JP2012227345A - Power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion apparatus capable of ensuring high cooling performance with low costs without using a plurality of coolers.SOLUTION: A power conversion apparatus 100 comprises: a cooler 101; a semiconductor 104 arranged on a main surface 103 of the cooler 101; a radiator 105 having a U-shaped cross section contacting with a surface opposed to a surface of the semiconductor 104 contacting with the cooler 101, and covering the semiconductor 104; a cover member 108 of the cooler 101 covering the main surface 103 of the cooler 101; and a spring member 109 provided between the cover member 108 and the radiator 105, and applying biasing force Fa in the direction of bringing the radiator 105 and the semiconductor 104 into contact with each other. The power conversion apparatus further comprises a connection member 110 which partially contacts with ends of the cooler 101 and the radiator 105, and applying biasing force Fb to an end of the radiator 105 in a direction parallel to the main surface 103 of the cooler 101.

Description

  The present invention relates to a power conversion device and relates to a technique for ensuring high cooling performance without using a plurality of coolers.

  In recent years, high-power AC motors are mounted on hybrid vehicles and electric vehicles for driving vehicles. In order to drive a high-output AC motor, a large amount of power is required, so that a large amount of power also flows through a power conversion device that converts DC power supplied from a vehicle-mounted power source into AC power and supplies the AC motor. When large power flows through the power conversion device, there is a problem that the amount of heat generated by the semiconductor provided in the power conversion device increases and the semiconductor becomes high temperature.

  Therefore, in order to efficiently cool the semiconductor provided in the power conversion device, a power conversion device is known in which a semiconductor and a cooler for cooling the semiconductor are alternately stacked (for example, Patent Document 1).

  Since this power converter cools a semiconductor using a plurality of coolers, it is possible to cool the semiconductor efficiently.

  Moreover, in order to cool the semiconductor provided in the power converter with a simple structure, the semiconductor is arranged on the plane of the cooler for cooling the semiconductor, and a radiator is provided so as to cover the semiconductor. Also known is a power conversion device that is fixed to (see, for example, Patent Document 2).

  In this power conversion device, the semiconductor is cooled by using a cooler and a radiator, respectively, so that the semiconductor can be cooled with the power conversion device and a relatively simple structure.

JP 2006-157042 A JP 2009-152505 A

  If the semiconductor and the cooler are alternately stacked as in the power conversion device disclosed in the above-mentioned Patent Document 1, and the semiconductor is cooled by using a plurality of coolers, excellent cooling performance can be ensured. However, since a plurality of coolers are required to cool the semiconductor, it has been difficult to obtain a simple structure.

  Moreover, the semiconductor can be cooled with a simple structure by disposing a semiconductor on the plane of the cooler as in the power conversion device disclosed in Patent Document 2 and further disposing a radiator so as to cover the semiconductor. I can do it. However, if there is a gap between the radiator and the cooler due to design error or vibration, it is difficult to ensure high cooling performance because the heat of the semiconductor cannot be efficiently transferred to the cooler. there were.

  This invention is for solving said subject, The objective is to provide the power converter device which can ensure high cooling performance with a simple structure, without using several cooler.

  A power converter according to a first aspect of the present invention includes a cooler, a semiconductor arranged on the main surface of the cooler, and a cross section provided so as to cover the semiconductor in contact with the surface facing the surface where the semiconductor contacts the cooler. A heat sink, a cover member of the cooler provided so as to cover the main surface side of the cooler, and a cover member and the heat sink are interposed between the heat sink and the semiconductor. A power conversion device including a spring member for applying a force, at least part of which is in contact with the cooler and the end of the radiator, and attached to the end of the radiator in a direction parallel to the main surface of the cooler. It is further provided with the connection member which provides power.

  The power conversion device according to the second invention includes a cooler, a plurality of semiconductors arranged on a main surface of the cooler, and a semiconductor in contact with a surface facing the surface in contact with the cooler and covering each semiconductor The cross section provided in the U-shaped radiator, the cover member of the cooler provided so as to cover the main surface side of the cooler, the cover member and the respective heat sink, A power conversion device including a spring member that applies a biasing force in a direction in which the semiconductor is brought into contact, at least a part of which is in contact with the cooler and the end of the radiator, and a cooling at each end of the radiator And a connecting member for applying an urging force in a direction parallel to the main surface of the vessel.

  ADVANTAGE OF THE INVENTION According to this invention, the power converter device which can ensure cooling performance with a simple structure can be provided, without using several cooler.

