JP2013008851A - Functional liquid pattern formation method, conductive pattern formation method, functional liquid pattern formation system, conductive pattern formation system, method for manufacturing functional liquid pattern structure and method for manufacturing conductive pattern structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a functional liquid pattern formation method/system and a conductive pattern formation method/system, along with a method for manufacturing a functional liquid pattern structure and a method for manufacturing a conductive pattern structure, capable of avoiding occurrence of a bulge, a jaggy and the like and preferably forming a fine pattern.SOLUTION: A base material is heated and maintained at a surface temperature of 45°C or more (preferably 60°C or more). A pattern of a catalyst carrying polymer liquid for plating is formed by discharging the catalyst carrying polymer liquid for plating containing a catalyst carrying polymer for plating, a high boiling point solvent and a low boiling point solvent on the base material by an ink jet system, on the basis of the discharge condition that a diameter D1 of a discharge liquid drop, a pitch W between dots of the catalyst carrying polymer liquid for plating and a diameter D2 of the dot of the liquid satisfy the relation of D<W<D. A conductive pattern consisting of a plating film is formed by adding a plating catalyst (or plating catalyst precursor) after curing the liquid and performing plating treatment.

Description

  The present invention relates to a functional liquid pattern forming method, a conductive pattern forming method, a functional liquid pattern forming system, a conductive pattern forming system, a functional liquid pattern structure manufacturing method, and a conductive pattern structure manufacturing method. In particular, the present invention relates to a technique for forming a fine pattern using an ink jet method.

  In recent years, along with the downsizing and thinning of electronic devices, various electronic devices (active elements such as IC chips and passive elements such as capacitors and resistors) to be mounted are becoming more and more miniaturized. Techniques for reducing the size and thickness have been proposed. Flip-chip method instead of wire bonding that requires large wiring space, SiP that integrates multiple semiconductor elements in a package, built-in substrate that incorporates elements in the substrate, chip size package (CSP), etc. have been proposed and put to practical use ing.

  In general, a photolithography method is known as a method for manufacturing a wiring board. In the photolithography method, a resist layer made of a dry film resist or a liquid resist is formed on a copper clad laminate made of an insulating layer and a copper foil, and pattern exposure (development) is performed by irradiating the resist layer with ultraviolet rays through a photomask. Thus, the resist layer is patterned, and the copper foil portion not covered with the resist pattern is removed by etching to obtain a conductor pattern.

  In addition to the subtractive method described above, a semi-additive method and an additive method are known as photolithography methods.

  On the other hand, in the photolithography method, it is necessary to prepare a photomask used for exposure of the resist layer. In addition to the etching process and the plating process, a resist developing process as an intermediate material is required. On the other hand, wiring drawing by printable electronics using a printing technique has been proposed.

  In particular, the method of directly patterning conductive fine particle materials using the inkjet method is a technique that can replace the photolithographic method, such as maskless, on-demand production of wiring substrates, and reduction of resist development and wiring etching processes. As expected.

  In the formation of a fine wiring pattern by direct drawing using an inkjet method, it is difficult to sufficiently increase the thickness of the pattern, and the substrate surface (pattern forming surface) needs to be flattened. On the other hand, conventionally, the adhesion between the substrate surface and the conductive pattern is reinforced by the anchor effect, and when the substrate surface is flattened, the adhesion between the substrate surface and the conductive pattern becomes a problem.

  Patent Document 1 forms a conductive substance adsorbing resin precursor layer on the surface of a flexible resin film substrate, and forms a conductive substance adsorbing layer by applying energy to the conductive substance adsorbing resin precursor layer. Then, a conductive material is adsorbed on the conductive substance adsorption layer to form a conductive layer, and a metal layer adsorbed on the conductive adsorption resin layer is plated to form a conductive layer (metal layer). Yes.

  In the method for manufacturing a multilayer substrate disclosed in Patent Document 1, a conductive material adsorption precursor layer is formed between a conductive (metal) layer made of a plating metal and a substrate surface, whereby the substrate surface and the conductive layer are referred to. Ensuring adhesion of dissimilar materials.

  The coating liquid used as the conductive substance adsorption precursor layer contains a compound having a functional group capable of adsorbing metal ions or metal fine particles, and the coating liquid is applied by an ink jet method by adjusting the viscosity of the coating liquid. .

  In Patent Document 2, a liquid containing an unsaturated compound capable of radical polymerization is arranged on a substrate surface in a pattern by an ink jet method, radical polymerization is generated by heating or exposure, and a graft polymer is applied only to a liquid arrangement region. A method for forming a conductive pattern (graft polymer pattern) is disclosed in which a conductive pattern is formed by attaching a conductive substance to the graft polymer.

  In the conductive pattern forming method disclosed in Patent Document 2, the adhesion between the substrate surface and the conductive pattern is enhanced by interposing a graft polymer between the substrate surface and the conductive pattern. Patent Document 2 discloses that heat treatment is performed in the graft polymer production step.

  Patent Document 3 discloses a substrate in which a composition containing a photoradical generator is applied in a pattern on a substrate, the photoradical generator is immobilized on a substrate by heating or exposure, and the photoradical generator is immobilized. A compound having a polymerizable double bond is brought into contact with the material, energy is applied to the surface of the base material, a graft polymer is formed in a region where the photo radical generator is present, and no material is present in the region where the graft polymer is formed. Disclosed is a method for forming a conductive pattern (graph and polymer pattern) in which an electroplating catalyst or a precursor of an electroless plating catalyst is applied, an electroless plating process is performed, and a conductive pattern is formed in a region where a graft polymer is formed. is doing.

  In the conductive pattern forming method disclosed in Patent Document 3, a graft polymer is interposed between the substrate and the conductive pattern to enhance the adhesion between the substrate and the conductive pattern.

  Patent Document 3 discloses an alcohol solvent, a ketone solvent, a nitrile solvent, and an ester solvent as solvents used in a composition containing a polymerizable compound, and when a cyano group-containing polymerizable polymer is used. Amide type, ketone type and nitrile type solvents are preferred, and solvents having a boiling point of 50 ° C. to 150 ° C. are preferred.

JP 2008-258211 A Special table 2009-503806 JP 2008-257892 A

  In forming a pattern with a functional liquid (liquid composition) using an inkjet method, characteristics of the functional liquid, environmental conditions, and the like must be taken into consideration. In particular, when ink-jet direct drawing is applied to the formation of fine patterns, the line width due to the occurrence of bulges must be non-uniform, the edge shape of the pattern due to the occurrence of jaggies, and pattern cuts must be avoided. Don't be.

  However, although the above-mentioned Patent Documents 1 to 3 disclose a technique for forming a layer (pattern) that serves as a base for plating using an ink jet method and can ensure adhesion to a substrate, stable ejection characteristics are disclosed. No specific ink jet system application conditions for obtaining a desired pattern or forming a preferable pattern are disclosed.

  The present invention has been made in view of such circumstances, and a functional liquid pattern forming method, a conductive pattern forming method, and a functional liquid pattern forming system capable of forming a preferable fine pattern while avoiding the occurrence of bulges, jaggies and the like. Another object is to provide a conductive pattern forming system, a functional liquid pattern structure manufacturing method, and a conductive pattern structure manufacturing method.

In order to achieve the above object, the functional liquid pattern forming method according to the present invention includes a catalyst-supporting polymer compound for plating, a high boiling point solvent having a boiling point of 190 ° C. or higher and lower than 245 ° C., and a boiling point of 75 ° C. or higher and lower than 105 ° C. A functional liquid containing a low-boiling solvent having a diameter D ₁ when a droplet of the functional liquid in flight is regarded as a spherical shape, an interval W between dots of the functional liquid formed on the substrate, the diameter D ₂ of the dots of the functional liquid that is formed on said substrate, based on the ejection conditions satisfying the following relationship D _{1 <W} <D _2, the functional liquid to be ejected onto the substrate by an inkjet method It includes a discharging step and a heating step of heating the base material from the start of discharging the functional liquid to the end of discharging in the functional liquid discharging step.

According to the present invention, when forming a pattern of the functional liquid containing the catalyst-supporting polymer compound for plating, the diameter D ₁ when the droplet of the functional liquid in flight is regarded as a spherical shape, the substrate dot spacing W of the functional liquid that is formed in the upper, the diameter D ₂ of the dots of the functional liquid that is formed on said substrate, by satisfying the relation of D 1 _<W <D _2, bulges and jaggies Can be prevented.

  Moreover, by including a low boiling point solvent in the functional liquid, evaporation of the solvent of the functional liquid droplets (dots) on the substrate is promoted, and the spread of the pattern is suppressed.

  Furthermore, while the functional liquid is discharged, the wetting and spreading of the functional liquid is suppressed by heating the base material.

  Furthermore, by including a high boiling point solvent in the functional liquid, preferable liquid discharge by the ink jet method is realized.

The flowchart which shows the flow of the conductive pattern formation method which concerns on embodiment of this invention. The flowchart which shows the detail of the catalyst support polymer discharge process for plating shown in FIG. Explanatory drawing which illustrated typically the pattern formation system applied to the catalyst carrying | support polymer discharge process for plating shown in FIG. The block diagram which shows schematic structure of the control system of the pattern formation system shown in FIG. Explanatory drawing of discharge parameters of catalyst-supported polymer liquid for plating Graph showing the relationship between the boiling point of the solvent and the pattern width of the catalyst-supporting polymer solution for plating Graph showing the relationship between substrate temperature and pattern width Graph showing the relationship between dot pitch and pattern width Explanatory drawing schematically showing the shape of the pattern for each dot pitch Explanatory drawing which shows the planar shape and three-dimensional shape of a pattern when a laminated pattern is formed Explanatory drawing showing the effect of volatility of mixed solvent on surface shape of dots (pattern) Explanatory drawing which shows the relationship between the pitch between dots when forming a four-layer pattern and the planar shape of the pattern

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Description of conductive pattern forming method]
FIG. 1 is a flowchart showing a flow of a conductive pattern forming method according to an embodiment of the present invention. As shown in the figure, the conductive pattern forming method shown in this example is obtained by laminating a base material (for example, a 1 mm thick glass epoxy substrate with a 30 μm thick flattening film (epoxy insulating film)). An adhesion auxiliary layer forming step for forming an adhesion auxiliary layer on the substrate (step S10), and forming a pattern of the catalyst-supporting polymer for plating corresponding to the conductive pattern on the base material on which the adhesion auxiliary layer is formed by an ink jet method. A plating catalyst-carrying polymer discharging step (step S12), a curing energy applying step of irradiating the plating catalyst-carrying polymer with curing energy (step S14), and applying a plating catalyst to the cured plating catalyst-carrying polymer. Plating catalyst application step (step S16), plating catalyst-supported polymer provided with a plating catalyst The plating treatment is applied and plating process is configured to include (step S18), and the.

  In the adhesion auxiliary layer forming step (step S10), an adhesion auxiliary layer solution is applied on the substrate in order to ensure adhesion between the substrate and the catalyst-supporting polymer for plating. For example, an epoxy primer having a thickness of 3 micrometers is applied by spin coating.

  In the adhesion auxiliary layer forming step, an ink jet method may be applied to form a pattern corresponding to the conductive pattern.

  NBR (nitrile rubber) containing at least one type of dispersant selected from an anionic dispersant and a nonionic dispersant, resin particles, and an aqueous dispersant as an adhesion auxiliary layer liquid for forming an adhesion auxiliary layer ) Latex-based materials may be applied.

  In an aspect in which the ink jet method is applied, the liquid is diluted to a viscosity (about 10 millipascal second (centipoise)) that can be discharged by the ink jet method using a predetermined solvent.

  When the adhesion auxiliary layer solution is applied, a hydrophobic treatment that imparts a curing treatment by heating (for example, at a temperature of 100 ° C. or higher for 2 hours or less, preferably 1 hour or less), a treatment solution in which an acidic compound or a polyvalent metal salt is dissolved. And a cleaning process using a predetermined cleaning liquid is performed to form an adhesion auxiliary layer.

  In the plating catalyst-carrying polymer discharging step (step S12), a plating catalyst-carrying polymer liquid (functional liquid) is applied to the adhesion auxiliary layer formed on the substrate by an ink jet method.

  The catalyst-supporting polymer liquid for plating contains at least two kinds of solvents having different boiling points. As an example of two or more kinds of solvents having different boiling points, there may be an embodiment including a high boiling point solvent and a low boiling point solvent. In addition to the high-boiling solvent and the low-boiling solvent, an embodiment including a medium-boiling solvent is also possible.

  Here, the “high boiling point solvent” is a solvent having a boiling point of 190 ° C. or higher and lower than 245 ° C., and examples thereof include diethylene glycol monoethylene ether (boiling point 196 ° C.) and propylene carbonate (boiling point 240 ° C.).

