JP2012239356A - Vehicle power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion apparatus which reduces its size and weight.SOLUTION: According to an embodiment, a power conversion apparatus includes: a cooler 14 having a heat receiving block 32 having a heat receiving surface 33, a heat radiation part 34 provided at the heat receiving block, and a support member 36 having a heat receiving surface 37 different from the heat receiving surface of the heat receiving block and provided on the heat receiving block; multiple semiconductor switching elements 20u, 21u, 22u, 23u mounted on the heat receiving surface of the heat receiving block and forming a conversion circuit; and multiple diodes 24u, 25u mounted on the heat receiving surface of the support member and forming the conversion circuit.

Description

  Embodiments described herein relate generally to a vehicle power conversion device that includes a plurality of semiconductor elements and a cooler and is mounted on a railway vehicle or the like.

  For example, a railway vehicle is equipped with a power converter such as a converter that converts AC voltage into DC voltage, or an inverter that converts DC voltage into three-phase (U-phase, V-phase, W-phase) AC voltage. Yes. Such a power conversion device generally includes a large-capacity semiconductor switching element such as an IGBT and a plurality of semiconductor elements such as a diode and a cooler for cooling them. The cooler includes, for example, a heat receiving block having a heat receiving surface, and heat radiating fins, heat pipes, and the like provided integrally or separately with the heat receiving block.

  A plurality of semiconductor elements such as semiconductor switching elements and diodes have a large loss, and must be actively cooled by a cooler. Therefore, the plurality of semiconductor switching elements and the plurality of diodes are all mounted on the heat receiving surface of the heat receiving block. The heat generated in the semiconductor element is transferred to the heat receiving block, and the semiconductor element is efficiently cooled by dissipating this heat to the atmosphere through the heat radiation fins or heat pipes.

JP 2006-340490 A

  In the power conversion device configured as described above, since the plurality of semiconductor elements are all arranged on the common heat receiving surface of the heat receiving block, it is necessary to increase the area of the heat receiving surface of the cooler according to the number of semiconductor elements. There is. As a result, the entire power conversion device is enlarged due to the increase in size of the cooler. The power conversion device occupies a large proportion of the outer shape and mass of the vehicle control device, and in order to realize a reduction in size and weight of the vehicle control device, it is necessary to reduce the size and weight of the power conversion device.

  The present invention has been made in view of the above points, and an object thereof is to provide a power conversion device for a vehicle that can be reduced in size and weight.

According to the embodiment, the power converter includes a heat receiving block having a heat receiving surface, a heat radiating portion provided in the heat receiving block, a support member provided on the heat receiving block and having a heat receiving surface different from the heat receiving surface, A cooler having
A plurality of semiconductor switching elements mounted on the heat receiving surface of the heat receiving block to form a conversion circuit; and a plurality of diodes mounted on the heat receiving surface of the support member to form the conversion circuit.

FIG. 1 is a perspective view showing a power conversion device according to the first embodiment. FIG. 2 is a diagram showing an inverter circuit of the power converter. FIG. 3 is a side view and a front view of the power conversion device according to the first embodiment. FIG. 4 is a side view and a front view of the power conversion device according to the second embodiment. FIG. 5 is a side view of the power conversion apparatus according to the third embodiment. FIG. 6: is the side view and front view of a power converter device which concern on 4th Embodiment. FIG. 7: is the side view and front view of a power converter device which concern on 5th Embodiment. FIG. 8 is a side view and a front view of the power conversion device according to the sixth embodiment. FIG. 9 is a side view and a front view of the power conversion device according to the seventh embodiment. FIG. 10 is a side view and a front view of the power conversion device according to the eighth embodiment. FIG. 11: is the side view and front view of a power converter device which concern on 9th Embodiment.

Hereinafter, power converters according to various embodiments will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a perspective view illustrating an external appearance of the power conversion device according to the first embodiment, FIG. 2 illustrates an inverter circuit of the power conversion device, and FIG. 3 illustrates a side surface and a front surface of the power conversion device.

  As shown in FIGS. 1 to 3, the power converter 10 is configured as, for example, a three-level power converter that converts DC power into AC power and supplies it to an electric motor, an air conditioner, and the like. , A cooler 14 for cooling a semiconductor element constituting the inverter circuit 12, a control unit (not shown) for transmitting and receiving a switching signal to and from the inverter circuit 12, a detector, a power supply unit, and the like.

  The inverter circuit 12 constituting the conversion circuit has U-phase, V-phase, and W-phase units. The U-phase unit includes first, second, third, and fourth switching elements 20u, 21u, 22u, and 23u that are sequentially connected in series between a DC positive terminal P and a DC negative terminal N of the DC power source 19. doing. Similarly, the V-phase unit includes first, second, third, and fourth switching elements 20v, 21v, 22v, and 23v that are sequentially connected in series between the DC positive terminal P and the DC negative terminal N. The W-phase unit has first, second, third, and fourth switching elements 20w, 21w, 22w, and 23w that are sequentially connected in series between the DC positive terminal P and the DC negative terminal N. . The plurality of semiconductor switching elements are, for example, self-extinguishing semiconductor elements such as IGBTs (insulated gate bipolar transistors) and GTOs. For example, IGBTs and diodes connected in reverse parallel to the IGBTs are modularized. ing.

  The first diode 24u and the second diode are connected between a connection point between the first switching element 20u and the second switching element 21u of the U-phase unit and a connection point between the third switching element 22u and the fourth switching element 23u. 25u are connected in series. Similarly, between the connection point of the first switching element 20v and the second switching element 21v of the V-phase unit and the connection point of the third switching element 22v and the fourth switching element 23v, the first diode 24v and The second diode 25v is connected in series. The first diode 24w and the second diode are connected between the connection point of the first switching element 20w and the second switching element 21w of the W-phase unit and the connection point of the third switching element 22w and the fourth switching element 23w. 25w is connected in series. These first and second diodes are formed of, for example, a silicon nitride (SiC) element that is a low-loss semiconductor element.

  The U-phase unit, V-phase unit, and W-phase unit are connected in parallel, and capacitors 26 and 27 are connected in parallel with each unit. The capacitors 26 and 27 are, for example, power supply smoothing capacitors, such as aluminum electrolytic capacitors. An output terminal 30u is connected between the second switching element 21u and the third switching element 22u of the U-phase unit. Similarly, an output terminal is provided between the second switching element 21v and the third switching element 22v of the V-phase unit. 30v is connected, and the output terminal 30w is connected between the second switching element 21w and the third switching element 22w of the W-phase unit.

  As shown in FIGS. 1 and 3, the cooler 14 of the power conversion device 10 includes a rectangular heat receiving block 32 formed of a highly heat-conductive material, for example, aluminum. One surface of the heat receiving block 32 forms a rectangular heat receiving surface 33. On the other surface of the heat receiving block 32, that is, on the surface opposite to the heat receiving surface 33, a large number of radiating fins 34 are provided upright. These heat radiating fins 34 are integrally formed with the heat receiving block 32 of aluminum and constitute a heat radiating portion of the cooler 14.

  The first to fourth switching elements 20u to 23u, 20v to 23v, and 20w to 23w of each phase described above are mounted on the heat receiving surface 33 via thermal conductive grease or the like, and are arranged side by side with a gap therebetween. Yes. On the heat receiving surface 33, for example, a rectangular support plate 36 is erected as a plurality of support members. Each support plate 36 is formed of a highly heat-conductive material, for example, a metal block such as aluminum or iron. In the present embodiment, the support plate 36 is erected vertically with respect to the heat receiving surface 33. For example, three support plates 36 are provided along one side edge of the heat receiving surface 33, and three support plates 36 are provided. Are arranged side by side along one side edge opposite to the heat receiving surface 33. The inner surface of each support plate 36, that is, the surface facing the heat receiving surface 33 side of the heat receiving block 32 constitutes a heat receiving surface 37.

  The first and second diodes 24u, 25u, 24v, 25v, 24w, and 25w constituting the inverter circuit 12 are mounted on the heat receiving surface 37 of the support plate 36, respectively. For example, three first diodes 24u, 24v, 24w are mounted on three support plates 36 arranged on one side edge of the heat receiving block 32, respectively, and three first plates 24u, 24v, 24w are arranged on the other side edge. Two diodes 25u, 25v, and 25w are respectively mounted.

  According to the power conversion device 10 configured as described above, since the switching elements 21u to 23w are attached to the heat receiving surface 33 of the heat receiving block 32, the heat generated by these switching elements is transmitted to the heat receiving block 32, The switching element is actively cooled by radiating heat to the atmosphere via the heat radiation fins 34. On the other hand, the first and second diodes 24u, 25u, 24v, 25v, 24w, and 25w are attached to the heat receiving surface 37 of the support plate 36 erected on the heat receiving surface 33 of the heat receiving block 32. Although not generated, these diodes can function without problems because the generation loss is small due to the formation of SiC. When the support plate 36 is formed of an aluminum block, heat from the first and second diodes 24u, 25u, 24v, 25v, 24w, and 25w is transferred to the support plate 36 having a high thermal conductivity and a large heat capacity. The temperature rise of the first and second diodes can be reduced.

  According to the present embodiment, since the first and second diodes 24u, 25u, 24v, 25v, 24w, and 25w are not attached to the heat receiving surface 33 of the heat receiving block 32, the area of the heat receiving surface 33 can be reduced. It becomes possible. As a result, the cooler 14 is reduced in size and weight, so that the power converter 10 as a whole can be reduced in size and weight. Thereby, finally, it becomes possible to realize a reduction in size and weight of the control device for the railway vehicle. In addition, since internal devices such as diodes are arranged in a direction perpendicular to the heat receiving surface 33 of the heat receiving block 32 serving as a reference for the power conversion device 10, the structure of the connection conductors and other peripheral frames inside the power conversion device can be obtained. It can be simplified.

  In addition, in 1st Embodiment, although the support plate 36 stood perpendicularly | vertically with respect to the heat receiving surface 33, you may provide it inclining with respect to the heat receiving surface 33, without being restricted to this. The power conversion device 10 has an arrangement configuration in which the heat radiating fins 34 face downward. However, the power conversion device 10 is not limited to this, and may be arranged in a reverse direction or inclined.

  Next, power conversion devices according to various other embodiments will be described. In the various embodiments described below, the same components as those in the first embodiment described above will be denoted by the same reference numerals, and detailed description thereof will be omitted, and different portions will be mainly described.

(Second Embodiment)
FIG. 4 shows a side surface and a front surface of the power conversion device 10 according to the second embodiment. According to the second embodiment, the plurality of support plates 36 are arranged by being rotated 90 degrees with respect to the first embodiment described above. In other words, the plurality of support plates 36 are vertically provided on the heat receiving surface 33 of the heat receiving block 32, and are provided in two rows in two along the longitudinal direction of the heat receiving surface 33. The U-phase first and second diodes 24u and 25u are respectively attached to the support plate 36 in one row, and the V-phase first and second diodes 24v and 25v are respectively attached to the support plate 36 in the center row. The W-phase first and second diodes 24w and 25w are attached to the support plates 36 in the other rows arranged on one side edge of the heat receiving surface 33, respectively. The first and second diodes are both mounted on the heat receiving surface 37 of the support plate 36 and are arranged in a direction perpendicular to the switching elements 20u to 23w.

  Also in the second embodiment configured as described above, the same operational effects as those of the first embodiment described above are realized.

(Third embodiment)
FIG. 5 shows a side surface of the power conversion apparatus 10 according to the third embodiment. According to the third embodiment, the heat radiating portion of the cooler 14 is configured by a heat pipe and a heat radiating fin attached to the heat pipe instead of the heat radiating fin.

  The heat radiating portion of the cooler 14 includes a plurality of heat pipes 38 extending from the heat receiving block 32 and a plurality of heat radiating fins 40 attached to the heat pipe 38. The end of each heat pipe 38 is embedded in the heat receiving block 32. The plurality of heat pipes 38 extend, for example, perpendicular to the heat receiving block 32 and are arranged in parallel with a predetermined distance from each other. Each heat pipe 38 is filled with a refrigerant, for example, pure water. Heat is transported by changes in boiling (vaporization) and condensation (liquefaction) of the refrigerant. The plurality of radiating fins 40 are attached to the heat pipe 38 and are arranged with a gap therebetween.

  Other configurations of the power conversion apparatus 10 are the same as those in the first embodiment. In the third embodiment, the same operations and effects as in the first embodiment can be obtained.

(Fourth embodiment)
FIG. 6 shows a side surface of the power conversion apparatus 10 according to the fourth embodiment. According to the fourth embodiment, the support member of the cooler 14 is configured by the support frame 42 formed by bending a material having a high heat transfer rate, for example, a plate material of iron or aluminum. The support frame 42 is formed in a substantially U shape whose both ends are bent at a right angle, and has a pair of side walls 43a extending substantially vertically and an upper wall 44 extending horizontally between these side walls.

  In the support frame 42, the lower ends of the pair of side walls 43 are fixed on the heat receiving surface 33 of the heat receiving block 32. As a result, the pair of side walls 43 are erected substantially perpendicular to both side edges of the heat receiving surface 33, and the upper wall 44 is opposed to the heat receiving surface 33 in a substantially parallel manner at an interval. Three support frames 42 are provided corresponding to the U-phase, V-phase, and W-phase, and are arranged in three rows with a gap therebetween.

  The inner surface of each side wall 43 of each support frame 42 constitutes a heat receiving surface 43a. The first diode 24 u and the second diode 25 u are mounted on the heat receiving surface 43 a of the side wall 43 and face the direction perpendicular to the switching element on the heat receiving surface 33. Similarly, the first diode 24v and the second diode 25v are mounted on the heat receiving surfaces 43a of the both side walls 43 of the middle support frame 42, and further on the heat receiving surfaces 43a of the both side walls 43 of the other support frame 42. The first diode 24w and the second diode 25w are mounted and each face a direction perpendicular to the switching element.

  Other configurations of the power conversion apparatus 10 are the same as those in the first embodiment. In the third embodiment, the same operations and effects as in the first embodiment can be obtained. Further, according to the fourth embodiment, the number of supporting members can be reduced, and the apparatus can be reduced in size and weight without increasing the number of parts. Furthermore, since the internal device is configured in a direction perpendicular to the heat receiving surface 33 of the heat receiving block 32 serving as a reference of the power converter 10, the structure of the connection conductor and other peripheral frames inside the power converter can be simplified. Can do.

  In the fourth embodiment, as in the second and third embodiments, the diode and the diode heat receiving surface are rotated 90 degrees on the heat receiving surface 33 of the heat receiving block 32, and the power conversion device May be applied, and a configuration in which the heat radiating portion is changed from a cooling fin to a heat pipe may be applied, and the same effect can be obtained in any case.

(Fifth embodiment)
FIG. 7 shows a power conversion apparatus 10 according to the fifth embodiment. According to the fifth embodiment, the first and second diodes 24u, 25u, 24v, 25v, 24v, and 25v are the upper surface of the upper wall 44 of the support frame 42 with respect to the fourth embodiment described above. It is mounted on the heat receiving surface 44a. Thus, the first and second diodes 24u, 25u, 24v, 25v, 24v, and 25v are arranged above the switching elements 20u to 23w with the terminals facing in the same direction as the terminals of the switching elements, and switching Elements and diodes are arranged in parallel in two layers. Other configurations of the power conversion apparatus 10 are the same as those of the above-described fourth embodiment.

  According to the fifth embodiment, the same effect as that of the fourth embodiment is realized, and it is possible to arrange the space efficiently. Further, the access direction to the terminal portion of the semiconductor element is one direction, and the workability during assembly can be improved. In this embodiment, as in the second and third embodiments described above, the diode and the diode heat receiving surface are rotated by 90 degrees on the heat receiving surface 33 of the heat receiving block 32, and the power conversion device 180 is provided. You may apply the form which changed the degree of rotation (vertical direction reversed) and the form which changes a thermal radiation part from a cooling fin to a heat pipe, and the same effect is acquired in any case.

(Sixth embodiment)
FIG. 8 shows a power conversion apparatus 10 according to the sixth embodiment. According to the sixth embodiment, with respect to the fifth embodiment described above, between the heat receiving surface 44a of the support frame 42 and the first and second diodes 24u, 25u, 24v, 25v, 24w, 25w, A plate-like heat transfer block 48 made of a material having a high heat transfer property, for example, aluminum, is disposed. Other configurations of the power conversion apparatus 10 are the same as those of the fifth embodiment described above.

  According to the sixth embodiment, the same effect as that of the fifth embodiment is realized, and by providing the heat transfer block 48, the cooling performance of the diode can be further improved.

(Seventh embodiment)
FIG. 9 shows a power conversion apparatus 10 according to the seventh embodiment. According to the seventh embodiment, the first and second diodes 24u, 25u, 24v, 25v, 24v, and 25v are the lower surface of the upper wall 44 of the support frame 42 with respect to the fourth embodiment described above. It is mounted on the heat receiving surface 44a. Thus, the first and second diodes 24u, 25u, 24v, 25v, 24v, and 25v are arranged above the switching elements 20u to 23w with the terminals facing in the direction facing the terminals of the switching elements. Elements and diodes are arranged in parallel in two layers. Other configurations of the power conversion apparatus 10 are the same as those of the above-described fourth embodiment.

  According to the seventh embodiment, the same effect as that of the fourth embodiment is realized, and it is possible to arrange the space efficiently. In addition, since the distance between the terminals of the switching element and the diode can be shortened, it is possible to simplify the connection conductor and reduce the surge voltage of the semiconductor switching element due to the reduction of wiring inductance.

  In this embodiment, as in the second and third embodiments described above, the diode and the diode heat receiving surface are rotated by 90 degrees on the heat receiving surface 33 of the heat receiving block 32, and the power conversion device 180 is provided. You may apply the form which changed the degree of rotation (vertical direction reversed) and the form which changes a thermal radiation part from a cooling fin to a heat pipe, and the same effect is acquired in any case. Similarly to the sixth embodiment, a material having high heat conductivity, for example, aluminum, is provided between the heat receiving surface 44a of the support frame 42 and the first and second diodes 24u, 25u, 24v, 25v, 24w, and 25w. You may arrange | position the plate-shaped heat-transfer block formed by.

(Eighth embodiment)
FIG. 10 shows a power conversion apparatus 10 according to the eighth embodiment. According to the eighth embodiment, with respect to the above-described seventh embodiment, each side wall 43 of each support frame 42 is not perpendicular to the heat receiving surface 33 of the heat receiving block 32 but is inclined obliquely. . The first and second diodes 24 u, 25 u, 24 v, 25 v, 24 v, 25 v are mounted on the heat receiving surface 43 a that is the inner surface of the side wall 43 of the support frame 42. Thus, the first and second diodes 24u, 25u, 24v, 25v, 24v, and 25v are arranged above the switching elements 20u to 23w with the terminals facing in a direction obliquely facing the terminals of the switching elements. The switching element and the diode are arranged in parallel in two layers. Other configurations of the power conversion apparatus 10 are the same as those of the seventh embodiment described above.

  According to the eighth embodiment, the same effect as that of the seventh embodiment is realized, and the internal space has a complicated shape as in the case where the internal device of the power conversion device has a complicated shape. It is possible to make an arrangement that efficiently uses space according to the arrangement.

  In this embodiment, as in the second and third embodiments described above, the diode and the diode heat receiving surface are rotated by 90 degrees on the heat receiving surface 33 of the heat receiving block 32, and the power conversion device 180 is provided. You may apply the form which changed the degree of rotation (vertical direction reversed) and the form which changes a thermal radiation part from a cooling fin to a heat pipe, and the same effect is acquired in any case. Similarly to the sixth embodiment, a material having high heat conductivity, for example, aluminum, is provided between the heat receiving surface 44a of the support frame 42 and the first and second diodes 24u, 25u, 24v, 25v, 24w, and 25w. You may arrange | position the plate-shaped heat-transfer block formed by.

(Ninth embodiment)
FIG. 11 shows a power conversion apparatus 10 according to the ninth embodiment. According to the ninth embodiment, three support frames corresponding to the U-phase, the V-phase, and the W-phase are formed integrally with the fourth embodiment described above as one common support frame 42. It is configured. The first and second diodes 24u, 25u, 24v, 25v, 24v, and 25v are mounted on the heat receiving surface 43a that is the inner surface of each side wall 43 of the support frame 42. The mounting may be performed not only on the side wall 43 of the support frame 42 but also on the upper surface or the lower surface of the upper wall 44. Other configurations of the power conversion apparatus 10 are the same as those of the above-described fourth embodiment.

  According to the eleventh embodiment, the same effect as that of the fourth embodiment is realized, and the first and second diodes arranged in the three-phase circuit of the U phase, the V phase, and the W phase, respectively, It can be attached to a single integrated support frame. As a result, a single support frame is provided, and the number of parts can be reduced and the structure can be simplified. Further, the heat capacity of the heat receiving side support frame is increased, and the temperature rise of the diode can be further reduced.

  In this embodiment, as in the second and third embodiments described above, the diode and the diode heat receiving surface are rotated by 90 degrees on the heat receiving surface 33 of the heat receiving block 32, and the power conversion device 180 is provided. You may apply the form which changed the degree of rotation (vertical direction reversed) and the form which changes a thermal radiation part from a cooling fin to a heat pipe, and the same effect is acquired in any case.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof. For example, the conversion circuit is not limited to three phases, and may have a two-phase structure, or may be configured as a converter that converts an AC voltage into a DC voltage. The material which comprises a cooler is not limited to aluminum, Various selection is possible.

10 ... Power converter, 12 ... Inverter circuit, 14 ... Cooler,
20u, 21u, 22u, 23u ... switching elements,
20v, 21v, 22v, 23v ... switching element,
20w, 21w, 22w, 23w ... switching element,
24u, 24v, 24w ... 1st diode,
25u, 25v, 25w ... second diode,
32 ... Heat receiving block, 33, 37 ... Heat receiving surface, 34 ... Radiating fin, 36 ... Support plate,
38 ... Heat pipe, 40 ... Radiating fin, 42 ... Support frame

Claims (8)

A cooler having a heat receiving block having a heat receiving surface, a heat dissipating part provided in the heat receiving block, and a support member provided on the heat receiving block and having a heat receiving surface different from the heat receiving surface;
A plurality of semiconductor switching elements mounted on a heat receiving surface of the heat receiving block to form a conversion circuit;
A plurality of diodes mounted on the heat receiving surface of the support member to form the conversion circuit;
A power conversion device comprising:   The power conversion device according to claim 1, wherein the support member includes a plurality of support plates provided upright on a heat receiving surface of the heat receiving block.   The power conversion device according to claim 2, wherein the support plate is erected vertically to a heat receiving surface of the heat receiving block, and the diode is provided in a direction perpendicular to the switching element. The support member includes a support frame provided on a heat receiving surface of the heat receiving block, and the support frame extends between the pair of side walls standing on the heat receiving surface and the heat receiving surface. And an upper wall facing each other with a gap,
The power converter according to claim 1, wherein the plurality of diodes are attached to the support frame.   The power converter according to claim 4, wherein the diode is attached to the support frame in a direction perpendicular to the semiconductor switching element.   5. The diode according to claim 4, wherein the diode is attached to the upper wall of the support frame with the terminal facing in the same direction as the terminal of the semiconductor switching element, and the semiconductor switching element and the diode are arranged in two layers in parallel. The power converter described.   5. The diode according to claim 4, wherein the diode is attached to an upper wall of the support frame in a state in which the terminal faces in a direction facing the terminal of the semiconductor switching element, and the semiconductor switching element and the diode are arranged in two layers in parallel. The power converter described.   The support frame has a side wall extending obliquely with respect to the heat receiving surface of the heat receiving block, and the diode is attached to the side wall of the support frame, with the terminal facing in a direction facing the terminal of the semiconductor switching element. The power conversion device according to claim 4, wherein the power conversion device is attached to an upper wall of the support frame and is disposed obliquely with respect to the semiconductor switching element.

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