It is a figure which shows the structure of the power converter device which concerns on the 1st Embodiment of this invention. It is a perspective view of the heat sink mounted in the power converter device which concerns on the 1st Embodiment of this invention. It is a perspective view of the heat sink connection member mounted in the power converter device which concerns on the 1st Embodiment of this invention. It is a top view of the heat sink connection member mounted in the power converter device which concerns on the 1st Embodiment of this invention. It is the figure which expanded X in the dotted line of FIG. It is the figure which showed the cooling path | route of the power converter device which concerns on the 1st Embodiment of this invention. It is a figure which shows the structure which arranged the some semiconductor in parallel in the power converter device which concerns on the 1st Embodiment of this invention. It is a perspective view of the heat sink connection member mounted in the power converter device which concerns on the 2nd Embodiment of this invention. It is a top view of the heat sink connection member mounted in the power converter device which concerns on the 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram illustrating a structure of a power conversion device 100 according to a first embodiment of the present invention. The power conversion device 100 includes a cooler 101, a semiconductor 104, a radiator 105, a cover member 108, a spring member 109, and a radiator connecting member 110.

  The cooler 101 has cooling fins (not shown) arranged in a row in the interior at equal intervals, and forms a coolant channel 102 between adjacent cooling fins. As a member constituting the cooler 101, it is desirable to apply aluminum or the like having high thermal conductivity. Further, either a liquid or a gas may be used as the refrigerant.

  The semiconductor 104 is an electronic component constituting a power conversion circuit, and an IGBT (Insulated Gate Bipolar Transistor) or the like is used. The semiconductor 104 is mounted on the main surface 103 of the cooler 101 via grease (not shown) having high thermal conductivity and connected by soldering. Although many semiconductors are mounted on the in-vehicle power conversion device, only a part is illustrated in this specification for the sake of simplicity.

  As shown in FIG. 2, the heat radiator 105 has a U-shaped cross section, and a flat surface portion 106 that contacts a surface facing the surface where the semiconductor 104 is in contact with the cooler 101, and a heat radiator The leg part 107 extends substantially vertically from both ends of the flat part 106 toward the cooler 101, and is mounted on the semiconductor 104 via grease (not shown) having high thermal conductivity. As described above, when a large amount of power flows through the semiconductor 104, the semiconductor 104 generates heat, so that the heat of the semiconductor 104 is transmitted to the radiator 105 and radiated to the cooler 101. In addition, it is desirable to apply aluminum having high thermal conductivity as a member constituting the radiator 105.

  The cover member 108 is provided so as to cover the main surface 103 of the cooler 101 in order to protect the components mounted on the cooler 101 such as the semiconductor 104 and the radiator 105 and is fixed to the cooler 101 with a bolt 111 or the like. Is done. As a member constituting the cover member 108, it is desirable to apply aluminum having high thermal conductivity and high rigidity.

  The spring member 109 is provided between the cover member 108 and the heat radiating body 105. As shown in FIG. 1, the spring member 109 is configured so that the semiconductor 104 and the heat radiating body 105 mounted on the main surface 103 of the cooler 101 are fixed to the main surface 103 of the cooler 101. A biasing force Fa is applied to the surface facing the surface in contact with 104. The biasing force Fa can be adjusted by changing the spring constant of the spring member 109. Further, the spring member 109 may be integrally formed on the cover 108.

  As shown in FIG. 3A and FIG. 4, the radiator connecting member 110 has a shape like a truncated pyramid, and is divided into two by a plane that intersects with the bottom surface of the radiator connecting member 110 substantially perpendicularly. The heat dissipating body portions 113 (a) and 114 (a) and the elastic body portion 115 for coupling them are configured. One heat dissipating member 113 (a) is fixed to the main surface 103 of the cooler 101 by soldering or the like, and the other heat dissipating member 114 (a) is shown in FIGS. 3 (a) and 4 (a). Is arranged on the main surface 103 of the cooler 101 so as to be movable only in the direction of the arrow A (the direction in which the elastic body portion 115 of the radiator connecting member 110 applies the urging force Fb).

  With such a configuration, when the radiator 105 is disposed at a predetermined position, the slope 112 formed on the radiator part 114 (a) of the radiator connecting member 110 as shown in FIG. The heat radiating member 114 (a) of the heat connecting member 110 is shown in FIGS. 3 (a) and 4 (a) upon receiving the biasing force Fa of the spring member 109 via the legs 107 of the heat radiating member 105. The position is translated from the position to the position shown in FIGS. 3B and 4B.

  That is, by disposing the radiator 105 at a predetermined position, the elastic body portion 115 of the radiator connecting member 110 contracts, so that the radiator connecting member 110 is fixed to the main surface 103 of the cooler 101 in the state of FIG. . Meanwhile, as shown in FIGS. 3B and 4B, the elastic body portion 115 of the radiator connecting member 110 is biased to extend in a direction parallel to the main surface 103 of the cooler 101. Is generated. The heat radiating member 114 (a) of the heat radiating member connecting member 110 is pressed against the leg portion 107 of the heat radiating member 105 by the urging force Fb of the elastic member 115 of the heat radiating member connecting member 110. Accordingly, since the contact pressure between the radiator part 114 (a) of the radiator connecting member 110 and the leg part 107 of the radiator 105 can be secured, the radiator part of the radiator connecting member 110 is connected from the leg part 107 of the radiator 105. The heat transfer property to 114 (a) can be kept high. Further, since the radiator connecting member 110 is interposed between the cooler 101 and the radiator 105, a gap caused by a design error or vibration can be minimized, and high cooling performance can be secured. . The reason why the gap is generated between the radiator portions 113 (a) and 114 (a) is to absorb the dimensional variation of each component.

  Next, the path through which the heat of the semiconductor 104 is transferred to the cooler 101 will be described with reference to FIG. 6A shows the first route, and FIG. 6B shows the second route.

  The first path is a path through which the heat of the semiconductor 104 is directly transferred to the cooler 101. Since the cooler 101 is formed of aluminum or the like having high conductivity, heat from the semiconductor 104 can be efficiently transferred to the cooler 101 and the semiconductor 104 can be cooled.

  The second path is a path through which the heat of the semiconductor 104 is transmitted to the cooler 101 via the radiator 105 and the radiator connecting portion 110. First, the heat of the semiconductor 104 is transferred to the flat portion 106 of the heat radiating body 105 provided on the surface facing the surface where the semiconductor 104 is in contact with the cooler 101. Then, the heat is transmitted from the flat portion 106 of the radiator 105 to the leg 107 and to the radiator connecting member 110, and is radiated from the radiator connecting member 110 to the cooler 101. As described above, the leg 107 of the radiator 105 and the radiator connecting member 110 are contacted by the biasing force Fa of the spring member 109 and the biasing force Fb of the elastic body 115 of the radiator 105. High thermal conductivity can be ensured.

In the case where a plurality of semiconductors 104 are mounted on the cooler 101 in a planar shape as shown in FIG. It is desirable to provide the body connecting member 110. By disposing the two radiators 105 in contact with one radiator connecting member 110, the number of radiator connecting members 110 mounted on the cooler 101 can be reduced. Further, since the two radiators 105 are in contact with one radiator connecting member 110, the urging force Fa applied to the radiator connecting member 110 from the spring member 109 is increased, so that the radiator portion of the radiator connecting member 110 The contact pressure between 114 (a) and the leg 107 of the radiator 105 can be increased, and high thermal conductivity can be ensured. In this case, the radiator connecting member 110 in contact with the two radiators 105 is mounted without being soldered to the main surface 103 of the cooler 101, but the leg portions of the two radiators 105 as described above. Since the urging force Fa of the spring member 109 is applied from 107, the mounting is performed without causing positional displacement.
(Second embodiment)
Next, the structure of the power conversion apparatus 100 according to the second embodiment of the present invention will be described with reference to FIGS. 8 and 9. In the power converter 100 according to the second embodiment, the direction of the urging force that the elastic body 115 of the radiator connecting member 110 applies to the leg 107 of the radiator 105 and the radiator connecting member 110 are divided into two. The plane used in this case is different from the power converter 100 according to the first embodiment.

  FIG. 8A and FIG. 9A show the shape of the radiator connecting member 110 mounted on the main surface 103 of the cooler 101 of the power conversion device 100. The radiator connecting member 110 has a shape that intersects substantially perpendicularly to the bottom surface and is divided into two parts by a plane that is oblique to the direction in which the semiconductor 104, the radiator 105, and the like are stacked on the cooler 101. 113 (b) and 114 (b), and an elastic body 115. In the case of the first embodiment, the elastic body portion 115 of the radiator connecting member 110 mounted on the power conversion device 100 is in the direction of the arrow A shown in FIGS. 3A and 4A ( It is mounted on the radiator connecting member 110 so as to apply the urging force Fb in a direction perpendicular to the direction in which the semiconductor 104, the radiator 105, and the like are stacked, but is mounted on the power conversion device 100 of the present embodiment. As shown in FIGS. 8B and 9B, the elastic body portion 115 of the radiator connecting member 110 is in the direction of arrow B (the direction along the plane in which the radiator connecting member 110 is divided). The elastic body portion 115 of the heat radiating member connecting member 110 is provided so as to apply the urging force Fb.

