JP2013020914A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket capable of transporting a semiconductor device to a normal inspection position even if a margin region on the lower surface of a package is narrowed.SOLUTION: A semiconductor device support part 31 is slidable so as to evacuate to the outside of an opening part 21. This IC socket has a floating plate 41 provided in a socket guide 10 so as to be able to support a blank region 102 of a semiconductor chip 100 received by an insert 20 and energized upward. The IC socket includes a first stroke and a subsequent second stroke as conveyance strokes applied from when the semiconductor chip 100 is received in the insert 20 to when external terminals 110 of the semiconductor chip 100 are brought into contact with pogo pins 11. The IC socket is structured such that during the first stroke, the floating plate 41 starts supporting the semiconductor chip 100, on the other hand, the semiconductor device support part 31 finishes supporting the semiconductor chip 100, and during the second stroke, after the semiconductor device support part 31 completes evacuation from the opening part 21, the external terminals 110 of the semiconductor chip 100 are brought into contact with the pogo pins 11.

Description

  The present invention relates to an IC socket used when conducting an energization test or the like of a semiconductor device.

  2. Description of the Related Art In recent years, with the miniaturization and high performance of electronic devices, the density and the number of pins of semiconductor devices used in electronic devices are increasing. Therefore, as a connection structure between the semiconductor device and the substrate, a structure such as a BGA (Ball Grid Array) in which external terminals such as solder balls and bumps are arranged in a lattice pattern on the back surface of the semiconductor device may be used.

  On the other hand, when performing product inspection such as energization inspection of a semiconductor device having a BGA structure, a dedicated IC socket including a contact member having an array shape corresponding to the array of external terminals is required.

  As such an IC socket, for example, as described in Patent Document 1, a socket guide having a contact member that contacts an external terminal such as a solder ball or a bump of a semiconductor device, and a socket guide that can be connected to the socket guide are provided. An insert for receiving the supplied semiconductor device as an inspection object and transporting it to the inspection position on the socket guide; and a contact member for connecting the semiconductor device at the inspection position to the socket guide. Some have a pusher that presses to the side.

  In such an IC socket, the insert is formed so as to penetrate through the plate thickness in the central region thereof, and has an opening that receives the semiconductor device, and protrudes inward from the wall surface of the opening on the plate thickness lower surface side. And a semiconductor device support portion for supporting the device. The semiconductor device support portion of the insert supports a margin region (overhang region) on the lower surface of the package of the semiconductor device. Here, the margin region is a blank portion between the outer edge of the lower surface of the package and one formed on the outermost periphery of the external terminals formed on the lower surface.

  When performing product inspection such as energization inspection of the semiconductor device, the IC socket insert receives the semiconductor device to be measured in the opening, and supports the margin area of the semiconductor device by the semiconductor device support portion. As a result, the entire insert descends toward the socket guide. Then, the semiconductor device received in the insert reaches the inspection position. That is, the external terminals formed on the lower surface of the package of the semiconductor device come into contact with the contact members arranged in the socket guide. Next, the semiconductor device is energized through the contact member and the external terminal, and product inspection such as energization inspection is performed.

JP 2010-129505 A

  By the way, the above-mentioned downsizing of electronic devices, high density of semiconductor devices accompanying high performance, and multi-pins are achieved by reducing the diameter of external terminals such as solder balls and bumps and narrowing the pitch (narrow center distance). In addition to narrowing the spacing, the package dimensions are also being reduced. As the mold outer dimensions are reduced, the margin area on the lower surface of the package is becoming narrower. For example, some of the former margin widths were 0.5 mm or more, but some have been narrowed to about 0.4 mm. When the width is reduced to about 0.4 mm, it becomes difficult to hold the semiconductor device by the support portion.

  In response to such a situation, in the above-described IC socket, it has become difficult to receive and transport the semiconductor device by the semiconductor device support portion of the insert. That is, when the margin area on the lower surface of the package is narrowed, the semiconductor device is socketed with external terminals such as solder balls and bumps mounted on the semiconductor device support portion of the insert that is supposed to support the margin area. It will be conveyed toward the guide. For this reason, the semiconductor device does not descend to the correct inspection position by the height (thickness) of the external terminal. As a result, the contact member does not reach the external terminal and normal electrical contact is not made.