  In the conductive pattern formation method (pattern formation method using a functional liquid) shown in this example, an experiment using a catalyst-supporting polymer liquid for plating containing diethylene glycol monoethylene ether and propylene carbonate has been performed. The effect of containing a boiling point solvent is verified (details will be described later).

  The “low boiling point solvent” is a solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C., and examples thereof include water (boiling point 100 ° C.), acetrinitol (boiling point 82 ° C.) and the like. The “medium boiling point solvent” is a solvent having a boiling point of 105 ° C. or higher and lower than 190 ° C., and examples thereof include cyclohexane (boiling point 160 ° C.).

  In the conductive pattern forming method shown in this example, the effect of containing a low boiling point solvent in the plating catalyst-carrying polymer liquid is verified by an experiment using a plating catalyst-carrying polymer liquid containing water and acetrinitol (Details) Later).

  By including the high boiling point solvent, good dischargeability of the catalyst-supporting polymer liquid for plating by the ink jet method is maintained. That is, the liquid in the nozzle provided in the inkjet head due to the evaporation of the ink solvent at the time of ejection is prevented, and the occurrence of ejection abnormalities that are not normally ejected due to the increased viscosity of the ink in the vicinity of the nozzle, The occurrence of non-ejection that completely clogs the nozzle is avoided.

  In other words, it can be said that the open time of a nozzle becomes long by including a high boiling point solvent. The “nozzle open time” is an index for drying the nozzle of the inkjet head, and is a time during which recovery is possible only by jetting (preliminary ejection) while leaving the nozzle uncovered.

  If the boiling point of the high-boiling solvent exceeds the upper limit of the above temperature range, abnormal discharge (non-discharge) near the nozzle when discharging the catalyst-supporting polymer liquid for plating is prevented, but for plating after drawing. It is possible that the drying of the catalyst-supporting polymer liquid becomes too slow, and the width of the drawn pattern widens or the width of the drawn pattern fluctuates.

  Further, by including the low boiling point solvent, the low boiling point solvent quickly evaporates after landing on the substrate, the volume of the droplet is reduced, and the droplet can be miniaturized. On the other hand, when the boiling point of the low boiling point solvent is less than the lower limit of the above range, when the plating catalyst-carrying polymer liquid is discharged, the plating catalyst-carrying polymer liquid is thickened in the vicinity of the nozzle, causing abnormal discharge or non-ejection. It can be a cause of occurrence.

  It is preferable that the medium boiling point solvent has a high ability to dissolve the polymer substance serving as the content. The above-described cyclohexane is a preferable substance as a medium-boiling point solvent because it has a high ability to dissolve a polymer substance having a property of being cross-linked and cured by reacting with light.

  In addition, two or more types of solvents may be mixed as the high boiling point solvent, the medium boiling point solvent, and the low boiling point solvent. A method for calculating the boiling point of the mixed solvent will be described later.

  The catalyst-supporting polymer for plating is a polymer containing a functional group (interactive group) that forms an interaction with the electroless plating catalyst or its precursor and a polymerizable functional group. By including an interactive group in the polymer, excellent adsorptivity to a plating catalyst described later is achieved, and as a result, a plating film (metal film) having a sufficient thickness can be obtained during the plating process. .

  Moreover, when a polymerizable functional group is contained in the polymer, a crosslinking reaction proceeds in the liquid film, and a polymer layer having excellent strength can be obtained. Details of the plating catalyst-carrying polymer discharging step will be described later.

  When the pattern by the catalyst-supporting polymer liquid for plating is formed, a curing energy imparting process such as a heat treatment (drying process) or exposure is performed (curing energy imparting step: step S14).

  As an example of the heat treatment (drying treatment), heating by a heater and spraying of dry air can be given. Moreover, as an example of heat processing conditions, the conditions of 5 minutes to 120 minutes are mentioned at the temperature of 100 degreeC or more and 300 degrees C or less.

  As an example of the exposure process, light irradiation with a UV lamp, visible light, or the like can be given. Examples of the light source include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a carbon arc lamp.

  It is also possible to apply radiation. For example, an electron beam, an X-ray, an ion beam, a far infrared ray, or the like may be applied, or a g-line, i-line, deep-UV light, high-density energy beam (laser beam), or the like may be used.

  The exposure time when scanning exposure using an infrared laser, high-intensity flash exposure such as a xenon discharge lamp, or infrared lamp exposure varies depending on the reactivity of the polymer and the type of light source, but is generally 10 seconds to 5 hours. Between.

  The exposure energy is appropriately selected depending on the material used, and the curing energy is preferably 30 milliwatts per square centimeter or more and 1500 milliwatts per square centimeter or less.

  When forming the lamination pattern by the catalyst support polymer liquid for plating, the aspect which performs a hardening process for every layer is preferable.

  In the plating catalyst application step, a plating catalyst or a plating catalyst precursor is applied to the cured plating catalyst-carrying polymer. Examples of the plating catalyst include metal catalysts such as gold, silver and palladium. Moreover, a metal ion is mentioned as a catalyst precursor for plating.

  In the plating catalyst application step, the substrate on which the pattern of the catalyst-supporting polymer for plating is formed is immersed in a solution of a metal serving as a catalyst for plating such as gold, silver, and palladium. A metal that becomes a catalyst for plating, such as gold, silver, and palladium, is taken in.

  In the plating process (step S18), the electroless plating process is performed on the pattern of the catalyst-carrying polymer to which the catalyst for plating or the catalyst precursor for plating has been applied. A plating metal (for example, copper) grows with the plating catalyst taken into the core as a nucleus, and a plating film to be a conductive pattern is formed.

The plating film to be a conductive pattern has excellent conductivity with a high electric conductivity of 10 × 10 ⁶ Siemens per meter or more and 100 × 10 ⁶ Siemens per meter or less, and between the catalyst-supporting polymer for plating Excellent adhesion.

  As for the type of plating performed in this step, it is preferable to perform electroless plating from the viewpoint of improving the formability and adhesion of a hybrid structure expressed in the catalyst-supporting polymer for plating. Further, in order to obtain a plating layer having a desired film thickness, it is a more preferable aspect that electroplating is further performed after electroless plating.

  When the plating catalyst-carrying polymer provided with the plating catalyst or the plating catalyst precursor functions as a seed layer, the plating catalyst-carrying polymer can be electroplated.

  That is, the type of plating can be appropriately selected depending on the function of the plating catalyst or the plating catalyst precursor that has formed an interaction with the plating catalyst-supporting polymer.

[Description of catalyst loading polymer discharge process for plating]
FIG. 2 is a flowchart showing the flow of the plating catalyst-carrying polymer discharging step (step S12 in FIG. 1). As shown in the figure, when the plating catalyst-carrying polymer discharge step is started (step S20), discharge conditions corresponding to the width of the conductive pattern are set in the discharge condition setting step (step S22), and the heating step (Step S24) starts heating the substrate on which the conductive pattern is formed.

The discharge conditions set by the discharge condition setting step include the diameter (dot size) D ₁ of dots formed on the substrate, the pitch W between dots, and the diameter of the droplets during discharge (discharge droplet diameter) D _2. Is included.

In the pattern formation of the catalyst-supporting polymer for plating shown in this example, the dot size D ₁ , the dot pitch W, and the discharge droplet diameter D ₂ are determined so as to satisfy the relationship of the following formula (11).

D ₁ <W <D ₂ (11)
In addition, when forming a layered pattern of the catalyst-supporting polymer for plating, the discharge conditions for forming the first layer (lowermost layer) pattern and the discharge conditions for forming the second and subsequent layers are set. Is done.

  The discharge conditions for forming the pattern for the first layer and the discharge conditions for forming the pattern for the second and subsequent layers may be the same or different (details will be described later).

  In the heating step, the surface temperature of the substrate is maintained within a certain range while the catalyst-supporting polymer liquid for plating is discharged. The surface temperature of the substrate is maintained at 45 ° C. or higher, preferably 60 ° C. or higher. When the substrate is heated and the surface temperature of the substrate is maintained within the above-described temperature range, it contributes to high definition of the pattern formed by the catalyst-supporting polymer liquid for plating (details will be described later).

  Next, on the basis of the discharge conditions set in the discharge condition setting step (step S22), when the discharge of the plating catalyst-supporting polymer liquid is started (step S26), the plating catalyst-supporting polymer liquid is set to a predetermined value. A continuous pattern of the polymer liquid for supporting a catalyst for plating is formed by continuously discharging at a discharge cycle.

  When the continuous pattern of the catalyst supporting polymer solution for plating is formed, the discharge is finished (step S28), the heating of the substrate is stopped (step S30), and the plating catalyst supporting polymer discharging step is finished (step). S32).

  FIG. 3 is an explanatory view schematically showing a pattern forming system applied to the plating catalyst-carrying polymer discharging step shown in FIG. A pattern forming system 10 shown in FIG. 1 discharges a catalyst-carrying polymer solution 16 for plating to the platen 14 that supports the back side surface of the substrate 12 and the surface of the substrate 12 (the surface on which the adhesion auxiliary layer 20 is formed). An inkjet head 18.

  As for the base material 12, the planarization film | membrane 12B is formed in 12A of epoxy substrates. The base material 12 shown in FIG. 3 is coated with an epoxy primer agent (adhesion auxiliary layer) 20 by spin coating.

  The platen 14 includes a heater 22 and is provided with a temperature sensor 24 that detects the temperature of the surface of the platen 14 (the support surface of the base material 12). The amount of heating by the heater 22 is determined based on the detection result of the temperature sensor 24. By controlling, the surface temperature of the base material 12 is maintained within a certain range.

  Instead of the mode in which the heater 22 is built in the platen 14, a mode in which a means for applying heat energy to the base material 12 in a non-contact manner is also possible.

  The inkjet head 18 is configured to be movable with a predetermined clearance maintained between the inkjet head 18 and the surface of the substrate 12 by a moving mechanism (not shown). For example, an aspect in which the inkjet head 18 is moved two-dimensionally (in the xy direction) on a plane parallel to the surface of the substrate 12 is possible.

  It is also possible to move the platen 14 intermittently in a direction orthogonal to the moving direction of the inkjet head 18 while moving the inkjet head 18 in one direction (the direction of the arrow line in the drawing).

  Furthermore, a full line type head having at least one nozzle row in which a plurality of nozzles are arranged over a length corresponding to the entire width of the base material 12 is provided, and the base material 12 and the inkjet head 18 are arranged in a direction perpendicular to the nozzle arrangement direction. A mode of relatively moving the two is also possible.

  Although detailed illustration of the inkjet head 18 is omitted, a nozzle for discharging the catalyst-supporting polymer liquid for plating, a liquid chamber (pressure chamber) communicating with the nozzle, and a pressurizing element for pressurizing the liquid in the liquid chamber are provided. There is an aspect to provide.

  As a pressurizing element that pressurizes the liquid in the liquid chamber, a piezoelectric element that deforms the liquid chamber or a heating element that heats the liquid in the liquid chamber can be applied.

  Further, a curing energy applying unit (not shown in FIG. 3) for applying curing energy to the pattern of the catalyst-supporting polymer solution for plating formed on the substrate 12 (shown by adding a reference numeral 26 to the dots of the catalyst-supporting polymer solution for plating). In FIG. 4, a reference numeral 46 is shown in FIG. The substrate on which the pattern of the catalyst-carrying polymer for plating is formed is moved to the curing energy application region of the curing energy application unit, and the curing energy is applied.

  FIG. 4 is a block diagram showing a schematic configuration of a control system of the pattern forming system 10 shown in FIG. As shown in the figure, the pattern forming system 10 includes a system control unit 30, an input / output interface (input / output I / F) 32, a liquid information acquisition unit 34, a memory 35, a heater control unit 36, and a discharge. The control part 38, the conveyance control part 40, and the hardening energy provision control part 42 are comprised.

  The system control unit 30 includes a central processing unit (CPU) and its peripheral circuits, and performs communication control with a host computer (not shown), read / write control of the memory 35, and control for controlling each unit. Generate signals and control them centrally.

  The input / output interface 32 is an interface for inputting data (pattern data of the catalyst-supporting polymer liquid for plating) and outputting information to the outside, and a serial interface and a parallel interface are appropriately applied.

  The liquid information acquisition unit 34 acquires information on the catalyst-supporting polymer liquid for plating and sends the information to the system control unit 30. The liquid information acquisition unit 34 may read information stored in an information storage body such as a barcode or an IC tag, or may input the information by an operator.

  The memory 35 functions as a temporary storage area for the pattern data of the plating catalyst-carrying polymer liquid input via the input / output interface, an arithmetic processing area for data processing, and a storage area for system parameters.

  Various types of storage elements such as semiconductor storage elements and magnetic storage elements can be applied to the memory 35. Further, a mode in which a plurality of memory elements are used in combination is also possible.

  The heater control unit 36 controls on / off and heating amount of the heater 22 built in the platen 14 shown in FIG. 3 based on a command signal sent from the system control unit 30 based on the detection result of the temperature sensor 24.

