JP2012227428A - Induction coupling plasma processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an induction coupling plasma processing apparatus which can generate strong plasma in a processing chamber even if a dielectric window is divided into three or more pieces, which is a greater number when compared with prior art, in order to accommodate upsizing of a processed substrate.SOLUTION: The induction coupling plasma processing apparatus comprises high frequency antennas 11a-11c which generate induction coupling plasma in a plasma generation region within a processing chamber, and a dielectric window 3 arranged between the plasma generation region and the high frequency antennas 11a-11c, and including a plurality of dielectric members 3a-3h and a conductive beam 7 for supporting the plurality of dielectric members 3a-3h. The conductive beam 7 divides the dielectric window 3 into three or more per one side, and a closed loop circuit 200 is not formed along the high frequency antennas 11a, 11b in the center part of the dielectric window 3, when the conductive beam 7 divides the dielectric window 3 into three or more per one side.

Description

  The present invention relates to an inductively coupled plasma processing apparatus for performing plasma processing on a substrate such as a glass substrate for manufacturing a flat panel display (FPD) such as a liquid crystal display (LCD).

  In a manufacturing process of a liquid crystal display (LCD) or the like, various plasma processing apparatuses such as a plasma etching apparatus and a plasma CVD film forming apparatus are used to perform a predetermined process on a glass substrate. Conventionally, a capacitively coupled plasma processing apparatus has been widely used as such a plasma processing apparatus. Recently, however, an inductively coupled plasma (ICP) process has a great advantage that a high-density plasma can be obtained. The device is drawing attention.

  In an inductively coupled plasma processing apparatus, a high frequency antenna is disposed outside a dielectric window of a processing chamber that accommodates a substrate to be processed, a processing gas is supplied into the processing chamber, and high frequency power is supplied to the high frequency antenna. Inductively coupled plasma is generated in the chamber, and a predetermined plasma treatment is performed on the substrate to be processed by the inductively coupled plasma. As a high-frequency antenna for an inductively coupled plasma processing apparatus, a planar antenna having a predetermined planar pattern is often used. As a known example, there is Patent Document 1.

  Recently, the size of the substrate to be processed has increased. For example, taking a rectangular glass substrate for LCD as an example, the length of the short side × long side is changed from about 1500 mm × about 1800 mm to about 2200 mm × about 2400 mm, and further about 2800 mm × about 3000 mm. The increase in size is remarkable.

  In the case of an inductively coupled plasma processing apparatus, a dielectric window is interposed between the high frequency antenna and the processing chamber. If the substrate to be processed is enlarged, the dielectric window is also enlarged. As described in Patent Document 1, generally, quartz glass or ceramic is used for the dielectric window.

  However, quartz glass and ceramic are brittle and are not suitable for enlargement. For this reason, for example, as described in Patent Document 2, the size of the dielectric window is increased by dividing the quartz glass into divided pieces having an appropriate size by dividing into four pieces.

Japanese Patent No. 3077709 Japanese Patent No. 3609985

  By the way, the enlargement of the substrate to be processed is still progressing significantly. For this reason, unless the number of divisions of the dielectric window portion is further increased, the size of the appropriate division pieces cannot be obtained.

  However, in accordance with the increase in the size of the substrate to be processed, a method of dividing the whole into four equally by dividing into two per side in Patent Document 2 using a method by linear division as described in Patent Document 2 In the same manner as described above, if the dielectric window portion is divided into three or more per side and divided into nine equal parts, the induced electric field generated in the processing chamber is reduced for the reason described later, and accordingly, the plasma generated by the induced electric field is generated. There is a situation that it becomes weak.

  This invention generates a strong plasma in the processing chamber even when the dielectric window is divided into three or more per side and divided into a larger number of divided pieces than the prior art in response to the increase in size of the substrate to be processed. An inductively coupled plasma processing apparatus is provided.