  Alternatively, if the protrusion size of the semiconductor device support portion is set to be small according to the narrowed margin region, the semiconductor device cannot be stably supported due to the yield of the package size of the semiconductor device. Even if the semiconductor device falls from the insert during transportation or can be transported to the socket guide side, the contact member and the external terminal may be misaligned, and normal electrical contact between them may not be achieved.

  Therefore, an object of the present invention is to provide an IC socket capable of transporting a semiconductor device having a narrow margin area on the lower surface of a package to a normal inspection position.

  According to the present invention, there is provided an IC socket applied to an electronic device that conducts an energization inspection of a semiconductor device provided with an external terminal around a blank area on the lower surface of a package, and a contact member corresponding to the external terminal of the semiconductor device. A socket guide, and an insert that is provided on the socket guide so as to be movable up and down, and that receives the semiconductor device and descends to transport the received semiconductor device toward the socket guide. An opening formed so as to penetrate the semiconductor device in the vertical movement direction, and a portion protruding into the opening below the opening to support the semiconductor device received in the opening. An IC socket including a semiconductor device support portion provided so as to include a portion of the semiconductor device support portion that protrudes into the opening and retracts outside the opening. A floating plate which is slidable in a direction to be supported, is provided on the socket guide so as to be able to support a blank area of the semiconductor device received in the insert, is movable up and down, and is biased upward. And a first stroke followed by a second stroke as a transport stroke from when the semiconductor device is received by the insert until the external terminal of the semiconductor device contacts the contact member, In one stroke, the floating plate comes into contact with the blank region of the semiconductor device received in the insert that descends toward the socket guide and starts supporting the semiconductor device, while the semiconductor device support portion When the insert further descends, the semiconductor device is separated from the semiconductor device, and the support of the semiconductor device is finished. The semiconductor device supported by the floating stage after the semiconductor device supporting portion slides out of the opening and completes retreating from the opening as the insert further descends during roking An IC socket is obtained in which an external terminal is brought into contact with the contact member by an external force that presses the contact member toward the contact member side.

  Even if the IC socket according to the present invention is a semiconductor device in which the margin area on the lower surface of the package is narrowed, it can be conveyed to a normal inspection position.

It is a figure for demonstrating the IC socket of this invention, and is a top view which shows the package lower surface of the semiconductor device as a test object (connection object) of IC socket. It is sectional drawing which shows the basic structure of the IC socket by Example 1 of this invention. (A)-(e) is a figure for demonstrating operation | movement of the IC socket by Example 1 of this invention, and shows the 1st stroke among conveyance strokes. (A)-(e) is a figure for demonstrating operation | movement of IC socket shown by FIG. 2, and shows the 2nd stroke of conveyance strokes. (A) And (b) is a top view which shows the modification of the plate surface of the floating plate in the IC socket by Example 2 of this invention. It is sectional drawing which shows the basic structure of the IC socket by Example 3 of this invention.

  An IC socket according to the present invention is an IC socket that is applied to an electronic device that performs an energization inspection of a semiconductor device having an external terminal around a blank area on the lower surface of a package, and includes a socket guide and an insert. The socket guide includes a contact member corresponding to the external terminal of the semiconductor device. The insert is provided on the socket guide so as to be movable up and down, receives the semiconductor device, and descends to transport the received semiconductor device toward the socket guide, and includes an opening and a semiconductor device support. I have. The opening is formed so as to penetrate the semiconductor device in the up and down movement direction so as to receive the semiconductor device. The semiconductor device support portion is provided so as to include a portion protruding into the opening portion below the opening portion to support the semiconductor device received in the opening portion.

  In particular, in the present invention, the semiconductor device support portion is slidable in a direction in which a portion protruding into the opening is retracted outside the opening.

  The IC socket further has a floating plate. The floating plate has a plate surface capable of supporting the blank area of the semiconductor device received in the insert, and is provided on the socket guide so as to be movable up and down. The floating plate is also biased upward.

  In addition, the IC socket includes a first stroke and a second stroke following the transfer stroke from when the semiconductor device is received in the insert until the external terminal of the semiconductor device contacts the contact member. It is out.

