JP2012222289A - Plasma processing apparatus and plasma processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus using a single arm carrier device to achieve a high throughput.SOLUTION: A carrier device 15 of a dry etching apparatus 1 carries a preprocessing tray 3 from main shelves 67b, 68b of a cassette 62 in a stock section 13 to a rotary stage 33, and after alignment processing at the rotary stage 33, carries the tray 3 to a plasma treatment section 11 through temporally placing sections 67c, 68c in the cassette 62. The carrier device 15 also carries the processed tray 3 from the plasma treatment section 11 to the main shelves 67b, 68b of the cassette 62 in the stock section 13.

Description

  The present invention relates to a plasma processing apparatus such as a dry etching apparatus and a CVD apparatus, and a method thereof.

  Plasma processing apparatuses such as dry etching apparatuses and CVD apparatuses include a plasma processing unit that performs plasma processing on a substrate, a substrate stock unit, and a transport device for transporting a substrate between the plasma processing unit and the stock unit. In addition to the transfer unit in which the substrate is accommodated, a device including an alignment unit that performs substrate alignment before supply to the plasma processing unit is known (see Patent Documents 1 to 4). There are two types of substrate transfer devices: a double arm type having two arms for transferring a substrate and a single arm type having only one such arm (Patent Document 5).

JP 2009-182177 A JP 2002-43292 A JP-A-6-51260 JP 2001-44257 A JP 2002-166376 A, FIGS. 9 and 10

  The double arm type can continuously carry in and out the substrate with respect to the plasma processing unit or the like without a time interval, so that the throughput (the number of substrates that can be processed per unit time) can be improved. However, the double arm type has a complicated structure and is expensive.

  The single arm type has a simple structure and low cost. However, since the single arm type has a single substrate that can be transported at a time, the time required to carry the substrate in and out of the plasma processing unit or the like is longer than that of the double arm type, and the throughput is reduced.

  It is an object of the present invention to achieve high throughput in a plasma processing apparatus while adopting a single arm type transfer apparatus.

  According to a first aspect of the present invention, a plasma processing is performed on a target unit that stores a target object before and after plasma processing, a stock unit including a temporary storage unit, and the target object that is carried from the stock unit. A transfer unit that accommodates a plasma processing unit, a transfer unit that houses a transfer device that transfers the object with a single arm, and the transfer object that is not transferred from the stock unit to the plasma processing unit. A preparatory stage housed in a part, and a pretreatment unit for performing a preparatory process for the plasma treatment on the object in cooperation with the preparatory stage, The object before plasma processing is transported from the main storage section of the stock section to the preparation stage, and the object after the preliminary processing is passed from the preparation stage through the temporary storage section of the stock section. Transported to serial the plasma processing unit, and to transport said object after the plasma treatment of the plasma processing unit to the main housing portion of the stock portion, to provide a plasma processing apparatus.

  The object may be a transportable tray containing a substrate, or a large substrate itself. The tray may accommodate a substrate in a substrate accommodation hole penetrating in the thickness direction, or may accommodate a substrate in a bottomed substrate accommodation hole.

  Specifically, while the plasma processing is being performed on one target object in the plasma processing unit, the transfer device moves another target object from the main storage unit of the stock unit to the preparation stage. The preparatory processing unit performs the preliminary processing on the other one object on the preparatory stage, and the transport device further performs the another single one after the preliminary processing. The object is transported from the preparation stage to the temporary storage part of the stock part.

  While performing plasma processing on one target object, transporting another target object from the main storage unit to the preparation stage, preliminary processing by the preliminary processing unit, and transporting from the preparation stage to the temporary storage unit Is executed. Therefore, high throughput can be realized while adopting a single-arm type conveyance device with a simple configuration and low cost.

  A temporary storage part for the object after the preliminary processing is provided in the stock part. In addition, since the preliminary processing is executed by the preparation stage and the preliminary processing unit provided in the transport unit, it is not necessary to separately provide a dedicated chamber for the preliminary processing. As a result, the plasma processing apparatus can be downsized or the installation area can be reduced.

  The preliminary process executed by the preparation stage and the preliminary processing unit is, for example, a circumferential alignment process. That is, the preparation stage is rotatable around a rotation axis extending in the vertical direction, and the preliminary processing unit rotates the preparation stage around the rotation axis, thereby the target placed on the preparation stage. Adjust the rotation angle position of the object.

  Specifically, the object includes a notch on an outer periphery, and the preliminary processing unit includes a notch detection sensor that optically detects the notch of the object placed on the preparation stage, and the notch The rotation angle position of the object is adjusted by rotating the preparation stage according to the output from the detection sensor.

  The preliminary processing unit performs an inspection as to whether or not the object is in a state suitable for the plasma processing.

  For example, the object is a transportable tray in which a substrate is accommodated, and the preliminary processing unit includes a substrate detection sensor that optically detects the presence or absence of the substrate in the tray placed on the preparation stage. The presence or absence of the substrate is determined based on the output from the substrate detection sensor.

  The object is a transportable tray in which a substrate is accommodated, and the preliminary processing unit optically detects a positional shift of the substrate with respect to the tray placed on the preparation stage. And determining whether the substrate is misaligned with respect to the tray based on an output from the substrate detection sensor.

  The preparation stage is preferably lifted up and down along the vertical direction.

  With this configuration, it is not necessary for the transport device to move up and down to place the object on the preparation stage, and the configuration of the device can be simplified.

  According to a second aspect of the present invention, the preparation device accommodated in the main storage unit of the stock unit is conveyed to the preparation stage accommodated in the conveyance unit by the conveyance device accommodated in the conveyance unit, and the preparation stage Preliminary processing for the plasma processing is performed on the target object arranged above, and the target object after the preliminary processing is transported to the temporary placement unit of the stock unit by the transporting device. A plasma processing method is provided in which the counter object is transferred from the temporary placement unit to the plasma processing unit by the transfer device and plasma processing is executed.

  While the plasma processing is being performed on one target object in the plasma processing unit, another target object is transported from the main storage unit of the stock unit to the preparation stage, and then on the preparation stage. The preliminary processing is performed on the other one target object, and the another target object after the preliminary processing is transported from the preparation stage to the temporary placement section of the stock section.

  In the plasma processing apparatus and method according to the present invention, while performing plasma processing on one target, another target is transported from the main storage unit to the preparation stage, and preliminary processing is performed by the preliminary processing unit. Processing and conveyance from the preparation stage to the temporary storage unit are executed. Therefore, high throughput can be realized while adopting a single-arm type conveyance device with a simple configuration and low cost. Further, in addition to the provisional storage unit for the object after the preliminary processing being provided in the stock unit, the preliminary processing is performed by using a preparation stage provided in the transporting unit in which a transporting device for transporting the target is accommodated and a spare part. Since it is executed in the processing unit, it is not necessary to provide a dedicated chamber for the preliminary processing. Therefore, it is possible to reduce the size of the plasma processing apparatus or reduce the installation area.

1 is a horizontal sectional view of a dry etching apparatus according to an embodiment of the present invention. Sectional drawing (line II-II of FIG. 13A) of the dry etching apparatus which concerns on embodiment of this invention. Sectional drawing of the dry etching apparatus which concerns on embodiment of this invention (line III-III of FIG. 13A). 1 is a block diagram of a dry etching apparatus according to an embodiment of the present invention. The top view of a lifter and a cassette. The top view of the lifter equipped with the cassette. The side view of a cassette. The front view of a cassette. Sectional drawing in line VIII-VIII of FIG. 7B. Sectional drawing in line IX-IX of Drawing 7B. A typical sectional view showing a substrate susceptor and a tray. The perspective view which shows a tray and a board | substrate. The time chart which shows operation | movement of the dry etching apparatus which concerns on embodiment of this invention. The horizontal sectional view of the dry etching apparatus before a conveyance arm enters into a tray stock part from a conveyance part. The horizontal sectional view of a dry etching apparatus when a conveyance arm has entered the tray stock section. The horizontal sectional view of the dry etching apparatus when processing a board | substrate with a turntable. The horizontal sectional view of the dry etching apparatus before a conveyance arm enters a plasma processing part from a conveyance part. The top view which shows carrying out of the tray from the tray cassette by a conveyance arm. The typical sectional view for explaining mounting of the tray and a substrate to a substrate susceptor. The horizontal sectional view of the dry etching apparatus concerning the modification of the present invention. The horizontal sectional view of the dry etching apparatus concerning other modifications of the present invention.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  1 to 4 show an ICP (inductively coupled plasma) type dry etching apparatus 1 according to an embodiment of the present invention. In the dry etching apparatus 1, a tray 3 for transporting the substrate 2 is used.

  Referring to FIG. 11, the tray 3 is provided with a plurality (seven in this embodiment) of substrate receiving holes 4 penetrating in the thickness direction from the upper surface 3a to the lower surface 3b. There is one substrate accommodation hole 4 in the center of the tray 3, and the remaining six substrate accommodation holes 4 are arranged at equiangular intervals in plan view. One substrate 2 is accommodated in each substrate accommodation hole 4. A substrate support portion 5 that protrudes toward the center of the substrate accommodation hole 4 is provided on the hole wall of each substrate accommodation hole 4. The substrate support surface 5 a that is the upper surface of the substrate support portion 5 supports the vicinity of the periphery of the lower surface of the substrate 2 accommodated in the substrate accommodation hole 4. In this embodiment, the board | substrate support part 5 is provided in the perimeter of the hole wall of the board | substrate accommodation hole 4, and is a cyclic | annular form with fixed width in planar view. Since the substrate accommodation hole 4 is formed so as to penetrate the tray 3 in the thickness direction as described above, when viewed from the lower surface 3b side of the tray 3, the substrate accommodation hole 4 (enclosed by the tip of the substrate support portion 5). The lower surface of the substrate 2 is exposed by a circular region. The substrate support portion 5 may have a plurality of protrusions provided at intervals in the circumferential direction of the hole wall of the substrate accommodation hole 4. A notch 3 c for detecting the rotational angle position is provided on the outer peripheral edge of the tray 3.

