JP2012247305A - Inter-layer peeling inspection device for plastic card and peeling inspection method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for inspecting an inter-layer peeling force of each layer of various magnetic cards and IC cards having a multilayer configuration in which at least three plastic film layers including a plastic card base material layer are laminated, and to provide a method and device for achieving the inspection and evaluation of the inter-layer peeling force with high reproducibility and high efficiency without leaving any scratch or any binder on the surface of the card as the laminate.SOLUTION: The top end of a tracer member is butted between the base material layer of a plastic card and a plastic film layer laminated on this, and continuously pressed in parallel with a press pressure within a certain range while a certain fixed angle above the plastic card is maintained. When the press pressure is stronger than the above mentioned inter-layer adhesive force and adhesion, the top end of the tracer is stuck into the adhesive layer which exists between the layers so that only the plastic film layer laminated on this can be peeled.

Description

  The present invention relates to a method and an apparatus for inspecting the peeling force between layers of cards manufactured in a multilayer structure (lamination) such as a plastic magnetic card and an IC card.

  Conventionally, magnetic cards and IC cards, etc., which are constructed by laminating plastic materials for credit cards and cash cards in multiple layers, peel off within the expiration date, or float between the card layers, making it difficult to hit the machine Trouble may occur.

  Peeling between the layers of these cards and floating between the layers of the cards themselves are not fatal damage, but in fact, if the magnetic recording layer or IC chip is damaged like a magnetic card or IC card Will be fatal damage.

  Therefore, in the case of a magnetic card and an IC card having a structure in which plastic materials are laminated in multiple layers, it is necessary to inspect non-destructively if the adhesive strength and adhesive strength between layers are possible.

  As a test method for evaluating the adhesion strength of a thin film layer to a transparent substrate, there are a cross cut method, a cross cut tape method, and an X cut tape method as methods defined in JIS and K5400. There are also bending tests in the standards of JIS, ASTM and ISO. A proposal for quantitatively and efficiently performing such a method has been made by Patent Document 1 or the like.

  Among the conventional test methods, the cross cut method is a method in which cuts that penetrate the film on the test piece and reach the substrate surface are formed in a checkered pattern, and the adhesion state of the film is visually observed. However, visual observation of the adhesion state around the cut is not quantitative, and it is difficult to discriminate and observe even subtle differences in adhesion.

  In the cross cut tape method, a cut reaching the base material surface through the film on the test piece is made in a cross cut, and an adhesive tape is applied on the cross cut, and the thin film layer and the adhesive tape are adhered by rubbing with an eraser. This is a method of visually observing the adhesion state of the thin film layer after peeling off the adhesive tape. However, in this method, when rubbing with an eraser in order to obtain adhesion between the thin film layer and the adhesive tape, the brittle film itself causes layer breakage, and it is impossible to accurately measure the adhesion of the thin film layer. is there. In addition, since the test method includes many artificial factors, there is a disadvantage that the test method itself and the measurement result are poorly reproducible.

  In addition, the X-cut tape method penetrates the thin film layer on the test piece, attaches an X-shaped cut reaching the substrate surface with a cutter knife, attaches an adhesive tape thereon, peels it off, and the substrate, or This is a method for examining the superiority or inferiority of adhesion to a thin film layer. However, this method is not quantitative as the cross cut method and cross cut tape method, and there is a risk of damaging the film when rubbed with an eraser to obtain close contact with the adhesive tape. Has the disadvantages.

  Also, as shown in FIGS. 7 and 8, an adhesive tape (21) such as a cellophane tape is adhered to the plastic card (20), and then the adhesive tape (21) is peeled off to remove the card base (20). There is also an adhesive tape peeling inspection method to confirm the presence or absence of peeling of the oversheet (23) laminated on the oversheet (23) and the card base (22) rather than the adhesive strength of the adhesive tape (21). When the adhesive force between them is large, the oversheet (23) is not peeled off. On the contrary, when the adhesive force of the adhesive tape (21) is larger, the oversheet (23) is peeled off.

  In other words, in the method using this adhesive tape (21), since peeling evaluation and inspection are performed with a peeling force that is directly attached to the surface of the laminated sheet and peeled off, in magnetic cards and IC cards, etc. When the adhesive component of the agent remains on the surface and it is desired to accurately inspect, it is necessary to stabilize the adhesive strength of the tape to be used, and also stabilize the peeling operation itself of peeling by attaching the adhesive tape (21). This is what you need.

  In other words, the method using the adhesive tape (21) is merely a comparison with the adhesive force of the adhesive tape (21), and the adhesive force, the adhesive force, and the adhesive force deviating from the range of the adhesive force of the adhesive tape (21). Is difficult to measure.

  The bending test will be described by taking a four-point bending test shown in FIG. 9 of the conventional method of the invention according to Patent Document 2 as an example. The test piece (33) to which the strain gauge (36) is attached is supported by two lower fulcrums (35), a load is applied in the lower direction of the drawing by the upper fulcrum (34), and the peeled state is obtained by an optical microscope (35). The strain (curvature radius) of the test piece (33) at that time is measured. This method is a non-contact test, and the state of peeling of the thin film layer (32) can be observed without touching the film. However, in the measurement of the test piece (33) having a thin test piece (33) and a small radius of curvature at which peeling occurs, the fulcrum interval becomes narrow, and there is a problem that observation and control of the fulcrum interval are difficult.

  As shown in FIG. 11, the invention according to Patent Document 2 includes a thin film layer (45) of a laminate having one or more thin film layers (45) on one side of a flexible transparent substrate (44). In the adhesion strength evaluation method, the test piece (46) formed by bending the laminated body (46) with the thin film layer (45) on the inside is formed into the apparatus for the accelerated deterioration test of the thin film layer (45). Then, after completing the accelerated deterioration test under the predetermined test conditions, the test piece (46) in which delamination was observed was selected by observing and evaluating the delamination state of the thin film layer (44) in the curved portion. The adhesion strength is evaluated numerically using the distance value of the radius of curvature of the curved portion of the test piece (46).

  In the invention according to Patent Document 2, as shown in FIG. 10, the bending portion is formed using a jig (40) having an observation window (41) having a predetermined curvature. The test piece (46) is fixed along the curved surface, and the curved portion is formed with the thin film layer (45) inside, and the peeled state is observed with an observation window ( 41) through which the peeled state of the thin film layer (45) of the test piece (46) in the curved portion is observed.

  In the invention according to Patent Document 2, the sample piece (46) is a group consisting of a plurality of pieces having the same radius of curvature. The group is put into a deterioration acceleration test, and the deterioration acceleration test is performed under a predetermined condition. After completion, the peeling state of the thin film layer (45) is observed at the same time.

  In the invention according to Patent Document 2, the sample piece (46) is a group consisting of a plurality of types having different radii of curvature. The group is put into a deterioration acceleration test, and the deterioration acceleration test is performed under a predetermined condition. After completion, the peeling state of the thin film layer (45) is observed at the same time.

That is, in the invention according to Patent Document 2, the thin film layer (45) forming surface of the laminate is bent and fixed inward, and several types of curvatures are prepared for the deterioration acceleration test, and the thin film is obtained by the optical microscope (42). By judging numerically using the radius value of the curvature when the layer (45) is peeled off, it is efficient and simple without touching the surface of the laminate and the thin film layer (45). The adhesion strength between the transparent substrate (44) and the thin film layer (45) can be measured, and the obtained measurement results can quantitatively indicate a minute difference in the adhesion strength as the magnitude of the radius of curvature. That's it.

  However, with the method according to Patent Document 2, it is possible to evaluate the resistance against the accelerated deterioration test in the test piece (46) state, but it cannot be used in the inspection process immediately after the product is completed. In addition, since it is fixed to the bending jig (4) and the shape is changed, it is not suitable for the inspection in the production of products such as magnetic cards and IC cards in which appearance is important, and all inspections necessary for production are performed. This is very difficult in terms of work man-hours.