  During the first stroke, the floating plate contacts the blank area of the semiconductor device received by the insert that descends toward the socket guide and starts supporting the semiconductor device, while the semiconductor device support portion Further lowering leaves the semiconductor device and ends the support of the semiconductor device.

  Next, during the second stroke, the semiconductor device supporting portion slides out of the opening as the insert further descends, and the semiconductor device is retracted from the opening before the external terminal of the semiconductor device contacts the contact member. To complete.

  That is, in the IC socket according to the present invention, the semiconductor device is supported by the semiconductor device supporting portion provided in the insert in the first half of the transport stroke, and the blank area inside the external terminal of the semiconductor device is supported in the second half of the transport stroke. The floating plate takes over the support of the semiconductor device from the semiconductor device support, and the semiconductor device support is retracted so as not to be interposed between the external terminal of the semiconductor device and the contact member on the socket guide.

  Therefore, the IC socket according to the present invention can be transported to a normal inspection position even if it is a semiconductor device in which the margin area on the lower surface of the package is narrowed.

  Embodiments of an IC socket according to the present invention will be described below with reference to the drawings.

  The IC socket according to the present invention is an IC socket that is applied to an electronic device that conducts an energization test of the semiconductor chip 100 as shown in FIG.

  First, the semiconductor chip 100 as an inspection target of an inspection device to which the present IC socket is applied will be described.

[Semiconductor chip (inspection target)]
Referring to FIG. 1, a semiconductor chip 100 which is PoP (Package on Package) type packaging and whose terminal structure is a BGA type has a plurality of solder balls as external terminals around a blank region 102 on the lower surface of the package. 110 is provided in an annular shape. In the semiconductor chip 100 shown in FIG. 1, the diameter D ₁₁₀ of each solder ball ₁₁₀ is 0.25 mm, and the pitch P ₁₁₀ that is the distance between the centers of adjacent solder balls ₁₁₀ is 0.4 mm. Further, the distance between adjacent solder balls 110 and the width of the margin area 103 at the outer edge of the lower surface of the package are very narrow. The lower surface of the package shown in FIG. 1 is an example, and there are various shapes of the blank region and the arrangement of the solder balls around it.

  Next, the configuration of the IC socket will be described.

  Referring to FIG. 2, the IC socket according to the present invention includes a socket guide 10 and an insert 20.

[Socket guide]
The socket guide 10 includes Pogo pins (registered trademark) 11 as contact members corresponding to the solder balls 110 of the semiconductor chip 100, and is mounted on a test board of an inspection device (not shown).

That is, as shown in FIG. 2, the socket guide 10 has a rectangular plate shape, and has a concave portion having a square cross-sectional shape on the upper surface when mounted on a test board of an inspection device. . In the recess, a plurality of pogo pins 11 as contact members correspond to the terminal arrangement of the semiconductor chip 100 shown in FIG. 1, that is, at the same pitch as the pitch (P ₁₁₀ ) of the solder balls 110. 110 are arranged in the same array shape. The pogo pin 11 is configured so that its upper end is exposed in the recess and its lower end is exposed on the other surface side of the socket guide 10 and is electrically connected to the wiring pattern of the test board of the inspection device. (The lower end is not shown). At the four corners of the socket guide 10, there are provided an insert 20 which will be described in detail later and columnar guide pins 12 for connecting a pusher which will be illustrated and described later with the socket guide 10. A recess 12 a is provided at the tip of the guide pin 12.

  A floating plate 41, which will be described in detail later, is provided in the recess so as to be movable up and down.

  Furthermore, the socket guide 10 has a guide lamp pin 32 having a ramp surface 32a that is inclined so as to go outward in the horizontal direction of the socket guide 10 from the upper end to the lower end. The function of the guide lamp pin 32 will be described in the description of the semiconductor device support portion described later.

[insert]
The insert 20 is provided on the socket guide 10 so as to be movable up and down. The insert 20 receives the semiconductor chip 100 and descends so as to transport the received semiconductor chip 100 toward the socket guide 10.

  The insert 20 also includes an opening 21 and a semiconductor device support 31. The opening 21 is formed so as to penetrate the semiconductor chip 100 in the vertical movement direction so as to be able to receive the semiconductor chip 100.