  An inductively coupled plasma processing apparatus according to an aspect of the present invention is an inductively coupled plasma processing apparatus that generates inductively coupled plasma in a plasma generation region in a processing chamber and plasma-treats a substrate, wherein the inductively coupled plasma processing device is in the plasma generation region. A dielectric window including a high-frequency antenna for generating plasma, a plurality of dielectric members disposed between the plasma generation region and the high-frequency antenna, and a conductive beam supporting the plurality of dielectric members; The conductive beam divides the dielectric window part into three or more per side, and the conductive beam includes the dielectric beam when the conductive beam divides the dielectric window part into three or more per side. There is no closed-loop circuit that occurs along the high-frequency antenna at the center of the body window.

  According to this invention, even when the dielectric window is divided into three or more per side and divided into a larger number of divided pieces than in the prior art in response to an increase in the size of the substrate to be processed, strong plasma is generated in the processing chamber. An inductively coupled plasma processing apparatus can be provided.

Sectional drawing which shows schematically the inductively coupled plasma processing apparatus which concerns on one Embodiment of this invention (A) The figure is a top view which shows the 1st division example of the dielectric material window part with which the inductively coupled plasma processing apparatus which concerns on one Embodiment is equipped, (B) figure, (C) figure shows a high frequency antenna from (A) figure Omitted plan view (A) The figure is a top view which shows the 2nd example of division | segmentation of the dielectric material window part with which the inductively coupled plasma processing apparatus which concerns on one Embodiment is equipped, (B) figure, (C) figure shows a high frequency antenna from (A) figure Omitted plan view (A) The figure is a top view which shows the 3rd division example of the dielectric material window part with which the inductively coupled plasma processing apparatus which concerns on one Embodiment is equipped, (B) figure, (C) figure shows a high frequency antenna from (A) figure Omitted plan view (A) The figure is a top view which shows the 4th division example of the dielectric window part with which the inductively coupled plasma processing apparatus which concerns on one Embodiment is equipped, (B) The top view which abbreviate | omitted the high frequency antenna from (A) figure Plan view showing another example of a high-frequency antenna (A) is a plan view of a nine-division type dielectric window section obtained by dividing the dielectric window section into three per side, and (B) to (D) are plan views in which the high-frequency antenna is omitted from FIG. (A) is a plan view of a 16-division type dielectric window portion obtained by dividing the dielectric window portion into four per side, and (B) is a plan view in which the high-frequency antenna is omitted from FIG.

  Prior to the description of the embodiment, a description will be given of the fact that the induced electric field generated in the processing chamber is reduced when the dielectric window is divided into three or more per side.

  FIG. 7A is a plan view of a nine-divided dielectric window portion obtained by dividing the dielectric window portion into three per side, and FIGS. 7B to 7D are plan views in which the high-frequency antenna is omitted from FIG. 7A.

  As shown in FIGS. 7A and 7B, the nine-divided dielectric window 103 is divided into a total of nine divided pieces (a plurality of divided dielectric members) 103a to 103i, each 3 × 3 in length and width. The divided pieces 103a to 103i are supported by conductive support beams having a lattice-like plane pattern, for example, metal support beams 107. In this example, there are three sets of high-frequency antennas 111, which are divided into an inner high-frequency antenna 111a, an intermediate high-frequency antenna 111b, and an outer high-frequency antenna 111c. The inner high-frequency antenna 111 a is disposed above one divided piece 103 i disposed in the central portion of the dielectric window portion 103, and the intermediate high-frequency antenna 111 b and the outer high-frequency antenna 111 c are disposed in the outer portion of the dielectric window portion 103. The eight divided pieces 103a to 103h are disposed above.

  However, in the case of such a nine-divided dielectric window 103, a ring is formed along the inner high-frequency antenna 111a and the intermediate high-frequency antenna 111b in the metal beam 107 between the inner high-frequency antenna 111a and the intermediate high-frequency antenna 111b. A closed loop circuit 200 that is parasitically generated is formed.

  In the closed loop circuit 200, when the current I flows clockwise through the inner high-frequency antenna 111a and the intermediate high-frequency antenna 111b, the current Ii flows counterclockwise (FIG. 7C). On the other hand, when a current I flows counterclockwise through the inner high-frequency antenna 111a and the intermediate high-frequency antenna 111b, a current Ii flows through the closed loop circuit 200 clockwise (FIG. 7D). This is a so-called counter electromotive force.

  When the current Ii due to the back electromotive force flows in the metal beam 107, the current Ii acts to cancel the induced electric field generated in the processing chamber by the inner high frequency antenna 111a and the intermediate high frequency antenna 111b. For this reason, the induction electric field generated in the processing chamber is reduced, and the plasma generated in the processing chamber is weakened. Such a situation is solved in the following embodiment.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the same reference numerals are given to the same parts throughout the drawings.

  FIG. 1 is a cross-sectional view schematically showing an inductively coupled plasma processing apparatus according to an embodiment of the present invention. The inductively coupled plasma processing apparatus shown in FIG. 1 is used, for example, for plasma processing such as etching of metal films, ITO films, oxide films, etc., and ashing processing of resist films when forming thin film transistors on an FPD glass substrate. Can do. Here, as FPD, a liquid crystal display (LCD), an electroluminescence (Electro Luminescence; EL) display, a plasma display panel (PDP), etc. are illustrated. Moreover, it can use also for the plasma processing similar to the above with respect to the glass substrate for solar cell panels not only for the glass substrate for FPD.

  The plasma processing apparatus has a rectangular tube-shaped airtight main body container 1 made of a conductive material, for example, aluminum whose inner wall surface is anodized (anodized). The main body container 1 is grounded by a ground wire 2. The main body container 1 is divided into an antenna chamber 4 and a processing chamber 5 in the vertical direction by a dielectric window portion 3 formed to be insulated from the main body container 1. The dielectric window 3 constitutes the ceiling wall of the processing chamber 5 in this example. The dielectric window 3 is configured using a dielectric material. The dielectric material is, for example, quartz glass or ceramic.

  Between the side wall 4 a of the antenna chamber 4 and the side wall 5 a of the processing chamber 5, a support shelf 6 and a support beam 7 projecting inward of the main body container 1 toward the dielectric window 3 are provided. The support shelf 6 and the support beam 7 are made of a conductive material, preferably metal. Hereinafter, they are referred to as a metal support shelf 6 and a metal support beam 7. An example of a metal is aluminum. In this example, the metal support beam 7 also serves as a shower casing for supplying a processing gas. When the metal support beam 7 also serves as a shower housing, a gas flow path 8 extending in parallel to the surface to be processed of the substrate G to be processed is formed inside the metal support beam 7. In the gas flow path 8, a plurality of gas discharge holes 8 a for ejecting process gas into the process chamber 5 are formed. A processing gas is supplied to the gas flow path 8 from the processing gas supply mechanism 9 via the gas supply pipe 10, and the processing gas is discharged into the processing chamber 5 from the gas discharge hole 8 a.

  A high frequency antenna 11 is disposed in the antenna chamber 4 above the dielectric window 3 so as to face the dielectric window 3. The high frequency antenna 11 is disposed away from the dielectric window 3 by a spacer 12 made of an insulating member. During the plasma processing, high-frequency power for forming an induction electric field is supplied to the high-frequency antenna 11 from the first high-frequency power source 13 through the matching unit 14 and the power supply member 15. The frequency of the high frequency power is, for example, 13.56 MHz. By supplying high-frequency power to the high-frequency antenna 11, an induction electric field is formed in the plasma generation region in the processing chamber 5. The processing gas supplied from the plurality of gas discharge holes 8 a by this induction electric field is turned into plasma in the plasma generation region in the processing chamber 5.

