JP2013015476A5 - - Google Patents
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- JP2013015476A5 JP2013015476A5 JP2011149792A JP2011149792A JP2013015476A5 JP 2013015476 A5 JP2013015476 A5 JP 2013015476A5 JP 2011149792 A JP2011149792 A JP 2011149792A JP 2011149792 A JP2011149792 A JP 2011149792A JP 2013015476 A5 JP2013015476 A5 JP 2013015476A5
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- temperature
- holding
- pressure
- housing
- element holding
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Description
流体の温度を検知する温度センサと、当該流体の圧力を検知する圧力センサが一体化されたセンサセンサ（以下、単に一体型センサ、ということがある）が、例えば、特許文献１に開示されている。
特許文献１の一体型センサ１００は、図１１に示すように、温度検知素子１０２と圧力検知素子１０３が、金属性のハウジング１０４の一方の側と他方の側にそれぞれ結合されている。ハウジング１０４は、流体の温度を温度検知素子１０２に伝え、流体の圧力を圧力検知素子１０３に伝えるように配置されている。ハウジング１０４は、延長されたボディ１０５と、ボディ１０５の開放端部１０６と接続される圧力検知構造１０７と、から構成される。温度検知素子１０２はボディ１０５の閉じられた端部１０８に配置され、圧力検知素子１０３は圧力検知構造１０７上に搭載される。
特許文献１の一体型センサ１００は、ボディ１０５が検知対象の流体中に配置され、温度検知素子１０２で流体の温度を検知する。また、一体型センサ１００は、ボディ１０５で受けた流体の圧力を、ハウジング１０４（ボディ１０５、圧力検知構造１０７）を介して間接的に圧力検知素子１０３に伝える。
For example, Patent Document 1 discloses a sensor sensor in which a temperature sensor that detects the temperature of a fluid and a pressure sensor that detects the pressure of the fluid are integrated (hereinafter, simply referred to as an integrated sensor). Yes.
As shown in FIG. 11 , in the integrated sensor 100 of Patent Document 1, a temperature detection element 102 and a pressure detection element 103 are coupled to one side and the other side of a metallic housing 104, respectively. The housing 104 is arranged to transmit the temperature of the fluid to the temperature detection element 102 and to transmit the pressure of the fluid to the pressure detection element 103. The housing 104 includes an extended body 105 and a pressure detection structure 107 connected to the open end portion 106 of the body 105. The temperature sensing element 102 is disposed at the closed end 108 of the body 105, and the pressure sensing element 103 is mounted on the pressure sensing structure 107.
In the integrated sensor 100 of Patent Document 1, a body 105 is disposed in a fluid to be detected, and the temperature detection element 102 detects the temperature of the fluid. The integrated sensor 100 indirectly transmits the pressure of the fluid received by the body 105 to the pressure detection element 103 via the housing 104 (body 105, pressure detection structure 107).
Claims (1)
前記温度検知素子が保持される素子保持部を先端部に有する第１素子保持塔と、
前記温度検知素子から引き出されるリード線と接続される端子を保持するとともに、前記素子保持塔を支持する基部と、
を備える請求項１に記載の温度センサ。 The housing is
A first element holding column having an element holding portion to which the temperature sensing element is held to the tip portion,
While holding a terminal connected to a lead wire drawn out from the temperature detection element, and a base portion supporting the element holding tower,
A temperature sensor according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011149792A JP5769298B2 (en) | 2011-07-06 | 2011-07-06 | Temperature sensor, integrated sensor for detecting temperature and pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011149792A JP5769298B2 (en) | 2011-07-06 | 2011-07-06 | Temperature sensor, integrated sensor for detecting temperature and pressure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013015476A JP2013015476A (en) | 2013-01-24 |
| JP2013015476A5 true JP2013015476A5 (en) | 2014-08-07 |
| JP5769298B2 JP5769298B2 (en) | 2015-08-26 |
Family
ID=47688271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011149792A Active JP5769298B2 (en) | 2011-07-06 | 2011-07-06 | Temperature sensor, integrated sensor for detecting temperature and pressure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5769298B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6261442B2 (en) * | 2014-05-02 | 2018-01-17 | アズビル金門株式会社 | Flowmeter |
| CN105403321B (en) * | 2015-12-31 | 2019-03-19 | 广东爱晟电子科技有限公司 | A kind of surface of solids contact high sensitivity temperature sensor and preparation method thereof |
| CN108885143A (en) * | 2017-02-09 | 2018-11-23 | 株式会社芝浦电子 | temperature sensor |
| US10545064B2 (en) * | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
| KR101992608B1 (en) * | 2017-12-06 | 2019-06-25 | 주식회사 현대케피코 | Oil complex ssensor |
| CN108344526B (en) * | 2018-02-27 | 2020-12-11 | 深圳市元征科技股份有限公司 | Body temperature monitoring method and device |
| KR102006750B1 (en) * | 2018-11-16 | 2019-08-06 | 주식회사 신한전기 | Sensor assembly for measuring temperature or pressure |
| JP6964063B2 (en) * | 2018-11-28 | 2021-11-10 | 長野計器株式会社 | Sensor assembly and physical quantity measuring device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02247532A (en) * | 1989-03-20 | 1990-10-03 | Mitsubishi Electric Corp | Temperature sensor |
| JP3319990B2 (en) * | 1997-08-29 | 2002-09-03 | 三菱電機株式会社 | Pressure sensor device |
| JP4041018B2 (en) * | 2003-06-25 | 2008-01-30 | Ｔｄｋ株式会社 | Temperature sensor |
-
2011
- 2011-07-06 JP JP2011149792A patent/JP5769298B2/en active Active
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