  That is, as shown in FIG. 2, the insert 20 has a square plate shape, and an opening 21 having a square cross-sectional shape that accommodates the semiconductor chip 100 is provided in the center thereof. The opening 21 is formed in a tapered shape so as to increase from the lower surface side to the upper surface side of the insert 20, and the semiconductor chip 100 is mounted on the lower surface side so as to protrude from the side surface of the opening 21. A semiconductor device support 31 is provided. Further, the periphery of the opening 21 on the lower surface side of the insert 20 is provided with a protruding portion protruding downward. Furthermore, guide pin holes 22 into which the guide pins 12 are inserted are provided at the four corners of the insert 20 at positions corresponding to the guide pins 12.

[Semiconductor device support]
As shown in FIG. 2, the semiconductor device support portion 31 is provided so as to include a portion protruding into the opening portion 21 below the opening portion 21 to support the semiconductor chip 100 received in the opening portion 21. It has been.

  In particular, the semiconductor device support portion 31 is slidable in a direction in which a portion protruding into the opening 21 retracts outside the opening 21.

  The semiconductor device support portion 31 has a slit having a ramp surface 31a that is inclined so as to go outward in the horizontal direction of the insert 20 from the upper end toward the lower end.

  On the other hand, as described above, the socket guide 10 includes the guide lamp pin 32 having the ramp surface 32a that is inclined so as to go outward in the horizontal direction of the socket guide 10 from the upper end toward the lower end.

  The semiconductor device support portion 31 moves toward the outside of the opening portion 21 by sliding the ramp surface 31a on the ramp surface 32a of the guide lamp pin 32 as the insert 20 descends during a second stroke described later. And slide.

  Furthermore, the semiconductor device support portion 31 includes a tapered recess portion 31 b into which at least one of the solder balls 110 of the semiconductor chip 100 enters on the upper surface of the portion protruding into the opening portion 21. As a result, when the semiconductor chip 100 is supported during a first stroke, which will be described later, the solder ball 110 enters the recess 31b, so that the solder ball 110 of the semiconductor chip 100 is in the correct plane position on the pogo pin 11 during the second stroke. Positioning with respect to the planar position of the semiconductor chip 100 is performed in advance so as to make contact.

[Floating plate]
Referring to FIG. 2, the IC socket according to the present invention further includes a floating plate 41.

  The floating plate 41 includes a plate surface 41a that can support the blank region 102 of the semiconductor chip 100 received in the insert 20, and is provided in the socket guide 10 so as to be movable up and down. The floating plate 41 and the socket guide 10 are connected so as to be movable up and down by springs 42 as elastic members provided at the four corners of the recess, and the floating plate 41 is urged upward by the springs 42 and is arranged in a so-called floating manner. ing.

[Pusher]
Referring to FIG. 4B, the IC socket further includes a pusher 50 that is separate from the socket guide 10 and the insert 20.

  The pusher 50 is for pressing the semiconductor chip 100 supported by the floating plate 41 to the pogo pin 11 side after the semiconductor device support portion 31 is retracted from the opening portion 21 during a second stroke in a transport stroke described later.

  The pusher 50 forms a plate-like pressing part 51 whose center protrudes, and the periphery of the pressing part 51 forms a thinner flange part 52 than the pressing part 51. Pusher pins 53 are provided at positions corresponding to the guide pins 12 at the four corners of the flange portion 52. The pusher pin 53 has a shape corresponding to the recess 12a of the guide pin 12, and the pusher pin 53 can be inserted into the recess 12a.

  Next, the operation of the IC socket of this embodiment will be described.

  This IC socket has a first stroke and a second stroke following this as a transport stroke from when the semiconductor chip 100 is received by the insert 20 until the solder ball 110 of the semiconductor chip 100 contacts the pogo pin 11. Is included.

[First stroke]
During the first stroke, the floating plate 41 comes into contact with the blank area of the semiconductor chip 100 received by the insert 20 descending toward the socket guide 10 and starts supporting the semiconductor chip 100, while supporting the semiconductor device. The part 31 is configured to leave the semiconductor chip 100 and finish supporting the semiconductor chip 100 by further lowering the insert 20.

[Second stroke]
Next, during the second stroke, the semiconductor device support portion 31 slides out of the opening portion 21 as the insert 20 further descends, and after the retraction from the opening portion 21 is completed, The solder ball 110 is configured to contact the pogo pin 11.