  Below the processing chamber 5, a mounting table 16 facing the high-frequency antenna 11 through the dielectric window 3 is disposed in a state insulated from the main body container 1 by the insulating member 17. The mounting table 16 is made of a conductive material, for example, aluminum whose surface is anodized. A substrate to be processed G, for example, an LCD glass substrate is placed on the mounting table 16. The mounting table 16 is provided with an electrostatic chuck (not shown). The substrate G to be processed is attracted and held on the mounting table 16 by an electrostatic chuck. A second high-frequency power source 18 is connected to the mounting table 16 via a matching unit 19 and a feeder line 20. In this example, high-frequency power for bias is supplied to the mounting table 16 from the second high-frequency power source 18 through the matching unit 19 and the feeder line 20 during the plasma processing. The frequency of the high frequency power for bias is, for example, 3.2 MHz. By applying bias high frequency power to the mounting table 16, ions in the plasma generated in the processing chamber 5 are effectively drawn into the substrate G to be processed. Although not particularly shown, the mounting table 16 is provided with a heating means such as a ceramic heater, a temperature control mechanism including a coolant channel, a temperature sensor, and the like in order to control the temperature of the substrate G to be processed.

  On the side wall 5 a of the processing chamber 5, a loading / unloading port 21 for loading and unloading the substrate G to be processed into the processing chamber 5 is provided. The loading / unloading port 21 is opened and closed by a gate valve 22.

  An exhaust port 23 for exhausting the inside of the processing chamber 5 is provided in the bottom wall 5 b of the processing chamber 5. An exhaust device 24 including a vacuum pump is connected to the exhaust port 23. The inside of the processing chamber 5 is exhausted by the exhaust device 24, and the pressure inside the processing chamber 5 is set and maintained in a predetermined vacuum atmosphere (for example, 1.33 Pa) during the plasma processing.

  The inductively coupled plasma processing apparatus is controlled by a control unit 25 including a computer. A user interface 26 and a storage unit 27 are connected to the control unit 25. The user interface 26 includes a keyboard for a process manager to perform a command input operation for managing the inductively coupled plasma processing apparatus, a display for visualizing and displaying the operating status of the inductively coupled plasma processing apparatus, and the like. Yes. The storage unit 27 includes a control program that implements various processes executed by the inductively coupled plasma processing apparatus under the control of the control unit 25, and a program that causes each part of the inductively coupled plasma processing apparatus to execute processes according to the processing conditions ( Process recipe) is stored. The process recipe may be stored in a hard disk or a semiconductor memory, or may be set in the storage unit 27 in a state of being stored in a portable storage medium such as a CD-ROM or a DVD. Furthermore, the process recipe may be appropriately transmitted from another apparatus via a dedicated line, for example. The plasma processing is performed under the control of the control unit 25 by calling an arbitrary process recipe from the storage unit 27 according to an instruction from the user interface 26 and causing the control unit 25 to execute processing according to the process recipe. .

  Next, a dielectric window provided in the inductively coupled plasma processing apparatus according to an embodiment of the present invention will be described.

(First division example of dielectric window)
FIG. 2A is a plan view showing a first division example of a dielectric window part included in the inductively coupled plasma processing apparatus according to one embodiment of the present invention, and FIGS. 2B and 2C are plan views in which the high frequency antenna is omitted from FIG. 2A. is there.

  As shown in FIGS. 2A and 2B, the planar shape of the dielectric window 3 according to the first division example is rectangular. The rectangular dielectric window 3 is divided into three parts per side, and divided into eight divided pieces (a plurality of divided dielectric members) 3a to 3h. These divided dielectric windows 3a to 3h are supported on the metal support shelf 6 and the metal support beam 7, respectively.

  In this example, the high-frequency antenna 11 includes an annular inner high-frequency antenna 11a, an annular outer high-frequency antenna 11c, and an annular intermediate high-frequency antenna 11b between the inner high-frequency antenna 11a and the outer high-frequency antenna 11c. .

  The method of dividing the dielectric window 3 in this example is as follows.

  As described above, if the dielectric window is simply divided into three parts per side, a nine-part configuration as shown in FIG. 7 is obtained. However, in the antenna configuration of the present embodiment, the current due to the back electromotive force is Since it flows to the closed loop circuit 200, it is necessary to prevent the closed loop circuit 200 from occurring. Therefore, as shown in FIG. 2C, when the rectangular dielectric window 3 is divided into three parts per side using the metal support beam 7, the dielectric shown by an imaginary line (two-dot chain line) in the figure. In order to prevent the closed loop circuit 200 from being generated in the central portion of the window 3, in this example, the metal support beam 7 that generates the closed loop circuit 200 is directed toward the center point of the dielectric window 3 as indicated by an arrow in the figure. And bend. As a result, as shown in FIG. 2A, the high-frequency antenna 11, in this example, the inner high-frequency antenna 11 a intersects the metal support beam 7 in the central portion of the dielectric window portion 3. Thus, by devising the arrangement of the metal support beams 7, the closed-loop circuit 200 that was about to occur along the antennas 11a and 11b was eliminated between the inner high-frequency antenna 11a and the intermediate high-frequency antenna 11b. As a result of the disappearance of the closed loop circuit 200, the current due to the counter electromotive force does not flow in the metal support beam 7, and the dielectric window portion 3 is generated in the processing chamber 5 which is generated when trying to divide the dielectric window portion 3 into three or more per side. The situation that the induced electric field to be generated is reduced can be solved. As shown in FIG. 2C, when the rectangular dielectric window portion 3 is divided into three parts per side using the metal support beam 7, the center of the dielectric window portion 3 is shown as indicated by an imaginary line in the figure. In part, a closed loop circuit 200 is about to occur in the metal support beam 7. In this example, the metal support beam 7 that is to generate the closed loop circuit 200 is bent toward the center point of the dielectric window portion 3 as indicated by an arrow in the figure. As a result, as shown in FIG. 2A, the high-frequency antenna 11, in this example, the inner high-frequency antenna 11 a intersects the metal support beam 7 in the central portion of the dielectric window portion 3. Thus, by devising the arrangement of the metal support beams 7, the closed-loop circuit 200 that was about to occur along the antennas 11a and 11b was eliminated between the inner high-frequency antenna 11a and the intermediate high-frequency antenna 11b. As a result of the disappearance of the closed loop circuit 200, the current due to the counter electromotive force does not flow in the metal support beam 7, and the dielectric window portion 3 is generated in the processing chamber 5 which is generated when trying to divide the dielectric window portion 3 into three or more per side. The situation that the induced electric field to be generated is reduced can be solved.

  Therefore, according to the inductively coupled plasma processing apparatus according to the embodiment, even when the dielectric window 3 is divided into three or more per side, it is possible to generate strong plasma in the processing chamber 5. Can be obtained.

  In this example, the metal support beam 7 has a radial portion extending radially at the center portion of the dielectric window portion 3, and the metal support beam 7 intersects at the center portion of the dielectric window portion 3. It has a shape.

  In addition, the radial portion is along the diagonal line of the dielectric window 3.

(Second example of division of dielectric window)
The situation that the induced electric field generated in the processing chamber 5 when the dielectric window is divided into three per side is reduced also occurs when the dielectric window is divided into four per side. Reference examples are shown in FIGS. 8A and 8B.

  FIG. 8A is a plan view of a 16-division type dielectric window portion obtained by dividing the dielectric window portion into four per side, and FIG. 8B is a plan view in which the high-frequency antenna is omitted from FIG. 8A.

  As shown in FIGS. 8A and 8B, the 16-divided dielectric window 103 is divided into a total of 16 divided pieces (a plurality of divided dielectric members) 103a to 103p, each 4 × 4 in length and width. These divided pieces 103a to 103p are supported by conductive support beams having a lattice-like plane pattern, for example, metal support beams 107. The high-frequency antenna 111 includes an inner high-frequency antenna 111a, an intermediate high-frequency antenna 111b, and an outer high-frequency antenna 111c, and the inner high-frequency antenna 111a and the intermediate high-frequency antenna 111b are arranged in four central portions of the dielectric window 103. The outer high-frequency antenna 111c is disposed above the twelve divided pieces 103a to 103l disposed on the outer portion of the dielectric window 103.

