JP2012514221A - Electronic paper apparatus and particle addressing method thereof - Google Patents

Abstract

According to the present invention, a mold is formed so as to contact a selected cell among cells of an electronic paper panel, and a desired particle is selected and filled when the mold is filled with the particle, so that the panel is formed from the mold. The present invention relates to an electronic paper apparatus and a particle addressing method thereof for causing selected particles to move and fill in selected cells.
The present invention includes an upper plate and a lower plate of a panel in which cells and cells are defined by partition walls, and a groove is provided in accordance with the cell size only at a portion in contact with a selected cell in the cells of the formed panel. A voltage is applied to the electrodes of the mold thus formed to push the respective particles to fill the grooves in the mold and fill the mold with the desired particles. Select the particles, fill the panel upper plate and panel lower plate with the selected particles from the groove of the mold, and paste the cells of the upper plate and lower plate filled with the selected particles exactly together In order to activate the bonded panel, a voltage is applied to the electrodes of the upper plate and the lower plate.
As a result, the present invention can reduce the filling voltage of the electronic paper panel and can be mass-produced because the process is simpler than other methods, and a vivid image quality and high contrast can be obtained.

Description

  The present invention relates to an electronic paper and a method of filling the electronic paper with particles, and more specifically, a mold is formed so as to contact a selected cell among cells of an electronic paper panel defined by a partition, An electronic paper device and a method for selecting and filling desired particles when filling particles in a mold so that selected particles are moved and filled from the mold to selected cells of the panel. The present invention relates to a particle addressing method.

  In general, electronic paper has a much lower production cost than existing flat display panels, and does not require a backlight or continuous recharging unlike a liquid crystal display element. For this reason, it can drive even with a very small amount of energy, and is excellent in energy efficiency. Furthermore, electronic paper is extremely vivid, has a wide viewing angle, and has a memory function that prevents characters from being completely erased even without a power source.

  Because of these merits, electronic paper can be used in a wide range of fields such as e-books with paper and moving illustrations, self-updating newspapers, reusable paper displays for mobile phones, disposable TV screens and electronic wallpaper. It can be applied to.

  A charged particle type display has a higher response speed and a threshold voltage than a microcapsule type electronic paper, and can therefore be driven by a passive matrix. In particular, since it has an excellent memory effect, an effect of relatively reducing power consumption can be obtained.

  The particle injection method of the charged particle type display which has been commercialized at present is a method of injecting mixed particles having oppositely charged colors of two contrasting colors. For this reason, in order to realize a color image, it is necessary to use a color filter. However, this has the disadvantage that the optical characteristics are lowered, the module is thickened and the flexibility is inferior, and the manufacturing cost is relatively high.

  In the case of injecting black and white particles, a powder coating method is used for uniform application. In this case, since a high voltage of several tens of kilovolts (kV) is applied, charged particles are instantaneously excessive. Negative charge. In order to drive the electronic paper, it is necessary to create particles having a negative charge and a positive charge. However, since an excessive amount of negative charge is created in the injection process, the driving of the electronic paper is also adversely affected.

  In conventional color charged particle injection technology, color charged particles directly injected into the panel display images, so vivid image quality and high contrast are obtained, manufacturing costs are reduced, and gray scale is reduced. This is extremely advantageous for realization. In particular, the existing particle injection method is a method in which particles having opposite charges are mixed at a ratio of 1: 1 and injected into the panel by a physical force, but this has opposite charges. There is a drawback that the driving voltage is relatively high due to repulsive force acting between particles and physical force acting at the time of particle injection.

  For this reason, the particle coating method for realizing electronic paper has a problem that it is difficult to fill the desired cells with the desired particles.

  In order to solve the above-described problems, an object of the present invention is to form a mold so as to contact a selected cell among cells of an electronic paper panel defined by a partition, and fill the mold with particles. For addressing electronic paper panels and electronic paper particles, the selected particles are selected and filled to move and fill the selected cells of the panel from the mold. Dies, electronic paper particle addressing apparatus, electronic paper apparatus and particle addressing method thereof are provided.