  That is, in the IC socket according to the present invention, the semiconductor device is supported by the semiconductor device supporting portion provided in the insert in the first half of the transport stroke, and the blank area inside the external terminal of the semiconductor device is supported in the second half of the transport stroke. The floating plate takes over the support of the semiconductor device from the semiconductor device support, and the semiconductor device support is retracted so as not to be interposed between the external terminal of the semiconductor device and the contact member on the socket guide.

  Hereinafter, with reference to FIGS. 3A to 3E and FIGS. 4A to 4E, the operation of the IC socket will be described along the inspection method of the semiconductor chip 100. FIG.

[Inspection method]
First, the semiconductor chip 100 to be inspected is taken out from a product tray (not shown), inserted into the opening 21 of the insert 20 and mounted on the semiconductor device support 31 as shown in FIG. . Here, as described above, since the opening 21 is formed in a tapered shape so as to become wider from the lower surface side to the upper surface side of the insert 20, the semiconductor chip 100 is mounted with a slight misalignment. Even if it exists, a position is correct | amended by a taper surface and it is mounted in the semiconductor device support part 31 as FIG.3 (b) shows. At this time, the solder balls 110 of the semiconductor chip 100 are arranged so that the solder balls 110 of the semiconductor chip 100 come into contact with the pogo pins 11 in the correct plane position by the recesses 31b of the semiconductor device support portion 31 in a later process. Positioning with respect to 100 plane positions is performed. When the semiconductor chip 100 is mounted on the insert 20, the insert 20 is preheated by a preheating portion (not shown).

  Next, as shown in FIG. 3C, the preheated insert 20 is mounted on the socket guide 10 by inserting the guide pin 12 of the socket guide 10 into the guide pin hole 22 of the insert 20, The state shown in FIG. From this point, the first stroke in the transport stroke is started.

  In the process from FIG. 3D to FIG. 3E, the floating plate 41 floated by the spring 42 is placed in the blank region 102 of the semiconductor chip 100 received in the insert 20 that descends toward the socket guide 10. The support of the semiconductor chip 100 is started upon contact. On the other hand, the semiconductor device support unit 31 ends the support of the semiconductor chip 100 by moving away from the semiconductor chip 100 when the insert 20 is further lowered. From this point, the second stroke in the transport stroke is started.

  Subsequently, as illustrated in FIG. 4A, the semiconductor device support portion 31 is configured such that the ramp surface 31 a slides on the ramp surface 32 a of the guide lamp pin 32 as the insert 20 further descends. Then, the sliding is started so as to retract toward the outside of the opening 21.

  Next, as shown in FIG. 4B, the pusher 50 is prepared above the insert 20.

  Subsequently, in the process from FIG. 4C to FIG. 4D, the semiconductor device support portion 31 before the solder ball 110 of the semiconductor chip 100 contacts the contact member as the insert 20 further descends. Completes the retraction of the insert 20 from the opening 21. On the other hand, the pusher 50 presses the semiconductor chip 100 supported by the floating plate 41 toward the pogo pin 11 side.

  Next, as shown in FIG. 4E, when the pusher 50 is lowered to the lower limit position, the pogo pin 11 is stroked, and the solder ball 110 and the pogo pin 11 are electrically connected. Here, since the positioning with respect to the planar position of the semiconductor chip 100 is already made in advance by the recess 31b of the semiconductor device support part 31, and the state is maintained and the support of the semiconductor chip 100 is taken over by the floating plate 41. The solder ball 110 is in electrical contact with the pogo pin 11 at a correct plane position.

  Next, the test of the semiconductor chip 100 is performed in a state where the solder balls 110 and the pogo pins 11 are electrically connected. Since the contents of the test are out of the scope of the present invention, detailed description is omitted.

  When the test is completed, the pusher 50 moves upward to open the IC socket, and the insert 20 is taken out from the socket guide 10.

  Finally, after the insert 20 returns to room temperature, the semiconductor chip 100 is taken out from the insert 20 and accommodated in a product tray (not shown) according to the test result, and the test of the semiconductor chip 100 is completed.

  The IC socket of the second embodiment of the present invention is different from the first embodiment in the shape of the plate surface of the floating plate. For this reason, about the structure and operation | movement similar or similar to Example 1, it shall refer to drawing and description of Example 1 for assistance, and detailed description is abbreviate | omitted in the following description.

  The IC socket of this embodiment is an IC socket that is applied to an electronic device that conducts an energization inspection of a semiconductor chip 100 ′ or 100 ″ as shown in FIG. 5A or FIG.

  Referring to FIG. 5A, a PoP (Package on Package) type semiconductor chip 100 ′ having a terminal structure of BGA type is provided as an external terminal around a blank region 102 ′ on the lower surface of the package. The plurality of solder balls 110 are annularly provided. On the other hand, the IC socket of this embodiment has a floating plate 46 having a cross-shaped plate surface corresponding to the shape of the blank region 102 ′ of the semiconductor chip 100 ′. As an overall configuration, the floating plate 41 is replaced with the floating plate 46 in the first embodiment shown in FIG. That is, referring to FIG. 2, the floating plate 46 includes the plate surface shown in FIG. 5A that can support the blank region 102 ′ of the semiconductor chip 100 ′ received in the insert 20. The socket guide 10 is movably provided. The floating plate 46 and the socket guide 10 are connected to each other by a spring 42 as an elastic member so as to be movable up and down. The floating plate 46 is urged upward by the spring 42 and is so-called floating. Then, during the first of the transport strokes, the floating plate 46 comes into contact with the blank region of the semiconductor chip 100 ′ received by the insert 20 that descends toward the socket guide 10 to support the semiconductor chip 100 ′. On the other hand, the semiconductor device support portion 31 is separated from the semiconductor chip 100 ′ by the further lowering of the insert 20 and ends the support of the semiconductor chip 100 ′.

  Further, referring to FIG. 5B, a semiconductor chip 100 ″ which is PoP (Package on Package) type packaging and has a terminal structure of BGA type is provided around the blank region 102 ″ on the lower surface of the package. A plurality of solder balls 110 as terminals are provided in an annular shape. On the other hand, the IC socket of this embodiment has the floating plate 47 having four L-shaped plate surfaces corresponding to the shape of the blank region 102 ″ of the semiconductor chip 100 ″. Although the floating plate 47 has four plate surfaces, it is single in the main part, and the plate surface moves up and down with the same level. As an overall configuration, the floating plate 41 is replaced with a floating plate 47 in the first embodiment shown in FIG. That is, with reference to FIG. 2, the floating plate 47 includes the plate surface shown in FIG. 5B that can support the blank region 102 ″ of the semiconductor chip 100 ″ received in the insert 20, and The socket guide 10 is movably provided. The floating plate 47 and the socket guide 10 are connected by a spring 42 as an elastic member so as to be movable up and down. The floating plate 47 is urged upward by the spring 42 and is so-called floating. Then, during the first of the transport strokes, the floating plate 47 comes into contact with the blank area of the semiconductor chip 100 ″ received by the insert 20 that descends toward the socket guide 10 to support the semiconductor chip 100 ″. On the other hand, the semiconductor device support portion 31 is separated from the semiconductor chip 100 ″ and the support of the semiconductor chip 100 ″ is finished by further lowering the insert 20.

  The lower surface of the package shown in FIG. 1 and FIGS. 5A and 5B is only an example, and there are various shapes of the blank region and the arrangement of the surrounding solder balls. Therefore, in the present invention, it is preferable that the position and shape of the plate surface of the floating plate correspond to the shape of the blank region and the arrangement of the surrounding solder balls.

  The IC socket of the third embodiment of the present invention is different from the first embodiment in the support structure of the floating plate. For this reason, about the structure and operation | movement similar or similar to Example 1, it shall refer to drawing and description of Example 1 for assistance, and detailed description is abbreviate | omitted in the following description.

  Referring to FIG. 6, the IC socket of this embodiment has a floating plate 41 ′ as in the first embodiment. The floating plate 41 ′ has a plate surface capable of supporting a blank area of a semiconductor chip (not shown) received in the insert 20, and is provided on the socket guide 10 ′ so as to be movable up and down.

