar by welding.

  Hereinafter, as an example, as shown in FIG. 23, connection of W-phase power terminals 21w (hereinafter, simply referred to as power terminals 21) of both semiconductor modules 2a, 2b to a W-phase bus bar (hereinafter, simply referred to as bus bar 4). Will be described. The power terminal 21 of one semiconductor module 2 is referred to as a power terminal 21a, and the power terminal 21 of the other semiconductor module 2b is referred to as a power terminal 21b.

  As shown in the figure, the power terminals 21a and 21b are flat and have a protruding portion 211 protruding from the main body portion 20, an extending portion 212 extending at a right angle from the tip of the protruding portion 211, and an extending portion. 212 has a connection end 213 that is bent at a right angle from the tip of 212 and extends in the protruding direction of the protruding portion 211 and is connected to the bus bar 4.

  The bus bar 4 has a flat plate-like main body portion 41 and a connected end portion 42 that is bent at a right angle from the front end of the main body portion 41 and connected to the connection end portion 213 of the power terminal 21. The connected end 42 has an arrangement surface 421 on which one end of the connection end 213 of the power terminal 21 is arranged.

As shown in FIG. 24, the arrangement surface 421 of the bus bar 4 overlaps the connection ends 213 of the two power terminals 21 in the orthogonal direction X (hereinafter simply referred to as the orthogonal direction X) orthogonal to the arrangement surface 421 of the bus bar 4. It is arranged side by side so as not to become.
The connection end portions 213 of the power terminals 21 a and 21 b are welded to the connected end portions 42 of the bus bar 4. Specifically, the ends of the connecting end portion 213 of the power terminal 21 and the connected end portion 42 of the bus bar 4 are brought into contact with each other and melted to join the two (the welded portion in the figure). 51).

Next, the circuit configuration of the power conversion device 1 of this example will be described.
As shown in FIG. 6, the power conversion apparatus 1 includes a booster circuit 61 that boosts the DC voltage of the power supply 19 and an inverter circuit 62 that converts the boosted DC voltage into an AC voltage.
The booster circuit 61 includes a plurality of semiconductor elements 23. Each semiconductor element 23 includes a switching element (IGBT element) 231 and a flywheel diode 232 connected in reverse parallel to the switching element 231.

The inverter circuit 62 includes a plurality of semiconductor elements 23. Each semiconductor element 23 includes a switching element (IGBT element) 231 and a flywheel diode 232 connected in reverse parallel to the switching element 231. The semiconductor element 23 includes a positive-side semiconductor element 23p connected to the positive-side bus bar and a negative-side semiconductor element 23n connected to the negative-side bus bar.
One semiconductor module 2a (FIG. 22A) includes three positive-side semiconductor elements 23p, and the other semiconductor module 2b (FIG. 22B) includes three negative electrodes. A side semiconductor element 23n is incorporated.

Next, the effect in the power converter device 1 of this example is demonstrated.
In the power conversion device 1 of the present example, the connection end portions 213 of the plurality of power terminals 21 are arranged side by side on the arrangement surface 421 of the bus bar 4 so as not to overlap each other in the orthogonal direction X orthogonal to the arrangement surface 421 of the bus bar 4. Has been.
Therefore, the connection end portions of the plurality of power terminals 21 are connected to the connected end portions 42 of the bus bar 4 by welding the connection end portions 213 of the plurality of power terminals 21 to the connected end portions 42 of the bus bar 4. 213 can be easily connected. Each welding is welding of the connected end portion 42 of the bus bar 4 and the connecting end portion 213 of one power terminal 21, that is, welding between two members. Therefore, each welding can be performed easily.

  In addition, as described above, the connection end portions 213 of the plurality of power terminals 21 are arranged on the arrangement surface 421 of the connected end portion 42 of the bus bar 4. Therefore, space saving can be achieved compared with the conventional case where one power terminal 21 is arranged with respect to the connected end portion 42 of the bus bar 4. Thereby, size reduction of the whole power converter device 1 is realizable.

  Thus, according to this example, the power converter device can easily connect the plurality of power terminals 21 to the connected end portion 42 of the bus bar 4, and can achieve space saving and downsizing. 1 can be provided.

  Also in the configuration of this example, the configuration of the connected end 42 of the bus bar 4 is changed as in the third embodiment, or the connected end 213 of the power terminal 21 and the connected bus bar 4 are connected as in the fourth embodiment. The configuration of the end portion 42 can be changed, or the configuration of the semiconductor module 2 can be changed as in the fifth to seventh embodiments.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 21 Power terminal 23 Semiconductor element 213 Connection end part 214 Non-polymerization part 4 Bus bar 42 Connection end part 421 Arrangement surface X Orthogonal direction

Claims (5)

In a power conversion device comprising a plurality of semiconductor modules having a power terminal that is electrically connected to the semiconductor element, and a plurality of bus bars to which the power terminal is connected.
The power terminal includes a connection end to be connected to the bus bar,
The bus bar includes a connection end portion to which the connection end portion of the power terminal is connected and has an arrangement surface on which the connection end portion of the power terminal is disposed.
On the arrangement surface of the bus bar, the connection end portions of a plurality of the power terminals are stacked in an orthogonal direction orthogonal to the arrangement surface of the bus bar,
The tip of the connection end of each power terminal is provided with a non-overlapping portion that does not overlap the connection end of the other power terminal in the orthogonal direction,
The non-overlapping portion of the connection end of each power terminal is welded to the connected end of the bus bar.   2. The power conversion device according to claim 1, wherein at least a part of the non-overlapping portion of the connection end portion of the power terminal that is outside the power terminal adjacent to the arrangement surface of the bus bar is the bus bar. The power conversion device, wherein the power conversion device is parallel and flush with the non-overlapping portion of the connection end portion of the power terminal adjacent to the arrangement surface, and is close to or in contact with the arrangement surface of the bus bar.   3. The power conversion device according to claim 1, wherein the connected end portion of the bus bar is provided with a notched portion cut from a tip thereof, and the notched portion is connected to the bus bar. A power conversion device, wherein the power conversion device is formed between the non-overlapping portions of the connection end portions of the plurality of power terminals welded to the end portions. In a power conversion device comprising a plurality of semiconductor modules having a power terminal that is electrically connected to the semiconductor element, and a plurality of bus bars to which the power terminal is connected.
The power terminal includes a connection end to be connected to the bus bar,
The bus bar includes a connection end portion to which the connection end portion of the power terminal is connected and has an arrangement surface on which the connection end portion of the power terminal is disposed.
On the arrangement surface of the bus bar, the connection end portions of the plurality of power terminals are arranged side by side so as not to overlap each other in an orthogonal direction perpendicular to the arrangement surface of the bus bar,
The power conversion device, wherein the connection end of each power terminal is welded to the connected end of the bus bar.   5. The power conversion device according to claim 4, wherein the connected end portion of the bus bar is provided with a notched portion cut from a tip thereof, and the notched portion is the connected end portion of the bus bar. The power conversion device is formed between the non-overlapping portions of the connection end portions of the plurality of power terminals welded to each other.

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