  In such a 16-divided dielectric window 103, as shown in FIG. 8A, the intermediate high-frequency antenna 111b and the outer high-frequency antenna 111c are placed in a metal beam 107 between the intermediate high-frequency antenna 111b and the outer high-frequency antenna 111c. A closed-loop circuit 200 that is generated in a parasitic manner in a ring shape is formed. Similarly to the closed loop circuit 200 of the nine-divided dielectric window shown in FIGS. 7A to 7C, a current due to the counter electromotive force flows through the closed loop circuit 200. Therefore, the current due to the back electromotive force acts to cancel the induced electric field generated in the processing chamber by the inner high-frequency antenna 111a and the intermediate high-frequency antenna 111b, and the induced electric field generated in the processing chamber is reduced and generated in the processing chamber. Plasma weakens.

  Thus, the closed loop circuit 200 is generated when the metal support beam 107 divides the dielectric window 103 into three or more per side. In other words, when the dielectric window 103 is divided into two per side as in Patent Document 2, such a closed loop circuit does not occur, so there is no problem to be solved as in the present application.

  The second division example is an example in which the closed loop circuit 200 is eliminated when the dielectric window is divided into four per side.

  FIG. 3A is a plan view showing a second example of division of the dielectric window provided in the inductively coupled plasma processing apparatus according to one embodiment of the present invention, and FIGS. 3B and 3C are plan views in which the high-frequency antenna is omitted from FIG. 3A. is there.

  As shown in FIGS. 3A and 3B, the planar shape of the dielectric window portion 3 according to the second division example is a rectangular shape as in the first division example. The rectangular dielectric window part 3 is divided into four parts per side, and divided into twelve pieces (divided plural dielectric members) 3a to 3l. These divided dielectric windows 3a to 3l are supported on the metal support shelf 6 and the metal support beam 7, respectively.

  The high-frequency antenna 11 includes an annular inner high-frequency antenna 11a, an annular outer high-frequency antenna 11c, and an annular intermediate high-frequency antenna 11b between the inner high-frequency antenna 11a and the outer high-frequency antenna 11c.

  The method of dividing the dielectric window 3 in this example is as follows.

  As described above, if the dielectric window is simply divided into four parts per side, a 16-divided configuration as shown in FIG. 8 can be obtained. However, in the antenna configuration of the present embodiment, the current due to the back electromotive force is Since it flows to the closed loop circuit 200, it is necessary to prevent the closed loop circuit 200 from occurring. Therefore, as shown in FIG. 3C, when the dielectric window portion 3 is divided into four parts per side using the metal support beam 7, a closed loop circuit 200 is generated in the central portion of the dielectric window portion 3 (imaginary line in the figure). In this example, the metal support beam 7 that generates the closed loop circuit 200 is directed toward the center point of the dielectric window portion 3 as indicated by an arrow in the figure, as in the first division example. And bend. As a result, as shown in FIG. 3A, the high frequency antenna 11, the inner high frequency antenna 11 a and the intermediate high frequency antenna 11 b intersect the metal support beam 7 in the central portion of the dielectric window portion 3.

  Thus, also in the second division example, the arrangement of the metal support beam 7 is devised so that the inner high frequency antenna 11a and the intermediate high frequency antenna 11b intersect the metal support beam 7, so that the intermediate high frequency antenna 11b and the outer high frequency antenna 11b are arranged. The closed loop circuit 200 that has been generated along the antennas 11b and 11c is eliminated between the antenna 11c and the antenna 11c. As a result of the disappearance of the closed loop circuit 200, the same advantage as in the first division example can be obtained in the second division example.

  Also in this example, the metal support beam 7 has a radial portion extending radially at the center portion of the dielectric window portion 3, and the metal support beam 7 intersects at the center portion of the dielectric window portion 3. It has a planar shape.

  In addition, the radial portion is along the diagonal line of the dielectric window 3.

(Third division example of dielectric window)
The third division example is an example in which the number of divisions is further increased from the first division example.

  FIG. 4A is a plan view showing a third example of division of the dielectric window provided in the inductively coupled plasma processing apparatus according to one embodiment of the present invention, and FIGS. 4B and 4C are plan views in which the high frequency antenna is omitted from FIG. 4A. is there.

  As shown in FIGS. 4A and 4B, in the third division example, the rectangular dielectric window portion 3 is divided into three per side, and further, the dielectric window portion is further divided into pieces other than the corner portions. 3 is further divided along the circumferential direction 3. As a result, in this example, the dielectric window portion 3 is divided into 12 pieces (divided pieces of a plurality of dielectric members) 3a to 3l. These divided dielectric windows 3a to 3l are supported on the metal support shelf 6 and the metal support beam 7, respectively.

  The method of dividing the dielectric window 3 in this example is as follows.

  As shown in FIG. 4C, when the dielectric window portion 3 is further divided along the circumferential direction θ using the metal support beam 7, a closed loop circuit is formed in the metal support beam 7 in the central portion of the dielectric window portion 3. 200 occurs (indicated by phantom lines in the figure). In this example, the metal support beam 7 that is to cause the closed-loop circuit 200 is not bent toward the center point of the dielectric window 3, but the metal support beam 7 is removed so that the closed-loop circuit 200 disappears. The dielectric window portion 3 is arranged so as to be interrupted at the central portion.

  Thus, in the third division example, the intermediate high-frequency antenna 11b and the outer high-frequency antenna 11c are obtained by interrupting the metal support beam 7 that is to generate the closed-loop circuit 200 at the central portion of the dielectric window portion 3. In the meantime, the closed loop circuit 200 which was going to occur along these antennas 11b and 11c is lost. As a result of the disappearance of the closed loop circuit 200, the third division example can obtain the same advantages as those of the first and second division examples.

(Fourth division example of dielectric window)
In the fourth division example, when the dielectric window 3 is divided into three or more per side, all the metal support beams 7 in the central portion of the dielectric window 3 are crossed with the high frequency antenna 11 so that the metal The arrangement of the support beams 7 is devised.

  FIG. 5A is a plan view showing a fourth division example of the dielectric window provided in the inductively coupled plasma processing apparatus according to the embodiment of the present invention, and FIG. 5B is a plan view in which the high-frequency antenna is omitted from FIG. 5A.

  As shown in FIGS. 5A and 5B, in the fourth division example, the rectangular dielectric window 3 is divided into three parts per side (for example, three divisions 3a, 3b, and 3c on the upper side in FIG. 5B). At this time, the metal support beam 7 is arranged in the center of the dielectric window 3 in a direction intersecting with the inner high frequency antenna 11a, the intermediate high frequency antenna 11b, and the outer high frequency antenna 11c formed in a ring shape along the circumferential direction. Is. In this example, the direction intersecting the circumferential direction is the diagonal direction of the dielectric window 3. The dielectric window 3 is first divided into four along two diagonal lines.

  Furthermore, the dielectric window 3 is connected to a line connecting the center o1 of the first side and the center o2 of the second side adjacent to the first side in the clockwise direction, the center o2 of the second side and the second side A line connecting the center o3 of the third side adjacent to the side clockwise, a line connecting the center o3 of the third side and the center o4 of the fourth side adjacent to the third side clockwise, Further division is performed along a line connecting the center o4 of the four sides and the center o1 of the first side adjacent to the fourth side in the clockwise direction.

  By such division, the dielectric window portion 3 is divided into 12 divided pieces (divided plural dielectric members) 3a to 3l. These divided dielectric windows 3a to 3l are supported on the metal support shelf 6 and the metal support beam 7, respectively.

  Thus, even if the arrangement of the metal support beam 7 is devised so that all sides of the metal support beam 7 intersect the high-frequency antennas 11a, 11b, and 11c in the central portion of the dielectric window 3, the closed-loop circuit is provided. 200 no longer occurs. As a result of the closed loop circuit 200 not being generated, the same advantages as the first to third division examples can be obtained in the fourth division example.

  As described above, according to the embodiment of the present invention, even when the dielectric window 3 is divided into three or more per side, a closed loop circuit in which a counter electromotive force is generated is not generated. An inductively coupled plasma processing apparatus capable of generating plasma can be provided.

  The present invention is not limited to the above-described embodiment and can be variously modified. Further, in the embodiment of the present invention, the above-described embodiment is not the only embodiment.

  For example, the structure of the high frequency antenna 11 is not limited to the structure disclosed in the above embodiment. For example, a spiral high frequency antenna 40 as shown in FIG. 6 can also be used.

  As shown in FIG. 6, the spiral high frequency antenna 40 is connected to the power supply member 15 shown in FIG. 1 at a position shifted by 90 ° at substantially the same radial position from the center around the center portion 4. Two power supply portions 41, 42, 43, and 44 are provided, and two antenna wires extend outward from each of the power supply portions 41, 42, 43, and 44. A capacitor 45 is connected to the end of each antenna line, and each antenna line is grounded via the capacitor 45.

  Such a spiral high-frequency antenna 40 has portions where antenna wires are densely arranged. In this example, there are two places where the antenna wires are densely arranged on the inner side and the outer side. The inner portion 46a where the antenna lines are densely arranged corresponds to the inner high frequency antenna 11a of the above-described embodiment. The outer portion 46b where the antenna lines are densely arranged corresponds to the intermediate high-frequency antenna 11b or the outer high-frequency antenna 11c of the above-described embodiment.

  The structure of the high-frequency antenna 11 is not limited to an annular shape or a spiral shape, and any structure can be adopted as long as an induction electric field can be formed in the main body container 1.

  Furthermore, although the ashing device is illustrated as an example of the inductively coupled plasma processing apparatus in the above embodiment, the present invention is not limited to the ashing apparatus but can be applied to the other plasma processing apparatus such as etching and CVD film formation.

  Furthermore, although the FPD substrate is used as the substrate to be processed, the present invention is not limited to this and can be applied to the case of processing the other substrate such as a semiconductor wafer.

  DESCRIPTION OF SYMBOLS 1; Main body container, 3; Dielectric material window part, 4; Antenna chamber, 5; Processing chamber, 6; Metal support shelf, 7: Metal support beam, 11: High frequency antenna, 16;

Claims (7)

An inductively coupled plasma processing apparatus for generating inductively coupled plasma in a plasma generation region in a processing chamber and plasma processing a substrate,
A high frequency antenna for generating the inductively coupled plasma in the plasma generation region;
A dielectric window portion disposed between the plasma generation region and the high-frequency antenna and including a plurality of dielectric members and conductive beams supporting the plurality of dielectric members;
The conductive beam divides the dielectric window into three or more per side;
In addition, the conductive beam does not have a closed loop circuit generated along the high-frequency antenna at a central portion of the dielectric window when the conductive beam divides the dielectric window into three or more per side. An inductively coupled plasma processing apparatus.   The inductive coupling according to claim 1, wherein the conductive beam is disposed so as to intersect the high-frequency antenna at a central portion of the dielectric window so that the closed-loop circuit is eliminated. Plasma processing equipment.   2. The conductive beam has a radial portion extending radially at a central portion of the dielectric window portion, and the conductive beam intersects at the central portion of the dielectric window portion. Alternatively, the inductively coupled plasma processing apparatus according to claim 2.   The inductively coupled plasma processing apparatus according to claim 3, wherein the radial portion is along a diagonal line of the dielectric window portion.   The said conductive beam is arrange | positioned so that it may interrupt in the center part of the said dielectric material window part so that the said closed loop circuit may be lose | disappeared. The inductively coupled plasma processing apparatus described.   5. The inductive coupling according to claim 1, wherein all sides of the conductive beam intersect the high-frequency antenna at a central portion of the dielectric window portion. 6. Plasma processing equipment. The high frequency antenna includes at least a first high frequency antenna and a second high frequency antenna outside the first high frequency antenna,
The closed-loop circuit is generated between the first high-frequency antenna and the second high-frequency antenna and in a ring shape along the first high-frequency antenna and the second high-frequency antenna. The inductively coupled plasma processing apparatus according to any one of claims 1 to 6.

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