  The discharge controller 38 converts the pattern data of the plating catalyst-carrying polymer liquid input via the input / output interface 32 into dot data based on preset discharge conditions, and the ink jet head 18 based on the dot data is converted. A drive voltage is generated.

  The discharge control unit 38 includes a discharge condition setting unit that sets discharge conditions, an arithmetic processing unit that converts the input pattern data of the catalyst-carrying polymer liquid for plating into dot data, and a drive voltage (drive waveform based on the dot data). And a drive voltage generation unit.

  In the case of forming a laminated pattern of the catalyst-supporting polymer liquid for plating, the discharge conditions for forming the first layer (lowermost layer) pattern and the discharge conditions for forming the second and subsequent patterns may be the same. However, different conditions may be used.

  The drive voltage generation unit includes a drive waveform generation unit, an amplification processing unit that performs voltage amplification and current amplification on the drive waveform, and an output unit that outputs the drive waveform after the amplification processing as a drive voltage.

  The conveyance control unit 40 controls the operation of the conveyance driving unit 44 that relatively moves the inkjet head 18 and the platen 14 (base material 12) based on the pattern data (dot data) of the catalyst-carrying polymer liquid for plating.

  The conveyance driving unit 44 includes a moving mechanism that moves the inkjet head 18 along the guide, and a motor that is a driving source of the moving mechanism. An aspect including a position detection element that detects the position of the inkjet head 18 and the position of the platen 14 (base material 12) is preferable.

  Examples of the position detection element include a rotary encoder attached to a rotating shaft of a motor and a linear encoder provided extending in the moving direction of the inkjet head 18.

  The curing energy application control unit 42 controls the operation of the curing energy application unit 46 based on a command signal from the system control unit 30.

  Although detailed illustration is omitted, it is also possible to configure a conductive pattern forming system provided with means for realizing the plating catalyst applying step (step S16) and the plating step (step S18) shown in FIG. is there.

[Explanation of discharge conditions]
(Discharge parameter)
Next, the discharge conditions of the pattern forming method (system) shown in this example will be described. FIG. 5 is a view for explaining discharge parameters of the catalyst-supporting polymer liquid for plating. In the figure, parts that are the same as or similar to those in FIG. 3 are given the same reference numerals, and descriptions thereof are omitted.

The diameter of the discharge droplet 16 discharged from the inkjet head 18 (the diameter obtained from the volume of the discharge droplet 16 assuming that the shape of the discharge droplet 16 is a spherical shape) D ₁ , the dot 26 formed on the substrate D ₂ (the diameter of a dot in a state where the ejected droplets 16 land on the substrate independently and the shape is stable) D ₂ , and the inter-dot pitch W of the dots 26 formed on the substrate is as shown in the figure. Yes.

(System requirements)
Head system: DMP-2831 (manufactured by FUJIFILM Dimatix)
Inkjet head: DMC-11610
Discharge frequency: 4 kHz Discharge rate: 6 millimeters per second (Preparation of catalyst-supporting polymer solution for plating)
Polymer having a molecular weight of 20000 (high molecular weight polymer): 5%
Acetonitrile (low boiling point solvent with a boiling point of 82 ° C): 45%
Cyclohexanone (medium boiling solvent with a boiling point of 156 ° C.): 30.95%
Propylene carbonate (high boiling point solvent with a boiling point of 240 ° C.): 19%
Surfactant (surface tension modifier): 0.05%
The diameter D ₁ of the ejected droplet 16 shown in FIG _same, the diameter D ₂ of the dots _26, that relationship dot pitch W satisfies the relationship of the above formula (11), preferably a fine pattern is formed.

  Here, when the molecular weight of the polymer is 20000, good ejection is realized. However, when the molecular weight of the polymer is increased, ejection characteristics are deteriorated. When the molecular weight exceeds 50000 (for example, molecular weight 60000), ejection by the ink jet method is performed. Experiments have shown that it becomes difficult.

  Therefore, the molecular weight of the polymer is preferably 50000 or less, and more preferably 20000 or less, from the viewpoint of ejection performance by the inkjet method.

  Further, when the mass ratio of the high molecular weight polymer is decreased, the discharge performance is improved, the nozzle is prevented from being dried, and the open time is increased. If the mass ratio of the high molecular weight polymer is 10 weight percent or more, normal ejection may not be performed. Therefore, the mass ratio of the high molecular weight polymer is preferably less than 10 mass percent.

(Preparation of solvent)
FIG. 6 is a graph showing the relationship between the boiling point (volatility) calculated from the mass ratio in a mixed solvent in which a plurality of types of solvents having different boiling points are mixed and the pattern width of the plating catalyst-carrying polymer liquid.

  The above-described preparation of the catalyst-supporting polymer solution for plating is changed, and the mass ratio of the high-boiling point solvent, the medium-boiling point solvent, and the low-boiling point solvent is changed, and the influence of this change is considered. In addition, the temperature of a base material is room temperature (25 degreeC).

When the boiling point of the mixed solvent in the figure is T ₁ ° C., the high boiling point solvent (19% by mass), the medium boiling point solvent (30.95% by mass) and the low boiling point solvent (45% by mass) in the above-described mass ratio are contained. The catalyst-supporting polymer liquid for plating is used.

On the other hand, when the boiling point is T ₂ ° C (including only the medium boiling point solvent mixed with the medium boiling point solvent instead of the high boiling point solvent and the low boiling point solvent), the boiling point of the mixed solvent is compared to the case where the boiling point is T ₁ ° C. It can be seen that the pattern width has increased.

Further, when the boiling point of the mixed solvent is T ₃ ° C (when a medium boiling point solvent is mixed instead of the low boiling point solvent), the pattern width is further increased as compared with the case where the boiling point of the solvent is T ₂ ° C. It is understood.

  That is, the volatility (the boiling point of the mixed solvent calculated from the mass ratio) and the pattern width are correlated, and the pattern width is greatly reduced compared to the mixing of the low boiling point solvent (when the boiling point of the mixed solvent is lower). Is grasped.

  This is presumably because the dots that land on the substrate evaporate the solvent from the edge portion, and thus the addition of the low boiling point solvent promotes the evaporation of the solvent and suppresses the spread of the dots.

  The details of calculation of the boiling point (mixed solvent boiling point calculated from the mass ratio) of the mixed solvent in which a plurality of types of solvents having different boiling points are mixed will be described later.

(Temperature of base material)
Next, the temperature of the substrate will be described. FIG. 7 is a graph showing the relationship between the temperature of the substrate and the pattern width. As shown in the figure, it is understood that the pattern width decreases when the temperature of the substrate is gradually increased from room temperature (25 ° C.).

  That is, by setting the temperature of the base material to 45 ° C. or higher, adhesion of the contact line between the base material and the catalyst-supporting polymer liquid for plating is promoted, and the pattern width can be reduced. Further, by making the surface temperature of the substrate 60 or more, the pattern width can be further miniaturized.

(Description of dot pitch)
Next, the dot pitch will be described. FIG. 8 is a graph showing the relationship between the pitch between dots and the pattern width. FIGS. 9A to 9G show the relationship between the pitch between dots and the planar shape of the pattern (micrographs are schematically shown). It is explanatory drawing which shows.

The substrate temperature is 60 ° C., and the inter-dot pitch W is quantitatively changed from a half of the diameter D ₁ of the ejected droplets to the diameter D ₂ of the dots. Note that the 60 micrometer Examples of (D ₂ in the formula ₍₁₁₎₎ the diameter of discharged liquid droplets 20 micrometers Examples of (D ₁ of the formula _(11)), dot diameter formed on the substrate can do.

As shown in FIG. 8, it is understood that the pattern width decreases by increasing the inter-dot pitch. On the other hand, when the inter-dot pitch W≈dot diameter D ₂ shown in FIG. 9 (f), and when the inter-dot pitch W> dot diameter D ₂ shown in FIG. The phenomenon that part is cut off) has occurred.

Note that the dot pitch W shown in FIG. 9 (e) is slightly smaller than the diameter D ₂ of the dots, but there are portions where the thickness is reduced to the edge of the pattern, not jaggy occurs in the pattern.

On the other hand, when narrowing the pitch between dots W to the discharge droplet diameter D ₁ less, thicker pattern width as shown in FIG. 9 (a), and becomes uneven, and as shown in FIG. 9 (b) The pattern width becomes thick, and it is not a preferable fine pattern.

  When the inter-dot pitch W is reduced (when the dot density of the pattern is increased), the liquid amount per unit length of the pattern (liquid volume) increases, so that the width of the pattern becomes thick. Therefore, in order to further reduce the pattern width, it is preferable to increase the inter-dot pitch W to reduce the liquid amount per unit length.

  On the other hand, if the inter-dot pitch W is excessively increased, adjacent dots are separated from each other, and pattern cuts may occur.

By setting the inter-dot pitch W to a value exceeding the diameter D ₁ of the ejected droplet (W> D ₁ ), the inter-dot pitch W is set to the diameter D of the ejected droplet while suppressing the amount of droplet per unit length of the pattern. be a value greater than _1, it is possible to connect reliably dots which are adjacent to the pitch W of the dot diameter of less than D ₂ between dots.

  For example, when the diameter of the nozzle is 21 micrometers, the diameter of the ejected droplet is estimated to be about 25 micrometers, so the inter-dot pitch W is set to a value exceeding 25 micrometers.

  On the other hand, the cause of the non-uniform pattern width is considered to be a bulge. When drawing is performed at a higher density, the occurrence of bulges appears remarkably. Further, when the discharge frequency is 1 kilohertz or more, bulges are generated at non-uniform intervals.

  It is considered that a bulge occurs when the pattern width locally increases with the non-uniform position as a base point due to minute fluctuations in the ejection direction and ejection amount and irregular minute irregularities on the substrate.

Therefore, it is considered that the occurrence of bulges can be avoided by setting the inter-dot pitch W to be less than the dot diameter D ₂ (W <D ₂ ).

That is, the inter-dot pitch W and the discharge droplets are so arranged that the inter-dot pitch W exceeds the discharge droplet diameter (D ₁ ) and is less than the dot diameter (D ₂ ) so that adjacent dots overlap. As shown in FIGS. 9C to 9E, the relationship between the diameter D ₁ and the dot diameter D ₂ satisfies the relationship of the above equation (11) and an appropriate dot pitch W is selected. A fine pattern having a flat shape can be formed.

In particular, the dot pitch W by the following one-half of the dot diameter _{D 2 (W ≦ D 2/} 2), can form a more preferable fine laminate pattern.

  According to the pattern forming method (system) of the catalyst-supporting polymer for plating configured as described above, good discharge performance by the in-jet method is ensured because the catalyst-supporting polymer liquid for plating contains a high boiling point solvent, and When the catalyst-supporting polymer liquid for plating contains a low boiling point solvent, wetting and spreading of the liquid is suppressed, and the pattern of the catalyst-supporting polymer for plating can be miniaturized.

  In addition, by heating the base material and maintaining the surface temperature at 60 ° C., adhesion of the contact line of the catalyst supporting polymer pattern for plating is promoted, and the pattern of the catalyst supporting polymer pattern for plating can be miniaturized. .

Furthermore, when the relationship between the discharge droplet diameter D ₁ , the dot diameter D ₂ , and the inter-dot pitch W satisfies D ₁ <W <D ₂ , a fine pattern of a catalyst-supporting polymer for plating is formed. Yes.

[Explanation of layering]
(Single layer flattening)
Next, lamination of the catalyst-supporting polymer liquid pattern for plating will be described. FIG. 10A is an explanatory view schematically showing a planar shape (upper figure) and a three-dimensional shape (lower figure) of the pattern of the catalyst-supporting polymer liquid for plating of a single layer (one layer).

  In the catalyst-supporting polymer liquid for plating, the low boiling point solvent is 45% by mass, the medium boiling point solvent is 30.95% by mass, and the high boiling point solvent is 19% by mass, and the surface temperature is maintained at 60 ° C. by heating the substrate. ing.

  The planar shape shown in the upper part of FIGS. 10A to 10C schematically shows an image of a micrograph, and the three-dimensional shape shown in the lower part schematically shows an image obtained by a shape measurement microscope. It is.

FIG. 10A shows a pattern of a single layer catalyst-supporting polymer liquid for plating. Although the pattern is miniaturized, the film thickness (d ₁ ) is insufficient.

FIG. 10B shows a pattern of the catalyst-supporting polymer liquid for plating obtained by laminating two layers of the pattern of the catalyst-supporting polymer liquid for plating shown in FIG. 10A. As shown in the figure, the film thickness is about twice (d ₁ × 2) while the fine width of the pattern is substantially maintained.

FIG. 10C shows a pattern of a catalyst-supporting polymer liquid for plating obtained by laminating four layers of the pattern shown in FIG. As shown in the figure, while the pattern width is substantially maintained, the film thickness is not a value obtained by multiplying the film thickness of the single layer by the number of layers, but is approximately three times the film thickness of the single layer (d ₁ × 3 ).

  That is, the pattern of the catalyst-supporting polymer liquid for plating can be laminated, and a multilayer (laminated) pattern having a desired film thickness can be formed by repeating the formation of a single layer pattern.

  In order to laminate the pattern of the catalyst-supporting polymer liquid for plating, it is necessary to optimize the drying of the dots (evaporation of the solvent) and to flatten each layer or at least the first layer as the lowermost layer to some extent.

FIGS. 11A to 11C are explanatory views showing the influence of the volatility of the mixed solvent on the surface shape of the dots (patterns). FIG. 11A shows a mixed solvent in which the above-mentioned low-boiling solvent is 45% by mass, medium-boiling solvent is 30.95% by mass, and high-boiling solvent is 19% by mass (mixing at the boiling point T ₁ ° C. shown in FIG. 6). It represents the three-dimensional shape of a dot using a catalyst-supporting polymer liquid for plating using a solvent. The dots 26A shown in the figure have no extreme unevenness.

FIG. 11B shows a catalyst-supported polymer liquid dot for plating in which a medium-boiling solvent added in place of the high-boiling solvent and the low-boiling solvent (only the medium-boiling solvent having a boiling point of T ₂ ° C. shown in FIG. 6) is used. This represents the three-dimensional shape. In the dot 26B shown in the figure, extreme unevenness is generated at the end (portion surrounded by a circle), and so-called coffee stain phenomenon occurs.

FIG. 11 (c) shows a plating catalyst using a mixed solvent (a mixed solvent having a boiling point of T ₃ ° C. shown in FIG. 6) in which a high boiling point solvent is mixed by 19% by mass and a medium boiling point solvent is mixed by 75.95% by mass. It represents the three-dimensional shape of the dots in which the supported polymer liquid was used. The dots 26C shown in the figure do not have extreme unevenness like the dots 26A shown in FIG.

  The evaporation of the solvent at the dots on the substrate occurs from the boundary between the substrate, the dots and the gas. Convection occurs from the center of the dot to the end of the dot due to evaporation of the solvent, and the polymer component is carried by this convection, so that the localization of the polymer component occurs at the end of the dot, and the end of the dot is convex after drying. It becomes.

  On the other hand, by containing a high-boiling solvent in the catalyst-supporting polymer solution for plating, the rate of evaporation from the boundary between the substrate, dots, and gas (atmosphere) decreases, and convection flows from the center of the dot to the edge of the dot. And the dots are flattened after drying.

(Pitch between dots)
FIG. 12 is an explanatory diagram showing the relationship between the pitch between dots and the planar shape of the pattern when forming (stacking) the second and subsequent layers.

12 (a) is a case where substantially the same as the diameter D ₁ of the ejected droplet dot pitch W, sometimes the second or upper layer protrudes from the width of the pattern.

Figure 12 (b) (d) is a case of the dot pitch W of the discharged fluid diameter D _1, greater diameter D than ₂ dots drop, good fine layered pattern is formed. In particular, as shown in FIG. 12 (b), when the pitch between dots W is one-half of the dot diameter D ₂ may form a more preferred fine laminate pattern.

  As shown in FIG. 12D, even when a fine pattern can be formed, if the inter-dot pitch W is further widened, a thin portion occurs at the edge of the second and subsequent patterns. It is possible.

  FIG. 12E shows a case where the dot pitch is substantially the same as the dot diameter, and jaggy is generated as in FIGS. 9F and 9G.

That is, when forming a laminated pattern of the catalyst-supporting polymer liquid for plating, the relationship between the diameter D _{1 of} the ejected droplets, the diameter D _{2 of} the dots, and the pitch W between dots satisfies the above formula (11). A preferred laminate pattern is formed.

Further, the pitch between dots W by the following one-half of the dot diameter _{D 2 (W ≦ D 2/} 2), can form a more preferable fine laminate pattern.

  In addition, when the laminated pattern is formed without heating the substrate, the liquid is easy to spread because the properties of the liquid that forms the lower layer and the liquid that forms the upper layer are the same, making it difficult to form the laminated pattern. By heating the substrate and maintaining the surface temperature at 60 ° C. (temperature exceeding twice the room temperature (25 ° C.)), wetting and spreading of the liquid is suppressed, and lamination is possible while maintaining a fine pattern width. Become.

  Furthermore, by including a low boiling point solvent in the catalyst-supporting polymer liquid for plating, it is possible to enhance the effect of suppressing wetting and spreading.

  In summary, when forming a laminated pattern using a catalyst-supporting polymer for plating, the dot drying process is optimized by including a high boiling point solvent in the catalyst-supporting polymer solution for plating. The surface shape of the film becomes good (more flattened).

  In addition, by heating the substrate to a surface temperature of 60 ° C., wetting and spreading of the catalyst-supporting polymer liquid for plating can be prevented, and the pattern can be miniaturized. Furthermore, the inclusion of a low boiling point solvent in the catalyst-supporting polymer liquid for plating makes it possible to enhance the effect of preventing the plating catalyst-supporting polymer liquid from spreading out.

Furthermore, when forming the pattern after the second layer, the relationship between the diameter D _{1 of} the ejected droplets, the diameter D _{2 of} the dots, and the pitch W between dots satisfies the above formula (11), so that a preferable laminated pattern Is formed. From the viewpoint of forming a fine pattern, the number of stacked layers is preferably about 2 to 4.

  In this example, the discharge conditions in the pattern formation for the second and subsequent layers are clearly shown, but the discharge conditions can be applied to the discharge conditions for forming the first layer (lowermost layer) pattern. It is also possible to share the discharge conditions for forming the first layer pattern and the discharge conditions for forming the second and subsequent layers.

[Others]
(Substrate material)
The substrate (substrate) applied to the present invention is preferably dimensionally stable. For example, paper, paper laminated with plastic (for example, polyethylene, polypropylene, polystyrene, etc.), glass substrate, and the like. , Metal plates (eg, aluminum, zinc, copper, etc.), plastic films (eg, cellulose diacetate, cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate, cellulose nitrate, polyethylene terephthalate, polyethylene, polystyrene, polypropylene, polycarbonate , Polyvinyl acetal, polyimide, polyetherimide, epoxy resin (which may have SiO2, SiON, or ITO), bismaleimide resin, bismaleimide triazine resin, polyphenylene oxide, liquid Polymer, polytetrafluoroethylene, cyanate resin, etc., phenol resin, aramid resin, cycloolefin polymer, polyphenylene ether, benzocyclobutene resin, polyethersulfone, polyarylate), paper or plastic film on which metal is laminated or deposited included. As a base material used for this invention, an epoxy resin or a polyimide resin is preferable.

  In general, a plate-like substrate (various substrates) is used as the substrate, but the substrate is not necessarily limited to a plate-like substrate, and a substrate having an arbitrary shape such as a cylindrical shape may be used. .

(Adhesion auxiliary layer solution)
The latex used for the adhesion auxiliary layer contains at least one dispersant selected from an anionic dispersant and a nonionic dispersant, resin particles, and an aqueous dispersion medium. Specifically, the latex in the present invention is one in which resin particles insoluble in water are dispersed in water or a water-soluble dispersion medium, and contains an anionic dispersant or a nonionic dispersant.

  Here, the aqueous dispersion medium is water or a mixed solvent obtained by mixing water with 90% by mass or less of a water-miscible organic solvent. Examples of water miscible organic solvents include water-soluble flammable liquids such as ketone solvents, ester solvents, alcohol solvents, ether solvents, glycol solvents, amine solvents, thiol solvents, and halogen solvents. Can be mentioned.

<Water-soluble flammable liquid>
The water-soluble flammable liquid used for the aqueous dispersion medium will be described.

  Examples of ketone solvents include 4-hydroxy-4-methyl-2-pentanone, γ-butyrolactone, and hydroxyacetone.

  Examples of ester solvents include 2- (2-ethoxyethoxy) ethyl acetate, ethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, methyl cellosolve acetate, 2-hydroxyethyl acrylate, hydroxypropyl acrylate, methyl glycolate, glycol Examples include ethyl acid.

  Examples of alcohol solvents include methanol, ethanol, propanol, 1-methoxy-2-propanol, isopropyl alcohol, normal propyl alcohol, 3-acetyl-1-propanol, 2- (allyloxy) ethanol, 1-pentanol, and 3-methyl- 1-butanol, n-hexanol, 1-heptanol, 2-ethyl-1,3-hexanediol, 2-aminoethanol, 2-amino-2-methyl-1-propanol, (±) -2-amino-1- Propanol, 3-amino-1-propanol, 2-dimethylaminoethanol, 2,3-epoxy-1-propanol, ethylene glycol, 2-fluoroethanol, diacetone alcohol, 2-methylcyclohexanol, 4-hydroxy-4- Methyl-2-pentanone Glycerin, 2,2 ′, 2 ″ -nitrilotriethanol, 2-pyridinemethanol, 2,2,3,3-tetrafluoro-1-propanol, 2- (2-aminoethoxy) ethanol, 2- [2- (benzyl Oxy) ethoxy] ethanol, 2,3-butanediol, 2-butoxyethanol, 2,2′-thiodiethanol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 2-methyl -2,4-pentanediol, 1,3-propanediol, diglycerin, 2,2'-methyliminodiethanol, 1,2-pentanediol, etc. In addition, alcohol solvents include 3-amino Also includes alcohol derivatives such as -1-propanol, trifluoroethyl methacrylate and pentadecafluorooctanol. It is.

  Examples of ether solvents include bis (2-ethoxyethyl) ether, bis [2- (2-hydroxyethoxy) ethyl] ether, 1,2-bis (2-methoxyethoxy) ethane, and bis [2- (2-methoxy). Ethoxy) ethyl] ether, bis (2-methoxyethyl) ether, 2- (2-butoxyethoxy) ethanol, 2- [2- (2-chloroethoxy) ethoxy] ethanol, 2-ethoxyethanol, 2- (2- Ethoxyethoxy) ethanol, 2-isobutoxyethanol, 2--2-isobutoxyethoxy) ethanol, 2-isopropoxyethanol, 2- [2- (2-methoxyethoxy) ethoxy] ethanol, 2- (2-methoxyethoxy) Ethanol, 1-ethoxy-2-propanol, 1-methoxy-2-propanol, Polypropylene glycol monomethyl ether, methoxy acetic acid and 2-methoxy ethanol.

  Examples of the glycol solvent include diethylene glycol, triethylene glycol, ethylene glycol, hexaethylene glycol, propylene glycol, dipropylene glycol, and tripropylene glycol.

  Examples of the amine solvent include N-methyl-2-pyrrolidone and N, N-dimethylformamide.

  Examples of the thiol solvent include mercaptoacetic acid and 2-meltcaptoethanol.

  Examples of the halogen solvent include 3-bromobenzyl alcohol, 2-chloroethanol, 3-chloro-1,2-propanediol and the like.

  Examples of the solvent included in the water-soluble flammable liquid other than the above solvent include methyl lactate, ethyl lactate, morpholine, N-ethylmorpholine, formic acid, acetic acid and the like.

  As long as the total content is within the above range, the water-soluble flammable liquid contained in the mixed solvent may be used alone or in combination of two or more.

  The resin constituting the resin particles contained in the latex is not particularly limited. For example, polyester, polyurethane, polyurea / urethane, SBR (styrene-butadiene), MBR (MMA / butadiene, acrylic / butadiene), NBR (acrylonitrile). / Butadiene), NR (natural rubber), acrylic rubber, BR (butadiene rubber), CR (chloroprene rubber), IR (isoprene rubber), VP (SBR / divinylpyridine), EPDM (ethylene propylene diene rubber) A polymer etc. are mentioned. As the latex, those containing resin particles containing a cyano group are particularly preferable.

  As such a latex, commercially available products may be used. Specifically, Nipol 1561 (Nippon Zeon Co., Ltd.), Nipol 1562 (Nippon Zeon Co., Ltd.), Nipol 1577K (Nippon Zeon Co., Ltd.), Nipol LX110 (Nippon Zeon Corporation), LX 531 (Nippon Zeon Corporation), LX 531B (Nippon Zeon Corporation), Nipol SX1503A (Nippon Zeon Corporation), LX 513 (Nippon Zeon Corporation), You may use what is marketed as NK-300 (Nippon A & L Co., Ltd.) and NK-301 (Nippon A & L Co., Ltd.). These commercially available latexes contain an anionic dispersant and / or a nonionic dispersant as described below.

  Further, as the resin particles, different types of resin particles may be used in combination. Examples of resin particles that can be used in combination include SBR and NR, IR and NR, CR and NR, NBR having different nitrile amounts, SBR having different styrene amounts, SBR and VP, NBR and MBR, SBR and NBR, and SBR. And MBR, BR and CR, NBR and VP, CR and VP, and the like.

  The anionic dispersant or nonionic dispersant contained in the latex will be described.

<Anionic dispersant>
Examples of the anionic dispersant include fatty acid such as beef tallow fatty acid, partially hydrogenated beef tallow fatty acid, oleic acid, palmitic acid, dodecyl sulfate and the like, and fatty acid salts thereof such as potassium salt and sodium salt; rosin acid, hydrogenated rosin acid, etc. Examples thereof include resin acid salts such as resin acids and sodium salts and potassium salts thereof; alkylbenzene sulfonic acids such as dodecylbenzene sulfonic acid and sodium salts thereof. Among these anionic dispersants, long chain fatty acids such as oleic acid and palmitic acid and salts thereof are preferable from the viewpoint of ease of use.

<Nonionic dispersant>
Examples of nonionic dispersants include polyethylene glycol ester type and pluronic type dispersants such as block copolymers of ethylene oxide and propylene oxide, and ethylene glycol type dispersants are preferred.

  Only one type of anionic dispersant or nonionic dispersant may be used, or two or more types may be used in combination. Moreover, as a combination aspect of these dispersants, an aspect in which only two or more anionic dispersants are used, an aspect in which only two or more nonionic dispersants are used, one type or two or more types of anionic dispersant and one type Or any of the aspects using 2 or more types of nonionic dispersing agents may be sufficient. When used in combination, it is particularly preferable to use a combination of a long-chain fatty acid and a salt thereof as the anionic dispersant and an ethylene glycol type dispersant as the nonionic dispersant.

  The film thickness of the resin layer A formed by the contact between the base material and the latex can be appropriately set, but is preferably 0.01 to 5 micrometers, preferably 0.06 to 3 micrometers. Is more preferable, and most preferably 1 micrometer or more and 2 micrometers or less.

(Catalyst-supported polymer solution for plating)
The catalyst-supporting polymer liquid for plating applied to the wiring structure manufacturing method (apparatus) according to the present invention contains a polymer having a predetermined functional group and a solvent having a predetermined boiling point. When the solvent has a predetermined boiling point, an ink exhibiting excellent continuous ejection stability and pattern formability can be obtained.

<Polymer>
The polymer used in the catalyst-supporting polymer solution for plating of the present invention is composed of a functional group that interacts with the electroless plating catalyst or its precursor (hereinafter also referred to as “interactive group” as appropriate) and a polymerizable functional group. And a polymer containing By including an interactive group in the polymer, excellent adsorptivity to a plating catalyst described later is achieved, and as a result, a plating film (metal film) having a sufficient thickness can be obtained during the plating process. In addition, when the polymerizable functional group is contained in the polymer, excellent adhesion to the substrate described later is exhibited, and a polymer layer having excellent strength can be obtained because a crosslinking reaction proceeds in the film.

[Interactive group]
The type of the interactive group is not particularly limited as long as it interacts with a plating catalyst described later. For example, non-dissociative functional groups such as polar groups (hydrophilic groups), groups capable of forming multidentate coordination, nitrogen-containing functional groups, sulfur-containing functional groups, oxygen-containing functional groups (functions that do not generate protons by dissociation) Group). In particular, in order to reduce the water absorption and hygroscopicity of the polymer layer obtained using the ink, it is preferable to use a non-dissociable functional group as a site exhibiting metal ion adsorption ability.

  Examples of polar groups include positively charged functional groups such as ammonium and phosphonium, sulfonic acid groups, carboxyl groups, phosphoric acid groups, phosphonic acid groups, groups containing an N-hydroxy structure, phenolic hydroxyl groups, hydroxyl groups, and the like. Examples thereof include an acidic group having a negative charge or capable of dissociating into a negative charge. They adsorb with metal ions either in the form of a counter ion of the dissociating group or in a non-dissociated state.

  Specifically, the non-dissociable functional group is preferably a group capable of forming a coordination with a metal ion, a nitrogen-containing functional group, a sulfur-containing functional group, an oxygen-containing functional group, a phosphorus-containing functional group, or the like. More specifically, imide group, pyridine group, tertiary amino group, ammonium group, pyrrolidone group, amidino group, triazine ring, triazole ring, benzotriazole group, benzimidazole group, quinoline group, pyrimidine group, pyrazine group, Quinazoline group, quinoxaline group, purine group, triazine group, piperidine group, piperazine group, pyrrolidine group, pyrazole group, aniline group, group containing alkylamine group structure, group containing isocyanuric structure, nitro group, nitroso group, azo group, Nitrogen-containing functional groups such as diazo group, azide group, cyano group, cyanate group (R—O—CN), ether group, carbonyl group, ester group, group containing N-oxide structure, group containing S-oxide structure, etc. Oxygen-containing functional group, thioether group, thioxy group, thiophene group, thiol group, sulfoxy Groups, sulfone groups, sulfite groups, groups containing sulfoxyimine structures, groups containing sulfoxynium salt structures, sulfur-containing functional groups such as groups containing sulfonate structures, phosphorous groups such as phosphine groups, phosphate groups, phosphoramide groups, etc. Examples include functional groups, groups containing halogen atoms such as chlorine and bromine, and unsaturated ethylene groups. In addition, an imidazole group, a urea group, or a thiourea group may be used as long as it is non-dissociative due to a relationship with an adjacent atom or atomic group. Furthermore, it may be a functional group derived from a compound having an inclusion ability such as cyclodextrin and crown ether.

Among them, since it has high polarity and high adsorption ability to a plating catalyst or the like, it is represented by an ether group (more specifically, —O— (CH 2) _n —O— (n is an integer of 1 to 5). Structure) or a cyano group is particularly preferable, and a cyano group is more preferable.

[Polymerizable group]
Examples of the polymerizable group include a radical polymerizable group and a cationic polymerizable group. From the viewpoint of reactivity with the substrate described later, a radical polymerizable group is preferable. Examples of the radical polymerizable group include unsaturated carboxylic acid ester groups such as acrylic acid ester groups, methacrylic acid ester groups, itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, styryl groups, Examples include allyl group. Among these, a methacrylic acid ester group (methacryloyl group), an acrylic acid ester group (acryloyl group), an allyl group, and a styryl group are preferable, and an acryloyl group and a methacryloyl group are particularly preferable.

<Preferred embodiment of polymer>
[Unit represented by Formula (1)]
One preferred embodiment of the polymer is a polymer containing a unit (repeating unit) represented by the following formula (1) because it is more excellent in reactivity with the substrate. The unit is a unit having a polymerizable group (polymerizable group-containing unit).

In the formula (1), R ¹ to R ⁴ each independently represent a hydrogen atom or a substituted or unsubstituted alkyl group. When R ¹ to R ⁴ are a substituted or unsubstituted alkyl group, an alkyl group having 1 to 4 carbon atoms is preferable, and an alkyl group having 1 to 2 carbon atoms is more preferable.

  More specifically, examples of the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group, and examples of the substituted alkyl group include a methoxy group, a hydroxy group, and a halogen atom (for example, a chlorine atom). , A bromine atom, a fluorine atom) and the like, and a methyl group, an ethyl group, a propyl group, and a butyl group.

R ¹ is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a hydroxy group or a bromine atom. R ² is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a hydroxy group or a bromine atom. R ³ is preferably a hydrogen atom. R ⁴ is preferably a hydrogen atom.

  Y and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group. Examples of the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 11 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), -O —, —S—, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, or a combination thereof (eg, alkyleneoxy group, alkylene group) Oxycarbonyl group, alkylenecarbonyloxy group, etc.). The organic group may have a substituent such as a hydroxy group as long as the effects of the invention are not impaired.

  Examples of the substituted or unsubstituted aliphatic hydrocarbon group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentyl group, a hexyl group, or a group such as a methoxy group, a hydroxy group, or a halogen atom (for example, a chlorine atom). , Bromine atom, fluorine atom) and the like. The substituted or unsubstituted aromatic hydrocarbon group is preferably an unsubstituted phenyl group or a phenyl group substituted with a methoxy group, a hydroxy group, a halogen atom (for example, a chlorine atom, a bromine atom, or a fluorine atom). .

  Y and Z are preferably an ester group (—COO—), an amide group (—CONH—), an ether group (—O—), a substituted or unsubstituted aromatic hydrocarbon group, and the like.

L ¹ represents a substituted or unsubstituted divalent organic group. The definition of a divalent organic group is synonymous with the organic group represented by said Y and Z, for example, a substituted or unsubstituted aliphatic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, -O -, -S-, -N (R)-(R: alkyl group), -CO-, -NH-, -COO-, -CONH-, or a group combining these.

L ¹ is preferably an unsubstituted alkyl group or a divalent organic group having a urethane bond or a urea bond, more preferably a divalent organic group having an unsubstituted alkyl group and a urethane bond, and the total number of carbon atoms. Those having 1 to 9 are particularly preferred. Incidentally, the total number of carbon atoms of L ^1, means the total number of carbon atoms contained in the substituted or unsubstituted divalent organic group represented by L ^1.

More specifically, the structure of L ¹ is preferably a structure represented by the following formula (1-1), the following formula (1-2), or the following formula (1-3).

In the formula (1-1) and the formula (1-2), R ^a and R ^b are each independently two or more atoms selected from the group consisting of a carbon atom, a hydrogen atom, and an oxygen atom. It is a divalent organic group formed using Preferably, it is a substituted or unsubstituted methylene group, ethylene group, propylene group or butylene group, ethylene oxide group, diethylene oxide group, triethylene oxide group, tetraethylene oxide group, dipropylene oxide group, tripropylene oxide group, tetrapropylene. An oxide group is mentioned.

[Unit represented by Formula (4)]
A preferred embodiment of the unit represented by the above formula (1) is a unit represented by the following formula (4).

In the formula ^(4), R ^{1, R2,} Z and ^{L 1} are the same as the definition of each group in the unit represented by the above formula (1). T represents an oxygen atom or NR (R represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms).

[Unit represented by Formula (5)]
A preferred embodiment of the unit represented by the above formula (4) is a unit represented by the following formula (5).

In said formula (5), R < ¹ >, R < ² > and L < ¹ > are the same as the definition of each group in the unit represented by the said Formula (1). T and Q each independently represent an oxygen atom or NR (R represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms).

In the above formula (4) and the above formula (5), W is preferably an oxygen atom. In the above formulas (4) and (5), L ¹ is preferably an unsubstituted alkylene group or a divalent organic group having a urethane bond or a urea bond, and a divalent organic group having a urethane bond. The group is more preferable, and those having 1 to 9 carbon atoms are particularly preferable.

  The content of the unit represented by the above formula (1) in the polymer is not particularly limited. However, from the viewpoints of adhesion to a substrate described later, storage stability, and difficulty in synthesis, all units (100 mol%) are used. On the other hand, 5 mol% or more and 50 mol% or less are preferable, and 5 mol% or more and 40 mol% or less are more preferable.

  When the amount is less than 5 mol%, the reactivity (curability and polymerizability) may be lowered. When the amount exceeds 50 mol%, gelation tends to occur during the synthesis of the polymer, and the control of the reaction becomes difficult.

[Unit represented by Formula (2)]
One preferred embodiment of the polymer includes a polymer having a unit (repeating unit) represented by the following formula (2) from the viewpoint of the excellent adsorptivity of the plating catalyst. The unit is a unit containing an interactive group (interactive group-containing unit).

In the formula (2), R ⁵ represents a hydrogen atom or a substituted or unsubstituted alkyl group.
A substituted or unsubstituted alkyl group represented by R5 has the same meaning as substituted or unsubstituted alkyl group represented by R ^{1 to} R ⁴ described above. R5 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a hydroxy group or a bromine atom.

X and L ² each independently represent a single bond or a substituted or unsubstituted divalent organic group. The definition of the divalent organic group is as described above. X is preferably a single bond, an ester group, an amide group or an ether group, more preferably a single bond, an ester group or an amide group, and most preferably a single bond or an ester group.

L ² is one of the preferred embodiments that is a linear, branched, or cyclic alkylene group, an aromatic group, or a combination thereof. The group obtained by combining the alkylene group and the aromatic group may further contain an ether group, an ester group, an amide group, a urethane group, or a urea group. Among them, L ² preferably has a total carbon number of 1 to 15, and is particularly preferably unsubstituted.

Here, the total number of carbon atoms, for example, means the total number of carbon atoms contained in the substituted or unsubstituted divalent organic group represented by L ^2.

  Specifically, a methylene group, an ethylene group, a propylene group, a butylene group, a phenylene group, and those groups substituted with a methoxy group, a hydroxyl group, a chlorine atom, a bromine atom, a fluorine atom, etc., The group which combined these is mentioned.

W represents a non-dissociable functional group that interacts with the plating catalyst or its precursor. W may be bonded directly from the polymer straight chain. That is, the aforementioned X and L ² may be a single bond, and W may be directly bonded to a carbon atom. The definition of the non-dissociable functional group is as described above.

  One preferred embodiment of the unit represented by the above formula (2) is a unit represented by the following formula (6).

