JP2013006353A - Method of manufacturing molding material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a molding material comprising a reinforced fiber base material and a polyphenylene ether etherketone more easily and with higher productivity.SOLUTION: The manufacturing method of the molding material has: step (I) to draw out and continuously supply a reinforced fiber base material (A); step (II) to obtain a composite by compounding the component (A) with the polyphenylene ether etherketone oligomer (B); step (III) to polymerize the component (B) to the polyphenylene ether etherketone (B'); and step (IV) to cool and take off the composite comprising the component (A) and the component (B'). This is the manufacturing method of molding material whose melting point of the component (B) is 270°C or less.

Description

  The present invention relates to a method for producing a molding material. More specifically, the present invention relates to a method capable of producing a molding material using polyphenylene ether ether ketone as a matrix resin with good economic efficiency and productivity.

  A fiber reinforced composite material composed of a continuous reinforcing fiber substrate and a matrix resin is lightweight and has excellent mechanical properties, and is widely used for sports equipment applications, aerospace applications, general industrial applications, and the like. In particular, a composite material (CFRP) using carbon fiber as a reinforcing fiber has a specific strength and specific rigidity that exceed those of a metal material, and the amount of use is increasing mainly in aerospace applications. In the past, thermosetting resins have been used favorably as matrix resins because of their good impregnation into reinforcing fiber substrates. Thermoplastic resins are high molecular weight products, have a higher viscosity than thermosetting resins, and require higher process temperatures, making them unsuitable for producing molding materials easily and with high productivity. there were.

  However, in recent years, thermoplastic resins have been used because of the fact that they can be molded in a short period of time, the molded products obtained can be recycled, and that they have excellent post-processing properties such as thermal bonding and thermal correction. Composite materials with a matrix resin have come into the limelight.

In Patent Document 1, a crystalline thermoplastic resin film is disposed on both sides of a sheet-like substrate made of continuous reinforcing fibers, and the temperature is 150 ° C. higher than the melting point of the resin, and 5 to 30 kg / cm ^2. A method has been proposed in which a reinforcing fiber bundle is impregnated with a thermoplastic resin by pressurizing at a pressure of (about 0.5 to 3 MPa). However, this method requires severe temperatures for impregnation of the thermoplastic resin, which causes thermal decomposition of the resin and cannot sufficiently improve the properties of the molded product, and economically produces molding materials. It was difficult to manufacture with good quality.

  Patent Document 2 discloses a method for producing a molding material in which a continuous reinforcing fiber bundle is impregnated with a low molecular weight thermoplastic resin and then integrated with a high molecular weight thermoplastic resin in order to easily impregnate the thermoplastic resin. Has been proposed. This method is an excellent method for obtaining a molded article having excellent molding material productivity and high mechanical properties. However, there is a problem that a low molecular weight thermoplastic resin remains in the molding material.

  Patent Document 3 discloses a fiber reinforcement in which a low molecular weight cyclic polyarylene sulfide is combined with a continuous reinforcing fiber bundle, and further heated at 200 to 450 ° C. to polymerize the cyclic polyarylene sulfide into a high molecular weight polyarylene sulfide. A method for producing a molded substrate is disclosed. This method is an excellent production method capable of easily and easily producing a molding material comprising a continuous reinforcing fiber bundle and a high molecular weight polyarylene sulfide. However, diversifying needs for fiber reinforced composite materials using thermoplastic resins, there is a need for molding materials using high heat resistant thermoplastic resins such as polyether ether ketone in addition to polyarylene sulfide. It has become.

  Patent Document 4 discloses a cyclic poly (aryl ether) oligomer, a production method thereof, and a polymerization method of the cyclic poly (aryl ether) oligomer. Here, a method for producing a poly (aryl ether) by polymerizing a cyclic poly (aryl ether) oligomer is described. However, the cyclic poly (aryl ether) oligomer disclosed by this method has a melting point of 340 ° C. or higher, and development of a cyclic poly (aryl ether) oligomer having a lower melting point is possible from the viewpoint of economy and productivity. It has become necessary.

JP-A-8-118489 Japanese Patent Laid-Open No. 10-138379 JP 2008-231289 A Japanese Patent Laid-Open No. 3-88828

  An object of the present invention is to provide an improved process for producing a molding material comprising a reinforcing fiber substrate and polyphenylene ether ether ketone more easily and with high productivity.

The present invention for solving such problems has the following configuration. That is,
(1) Step (I) for drawing out the reinforcing fiber substrate (A) and continuously supplying it, Step (II) for obtaining a composite by combining the component (A) with polyphenylene ether ether ketone oligomer (B), A step (III) of polymerizing the component (B) to a polyphenylene ether ether ketone (B ′), and a step (IV) of cooling and taking up the composite comprising the component (A) and the component (B ′). A method for producing a molding material, wherein the melting point of the component (B) is 270 ° C. or lower.
(2) The method for producing a molding material according to (1), wherein the component (B) contains 60% by weight or more of cyclic polyphenylene ether ether ketone.
(3) The method for producing a molding material according to any one of (1) and (2), wherein the component (B) is a mixture of cyclic polyphenylene ether ether ketones having different repeating numbers m.
(4) The method for producing a molding material according to any one of (1) to (3), wherein the polymerization catalyst (C) is further combined in the step (II).
(5) The method for producing a molding material according to (1) to (4), wherein the steps (I) to (IV) are performed online.
(6) The method for producing a molding material according to any one of (1) to (5), wherein in the step (II), the component (B) heated and melted is added to the component (A) to be combined. .
(7) In the step (II), the component (B) in at least one form selected from the group consisting of particles, fibers, and flakes is added to the component (A) to be compounded. (1) The manufacturing method of the molding material in any one of (5).
(8) In the step (II), the component (B) in at least one form selected from the group consisting of a film form, a sheet form, and a non-woven form is imparted to the component (A) to be compounded. (1) The manufacturing method of the molding material in any one of (5).
(9) The manufacturing method of the molding material in any one of (1)-(8) which superposes | polymerizes in the said process (III) at the temperature of 160 degreeC or more.
(10) The method for producing a molding material according to any one of (1) to (9), wherein the step (III) further includes a step of applying a pressure of 0.1 to 10 MPa.
(11) The manufacturing method of the molding material in any one of (1)-(10) whose take-up speed of the said process (IV) is 1-100 m / min.
(12) The content of the component (A) is 10% by weight or more when the total of the component (A) and the component (B) is 100% by weight. The manufacturing method of the molding material as described.
(13) The manufacturing method of the molding material as described in (4) whose content of the said component (C) is 0.001-20 mol% with respect to 1 mol of ether ether ketone structural units in the said component (B).
(14) The method for producing a molding material according to any one of (1) to (13), wherein the component (A) contains at least 10,000 single fibers of carbon fibers.
(15) The method for producing a molding material according to (4), wherein the component (C) is an alkali metal salt.

  According to the production method of the present invention, polyphenylene ether ether ketone can be easily combined with a reinforcing fiber substrate, so that it is possible to improve productivity such as increasing the take-up speed and suppressing process temperature. And is suitably used for the production of molding materials such as prepregs, semi-pregs and fabrics.

It is an example of the manufacturing apparatus used for the manufacturing method of the molding material which concerns on this invention. It is an example of the manufacturing apparatus used for the manufacturing method of the molding material which concerns on this invention. It is an example of the manufacturing apparatus used for the manufacturing method of the molding material which concerns on this invention.

  Hereinafter, the manufacturing method of the molding material of this invention is demonstrated concretely.

  In the method for producing a molding material of the present invention, a molding material is produced using a reinforcing fiber substrate (A) and a polyphenylene ether ether ketone oligomer (B) as raw materials and polyphenylene ether ether ketone (B ') as a matrix resin. At this time, it is preferable to accelerate the polymerization reaction to polyphenylene ether ether ketone (B ′) by adding a polymerization catalyst (C) to the polyphenylene ether ether ketone oligomer (B). First, each component will be described.

<Reinforcing fiber substrate (A)>
The reinforcing fiber substrate (A) used in the present invention is not particularly limited, but carbon fibers, glass fibers, aramid fibers, boron fibers, alumina fibers, mineral fibers, silicon carbide fibers, and the like can be used. Two or more types can be mixed.

  In particular, carbon fibers are preferable from the viewpoint of excellent specific strength and specific rigidity, and improving the mechanical properties of the molded product. Among these, from the viewpoint of obtaining a molded article having a light weight, high strength, and high elastic modulus, it is preferable to use carbon fibers, and it is particularly preferable to use carbon fibers having a tensile elastic modulus of 200 to 700 GPa. Furthermore, carbon fibers and reinforcing fibers coated with metal have high conductivity, and thus have the effect of improving the conductivity of the molded product. For example, for housing applications such as electronic devices that require electromagnetic shielding properties. Is particularly preferred.

  As a more preferred embodiment of the carbon fiber, the amount of surface functional groups (O / C), which is the ratio of the number of atoms of oxygen (O) and carbon (C) on the fiber surface measured by X-ray photoelectron spectroscopy, is 0. The range is from 0.05 to 0.4. The higher the O / C, the greater the functional group amount on the carbon fiber surface, and the higher the adhesiveness with the matrix resin. On the other hand, if O / C is too high, there is a concern about the destruction of the crystal structure on the surface of the carbon fiber. Within the preferable range of O / C, it is possible to obtain a molded product particularly excellent in the balance of mechanical properties.

The surface functional group amount (O / C) is determined by the following procedure by X-ray photoelectron spectroscopy. First, the carbon fibers from which the sizing agent and the like have been removed with a solvent are cut and spread and arranged on a copper sample support, and then the photoelectron escape angle is set to 90 °, MgK _α1,2 is used as the X-ray source, and the sample chamber Keep the inside at 1 × 10 ⁻⁸ Torr. As a correction of the peak accompanying charging during measurement, the kinetic energy value (KE) of the main peak of C1S is adjusted to 969 eV. The C1S peak area is the K.S. E. Is obtained by drawing a straight base line in the range of 958 to 972 eV. The O1S peak area E. It is obtained by drawing a straight base line in the range of 714 to 726 eV. Here, the surface functional group amount (O / C) is calculated as an atomic ratio from the ratio of the O1S peak area to the C1S peak area using a sensitivity correction value unique to the apparatus.

  The form and arrangement of the reinforcing fiber base (A) used in the present invention are not particularly limited. For example, a reinforcing fiber bundle obtained by converging continuous reinforcing fibers (hereinafter also simply referred to as a reinforcing fiber bundle), continuous A base material (hereinafter also simply referred to as a unidirectional base material), a woven fabric (cross), a non-woven fabric, a mat, a knitted fabric, a braid, a yarn, a tow, or the like is used. Among them, a reinforcing fiber bundle is preferable because it can be taken up continuously at a high speed, and it is preferable to use a unidirectionally arranged base material because it is possible to easily design strength characteristics by a laminated configuration. In addition, a woven fabric is preferable because it can be easily shaped, and a nonwoven fabric and a mat are preferably used because they can be easily formed in the thickness direction. Here, the unidirectional array base material is a base material in which a plurality of reinforcing fibers are arrayed in parallel. Such a unidirectional array base material can be obtained, for example, by a method of aligning a plurality of continuous reinforcing fiber bundles in one direction and further leveling it into a sheet.

  When the reinforcing fiber base (A) is a reinforcing fiber bundle, the greater the number of single fibers of the reinforcing fibers, the more advantageous the economy is, so 10,000 or more single fibers are preferable. On the other hand, the larger the number of single fibers of the reinforcing fiber, the more likely it is that the impregnation property of the matrix resin tends to be disadvantageous. More preferably, 10000 or more and 100,000 or less, more preferably 20,000 or more and 50,000 or less can be used.

  Furthermore, a sizing agent may be used separately from the component (B) in the present invention for the purpose of bundling single fibers into a reinforcing fiber bundle. This is because the sizing agent is attached to the reinforcing fiber bundle, and the handling property at the time of transferring the reinforcing fiber and the processability in the process of producing the molding material are improved, and within the range not impairing the object of the present invention. Sizing agents such as resins, urethane resins, acrylic resins and various thermoplastic resins can be used alone or in combination of two or more.