  The electronic paper panel according to the present invention for achieving the above-described object is configured such that the selected particles are selected from the plurality of cells by applying voltage from the first mold in which the selected particles are packed in a plurality of grooves. A plurality of cells are formed by a panel upper plate filled with cells and a large number of partition walls, and the selected particles are formed by the application of voltage from the second mold in which the selective particles are packed in a large number of grooves. And a panel lower plate filled in the selected cell.

  Also, a mold for addressing electronic paper particles according to the present invention for achieving the above-described object, a groove into which particles for filling the cells of the electronic paper panel are filled, and the particles are pushed and filled into the grooves. A filling plate and an electrode for applying a power source for filling the grooves with the particles.

  Here, in order to adjust the layer or number of particles filled in the groove, the depth of the groove is adapted to the number or amount of layers.

  On the other hand, the particle addressing apparatus for electronic paper according to the present invention for achieving the above-described object includes a method in which desired particles are filled in a large number of cells formed by barrier ribs, and a voltage for filling the desired particles is applied. A die having an upper plate or a lower plate on which one electrode is disposed, and a groove having a size corresponding to the cell size, provided only at a location that contacts a selected cell among the cells of the panel upper plate or the lower plate. And a second electrode for applying a voltage for filling the groove with the desired particles, and the desired particles filled in the groove are transferred to the selected cell of the panel upper plate or the lower plate. Fill.

  Here, no groove is provided at a location of the mold that abuts the cell not filled with the particles among the cells of the upper plate or the lower plate, and the groove of the mold is the upper plate or the lower plate. Corresponding to the cell size of the plate, the number of grooves in the mold is less than half the number of cells in the upper plate or the lower plate.

  The material of the mold is a material such as a glass plate, plastic, or metal that can be used for manufacturing a display device.

  Further, the mold and the electrodes of the upper plate or the lower plate are indium tin oxide (ITO) or chromium (Cr).

  In addition, a dielectric is further provided on the mold and the electrode of the upper plate or the lower plate.

  Further, an electronic paper device according to the present invention for achieving the above-described object includes a plurality of cells in which selected particles are defined by partition walls by applying voltage from a mold in which selected particles are packed in a plurality of grooves. A plurality of cells are defined by partition walls, and the plurality of cells are precisely aligned with the plurality of cells on the panel upper plate and pasted on the panel upper plate. A panel lower plate filled with a selected cell out of a number of cells in which the selected particles are defined by a partition wall by applying voltage from a mold in which the selected particles are packed in a plurality of grooves. Prepare.

  Further, the particle addressing method of the electronic paper according to the present invention for achieving the above-described object comprises (a) a step of defining cells and cells by partition walls to form an upper plate and a lower plate of the panel, and (b) Forming a mold having a groove in accordance with the cell size only at a position in contact with the selected cell in the cell of the panel; and (c) applying a voltage to the electrode of the mold to Pushing the particles to fill the grooves in the mold with particles; (d) selecting the desired particles while filling the mold with particles; and (e) the particles filled in the mold. A step of filling the upper plate with selected particles, (f) a step of filling the lower plate with selected particles among the particles filled in the mold, and (g) the selected particles. Filled with upper plate and lower plate Comprising the steps of bonding the cells exactly fit, and a step of applying a voltage to activate the (h) the bonded was panels.

  The step (e) and the step (f) may fill the selected particles into different cells of the upper plate and the lower plate.

  The applied voltage in the step (b) or the step (c) may be within a range of 0.1V to 300V.

  In the step (c), a voltage may be applied between the filling plate and the mold when the grooves of the mold are filled with particles.

  In the step (e) and the step (f), a voltage is applied between the upper plate and the lower plate and the mold when the cells of the upper plate or the lower plate are filled with the selected particles. In addition, the selected particles may be filled.

  The step (b) may be formed by adhering a dry film photoresist (DFR) to the upper surface of the glass plate and selectively patterning according to the mold by a sandblast method.