In said formula (6), the definition of R < ⁵ >, X and L < ² > is synonymous with each group in the said Formula (2). Another preferred embodiment of the unit represented by the above formula (2) is a unit represented by the following formula (7).

In the formula (7), the definition of ^{R 5} and ^{L 2} are as defined each group in the above formula (2). R ⁶ represents an unsubstituted alkyl group, alkenyl group, alkynyl group, or aryl group. The content of the unit represented by the above formula (2) in the polymer is not particularly limited, but from the viewpoint of adsorbability to the plating catalyst or its precursor and ease of synthesis, all units (100 mol%) in the polymer ) To 20 mol% to 90 mol%, more preferably 30 mol% to 80 mol%.

<Optional unit>
The polymer may further have a unit represented by the following formula (3) from the viewpoint that the affinity for an aqueous solution is improved and the developability is further improved. The unit corresponds to a unit having an ionic polar group.

In the formula (3), R ⁷ represents a hydrogen atom or a substituted or unsubstituted alkyl group. The substituted or unsubstituted alkyl group represented by R ⁷ has the same meaning as the substituted or unsubstituted alkyl group represented by R ¹ to R ⁴ described above.

R ⁷ is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a hydroxy group or a bromine atom. U and L ³ each independently represent a single bond or a substituted or unsubstituted divalent organic group. The definition of the divalent organic group is as described above. The preferred embodiment of U is the same as the preferred embodiment of X above. A preferred embodiment of L ³ is the same as the preferred embodiment of L ² described above.

  V represents an ionic polar group and is not particularly limited as long as it can impart developability of the polymer to an aqueous solution. Specific examples include a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group.

  Above all, from the viewpoint of moderate acidity (does not decompose other functional groups), a carboxylic acid group is preferable, and in particular, it is bonded directly to the polymer main chain from the viewpoint of achieving both low water absorption necessary for electrical wiring. Carboxylic acid groups, carboxylic acid groups directly bonded to the alicyclic structure (alicyclic carboxylic acid groups), carboxylic acid groups separated from the polymer main chain (long chain carboxylic acid groups) are preferred, most preferably It is a carboxylic acid group directly connected to the polymer main chain.

  Such an ionic polar group may be introduced into the polymer by addition / substitution to a part of the polymer, or by copolymerizing a monomer in which the ionic polar group is pendant, It may be introduced into the polymer.

The unit represented by the above formula (3) is moderately acidic (does not decompose other functional groups), exhibits hydrophilicity in an alkaline aqueous solution, and exhibits hydrophobicity due to the cyclic structure when water is dried. , V is a carboxylic acid group, and it is preferable that L ³ has a 4-membered to 8-membered ring structure at the connecting portion with V.

  Here, examples of the 4- to 8-membered ring structure include a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and a phenyl group, and among them, a cyclohexyl group and a phenyl group are preferable. That is, in this embodiment, the terminal of the unit represented by the above formula (3) is an alicyclic carboxylic acid group.

The unit represented by the above formula (3) is moderately acidic (does not decompose other functional groups), shows hydrophilicity in an alkaline aqueous solution, and becomes hydrophobic due to the long-chain alkyl group structure when water is dried. From the viewpoint that it is easy to show, it is preferable that V is a carboxylic acid group and the chain length of L ³ is 6 to 18 atoms.

Here, the chain length of L ³ represents the distance between U and V in the above formula (3), and it is preferable that the distance between U and V is in the range of 6 to 18 atoms. Means. The chain length of L ³ is more preferably 6 to 14 atoms, and still more preferably 6 to 12 atoms.

On the other hand, in the unit represented by the above formula (3), it is also one of preferred embodiments that V is a carboxylic acid group and U and L ³ are single bonds. In this embodiment, it is expected that the carboxylic acid group is shielded by the polymer main chain, and as a result, it can be hydrophobized, and immediately after the metal pattern is formed, the adhesion between the substrate and the metal pattern can be improved. The water resistance of the polymer layer can be increased.

  The content of the unit represented by the above formula (3) in the polymer is not particularly limited, but it is 20 moles with respect to all units (100 mole%) in the polymer from the viewpoint of developability with an aqueous solution and moisture-resistant adhesion. % To 70 mol%, more preferably 20 mol% to 60 mol%.

  Especially preferably, it is 30 mol% or more and 50 mol% or less. Within this range, both developability and moisture-resistant adhesion can be achieved.

  The bonding mode of the above-mentioned units in the polymer is not particularly limited, and each unit may be a random polymer bonded at random, or each unit may be a block polymer that is connected to the same type to form a block portion. Good.

  In addition, the polymer mentioned above may contain other units in the range which does not impair the effect of this invention other than the said unit. However, as described later, when a polymerizable group is introduced by reacting with a polymer, a small amount of a reactive portion remains when it is difficult to introduce 100%, so this may become another unit. There is also sex.

  As a preferred embodiment of the catalyst-supporting polymer for plating applied in this example, a polymer having a unit represented by the above formula (1) and a unit represented by the above formula (6), and the above formula (1) A polymer having a unit represented by formula (7) and a unit represented by formula (7), a unit represented by formula (1), a unit represented by formula (2), and a formula (3). And a polymer having a unit to be prepared.

  The weight average molecular weight of the catalyst-supporting polymer for plating applied in this example is preferably 20000 or less from the viewpoint of forming a fine pattern.

  Moreover, as a polymerization degree of the catalyst support polymer for plating applied to this example, it is preferable to use a 10-mer or more thing, More preferably, it is a 20-mer or more thing. Moreover, 2000-mer or less is preferable and 1000-mer or less is particularly preferable.

<Polymer synthesis method>
As a polymer synthesis method, the following methods are preferably exemplified.

  i) a method of copolymerizing a monomer having an interactive group and a monomer having a polymerizable group, ii) copolymerizing a monomer having an interactive group and a monomer having a double bond precursor, and then a base Iii) copolymerizing a monomer having an interactive group and a monomer having a reactive group for introducing a double bond into a polymer having a reactive group. And a method of introducing a double bond (introducing a polymerizable group) by reacting a monomer having a polymerizable group capable of reacting with the reactive group.

  From the viewpoint of synthesis suitability, preferred methods are the methods ii) and iii). The kind of the polymerization reaction at the time of synthesis is not particularly limited, and includes radical polymerization, cationic polymerization, anionic polymerization, etc., but it is preferable to carry out by radical polymerization. Moreover, when introduce | transducing the unit which has said ionic polar group, the monomer which has an ionic polar group is used together.

  The polymer of the present invention can be synthesized with reference to the method described in paragraphs [0097] to [0125] of JP2009-280905A. Specifically, in the synthesis method of ii) above, in order to convert a double bond precursor to a double bond, the leaving groups represented by B and C are removed by elimination reaction as shown below. A method in which C is extracted by the action of a base and B is eliminated.

  In the following formula, A is an organic group having a polymerizable group, R1 to R3 are each independently a hydrogen atom or a monovalent organic group, and B and C are each independently removed by an elimination reaction. It is a leaving group, and one of B and C is a hydrogen atom, and the other represents a halogen atom, a sulfonate group, an ether group, or a thioether group. The elimination reaction here means that C is extracted by the action of a base and B is eliminated. B is preferably eliminated as an anion and C as a cation. Preferred examples of the base include hydrides of alkali metals, hydroxides or carbonates, organic amino compounds, and metal alkoxide compounds.

  In the synthesis method of iii), examples of the monomer having a reactive group for introducing a double bond include a monomer having a carboxyl group, a hydroxyl group, an epoxy group, or an isocyanate group as a reactive group. The monomer having a polymerizable group to be reacted with a polymer having a reactive group preferably has a reactive group such as a carboxyl group, a hydroxyl group, an epoxy group, an isocyanate group, or a halogenated benzyl group.

  Examples of combinations of reactive groups in the polymer and reactive groups in the monomer include the following patterns.

  That is, (polymer reactive group, monomer reactive group) = (carboxyl group, epoxy group), (carboxyl group, isocyanate group), (hydroxyl group, epoxy group), (hydroxyl group, isocyanate group), (isocyanate group, (Hydroxyl group), (isocyanate group, carboxyl group), (epoxy group, carboxyl group) and the like.

In addition, as a polymer synthesis method, a polymer having a hydroxyl group in a side chain and a compound having an isocyanate group and a polymerizable group are used, and the urethane group in L ¹ is added to the hydroxyl group by adding the isocyanate group. Is preferably formed.

In addition, as a polymer synthesis method, a polymer having a carboxyl group in a side chain and a compound having a benzyl halide group and a polymerizable group are used, and the benzyl halide group is added to the carboxyl group to thereby add L ¹ It is also preferred to form a methylene group therein.

<Solvent>
The inkjet ink of the present invention contains solvents (liquids) that satisfy the average boiling point represented by the following formula (A).

  The solvent can dissolve or disperse the above-described polymer. In the present invention, when the solvent used has a predetermined boiling point, it is possible to obtain an ink that exhibits excellent continuous ejection stability and excellent formability of the polymer layer.

Represents in the formula (A), the mass ratio i th solvent of the solvent total amount in the W _i inkjet ink (i-th solvent mass / total solvent weight) (mass fraction). T _bi represents the boiling point (° C.) (under 1 atm) of the i-th solvent in the inkjet ink. i represents an integer of 1 to n.

  n represents the number of solvents contained in the ink-jet ink. Specifically, n represents an integer of 1 or more. For example, n = 2 when two types of solvents are used, and n = 3 when three types of solvents are used. The upper limit of n is not particularly limited, but is preferably 5 or less and more preferably 3 or less from the viewpoint of cost. In the above formula (A), Σ represents the total.

  In the above formula (A), the value obtained by multiplying the boiling point of each solvent by the mass fraction of the solvent in all the solvents is obtained, and the sum is obtained by adding them. The degree of volatilization of the solvent in the ink jet can be estimated from the obtained value.

More specifically, when only one kind of solvent is used, n = 1, and the boiling point value of the solvent used corresponds to T _(b) .

When two types of solvents are used in combination (boiling point of solvent X: T _X , boiling point of solvent Y: T _Y ), T
(B) is represented by the following formula: T _(b) = {T _X × (mass of solvent X / total solvent mass)} + {T _Y × (mass of solvent Y / total solvent mass)}
It can be obtained more. Further, when three types of solvents are used in combination (boiling point of solvent X: T _X , boiling point of solvent Y: T _Y , boiling point of solvent Z: T _Z ), T _(b) is expressed by the following formula T _(b) = { T _X × (mass of solvent X / total mass of solvent)} + {T _Y × (mass of solvent Y / total mass of solvent)} + {T _Z × (mass of solvent Z / total mass of solvent)}
It can be obtained more.

  The solvent used may be a non-polymerizable solvent (non-polymerizable liquid) or a polymerizable solvent (polymerizable liquid) containing a polymerizable group. The polymerizable solvent means a liquid monomer having a polymerizable group. The polymerizable solvent is not particularly limited as long as it has a dischargeable viscosity. From the viewpoint of solubility, a polymerizable solvent having a molecular weight of 300 or less and a polymerizable functional group number of 2 or less is particularly preferable.

  More specifically, examples of the solvent used include aldehyde solvents (for example, 2-alaldehyde, benzaldehyde, etc.), ether solvents (for example, ethylene glycol dimethyl ether, propyl ether, 1,4-dioxane, propylene glycol). Monomethyl ether, butyl ether, ethylene glycol monomethyl ethyl acetate, dipropylene glycol dimethyl ether, dipropylene glycol monomethyl ether acetate, diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, ethylene glycol monohexyl ether, triethylene glycol monomethyl ether, tetraethylene glycol dimethyl ether, etc. ), Amide solvents (for example, N, N-dimethylformamide) N, N-dimethylacetamide, N-methylformamide, N-methylacetamide, 1-methyl-2-pyrrolidone, etc.), amine solvents (for example, triethylamine, pyridine, etc.), aliphatic hydrocarbon solvents (for example, cyclohexane) , Heptane, etc.), aromatic hydrocarbon solvents (eg, benzene, toluene, xylene, aniline, cresol, tetralin), alcohol solvents (eg, ethanol, butanol, hexanol, methylcyclohexanol, glycerol, 2-ethyl-1) -Hexanol, benzyl alcohol, decanol, etc.), ester solvents (eg, ethyl acetate, propyl acetate, diethyl carbonate, ethyl lactate, 2-ethoxyethyl acetate, ethyl benzoate, propylene carbonate) Bonate, triacetin, etc.), ketone solvents (eg, 2-butanone, cyclohexanone, acetophenone, etc.), nitrile solvents (eg, acetonitrile, cyanoethyl acrylate, etc.), halogen solvents (eg, trichloromethane, tetrachloromethane), Examples thereof include a sulfur-based solvent (for example, dimethyl sulfoxide), an organic acid (for example, acetic acid), and the like.

  Above all, from the viewpoint of solubility, inkjet head attack, and material selectivity, alcohol solvents, ester solvents, ether solvents (especially, (oligo) ethylene glycol derivatives, (oligo) propylene glycol derivatives), polymerizable solvents Etc. are preferable.

  The solvent applied to the catalyst-supporting polymer solution for plating shown in this example is used as a mixed solvent of two or more kinds having different boiling points in the above.

  When two or more kinds of solvents A (or solvents B) having different boiling points are used, a value obtained by multiplying the mass fraction of each solvent A with respect to the total amount of solvent A by the boiling point of each solvent A was added. The value is the boiling point of solvent A. The same applies to the solvent B. More specifically, the boiling point of each solvent is a boiling point represented by the following formula (B) or the following formula (C), respectively.

In the formula (B), W _Ai represents a mass ratio (i-th solvent A mass / total solvent A mass) (mass fraction) to the total amount of the solvent A of the i-th solvent A in the inkjet ink.

T _Abi represents the boiling point (° C.) (under 1 atm) of the i-th solvent A in the inkjet ink. i represents an integer of from 1 _{n A.}

n _A represents the number of solvents A contained in the ink-jet ink. Specifically, n _A represents an integer of 1 or more. For example, when two types of solvent A are used, nA = 2, and when three types of solvent A are used, n _A = 3. Although the upper limit of n _A is not particularly limited, from the viewpoint of cost, preferably 5 or less, 3 or less is more preferable. In formula (B), Σ represents the total.

In the formula (C), W _Bi represents a mass ratio (i-th solvent B mass / total solvent B mass) (mass fraction) to the total amount of the solvent B of the i-th solvent B in the inkjet ink.

T _Bbi represents the boiling point (° C.) (under 1 atm) of the i-th solvent B in the inkjet ink. i represents an integer from 1 to _{n B.}

n _B represents the number of the solvent B contained in the inkjet ink. Specifically, n _B represents an integer of 1 or more. The upper limit of nB is not particularly limited, but is preferably 5 or less and more preferably 3 or less from the viewpoint of cost and the like.

  In this preferred embodiment, the solvent A is contained in a larger amount than the solvent B on a mass basis in the inkjet. In other words, the mass ratio between the solvent A and the solvent B in the inkjet ink (the mass of the solvent A / the mass of the solvent B) is a numerical value exceeding 1.

  The mass ratio is more preferably 2 or more from the viewpoint of both continuous discharge stability and the surface state of the polymer film during drawing. As an upper limit, 20 or less is usually preferable and 10 or less is more preferable.

  A preferable embodiment of the solvent B includes a polymerizable solvent (polymerizable liquid) from the viewpoint of improving the surface state of the polymer film at the time of drawing. As the polymerizable solvent, a solvent having a relatively low molecular weight and a high solubility in the polymer component, preferably a molecular weight of 300 or less and a bifunctional or less, is preferable, and further, a non-dissociative function that forms an interaction with the plating catalyst or its precursor. It preferably has a group (W group in formula (1)).

  Specifically, imide group, pyridine group, tertiary amino group, ammonium group, pyrrolidone group, amidino group, triazine ring, triazole ring, benzotriazole group, benzimidazole group, quinoline group, pyrimidine group, pyrazine group, nazoline Group, quinoxaline group, purine group, triazine group, piperidine group, piperazine group, pyrrolidine group, pyrazole group, aniline group, group containing alkylamine group structure, group containing isocyanuric structure, nitro group, nitroso group, azo group, diazo Group, azide group, cyano group, nitrogen-containing functional group such as cyanate group (R—O—CN), ether group, carbonyl group, ester group, group containing N-oxide structure, group containing S-oxide structure, N A group containing a hydroxy structure, a phenolic hydroxyl group, or a (meth) acrylate containing a hydroxyl group (Meth) acrylamide is preferable.

<Correspondence to inkjet system>
The catalyst-supporting polymer liquid for plating applied to the present invention contains the polymer and the solvent. The content of the polymer in the inkjet ink is not particularly limited, but is preferably 1% by mass or more and 20% by mass or less, more preferably 4% by mass or more and 15% by mass or less with respect to the total amount of the ink in terms of excellent continuous discharge stability. preferable.

  The content of the solvent in the inkjet ink is not particularly limited, but is preferably 80% by mass or more and 99% by mass or less, and more preferably 85% by mass or more and 96% by mass or less with respect to the total amount of the ink in terms of excellent continuous discharge stability. More preferred.

<Optional component>
The catalyst-supporting polymer liquid for plating applied to the present invention may contain a surfactant, a radical generator and the like as long as the effects of the present invention are not impaired.

<Surfactant>
The catalyst-supporting polymer liquid for plating applied to the present invention may further contain a surfactant. When a surfactant is included, it is preferable in terms of inkjet discharge stability and leveling properties upon landing.

  Examples of the surfactant include a nonionic surfactant, an amphoteric surfactant, an anionic surfactant having an ammonium ion as a counter ion, and a cationic surfactant having an organic acid anion as a counter ion. Examples of nonionic surfactants include polyethylene glycol derivatives and polypropylene glycol derivatives. Examples of amphoteric surfactants include long-chain alkyl betaines. Examples of the anionic surfactant having an ammonium ion as a counter ion include, for example, a long-chain alkyl sulfate ammonium salt, an alkyl aryl sulfate ammonium salt, an alkyl aryl sulfonate ammonium salt, an alkyl phosphate ammonium salt, and an ammonium salt of a polycarboxylic acid polymer. Etc.

  The content of the surfactant in the catalyst-supporting polymer liquid for plating is not particularly limited, but is preferably 5% by mass or less, more preferably 0.01% by mass or more and 2% by mass or less with respect to the total amount of the ink. If it is in the said range, it is preferable at the point which can obtain preferable surface tension, without impairing the other physical property of an ink.

<Radical generator>
The catalyst-supporting polymer solution for plating applied to the present invention may contain a radical generator (polymerization initiator) for the purpose of promoting the reaction of the polymerizable group in the polymer. The radical generator can be selected according to the type of polymer, and examples thereof include a photo radical generator and a thermal radical generator.

  Among these, at least one selected from the group consisting of oxime esters, acylphosphine oxides, α-hydroxyalkyl ketones, lophine dimers, and trihalomethyltriazines is preferable.

  The content of the radical generator is preferably 0.1% by mass or more and 5% by mass or less, and more preferably 0.5% by mass or more and 3% by mass or less with respect to the total amount of the ink. When the content is in the above-described range, a better sensitivity and a strong cured portion can be formed.

[Method for producing inkjet ink]
A known inkjet ink production method can be applied to the production of the catalyst-supporting polymer liquid for plating applied to the present invention. For example, after dissolving the polymer in a solvent, each component (for example, a surfactant and a radical generator) necessary for the inkjet ink can be dissolved to prepare the inkjet ink.

<Physical properties of inkjet ink>
The physical property value of the ink-jet ink of the present invention is not particularly limited as long as it can be ejected by the ink-jet head, but the ink viscosity is 20 millipascal seconds or less at the temperature in the head at the time of ejection from the viewpoint of stable ejection. Preferably, it is 2 millipascal seconds or more and 15 millipascal seconds or less. Further, when ejected by the apparatus, the temperature of the ink-jet ink is preferably maintained at a substantially constant temperature in the range of 20 ° C. or more and 80 ° C. or less, and the viscosity is more preferably 20 millipascal seconds in the temperature range. . When the temperature of the apparatus is set to a high temperature, the viscosity of the ink decreases, and it becomes possible to eject higher viscosity ink. However, since the temperature is increased, the ink is denatured by heat and a thermal polymerization reaction occurs in the head, or the solvent is evaporated on the surface of the nozzle that ejects the ink, so that nozzle clogging is likely to occur. It is preferable that it is below ℃. The viscosity is a value measured by using a commonly used E-type viscometer (for example, an E-type viscometer (RE-80L) manufactured by Toki Sangyo Co., Ltd.).

Further, the surface tension (static surface tension) at 25 ° C. of the ink-jet ink is 20 millinewtons per meter or more and 40 millinewtons per meter in terms of improvement in wettability with respect to a non-permeable substrate and ejection stability. Preferably, it is more preferably 20 millinewtons per meter or more and 35 millinewtons per meter or less.

  The above-mentioned surface tension is measured by a Wilhelmy method using a commonly used surface tension meter (for example, Kyowa Interface Science Co., Ltd., surface tension meter FACE SURFACE TENSIOMETER CBVB-A3), 60% liquid temperature. It is a value measured by RH.

  The plating catalyst-carrying polymer (plating catalyst-carrying polymer solution) described above does not limit the scope of application of the present invention, and can be changed as appropriate within the range in which the effects of the present invention can be obtained.

  In this example, a method and an apparatus for drawing a wiring pattern on a substrate have been illustrated. However, the present invention can be applied to a form in which a pattern is formed on a resin-made housing and the production of a thin panel such as an organic EL panel. Thus, the same effect can be obtained.

  As described above, the functional liquid pattern forming method, the conductive pattern forming method and the system according to the present invention have been described in detail, but the present invention is not limited to the above examples, and within the scope not departing from the gist of the present invention. Various improvements and modifications may be made.

[Appendix]
As will be understood from the description of the embodiment described in detail above, the present specification includes disclosure of various technical ideas including the invention described below.

(Invention 1): A functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the liquid droplet of the functional liquid is regarded as a spherical shape, the interval W between the dots of the functional liquid formed on the substrate, and the diameter of the dots of the functional liquid formed on the substrate D ₂ is a functional liquid discharge step for discharging onto the substrate by an ink jet method based on discharge conditions satisfying the relationship of the following formula D ₁ <W <D ₂ , and the functional liquid in the functional liquid discharge step And a heating step of heating the substrate between the start of discharge and the end of discharge.

According to the present invention, when forming a pattern with a liquid containing a catalyst-supporting polymer compound for plating, a diameter D ₁ when a droplet of a functional liquid in flight is regarded as a spherical shape, dot spacing W of the functional liquid to be formed, the diameter D ₂ of the dots of the functional liquid that is formed on said substrate, D 1 _<W <by satisfying the relation of D _2, such as bulges and jaggies Occurrence can be prevented.

  Moreover, by including a low boiling point solvent in the functional liquid, evaporation of the solvent of the functional liquid droplets (dots) on the substrate is promoted, and the spread of the pattern is suppressed.

  Furthermore, while the functional liquid is discharged, the wetting and spreading of the functional liquid is suppressed by heating the base material.

  Furthermore, by including a high boiling point solvent in the functional liquid, preferable liquid discharge by the ink jet method is realized.

  (Invention 2): The method for forming a functional liquid pattern according to Invention 1, wherein the molecular weight of the polymer compound is 50000 or less.

  According to this aspect, good ejection performance by the ink jet method is maintained.

  From the viewpoint of ink jet ejection stability, an embodiment in which the molecular weight of the polymer compound is 20000 or less is more preferable. The mass ratio of the polymer compound in the functional liquid is preferably 5% by mass or less.

(Invention 3): invention in the functional liquid pattern forming method as described in 1 or 2, wherein the functional liquid discharging step, the interval W of the dot of the functional liquid, the diameter D ₂ of the dots of the functional liquid, based on the ejection conditions satisfying the following relationship W ≦ D _2/2, characterized in that discharging the functional liquid.

  According to this aspect, a fine pattern having a uniform pattern width can be formed.

  (Invention 4): In the functional liquid pattern forming method according to any one of Inventions 1 to 3, the heating step heats the base material so that a surface temperature of the base material is 45 ° C. or higher. It is characterized by that.

  According to such an embodiment, wetting and spreading of the functional liquid on the substrate can be prevented, and a preferable fine pattern can be formed.

  In such an embodiment, an embodiment in which the surface temperature of the substrate is 60 ° C. or higher is preferable.

  (Invention 5): The method for forming a functional liquid pattern according to any one of Inventions 1 to 4, further comprising an adhesion auxiliary layer forming step of forming an adhesion auxiliary layer on the substrate, wherein the functional liquid ejection step is an adhesion The functional liquid is discharged onto a base material on which an auxiliary layer is formed.

  According to this aspect, adhesion between the catalyst-supporting polymer compound for plating and the substrate is ensured.

(Invention 6): In the functional liquid pattern forming method according to any one of Inventions 1 to 5, the functional liquid discharge step includes stacking two or more layers of the functional liquid pattern, and the second and subsequent layers. In the pattern formation, the functional liquid droplet diameter D ₁ , the functional liquid dot interval W, and the functional liquid dot diameter D ₂ satisfy the following relationship: D ₁ <W <D ₂ The functional liquid is ejected based on a satisfying ejection condition.

  According to such an embodiment, a preferable fine laminated pattern can be formed without causing the pattern after the second layer to protrude from the lower layer pattern, and without generating bulges or jaggies in the pattern after the second layer.

In such embodiments, it is preferable to eject the functional liquid on the basis of the ejection conditions satisfying the relationship of W ≦ D _2/2.