  When the reinforcing fiber substrate (A) is a unidirectional array substrate, a woven fabric, a nonwoven fabric, or a mat, the number of single fibers of the reinforcing fiber is not particularly limited.

  Furthermore, a binder may be used for the reinforcing fiber substrate (A) separately from the component (B) in the present invention for the purpose of suppressing the dropping of the single fibers. This is the purpose of improving the processability in the process of manufacturing a molding material, and the handling property at the time of the transfer of a reinforcing fiber base material (A) by making a binder adhere to a reinforcing fiber base material (A), One or more binders such as epoxy resin, urethane resin, acrylic resin and various thermoplastic resins can be used in combination as long as the object of the present invention is not impaired.

<Polyphenylene ether ether ketone oligomer (B)>
The polyphenylene ether ether ketone oligomer (B) in the present invention has a melting point of 270 ° C. or lower, preferably 250 ° C. or lower, more preferably 230 ° C. or lower, and further preferably 200 ° C. or lower. It is particularly preferable that the temperature is 180 ° C. or lower. As the melting point of the polyphenylene ether ether ketone oligomer (B) is lower, the processing temperature can be lowered, and the process temperature can be set lower, which is advantageous from the viewpoint that the energy required for processing can be reduced. In addition, since the process temperature can be set low, for example, in the step of melting and mixing the polymerization catalyst (C) and polyphenylene ether ether ketone oligomer (B) described later, the temperature of the melt kneading is set sufficiently lower than the polymerization temperature. become able to. Due to such effects, in the manufacturing process of the molding material, unfavorable reaction such that the polymerization of the polyphenylene ether ether ketone oligomer (B) proceeds during the storage or before the impregnation of the reinforcing fiber base (A) and the melt viscosity increases. Can be suppressed. Here, the melting point of the polyphenylene ether ether ketone oligomer (B) can be measured by observing the endothermic peak temperature using a differential scanning calorimeter.

  The polyphenylene ether ether ketone oligomer (B) in the present invention is preferably a polyphenylene ether ether ketone composition containing 60% by weight or more of cyclic polyphenylene ether ether ketone, and more preferably a composition containing 65% by weight or more. 70% by weight or more is more preferable, and a composition containing 75% by weight or more is even more preferable.

  The cyclic polyphenylene ether ether ketone in the present invention is a cyclic compound represented by the following general formula (I) having paraphenylene ketone and paraphenylene ether as repeating structural units.

  The range of the repeating number m in the formula (I) is 2 to 40, more preferably 2 to 20, further preferably 2 to 15, and 2 to 10 can be exemplified as a particularly preferable range. Since the melting point of the polyphenylene ether ether ketone oligomer (B) tends to increase as the number of repetitions m increases, the number of repetitions m is set in the above range from the viewpoint of melting the polyphenylene ether ether ketone oligomer (B) at a low temperature. It is preferable to do.

  The polyphenylene ether ether ketone oligomer (B) is preferably a mixture of cyclic polyphenylene ether ether ketones having different repeating numbers m, and is a cyclic polyphenylene ether ether ketone mixture comprising at least three different repeating numbers m. More preferably, it is more preferably a mixture composed of 4 or more repetitions m, and particularly preferably a mixture composed of 5 or more repetitions m. Furthermore, it is particularly preferable that these repeating numbers m are continuous. Compared to a single compound having a single repeating number m, the melting point of a mixture comprising a different repeating number m tends to be lower, and compared to a cyclic polyphenylene ether ether ketone mixture comprising two different repeating numbers m. In addition, the melting point of a mixture composed of three or more types of repeating number m tends to be further lowered, and the melting point of a mixture consisting of continuous repeating number m is lower than that of a mixture consisting of discontinuous repeating number m. There is a tendency. Here, cyclic polyphenylene ether ether ketone having each repeating number m can be analyzed by component separation by high performance liquid chromatography, and the composition of polyphenylene ether ether ketone oligomer (B), that is, polyphenylene ether ether ketone oligomer ( The weight fraction of the cyclic polyphenylene ether ether ketone having each repeating number m contained in B) can be calculated from the peak area ratio of each cyclic polyphenylene ether ether ketone in the high performance liquid chromatography.

  As an impurity component in the polyphenylene ether ether ketone oligomer (B), that is, a component other than the cyclic polyphenylene ether ether ketone, linear polyphenylene ether ether ketone can be mainly exemplified. Since this linear polyphenylene ether ether ketone has a high melting point, when the weight fraction of the linear polyphenylene ether ether ketone increases, the melting point of the polyphenylene ether ether ketone oligomer (B) tends to increase. Therefore, when the weight fraction of the cyclic polyphenylene ether ether ketone in the polyphenylene ether ether ketone oligomer (B) is in the above range, it tends to be a polyphenylene ether ether ketone oligomer (B) having a low melting point.

The reduced viscosity (η) of the polyphenylene ether ether ketone oligomer (B) in the present invention having the characteristics as described above can preferably be 0.1 dL / g or less, and is 0.09 dL / g or less. Is more preferable, and it is more preferable that it is 0.08 dL / g or less. Unless otherwise specified, the reduced viscosity in the present invention is obtained by subjecting a concentrated sulfuric acid solution having a concentration of 0.1 g / dL (weight of polyphenylene ether ether ketone oligomer (B) / 98% by weight concentrated sulfuric acid) to sulfonation. It is a value measured using an Ostwald viscometer at 25 ° C. immediately after completion of dissolution in order to minimize the influence. The reduced viscosity was calculated according to the following formula.
η = {(t / t0) −1} / C
(Here, t represents the number of seconds passing through the sample solution, t0 represents the number of seconds passing through the solvent (98 wt% concentrated sulfuric acid), and C represents the concentration of the solution.)

Examples of the method for obtaining the polyphenylene ether ether ketone oligomer (B) used in the present invention include the following methods (a) to (c).
(A) A production method by heating and reacting a mixture containing at least a dihalogenated aromatic ketone compound, a dihydroxy aromatic compound, a base, and an organic polar solvent.
(B) A production method by heating and reacting a mixture containing at least a linear polyphenylene ether ether ketone, a dihalogenated aromatic ketone compound, a dihydroxy aromatic compound, a base and an organic polar solvent.
(C) A production method by heating and reacting a mixture containing at least linear polyphenylene ether ether ketone, a basic compound, and an organic polar solvent.

  Typical reaction formulas of the production methods (a), (b) and (c) of the polyphenylene ether ether ketone oligomer (B) described above are shown below.

  In the polyphenylene ether ether ketone oligomer (B) in the present invention, various thermoplastic resins, oligomers, various thermosetting resins, elastomers, rubber components, and the like are included as long as the object of the present invention is not impaired. Improving agent, inorganic filler, flame retardant, conductivity imparting agent, crystal nucleating agent, ultraviolet absorber, antioxidant, vibration damping agent, antibacterial agent, insect repellent, deodorant, anti-coloring agent, heat stabilizer, mold release An agent, an antistatic agent, a plasticizer, a lubricant, a colorant, a pigment, a dye, a foaming agent, an antifoaming agent, or a coupling agent may be added.

  Specific examples of thermoplastic resins include polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin, polytrimethylene terephthalate (PTT) resin, polyethylene naphthalate (PENp) resin, polyester resins such as liquid crystal polyester, Polyolefin resin such as polyethylene (PE) resin, polypropylene (PP) resin, polybutylene resin, styrene resin, urethane resin, polyoxymethylene (POM) resin, polyamide (PA) resin, polycarbonate (PC) resin, Polymethyl methacrylate (PMMA) resin, polyvinyl chloride (PVC) resin, polyphenylene sulfide (PPS) resin, polyphenylene ether (PPE) resin, modified PPE resin, polyimide (PI) resin, polyamide resin (PAI) resin, polyetherimide (PEI) resin, polysulfone (PSU) resin, modified PSU resin, polyethersulfone (PES) resin, polyketone (PK) resin, polyetherketone (PEK) resin, polyetheretherketone (PEEK) resin, polyether ketone ketone (PEKK) resin, polyarylate (PAR) resin, polyether nitrile (PEN) resin, phenolic resin, phenoxy resin, fluorine resin such as polytetrafluoroethylene, Examples include coalesced polymers, modified products, and resins obtained by blending two or more types.

  Specific examples of the thermosetting resin include unsaturated polyester resin, vinyl ester resin, epoxy resin, phenol resin and the like.

  It is also preferable to add a tackifier to facilitate lamination of the molding material. As the tackifier, a compound having a softening point of 150 ° C. or lower and a polar group in the molecule is preferably used. The softening point means the Vicat softening point defined in JIS K7206-1999. The softening point of 150 ° C or lower has a relatively low molecular weight, so it has good fluidity and improves the adhesiveness when the molding materials are laminated. A substance having a polar group in the molecule is also preferable because it induces weak bonds such as hydrogen bonds and improves the adhesiveness when the molding material is laminated. Specifically, ethylene-ethyl acrylate copolymer, ethylene-vinyl acrylate copolymer, terpene polymer, terpene phenol copolymer, polyurethane elastomer, acrylonitrile butadiene rubber (NBR) and the like are preferably used.

<Polyphenylene ether ether ketone (B ')>
A polyphenylene ether ether ketone (B ′) is obtained by polymerizing the polyphenylene ether ether ketone oligomer (B) in the present invention. The polyphenylene ether ether ketone (B ′) here is a linear compound represented by the following general formula (II) having paraphenylene ketone and paraphenylene ether as repeating structural units.

  Although there is no restriction | limiting in particular in the reduced viscosity ((eta)) of the polyphenylene ether ether ketone (B ') in this invention, 0.1-2.5 dL / g as a preferable range, More preferably, 0.2-2.0 dL / g, More preferably, 0.3 to 1.8 dL / g can be exemplified. By adjusting to such a suitable viscosity range, a molded article having excellent mechanical properties can be obtained.

  The melting point of the polyphenylene ether ether ketone (B ′) in the present invention is the composition and molecular weight of the polyphenylene ether ether ketone oligomer (B), the weight fraction of the cyclic polyphenylene ether ether ketone contained in the polyphenylene ether ether ketone oligomer (B), Furthermore, since it changes with the environment at the time of a heating, it cannot show uniquely, However As a preferable range, 270-450 degreeC, More preferably, 280-400 degreeC, More preferably, 300-350 degreeC can be illustrated. By adjusting to such a suitable temperature range, a molded product having excellent moldability and heat resistance can be obtained. Here, the melting point of the polyphenylene ether ether ketone (B ′) is obtained by physically taking out the portion corresponding to the polyphenylene ether ether ketone (B ′) from the molding material of the present invention and using a differential scanning calorimeter from this sample. It can be measured by observing the endothermic peak temperature.

  The heating temperature when the polyphenylene ether ether ketone oligomer (B) is converted to polyphenylene ether ether ketone (B ′) by heat polymerization is preferably equal to or higher than the melting point of the polyphenylene ether ether ketone oligomer (B). If it is such temperature conditions, there will be no restriction | limiting in particular. When the heating temperature is lower than the melting point of the polyphenylene ether ether ketone oligomer (B), it takes a long time to obtain the polyphenylene ether ether ketone (B ′) by heat polymerization, or the polyphenylene ether ether ketone ( B ′) tends not to be obtained. As a minimum of heating temperature, 160 degreeC or more can be illustrated, Preferably it is 200 degreeC or more, More preferably, it is 230 degreeC or more, More preferably, it is 270 degreeC or more. Within this temperature range, the polyphenylene ether ether ketone oligomer (B) tends to melt and polyphenylene ether ether ketone (B ′) can be obtained in a short time.

  On the other hand, when the temperature of the heat polymerization is too high, between the polyphenylene ether ether ketone oligomers (B), between the polyphenylene ether ether ketones (B ′) generated by heating, and between the polyphenylene ether ether ketone (B ′) and the polyphenylene ether ether ketone oligomer ( B) Since there is a tendency that an undesirable side reaction represented by a cross-linking reaction or a decomposition reaction is easily generated, and the characteristics of the obtained polyphenylene ether ether ketone (B ′) may be deteriorated. It is desirable to avoid temperatures at which undesirable side reactions occur significantly. As an upper limit of heating temperature, 450 degrees C or less can be illustrated, Preferably it is 400 degrees C or less, More preferably, it is 350 degrees C or less, More preferably, it is 300 degrees C or less. Below this temperature range, adverse effects on the properties of polyphenylene ether ether ketone (B ') due to undesirable side reactions tend to be suppressed. When a known polyphenylene ether ether ketone oligomer is used, the melting point of the polyphenylene ether ether ketone oligomer is high, so that it takes a long time for the heat polymerization in the above preferred temperature range, or the heat polymerization does not proceed and the polyphenylene ether ether ketone does not proceed. In contrast, the polyphenylene ether ether ketone oligomer (B) having the melting point of 270 ° C. or less in the present invention tends to be efficiently heated and polymerized in the above preferred temperature range. (B ′) is obtained.

