JP2012232450A - Liquid ejecting head and liquid ejecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid ejecting head that blocks scattering droplets generated in ejecting liquid to prevent the liquid from attaching to parts other than an application target.SOLUTION: The liquid ejecting head includes a nozzle member 1 having an ejecting surface 4 to which a nozzle 3 is provided, and is configured to eject a droplet of the liquid that is supplied through a through hole 3a communicating to the nozzle, from the nozzle. The liquid ejecting head further includes: a slit member 2 disposed by facing the ejecting surface of the nozzle member while interposing a space therebetween; an opening 6 formed in a position facing the nozzle in the slit member and having a larger dimension than that of the nozzle; and suction means 8, 9 for sucking the air inside the space in a lateral direction of the nozzle. In the liquid ejecting head, part surrounding the opening of the slit member blocks at least part of the scattering liquid droplets that are unnecessary components generated in ejecting droplets of the liquid from the nozzle.

Description

  The present invention relates to a liquid ejection head having a liquid ejection nozzle that ejects liquid in droplets, and a liquid ejection apparatus including the liquid ejection head.

  2. Description of the Related Art In recent years, liquid ejection devices that eject liquid in droplets have been used in manufacturing processes in various fields including the electronics field. That is, by discharging a liquid material from the liquid discharge head, a pattern is formed in various device manufacturing processes, a uniform thin film is formed, and the like.

  The liquid material used in such a device manufacturing process has a higher viscosity than ink used for ink jet recording in which ink droplets are ejected onto recording paper. Therefore, when discharging liquid material, apart from the main droplet, satellite droplets that fly late from the main droplet at a relatively slow speed, and floating droplets that fly in various directions with no fixed flying direction (Mist) is likely to occur. Such satellite droplets and mists (hereinafter collectively referred to as scattered droplets) cause a decrease in landing accuracy and instability of the droplet amount, thereby reducing the reliability of the liquid ejection head.

  For example, Patent Document 1 discloses a liquid discharge head that can efficiently suck scattered droplets at each time of discharging and not discharging liquid. The liquid discharge head disclosed in Patent Document 1 is shown in FIG. FIG. 11A is a cross-sectional view, and FIG. 11B is a bottom view.

  The liquid discharge head is disposed between a pressure chamber 31 for storing a liquid material, a nozzle plate 33 in which a nozzle 32 communicating with the pressure chamber 31 is formed, an actuator 34, and the upper surface of the nozzle plate 33 and the actuator 34. And an elastic partition member 35 that partitions the side surface of the pressure chamber 31. The actuator 34 expands and contracts in the vertical direction (arrow direction) as it is driven. The elastic partition member 35 elastically expands and contracts as the actuator 34 is driven to change the volume of the pressure chamber 31. Thereby, pressure is applied to the liquid material in the pressure chamber 31, and the liquid material in the pressure chamber 31 is discharged through the nozzle 32.

  The upper end of the actuator 34 is fixed to the actuator holding member 36. The actuator holding member 36 is fixed in a recessed portion 37a formed inside the exterior member 37 and opening on the lower surface. A supply pipe 38 is disposed at the center position of the exterior member 37, and the lower end surface thereof is joined to the upper surface of the elastic partition member 35. A supply tank (not shown) is connected to the upper end of the supply pipe 38 via a tube.

  Suction passages 39 are formed on both sides of the recessed portion 37a of the exterior member 37, respectively. The lower end of each suction passage 39 is bent and opened on the side wall in the recessed portion 37a. This opening functions as a suction port 39a for sucking an unnecessary liquid existing around the nozzle opening at the time of discharging and not discharging the liquid. By this suction port 39a, suction is performed in a direction orthogonal to the droplet discharge direction.

  By disposing the suction port 39a in the vicinity of the opening of the nozzle 32, scattered droplets can be efficiently sucked when droplets are discharged through the nozzle 32, and the residue adhered to the surface of the nozzle 32 even when droplets are not discharged. Droplets can be sucked efficiently. As a result, it is possible to prevent droplets from being scattered, improve droplet landing accuracy, stabilize the discharge speed and the amount of droplets, and improve the reliability of the liquid discharge head.

JP 2010-188562 A

  In the configuration of the conventional example, unnecessary scattered droplets generated when the liquid is discharged from the nozzle 32 are sucked from the suction passage 39. However, the mass of the scattered droplets varies, and it is difficult to suck all of the scattered droplets when the suction pressure is low. For this reason, there is a problem that scattered droplets that have not been sucked may adhere to the application target. Further, when the suction pressure is high, there is a problem that the application position accuracy of the main droplet may be adversely affected.

  In addition, there may occur an abnormal application phenomenon in which the liquid adhering to the nozzle surface drops to a non-target position due to its own weight.

  The present invention solves the above-mentioned conventional problems, and provides a liquid discharge head capable of avoiding the application of scattered droplets to an application target and the abnormal application in which the liquid adhering to the nozzle surface drops to an undesired position due to its own weight. The purpose is to provide. It is another object of the present invention to provide a liquid discharge apparatus including such a liquid discharge head.

  The liquid ejection head of the present invention includes a nozzle member having an ejection surface provided with nozzles, and is configured to eject liquid supplied from the nozzles in droplets through a through hole communicating with the nozzles. In order to solve the above problems, a liquid discharge head according to the present invention includes a slit member disposed opposite to the discharge surface of the nozzle member and a position facing the nozzle in the slit member. An unnecessary component that is formed and has an opening having a size larger than that of the nozzle and suction means for sucking the air in the gap in the lateral direction of the nozzle, and is generated from the nozzle when the liquid droplets are discharged. At least a part of the scattered droplets of the liquid is blocked by a portion around the opening of the slit member.

  According to the said structure, since the scattering droplet generate | occur | produced at the time of liquid discharge is interrupted | blocked by the slit member, it can prevent that a scattering droplet adheres to an application target object as an unnecessary liquid.

Sectional drawing of the liquid discharge head in Embodiment 1 Bottom view of the liquid discharge head Bottom view showing the liquid discharge head in exploded view Bottom view showing another configuration example of the nozzle member of the liquid discharge head Sectional view shown together with a semiconductor wafer to explain the operation of the liquid discharge head Bottom view showing planar positional relationship with respect to semiconductor wafer during discharge operation of the liquid discharge head Sectional drawing which shows the mode of the liquid dripping to the semiconductor wafer from the liquid discharge head Sectional drawing which shows the mode of the dripping of the splash droplet from the liquid discharge head Sectional drawing of the liquid discharge head in Embodiment 2 Bottom view of the liquid discharge head Sectional drawing of the liquid discharge head in Embodiment 3 Bottom view of the liquid discharge head Sectional drawing of the liquid discharge head in Embodiment 4 Bottom view of the liquid discharge head Top view showing the upper surface of the slit member of the liquid discharge head Bottom view showing another configuration example of the liquid discharge head Top view showing the upper surface of the slit member of the liquid discharge head Sectional view and bottom view of conventional liquid discharge head

  The liquid discharge head of the present invention can take the following aspects based on the above-described configuration.

  That is, the suction means may include a suction port disposed on the side of the nozzle and generate a constant amount of air flow by suctioning from the suction port with a negative pressure. With such a configuration, scattered droplets generated at the time of ejection are moved from the opening of the slit member by a certain amount of air flow, and dropped onto the slit member, thereby preventing scattered droplets from adhering to the application target. Can do.

  A sealing wall provided on both sides of the outer region of the discharge surface and sealing the side of the gap; and the suction port is provided with a part of the sealing wall opened, Thus, a part of the blocking wall in the region opposite to the suction port may be opened to provide an air intake.

  In addition, a pair of rectifying plates that regulate the side of the air flow between the air intake port and the suction port may be provided, and the rectifying plate may be configured to generate a certain amount of undisturbed airflow. preferable. According to this configuration, it is possible to obtain an effect of preventing scattered droplets from passing through the opening and adhering to the application object due to dead space where air does not flow or turbulent air flow.

  The distance between the pair of rectifying plates may be wider on the air intake side than on the suction port side.

  The discharge surface is provided by projecting a region around the nozzle from the outer region, and a step portion is formed between the nozzle and the outer region. The outer dimension of the discharge surface is the opening of the slit member. It is preferable that it is set larger than the dimension of the part. According to this configuration, the excess liquid remaining on the nozzle surface at the time of discharge is concentrated on the discharge surface by a certain amount of air flow or the like, and the liquid adhering to the nozzle member is dropped onto the slit member, whereby the nozzle member An effect of preventing the occurrence of abnormal application in which the liquid adhering to the surface drops to an undesired position by its own weight can be obtained.

  In this case, the discharge surface may be inclined with respect to the liquid discharge direction from the nozzle. According to this configuration, excess liquid remaining on the surface of the ejection surface during ejection always falls on the slit member from the lower end of the inclined surface, so that the liquid adhering to the surface of the ejection surface drops to an undesired position by its own weight. The effect of preventing abnormal application is obtained.

  The suction port is preferably arranged at a position biased toward the slit member on the blocking wall. According to this configuration, an effect of effectively removing (cleaning) the liquid on the slit member can be obtained by suctioning strongly during non-ejection.

  Moreover, it is preferable that the periphery of the opening part of the said slit member becomes convex shape on the side facing the said discharge surface. According to this structure, the effect which suppresses that the liquid accumulate | stored on the slit member leaks from an opening part is acquired.

  The liquid ejection apparatus according to the present invention includes a liquid ejection head having any one of the above-described configurations, a control unit that controls the operation of supplying the liquid through the through hole and ejecting the liquid from the nozzle in a drop shape, and the suction operation by the suction unit. It can be set as the structure provided with these.

  In this configuration, the control unit strongly performs suction from the suction port when the liquid is not ejected compared to when ejecting the liquid from the nozzle, so that the liquid on the slit member is It is preferable to control so as to remove.

  The liquid discharge apparatus including the liquid discharge head of the present invention having the above-described features has high practical value particularly in the manufacture of semiconductor devices. For example, a semiconductor wafer in which a plurality of semiconductor chips are formed includes both non-defective chips and defective chips. Among these, as means for applying a liquid resin to electrically insulate defective chips, The liquid ejection apparatus of the present invention can be suitably used. Therefore, in the following description, the liquid discharge head and the liquid discharge apparatus of the present invention will be described by taking as an example the case of being used for manufacturing a semiconductor device.

(Embodiment 1)
A schematic configuration of a liquid discharge head used in the liquid discharge apparatus according to Embodiment 1 is shown in FIGS. 1A to 1C. 1A is a cross-sectional view of the liquid discharge head, FIG. 1B is a bottom view thereof, and FIG. 1C is an exploded bottom view of the liquid discharge head. FIG. 1A shows a cross section taken along line AA of FIG. 1B.

  The liquid discharge head includes a nozzle member 1 and a slit member 2. A bottom view of the nozzle member 1 is shown in FIG. 1C (a), and a bottom view of the slit member 2 is shown in FIG. 1C (b). The nozzle member 1 has a discharge surface 4 provided with a circular nozzle 3, and is configured to discharge the liquid supplied through the through hole 3 a communicating with the nozzle 3 downwardly from the nozzle 3. Has been. When configuring the liquid ejection device, means (not shown) for supplying the liquid to be ejected is connected to the upper end of the through hole 3a. The discharge surface 4 is provided by projecting the peripheral region of the nozzle 3 downward from the outer region, and a stepped portion 4a is formed at the periphery that is a boundary with the outer region.

  The slit member 2 is disposed opposite to the ejection surface 4 of the nozzle member 1 with a gap 5 provided therebetween. A circular opening 6 having a diameter larger than that of the nozzle 3 is formed at a position facing the nozzle 3 in the slit member. The outer dimension of the discharge surface 4 of the nozzle member 1 has a larger diameter than the opening 6. In addition, the nozzle 3, the discharge surface 4, and the opening part 6 do not necessarily need to be circular, and can be formed in a shape according to specifications. Even in this case, the outer shape of the opening has a size larger than the outer shape of the nozzle, and the outer shape of the discharge surface has a size larger than the outer shape of the opening.

  Sealing walls 7 a and 7 b for sealing the sides of the gap 5 are provided at both ends of the outer region of the discharge surface 4 in the nozzle member 1, and a semi-enclosed space is formed around the discharge surface 4. A suction port 8 is provided by opening a part of the blocking wall 7a. An air inlet 9 is provided by opening a part of the blocking wall 7b so as to face the suction port 8 with the nozzle 3 interposed therebetween. The arrangement of the suction port 8 and the air intake 9 is not limited to such a positional relationship, but the air intake 9 is arranged in a region opposite to the suction port 8 with respect to the nozzle 3. It is desirable.

  In the configuration of FIG. 1A, the suction port 8 is located immediately above the slit member 2. That is, the sealing wall 7a is provided at a position in contact with the upper surface of the slit member 1 (surface on the ejection surface 4 side). In this way, the suction port 8 is formed at a position biased toward the slit member 1 in the blocking wall 7a.

  A suction device (not shown) such as a suction pump is connected to the suction port 8 and constitutes a suction means for sucking air in the lateral direction of the nozzle 3 together with the air intake port 9. By sucking at a negative pressure from the suction port 8, it is possible to generate a constant amount of air that passes through the region of the discharge surface 4 including the nozzle 3.

  The blocking walls 7a and 7b can be configured to be provided in a range extending over the entire periphery of the outer region of the discharge surface 4 as the blocking wall 7 shown in FIG. As a result, a semi-sealed space with a higher degree of sealing can be formed around the nozzle 3, and the flow of air by suction from the suction port 8 can be stabilized.

  The operation of the liquid discharge head having the above configuration will be described below. In the following description, the case where the liquid resin is applied in order to electrically insulate defective chips in the manufacturing process of the semiconductor device as described above is an application target example.

  FIG. 3 is a cross-sectional view showing the liquid discharge head together with the semiconductor wafer in order to explain the operation. As shown in FIG. 3, a pedestal 10 is disposed below the slit member 2 of the liquid ejection head, and a semiconductor wafer 11 is placed on the pedestal 10. The semiconductor wafer 11 includes a plurality of semiconductor chips. The plurality of semiconductor chips include defective chips 12 and non-defective chips 13. Here, it is assumed that the determination of the defective chip 12 and the non-defective chip 13 has already been performed by an inspection apparatus or the like.

  Next, as shown in FIG. 4, the liquid ejection head is moved so that the nozzle 3 is positioned immediately above the defective chip 12. FIG. 4 is a bottom view showing a planar positional relationship of the liquid discharge head with respect to the semiconductor wafer 11.

  Next, as shown in FIG. 5, the liquid 14 is supplied through the through hole 3 a, and the liquid 14 is dropped from the nozzle 3 toward the defective chip 12. FIG. 5 is a cross-sectional view showing a state of liquid dropping onto the semiconductor wafer 11. The mechanism of the liquid dropping is that the liquid 14 pushed out from the nozzle 3 is separated and dropped as a droplet 14a by constriction occurring and growing. The droplet 14a passes through the opening 6 provided in the slit member 2 and adheres to the application target (in this case, the defective chip 12) as shown in FIG. 6, thereby forming the coating film 14b. Along with the liquid dropping operation, a weak air flow in a certain direction is generated from the air intake 9 toward the suction port 8 by suction. The weak air flow is set to a speed that does not substantially affect the mass of the normal droplet 14a.

  FIG. 6 shows how the scattered droplets 15 are dropped from the liquid ejection head as the droplets 14a are dropped. As described above, since a weak air flow in a certain direction is generated from the air inlet 9 toward the suction port 8, the scattered droplet 15 generated simultaneously with the dropping of the droplet 14 a bends the movement locus by the air flow. Then, it adheres onto the slit member 2 and forms a liquid reservoir 15a. Of the liquid separated by constriction during ejection, the residual liquid 16 remaining on the ejection surface 4 is biased toward the suction port 8 by the air flow and gathers in the stepped portion 4a and drops onto the slit member 2 by its own weight. .

  As described above, in the present embodiment, the slit member 2 is disposed so as to be opposed to the discharge surface 4 of the nozzle member 1 and the slit member 2 is opposed to the nozzle 3 in the slit member 2 than the nozzle 3. An opening 6 having a large size is formed, and a suction means for sucking the air in the gap 5 in the lateral direction of the nozzle 3 is provided by providing the nozzle member 1 with a suction port 8 and an air intake port 9. And By creating a flow of air in a certain direction that passes through the region of the nozzle 3, the movement trajectory of the scattered droplets is shifted and blocked by the slit member 2, so that the scattering is removed and the liquid adheres to parts other than the application target. Can be prevented.

  At the time of non-ejection after the droplet 14a is dropped, stronger suction is performed from the suction port 8 as compared to weak suction during ejection. As described above, since the intake port 8 is arranged directly above the slit member 2, by performing strong suction from the intake port 8 at the time of non-ejection, the droplets 15 and dripping from the residual liquid 16 due to its own weight. The accumulated liquid can be sucked and cleaned. As described above, for cleaning the unnecessary liquid accumulated on the slit member 2, a sufficiently strong air flow is generated as compared with the weak air flow at the time of discharge. There is no impact on

  As described above, abnormal application of the liquid 14 to the non-target position of the application target (in this case, for example, the non-defective chip 13) can be prevented.

(Embodiment 2)
7A and 7B show a schematic configuration of the liquid discharge head used in the liquid discharge apparatus according to the second embodiment. FIG. 7A is a cross-sectional view of the liquid discharge head, and FIG. 7B is a bottom view thereof. FIG. 7A shows a cross section taken along line BB of FIG. 7B. The basic configuration of the liquid discharge head is the same as that of the first embodiment shown in FIGS. 1A and 1B, and the same components are denoted by the same reference numerals and the description thereof will not be repeated. .

  In the liquid discharge head of the present embodiment, a nozzle member 17 having a mode different from the nozzle member 1 in the first embodiment is used, and an inclined discharge surface 18 inclined with respect to the liquid discharge direction from the nozzle 3 is provided. It is characterized by being. A stepped portion 18 a is formed at the periphery of the inclined ejection surface 18, and the dimension of the stepped portion 18 a is larger than the outer shape of the opening 4 of the slit member 2. The inclined discharge surface 18 is inclined so as to descend from the air intake 9 toward the suction port 8. Therefore, the angle formed between the inclined discharge surface 18 and the side surface of the stepped portion 18 a becomes an acute angle on the suction port 8 side. It is formed as follows.

  The operation of this liquid discharge head is as follows. That is, of the liquid separated by constriction at the time of discharge, the liquid remaining on the inclined discharge surface 18 is likely to gather at the acute angle portion of the inclined discharge surface 18 by suction from the suction port 8 and drops onto the slit member 2 by its own weight. By having such a configuration, compared to the first embodiment, the effect of guiding the scattered droplets 15 to the non-target position of the application target is improved, and as a result, abnormal application to the application target is more reliably performed. Can be prevented.

(Embodiment 3)
A schematic configuration of a liquid discharge head used in the liquid discharge apparatus according to Embodiment 3 is shown in FIGS. 8A and 8B. 8A is a cross-sectional view of the liquid discharge head, and FIG. 8B is a bottom view thereof. FIG. 8A shows a cross section taken along the line CC of FIG. 8B. The basic configuration of the liquid discharge head is the same as that of the first embodiment shown in FIGS. 1A and 1B, and the same components are denoted by the same reference numerals and the description thereof will not be repeated. .

  The liquid discharge head according to the present embodiment is characterized in that the peripheral portion of the opening 20 of the slit member 19 protrudes to the side facing the discharge surface 4 to form a convex peripheral portion 20a. The dimension of the step 4a at the periphery of the discharge surface 4 is larger than the outer shape of the convex periphery 20a.

  The operation of this liquid discharge head is as follows. That is, the liquid that accumulates on the surface of the slit member 19 drops because the liquid remaining on the scattered droplets 15 and the ejection surface 4 drops as described above. In contrast, in the present embodiment, the convex peripheral edge portion 20a is formed in a convex shape in the direction of the ejection surface 4, so that the amount of accumulated liquid can be increased, and cleaning by strong intake from the intake port 8 can be performed. The number of times can be reduced.

  Moreover, even if the scattered droplets dropped on the slit member 19 (the right side of the slit member 19 shown in FIG. 8A) may flow backward in the direction of the opening 20, the convex peripheral edge 20a plays a role of returning. By fulfilling, abnormal application to the application object can be effectively prevented.

(Embodiment 4)
A schematic configuration of a liquid discharge head used in the liquid discharge apparatus according to Embodiment 4 is shown in FIGS. 9A to 9C. 9A is a cross-sectional view of the liquid discharge head, and FIG. 9B is a bottom view thereof. FIG. 9A shows a cross section along the line DD in FIG. 9B. FIG. 9C is a plan view showing an upper surface portion of the slit member 2. The basic configuration of the liquid discharge head is the same as that of the first embodiment shown in FIGS. 1A and 1B, and the same components are denoted by the same reference numerals and the description thereof will not be repeated. .

  Sealing walls 22a and 22b for sealing the side portions of the gap 5 are formed on both side edges of the outer region of the discharge surface 4 of the nozzle member 21 as in the first embodiment. 24 is provided. The liquid discharge head according to the present embodiment is characterized in that a pair of rectifying plates 25 that restrict both sides of the air flow between the suction port 23 and the air intake port 24 are provided. The current plate 25 is disposed on the slit member 2 as shown in FIGS. 9A and 9C. Further, the gap between the pair of rectifying plates 25 is wider on the air intake 24 side than on the suction port 23 side. This rectifying plate 25 can generate a certain amount of undisturbed airflow.

  In FIG. 9B, the air intake port 24 is set to have a larger opening size than the suction port 23, but may be the same size.

  Further, the rectifying plate 25 is a partition shape that linearly connects the air intake port 9 and the suction port 8 as the rectifying plate 26 shown in FIGS. 10A and 10B, that is, the pair of rectifying plates 26 are parallel to each other. May be. Also in this case, as shown in FIG. 9B, the air intake 9 may have a larger opening size than the suction port 8.

  By arranging the current plate 25 or the current plate 26 and eliminating the dead space of the air flow, the air flow can be further stabilized. Further, the scattered droplets can be attached to the slit member 2 with a weaker air flow. By weakening the air flow, it is possible to improve the accuracy of the application position on the original object to be applied (in this case, the non-defective wafer 13). In addition, a very small amount of discharge that is easily affected by the air flow is also possible.

  The liquid discharge head according to the present invention can efficiently remove the liquid that should not adhere to the application target when the liquid is discharged and when the liquid is not discharged, thereby improving the reliability of the liquid discharge apparatus. it can. Therefore, it is useful in various technical fields such as the electronics field and optoelectronics field related to the manufacture of various devices such as application of adhesives for semiconductor device packages and insulation processing in inspection processes.

1, 17, 21 Nozzle member 2, 19 Slit member 3, 32 Nozzle 3a Through hole 4 Discharge surface 4a, 18a Stepped portion 5 Gap 6 Opening portion 7, 7a, 7b, 22a, 22b Sealing wall 8, 23 Suction port 9, 24 air intake 10 base 11 semiconductor wafer 12 defective chip 13 non-defective chip 14 liquid 14a droplet 14b coating film 15 splashed droplet 15a liquid reservoir 16 liquid remaining portion 18 inclined discharge surface 20 opening 20a convex shape peripheral portion 25, 26 rectification Plate 31 Pressure chamber 33 Nozzle plate 34 Actuator 35 Elastic partition member 36 Actuator holding member 37 Exterior member 37a Recessed portion 38 Supply pipe 39 Suction passage

Claims (11)

In a liquid discharge head comprising a nozzle member having a discharge surface provided with a nozzle, and configured to discharge liquid supplied from the nozzle in a drop shape through a through hole communicating with the nozzle.
A slit member disposed oppositely with a gap between the nozzle member and the discharge surface;
An opening formed at a position facing the nozzle in the slit member and having a size larger than the nozzle;
A suction means for sucking air in the gap in a lateral direction of the nozzle;
A liquid discharge head characterized in that at least a part of the scattered droplets of the liquid, which is an unnecessary component generated from the nozzle when the droplet liquid is discharged, is blocked by a portion around the opening of the slit member. .   2. The liquid according to claim 1, wherein the suction unit includes a suction port disposed on a side of the nozzle, and has a structure for generating a constant amount of air flow by suction from the suction port with a negative pressure. Discharge head. A sealing wall provided on both sides of the outer region of the discharge surface and sealing the side of the gap;
The suction port is provided by opening a part of the blocking wall,
The liquid discharge head according to claim 2, wherein an air intake port is provided by opening a part of the blocking wall in a region opposite to the suction port with respect to the nozzle. A pair of baffle plates that regulate the side of the air flow between the air intake and the suction port;
The liquid discharge head according to claim 2, wherein the rectifying plate is configured to generate a certain amount of undisturbed airflow.   The liquid discharge head according to claim 4, wherein a distance between the pair of rectifying plates is wider on the air intake side than on the suction port side.   The discharge surface is provided by projecting a region around the nozzle from the outer region, and a stepped portion is formed between the discharge region and the outer dimension of the discharge surface is the opening of the slit member. The liquid discharge head according to claim 1, wherein the liquid discharge head is set to be larger than a dimension.   The liquid discharge head according to claim 6, wherein the discharge surface is inclined with respect to a liquid discharge direction from the nozzle.   6. The liquid ejection head according to claim 3, wherein the suction port is disposed at a position biased toward the slit member in the blocking wall.   9. The liquid discharge head according to claim 1, wherein a peripheral edge of the opening of the slit member has a convex shape on a side facing the discharge surface. A liquid discharge head according to any one of claims 1 to 9,
A liquid ejection apparatus comprising: an operation for supplying the liquid through the through hole and ejecting the liquid from the nozzle in a drop shape; and a control unit for controlling a suction operation by the suction means.   The control unit removes the liquid on the slit member by strongly performing suction from the suction port when the liquid is not ejected compared to when ejecting the liquid from the nozzle. The liquid ejecting apparatus according to claim 10, which is controlled to the above.

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