  The invention according to Patent Document 3 is an apparatus for evaluating the peelability of a laminated sheet, which clamps and fixes one end portion in the longitudinal direction of a test piece made of the laminated sheet and the other end portion of the test piece A movable chuck that is movable, a moving chuck guide base that defines a moving direction of the moving chuck and that can move the moving chuck in the longitudinal direction of the test piece, and a tensile force in the longitudinal direction of the test piece. The test piece is moved along the longitudinal direction by a load mechanism that applies a predetermined force to the moving chuck, a first roller that contacts one surface of the test piece, and a second roller that contacts the other surface. An ironing unit having a pair of ironing rollers that are bent and deformed at two locations; and a drive mechanism for reciprocating the ironing unit. A release evaluation apparatus and the method of the laminated sheet, which is a possible evaluation of the peelability pieces.

  That is, in the invention according to Patent Document 3, the laminate sheet peelability evaluation apparatus peels the laminate sheet by squeezing the test piece, and evaluates the peelability of the laminate sheet by the number of reciprocations of the rollers required for peeling the test piece. Therefore, the work becomes simple even at the on-site operation level.

  However, in the invention according to Patent Document 3, the laminate sheet is ironed with two rollers, and the peelability is evaluated based on the load of ironing and the number of times of ironing when the laminate sheet peels off. That is, even in this method, evaluation in a test piece state is possible, but it is difficult to perform a peeling inspection in a product state of a small-cut product such as a magnetic card and an IC card.

JP 05-182255 A JP 2005-315684 A JP 2010-127623 A

  The present invention has been made in view of the above-mentioned problems, and the object of the present invention is to separate the card layers from each other in a multilayer structure (lamination) such as a plastic magnetic card and an IC card. With regard to the inspection method and equipment, the peel strength and adhesion between layers can be evaluated efficiently with good reproducibility without scratching the surface of the card that is a laminate or leaving an adhesive. It is to provide a method and an apparatus for inspecting and evaluating peeling force and adhesion between laminates.

The invention of claim 1 is an apparatus for inspecting the peeling force between the layers of each layer of various magnetic cards and IC cards comprising a multilayer structure in which at least three plastic films are laminated, including a plastic card base layer,
A stage for placing the card and maintaining the level for the peeling test;
A positioning mechanism for holding and fixing the card at a predetermined position of the stage;
A stylus member pressed between the layers of the card;
Holding the stylus member, comprising a stress relief spring on the stylus member;
A jig A capable of translating and sliding the stylus member in the longitudinal direction;
Holding the jig A, using a lever provided on the upper part of the jig A,
A jig B that can slide and move the jig A with a certain angle upward relative to the stage;
A device for inspecting the peeling force between the layers of the card.

According to a second aspect of the present invention, the tip of the stylus of the stylus member has a tip angle variable within a range of 30 ° to 60 °, a tip R variable within a range of 0.01 mm to 0.05 mm, The width of is variable within a range of 4 mm to 5 mm,
The pressing pressure and the pressing angle when the leading end is pressed between the layers of the card to perform the peeling inspection are variable in the range of the pressing angle of 30 ° to 60 °, and variable in the range of the pressing pressure of 2N to 5N. The apparatus for inspecting the peeling force between the layers of the card according to the invention of claim 1.

  According to a third aspect of the present invention, a stress relief spring provided on the stylus member of the jig A when the pressing force with which the tip of the stylus presses between the layers of the card becomes 6N or more. 3. The apparatus for inspecting the peeling force between the layers of the card according to claim 1, wherein the stylus member is moved in parallel in the longitudinal direction. is there.

  According to a fourth aspect of the present invention, there is provided a method for inspecting the peeling force between the layers of the card using the apparatus according to any one of the first to third aspects of the present invention.

  The present invention uses a device for inspecting the peeling force between layers of various layers of a magnetic card and an IC card having a multilayer structure in which at least three layers of plastic films including a plastic card base layer are laminated, It provides a method and an apparatus that can perform and evaluate the peel force between layers efficiently and with good reproducibility without scratching the surface of the card as a body or leaving an adhesive. is there.

  The tip of the stylus according to the invention of claim 1 is formed between the base layer of the plastic card and the plastic film layer laminated thereon, that is, the extreme end of the interface of the base layer of the plastic card. Pressing against the cross section of the boundary of the end of the plastic film layer laminated on it, keeping a certain angle above the plastic card, with a pressure in the range of 2N-5N If the pressing force is higher than the adhesive force and adhesion between the base layer of the plastic card and the plastic film layer laminated thereon, the tip of the stylus will be Can be pierced into the adhesive layer present and only the plastic film layer laminated thereon can be peeled off.

  On the other hand, when the adhesive force between the base layer of the plastic card and the plastic film layer laminated thereon is greater than the pressing force at the tip of the stylus, the jig The pressure of the stress relief spring provided on the stylus member of A is released, and the tip of the stylus cannot advance forward, and the stylus member including the tip portion in the vertical direction It happens to be slid by translation.

In other words, when the adhesion or adhesion between the layers is weak, the tip of the stylus moves forward and peels off the upper layer, but when the adhesion or adhesion between the layers is strong, scratching, peeling or destruction does not occur. In addition, since the tip of the stylus is moved in the vertical direction, it is possible to easily determine the adhesion and adhesion between the layers in a short time.

  In addition, the method of the present invention is not a relative peel force test like the above-mentioned adhesive tape, but an absolute peel force test that can be measured within a pressure range of 2N to 5N. It has an effect that a highly reliable inspection can be performed in the production line.

FIG. 1A is a schematic cross-sectional schematic view of a delamination inspection apparatus for a plastic card (14) of the present invention. FIG. 1B is a schematic enlarged cross-sectional view of the stylus member (5) and the jig B (8) of the jig A (6) of FIG. FIG. 2 (a) shows the start of the peeling inspection on the card (14) as the object to be inspected by the delamination inspection apparatus for the plastic card (14) of the present invention, and the upper layer (3) of the card is peeled off. 1 is a schematic cross-sectional schematic view of a scene. 2B is a schematic enlarged cross-sectional view of the stylus member (5) and the jig B (8) of the jig A (6) of FIG. 2 (a). FIG. 3 is a schematic plan view of the entire delamination inspection apparatus for the plastic card (14) of the present invention. FIG. 4 is a schematic enlarged cross-sectional view of the stylus member (5) and the jig B (8) of the jig A (6) before the delamination inspection of the plastic card (14) of the present invention. FIG. 5 is a schematic enlarged cross-sectional view of the stylus member (5) and the jig B (8) in the delamination phenomenon due to the interlayer adhesion force and adhesion failure after the start of delamination inspection of the plastic card (14) of the present invention. It is. That is, it is a schematic cross-sectional view showing a phenomenon that occurs in the case of abnormal adhesive coating. FIG. 6 is an enlarged schematic cross-sectional view of the stylus member (6) and the jig B (8) in a phenomenon caused by normal adhesion between layers after the start of delamination inspection of the plastic card (14) of the present invention. is there. That is, FIG. 6 is a schematic cross-sectional view showing a phenomenon that occurs when adhesive coating is normal, and when peeling does not occur between the card layers, the stylus member (5) of the jig A (6). If the jig B (8) is subjected to a certain stress, the jig B (8) is not translated in the Y-axis direction (15), and the spring (13) of the jig A (6) is pushed up. The stylus member (5) of the jig A (6) and the jig B (when the parallel movement occurs in the upward direction of A (6), that is, in the X-axis direction (16), and ascends in the vertical direction. It is a cross-sectional enlarged schematic diagram of 8). FIG. 7 (a) shows an adhesive tape (21) such as a cellophane tape adhered to a conventional plastic card (20), and then the adhesive tape (21) is peeled off, and the top of the card substrate (22). It is a schematic plan view when the adhesive tape (21) is brought into close contact with the plastics card (20) in the adhesive tape peeling inspection method for confirming the presence or absence of peeling of the oversheet (23) laminated on the sheet. Fig. 7 (b) is a schematic cross-sectional view of Fig. 7 (a), when the adhesive tape (21) is closely attached to the end of the card surface and pasted from the end of the card with 10 to 20mm as a grip allowance. FIG. FIG. 8 is a view of fixing the card (20) in FIGS. 7 (a) and 7 (b), grasping the gripping of the adhesive tape (21) taken out from the end of the card (20), and 90 ° to the card. It is a schematic cross-sectional schematic diagram when pulling up and peeling off at an angle of 1000 mm / sec. FIG. 9 (a) is an explanatory diagram taking the conventional four-point bending test of the invention according to Patent Document 2 as an example, and a test piece (33) with a strain gauge (36) attached to two lower fulcrums (35). ), A load is applied in the lower direction of the drawing by the upper fulcrum (34), and a schematic plan view when the peeled state and the distortion (curvature radius) of the test piece (33) at that time are measured by the optical microscope (35). It is. FIG. 9B is a schematic cross-sectional view of the test piece (33) that is the laminate of FIG. 9A. FIG. 10A is a schematic sectional side view of the curvature holding jig (40) of the test piece in the invention according to Patent Document 2. FIG. 10 (b) is a schematic plan view of the curvature holding jig (40) of FIG. 10 (a) viewed from above. (41) is an observation window. FIG. 11 is a schematic side view of the curvature holding jig (40) when the test piece (46) in the invention according to Patent Document 2 is fixed.

  As shown in FIG. 1, the present invention includes a base layer (2) of a plastic card (14) and includes a multilayer structure in which at least three layers of plastic films are laminated. The card (14) is placed on a horizontal stage (1) and the tip of the stylus member (5) is pressed between the layers of the card (14) while The upper layer (3) of the card (14) can be peeled off as shown in FIG. 2 by sliding the slide (15) with a certain angle upward relative to the stage (1). It is an apparatus for inspecting the peeling force between the layers of the card (14), and an inspection method using the apparatus.

  Various magnetic cards and IC cards having a multilayer structure in which at least three plastic films are laminated, including the base layer (2) of the plastic card (14) used in the present invention, are contact ICs having a contact IC module. There are cards, dual interface type IC cards, non-contact type IC cards, and magnetic cards.

  As the plastic material used for the card of the present invention, polyethylene terephthalate (PET, PET-G), polyethylene naphthalate, polycarbonate, nylon, polystyrene, polyvinyl chloride (PVC), and polyacrylonitrile can be used. As the core sheet, polyethylene terephthalate (PET, PET-G) or polyvinyl chloride (PVC) can be preferably used.

  Moreover, as the oversheets (2) and (12) laminated on both sides or one side of the card substrate (2), polyethylene terephthalate (PET, PET-G), polyethylene naphthalate, polycarbonate, nylon, polystyrene, polyvinyl chloride (PVC) and polyacrylonitrile can be used, and a hard coat layer and an antistatic coat layer can be further provided thereon.

  The card (14) is composed of two or more layers of the card base (2) or a total of three or more layers of plastic materials in which oversheets (2) and (12) are laminated on both sides of the card base (2). Each card is bonded or bonded between each layer with an adhesive or a heat laminate.

  As the stylus member (5), a stainless steel material can be used, and as an example, SUS304 can be preferably used.

  As shown in FIGS. 1 (b) and 2 (b), the tip (9) of the stylus member (5) has an angle (17) of the tip (9) variable within a range of 30 ° to 60 °, The tip R is variable within a range of 0.01 mm to 0.05 mm, and the width of the tip (9) is variable within a range of 4 mm to 5 mm.

  And as the pressing pressure and the pressing angle (17) when the tip (9) is pressed between the layers of the card (14) for peeling inspection, the pressing angle is in the range of 30 ° -60 ° and the pressing pressure is 2N. Inspection shall be performed in a range of ˜5N.

When the adhesion between the card layers is poor, that is, the pressing force of the tip (9) is the adhesive force between the base layer of the plastic card and the plastic film layer laminated thereon, When stronger than the adhesion, as shown in FIG. 5, the tip (9) of the stylus can move while sliding in the Y direction (15) of the jig B (8), and exists between the layers. Only the plastic film layer (3) which is pierced into the adhesive layer and laminated thereon can be peeled off.

  When the tip (9) of the stylus is pressed between the layers of the card (14) and slid in the Y direction (15) of the jig B (8) as shown in FIG. Assume that the handle A (6) is moved and slid in the Y direction (15) while holding a handle lever (7) provided on the stylus member (5).

  When the adhesion and adhesion between the layers of the card (14) are good and normal, that is, it is laminated on the base layer (2) of the plastic card (14) by the pressing force of the tip (9). When the adhesive force and adhesion between the plastic film layer (3) are strong, as shown in FIG. 6, the tip (9) of the stylus (5) is in the adhesive layer existing between the layers. The pressure of the stress relief spring (13) provided on the stylus member (5) of the jig A (6) cannot be inserted, and the tip (9) of the stylus (5) is released. Can not move forward, it is pushed up in the vertical direction in the X direction (16), and the stylus member (5) including the tip (9) slides in parallel in the X direction (16). It happens that you are let down. That is, no delamination occurs between the layers, and it is judged that the adhesion and adhesion between the card layers are good and normal.

  In other words, when the adhesion and adhesion between the layers are weak, the tip (9) of the stylus (5) moves forward and peels off the upper layer, but when the adhesion and adhesion between the layers are strong, there is a scratch. Since the tip (9) of the stylus (5) is moved in the vertical direction and pushed up without peeling or breaking, the stylus member (5) of the jig A (6) If it is moved or slid in the direction (15), it is a non-defective product, if it is pushed up in the X direction (16) in the vertical direction, and if it is slid in parallel, it is a defective product. It is possible to inspect the adhesion strength and adhesion strength of the.

  Specific examples of the present invention will be described below.

  A magnetic card having a three-layer structure is prepared. The layers are composed of a 0.6 mm-thick polyvinyl chloride sheet (PVC) as a card base material (core sheet material) and both sides of the core sheet material. The polyester sheet (PET-G) has a three-layer structure as an oversheet having a thickness of 0.1 mm, a polyester adhesive is applied to both surfaces of the core sheet material, and the oversheet is bonded to each other. After aging at a temperature of ° C., punching was performed to make a small card size.

  In addition, although the thing which does not apply the said adhesive agent was also made as a comparison object, it stuck together by the low-temperature heat laminating process at the temperature of 100-120 ° C, and it cuts in the same way, I made it.

  As the peeling inspection apparatus, the one shown in FIGS. 1 and 3 was used.

  Place the card created above on the stage (1) and place the positioning fixing pins (4) on the two adjacent sides of the card (long side and short side of the card) as shown in FIG. On the other two sides (long side and short side different from the two sides), a movable spring-equipped positioning pin (11) capable of pressing the end of the card was disposed and positioned.

While pressing the tip (9) (stainless steel: SUS304) of the stylus member (5) of the jig A (6) between the core sheet layer (2) and the oversheet layer (3) of the card, As shown in FIG. 2, the handle lever (7) provided on the stylus member (5) of the jig A (6) is gripped, and the jig is fixed in the Y direction (15) of the jig B (8). The tip (9) of the stylus member (5) of the tool A (6) was moved 5 mm.

  The above inspection was performed on a total of 20 cards: 10 cards with an adhesive layer between the layers and 10 low temperature laminated cards without an adhesive layer between the layers.

  As a result of the above inspection, the card on which the adhesive is normally applied, that is, in the case of 10 cards provided with an adhesive layer between the layers, as shown in FIG. Did not occur.

  In this case, as shown in FIG. 6, the spring (13) provided on the stylus member (5) with the peeling force adjusting function is contracted, and the handle lever (7) is moved. When the force is applied to the entire card, not only the oversheet but also the entire card is lifted from the stage, and delamination between the oversheet and the core card does not occur. Therefore, it can be determined that the product is a normal product without peeling.

  On the other hand, in all of the 10 low-temperature laminated cards in which the adhesive layer was not provided between the layers, the upper oversheet was peeled from the core sheet.

  In this case, as shown in FIG. 5, the tip portion (9) of the stylus member (5) of the jig A (6) was pierced between the layers, and the upper oversheet was peeled off from the core sheet. Is. That is, all of the ten low-temperature laminated cards not provided with an adhesive layer between the layers are peeled off and can be judged as defective products.

  On the other hand, in the method using the conventional pressure-sensitive adhesive sheet, a comparative inspection was attempted on 10 cards with an adhesive layer provided between the layers and 10 low-temperature laminated cards without an adhesive layer between the layers. It was.

  As for the result of the pressure-sensitive adhesive sheet of the conventional method, for the 10 cards provided with the adhesive layer between the layers, as in the result of the present invention, all peeling did not occur. For the ten low-temperature laminated cards that were not provided, the results were completely different from the results of the present invention, with only 20 percent peeling occurring. In other words, only 20 percent of defects were found for 10 low-temperature laminated cards without an adhesive layer between the layers. (Table 1)

The table below shows the results of the method of the present invention and the method using the pressure-sensitive adhesive sheet for each 10 low-temperature laminated cards without an adhesive layer provided between the layers.

  This is because 80% of the cards that could not be detected by the adhesive tape peeling method had adhesion strength that could not be detected by the adhesive tape even though the cards were subjected to low-temperature heat lamination.

1, card fixing stage 2, card base material layers 3, 12, oversheet (card laminated layer)
4, positioning fixing pin 5, the stylus member 6 of the present invention, the jig A
7. Handle lever (to move the entire jig A in the Y direction while holding the handle lever)
8. Jig B
9. Tip 10 of the stylus member, pressing pressure angle 11, positioning movement pin (pushing type using a spring or the like)
13, spring 14, card 15 of the present invention, Y direction (advance direction of parallel movement of the jig B)
16. X direction (advance direction of parallel movement of the stylus member of the jig A)
20, card 21, adhesive tape 22, card base layer 23, 24, card oversheet 30, optical microscope 31, transparent base 32, thin film layer 33, test piece 34, upper fulcrum 35, lower fulcrum 36, strain gauge 40 , Curvature holding jig 41, observation window 42, optical microscope 43, end fixing means 44, transparent substrate 45, thin film layer 46, test piece

Claims (4)

An apparatus for inspecting the peeling force between layers of various magnetic cards or IC cards having a multilayer structure in which at least three layers of plastic films including a plastic card base layer are laminated,
A horizontal stage for placing the card and performing the peel inspection;
A positioning mechanism for holding and fixing the card at a predetermined position of the stage;
A stylus member pressed between the layers of the card;
A jig A that holds the stylus member, includes a stress relief spring on the stylus member, and can slide the stylus member in parallel in the longitudinal direction;
A lever that holds the jig A and is provided on top of the jig A;
Using this lever, the jig A can be slid parallel to the stage with a certain angle upward with respect to the stage,
An apparatus for inspecting delamination between plastic card layers, comprising: The tip of the stylus of the stylus member has a tip angle that is variable in a range of 30 ° to 60 ° with respect to the horizontal direction, a tip R that is variable in a range of 0.01 mm to 0.05 mm, and a tip width. Is made variable in the range of 4 mm to 5 mm,
The pressing pressure and the pressing angle when the leading end is pressed between the layers of the card to perform the peeling inspection are variable in the range of the pressing angle of 30 ° to 60 °, and variable in the range of the pressing pressure of 2N to 5N. The peeling test | inspection apparatus between the layers of the plastic card of Claim 1 characterized by the above-mentioned. When the pressing force with which the tip of the stylus presses between the layers of the card becomes 6N or more, the pressure of the stress relief spring provided on the stylus member of the jig A is released, and the longitudinal 3. The peeling inspection apparatus between plastic card layers according to claim 1 or 2, wherein the stylus member is slid in parallel in the direction. A method for inspecting a peeling force between each layer of the plastic card by using the peel inspection apparatus according to claim 1.