  In addition, the polyphenylene ether ether ketone oligomer (B) in the present invention can be polymerized by heating at a temperature not higher than the melting point of the obtained polyphenylene ether ether ketone (B ′). Polyphenylene ether ether ketone (B ′) obtained under such polymerization conditions tends to have higher melting enthalpy and thus higher crystallinity than known polyphenylene ether ether ketone. This is thought to be because a phenomenon in which crystallization of the polyphenylene ether ether ketone (B ′) obtained by polymerization and polymerization of the polyphenylene ether ether ketone oligomer (B) proceeds simultaneously, so-called crystallization polymerization proceeds. . The lower limit of the melting enthalpy of the polyphenylene ether ether ketone (B ′) obtained by crystallization polymerization can be exemplified by 40 J / g or more, preferably 45 J / g or more, more preferably 50 J / g or more. Here, for the melting enthalpy of polyphenylene ether ether ketone (B ′), the portion corresponding to polyphenylene ether ether ketone (B ′) is physically taken out from the molding material of the present invention, and a differential scanning calorimeter is used from this sample. It is possible to measure by observing the endothermic peak area.

  Although the reaction time varies depending on conditions such as the weight fraction and composition ratio of the cyclic polyphenylene ether ether ketone in the polyphenylene ether ether ketone oligomer (B) to be used, the heating temperature and the heating polymerization method, it cannot be uniformly defined. It is preferable to set so as not to cause an undesirable side reaction such as a cross-linking reaction, and a range of 0.001 to 100 hours can be exemplified, 0.005 to 20 hours is preferable, and 0.005 to 10 hours is more preferable . By setting these preferable reaction times, there is a tendency that adverse effects on the properties of the obtained polyphenylene ether ether ketone (B ′) due to the progress of undesirable side reactions such as a crosslinking reaction can be suppressed.

<Polymerization catalyst (C)>
In the present invention, the polymerization catalyst (C) is a catalyst for accelerating the heat polymerization reaction of the polyphenylene ether ether ketone oligomer (B) to the polyphenylene ether ether ketone (B ′). There is no particular limitation, and a known catalyst such as a photopolymerization initiator, a radical polymerization initiator, a cationic polymerization initiator, an anionic polymerization initiator, or a transition metal catalyst can be used, and among these, an anionic polymerization initiator is preferable. Examples of the anionic polymerization initiator include alkali metal salts such as inorganic alkali metal salts or organic alkali metal salts. Examples of inorganic alkali metal salts include sodium fluoride, potassium fluoride, cesium fluoride, and lithium chloride. Examples of the alkali metal halide include organic alkoxides such as sodium methoxide, potassium methoxide, sodium ethoxide, potassium ethoxide, sodium tert-butoxide, potassium tert-butoxide and the like, or sodium phenoxide. Alkali metal phenoxide such as potassium phenoxide, sodium-4-phenoxyphenoxide, potassium-4-phenoxyphenoxide, alkali such as lithium acetate, sodium acetate, potassium acetate It can be exemplified genus acetate. Further, it is presumed that these anionic polymerization initiators exhibit a catalytic action by nucleophilic attack on the polyphenylene ether ether ketone oligomer (B). Therefore, it is possible to use a compound having a nucleophilic attack ability equivalent to those of these anionic polymerization initiators as a catalyst. Examples of such a compound having a nucleophilic attack ability include a polymer having an anion polymerizable terminal. Can do. These anionic polymerization initiators may be used alone or in combination of two or more. By performing the heat polymerization of the polyphenylene ether ether ketone oligomer (B) in the presence of these preferred catalysts, the polyphenylene ether ether ketone (B ′) tends to be obtained in a short time. Specifically, the heating time of the heat polymerization 2 hours or less, further 1 hour or less, 0.5 hours or less.

  The amount of the catalyst to be used varies depending on the molecular weight of the target polyphenylene ether ether ketone (B ′) and the kind of the catalyst, but is usually a formula which is the main constituent unit of the polyphenylene ether ether ketone oligomer (B).

0.001 to 20 mol%, preferably 0.005 to 15 mol%, and more preferably 0.01 to 10 mol% with respect to 1 mol of the repeating unit. By adding a catalyst amount in this preferred range, the heat polymerization of the polyphenylene ether ether ketone oligomer (B) tends to proceed in a short time.

  The method for adding the polymerization catalyst (C) is not particularly limited, but a mixture comprising the polyphenylene ether ether ketone oligomer (B) and the polymerization catalyst (C) is prepared in advance, and this mixture is combined with the reinforcing fiber (A). The method of making it etc. can be illustrated.

<Method of manufacturing molding material>
Next, the manufacturing method of the molding material of this invention is comprised from the following processes at least.
Step (I): Pulling out the reinforcing fiber substrate (A) and continuously supplying it (II): Step of obtaining a composite by combining the reinforcing fiber substrate (A) with the polyphenylene ether ether ketone oligomer (B) (III): Step of polymerizing polyphenylene ether ether ketone oligomer (B) to polyphenylene ether ether ketone (B ′) (IV): A composite comprising a reinforcing fiber substrate (A) and polyphenylene ether ether ketone (B ′) Further, the method for producing a molding material of the present invention is characterized in that the polyphenylene ether ether ketone oligomer (B) used in the step (II) has a melting point of 270 ° C. or lower.

  From the viewpoint of productivity, in the method for producing a molding material of the present invention, in step (II), the polymerization catalyst (C) is added to the polyphenylene ether ether ketone oligomer (B), and the polyphenylene ether ether ketone oligomer (B ) To polyphenylene ether ether ketone (B ′).

  Although each process can also be implemented offline, it is preferable to implement processes (I)-(IV) on-line from the surface of economical efficiency and productivity.

  Here, performing steps (I) to (IV) online means that all of steps (I) to (IV) are performed continuously or intermittently in a continuous production line (for example, see FIGS. 1 to 3). Means to do.

  Each step will be described.

<Process (I)>
Step (I) is a step of supplying the reinforcing fiber base (A) to the production line. Here, for the purpose of producing a molding material with good economic efficiency and productivity, it is preferable to continuously supply the reinforcing fiber base (A). Continuous means that the reinforcing fiber base material (A) as a raw material is continuously supplied without being completely cut, the supply speed may be constant, and supply and stop are intermittently performed. It may be repeated. Moreover, in order to improve the shaping property of the molding material obtained, in order to make a slit (cut) in the reinforcing fiber base (A), a step of cutting a part thereof may be included.

  Step (I) also includes the purpose of pulling out the reinforcing fiber substrate (A) and arranging it in a predetermined arrangement. That is, the reinforcing fiber substrate (A) to be supplied may be a yarn shape, a sheet shape aligned in one direction, or a preform shape that has been previously provided with a shape. Specifically, a continuous reinforcing fiber bundle is creeled, the reinforcing fiber bundle is pulled out, passed through a roller and supplied to the production line, and similarly, a plurality of reinforcing fiber bundles are arranged in one direction to form a sheet. A method of leveling and feeding to a production line through a roll bar, or a reinforced fiber base material (A) previously rolled in the form of a woven fabric, non-woven fabric, or mat is creeled, pulled out and passed through a roller. The method of supplying to a production line is mentioned. Here, a method using a continuous reinforcing fiber bundle is preferably used because it can be taken up at high speed, and a method using a roll is preferably used because a large amount of molding material can be produced at one time. Moreover, the method etc. which pass the some roll bar arrange | positioned so that it may become a predetermined shape and supply to a production line can be illustrated. Furthermore, when the reinforcing fiber substrate (A) is processed into a flat shape, the reinforcing fiber substrate (A) may be directly supplied to the production line from a folded state or the like. In addition, it is more preferable in terms of production management to provide a driving device for various rollers and roll bars because the supply speed can be adjusted.

  Furthermore, in the step (I), it is preferable in production to include a step of heating the reinforcing fiber base (A) to 50 to 500 ° C, preferably 80 to 400 ° C, more preferably 100 to 300 ° C. By heating the reinforcing fiber base (A), the fixing property of the polyphenylene ether ether ketone oligomer (B) to the reinforcing fiber base (A) in the step (II) can be improved. Moreover, the sizing agent adhering to the reinforcing fiber substrate (A) can be softened and opened. The heating method is not particularly limited, and examples thereof include non-contact heating using hot air or an infrared heater, and contact heating using a pipe heater or electromagnetic induction.

  In the step (I), for example, when the reinforcing fiber base (A) is a reinforcing fiber bundle or a unidirectional array base, it is more preferable to include a fiber opening operation. Opening is an operation of dividing the converged reinforcing fiber bundle, and an effect of further improving the impregnation property of the polyphenylene ether ether ketone oligomer (B) can be expected. By opening the fiber, the thickness of the reinforcing fiber substrate (A) is reduced, the width of the reinforcing fiber bundle before opening is b1 (mm), the thickness is a1 (μm), and the width of the reinforcing fiber bundle after opening is b2. When the thickness is (mm) and the thickness is a2 (μm), the spread ratio = (b2 / a2) / (b1 / a1) is preferably 2.0 or more, and more preferably 2.5 or more.

  The method for opening the reinforcing fiber substrate (A) is not particularly limited. For example, a method in which concavo-convex rolls are alternately passed, a method using a drum-type roll, a method in which tension fluctuation is applied to axial vibration, and a reciprocation vertically A method of changing the tension of the reinforcing fiber base (A) by two moving friction bodies and a method of blowing air to the reinforcing fiber base (A) can be used.

<Process (II)>
Step (II) is a step of combining the polyphenylene ether ether ketone oligomer (B) with the reinforcing fiber substrate (A). The method of complexing is not particularly limited, but the following three methods (1) to (3) can be preferably exemplified depending on the form of the polyphenylene ether ether ketone oligomer (B).

  (1) A method in which at least one polyphenylene ether ether ketone oligomer (B) selected from the group consisting of particles, fibers, and flakes is applied to the reinforcing fiber substrate (A) to form a composite. . In this method, when complexing is performed, it is preferable that the polyphenylene ether ether ketone oligomer (B) is dispersed in a gas phase or a liquid phase.

  The method using the polyphenylene ether ether ketone oligomer (B) dispersed in the gas phase means that the polyphenylene ether ether ketone oligomer (at least one form selected from the group consisting of particles, fibers, and flakes) ( In this method, B) is dispersed in the gas phase and the reinforcing fiber substrate (A) is passed through the gas phase. Specifically, a method in which the reinforcing fiber base (A) is passed while the polyphenylene ether ether ketone oligomer (B) is dispersed in a fluidized bed or the like, or the polyphenylene ether ether ketone directly on the reinforcing fiber base (A). Examples thereof include a method of spraying the oligomer (B), a method of charging the polyphenylene ether ether ketone oligomer (B) and electrostatically attaching it to the reinforcing fiber substrate (A).

  The method using the polyphenylene ether ether ketone oligomer (B) dispersed in the liquid phase means that the polyphenylene ether ether ketone oligomer in at least one form selected from the group consisting of particles, fibers and flakes ( In this method, B) is dispersed or dissolved in the liquid phase, and the reinforcing fiber substrate (A) is passed through the liquid phase. In addition, dispersion | distribution here maintains the inside of the range of the preferable size in each form mentioned later, without polyphenylene ether ether ketone oligomer (B) carrying out secondary aggregation, and forming the coarse aggregate of 1 mm or more. Means. A method for dispersing or dissolving the polyphenylene ether ether ketone oligomer (B) in the liquid phase is not particularly limited, and a method using a stirring device, a method using a vibration device, a method using an ultrasonic generator, and a jet device are used. A method etc. can be illustrated. In addition, from the viewpoint of maintaining a dispersed state or a dissolved state, it is more preferable to use these methods even in a liquid phase through which the reinforcing fiber base (A) is passed.