  The step (b) may be manufactured by patterning a photoresist by exposure.

  The step (b) may be formed by patterning using an imprint method.

  In the step (g), the upper plate and the lower plate filled with the particles may be bonded together with a spacer interposed therebetween.

  In the steps (c) and (d), when particles are filled in the mold, desired particles may be selected and filled, and unwanted particles may be filtered.

  In the step (h), after the cells of the upper plate and the lower plate filled with the particles are bonded together, an alternating voltage may be applied to make the driving characteristics of the particles uniform.

FIG. 1 is a diagram showing a configuration of an electronic paper panel according to an embodiment of the present invention. FIG. 2 is a diagram showing a configuration of a mold according to the embodiment of the present invention. FIG. 3 is a diagram illustrating a configuration of a particle addressing apparatus for electronic paper according to an embodiment of the present invention. FIG. 4 is a diagram illustrating a configuration of a particle addressing apparatus for electronic paper according to an embodiment of the present invention. FIG. 5 is a diagram showing a configuration of the electronic paper device according to the embodiment of the present invention. FIG. 6 is a flowchart for explaining an electronic paper particle addressing method according to an embodiment of the present invention. FIG. 7 is a diagram illustrating a process in which cyan particles selected from a mold are filled in a panel upper plate according to an embodiment of the present invention. FIG. 8 is a diagram illustrating a process in which magenta particles selected from a mold according to an embodiment of the present invention are filled in a panel upper plate. FIG. 9 is a diagram illustrating a process of filling the panel upper plate with yellow particles selected from the mold according to the embodiment of the present invention. FIG. 10 is a diagram illustrating a process of filling the panel upper plate with black particles selected from the mold according to the embodiment of the present invention. FIG. 11 is a diagram illustrating a process in which white particles selected from a mold according to an embodiment of the present invention are filled in a panel lower plate.

  The details of the object and technical configuration of the present invention and the operation and effect thereof will be more clearly understood from the following detailed description based on the drawings attached to the specification of the present invention. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a diagram showing a configuration of an electronic paper panel according to an embodiment of the present invention.

  Referring to FIG. 1, an electronic paper panel 100 according to the present invention includes a panel upper plate 110 and a panel lower plate 120.

  The panel upper plate 110 includes a large number of cells 102 formed by a large number of partition walls 101, and includes an electrode 103 that applies a voltage for filling particles in the large number of cells 102.

  Therefore, by applying a voltage via the electrode 103, selected particles packed in a large number of grooves of the mold described later are filled into a selected cell from the large number of cells of the panel upper plate 110 from the mold. .

  The panel lower plate 120 includes a large number of cells 102 formed by a large number of partition walls 101, and includes an electrode 103 that applies a voltage to fill the large number of cells 102 with particles.

  Therefore, by applying a voltage through the electrode 103, the selected particles packed in the large number of grooves of the mold are filled into the selected cell among the large number of cells of the lower panel 120 from the mold.

  FIG. 2 is a diagram showing a configuration of a mold according to the embodiment of the present invention.

  Referring to FIG. 2, a mold 200 for addressing electronic paper particles according to the present invention includes a groove 210 for filling particles 212 to fill the cells 102 of the electronic paper panel 100, and a particle 212 in the groove 210. It is provided with a filling plate 220 that is packed by pressing, and an electrode 230 that applies a voltage for filling the grooves 210 with particles.

  Here, in order to adjust the layer or number of particles 212 filled in the groove 210, the depth of the groove 210 is adjusted to the number or amount of layers.

  Further, the number of grooves 210 of the mold 200 is substantially the same as the type of color particles of the panel upper plate 110, and the grooves 210 of the mold 200 are formed with a predetermined rule.

  Further, the material of the mold 200 is a material capable of manufacturing a display device such as a glass plate 214, plastic, or metal.

  FIG. 3 is a diagram illustrating a configuration of a particle addressing apparatus for electronic paper according to an embodiment of the present invention.

  Referring to FIG. 3, an electronic paper particle addressing apparatus 300 according to the present invention includes a panel upper plate 110 and a mold 200.

  The panel upper plate 110 includes a first electrode 120 that fills a large number of cells 102 formed by the partition walls 101 with desired particles and applies a voltage for filling the desired particles.

  The mold 200 is provided with a groove 210 in accordance with the cell size only at a position where it abuts on a selected cell among the cells of the panel upper plate 110, and an electrode 230 for applying a voltage for filling a desired particle. The groove 210 is filled with desired particles and a voltage is applied through the electrode 230 to fill the selected cells of the panel upper plate 110 with the desired particles in the groove 210.

  Here, the mold 200 is not provided with a groove at a position where it abuts on a cell of the panel upper plate 110 that is not filled with particles, and the groove of the mold 200 has a cell size of the panel upper plate 110. The number of grooves of the mold 200 is equal to or less than half the number of cells of the panel upper plate 110.

  Further, a voltage is applied to the electrode 103 of the panel upper plate 110 and the electrode 230 of the mold 200 to fill the particles in the cells 102 of the panel upper plate 110. At this time, some of the particles remaining after use are blown off by a nitrogen gun (not shown), and the mold 200 is reused to adhere the next particles to the panel upper plate 110 and fill the next cell. .

  FIG. 4 is a diagram illustrating a configuration of a particle addressing apparatus for electronic paper according to an embodiment of the present invention.

  Referring to FIG. 4, an electronic paper particle addressing apparatus 400 according to the present invention includes a mold 200 and a panel lower plate 120.

  The mold 200 is filled with desired particles in a large number of grooves 210, and includes a first electrode 120 for filling the desired particles.

  The panel lower plate 120 is attached to the mold 200 and includes a second electrode 103 that applies a voltage for filling desired particles to a large number of cells 102 defined by the partition walls 101. By applying a voltage to the electrode 230 of the mold 200, the desired particles filled in the grooves of the mold 200 are filled in selected cells of the panel lower plate 120.

Here, the electrodes of the mold 200 and the panel lower plate 120 are indium tin oxide (ITO) or chromium (Cr).
In addition, a dielectric is further provided on the electrodes of the mold 200 and the panel lower plate 120.

  FIG. 5 is a diagram showing a configuration of the electronic paper device according to the embodiment of the present invention.

  Referring to FIG. 5, an electronic paper device 500 according to the present invention includes a panel upper plate 110 and a panel lower plate 120.

  In the case of the panel upper plate 110, a voltage is applied through the electrode of the panel upper plate 110 from the mold 200 in which the selected particles are filled in a plurality of grooves, so that the selected particles become a large number of the panel upper plate 110. The selected cell among the cells is filled.

  In the case of the panel lower plate 120, a large number of cells are defined by partition walls, and the large number of cells are precisely aligned with the large number of cells of the panel upper plate 110 and attached to the panel upper plate 110, and are selected into a large number of grooves. By applying a voltage from the mold 200 filled with the particles through the electrodes of the panel lower plate 120, the selected cells among the many cells of the panel lower plate 120 are filled.

  As shown in FIG. 5, the panel upper plate 110 is filled with white particles 500W in a state where four or more kinds of particles including cyan particles 500C, magenta particles 500M, yellow particles 500Y, and black particles 500B are filled. The panel lower plate 120 is attached.

  As shown in FIG. 5, the panel upper plate 110 filled with four or more kinds of particles and the panel lower plate 120 filled with one kind of particles are bonded together with a spacer 530 interposed therebetween.

  FIG. 6 is a flowchart for explaining an electronic paper particle addressing method according to an embodiment of the present invention.

  Referring to FIG. 6, cells and cells are defined by partition walls with respect to the panel upper plate 110 and the panel lower plate 120 to form the upper and lower panels of the panel (S602).

  A mold 200 having a groove in accordance with the cell size is formed only at a position in contact with the selected cell in the cells of the panel thus formed (S604).