  The floating plate 41 ′ and the socket guide 10 ′ are connected so that a guide post 43 extending from the lower side of the floating plate 41 ′ is movable up and down in a guide post hole formed in the socket guide 10 ′. Is biased upward by a spring 42 as an elastic member, and is so-called floating. Then, during the first of the transport strokes, the floating plate 41 ′ comes into contact with the blank area of the semiconductor chip received by the insert 20 that descends toward the socket guide 10 ′ and starts supporting the semiconductor chip. On the other hand, when the insert 20 further descends, the semiconductor device support portion 31 moves away from the semiconductor chip and finishes supporting the semiconductor chip.

  In this embodiment, since the floating plate 41 ′ is supported by the guide pole 43 so as to be movable up and down, the plane position of the plate surface is more accurate than in the first embodiment in which only the spring is supported. .

  The present invention is not limited to the several embodiments described above, and it goes without saying that the present invention can be variously modified within the technical scope described in the claims.

10, 10 'Socket guide 11 Pogo pin 12 Guide pin 12a Depression 20 Insert 21 Opening 22 Guide pin hole 31 Semiconductor device support 31a Lamp surface 31b Recess 32 Guide lamp pin 32a Lamp surface 41, 46, 47 Floating plate 41a Plate surface 43 Guide pole 50 Pusher 51 Pressing part 52 Flange part 53 Pusher pin 100, 100 ', 100 "Semiconductor chip 102, 102', 102" Blank area 110 Solder ball 103 Margin area

Claims (5)

An IC socket that is applied to an electronic device that conducts an energization inspection of a semiconductor device provided with external terminals around a blank area on a lower surface of a package,
A socket guide provided with a contact member corresponding to the external terminal of the semiconductor device;
An insert that is provided on the socket guide so as to be movable up and down, and that receives the semiconductor device and descends to transport the received semiconductor device toward the socket guide;
The insert protrudes into the opening below the opening to support the semiconductor device received in the opening, and an opening formed through the semiconductor device in the vertical movement direction so as to receive the semiconductor device. In an IC socket provided with a semiconductor device support provided to include the portion
The semiconductor device support portion is slidable in a direction in which a portion protruding into the opening is retracted outside the opening,
A floating plate provided on the socket guide so as to be capable of supporting a blank area of the semiconductor device received in the insert, movable up and down, and biased upward;
The transfer stroke from when the semiconductor device is received by the insert until the external terminal of the semiconductor device contacts the contact member includes a first stroke and a second stroke following the first stroke,
During the first stroke, the floating plate comes into contact with a blank region of the semiconductor device received by the insert that descends toward the socket guide and starts supporting the semiconductor device, while the semiconductor device support portion , The support further supports the semiconductor device away from the semiconductor device by further lowering the insert,
During the second stroke, the semiconductor device supporting portion is supported by the floating stage after sliding out of the opening and completing retraction from the opening as the insert is further lowered. An IC socket, wherein an external terminal is brought into contact with the contact member by an external force that presses the formed semiconductor device toward the contact member. The semiconductor device support is
The upper surface of the portion protruding into the opening is provided with a tapered recess into which at least one of the external terminals of the semiconductor device enters,
As a result, when the semiconductor device is supported during the first stroke, the external terminal enters the recess so that the external terminal of the semiconductor device contacts the contact member at the correct planar position during the second stroke. The IC socket according to claim 1, wherein positioning with respect to a planar position of the semiconductor device is performed in advance. The socket guide has a guide lamp pin having a ramp surface inclined so as to go outward in the horizontal direction of the socket guide from the upper end toward the lower end;
The semiconductor device support portion has a guide lamp slit having a ramp surface inclined so as to go outward in the horizontal direction of the insert from the upper end toward the lower end.
During the second stroke, the semiconductor device support portion slides on the lamp surface of the guide lamp pin so that the lamp surface of the guide lamp slit slides on the lamp surface of the guide lamp pin as the insert descends. The IC socket according to claim 1, which slides toward the top.   4. The pusher that further presses the semiconductor device supported by the floating plate toward the contact member after the semiconductor device support portion during the second stroke is retracted from the opening. 5. The IC socket according to one item. The floating plate has a guide post extending from the lower side in the vertical movement direction of the floating plate,
The IC socket according to any one of claims 1 to 4, wherein the socket guide has a guide post hole into which the guide post is inserted.

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