  Examples of the liquid phase used here include water and organic solvents, but it is more preferable to use pure water or industrial water from the viewpoints of economy and productivity. Moreover, for the purpose of assisting the dispersion of the polyphenylene ether ether ketone oligomer (B), various anionic, cationic and nonionic surfactants may be used in combination. Although the usage-amount of surfactant does not have a restriction | limiting in particular, 0.01 to 5 weight% can be illustrated as a preferable range.

  Further, in the compounding method using a liquid phase, an especially preferable form of the polyphenylene ether ether ketone oligomer (B) is an emulsion or a dispersion. From the viewpoint of dispersibility at this time, the average particle diameter is preferably 0.01 to 100 μm, more preferably 0.05 to 50 μm, and further preferably 0.1 to 20 μm.

  When the polyphenylene ether ether ketone oligomer (B) is in the form of particles, the average particle size is preferably 50 to 300 μm, more preferably 80 to 250 μm, and even more preferably 100 to 200 μm, from the viewpoint of processability and handleability of the particles. . Moreover, when it is fibrous form, 0.5-50 micrometers is preferable similarly, an average fiber diameter is more preferable, 1-30 micrometers is more preferable, and 5-20 micrometers is further more preferable. Although there is no restriction | limiting in particular in average fiber length, 1-10 mm can be illustrated as a preferable range. Moreover, when it is flake shape, it has the same thickness as the said particle shape, and it is preferable to have a length 5 to 100 times the thickness.

  The average particle diameter can be measured using a laser diffraction / scattering particle size distribution measuring apparatus or the like. The average fiber diameter, average fiber length, and flake-like thickness and length can be measured using an optical microscope. In addition, when measuring an average fiber diameter, an average fiber length, flake-like thickness, and length using an optical microscope, it expands 20-100 times and should just calculate | require the average value measured about arbitrary 400 points | pieces. .

  In addition, when an organic solvent is used in the liquid phase, undesirable side reactions such as inhibition of polymerization due to heating of the polyphenylene ether ether ketone oligomer (B) and decomposition or crosslinking of the generated polyphenylene ether ether ketone (B ′) are substantially caused. There is no particular limitation as long as it does not cause any problems. For example, N-methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, acetone, methyl ethyl ketone, diethyl ketone, dimethyl ether, dipropyl ether, tetrahydrofuran, chloroform, methylene chloride, trichloroethylene, Ethylene dichloride, dichloroethane, tetrachloroethane, chlorobenzene, methanol, ethanol, propanol, butanol, pentanol, ethylene glycol, propylene glycol, phenol , Cresol, polyethylene glycol, benzene, toluene, xylene and the like. It is also possible to use an inorganic compound such as carbon dioxide, nitrogen, or water as a solvent in a supercritical fluid state. These solvents can be used as one kind or a mixture of two or more kinds.

  Specifically, an emulsion or dispersion of polyphenylene ether ether ketone oligomer (B) is supplied into a water tank, and the reinforcing fiber substrate (A) is passed through the water tank, or a jet is used in the water tank. Examples thereof include a method of passing through the reinforcing fiber substrate (A) and a method of spraying an emulsion or dispersion of the polyphenylene ether ether ketone oligomer (B) directly on the reinforcing fiber substrate (A).

  Furthermore, in the method of compounding using a liquid phase, it is more preferable in production to remove (remove) the used water or organic solvent after passing through the reinforcing fiber base (A). For example, methods such as air blow, hot air drying, and suction filtration can be exemplified. At this time, the water removal rate of the complex or the organic solvent is not particularly limited, but is preferably 50 to 100%, more preferably 70 to 100%, and still more preferably 90 to 100%. In addition, it is particularly preferable from the viewpoint of production and environment that the liquid phase after liquid removal is recovered and circulated and reused. Here, the liquid removal rate can be easily determined from the mass difference of the composite before and after the liquid removal operation.

  (2) A method in which at least one polyphenylene ether ether ketone oligomer (B) selected from the group consisting of a film, a sheet, and a nonwoven fabric is applied to the reinforcing fiber substrate (A) and combined. is there. Here, the film shape means a thickness having an average thickness of 200 μm or less, and the sheet shape means a thickness having an average thickness exceeding 200 μm. The non-woven fabric is a fiber sheet or web, in which fibers are oriented in one direction or randomly, and the fibers are bonded by any of entanglement, fusion, or adhesion. The average thickness can be obtained by stacking a plurality of sheets or films, measuring arbitrary 10 points with calipers, and dividing the obtained thickness by the number of stacked sheets.

  Specifically, the reinforcing fiber substrate (A) is moved to a conveyor, and a film-like polyphenylene ether ether ketone oligomer (B) is laminated on one or both sides thereof with a hot roller, or a non-woven polyphenylene ether ether ketone. Examples thereof include a method of fixing the oligomer (B) by punching and a method of entanglement of the reinforcing fiber base (A) and the non-woven polyphenylene ether ether ketone oligomer (B) with an air jet.

  In addition, from the viewpoints of economy and productivity, the polyphenylene ether ether ketone oligomer (B) is preferably roll-processed in any form of film, sheet, and nonwoven fabric. When the polyphenylene ether ether ketone oligomer (B) is difficult to roll by itself, one example of a preferable method is to apply each form to a release paper after processing and roll processing.

  (3) This is a method in which the heat-melted polyphenylene ether ether ketone oligomer (B) is applied to the reinforcing fiber substrate (A) to form a composite. For heating and melting here, an apparatus such as an extruder or a melting bath can be used, but it has a function of transferring the melted polyphenylene ether ether ketone oligomer (B) such as a screw, a gear pump, and a plunger. It is preferable.

  Specifically, the polyphenylene ether ether ketone oligomer (B) is melted using an extruder and is supplied to a die die such as a T die or a slit die, and the reinforcing fiber base (A) is contained in the die die. , A method of passing the reinforcing fiber substrate (A) in the melting bath while squeezing it, and a polyphenylene ether ether ketone oligomer (melted with a plunger pump) B) is supplied to a kiss coater, and the melt of polyphenylene ether ether ketone oligomer (B) is applied to the reinforcing fiber substrate (A), or similarly, polyphenylene ether ether ketone melted on a heated rotating roll. A method of supplying the oligomer (B) and allowing the reinforcing fiber base (A) to pass through the roll surface can be exemplified.

  In the step of melting the polyphenylene ether ether ketone oligomer (B), it is preferable to set a temperature at which the heat polymerization of the polyphenylene ether ether ketone oligomer (B) does not occur as much as possible. The temperature of the step of obtaining the molten mixture and the step of impregnating the molten mixture is 160 to 340 ° C, preferably 180 to 320 ° C, more preferably 200 to 300 ° C, and particularly preferably 230 to 270 ° C. When heated at a temperature lower than 160 ° C., the polyphenylene ether ether ketone oligomer (B) does not melt or tends to require a long time for melting, which is not desirable. When heated at a temperature higher than 340 ° C., the polymerization of the polyphenylene ether ether keto oligomer (B) proceeds rapidly, the viscosity increases due to the formation of the polyphenylene ether ether ketone (B ′), and the subsequent reinforcing fiber substrate (A) Adversely affects the impregnation process.

  Furthermore, in the step (II), the composite composed of the reinforcing fiber base (A) and the polyphenylene ether ether ketone oligomer (B) is 160 to 340 ° C, preferably 180 to 320 ° C, more preferably 200 to 300 ° C, particularly Preferably, it includes a step of heating to 230 to 270 ° C. By this heating step, the polyphenylene ether ether ketone oligomer (B) is softened or melted, and can be firmly fixed by the reinforcing fiber base (A), which is advantageous in improving productivity. When heated at a temperature lower than 160 ° C., the polyphenylene ether ether ketone oligomer (B) does not melt or tends to require a long time for melting, which is not desirable. When heated at a temperature higher than 340 ° C., the polymerization of the polyphenylene ether ether ketone oligomer (B) proceeds rapidly, the viscosity increases due to the formation of the polyphenylene ether ether ketone (B ′), and the subsequent reinforcing fiber substrate (A) In some cases, the impregnation process is adversely affected, and in order to provide heat resistance to such a temperature range, the device parts may be very expensive.

  Furthermore, the effect of impregnating the reinforcing fiber base (A) with the polyphenylene ether ether ketone oligomer (B) can be obtained by applying pressure simultaneously with or immediately after the heating step, which is particularly preferable. The applied pressure at this time is preferably 0.1 to 5 MPa, more preferably 0.3 to 4 MPa, and further preferably 0.5 to 3 MPa from the viewpoint of productivity.

  Specifically, a method of arranging a plurality of pressure rollers in a heated chamber and passing the composite, a method of similarly arranging a calender roll up and down and passing the composite, and heating using a hot roller A method of simultaneously performing pressurization can be exemplified.

  Moreover, when using a polymerization catalyst (C), it is preferable to add a polymerization catalyst (C) in process (II) from a dispersible viewpoint to a polyphenylene ether ether ketone oligomer (B). At this time, the mixture composed of the polyphenylene ether ether ketone oligomer (B) and the polymerization catalyst (C) is processed into the above-described particle shape, fiber shape, flake shape, film shape, sheet shape, nonwoven fabric shape, and heat-melted state. Can be used.

  Although there is no restriction | limiting in particular in the method of obtaining the mixture of a polyphenylene ether ether ketone oligomer (B) and a polymerization catalyst (C), After adding a polymerization catalyst (C) to a polyphenylene ether ether ketone oligomer (B), it disperse | distributes uniformly. It is preferable to make it. As a method of uniformly dispersing, for example, a method of mechanically dispersing can be mentioned. Specific examples of the mechanical dispersion method include a pulverizer, a stirrer, a mixer, a shaker, and a method using a mortar. In addition, when the polymerization catalyst (C) is dispersed, the average particle size of the polymerization catalyst (C) is preferably 1 mm or less because more uniform dispersion is possible.

<Step (III)>
In the step (III), the composite comprising the reinforcing fiber base (A) and the polyphenylene ether ether ketone oligomer (B) obtained in the step (II) is heated to convert the polyphenylene ether ether ketone oligomer (B) to polyphenylene. This is a step of polymerizing ether ether ketone (B ′). In particular, it is preferable that the polyphenylene ether ether ketone oligomer (B) is polymerized by heating in the presence of the polymerization catalyst (C) to be converted into polyphenylene ether ether ketone (B ′).

  As a minimum of the temperature in the case of heat polymerization, 160 degreeC or more can be illustrated, Preferably it is 200 degreeC or more, More preferably, it is 230 degreeC or more, More preferably, it is 270 degreeC or more. Within this temperature range, the polyphenylene ether ether ketone oligomer (B) tends to melt and polyphenylene ether ether ketone (B ′) can be obtained in a short time.

  On the other hand, the upper limit of the temperature in the heat polymerization can be exemplified by 450 ° C. or less, preferably 400 ° C. or less, more preferably 350 ° C. or less, and further preferably 300 ° C. or less. Below this temperature range, adverse effects on the properties of polyphenylene ether ether ketone (B ') due to undesirable side reactions tend to be suppressed.

  Furthermore, the polyphenylene ether ether ketone oligomer (B) in the present invention can be polymerized at a temperature below the melting point of the polyphenylene ether ether ketone (B ′) obtained by polymerization. In such a temperature range, the polyphenylene ether ether ketone oligomer (B) undergoes crystallization polymerization, so that a molding material having a polyphenylene ether ether ketone (B ′) having a higher degree of crystallinity and thus a higher melting enthalpy than usual as a matrix resin can be obtained. can get.

  The shorter the reaction time until the polymerization in step (III) is completed, the shorter the length of the process, or the higher the take-up speed. . The reaction time is preferably 60 minutes or less, and more preferably 10 minutes or less. There is no restriction | limiting in particular about the minimum of reaction time, For example, 0.05 minutes or more can be illustrated.