  Here, the mold 200 is formed by adhering a dry film photoresist (DFR) to the upper surface of the glass plate 214 and selectively patterning according to the mold 200 by a sandblast method. The mold 200 may be manufactured by patterning a photoresist by exposure, or may be formed by patterning by an imprint method.

  Next, a voltage is applied to the electrode 230 of the formed mold 200 to push the respective particles to fill the grooves 210 of the mold 200 with the particles, but the desired particles are filled while filling the grooves 210 of the mold 200. Is selected (S606).

  That is, when the particles 212 are filled in the grooves 210 of the mold 200, desired particles are selected and filled, and unwanted particles are filtered.

  At this time, the voltage applied to the electrode 230 is 0.1 V to 300 V, and a voltage is applied between the filling plate 220 and both ends of the mold 200 when the grooves 210 of the mold 200 are filled with particles.

  Next, as shown in FIG. 3, the panel upper plate 110 is filled with selected particles among the particles 212 filled in the mold 200 (S608).

  Here, the mold 200 in which the panel upper plate 110 is filled with particles is the same mold, and all the cells of the panel upper plate 110 need to be filled with arbitrary particles. At this time, every time the particles filled in the mold 200 are filled in the panel upper plate 110, the process of peeling the panel upper plate 110 from the mold 200 and attaching it again is repeated. Further, every time the particles filled in the mold 200 are filled in the panel upper plate 110, the particles are filled into different cells. Note that the particles previously filled in the panel upper plate 110 do not fall due to the memory effect when the next particles are filled, and are not separated even by a weak impact.

  For example, as shown in FIG. 7, after bringing the mold 200 filled with the selected cyan particles 500 </ b> C into contact with the panel upper plate 110, the cyan particles 500 </ b> C are removed from the grooves 210 of the mold 200. As a result, the panel upper plate 110 in which the cyan particles 500C are addressed is obtained. FIG. 7 is a diagram illustrating a process in which cyan particles selected from a mold are filled in a panel upper plate according to an embodiment of the present invention.

  Further, for example, as shown in FIG. 8, after the mold 200 filled with the selected magenta particles 500M is brought into contact with the panel upper plate 110, the magenta particles 500M are transferred from the grooves 210 of the mold 200 to the panel upper plate. As a result, the panel upper plate 110 in which the magenta particles 500M are addressed is obtained. FIG. 8 is a diagram illustrating a process in which magenta particles selected from a mold according to an embodiment of the present invention are filled in a panel upper plate.

  As another example, as shown in FIG. 9, after bringing the mold 200 filled with the selected yellow particles 500 </ b> Y into contact with the panel upper plate 310, the yellow particles are released from the grooves 210 of the mold 200. 500Y is filled in the cells 102 of the panel upper plate 110, and as a result, the panel upper plate 110 in which the yellow particles 500Y are addressed is obtained. FIG. 9 is a diagram illustrating a process of filling the panel upper plate with yellow particles selected from the mold according to the embodiment of the present invention.

  In addition, as shown in FIG. 10, after the mold 200 filled with the selected black particles 500B is brought into contact with the panel upper plate 110, as shown in FIG. The black particles 500B are filled in the cells 102 of the panel upper plate 110, and as a result, the panel upper plate 110 in which the black particles 500B are addressed is obtained. FIG. 10 is a diagram illustrating a process of filling the panel upper plate with black particles selected from the mold according to the embodiment of the present invention.

  On the other hand, selected particles among the particles filled in the groove 210 of the mold 200 are filled in the panel lower plate 120 (S610). That is, the mold 200 filled with particles is attached to the panel lower plate 120, and voltage is applied to the electrode 103 of the panel lower plate 120 and the electrode 230 of the mold 200 to place the selected particles in the cell of the panel lower plate 120. To fill. At this time, a voltage having the opposite polarity to that of the panel upper plate 110 is applied to the electrode 103 of the panel lower plate 120 and the electrode 230 of the mold 200 to fill the selected particles in the cells of the panel lower plate 120.

  For example, as shown in FIG. 11, after the mold 200 filled with the selected white particles 500 </ b> W is brought into contact with the panel lower plate 120, the white particles 500 </ b> W are removed from the grooves 210 of the mold 200. As a result, the panel lower plate 120 in which the white particles 500W are addressed is obtained. FIG. 11 is a diagram illustrating a process in which white particles selected from a mold according to an embodiment of the present invention are filled in a panel lower plate.

  Further, when the selected particles are filled in the panel lower plate 120, the panel lower plate 120 is peeled off from the mold 200.

  Here, as described above, when the panel is filled with selected particles such as the cyan particles 500C, the yellow particles 500Y, the magenta particles 500M, the black particles 500B, and the white particles 500W, the panel upper plate 110 and the panel lower plate 120 Fill different cells.

  Further, when the selected particles are filled in the cells of the panel upper plate 110 and the panel lower plate 120, the selected particles are filled by applying a voltage between the panel upper plate 110 and the panel lower plate 120 and the mold 200. To do.

  Next, as described above, the cells of the panel upper plate 110 and the panel lower plate 120 filled with the selected particles are accurately aligned and bonded together (S612).

  At this time, as shown in FIG. 5, the panel upper plate 110 and the panel lower plate 120 filled with the selected particles may be bonded with a spacer 510 interposed therebetween.

  Further, in order to activate the bonded panel, a voltage is applied to the electrode of the panel upper plate 110 and the electrode of the panel lower plate 120 (S614).

  At this time, after the cells of the panel upper plate 110 and the panel lower plate 120 filled with the selected particles are bonded together, the drive characteristics of the filled particles are made uniform while applying an alternating voltage.

  As described above, according to the present invention, when a mold is formed so as to contact a selected cell among the cells of the electronic paper panel defined by the barrier ribs, Electronic paper panels that allow selected particles to be transferred and filled from the mold to selected cells of the panel by selecting and filling the particles, molds for addressing electronic paper particles, electronic paper A particle addressing device, an electronic paper device, and a particle addressing method thereof can be realized.

  Those skilled in the art to which the present invention pertains can implement the present invention in other specific forms without changing the technical idea and essential features thereof, and thus the above-described embodiments are not limited to all aspects. It should be understood that this is exemplary and not limiting. The scope of the present invention is limited by the following claims rather than the above detailed description, and any changes or modifications derived from the meaning and scope of the claims and equivalent concepts thereof are within the scope of the present invention. Should be interpreted as included.

  INDUSTRIAL APPLICABILITY The present invention is applicable to electronic paper having a memory function that is extremely vivid, has a wide viewing angle, and does not completely erase characters even when there is no power supply.

  In addition, the present invention is far less expensive to produce than a flat display panel and does not require a backlight or a continuous recharge like a liquid crystal display element, so it can be driven with a very small amount of energy. Available for electronic paper devices.

  Furthermore, the present invention is an electronic paper to which an electronic book having a surface such as paper and a movable illustration, a self-updating newspaper, a reusable paper display for a mobile phone, a disposable TV screen and an electronic wallpaper are applied. Available for technology.

  Furthermore, according to the present invention, since desired particles are filled in desired cells of an electronic paper panel, color particles directly injected into the panel display an image, so that vivid image quality and high contrast can be obtained. Available for technology.

Claims (20)

A panel upper plate in which a large number of cells are formed by a large number of partition walls, and the selected particles are filled in a selected cell by applying a voltage from a first mold in which the selective particles are packed in a large number of grooves. When,
Below the panel in which a large number of cells are formed by a large number of partition walls, and the selected particles are filled in a selected cell of the large number of cells by applying a voltage from a second mold in which the selective particles are packed in a large number of grooves. The board,
Electronic paper panel comprising. A groove filled with particles for filling the cells of the electronic paper panel;
A filling plate that pushes and fills the grooves with the particles;
An electrode for applying a voltage for filling the grooves with the particles;
A mold for addressing electronic paper particles comprising:   3. The addressing of electronic paper particles according to claim 2, wherein the depth of the groove is adapted to the number or amount of layers to adjust the layer or number of particles filled in the groove. Mold. An upper plate or a lower plate provided with a first electrode for applying a voltage for filling desired particles into a large number of cells formed by partition walls;
A groove is provided in accordance with the cell size only at a location where the selected cell of the upper plate or the lower plate abuts, and a second electrode for applying a voltage for filling the groove with the desired particle is provided. A mold in which the desired particles are filled in the groove, and a voltage is applied to the second electrode to fill the selected cells in the upper or lower plate with the desired particles in the groove. When,
An electronic paper particle addressing device comprising:   The groove of the mold is the same as the cell size of the upper plate or the lower plate, and the number of grooves of the mold is less than half the number of cells of the upper plate or the lower plate. A particle addressing device for electronic paper according to 1.   5. The particle addressing device for electronic paper according to claim 4, wherein the material of the mold is a material capable of producing a display device such as a glass plate, plastic or metal.   5. The particle addressing apparatus for electronic paper according to claim 4, wherein the mold and the electrodes of the upper plate or the lower plate are indium tin oxide (ITO) or chromium (Cr).   5. The particle addressing apparatus for electronic paper according to claim 4, further comprising a dielectric on the mold and the electrode of the upper plate or the lower plate. A panel upper plate in which selected particles are filled in selected cells among a plurality of cells defined by partition walls by applying voltage from a mold in which selected particles are packed in a plurality of grooves;
A mold in which a large number of cells are defined by partition walls, the large number of cells are precisely aligned with the large number of cells of the panel upper plate and attached to the panel upper plate, and a plurality of grooves are filled with selected particles. A panel lower plate in which the selected particles are filled in a selected cell among a number of cells defined by partition walls by application of a voltage;
An electronic paper device comprising: (A) defining a cell and a cell with a partition wall to form an upper plate and a lower plate of the panel;
(B) forming a mold provided with a groove in accordance with the cell size only at the portion of the cell of the panel that is in contact with the selected cell;
(C) applying a voltage to the electrode of the mold, and pressing each particle to fill the groove in the mold;
(D) selecting desired particles while filling the mold with particles;
(E) filling the upper plate with particles selected from the particles filled in the mold;
(F) filling the lower plate with particles selected from the particles filled in the mold;
(G) accurately aligning and bonding the cells of the upper and lower plates filled with the selected particles;
(H) applying a voltage to activate the bonded panel;
Particle addressing method for electronic paper including   The method of claim 10, wherein the step (e) and the step (f) fill the selected particles in different cells of the upper plate and the lower plate.   11. The particle addressing method for electronic paper according to claim 10, wherein the applied voltage in the step (b) or the step (c) is within a range of 0.1V to 300V.   11. The particle addressing method for electronic paper according to claim 10, wherein in the step (c), a voltage is applied between the filling plate and the mold when the grooves of the mold are filled with particles.   In the step (e) and the step (f), a voltage is applied between the upper plate and the lower plate and the mold when the cells of the upper plate or the lower plate are filled with the selected particles. 11. The electronic paper particle addressing method according to claim 10, further comprising filling the selected particles.   The step (b) is formed by attaching a dry film photoresist (DFR) to an upper surface of a glass plate and selectively patterning according to a mold by a sandblast method. Particle addressing method for electronic paper.   The method of claim 10, wherein the step (b) is performed by patterning a photoresist by exposure.   The method of claim 10, wherein the step (b) is formed by patterning using an imprint method.   11. The particle addressing method for electronic paper according to claim 10, wherein the step (g) includes bonding an upper plate and a lower plate filled with the particles with a spacer interposed therebetween.   11. The step (c) and the step (d) are characterized in that, when particles are filled in the mold, desired particles are selected and filled, and unwanted particles are filtered. Particle addressing method for electronic paper.   The step (h) is characterized in that after the cells of the upper and lower plates filled with the particles are bonded together, the driving characteristics of the particles are made uniform while applying an alternating voltage. Particle addressing method for electronic paper.