  (Invention 7): In the functional liquid pattern formation method according to Invention 6, the functional liquid discharge step is characterized in that the pattern formation of the second and subsequent layers is based on the same discharge conditions as the pattern formation of the first layer. To do.

  According to this aspect, the discharge conditions are optimized by sharing the discharge conditions for forming the first layer pattern and the discharge conditions for forming the second and subsequent patterns.

(Invention 8): Function of containing a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the functional liquid droplet during flight is regarded as a spherical shape, the interval W between the dots of the functional liquid formed on the substrate, and the function formed on the substrate the diameter D ₂ of the sexual liquid dots, based on the ejection conditions satisfying the following relationship D _{1 <W} <D _2, and functional liquid ejection step of ejecting on said substrate by an inkjet method, the functional liquid discharge A heating step of heating the base material from the start to the end of discharge of the functional liquid in the step, and a plating catalyst applying step of applying a plating catalyst or a plating catalyst precursor to the formed functional liquid pattern The conductive pattern forming method, which comprises a, a plating treatment step of the plating process is performed to pattern the plating catalyst or the plating catalyst precursor functional liquid granted.

  According to the present invention, it is possible to form a fine conductive pattern in which adhesion with a substrate is ensured.

(Invention 9): In the conductive pattern formation method according to Invention 8, in the functional liquid ejection step, the functional liquid pattern is laminated in two or more layers, and the pattern is formed in the second and subsequent layers. Based on the ejection conditions where the diameter D _{1 of} the functional liquid droplet, the interval W between the dots of the functional liquid, and the diameter D ₂ of the functional liquid dots satisfy the relationship of the following formula D ₁ <W <D ₂ , The functional liquid is ejected.

  According to such an aspect, a preferable conductive pattern in which the influence of the surface roughness of the base material is eliminated can be formed by sufficiently increasing the thickness of the functional liquid pattern.

(Invention 10): A function comprising a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. An inkjet head that discharges the functional liquid onto the substrate, a diameter D ₁ when a droplet of the functional liquid in flight is regarded as a spherical shape, an interval W between the dots of the functional liquid formed on the substrate, the diameter D ₂ of the dots of the functional liquid that is formed on said substrate, and a discharge control means based on the ejection conditions satisfying the following relationship D _{1 <W} <D _2, controls the discharge of the ink jet head, A functional liquid pattern forming system comprising: a heating step of heating the base material from the start of discharge of functional liquid to the end of discharge in the functional liquid discharge step.

  An inkjet head according to the present invention includes a nozzle that discharges a functional liquid, a liquid chamber that communicates with the nozzle and stores the functional liquid discharged from the nozzle, and a pressurizing unit that pressurizes the functional liquid in the liquid chamber There is an aspect provided with.

(Invention 11): In the functional liquid pattern formation system according to Invention 10, the ejection control unit stacks two or more layers of the functional liquid pattern, and the functionalities in pattern formation in the second and subsequent layers. The diameter D ₁ of the liquid droplet, the interval W between the functional liquid dots, and the diameter D ₂ of the functional liquid dots are based on ejection conditions satisfying the relationship of the following formula D ₁ <W <D ₂ , The functional liquid pattern forming system according to claim 9, wherein ejection of the inkjet head is controlled.

  In this aspect, an aspect in which the discharge conditions for forming the first layer pattern and the discharge conditions for forming the second layer pattern are made common.

(Invention 12): A function comprising a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. An inkjet head that discharges the functional liquid onto the substrate, a diameter D ₁ when a droplet of the functional liquid in flight is regarded as a spherical shape, an interval W between the dots of the functional liquid formed on the substrate, the diameter D ₂ of the dots of the functional liquid that is formed on said substrate, and a discharge control means based on the ejection conditions satisfying the following relationship D _{1 <W} <D _2, controls the discharge of the ink jet head, A heating step of heating the base material from the start of discharge of functional liquid to the end of discharge in the functional liquid discharge step, and a plating catalyst or a plating catalyst precursor on the formed functional liquid pattern A conductive pattern forming system comprising: a plating catalyst applying means for applying a plating process; and a plating processing means for performing a plating process on a functional liquid pattern to which the plating catalyst or the plating catalyst precursor is applied. .

(Invention 13): In the conductive pattern formation system according to Invention 12, the ejection control unit stacks two or more layers of the functional liquid pattern, and the functional liquid is formed in pattern formation of the second and subsequent layers. The droplet diameter D ₁ , the functional liquid dot interval W, and the functional liquid dot diameter D ₂ satisfy the following relationship: D ₁ <W <D _2. The ejection of the head is controlled.

(Invention 14): In flight, a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the liquid droplet of the functional liquid is regarded as a spherical shape, the interval W between the dots of the functional liquid formed on the substrate, and the diameter of the dots of the functional liquid formed on the substrate D ₂ is a functional liquid discharge step for discharging onto the substrate by an ink jet method based on discharge conditions satisfying the relationship of the following formula D ₁ <W <D ₂ , and the functional liquid in the functional liquid discharge step And a heating step of heating the base material from the start of discharge to the end of discharge.

(Invention 15): In flight, a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the liquid droplet of the functional liquid is regarded as a spherical shape, the interval W between the dots of the functional liquid formed on the substrate, and the diameter of the dots of the functional liquid formed on the substrate D ₂ is a functional liquid discharge step for discharging onto the substrate by an ink jet method based on discharge conditions satisfying the relationship of the following formula D ₁ <W <D ₂ , and the functional liquid in the functional liquid discharge step A heating step for heating the base material from the start of discharge to the end of discharge, a plating catalyst applying step for applying a plating catalyst or a plating catalyst precursor to the pattern of the formed functional liquid, and the plating catalyst Conductive pattern structure manufacturing method characterized by comprising: a plating treatment step of performing a plating process on the pattern of the functional liquid that the plating catalyst precursor has been applied it is.

  DESCRIPTION OF SYMBOLS 10 ... Pattern formation system, 12 ... Base material, 14 ... Platen, 16 ... Discharge droplet, 18 ... Inkjet head, 20 ... Adhesion auxiliary layer, 22 ... Heater, 24 ... Temperature sensor, 26 ... Dot, 30 ... System control part , 36 ... heater control unit, 38 ... discharge control unit

Claims (15)

A functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the droplet is regarded as a spherical shape, the interval W between the dots of the functional liquid formed on the substrate, and the diameter D ₂ of the dots of the functional liquid formed on the substrate are as follows: Formula D ₁ <W <D ₂
Based on the discharge conditions satisfying the relationship, a functional liquid discharge step of discharging onto the substrate by an inkjet method,
A heating step of heating the base material from the start of discharge of the functional liquid to the end of discharge in the functional liquid discharge step,
A functional liquid pattern forming method comprising:   The method for forming a functional liquid pattern according to claim 1, wherein the polymer compound has a molecular weight of 50,000 or less. The functional liquid discharging step, the interval W of the dot of the functional liquid, the diameter D ₂ of the dots of the functional liquid, the following equation W ≦ D _2/2
The functional liquid pattern forming method according to claim 1, wherein the functional liquid is ejected based on ejection conditions that satisfy the relationship.   4. The functional liquid pattern forming method according to claim 1, wherein the heating step heats the base material so that a surface temperature of the base material is 45 ° C. or higher. 5. Including an adhesion auxiliary layer forming step of forming an adhesion auxiliary layer on the substrate;
5. The functional liquid pattern forming method according to claim 1, wherein in the functional liquid discharging step, the functional liquid is discharged onto a base material on which an adhesion auxiliary layer is formed. In the functional liquid ejection step, two or more layers of the functional liquid pattern are stacked, and in the pattern formation of the second and subsequent layers, the diameter D ₁ of the functional liquid droplet, the dot of the functional liquid The interval W and the diameter D ₂ of the functional liquid dot are expressed by the following formula: D ₁ <W <D ₂
6. The functional liquid pattern forming method according to claim 1, wherein the functional liquid is ejected based on ejection conditions satisfying the above relationship.   The functional liquid pattern forming method according to claim 6, wherein in the functional liquid discharging step, pattern formation in the second layer and thereafter is based on the same discharge conditions as pattern formation in the first layer. A functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the droplet is regarded as a spherical shape, the interval W between the dots of the functional liquid formed on the substrate, and the diameter D ₂ of the dots of the functional liquid formed on the substrate are as follows: Formula D ₁ <W <D ₂
Based on the discharge conditions satisfying the relationship, a functional liquid discharge step of discharging onto the substrate by an inkjet method,
A heating step of heating the base material from the start of discharge of the functional liquid to the end of discharge in the functional liquid discharge step,
A plating catalyst application step of applying a plating catalyst or a plating catalyst precursor to the formed functional liquid pattern;
A plating treatment step of performing a plating treatment on the functional liquid pattern provided with the plating catalyst or the plating catalyst precursor;
The conductive pattern formation method characterized by including. In the functional liquid ejection step, two or more layers of the functional liquid pattern are stacked, and in the pattern formation of the second and subsequent layers, the diameter D ₁ of the functional liquid droplet, the dot of the functional liquid The interval W and the diameter D ₂ of the functional liquid dot are expressed by the following formula: D ₁ <W <D ₂
The conductive pattern forming method according to claim 8, wherein the functional liquid is ejected based on ejection conditions satisfying the above relationship. Inkjet head for discharging a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. onto a substrate When,
Diameter D ₁ when droplets of functional liquid in flight are regarded as spherical, distance W between functional liquid dots formed on the substrate, functional liquid dots formed on the substrate diameter _{D 2} is the formula D ₁ <W _{<D 2}
Discharge control means for controlling the discharge of the inkjet head based on discharge conditions satisfying the relationship:
A heating step of heating the base material from the start of discharge of the functional liquid to the end of discharge in the functional liquid discharge step,
A functional liquid pattern forming system comprising: The ejection control means stacks two or more layers of the functional liquid pattern, and in the pattern formation of the second and subsequent layers, the functional liquid droplet diameter D ₁ , the functional liquid dot interval W , The diameter D ₂ of the functional liquid dot is expressed by the following formula: D ₁ <W <D ₂
The functional liquid pattern forming system according to claim 10, wherein ejection of the inkjet head is controlled based on ejection conditions satisfying the relationship: Inkjet head for discharging a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. onto a substrate When,
Diameter D ₁ when droplets of functional liquid in flight are regarded as spherical, distance W between functional liquid dots formed on the substrate, functional liquid dots formed on the substrate diameter _{D 2} is the formula D ₁ <W _{<D 2}
Discharge control means for controlling the discharge of the inkjet head based on discharge conditions satisfying the relationship:
A heating step of heating the base material from the start of discharge of the functional liquid to the end of discharge in the functional liquid discharge step,
A plating catalyst applying means for applying a plating catalyst or a plating catalyst precursor to the formed functional liquid pattern;
A plating treatment means for performing a plating treatment on the pattern of the functional liquid provided with the plating catalyst or the plating catalyst precursor;
A conductive pattern forming system comprising: The ejection control means stacks two or more layers of the functional liquid pattern, and in the pattern formation of the second and subsequent layers, the functional liquid droplet diameter D ₁ , the functional liquid dot interval W , The diameter D ₂ of the functional liquid dot is expressed by the following formula: D ₁ <W <D ₂
The conductive pattern forming system according to claim 12, wherein the ejection of the inkjet head is controlled based on ejection conditions satisfying the above relationship. Flying a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a functional liquid containing a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the liquid droplet of the functional liquid is regarded as a sphere, the interval W between the dots of the functional liquid formed on the base material, the dots of the functional liquid dots formed on the base material diameter _{D 2,} the following formula _{D 1} <W <D ₂
Based on the discharge conditions satisfying the relationship, a functional liquid discharge step of discharging onto the substrate by an inkjet method,
A heating step of heating the base material from the start of discharge of the functional liquid to the end of discharge in the functional liquid discharge step,
A method for producing a functional liquid pattern structure, comprising: Flying a functional liquid containing a catalyst-supporting polymer compound for plating, a high-boiling solvent having a boiling point of 190 ° C. or higher and lower than 240 ° C., and a functional liquid containing a low-boiling solvent having a boiling point of 75 ° C. or higher and lower than 105 ° C. The diameter D ₁ when the liquid droplet of the functional liquid is regarded as a sphere, the interval W between the dots of the functional liquid formed on the base material, the dots of the functional liquid dots formed on the base material diameter _{D 2,} the following formula _{D 1} <W <D ₂
Based on the discharge conditions satisfying the relationship, a functional liquid discharge step of discharging onto the substrate by an inkjet method,
A heating step of heating the base material from the start of discharge of the functional liquid to the end of discharge in the functional liquid discharge step,
A plating catalyst application step of applying a plating catalyst or a plating catalyst precursor to the formed functional liquid pattern;
A plating treatment step of performing a plating treatment on the functional liquid pattern provided with the plating catalyst or the plating catalyst precursor;
A process for producing a conductive pattern structure, comprising: