JP2012234952A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012234952A5 JP2012234952A5 JP2011102152A JP2011102152A JP2012234952A5 JP 2012234952 A5 JP2012234952 A5 JP 2012234952A5 JP 2011102152 A JP2011102152 A JP 2011102152A JP 2011102152 A JP2011102152 A JP 2011102152A JP 2012234952 A5 JP2012234952 A5 JP 2012234952A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- mounting tool
- driving
- tool
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
この発明は、基板に電子部品を実装する実装装置であって、
基板に電子部品を実装する実装装置であって、
上記電子部品を保持する実装ツールと、
この実装ツールを駆動して上記基板の上方の実装位置に位置決めしてから下降方向に駆動して上記実装ツールに保持された上記電子部品を上記基板に実装させる駆動手段と、
上記実装ツールに設けられ、上記駆動手段によって上記実装ツールを駆動して上記実装位置の上方に位置決めしたときに上記実装ツールに生じる振動を検出する検出手段と、
この検出手段の検出に基いて上記実装ツールに生じた振動を打ち消す振動が上記実装ツールに加えられるよう上記駆動手段を駆動する制御手段と
を具備したことを特徴とする電子部品の実装装置にある。
The present invention is a mounting apparatus for mounting electronic components on a substrate,
A mounting device for mounting electronic components on a substrate,
A mounting tool for holding the electronic component;
Driving means for driving the mounting tool and positioning it at the mounting position above the substrate and then driving in the downward direction to mount the electronic component held by the mounting tool on the substrate;
Provided in the mounting tool, detecting means for detecting a vibration occurring in the mounting tool when positioned above the mounting position by driving the mounting tool by the drive means,
There is provided an electronic component mounting apparatus comprising: a control unit that drives the driving unit so that a vibration that cancels a vibration generated in the mounting tool based on detection by the detection unit is applied to the mounting tool. .
この発明は、基板に電子部品を実装する実装方法であって、
基板に電子部品を実装する実装方法であって、
上記電子部品を実装ツールに保持する工程と、
上記実装ツールを駆動して上記基板の上方の実装位置に位置決めしてから下降方向に駆動して上記実装ツールに保持された上記電子部品を上記基板に実装する工程と、
上記実装ツールを上記実装位置の上方に位置決めしたときに、上記実装ツールに設けられた検出手段により上記実装ツールに生じる振動を検出する工程と、
上記実装ツールに生じた振動の検出に基いて上記実装ツールに生じた振動を打ち消す振動を上記実装ツールに加える工程と
を具備したことを特徴とする電子部品の実装方法にある。
This invention is a mounting method for mounting an electronic component on a substrate,
A mounting method for mounting electronic components on a substrate,
Holding the electronic component in a mounting tool;
Mounting the electronic component held on the mounting tool by driving in the downward direction after driving the mounting tool and positioning the mounting position above the substrate;
Detecting the vibration generated in the mounting tool by the detection means provided in the mounting tool when the mounting tool is positioned above the mounting position;
And a step of applying to the mounting tool a vibration that cancels the vibration generated in the mounting tool based on detection of vibration generated in the mounting tool.
具体的には、この実施の形態では図６に示すようにＸ方向に対して液晶表示パネル１とＴＣＰ３の多数のリード１ａ，３ａが狭ピッチで配置されているので、Ｘ方向に対してわずかでもずれが生じると、実装不良の発生原因となる。そこで、実装ツール４１がＸ・Ｙ・Ｚ・θ駆動源４２によってＸ方向に駆動されるときに、このＸ方向の駆動時に生じる振動に対して逆位相の波形となる駆動信号を出力する。
Specifically, in this embodiment, as shown in FIG. 6, since the liquid crystal display panel 1 and the numerous leads 1a and 3a of the TCP 3 are arranged at a narrow pitch with respect to the X direction , However, if a deviation occurs, it causes a mounting failure. Therefore, when the mounting tool 41 is driven in the X direction by the X / Y / Z / θ drive source 42, a drive signal having a waveform in an opposite phase to the vibration generated during the driving in the X direction is output.
Claims (3)
上記電子部品を保持する実装ツールと、
この実装ツールを駆動して上記基板の上方の実装位置に位置決めしてから下降方向に駆動して上記実装ツールに保持された上記電子部品を上記基板に実装させる駆動手段と、
上記実装ツールに設けられ、上記駆動手段によって上記実装ツールを駆動して上記実装位置の上方に位置決めしたときに上記実装ツールに生じる振動を検出する検出手段と、
この検出手段の検出に基いて上記実装ツールに生じた振動を打ち消す振動が上記実装ツールに加えられるよう上記駆動手段を駆動する制御手段と
を具備したことを特徴とする電子部品の実装装置。 A mounting device for mounting electronic components on a substrate,
A mounting tool for holding the electronic component;
Driving means for driving the mounting tool and positioning it at the mounting position above the substrate and then driving in the downward direction to mount the electronic component held by the mounting tool on the substrate;
Provided in the mounting tool, detecting means for detecting a vibration occurring in the mounting tool when positioned above the mounting position by driving the mounting tool by the drive means,
An electronic component mounting apparatus comprising: a control unit that drives the driving unit such that a vibration that cancels a vibration generated in the mounting tool based on the detection by the detection unit is applied to the mounting tool.
上記電子部品を実装ツールに保持する工程と、
上記実装ツールを駆動して上記基板の上方の実装位置に位置決めしてから下降方向に駆動して上記実装ツールに保持された上記電子部品を上記基板に実装する工程と、
上記実装ツールを上記実装位置の上方に位置決めしたときに、上記実装ツールに設けられた検出手段により上記実装ツールに生じる振動を検出する工程と、
上記実装ツールに生じた振動の検出に基いて上記実装ツールに生じた振動を打ち消す振動を上記実装ツールに加える工程と
を具備したことを特徴とする電子部品の実装方法。 A mounting method for mounting electronic components on a substrate,
Holding the electronic component in a mounting tool;
Mounting the electronic component held on the mounting tool by driving in the downward direction after driving the mounting tool and positioning the mounting position above the substrate;
Detecting the vibration generated in the mounting tool by the detection means provided in the mounting tool when the mounting tool is positioned above the mounting position;
And a step of applying a vibration to the mounting tool to cancel the vibration generated in the mounting tool based on detection of the vibration generated in the mounting tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011102152A JP5713787B2 (en) | 2011-04-28 | 2011-04-28 | Electronic component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011102152A JP5713787B2 (en) | 2011-04-28 | 2011-04-28 | Electronic component mounting equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012234952A JP2012234952A (en) | 2012-11-29 |
| JP2012234952A5 true JP2012234952A5 (en) | 2014-06-05 |
| JP5713787B2 JP5713787B2 (en) | 2015-05-07 |
Family
ID=47434994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011102152A Active JP5713787B2 (en) | 2011-04-28 | 2011-04-28 | Electronic component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5713787B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6374189B2 (en) * | 2014-03-17 | 2018-08-15 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
| JP6667326B2 (en) * | 2016-03-17 | 2020-03-18 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
| JP7233079B2 (en) * | 2018-05-31 | 2023-03-06 | ボンドテック株式会社 | COMPONENT MOUNTING SYSTEM, COMPONENT SUPPLY DEVICE, AND COMPONENT MOUNTING METHOD |
| JP7128697B2 (en) * | 2018-09-19 | 2022-08-31 | ファスフォードテクノロジ株式会社 | Die bonding apparatus and semiconductor device manufacturing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000091796A (en) * | 1998-09-14 | 2000-03-31 | Murata Mfg Co Ltd | Component attaching apparatus |
| JP4222741B2 (en) * | 2001-04-06 | 2009-02-12 | 芝浦メカトロニクス株式会社 | Component mounting apparatus and component mounting method |
| JP4442694B2 (en) * | 2008-02-29 | 2010-03-31 | ソニー株式会社 | Component mounting apparatus, vibration control apparatus, and vibration control method |
-
2011
- 2011-04-28 JP JP2011102152A patent/JP5713787B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012234952A5 (en) | ||
| JP2016157131A5 (en) | ||
| JP2014067016A5 (en) | ||
| TWM382891U (en) | Angle adjustment structure of right-angle robot arm | |
| JP2018171665A5 (en) | Robot controller, robot and robot system | |
| ATE355180T1 (en) | CONTROL METHOD FOR A CARRIAGE, COMPUTER READABLE MEDIUM HAVING A CONTROL PROGRAM, ELECTRONIC DEVICE, RECORDING DEVICE AND LIQUID DISCHARGE DEVICE | |
| MX338463B (en) | Drive control apparatus, electronic device, and drive control method. | |
| JP2012097786A5 (en) | ||
| ATE551520T1 (en) | CONTROL SYSTEM AND METHOD FOR OPERATING AN ULTRASONIC LIQUID DELIVERY DEVICE | |
| JP2011101056A5 (en) | Exposure apparatus and exposure method | |
| EP2397818A4 (en) | Oscillator circuit, method for manufacturing oscillator circuit, inertial sensor using the oscillator circuit, and electronic device | |
| TW201427803A (en) | Apparatus for separating | |
| JP2011009538A5 (en) | Component mounting method, component mounting system, device for specifying board loading sequence, and program for specifying board loading sequence | |
| EP2555413A3 (en) | Ultrasonic motor and lens apparatus including the same | |
| BR112015020769B8 (en) | apparatus and method of positioning an automated system | |
| JP5713787B2 (en) | Electronic component mounting equipment | |
| JP2009231366A5 (en) | ||
| JP2015181068A5 (en) | ||
| JP2012234156A (en) | Automated work system for liquid crystal panel | |
| JP2012194435A5 (en) | ||
| JP2015082748A5 (en) | ||
| JP5574401B2 (en) | Electronic component mounting apparatus and mounting method | |
| WO2008132841A1 (en) | Plasma display device | |
| JP2013061592A5 (en) | ||
| JP2009295787A (en) | Thermocompression bonding method |