JP2012244106A - Heat sink, electronic equipment and heat sink manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink which is small in its envelope volume and radiates a large amount of heat.SOLUTION: A heat sink 1, which is mounted on an electronic component and radiates the heat of the electronic component, comprises a plurality of heat radiation members 11 and 12 consisting of a metal plate having tabular bottom face parts 11a and 12a, fin parts 11b, 11c, 12b and 12c formed from the bottom face parts 11a and 12a by folding both ends thereof upright. The intervals between the opposite fin parts 11b and 11c and 12b and 12c differ in each of the heat radiation members 11 and 12. The bottom face part 12a of the heat radiation member 12 having a small interval between the fin parts 12b and 12c and the bottom face part 11a of the heat radiation member 11 having a large interval between the fin parts 11b and 11c are combined to form an integral body by placing the former on top of the latter in order, the heat radiation member 11 disposed on the outermost side being made to be greater in thickness than the heat radiation member 12 disposed inside.

Description

  The present invention relates to a heat sink that is mounted on an electronic component and dissipates heat, and an electronic device using the heat sink. The present invention also relates to a method for manufacturing a heat sink for mounting and dissipating heat on electronic components.

  Patent Documents 1 and 2 disclose conventional heat sinks that are mounted on an electronic component and dissipate heat generated by the electronic component. The heat sink includes a plurality of heat radiating members formed by bending a metal plate. Each heat radiating member has a flat bottom surface portion and fin portions erected by bending both ends of the bottom surface portion, and the interval between the opposing fin portions is different for each heat radiating member. Then, the heat sink is formed by sequentially stacking and integrating the bottom surfaces of the heat radiating members with small intervals between the fin portions on the bottom surfaces of the heat radiating members with large intervals between the fin portions. Thereby, the heat sink can be formed at a lower cost than the die casting method or the extrusion process.

  In addition, the heat sink of Patent Document 2 is configured such that an engaging portion extending from a part of the fin portion engages with a chassis or a housing of an electronic device and is fixed.

Japanese Patent No. 4011600 (pages 11 to 29, FIG. 3) Japanese Patent Laid-Open No. 10-126075 (pages 4-8, FIG. 1)

  The conventional heat sink is formed with a heat radiation amount corresponding to each of electronic components having different heat generation amounts. At this time, the heat radiation amount of the heat sink can be varied by using heat radiation members having different fin heights or by increasing or decreasing the number of heat radiation members. For this reason, there was a problem that the envelope volume of the heat sink having a large heat dissipation amount was increased. Further, since heat dissipating members having different fin heights are required corresponding to a plurality of types of heat sinks having different heat radiation amounts, there is a problem that the number of parts is large and the cost of the heat sink increases.

  An object of the present invention is to provide a heat sink having a small envelope volume and a large amount of heat dissipation, and an electronic device using the heat sink. It is another object of the present invention to provide a method of manufacturing a heat sink that can obtain a plurality of types of heat sinks having different heat dissipation amounts at low cost.

  In order to achieve the above object, the present invention provides a heat sink that is mounted on an electronic component and dissipates heat generated from the electronic component, and a fin portion that is erected by bending a flat bottom portion and both ends of the bottom portion. A plurality of heat dissipating members made of a metal plate having a plurality of fins on the bottom surface of the heat dissipating member having a large interval between the fin portions, and the spacing between the fin portions facing each other is different for each heat dissipating member. The bottom surfaces of the heat radiating member having a small interval between the parts are sequentially stacked and formed integrally, and the thickness of the heat radiating member disposed on the outermost side is thicker than the heat radiating member disposed on the inner side. .

  According to this configuration, a plurality of U-shaped heat dissipating members having fin portions standing on the bottom surface portion by bending the metal plate are formed. Each heat dissipating member is overlapped and integrated on the bottom surface portion between the fin portions in order of increasing spacing between the fin portions, and the upper layer heat dissipating member is disposed inside the lower layer heat dissipating member. At this time, the thickness of the heat radiating member arranged on the outermost side that is easily in contact with the external airflow is formed to be thicker than that of the heat radiating member arranged on the inner side.

  According to the present invention, in the heat sink configured as described above, a recess is formed in the fin portion of at least one of the heat radiating members. According to this configuration, the surface area of the fin portion is increased by the recess.

  According to the present invention, in the heat sink configured as described above, the heat dissipating member disposed on the outermost side includes a leg portion that engages with a mounting substrate of the electronic component, and the leg portion includes one end of the fin portion and the other end. Each of the fin portions is extended diagonally from the other end of the fin portion.

  According to this structure, the leg part extended from one fin part of the heat radiating member arranged on the outermost side and the leg part extended from the other fin part are arranged diagonally and engage with the mounting board. As a result, the heat sink is attached to the mounting substrate in a state of being in close contact with the electronic component.

  According to the present invention, in the heat sink configured as described above, the leg portion is arranged in the same plane or in a vertical plane with respect to the fin portion.

  According to another aspect of the present invention, there is provided an electronic apparatus including the heat sink having the above-described configuration and an electronic component on which the heat sink is mounted.

The present invention is also directed to a method of manufacturing a heat sink that is mounted on an electronic component and dissipates the heat generated by the electronic component. The heat sink is a flat bottom portion and fin portions that are erected by bending both ends of the bottom portion. A plurality of heat dissipating members made of a metal plate having different fins on the bottom surface portion of the heat dissipating member having a large interval between the fin portions. The bottom part of the heat radiating member with a small interval between the parts is formed in an integrated manner by overlapping in order,
The heat radiation member disposed on the outermost side according to a desired heat radiation amount is formed in different thicknesses, and the heat radiation member common to the heat radiation amount is disposed on the inner side.

  According to this configuration, a plurality of U-shaped heat dissipating members having fin portions standing on the bottom surface portion by bending the metal plate are formed. Each heat dissipating member is overlapped and integrated on the bottom surface portion between the fin portions in order of increasing spacing between the fin portions, and the upper layer heat dissipating member is disposed inside the lower layer heat dissipating member. At this time, the heat dissipating member arranged on the outermost side that easily contacts the external airflow is selected from a plurality of parts having different thicknesses according to the heat dissipating amount of the heat sink, and the heat dissipating member arranged on the inner side does not depend on the heat dissipating amount of the heat sink. Common parts are used.

  According to the present invention, in the heat sink in which a plurality of heat dissipating members are stacked and integrated, the thickness of the heat dissipating member disposed on the outermost side is thicker than that of the heat dissipating member disposed on the inner side. Can be formed.

  Further, according to the present invention, the outermost heat dissipating member is formed in different thickness according to the desired heat dissipating amount, and the common heat dissipating member is arranged on the inner side with respect to the heat dissipating amount. The heat sink can be obtained at low cost by using common parts for the heat sink.

The perspective view which shows the heat sink of 1st Embodiment of this invention. The perspective view which shows the heat sink of 2nd Embodiment of this invention. The perspective view which shows the heat sink of 3rd Embodiment of this invention. The perspective view which shows the heat sink of 4th Embodiment of this invention. The side view which shows the heat sink of 4th Embodiment of this invention. The front view which shows the heat sink of 4th Embodiment of this invention. The perspective view which shows the heat sink of 5th Embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a heat sink according to the first embodiment. The heat sink 1 is mounted on an electronic component such as an IC provided in the electronic device, and has a plurality of heat radiating members 11, 12, 13 formed of a metal plate such as aluminum.

  The heat radiating member 11 has a flat bottom surface portion 11a and fin portions 11b and 11c in which both ends of the bottom surface portion 11a are erected by bending. Similarly, the heat radiating member 12 includes a flat bottom surface portion 12a and fin portions 12b and 12c which are erected by bending both ends of the bottom surface portion 12a. Similarly, the heat radiating member 13 includes a flat bottom surface portion 13a and fin portions 13b and 13c which are erected by bending both ends of the bottom surface portion 13a. In this embodiment, the heat sink 1 is formed by the three heat radiating members 11, 12, and 13, but can be formed by two or more heat radiating members.

  The interval between the opposing fin portions 11b and 11c is larger than the interval between the fin portions 12b and 12c, and the interval between the fin portions 12b and 12c is larger than the interval between the fin portions 13b and 13c. Then, the bottom surface portion 12a of the heat radiation member 12 having a small interval between the fin portions 12b and 12c is superimposed on the bottom surface portion 11a of the heat radiation member 11 having a large space between the fin portions 11b and 11c. Further, the bottom surface portion 13a of the heat radiation member 13 having a small interval between the fin portions 13b and 13c is overlapped on the bottom surface portion 12a of the heat radiation member 12 having a large interval between the fin portions 12b and 12c. Thereby, the heat radiating members 11, 12, and 13 are arranged in order from the outside and integrated, and the heat sink 1 is formed.

  The heat radiation member 11 disposed on the outermost side is provided with two crimping portions 11d formed integrally by bending on opposite sides. The heat radiating members 12 and 13 are clamped by the crimping part 11d, and the heat radiating members 11, 12, and 13 are brought into close contact with each other. A heat conductive sheet or heat conductive grease may be arranged between the heat radiating members 11, 12, and 13 to improve adhesion.

  Moreover, the thickness of the heat radiating member 11 arranged on the outermost side is thicker than the thickness of the heat radiating members 12 and 13 arranged on the inner side.

  The heat sink 1 having the above-described configuration is mounted with the bottom surface portion 11a of the heat radiating member 11 being in close contact with the electronic component by bonding or the like. Heat generated by the electronic component is transmitted to the heat sink 1, and the heat sink 1 dissipates heat by exchanging heat with the external airflow. At this time, since the thickness of the heat radiating member 11 arranged on the outermost side which is easily contacted with the external airflow is thicker than the heat radiating members 12 and 13 arranged on the inner side, the heat radiation amount of the heat sink 1 can be increased and the envelope volume is reduced. be able to.

  Further, a plurality of types of heat sinks 1 having different heat dissipation amounts corresponding to the heat generation amount of the electronic component are formed on the same production line. At this time, the heat radiating member 11 arranged on the outermost side is selected from a plurality of parts having different thicknesses according to a desired heat radiation amount. The heat dissipating members 12 and 13 arranged on the inner side use common parts with respect to the heat dissipation amount.

  Thereby, as shown in 2nd Embodiment of FIG. 2, the heat sink 1 which has the heat radiating member 11 thinner than the heat radiating members 12 and 13 can be formed similarly to 1st Embodiment. Therefore, it is possible to obtain the heat sink 1 at a low cost by sharing the components (heat dissipating members 12 and 13) arranged on the inner side with respect to the plurality of types of heat sinks 1 having different heat dissipation amounts.

  Next, FIG. 3 shows a perspective view of the heat sink 1 of the third embodiment. For convenience of explanation, the same reference numerals are given to the same parts as those in the first embodiment shown in FIG. In the heat sink 1 of the present embodiment, recesses 11e are formed on the outer surfaces of the fin portions 11b and 11c. The surface area of the fin portions 11b and 11c can be increased by the recess 11e. Therefore, it is possible to easily obtain the heat sink 1 having a larger heat dissipation amount.

  In addition, the recessed part 11e may be provided in the inner surface of the fin parts 11b and 11c, and may be provided in the fin parts 12b and 12c and the fin parts 13b and 13c.

  Next, FIGS. 4, 5, and 6 show a perspective view, a side view, and a front view of the heat sink of the fourth embodiment. For convenience of explanation, the same parts as those in the first embodiment shown in FIG. The heat sink 1 of this embodiment is provided with leg portions 11f and 11g extending outward from the fin portions 11b and 11c.

  The leg portions 11f and 11g are formed by bending a metal plate forming the heat radiating member 11, and protrude below the bottom surface portion 11a (opposite to the fin portions 11b and 11c). The leg portion 11f extends from one end of one fin portion 11b and is formed in the same plane as the fin portion 11b. The leg portion 11g extends from the other end of the other fin portion 11c and is formed in the same plane as the fin portion 11c. Thereby, the leg portions 11f and 11g are arranged diagonally of the heat sink 1.

  The heat sink 1 disposed on the electronic component is attached to the mounting substrate with the legs 11f and 11g engaging with holes provided in the mounting substrate of the electronic component. At this time, since the leg portions 11f and 11g are arranged diagonally, the heat sink 1 can be more closely attached to the electronic component.

  In addition, when the heat sink 1 is fixed by engagement with a chassis or housing of an electronic device as in the conventional example, if the heat sink 1 is installed near the chassis or the like, the heat convection due to the external air current is caused by the chassis or the like. Be disturbed. Further, when the heat sink 1 is installed away from the chassis or the like, the engaging portion becomes large and heat convection is prevented by the engaging portion.

  Therefore, the leg portions 11f and 11g extending downward from the heat radiating member 11 are engaged with the mounting substrate to fix the heat sink 1, thereby preventing the heat convection from being hindered and increasing the heat radiation amount. .

  Next, FIG. 7 shows a perspective view of the heat sink of the fifth embodiment. For convenience of explanation, the same parts as those in the fourth embodiment shown in FIGS. 4 to 6 are given the same reference numerals. The heat sink 1 of this embodiment is provided with bent leg portions 11f and 11g with respect to the fin portions 11b and 11c.

  The leg portions 11f and 11g are formed by bending a metal plate forming the heat radiating member 11, and protrude below the bottom surface portion 11a. The leg portion 11f extends from one end of one fin portion 11b and is formed in a plane perpendicular to the fin portion 11b by bending. The leg portion 11g extends from the other end of the other fin portion 11c and is formed in a plane perpendicular to the fin portion 11c. Thereby, the leg portions 11f and 11g are arranged diagonally of the heat sink 1.

  The heat sink 1 disposed on the electronic component is attached to the mounting substrate with the legs 11f and 11g engaging with holes provided in the mounting substrate of the electronic component. At this time, since the leg portions 11f and 11g are arranged diagonally, the heat sink 1 can be more closely attached to the electronic component. Further, it is possible to prevent the heat convection from being hindered and to increase the heat radiation amount.

  The present invention can be used for a heat sink and an electronic apparatus using the heat sink.

DESCRIPTION OF SYMBOLS 1 Heat sink 11, 12, 13 Heat radiating member 11a, 12a, 13a Bottom part 11b, 11c, 12b, 12c, 13b, 13c Fin part 11e Recessed part 11f, 11g Leg part

Claims (6)

  A heat sink that is mounted on an electronic component and dissipates heat generated by the electronic component, and a plurality of heat dissipations composed of a metal plate having a flat bottom surface portion and fin portions that are erected by bending both ends of the bottom surface portion. The heat dissipation member includes a member, and the interval between the fin portions facing each other is different for each heat dissipating member, and the heat dissipating member has a small interval between the fin portions on the bottom surface portion of the heat dissipating member having a large interval between the fin portions. A heat sink characterized in that bottom portions are sequentially stacked and formed integrally, and the thickness of the heat radiating member disposed on the outermost side is thicker than that of the heat radiating member disposed on the inner side.   The heat sink according to claim 1, wherein a recess is formed in the fin portion of at least one of the heat radiating members.   The heat dissipating member arranged on the outermost side has a leg portion that protrudes in a direction opposite to the fin portion with respect to the bottom surface portion and engages with a mounting substrate of the electronic component, and the leg portion is one of the fin portions. The heat sink according to claim 1, wherein the heat sink extends diagonally from one end of the other and the other end of the other fin portion.   The heat sink according to claim 3, wherein the leg portion is disposed in the same plane or a vertical plane with respect to the fin portion.   An electronic apparatus comprising the heat sink according to claim 1 and an electronic component on which the heat sink is mounted. In a manufacturing method of a heat sink that is mounted on an electronic component and dissipates heat generated by the electronic component, the heat sink has a flat bottom surface portion and a fin portion that is erected by bending both ends of the bottom surface portion. A plurality of heat dissipating members made of a plate are provided, and the interval between the fin portions facing each other is different for each heat dissipating member, and the interval between the fin portions is on the bottom surface portion of the heat dissipating member having a large interval between the fin portions. It is integrally formed by overlapping the bottom surface portion of the small heat dissipation member in order,
A method of manufacturing a heat sink, wherein the heat radiating member disposed on the outermost side according to a desired heat radiation amount is formed in different thicknesses, and the heat radiation member common to the heat radiation amount is disposed on the inner side.

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