  In the step (III), in the polymerization of the polyphenylene ether ether ketone oligomer (B), it is preferable to heat in a non-oxidizing atmosphere from the viewpoint of suppressing the occurrence of undesirable side reactions such as crosslinking reaction and decomposition reaction. . Here, the non-oxidizing atmosphere is an atmosphere having an oxygen concentration of 5% by volume or less, preferably 2% by volume or less, more preferably an oxygen-free atmosphere, that is, an inert gas atmosphere such as nitrogen, helium or argon. Of these, a nitrogen atmosphere is particularly preferred from the standpoints of economy and ease of handling.

  Similarly, in step (III), it is preferable to heat under reduced pressure. Here, it is more preferable that the atmosphere in the reaction system is once changed to a non-oxidizing atmosphere and then adjusted to a reduced pressure condition. Here, “under reduced pressure” means that the inside of the reaction system is lower than atmospheric pressure, preferably 0.1 to 50 kPa, and more preferably 0.1 to 10 kPa.

  Furthermore, it is preferable that the step (III) includes a step of applying a pressing force simultaneously with heating or after heating. It is preferable because the impregnation of the polyphenylene ether ether ketone oligomer (B) and the polyphenylene ether ether ketone (B ′) into the reinforcing fiber substrate (A) can be further enhanced. The pressure applied here is preferably from 0.1 to 10 MPa, more preferably from 0.2 to 5 MPa, and even more preferably from 2 to 6 MPa from the viewpoint of the balance between impregnation and productivity. When the pressure is lower than 0.1 MPa, a large number of voids may be generated in the molding material and thus in the obtained molded product. When the pressure is higher than 10 MPa, the reinforcing fiber substrate (A ) May be greatly disturbed.

  Specifically, in a system substituted with nitrogen, a method of passing the composite while applying pressure from above and below by a double belt press, or a combination of calender rolls arranged in multiple in a nitrogen-substituted heating furnace A method of passing the body while applying pressure, or placing the composite in a high-temperature press die, sealing and pressurizing between the press dies, and simultaneously replacing the inside of the die with nitrogen, and releasing the space between the press dies after completion of polymerization as a decompression condition Thus, a method of pulling out the composite can be exemplified. In addition, these devices may be used in combination for the purpose of improving the impregnation property, and the line direction may be folded in order to increase the length, and the composite that has passed through the device is folded back. You may use and loop the same device multiple times.

<Step IV>
Step (IV) is a step of cooling and taking up the composite obtained in the step (III). The cooling method is not particularly limited, and a method of cooling by jetting air, a method of spraying cooling water, a method of passing a cooling bath, a method of passing over a cooling plate, and the like can be used.

  When the production of the molding material is on-line, the take-up speed directly affects the economic efficiency and the productivity, so that the higher the better. The take-up speed is preferably 1 to 100 m / min, more preferably 5 to 100 m / min, and even more preferably 10 to 100 m / min.

  Specific examples include a method of pulling out with a nip roller, a method of winding up with a drum winder, and a method of gripping a base material with a fixing jig and pulling up the jig together. Moreover, when picking up, a base material may be cut through a slitter, a sheet may be cut into a predetermined length with a guillotine cutter or the like, or it may be cut into a fixed length with a strand cutter or the like. Alternatively, it may be a roll shape.

  In addition, the manufacturing method of the molding material of this invention can combine another process in the range which does not impair the effect. For example, an electron beam irradiation process, a plasma treatment process, a strong magnetic field application process, a skin material laminating process, a protective film attaching process, an after-cure process, and the like can be given.

  The molding material obtained by the manufacturing method of the molding material of this invention is comprised from a reinforced fiber base material (A) and a polyphenylene ether ether ketone oligomer (B).

  Among these, the content of the reinforcing fiber base (A) is preferably 10% by weight or more when the total of the reinforcing fiber base (A) and the polyphenylene ether ether ketone oligomer (B) is 100% by weight, and 30% by weight. % Or more is more preferable, 60% by weight or more is more preferable, and 70% by weight or more is particularly preferable. When the reinforcing fiber base (A) is less than 10% by weight, the resulting molded article may have insufficient mechanical properties. On the other hand, although there is no restriction | limiting in particular about the upper limit of content of a reinforced fiber base material (A), 90 weight% or less is preferable, 80 weight% or less is more preferable, and 70 weight% or less is further more preferable. When the reinforcing fiber base (A) is larger than 90% by weight, it may be difficult to impregnate the reinforcing fiber base (A) with the polyphenylene ether ether ketone oligomer (B). The content of the reinforcing fiber base (A) in the molding material of the present invention can be adjusted by controlling the supply amounts of the reinforcing fiber (A) and the polyphenylene ether ether ketone oligomer (B).

  Furthermore, when the polymerization catalyst (C) is included, the content thereof is a formula that is a main structural unit of the polyphenylene ether ether ketone oligomer (B).

0.001 to 20 mol%, preferably 0.005 to 15 mol%, and more preferably 0.01 to 10 mol% with respect to 1 mol of the repeating unit.

  These ratios can be easily implemented by controlling the supply amounts of the reinforcing fiber base (A) and the polyphenylene ether ether ketone oligomer (B). For example, the supply amount of the reinforcing fiber substrate (A) can be adjusted by the take-up speed in the step (IV), and the supply amount of the polyphenylene ether ether ketone oligomer (B) can be determined by a quantitative feeder in the step (II). Can be used to adjust the supply amount. Furthermore, the supply amount of a polymerization catalyst (C) can also adjust the addition amount in a molding material by adjusting the addition amount to a polyphenylene ether ether ketone oligomer (B).

  In the production method of the present invention, molding materials having different impregnation rates can be produced according to the usage and purpose of the molding material. For example, a prepreg having a higher impregnation property, a semi-preg with a semi-impregnation, and a fabric with a low impregnation property. In general, a molding material with higher impregnation property tends to provide a molded product with excellent mechanical properties in a short time. On the other hand, molding materials with relatively low impregnation properties tend to be excellent in drape and excellent in shaping into curved shapes.

  Therefore, in the molding material obtained in the present invention, the first preferred embodiment for the impregnation rate of polyphenylene ether ether ketone (B ′) is a molding material having such an impregnation rate of 80% or more and 100% or less. This is excellent from the viewpoint of manufacturing a simpler planar shaped product with high productivity.

  In the molding material obtained in the present invention, a second preferred embodiment of the impregnation rate of polyphenylene ether ether ketone (B ′) is a molding material having an impregnation rate of 20% or more and less than 80%. This is a molding material excellent in drapeability, and since the molding material can be pre-shaped according to the mold, it is excellent from the viewpoint of producing a relatively complicated molded product such as a curved shape with high productivity. The impregnation rate of the polyphenylene ether ether ketone (B ′) referred to here is a cross section of the molding material observed using an optical microscope, and the area of the impregnated polyphenylene ether ether ketone (B ′) It is expressed as a ratio (%) divided by the sum of the area and the area of voids (voids).

  In addition, what is necessary is just to obtain | require the average value measured about 20 arbitrary images, enlarging 20-100 times, when measuring each area using an optical microscope.

  As a method for controlling the impregnation rate, the temperature and pressure when the polyphenylene ether ether ketone oligomer (B) is compounded in the step (II), the polyphenylene ether ether ketone oligomer (B) in the step (III) is polyphenylene. Examples thereof include the temperature and pressure applied when polymerizing ether ether ketone (B ′). Usually, the higher the temperature and the applied pressure, the higher the impregnation rate. Moreover, impregnation can be improved, so that the form of a polyphenylene ether ether ketone oligomer (B) becomes finer.

<Molding method of molding material>
One or more molding materials obtained by the present invention are laminated in an arbitrary configuration, and then molded while applying heat and pressure to obtain a molded product.

  As a method of applying heat and pressure, a molding material laminated in an arbitrary configuration is placed in a mold or on a press plate, and then a press molding method in which the mold or the press plate is closed and pressed, molding with an arbitrary configuration is performed. An autoclave molding method in which materials are put into an autoclave and then pressurized and heated. A bagging molding method in which molding materials laminated in any configuration are wrapped in a film, etc., and the interior is decompressed and heated in an oven while being pressurized at atmospheric pressure. Wrapping tape method in which tape is wound while applying tension to the molding material laminated in any configuration and heated in an oven, the molding material laminated in any configuration is installed in the mold, and the core is also installed in the mold An internal pressure molding method or the like in which gas or liquid is injected into the inside and pressurized is used. In particular, since a molded product having few voids in the obtained molded product and excellent in appearance quality can be obtained, a molding method of pressing using a mold can be preferably exemplified.

  As a range of the heating temperature at the time of shaping | molding, 160-450 degreeC, More preferably, it is 230-430 degreeC, More preferably, 270-400 degreeC can be illustrated. If the temperature is lower than 160 ° C., the polyphenylene ether ether ketone (B ′) may not be melted and there may be a problem in moldability. When the temperature is higher than 450 ° C., the thermal deterioration of the polyphenylene ether ether ketone (B ′) proceeds, and the mechanical properties of the obtained molded product may be lowered.

  In addition, the measuring method of the heating temperature at the time of shaping | molding here can illustrate the method of measuring the surface temperature of a metal mold | die with thermometers, such as a thermocouple, in the case of the shaping | molding method which shape | molds using a metal mold | die, for example. .

  As a range of the pressure at the time of shaping | molding, 0.1-10 MPa is preferable and 0.2-5 MPa can be illustrated as a more preferable range. When the pressure is lower than 0.1 MPa, a large number of voids may be generated in the obtained molded product. When the pressure is higher than 10 MPa, the arrangement of the reinforcing fiber base (A) may be greatly disturbed. There is sex.

  Although there is no restriction | limiting in particular as the range of the time heated and pressurized at the time of shaping | molding, 0.001-1000 minutes, Preferably it is 0.01-300 minutes, More preferably, it is 0.1-60 minutes, More preferably, it is 0.3- 30 minutes, particularly preferably 0.5 to 10 minutes. When the impregnation time is shorter than 0.001 minutes, the polyphenylene ether ether ketone (B ′) is insufficiently melted and the quality of the molded product tends to be lowered. When the impregnation time is longer than 1000 minutes, it is not preferable in terms of the productivity of the molded product.

  The molding material obtained by the present invention can be easily subjected to integral molding such as insert molding and outsert molding. Furthermore, it is possible to utilize an adhesive method having excellent productivity such as a correction treatment by heating, heat welding, vibration welding, ultrasonic welding, etc. after molding.

<Molded product>
A molded article using the molding material obtained by the present invention is excellent in heat resistance, mechanical properties, flame retardancy, chemical resistance and the like because the matrix resin is polyphenylene ether ether ketone. Further, since the matrix resin is thermoplastic polyphenylene ether ether ketone, the resin can be plasticized by heating or the like, so that the molded product can be easily recycled and repaired.

  Molded products include automotive parts such as thrust washers, oil filters, seals, bearings, gears, cylinder head covers, bearing retainers, intake manifolds, pedals, semiconductors such as silicon wafer carriers, IC chip trays, electrolytic capacitor trays, insulating films, etc. Examples include liquid crystal production equipment parts, compressor parts such as pumps, valves, and seals, industrial machine parts such as aircraft cabin interior parts, sterilization equipment, medical equipment parts such as columns and piping, and food / beverage production equipment parts. In addition, the molding material of the present invention can relatively easily obtain a thin molded product having a thickness of 0.5 to 2 mm. Such thin-wall molding is required to be represented by, for example, a casing used for a personal computer, a mobile phone, or a keyboard support that is a member that supports the keyboard inside the personal computer. Examples of members for electrical and electronic equipment. In such a member for an electric / electronic device, when carbon fiber having conductivity is used as the reinforcing fiber, electromagnetic shielding properties are imparted, which is more preferable.

  The following examples illustrate the present invention more specifically.

  The evaluation method used in the present invention is described below.

(1) Quantification of cyclic polyphenylene ether ether ketone The cyclic polyphenylene ether ether ketone in the polyphenylene ether ether ketone oligomer (B) was quantified by high performance liquid chromatography. The measurement conditions are as follows.
Apparatus: LC-10Avp series column manufactured by Shimadzu Corporation: Mightysil RP-18GP150-4.6
Detector: Photodiode array detector (UV = 270 nm is used)
Column temperature: 40 ° C
Sample: 0.1 wt% THF solution mobile phase: THF / 0.1 w% trifluoroacetic acid aqueous solution.

(2) Differential scanning calorimeter In accordance with JIS K7121 (1987), a differential scanning calorimeter, DSC system TA3000 (manufactured by METTLER) was used to measure at a heating rate of 10 ° C./min, and a melting peak temperature. The melting enthalpy was determined from the melting peak area.

(3) Infrared spectroscopic analyzer The absorption spectrum in infrared spectroscopy was measured under the following conditions.
Apparatus: Perkin Elmer System 2000 FT-IR
Sample preparation: KBr method.

(4) Viscosity measurement The reduced viscosity was measured under the following conditions.
Viscometer: Ostwald viscometer solvent: 98 wt% sulfuric acid sample concentration: 0.1 g / dL (sample weight / solvent volume)
Measurement temperature: 25 ° C
Reduced viscosity calculation formula: η = {(t / t0) −1} / C
t: Sample solution passage time t0: Solvent passage time C: Solution concentration.

(5) Evaluation of impregnation rate of polyphenylene ether ether ketone (B ′) in molding material The thickness direction cross section of the molding material was observed and measured as follows. A sample in which the molding material was embedded with an epoxy resin was prepared, and the sample was polished until the cross-section in the thickness direction of the molding material could be observed well. Using the sample obtained here, the range of the thickness x 500 μm of the molding material was measured using an ultra-deep color 3D shape measuring microscope VK-9500 (controller part) / VK-9510 (measuring part) (manufactured by Keyence Corporation). It was used and photographed at a magnification of 400 times. In the photographed image, the area of the part occupied by the resin and the area of the part that was a void were obtained, and the impregnation rate was calculated by the following equation.
Impregnation rate (%) = 100 × (total area occupied by resin) / {(total area occupied by resin) + (total area occupied by voids)}
Evaluation of the impregnation rate of polyphenylene ether ether ketone (B ′) was evaluated according to the following three stages using this impregnation rate as a judgment criterion, and “◯” or more was regarded as acceptable.
◯: The impregnation rate is 80% or more and 100% or less.
○: Impregnation rate is 20% or more and less than 80%.
X: The impregnation rate is less than 20%.

(6) Bending test of the molded product obtained using the molding material From the molded product formed by stacking the molding material with the fiber direction aligned in one direction and molding with a thickness of 2 ± 0.4 mm, the long side in the fiber axis direction As a result, a test piece having a size according to JIS K 7074-1988 was cut out.
A three-point bending test was performed using “Instron” (registered trademark) universal testing machine 4201 type (manufactured by Instron) as a testing machine, and 0 ° bending elastic modulus and 0 ° bending strength were calculated.

(7) Evaluation of Void Ratio of Molded Product Obtained Using Molding Material The thickness direction cross section of the molded product was observed and measured as follows. A sample in which the molded product was embedded with an epoxy resin was prepared, and the sample was polished until the cross section in the thickness direction of the molded product could be observed well. Using the sample obtained here, the range of thickness x 500 μm of the molded product was measured using an ultra-deep color 3D shape measurement microscope VK-9500 (controller unit) / VK-9510 (measurement unit) (manufactured by Keyence Corporation). It was used and photographed at a magnification of 400 times. In the photographed image, the area of a portion that was a void was obtained, and the impregnation rate was calculated by the following equation.
Void ratio (%) = 100 × (total area of the part that is a void) / (total area of the observation part of the molded product)
The void ratio of the molded product was evaluated based on the void ratio as a criterion for evaluation in the following three stages, and a value of ○ or higher was regarded as acceptable.
◯: The void ratio is 0% or more and 20% or less. Variations in physical properties of molded products are very small.
○: Void ratio is larger than 20% and 40% or less. Small variations in physical properties of molded products.
X: Void ratio is larger than 40%. The physical properties of molded products vary greatly.

<Preparation of polyphenylene ether ether ketone oligomer (B)>
(Reference Example 1) Production method (a) of polyphenylene ether ether ketone oligomer (B)
In a four-necked flask equipped with a stirrer, nitrogen blowing tube, Dean-Stark device, condenser, thermometer, 4,4′-difluorobenzophenone 2.40 g (11 mmol), hydroquinone 1.10 g (10 mmol), anhydrous potassium carbonate 1.52 g (11 mmol), dimethyl sulfoxide 100 mL, and toluene 10 mL were charged. The amount of dimethyl sulfoxide with respect to 1.0 mole of the benzene ring component in the mixture is 3.13 liters. While passing through nitrogen, the temperature was raised to 140 ° C., held at 140 ° C. for 1 hour, then heated to 160 ° C. and held at 160 ° C. for 4 hours to carry out the reaction. After completion of the reaction, the reaction mixture was cooled to room temperature.

  About 0.2 g of the obtained reaction mixture was weighed, diluted with about 4.5 g of THF, a THF-insoluble component was separated and removed by filtration to prepare a high performance liquid chromatography analysis sample, and the reaction mixture was analyzed. As a result, it was confirmed that five cyclic polyphenylene ether ether ketones having a repeating number m = 2 to 6 were formed, and the yield of the polyphenylene ether ether ketone oligomer (B) with respect to hydroquinone was 15.3%.

  50 g of the reaction mixture thus obtained was collected, and 150 g of a 1% by weight aqueous acetic acid solution was added. After stirring to form a slurry, the mixture was heated to 70 ° C. and stirring was continued for 30 minutes. The slurry was filtered through a glass filter (average pore diameter of 10 to 16 μm) to obtain a solid content. The operation of dispersing the obtained solid content in 50 g of deionized water, maintaining at 70 ° C. for 30 minutes and filtering to obtain the solid content was repeated three times. The obtained solid was subjected to vacuum drying at 70 ° C. overnight to obtain about 1.24 g of a dry solid.

  Furthermore, 1.0 g of the dry solid obtained above was subjected to Soxhlet extraction with 100 g of chloroform at a bath temperature of 80 ° C. for 5 hours. Chloroform was removed from the obtained extract using an evaporator to obtain a solid content. After adding 2 g of chloroform to this solid content, it was added dropwise to 30 g of methanol as a dispersion using an ultrasonic cleaner. The resulting precipitated component was filtered off using a filter paper having an average pore size of 1 μm and then vacuum dried at 70 ° C. for 3 hours to obtain a white solid. The obtained white solid was 0.14 g, and the yield based on hydroquinone used in the reaction was 14.0%.

  This white powder was confirmed to be a compound comprising a phenylene ether ketone unit from the absorption spectrum in infrared spectroscopic analysis, mass spectrum analysis (equipment: Hitachi M-1200H) divided into components by high performance liquid chromatography, and MALDI- From the molecular weight information by TOF-MS, this white powder is found to be a polyphenylene ether ether ketone oligomer (B) mainly composed of a mixture of five cyclic polyphenylene ether ether ketones having a repeating number m of 2-6. It was. The weight fraction of the cyclic polyphenylene ether ether ketone mixture in the polyphenylene ether ether ketone oligomer (B) was 81%. In addition, components other than cyclic polyphenylene ether ether ketone in the polyphenylene ether ether ketone oligomer (B) were linear polyphenylene ether ether ketone oligomers.

  As a result of measuring the melting point of such a polyphenylene ether ether ketone oligomer (B), it was found to have a melting point of 163 ° C. As a result of measuring the reduced viscosity, it was found that the polyphenylene ether ether ketone oligomer (B) had a reduced viscosity of less than 0.02 dL / g.

  Further, in the recovery of the polyphenylene ether ether ketone oligomer (B) by Soxhlet extraction, the chloroform-insoluble solid component was vacuum-dried at 70 ° C. overnight to obtain about 0.85 g of an off-white solid content. As a result of the analysis, it was confirmed that it was a linear polyphenylene ether ether ketone from the absorption spectrum in infrared spectroscopic analysis. As a result of measuring the reduced viscosity, it was found that this linear polyphenylene ether ether ketone had a reduced viscosity of 0.45 dL / g.

(Reference Example 2) Production method (b) of polyphenylene ether ether ketone oligomer (B)
Here, the production method (b) of the polyphenylene ether ether ketone oligomer (B) using the linear polyphenylene ether ether ketone by-produced by the production method of the polyphenylene ether ether ketone oligomer (B) will be described.

  In a 100 mL autoclave equipped with a stirrer, 0.24 g (1 mmol) of 4,4′-difluorobenzophenone, 0.11 g (1 mmol) of hydroquinone, 0.14 g (1 mmol) of anhydrous potassium carbonate were obtained by the method described in Reference Example 1. 1.15 g (4 mmol) of linear polyphenylene ether ether ketone (reduced viscosity; 0.45 dL / g) and 50 mL of N-methyl-2-pyrrolidone were charged. The amount of N-methyl-2-pyrrolidone relative to 1.0 mole of benzene ring component in the mixture is 3.33 liters.

  After the reaction vessel was sealed under nitrogen gas at room temperature and normal pressure, the temperature was raised from room temperature to 140 ° C. with stirring at 400 rpm, held at 140 ° C. for 1 hour, then heated to 180 ° C. and then heated to 180 ° C. for 3 hours. The reaction was carried out by maintaining the time, then raising the temperature to 230 ° C. and holding at 230 ° C. for 5 hours.

  About 0.2 g of the obtained reaction mixture was weighed, diluted with about 4.5 g of THF, a THF-insoluble component was separated and removed by filtration to prepare a high performance liquid chromatography analysis sample, and the reaction mixture was analyzed. As a result, it was confirmed that 7 types of cyclic polyphenylene ether ether ketones having a repetition number m = 2 to 8 were formed, and the yield of the cyclic polyphenylene ether ether ketone mixture was 8.3%.

  Further, the polyphenylene ether ether ketone oligomer (B) was recovered from the reaction mixture by the method described in Reference Example 1. As a result, the polyphenylene ether ether ketone oligomer (B) was obtained in a yield of 8.0%. As a result of analysis of the obtained polyphenylene ether ether ketone oligomer (B), the weight fraction of the cyclic polyphenylene ether ether ketone mixture in the polyphenylene ether ether ketone oligomer (B) was 77%, and the melting point was 165 ° C. It turns out to have. It was also found that the reduced viscosity of the polyphenylene ether ether ketone oligomer (B) was less than 0.02 dL / g.

(Reference Example 3)
Here, it describes about the synthesis | combination according to the manufacturing method of the polyphenylene ether ether ketone by the general method as described in the Example of patent publication 2007-506833.

  In a four-necked flask equipped with a stirrer, a nitrogen blowing tube, a Dean-Stark device, a condenser tube, and a thermometer, 22.5 g (103 mmol) of 4,4′-difluorobenzophenone, 11.0 g (100 mmol) of hydroquinone, and 49 g of diphenylsulfone Was charged. The amount of diphenylsulfone relative to 1.0 mole of benzene ring component in the mixture is about 0.16 liter. When the temperature was raised to 140 ° C. through nitrogen, an almost colorless solution was formed. At this temperature, 10.6 g (100 mmol) of anhydrous sodium carbonate and 0.28 g (2 mmol) of anhydrous potassium carbonate were added. The temperature was raised to 200 ° C and held for 1 hour, raised to 250 ° C and held for 1 hour, then raised to 315 ° C and held for 3 hours.

  As a result of analyzing the obtained reaction mixture by high performance liquid chromatography, the yield of the cyclic polyphenylene ether ether ketone mixture with respect to hydroquinone was less than 1%, which was a trace amount.

  The reaction mixture was allowed to cool, pulverized, and washed with water and acetone to wash away by-product salts and diphenylsulfone. The obtained polymer was dried at 120 ° C. in a hot air dryer to obtain a powder.

  About 1.0 g of the obtained powder was subjected to Soxhlet extraction with 100 g of chloroform at a bath temperature of 80 ° C. for 5 hours. Chloroform was removed from the obtained extract using an evaporator to obtain a small amount of a chloroform-soluble component. The yield of the recovered chloroform-soluble component based on hydroquinone used in the reaction was 1.2%. As a result of analyzing the recovered chloroform soluble component by high performance liquid chromatography, it was found that the cyclic soluble polyphenylene ether ether ketone and linear polyphenylene ether ether ketone oligomer were contained in the chloroform soluble component. . The linear polyphenylene ether ether ketone oligomer is similar to the cyclic polyphenylene ether ether ketone in properties such as solvent solubility and is difficult to separate from the cyclic polyphenylene ether ether ketone. Further, the cyclic polyphenylene ether ether ketone mixture contained in the recovered chloroform-soluble component has a repetition number m = 4, 5 and the weight fraction of the cyclic polyphenylene ether ether ketone having the repetition number m = 4. Accounted for 80% or more. The recovered chloroform soluble component had a melting point of about 320 ° C. This is presumed to be due to the high content of cyclic polyphenylene ether ether ketone tetramer (m = 4) occupying the chloroform-soluble component obtained by this method.

  In the above Soxhlet extraction, a solid component insoluble in chloroform was vacuum-dried overnight at 70 ° C. to obtain an off-white solid content of about 0.98 g. As a result of the analysis, it was confirmed that it was a linear polyphenylene ether ether ketone from the absorption spectrum in infrared spectroscopic analysis. As a result of measuring the reduced viscosity, it was found that this linear polyphenylene ether ether ketone had a reduced viscosity of 0.75 dL / g.

(Reference Example 4) Production method (c) of polyphenylene ether ether ketone oligomer (B)
Here, the production method (c) of cyclic polyphenylene ether ether ketone using the linear polyphenylene ether ether ketone (reduced viscosity; 0.75 dL / g) obtained by the method according to Reference Example 3 will be described.

  A 1 liter autoclave equipped with a stirrer was charged with 14.4 g (50 mmol) of polyphenylene ether ether ketone obtained by the method described in Reference Example 3, 1.52 g (10 mmol) of cesium fluoride, and 500 mL of N-methyl-2-pyrrolidone. It is. The amount of N-methyl-2-pyrrolidone relative to 1.0 mole of benzene ring component in the mixture is 3.33 liters.

  After the reaction vessel was sealed under nitrogen gas at room temperature and normal pressure, the temperature was raised from room temperature to 140 ° C. with stirring at 400 rpm, held at 140 ° C. for 1 hour, then heated to 180 ° C. and then heated to 180 ° C. for 3 hours. The reaction was carried out by maintaining the time, then raising the temperature to 230 ° C. and holding at 230 ° C. for 5 hours.

  About 0.2 g of the obtained reaction mixture was weighed, diluted with about 4.5 g of THF, a THF-insoluble component was separated and removed by filtration to prepare a high performance liquid chromatography analysis sample, and the reaction mixture was analyzed. As a result, it was confirmed that seven consecutive cyclic polyphenylene ether ether ketone mixtures having a repetition number m = 2 to 8 were produced. The yield of the cyclic polyphenylene ether ether ketone mixture was 13.7%. (The yield of the cyclic polyphenylene ether ether ketone mixture here was calculated by comparing the amount of cyclic polyphenylene ether ether ketone produced with the amount of polyphenylene ether ether ketone used in the reaction).

  Further, the polyphenylene ether ether ketone oligomer (B) was recovered from the reaction mixture by the method described in Reference Example 1. As a result, the polyphenylene ether ether ketone oligomer (B) was obtained in a yield of 13.7%. It was found that the weight fraction of the cyclic polyphenylene ether ether ketone mixture in the obtained polyphenylene ether ether ketone oligomer (B) was 79% and had a melting point of 165 ° C. It was also found that the polyphenylene ether ether ketone oligomer (B) was less than 0.02 dL / g.

Example 1
The manufacturing method of a molding material is demonstrated using the apparatus shown in FIG. The apparatus configuration used in this manufacturing method is (i).

  Step (I): A plurality of carbon fiber trading cards (registered trademark) T700S-12K (manufactured by Toray Industries, Inc.) are aligned within a width of 100 mm so that the interval between reinforcing fiber bundles is 1 to 5 mm, and used for the production line. . Roll fiber 1 is leveled by applying a bundle of reinforcing fibers, fed to impregnation bath 2, passed through rotating roller 3 in the impregnation bath, then passed through hot air drying furnace 4, further double belt press 5, heated The chamber 15 and the hot roller 17 are passed in this order, and the nip roller 6 applies tension and pulls it. The take-up speed here is set to 3 m / min, and after the process is stabilized, the reinforcing fiber bundle is heated to 150 ° C. by the preheating infrared heater 7.

  Step (II): The polyphenylene ether ether ketone oligomer (B) prepared in Reference Example 1 was added with a predetermined amount of the polymerization catalyst (C) to form a dispersion, which was supplied to the impregnation bath by the pump 8. As the rotating roller is immersed in the dispersion, the polyphenylene ether ether ketone oligomer (B) and the polymerization catalyst (C) are imparted to the reinforcing fiber bundle. At this time, the length of the reinforcing fiber bundle to be immersed is adjusted so that the weight content (Wf) of the polyphenylene ether ether ketone oligomer (B) and the polymerization catalyst (C) is 64%. Further, the hot air drying furnace 4 is adjusted to 140 ° C. to remove 90% or more of moisture from the reinforcing fiber bundle, and from the reinforcing fiber base (A), the polyphenylene ether ether ketone oligomer (B), and the polymerization catalyst (C). A composite was obtained.

  A double belt press having a length of 4 m in the line direction was used under the conditions of a temperature of 230 ° C. and a pressure of 3 MPa, and the composite was passed while being heated and pressed to reinforce the polyphenylene ether ether ketone oligomer (B). (A) was impregnated by heating to obtain an impregnated body comprising a reinforcing fiber substrate (A), a polyphenylene ether ether ketone oligomer (B) and a polymerization catalyst (C). At this time, nitrogen purge was performed from the air inlet 10 of the chamber 9 surrounding the double belt press, and the oxygen concentration in the chamber was adjusted to 1% by volume or less.

  Step (III): The heating chamber 15 having a length of 30 m in the line direction is used under the condition of a temperature of 400 ° C., and the impregnated body is passed with heating to polymerize the polyphenylene ether ether ketone oligomer (B). Furthermore, it shape | molded on the conditions of 400 degreeC and the pressure of 1 MPa using the hot roller 17, and obtained the polymer which consists of a reinforced fiber base material (A), polyphenylene ether ether ketone (B '), and a polymerization catalyst (C). At this time, nitrogen purge was performed from the air inlet 16 of the heating chamber 15 to adjust the oxygen concentration in the chamber to 1% by volume or less.

  Step (IV): The polymer is passed through the cooling plate 11 having a temperature of 50 ° C., the polyphenylene ether ether ketone (B ′) is solidified, taken up with a nip roll, and then cut into 1 m lengths with a guillotine cutter 12 to obtain a width. A 100 mm sheet-shaped molding material was used.

  All the above steps were performed online, and the molding material could be continuously produced. Polyphenylene ether ether ketone (B ′) was physically separated from the obtained molding material and subjected to melting point measurement, melting enthalpy measurement and viscosity measurement.

  After aligning the fiber direction of the obtained molding material and laminating so that the thickness of the molded product becomes 2 ± 0.4 mm, using a press molding machine, the mold surface temperature is 400 ° C. and the molding pressure is 3 MPa for 3 minutes. After heating and pressurizing, the mold was cooled, and the molded product was demolded to obtain a laminate. A bending test piece was cut out from the obtained laminate and a 0 ° bending test was performed. Table 1 shows the process conditions and evaluation results.

(Example 2)
A molding material was produced in the same manner as in Example 1 except that the heating chamber temperature in the step (III) was changed to 300 ° C. and the take-up speed of the reinforcing fiber substrate (A) was changed to 1 m / min. The obtained molding material was subjected to various evaluations as in Example 1. The molding material obtained here was characterized by higher melting point and melting enthalpy of polyphenylene ether ether ketone (B ′) than Example 1. Each process condition and evaluation result are shown in Table 1.

(Comparative Example 1)
A molding material was produced in the same manner as in Example 1 except that the polyphenylene ether ether ketone oligomer (B) prepared in Reference Example 3 was used. The obtained molding material was subjected to various evaluations as in Example 1. The molding material obtained here had a lower impregnation rate of polyphenylene ether ether ketone (B ′) than that of Example 1, the molded product obtained had many voids, and the mechanical properties were low. This is considered to be because the impregnation of the reinforcing fiber base (A) with the polyphenylene ether ether ketone oligomer (B) was insufficient. Each process condition and evaluation result are shown in Table 1.

(Comparative Example 2)
A molding material was produced in the same manner as in Comparative Example 1 except that the temperature of the double belt press in step (II) was changed to 350 ° C. The obtained molding material was subjected to various evaluations as in Example 1. The molding material obtained here had a relatively high impregnation rate of polyphenylene ether ether ketone (B ′), but it was not an economically preferable method because the temperature of the impregnation step was high and the apparatus load was large. Each process condition and evaluation result are shown in Table 1.

(Comparative Example 3)
In place of the polyphenylene ether ether ketone oligomer (B), VICTREX (registered trademark) PEEK ^™ 151G (polyether ether ketone resin, melting point 343 ° C., manufactured by Victorex MC Ltd.) is used, and the double belt in step (II) A molding material was produced in the same manner as in Example 1 except that the temperature of the press was changed to 400 ° C. The obtained molding material was subjected to various evaluations as in Example 1. The molding material obtained here had a lower impregnation rate of polyphenylene ether ether ketone (B ′) than that of Example 1, the molded product obtained had many voids, and the mechanical properties were low. Furthermore, since the temperature of the impregnation process is high and the load on the apparatus is large, it is not an economically preferable method. Each process condition and evaluation result are shown in Table 1.

  From the examples and comparative examples in Table 1, the following is clear. Since the method for producing the molding material of Examples 1 and 2 uses the polyphenylene ether ether ketone oligomer (B) in the present invention, it is excellent in process temperature and impregnation in the production of the molding material as compared with Comparative Examples 1-3. It is also clear that the molded article using this molding material is excellent in mechanical properties.

(Example 3)
The manufacturing method of a molding material is demonstrated using the apparatus shown in FIG. The apparatus configuration used in this manufacturing method is (ii).

  Step (I): A plurality of carbon fiber trading cards (registered trademark) T700S-12K (manufactured by Toray Industries, Inc.) are aligned within a width of 100 mm so that the interval between reinforcing fiber bundles is 1 to 5 mm, and used for the production line. . A roll of reinforcing fiber is applied to the roll bar 21 and leveled, fed to the belt conveyor 22, further sandwiched between a hot roller 23 having a pair of upper and lower sides, tensioned by a nip roller 24, and taken up by a drum winder 25. The take-up speed here is set to 5 m / min, and after the process is stabilized, the reinforcing fiber bundle is heated to 150 ° C. by the preheating infrared heater 26.

  Step (II): A mixture of the polyphenylene ether ether ketone oligomer (B) and the polymerization catalyst (C) prepared in Reference Example 1 was melted at 230 ° C., and the obtained melt was released into a release paper using a knife coater. A film was produced by applying the film to a predetermined thickness. This film is pulled out on a winder 27 and supplied to a hot roller 28 together with a release paper under the conditions of 230 ° C. and 1 MPa, polyphenylene ether ether ketone oligomer (B) is heated and impregnated into the reinforcing fiber base (A), An impregnated body comprising a reinforcing fiber substrate (A), a polyphenylene ether ether ketone oligomer (B) and a polymerization catalyst (C) was obtained. The release paper was removed by winding it with a winding winder 29. At this time, as a result of measuring the adhesion amount of the polyphenylene ether ether ketone oligomer (B), the fiber weight content (Wf) was 64%.

  Step (III): The temperature of the heating chamber 30 having a length of 50 m in the line direction is set to 400 ° C., and the hot roller 23 is passed through the impregnated material under the condition of a pressure of 0.1 MPa to obtain a polyphenylene ether ether ketone oligomer ( A polymer was obtained by polymerizing B). At this time, nitrogen purge was performed from the air inlet 31 of the heating chamber 30 to adjust the oxygen concentration in the heating chamber to 1% by volume or less.

  Step (IV): The polymer is passed through a cooling plate 32 having a temperature of 50 ° C., the polyphenylene ether ether ketone (B ′) is solidified, taken up by a nip roll, and then wound around a drum winder to obtain a molding material having a width of 100 mm. .

  All the above steps were performed online, and the molding material could be continuously produced. Polyphenylene ether ether ketone (B ′) was physically separated from the obtained molding material and subjected to melting point measurement, melting enthalpy measurement and viscosity measurement.

  After aligning the fiber direction of the obtained molding material and laminating so that the thickness of the molded product becomes 2 ± 0.4 mm, using a press molding machine, the mold surface temperature is 400 ° C. and the molding pressure is 3 MPa for 3 minutes. After heating and pressurizing, the mold was cooled, and the molded product was demolded to obtain a laminate. A bending test piece was cut out from the obtained laminate and a 0 ° bending test was performed. Each process condition and evaluation result are shown in Table 2.

Example 4
A molding material was produced in the same manner as in Example 3 except that the heating chamber temperature in step (III) was changed to 300 ° C. and the take-up speed of the reinforcing fiber substrate (A) was changed to 1.7 m / min. The obtained molding material was subjected to various evaluations as in Example 3. The molding material obtained here was characterized by a higher melting point and melting enthalpy of polyphenylene ether ether ketone (B ′) than in Example 3. Table 2 shows each process condition and evaluation result.

(Comparative Example 4)
Using the polyphenylene ether ether ketone oligomer (B) prepared in Reference Example 3, molding was performed in the same manner as in Example 3 except that the film forming temperature and the hot roller temperature in Step (II) were changed to 350 ° C. The material was manufactured. The obtained molding material was subjected to various evaluations as in Example 3. The molding material obtained here had a lower impregnation rate of polyphenylene ether ether ketone (B ′) than that of Example 3, the molded product obtained had many voids, and the mechanical properties were low. This is presumably because the polymerization of the polyphenylene ether ether ketone oligomer (B) progressed at the time of film formation, and the reinforcing fiber substrate (A) was not sufficiently impregnated. Table 2 shows each process condition and evaluation result.

(Comparative Example 5)
In place of the polyphenylene ether ether ketone oligomer (B), VICTREX (registered trademark) PEEK ^™ 151G (polyether ether ketone resin manufactured by Victorex MC Ltd., melting point 343 ° C.) was used to form a film in the step (II). A molding material was produced in the same manner as in Example 3 except that the temperature and the temperature of the hot roller were changed to 400 ° C. The obtained molding material was subjected to various evaluations as in Example 3. The molding material obtained here had a lower impregnation rate of polyphenylene ether ether ketone (B ′) than that of Example 3, the molded product obtained had many voids, and the mechanical properties were low. Table 2 shows each process condition and evaluation result.

  From the examples and comparative examples in Table 2, the following is clear. Since the method for producing the molding material of Examples 3 and 4 uses the polyphenylene ether ether ketone oligomer (B) in the present invention, it is excellent in process temperature and impregnation in the production of the molding material as compared with Comparative Examples 4 and 5. Also, it is clear that the molded article using this molding material is excellent in mechanical properties.

(Example 5)
The manufacturing method of a molding material is demonstrated using the apparatus shown in FIG. The apparatus configuration used in this manufacturing method is (iii).

  Step (I): A plurality of carbon fiber trading cards (registered trademark) T700S-12K (manufactured by Toray Industries, Inc.) are aligned within a width of 100 mm so that the interval between reinforcing fiber bundles is 1 to 5 mm, and used for the production line. . A roll of reinforcing fiber is applied to the roll bar 41 and leveled, fed to the calendar roll 42, tensioned by the nip roller 43, and taken up by the drum winder 44. The take-up speed here is set to 10 m / min, and after the process is stabilized, the reinforcing fiber bundle is heated to 150 ° C. with the preheating infrared heater 45.

  Step (II): A polyphenylene ether ether ketone oligomer (B) prepared in Reference Example 1 and a predetermined amount of a polymerization catalyst (C) added thereto were pulverized into particles. The particles are dispersed from the quantitative powder feeder 46 onto the reinforcing fiber bundle so that the fiber weight content (Wf) is 64%, and further heated to a temperature of 230 ° C. with an infrared heater 52 to obtain polyphenylene ether. A composite in which the ether ketone oligomer (B) and the polymerization catalyst (C) were fused to the reinforcing fiber base (A) was obtained.

  Step (III): The temperature of the heating chamber 47 is set to 400 ° C., and the composite is passed through a distance of 100 m as a line length while applying tension with the calender roller 42 to thereby obtain the polyphenylene ether ether ketone oligomer (B). A polymer obtained by polymerization was obtained. At this time, nitrogen purge was performed from the air inlet 48 of the heating chamber 47 to adjust the oxygen concentration in the heating chamber to 1% by volume or less.

Step (IV): The polymer is passed through a cooling plate 49 having a temperature of 50 ° C., the polyphenylene ether ether ketone (B ′) is solidified, taken up by a nip roll, and then wound around a drum winder to obtain a molding material having a width of 100 mm. .
All the above steps were performed online, and the molding material could be continuously produced. Polyphenylene ether ether ketone (B ′) was physically separated from the obtained molding material and subjected to melting point measurement, melting enthalpy measurement and viscosity measurement.

  After aligning the fiber direction of the obtained molding material and laminating so that the thickness of the molded product becomes 2 ± 0.4 mm, using a press molding machine, the mold surface temperature is 400 ° C. and the molding pressure is 3 MPa for 3 minutes. After heating and pressurizing, the mold was cooled, and the molded product was demolded to obtain a laminate. A bending test piece was cut out from the obtained laminate and a 0 ° bending test was performed. Each process condition and evaluation result are shown in Table 3.

(Example 6)
A molding material was produced in the same manner as in Example 5 except that the polyphenylene ether ether ketone oligomer (B) prepared in Reference Example 2 was used. The obtained molding material was subjected to various evaluations as in Example 5. Table 3 shows the process conditions and evaluation results.

(Comparative Example 6)
A molding material was produced in the same manner as in Example 5 except that the polyphenylene ether ether ketone oligomer (B) prepared in Reference Example 3 was used and the temperature of the fusion process in Step (II) was changed to 350 ° C. . The obtained molding material was subjected to various evaluations as in Example 5. The molding material obtained here had a lower impregnation rate of polyphenylene ether ether ketone (B ′) than that of Example 5, the molded product obtained had many voids, and the mechanical properties were low. This is presumably because the polymerization of the polyphenylene ether ether ketone oligomer (B) progressed at the time of the fusing step and the impregnation of the reinforcing fiber base (A) was insufficient. Table 3 shows the process conditions and evaluation results.

(Example 7)
A molding material was produced in the same manner as in Example 5 except that the polyphenylene ether ether ketone oligomer (B) prepared in Reference Example 4 was used. The obtained molding material was subjected to various evaluations as in Example 5. Table 3 shows the process conditions and evaluation results.

(Comparative Example 7)
In place of the polyphenylene ether ether ketone oligomer (B), VICTREX (registered trademark) PEEK ^™ 151G (polyether ether ketone resin manufactured by Victorex MC Ltd., melting point 343 ° C.) was used, and the fusion in step (II) A molding material was produced in the same manner as in Example 5 except that the temperature of the process was changed to 400 ° C. The obtained molding material was subjected to various evaluations as in Example 5. The molding material obtained here had a lower impregnation rate of polyphenylene ether ether ketone (B ′) than Examples 5, 6 and 7, and the molded product obtained had many voids and low mechanical properties. Table 3 shows the process conditions and evaluation results.

(Example 8)
A molding material was produced in the same manner as in Example 5 except that the heating chamber temperature in step (III) was changed to 350 ° C. The obtained molding material was subjected to various evaluations as in Example 5. Table 3 shows the process conditions and evaluation results.

Example 9
A molding material was produced in the same manner as in Example 5 except that the heating chamber temperature in step (III) was changed to 300 ° C. and the take-up speed of the reinforcing fiber substrate (A) was changed to 3.3 m / min. The obtained molding material was subjected to various evaluations as in Example 5. The molding material obtained here was characterized by higher melting point and melting enthalpy of polyphenylene ether ether ketone (B ′) than in Example 5. Table 3 shows the process conditions and evaluation results.

(Example 10)
Molded in the same manner as in Example 5 except that the content of the reinforcing fiber base (A) is 76% by weight and the content of the polyphenylene ether ether ketone oligomer (B) in Reference Example 1 is changed to 24% by weight. The material was manufactured. The obtained molding material was subjected to various evaluations as in Example 5. Table 3 shows the process conditions and evaluation results.

  The following is clear from the examples and comparative examples in Table 3. From the results of Examples 5, 6 and 7, the polyphenylene ether ether ketone oligomer (B) in the present invention does not depend on its production method, and the process temperature and impregnation in the production of the molding material as compared with Comparative Examples 6 and 7. It is clear that the molded article using this molding material is excellent in mechanical properties.

  From Examples 8 and 9, the polyphenylene ether ether ketone oligomer (B) in the present invention can be polymerized well even at 350 ° C. and 300 ° C., and these methods are performed at the process temperature in the production of the molding material. It is clear that this is an excellent method.

  From Example 10, according to the method for producing a molding material of the present invention, even when the content of the reinforcing fiber substrate (A) is 76% by weight, the process temperature and the impregnation property in the production of the molding material are excellent. It is clear that the molded article using the molding material is excellent in mechanical properties.

  The method for producing a molding material of the present invention can be easily combined with a reinforcing fiber base material and polyphenylene ether ether ketone, so that it is possible to improve economy and productivity and is useful for producing a molding material.

1, 21, 41: Roll bar 2: Impregnation bath 3: Rotating roller 4: Hot air drying furnace 5: Double belt press 6, 24, 43: Nip roller 7, 26, 45, 52: Infrared heater 8: Pump 9: Chamber 10, 16, 31, 48: Inlet 11, 32, 49: Cooling plate 12: Guillotine cutter 13, 33, 50: Reinforced fiber bundle 14, 34, 51: Molding material 22: Belt conveyor 25, 44: Drum winder 27 : Drawer winder 17, 23, 28: Hot roller 29: Winding winder 15, 30, 47: Heating chamber 42: Calendar roll 46: Fixed powder feeder

Claims (15)

Step (I) of pulling out and continuously supplying the reinforcing fiber base (A),
Step (II) for obtaining a composite by complexing polyphenylene ether ether ketone oligomer (B) with the component (A),
Step (III) of polymerizing the component (B) to polyphenylene ether ether ketone (B ′),
And (IV) a step of cooling and taking out the composite comprising the component (A) and the component (B ′).
A process for producing a molding material comprising the component (B) having a melting point of 270 ° C. or lower. The manufacturing method of the molding material of Claim 1 in which the said component (B) contains 60 weight% or more of cyclic polyphenylene ether ether ketone. The method for producing a molding material according to claim 1 or 2, wherein the component (B) is a mixture of cyclic polyphenylene ether ether ketones having different repeating numbers m. The manufacturing method of the molding material in any one of Claims 1-3 which make a polymerization catalyst (C) complex further in the said process (II). The manufacturing method of the molding material of Claims 1-4 with which said process (I)-(IV) is implemented online. In the said process (II), the said component (B) heat-melted is provided to the said component (A), and is combined, The manufacturing method of the molding material in any one of Claims 1-5. The said process (II) WHEREIN: The said component (B) of the at least 1 sort (s) selected from the group which consists of a particulate form, a fibrous form, and a flake form is provided to the said component (A), and it combines. The manufacturing method of the molding material in any one of -5. The said process (II) WHEREIN: The said component (B) of the at least 1 sort (s) selected from the group which consists of a film form, a sheet form, and a nonwoven fabric form is provided to the said component (A), and it combines. The manufacturing method of the molding material in any one of -5. The manufacturing method of the molding material in any one of Claims 1-8 which superpose | polymerizes in the said process (III) at the temperature of 160 degreeC or more. The method for producing a molding material according to any one of claims 1 to 9, wherein the step (III) further includes a step of applying a pressure of 0.1 to 10 MPa. The manufacturing method of the molding material in any one of Claims 1-10 whose take-up speed of the said process (IV) is 1-100 m / min. Content of the said component (A) when the sum total of the said component (A) and the said component (B) is 100 weight% is 10 weight% or more, The molding material in any one of Claims 1-11 Production method. The method for producing a molding material according to claim 4, wherein the content of the component (C) is 0.001 to 20 mol% with respect to 1 mol of the ether ether ketone structural unit in the component (B). The method for producing a molding material according to any one of claims 1 to 13, wherein the component (A) contains at least 10,000 single fibers of carbon fibers. The method for producing a molding material according to claim 4, wherein the component (C) is an alkali metal salt.

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