  Therefore, when the heat radiator 105 is disposed at a predetermined position, the slope 112 formed on the heat radiator portion 114 (b) of the heat radiator connection member 110 is formed on the spring member 109 via the leg portion 107 of the heat radiator 105. In response to the urging force Fa, the heat radiating member 114 (b) of the heat radiating member connecting member 110 is moved from the position shown in FIGS. 8 (a) and 9 (a) to FIGS. 8 (b) and 9 (b). It moves to the position shown along the plane along which the radiator connecting member 110 is divided.

  With such a configuration, a direction in which the semiconductor 104 and the heat dissipating body 105 are separated from each other by the stress applied to the heat dissipating body 105 from the elastic body 115 of the heat dissipating member connecting member 110 (the biasing force Fa of the spring member 109 is applied) It is possible to prevent the heat radiator 105 from being deformed in the direction opposite to the direction). In addition, since the gap between the radiator portions 113 (a) and 114 (a) provided to absorb the dimensional variation of each component is not required, the thermal conductivity of the radiator connecting member 110 is further increased. I can do it.

  As described above, the power conversion device 100 according to the present invention is in contact with the cooler 101, the semiconductor 104 arranged on the main surface 103 of the cooler 101, and the surface facing the surface where the semiconductor 104 is in contact with the cooler 101, A radiator 105 having a U-shaped cross section provided to cover the semiconductor 104, a cover member 108 of the cooler 101 provided to cover the main surface side 103 of the cooler 101, the cover member 108, and the radiator 105 And a spring member 109 that applies an urging force Fa in a direction in which the radiator 105 and the semiconductor 104 are in contact with each other, at least a part of which is in contact with the cooler 101 and the end of the radiator 105 to dissipate heat. Since it further includes a radiator connecting member 110 that applies an urging force Fb in a direction parallel to the main surface 103 of the cooler 101 at the end of the body 105, a simple structure without using a plurality of coolers It is possible to ensure a high cooling performance.

  The power conversion device 100 according to the present invention is in contact with a cooler 101, a plurality of semiconductors 104 arranged on the main surface 103 of the cooler 101, and a surface facing the surface where the semiconductor 104 is in contact with the cooler 101. The cross section provided in each semiconductor 104 so as to cover 104 has a U-shaped radiator 105, the cover member 108 of the cooler 101 provided so as to cover the main surface side 103 of the cooler 101, and the cover member 108 And a spring member 109 that applies an urging force Fa in a direction in which the radiator 105 and the semiconductor 104 are brought into contact with each other, at least a part of which is an end of the cooler 101 and the radiator 105. And a radiator connecting member 110 that applies an urging force Fb in a direction parallel to the main surface 103 of the cooler 101 to each end of the radiator 105. In, without using a plurality of coolers, it is possible to ensure a high cooling performance with a simple structure.

  100: power conversion device, 101: cooler, 104: semiconductor, 105: radiator, 107: leg, 109: spring member, 110: radiator connecting member, 112: slope, 113, 114: radiator body, 115 : Elastic body

Claims (2)

A cooler,
Semiconductors arranged on the main surface of the cooler;
The semiconductor is in contact with the surface opposite to the surface in contact with the cooler, and the cross-section provided to cover the semiconductor is a U-shaped radiator,
A cover member of the cooler provided to cover the main surface side of the cooler;
A power conversion device comprising a spring member interposed between the cover member and the heat dissipator, and applying a biasing force in a direction in which the heat dissipator and the semiconductor are brought into contact with each other,
At least a part is in contact with the cooler and the end of the radiator, and further includes a connection member that applies a biasing force to the end of the radiator in a direction parallel to the main surface of the cooler. A power conversion device. A cooler,
A plurality of semiconductors arranged on the main surface of the cooler;
The semiconductor is in contact with the surface facing the cooler, and the cross-section provided on each semiconductor so as to cover the semiconductor is a U-shaped radiator,
A cover member of the cooler provided to cover the main surface side of the cooler;
A power conversion device comprising a spring member interposed between the cover member and the heat dissipator and applying a biasing force in a direction in which the heat dissipator and the semiconductor are brought into contact with each other,
At least a part is in contact with the cooler and each end of the radiator, and a connection member that applies a biasing force to each end of the radiator in a direction parallel to the main surface of the cooler. The power conversion device further comprising: