JP2012252828A - Method for manufacturing assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an assembly which is more reliably bonded with higher strength, without being limited by a thickness of a bonding material.SOLUTION: A method for manufacturing an assembly 1 obtained by bonding first and second members 2, 3 with a bonding material 4 which is heated and melted by irradiation of heating light 5, includes a step for forming a first bonding material layer 4a on a bonding surface of the first member 2, which is to be bonded to the second member 3, a step for forming a second bonding material layer 4b having absorptivity larger than that of the first bonding material layer 4a with respect to first heating light 5 having a predetermined wavelength on a surface of the first bonding material layer 4a on the opposite side of a surface in contact with the first member 2 or on a bonding surface of the second member 3, which is to be bonded to the first member 2, a step for arranging the first and second members with the first and second bonding material layers 4a, 4b sandwiched between the first and second members 2, 3, and a first heating light irradiation step for irradiating the bonding material 4 from a side of the first bonding material layer 4a with the first heating light 5.

Description

  The present invention relates to a method for manufacturing a joined body in which two members are joined using a joining material that is melted by irradiation with heating light. In particular, the present invention relates to a method for manufacturing a joined body used as an airtight container (envelope) of an image processing display device.

  Flat panel type image display devices such as an organic EL display (OLED), a field emission display (FED), and a plasma display (PDP) are known. These image display apparatuses include an envelope whose internal space is partitioned from the outside. The envelope is an airtight container in which airtightness is ensured, and a device for driving the image display apparatus is disposed inside the airtight container.

  FIG. 6A is a plan view of the hermetic container, and FIGS. 6B to 6E are AA ′ sectional view, BB ′ sectional view, and CC ′ shown in FIG. 6A, respectively. It is sectional drawing and DD 'sectional drawing.

  As shown in FIG. 6, the airtight container 1 is formed by joining a pair of members 2 and 3 that are arranged to face each other. The airtight container 1 is manufactured as follows. That is, the bonding material 4 is annularly applied to the bonding surface of the first member 2 of the pair of members 2 and 3 along the circumference of the member, and the bonding material 4 and the second member 3 are brought into contact with each other. . In a state where the pair of members 2 and 3 are pressed in a direction approaching each other, the bonding material 4 is heated and melted, and then the bonding material 4 is cooled to bond the pair of members 2 and 3.

  As a method of heating the bonding material 4, a pair of members 2, 3 are put into a heating furnace and the whole is baked, or a peripheral portion of the bonding material 4 is locally irradiated by heating light such as laser light. A method of heating is known.

  In patent document 1, the manufacturing method of the envelope of OLED using heating light is disclosed. Fig.7 (a) is a top view which shows the outline of the method of heating the joining material 4 using heating light, and manufacturing the airtight container 1, FIG.7 (b) is EE of Fig.7 (a). 'Cross section.

  In the envelope manufacturing method disclosed in Patent Document 1, first, the bonding material 4 is annularly applied along the circumferential lengths of a pair of members 2 and 3 made of glass plates that are arranged to face each other. When applying the bonding material 4, an interval defining member (not shown) is disposed between the pair of members 2 and 3.

  Next, the heating light 5 is irradiated toward the bonding material 4 from the side of the first member 2 opposite to the side where the second member 3 is located. The heating light 5 passes through the first member 2 and reaches the bonding material 4, the temperature of the bonding material 4 rises, and the bonding material 4 is melted. The light source 6 of the heating light 5 is moved along the bonding material 4 applied in an annular shape, and the entire bonding material 4 is heated to bond the pair of members 2 and 3 together.

  If the thermal expansion coefficients of the pair of members 2 and 3 and the bonding material 4 are different, the pair of members 2 and 3 may be damaged when the bonding material 4 is heated by the heating light 5 and the temperature rises. Therefore, in the method for manufacturing the hermetic container 1 disclosed in Patent Document 1, the thermal expansion coefficients of the pair of members 2 and 3 and the bonding material 4 are limited to substantially equal conditions.

  Patent Document 2 discloses a method of manufacturing an airtight container formed by joining two members having different thermal expansion coefficients using heating light 5. The hermetic container 1 has a first member 2 and a second member that has a thermal expansion coefficient different from that of the first member 2 and is opposed to and spaced from the first member 2. 3 is provided. A bonding material 4 is applied between the first and second members 2 and 3.

  The thermal expansion coefficient of the bonding material 4 used in the manufacturing method disclosed in Patent Document 2 changes from the first member 2 toward the second member 3. The portion of the bonding material 4 adjacent to the first member 2 has a thermal expansion coefficient close to that of the first member 2, and the portion of the bonding material 4 adjacent to the second member 3 is the second. The member 3 has a thermal expansion coefficient close to the thermal expansion coefficient. Therefore, even if the temperature of the bonding material 4 rises due to the irradiation of the heating light 5, the difference due to thermal expansion between the first member 2 and the bonding material 4, and between the second member 3 and the bonding material 4. There is almost no difference due to the thermal expansion of the first and second members 2 and 3, and damage to the first and second members 2 and 3 can be suppressed.

  The method of manufacturing the hermetic container 1 by locally heating the bonding material 4 using the heating light 5 includes heating and cooling time, energy required for heating, productivity, prevention of thermal deformation of the hermetic container 1, and placement inside the hermetic container 1. From the standpoint of preventing thermal degradation of the manufactured device, it is more advantageous than the method of baking the whole.

Special table 2008-517446 gazette JP-A-11-213923

  However, in the method of manufacturing the hermetic container 1 using the heating light 5 disclosed in Patent Document 1 and Patent Document 2, one surface of the bonding material 4 (contacts the first member 2 shown in FIG. 7A). The heating light 5 is irradiated from the surface). Therefore, a difference occurs in the temperature distribution in the direction from the first member 2 to the first member 3 (hereinafter referred to as the thickness direction Z). The temperature of the bonding material 4 on the irradiation side irradiated with the heating light 5 is higher than the temperature of the bonding material 4 on the non-irradiation side opposite to the irradiation side.

  When a temperature difference occurs inside the bonding material 4, cracks are likely to occur due to a difference in thermal shrinkage, and the sealing performance and bonding strength of the bonded portion where the first member 2 and the second member 3 are bonded are reduced. There was a case of decline.

  Furthermore, the temperature on the non-irradiation side of the bonding material 4 does not rise sufficiently, and there is a concern that bonding failure occurs due to insufficient melting of the bonding material 4. When the output of the heating light 5 is increased in order to increase the temperature on the non-irradiation side of the bonding material 4, there is a problem that the irradiation-side member 2 is overheated and damaged.

  The problem caused by the temperature distribution in the bonding material 4 becomes more prominent as the dimension of the bonding material 4 in the thickness direction Z (hereinafter referred to as thickness) increases. Therefore, the thickness of the bonding material 4 is limited in the method of manufacturing the bonded body such as the airtight container 1 using the heating light 5. As a result, it was not possible to increase the thickness of the bonding material 4 in order to increase the sealing performance and strength of the bonded portion where the first member 2 and the second member 3 are bonded.

  Then, this invention aims at providing the manufacturing method of a joined body which can ensure the sealing performance and joining strength of a junction part, even if the thickness of a joining material is thickened.

  The present invention relates to a method of manufacturing a joined body in which a first member and a second member are joined using a joining material that is heated and melted by irradiation with heating light. The step of forming the first bonding material layer on the bonding surface of the first member to be bonded to the second member, and the surface of the first bonding material layer in contact with the first member Absorbance greater than the absorbance of the first bonding material layer with respect to the first heating light having a predetermined wavelength on the opposite surface or the bonding surface of the second member to be bonded to the first member A step of forming a second bonding material layer comprising: a step of disposing the first and second members with the first and second laminated material layers sandwiched between the first and second members; And a first heating light irradiation step of irradiating the first heating light from the first bonding material layer side.

  According to the method for manufacturing a joined body of the present invention, even if the thickness of the joining material is increased, the sealing performance and joining strength of the joined portion can be ensured.

The top view and sectional drawing which show the outline of the manufacturing method of the airtight container 1 which concerns on this invention. The graph which shows the relationship between the wavelength of heating light, and a light absorbency of a joining material. The partially broken perspective view of FED which can apply this invention. The figure which shows the manufacturing method of the airtight container which concerns on a 1st Example. The figure which shows the manufacturing method of the airtight container which concerns on a 2nd Example. The top view and sectional drawing of an airtight container. The top view and sectional drawing which show the outline of the method of heating a joining material using heating light and manufacturing an airtight container.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. The present invention can be applied to the manufacture of an airtight container having a device that needs to be hermetically cut off from the external atmosphere of an image display device such as an FED, an OLED, or a PDP. The present invention can be suitably applied to the manufacture of an airtight container of an image display device including a display element whose performance is deteriorated by inflow of a fluid such as oxygen or water, an electron emitting element used in a reduced pressure space, and a fluorescent film.

  In particular, in an image display apparatus such as an FED in which the interior is a decompressed space, a bonding strength that can resist an atmospheric pressure load generated by a negative pressure in the interior space is required. According to the present invention, the bonding strength is stronger and it is possible to realize more reliable bonding.

  Of course, the present invention is not limited to the manufacture of an airtight container, and can be widely applied to the manufacture of a joined body in which two members are joined using a joining material that melts when irradiated with heating light.

  Fig.1 (a) is a top view which shows the outline of the manufacturing method of the airtight container 1 which concerns on this invention, FIG.1 (b) is F-F 'sectional drawing of Fig.1 (a).

  First, first and second members 2 and 3 made of a glass substrate are prepared.

  The first member 2 may be either one of a pair of glass substrates constituting the hermetic container 1 or sandwiched between a pair of glass substrates at the peripheral edge of the hermetic container 1. It may be a frame member or an interval defining member. Furthermore, the frame member or the interval defining member and the glass substrate may be integrally formed.

  Next, the bonding material 4 is applied to one surface of the first member 2 along the circumferential length of the first member 2. The surface to which the bonding material 4 is applied becomes the bonding surface of the first member 2. As a method of applying the bonding material 4, a method using a dispenser, screen printing, or the like can be used.

  The bonding material 4 includes first and second bonding material layers 4 a and 4 b laminated in the thickness direction Z of the bonding material 4. First, the first bonding material layer 4 a is formed on the bonding surface of the first member 2. Further, the second bonding material layer 4 b is formed on the surface of the first bonding material layer 4 a opposite to the surface in contact with the first member 2.

  For the first and second bonding material layers 4a and 4b, a bonding material that can obtain fluidity when heated and can obtain a fixing function at a low temperature is applicable. That is, a bonding material having a negative temperature dependency of the viscosity can be applied. Examples of the bonding material having a negative temperature dependency of viscosity include glass frit and inorganic adhesive.

  Furthermore, the bonding material applicable to the present invention has a higher absorbance than the first and second members 2 and 3 with respect to the wavelength of the heating light. It is preferable in terms of suppressing heat stress on the skin.

  The thickness of each of the first and second bonding material layers 4a and 4b is preferably about 1 to 15 μm. As the thickness of the first and second bonding material layers 4a and 4b increases, the amount of heating light absorbed by the first and second bonding material layers 4a and 4b increases. When a certain thickness is reached, the heating light irradiated along the thickness direction Z is all within the first bonding material layer 4a located on the irradiation side of the first and second bonding material layers 4a and 4b. Absorbed. If the thickness exceeds the thickness, a region where the heating light does not reach the second bonding material layer 4b located on the non-irradiation side occurs, and bonding becomes difficult.

  The amount of light absorbed by the first and second bonding material layers 4a and 4b is not limited to the above thickness because it depends on the type and absorbance of the bonding material, depending on the type of bonding material used, etc. It can be selected appropriately.

  In the present embodiment, the first and second bonding material layers 4a and 4b have different absorbances with respect to the predetermined wavelength g of the heating light. The absorptance of the first and second bonding material layers 4a and 4b will be described with reference to FIG.

  FIG. 2 is a graph showing the relationship between the wavelength of the heating light and the absorbance of the first and second bonding material layers 4a and 4b. As shown in FIG. 2, the second bonding material layer 4b with respect to the heating light having a predetermined wavelength g is larger than the absorbance of the first bonding material layer 4a with respect to the heating light.

  When the bonding material 4 is applied to the first member 2, the first member 2 is calcined. Note that “temporary firing” as used herein means heating at or below the softening point of the bonding material and at a temperature at which the bonding material does not decompose or crystallize. By performing temporary firing, the binder contained in the bonding material 4 can be extracted from the bonding material 4.

  Next, the first member 2 and the second member 3 are disposed in a state where the bonding material 4 is sandwiched between the first member 2 and the second member 3, and the second bonding material layer 4b and the second member 3 are disposed. 2 members 3 are brought into contact with each other. As a result, the assembly shown in FIG. 1 is formed.

  Subsequently, the assembly is pressed in a direction in which the first and second members 2 and 3 approach each other by pressing means (not shown).

  Examples of the pressing means include mechanical means for pressurizing the first and second members 2 and 3 from the outside via a weighting pin or the like. When the sealed space is formed by the first and second members 2 and 3 and the bonding material 4, the exhaust means for exhausting the gas in the sealed space and the positive pressure that positively pressurizes the pressure around the assembly The means can be used as a pressing means. When the bonding material 4 can be pressurized by the weight of the first or second member 2 or 3 itself, no pressing means is required.

  While maintaining the pressure on the assembly, the heating light 5 is irradiated toward the bonding material 4 from the side of the first member 2 opposite to the side where the second member 3 is located. That is, the heating light 5 is irradiated so that the surface of the first bonding material layer 4a in contact with the first member 2 is irradiated.

  As the heating light 5, a processing semiconductor laser having a wavelength in the infrared region is preferable from the viewpoint of locally heating the bonding material 4 and the transparency of the first and second members 2 and 3.

  When local heating light such as laser is used, the heating region is limited only to the vicinity of the bonding material 4. Therefore, the temperature of the center part of the 1st and 2nd members 2 and 3 can be kept low with respect to a heating area | region. As a result, thermal damage to the device provided on the first or second member 2 or 3 can be minimized.

  By moving the light source 6 of the heating light 5 along the bonding material 4, the entire bonding material 4 is heated and the bonding material 4 is melted. The bonding material 4 melts in a state where the assembly is pressed, so that the bonding material 4 adheres to the first and second members 2 and 3. Thereafter, the bonding material 4 is cooled and solidified, whereby the first and second members 2 and 3 are bonded, and the hermetic container 1 is completed.

  The rise in temperature of the first bonding material layer 4a depends on the amount of light absorbed by the first bonding material layer 4a from the heating light 5. The rise in temperature of the second bonding material layer 4b depends on the amount of light absorbed by the second bonding material layer 4b from the amount of the heating light 5 that has passed through the first bonding material layer 4a.

  In the present embodiment, the extinction coefficient of the first bonding material layer 4a with respect to the heating light having the wavelength g is smaller than the conventional one. Therefore, the amount of light absorbed by the first bonding material layer 4a is smaller than before, and the amount of light passing through the first bonding material layer 4a is larger than before. As a result, a sufficient amount of light reaches the second bonding material layer 4b.

  The light absorption amount of the second bonding material layer 4b with respect to the heating light having the wavelength g is larger than the light absorption amount of the first bonding material layer 4a with respect to the heating light. Therefore, even if it is the light quantity which permeate | transmitted the 1st joining material layer 4a among the heating lights 5, it can fully heat and can melt the 2nd joining material layer 4a.

  In the present embodiment, two types of bonding material layers 4a and 4b are used. However, the present invention does not limit the bonding material layers to two types. It is also possible to stack three or more types of bonding material layers in the thickness direction Z.

  Moreover, the joining material which changes so that the light absorbency of the joining material 4 may become high as it goes to the contact surface with the 2nd member 3 from the contact surface with the 1st member 2 can also be used. By using such a bonding material, the temperature distributed in the thickness direction Z of the bonding material 4 can be adjusted more flexibly.

  In the step of providing the bonding material 4, the member to which the first and second bonding material layers 4 a and 4 b are applied needs to be either one of the first or second members 2 and 3. Absent. That is, the first bonding material layer 4 a is formed on the first member 2, and the second bonding material layer 4 b is formed on the second member 3. Then, the 1st and 2nd members 2 and 3 are arrange | positioned facing each other, and the 1st and 2nd joining material layers 4a and 4b are made to contact.

  Furthermore, the heating light irradiated to the bonding material 4 is not limited to one type. That is, the bonding material 4 may be further irradiated with heating light having a wavelength other than the wavelength g. When two types of heating light are used, is the absorbance of the second bonding material layer 4b for the second heating light equivalent to the absorbance of the first bonding material layer 4a for the second heating light? Choose a smaller value.

  By selecting the first and second bonding material layers 4a and 4b in this way, even if the first and second heating light beams are irradiated from the same side, the first heating light beam is the second bonding material layer. 4b is heated, and the second heating light heats the first bonding material layer 4a. That is, even when the first and second heating lights are irradiated with the assembly mounted on the table, the first and second heating lights can be adjusted by adjusting the respective outputs of the first and second heating lights. The temperature of the second bonding material layers 4a and 4b can be controlled more easily.

  When the bonding material 4 is irradiated with two types of heating light, the second heating light is irradiated before the temperature of the second bonding material layer 4b heated by the first heating light is cooled to the strain point. It is desirable to heat the first bonding material layer 4a. By heating the first bonding material layer 4a before being cooled to the strain point, cracks caused by the temperature difference between the first and second bonding material layers 4a and 4b can be suppressed.

  The light absorption amount E1 absorbed by the first bonding material layer 4a from the first or second heating light and the second transmitted light transmitted through the first bonding material layer 4a of the first or second heating light. It is desirable that the light absorption amount E2 absorbed by the bonding material layer 4b satisfies the following relationship. That is, E1 <E2 for the first heating light and E1> E2 for the second heating light.

  By selecting the heating light and the conditions of the first and second bonding material layers 4a and 4b so as to satisfy such a relationship, the temperature of the first and second bonding material layers 4a and 4b is easily controlled. be able to. The amount of light absorbed by each bonding material layer 4a, 4b is determined by the thickness of the bonding material and the light absorption rate. The setting of the thickness and absorbance of the first and second bonding material layers 4a and 4b and the amount of heating light generated from the light source 6 will be described.

  The absorbance of the first bonding material layer 4a with respect to the first and second heating light is A11, A12, and the absorbance of the second bonding material layer 4b with respect to the first and second heating light is A21, A22. To do. The thicknesses of the first and second bonding material layers 4a and 4b are T1 and T2, and the light amounts of the first and second heating lights generated from the light source 6 are I1 and I2. At this time, with respect to the first heating light,

For the second heating light,

The thickness and absorbance of the first and second bonding material layers 4a and 4b and the amount of heating light generated from the light source 6 may be set so as to satisfy the relationship.

  In the manufacturing method of the airtight container 1 in this embodiment, the irradiation start position of the heating light 5 can be freely selected. When the bonding material 4 is applied so as to draw a rectangular outline as shown in FIG. 1, irradiation may be started from any of the four apex angles of the rectangular shape, or from the side You can also start. What is necessary is just to irradiate heating light so that all the junction parts 4 may be heat-melted.

  Moreover, this invention is not restricted to the joining material 4 apply | coated so that the outline of a rectangular shape may be drawn, You may apply | coat the joining material 4 so that the outline of a polygonal shape or a circular shape may be drawn.

  According to the present invention, since the temperature distribution difference in the thickness direction Z of the bonding material 4 when the bonding material 4 is heated is reduced, the unmelted region of the bonding material 4 is eliminated, and the first and The second members 2 and 3 can be joined. In addition, since the temperature of the first bonding material layer 4a does not increase more than necessary, thermal damage to the first member 2 when the bonding material 4 is heated can be reduced. As a result, the airtight container 1 bonded more reliably can be manufactured without being limited by the thickness of the bonding material 4.

  Hereinafter, specific examples of the present invention will be described in detail. Here, manufacture of a vacuum hermetic container applicable as an envelope for an FED in which a rear plate (first member) including a frame member and an electron-emitting device and a face plate (second member) are joined. A method will be described.

Example 1
A first embodiment will be described with reference to FIGS. 3 and 4. FIG. 3 is a partially broken perspective view of an image display apparatus that can be manufactured using the first embodiment.

  As shown in FIG. 3, the airtight container 1 (envelope) of the image display device 7 includes a glass face plate 8, a rear plate 9, and a frame member 10.

  Each of the frame members 10 is positioned between the flat face plate 8 and the rear plate 9, and forms a sealed space between the face plate 8 and the rear plate 9. Specifically, the face plate 8 and the frame member 10 and the rear plate 9 and the frame member 10 are joined to each other to form an airtight container 1 having a sealed internal space.

  The internal space of the hermetic container 1 is maintained in a vacuum, and spacers 11 that are spacing defining members between the face plate 8 and the rear plate 9 are provided at a predetermined pitch.

  The rear plate 9 is provided with a plurality of electron-emitting devices 12 that emit electrons according to an image signal. In addition, driving matrix wirings (X-directional wirings 13 and Y-directional wirings 14) for operating the respective electron-emitting devices 12 in accordance with image signals are formed on the rear plate 9.

  The face plate 8 positioned opposite to the rear plate 9 is provided with a fluorescent film 15 made of a phosphor that emits light upon receiving irradiation of electrons emitted from the electron-emitting device 12 and displays an image. A black stripe 16 is further provided on the face plate 8. The fluorescent films 15 and the black stripes 16 are alternately arranged.

  A metal back 17 made of an Al thin film is formed on the fluorescent film 15. The metal back 17 has a function as an electrode that attracts electrons, and is supplied with a potential from a high voltage terminal Hv provided in the hermetic container 1. A non-evaporable getter 18 made of a Ti thin film is formed on the metal back 17.

  Next, the manufacturing method of the airtight container 1 which concerns on a 1st Example is demonstrated using FIG. FIG. 4 is a diagram illustrating a method for manufacturing the hermetic container 1 according to the present embodiment.

(Step 1)
First, a rear plate 9 made of a 1.8 mm thick high strain point glass substrate (PD200 manufactured by Asahi Glass Co., Ltd.) was prepared. Matrix drive wiring (not shown) was formed on one side of the rear plate 9, and electron-emitting devices 12 (FIG. 3) were formed at each matrix intersection of the matrix drive wiring.

  Thereafter, the frame member 10 made of PD200 was joined to the peripheral edge of the rear plate 9. The dimension in the thickness direction Z of the frame member 10 was 1.5 mm, and the thickness of the frame member 10 in the direction perpendicular to the thickness direction Z was 4 mm. A bonding material 19 made of glass frit was used as a material for bonding the frame member 10 and the rear plate 9.

As the glass frit, a paste in which a Bi-based lead-free glass frit having a thermal expansion coefficient α = 79 × 10 ⁻⁷ / ° C., a transition point 357 ° C. and a softening point 420 ° C. is used as a base material, and an organic substance is dispersed and mixed is used. It was. The bonding material 19 adjusted in this way was applied on the first member 2 so as to surround the electron-emitting device 12 (FIG. 3).

  The bonding material 19 was formed on the rear plate 9 by screen printing. The bonding material 19 was applied, and the frame member 10 and the rear plate 9 were brought into contact with each other, and these were temporarily fired and main-fired in a heating furnace, and the rear plate 9 and the frame member 10 were bonded.

  In joining the rear plate 9 and the frame member 10, the width of the joining material 19 is 1 mm, the thickness is 10 μm, the length of the relatively long side is 800 mm, and the length of the relatively short side is 450 mm. Formed in shape.

(Step 2)
Next, a step of preparing the face plate 8 was performed. First, the first bonding material layer 4a was formed in a rectangular shape on the face plate 8 with the same size as the bonding material 19 formed in Step 1. The first bonding material layer 4a was adjusted so that the absorbance was 38.3% with respect to the heating light having a wavelength of 980 nm. The width and thickness of the first bonding material layer 4a were 1 mm and 5 μm, respectively.

  Subsequently, a second bonding material layer 4b different from the absorbance of the first bonding material layer 4a with respect to the heating light having a wavelength of 980 nm is prepared, and the first bonding material layer 4a is brought into contact with the face plate 8. The second bonding material layer 4 b was laminated on the surface opposite to the surface on which the bonding material 4 was formed. The second bonding material layer 4b was prepared so that the absorbance was 92.0% with respect to the heating light having a wavelength of 980 nm.

  Thereafter, the face plate 8 was temporarily fired at 460 ° C. for 30 minutes.

(Step 3)
Next, the surface of the face plate 8 on which the bonding material 4 was formed and the surface of the rear plate 9 on which the frame member 10 was bonded face each other, and the bonding material 4 and the frame member 10 were brought into contact with each other. At this time, the face plate 8 and the rear plate 9 were pressed with a load of about 60 kPa.

  The face plate 8 is previously formed with a phosphor (not shown), a black matrix, and an anode. The arrangement of the phosphors was a pixel arrangement corresponding to the arrangement of the electron-emitting devices 12 (FIG. 3) on the rear plate 9.

(Step 4)
Next, the assembly made up of the face plate 8, the rear plate 9, and the frame member 10 was irradiated with laser light 20 as heating light. The irradiation method of the laser beam 20 will be described below.

  A laser light head 21 was used as a light source of the laser light 20, and the laser light head 21 was used on a breadboard (not shown). The breadboard was moved relative to the bonding material 4 so that the entire bonding material 4 was irradiated.

  The laser beam 20 was irradiated under the following irradiation conditions. The laser beam 20 from the laser beam head 21 has a wavelength of 980 nm, a laser power of 212 W, an effective diameter of 2 mm, and the laser beam head 21 was scanned at a speed of 1000 mm / s. As the output of the laser beam 20, laser power adjusted in advance so that the temperature of the bonding material 4 becomes 700 ° C. was used.

Here, the effective diameter of the laser beam 20 was set within a beam irradiation range showing an intensity of e ⁻² (e is a natural logarithm) times the peak intensity.

  As described above, a continuous joint portion was formed between the frame member 10 on the rear plate 9 and the face plate 8 to complete the hermetic container 1. Next, the gas inside the completed airtight container 1 was exhausted to complete the envelope of the FED. When the completed FED is operated, stable electron emission and image display are possible for a long time, and the completed envelope is confirmed to have stable airtightness and strength applicable to the FED. confirmed.

(Example 2)
In Example 2, as shown in FIG. 5, the airtight container 1 was manufactured using two types of heating light. FIG. 5 is a diagram illustrating a method for manufacturing the airtight container 1 according to the present embodiment.

  First, the rear plate 9 to which the frame member 10 was joined was prepared in the same manner as in Example 1. Next, first and second bonding material layers 4a and 4b were formed on the face plate 8 in the same manner as in Example 1. In the present embodiment, the first bonding material layer 4a is adjusted so that the absorbance is 38.3% with respect to the heating light having a wavelength of 980 nm and the absorbance is 90.1% with respect to the heating light having a wavelength of 380 nm. did. The second bonding material layer 4b was prepared such that the absorbance was 92.0% with respect to heating light with a wavelength of 980 nm and the absorbance was 92.7% with respect to heating light with a wavelength of 380 nm. Then, temporary baking for 30 minutes was performed at 460 degreeC.

  Next, the rear plate 9 to which the frame member 10 was bonded and the face plate 8 on which the first and second bonding material layers 4a and 4b were formed were arranged to face each other to form an assembly. The assembly arranged oppositely was pressed in the same manner as in Example 1 and irradiated with heating light. A method of irradiating the heating light will be described below.

  In this embodiment, two types of laser beams 20a and 20b are used as heating light. The distance between the first laser beam head 21a that irradiates the first laser beam 20a and the second laser beam head 21b that irradiates the second laser beam 20b is set to 20 mm, and these are arranged on a breadboard (not shown). . The interval between the irradiation positions of the first and second laser beams 20a and 2b was 20 mm.

  The breadboard was moved relative to the bonding material 4 so that the entire bonding material 4 was irradiated. The breadboard was moved so that the bonding material 4 was irradiated with the second laser beam 20b following the first laser beam 20a.

  The first and second laser beams 20a and 20b were irradiated under the following irradiation conditions. The wavelength of the second laser beam 20b from the second laser beam head 21b having the wavelength of 980 nm, the laser power of 212 W, and the effective diameter of 2 mm, which is the first laser beam 20a from the first laser beam head 21a. 380 nm, laser power 212 W, and effective diameter 2 mm.

  The scanning speed of the first and second laser light heads 21a and 20b was set to 1000 mm / s. Since the distance between the first and second laser light heads 21a and 20b is 20 mm, the second laser light 20b passes through the portion through which the first laser light 20a has passed 0.02 seconds later. That is, the interval between the first irradiation step of irradiating the first laser beam 20a and the second irradiation step of irradiating the second laser beam 20a is 0.02 seconds.

  Further, as the power of the first and second laser beams 20a and 20b, laser power adjusted in advance so that the temperature of the bonding material 4 becomes 700 ° C. by irradiation of the first and second laser beams 20a and 20b. Was used.

  As described above, continuous joints were formed between the rear plate 9 and the frame member 10 and between the frame member 10 and the face plate 8 to complete the hermetic container 1. Next, the gas inside the completed airtight container 1 was exhausted to complete the envelope of the FED. When the completed FED is operated, stable electron emission and image display are possible for a long time, and the completed envelope is confirmed to have stable airtightness and strength applicable to the FED. confirmed.

DESCRIPTION OF SYMBOLS 1 Airtight container 2 1st member 3 2nd member 4 Joining material 4a 1st joining material layer 4b 2nd joining material layer 5 Heating light

Claims (5)

A method for manufacturing a joined body in which a first member and a second member are joined using a joining material that is heated and melted by irradiation with heating light, wherein the first member is joined to the second member. Forming a first bonding material layer on the bonding surface;
A predetermined wavelength is applied to the surface of the first bonding material layer opposite to the surface in contact with the first member, or the bonding surface of the second member to be bonded to the first member. Forming a second bonding material layer having an absorbance greater than that of the first bonding material layer with respect to the first heating light having:
Disposing the first and second members with the first and second bonding material layers sandwiched between the first and second members;
A first irradiation step of irradiating the first heating light from the first bonding material layer side. The absorbance of the second bonding material layer with respect to the second heating light having a wavelength different from that of the first heating light corresponds to the absorbance of the first bonding material layer with respect to the second heating light. Value to be less than or equal to
The manufacturing method of the joined body according to claim 1, further comprising a second irradiation step of irradiating the second heating light from the side irradiated with the first heating light after the first irradiation step. .   The second irradiation step is performed according to claim 2, wherein the second irradiation step is performed before the temperature of the second bonding material layer heated in the first irradiation step is cooled to the strain point of the second bonding material layer. Manufacturing method of joined body.   The amount of light absorbed by the first bonding material layer from the first and second heating lights is E1, and the transmitted light transmitted through the first bonding material layer of the first and second heating lights. When E2 is the amount of light absorbed by the second bonding material layer, E1 <E2 with respect to the first heating light irradiation in the first irradiation step, and the second irradiation step in the second irradiation step. 4. The method for manufacturing a joined body according to claim 2, comprising irradiating the first and second heating lights so as to satisfy E1> E2 with respect to the irradiation of the second heating light. 5. It is a manufacturing method of the joined object given in any 1 paragraph of Claims 1 thru / or 4,
The joined body is an airtight container;
The first and second members are a pair of substrates constituting the hermetic container;
A method for manufacturing a joined body having a sealed space defined by the pair of substrates and the first and second joining material layers.

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