  Referring to FIGS. 1 to 4, a dry etching apparatus 1 accommodates a plasma processing unit 11 that performs dry etching on a substrate 2 and a single arm type transfer device 15 that is provided adjacent to the plasma processing unit 11. A transport unit 12. In addition, a stock unit 13 for supplying and collecting the tray 3 is provided adjacent to the transport unit 12.

  Referring to FIG. 1, in the dry etching apparatus 1 of the present embodiment, the plasma processing unit 11, the transport unit 12, and the stock unit 13 are arranged so as to have a substantially L shape in plan view. That is, the plasma processing unit 11 is disposed on the right side in FIG. 1 with respect to the transport unit 12, and the stock unit 13 is disposed on the upper side in FIG. A communication port 20A is provided between the processing chamber 16 in the plasma processing unit 11 and the transfer chamber 19 in the transfer unit 12, and between the transfer chamber 19 in the transfer unit 12 and the storage chamber 17 in the stock unit 13. A communication port 20B is provided. Gate valves 21A and 21B are attached to the communication ports 20A and 20B, respectively. In FIG. 1, the gate valve 21A of the communication port 20A is closed, and the gate valve 21B of the communication port 20B is opened.

  The stock section 13 will be described with reference to FIGS. 1, 2, and 4 to 9. The stock unit 13 includes a lifter 61 and a cassette 62 that is detachably attached to the lifter 61. The cassette 3 accommodates the tray 3. As shown in FIG. 2, the lifter 61 includes a lifting platform 63 disposed in the storage chamber 17 of the stock unit 13 and a lifter drive mechanism 64 that lifts and lowers the lifting platform 63.

  Hereinafter, the cassette 62 will be described.

  As shown in FIGS. 7A to 9, the cassette 62 can store a plurality of (up to nine in the present embodiment) trays 3 between the bottom plate 65 and the top plate 66 in a horizontal posture and spaced apart from each other. The individual trays 3 accommodated in the cassette 62 are not supported on the entire lower surface 3a, but are supported only at a plurality of locations (four locations in the present embodiment) near the outer periphery of the lower surface 3a.

  As shown most clearly in FIGS. 8 and 9, the cassette 62 has main shelf board members 67A and 67B extending vertically so as to face each other across the center of the tray 3 in plan view, and individual main shelf board members. Sub-shelf members 68A and 68B extending in the vertical direction at positions adjacent to 67A and 67B. The main shelf members 67A and 67B and the auxiliary shelf members 68A and 68B have a lower end connected to the bottom plate 65 and an upper end connected to the top plate 66. The opposite side of the main shelf members 67A and 67B from the auxiliary shelf members 68A and 68B constitutes an entrance / exit 71 for the cassette 62. In other words, the auxiliary shelf members 68 </ b> A and 68 </ b> B are disposed on the back side with respect to the entrance / exit 71.

  A main shelf 67b having a relatively long rectangular shape in plan view and a flat upper surface protrudes from the inner surfaces 67a of the individual main shelf members 67A and 67B at a plurality of levels (eight levels in this embodiment) at intervals. . In addition, main shelves 68b having a relatively short rectangular shape and a flat upper surface protrude from the inner surfaces 68a of the individual sub shelf members 68A and 68B in a plurality of stages (eight stages in this embodiment). The main shelf portions 67b and 68b of the main shelf members 67A and 67B and the sub shelf members 68A and 68B have the same height (position in the height direction of the upper surface) at each level. For example, the main shelves 67b and 68b at the lowermost ends of the main shelf members 67A and 67B and the auxiliary shelf members 68A and 68B have the same height. Accordingly, as shown most clearly in FIG. 9, the lower surface 3a is supported by the main shelves 67b and 68b of the main shelf members 67A and 67B and the sub shelf members 68A and 68B constituting the same stage, so that the tray 3 is held in a horizontal posture. Specifically, the lower surface 3a is supported by the main shelves 67b on both sides in the two regions facing each other across the center of the tray 3 in the vicinity of the outer peripheral edge of the tray 3, and in the other two regions adjacent to these regions The lower surface 3a is supported by the main shelf 68b on the back side.

  As will be described in detail later, the tray 3 before or after dry etching of the substrate 2 by the plasma processing unit 11 is accommodated in the main shelves 67b and 68b of each stage.

  The interval between the inner surfaces 67a of the main shelf board members 67A and 67B in the individual main shelf portions 67b and 68b is set to a minimum within a range in which the advancement and retreat of the tray 3 through the entrance / exit 71 is allowed. That is, the gap t1 between the tray 3 correctly placed on the main shelf portions 67b and 68b and the inner surface 67a of the main shelf plate members 67A and 67B is set to a minimum. Therefore, the inner surfaces 67a of the main shelf members 67A and 67B have a function of positioning the horizontal position of the tray 3 with respect to the cassette 62 in FIG. Further, the gap t2 between the tray 3 correctly placed on the main shelves 67b and 68b and the inner surfaces 68a of the sub shelf members 68A and 68B is also set to a minimum. Therefore, the inner surfaces 68a of the auxiliary shelf members 68A and 68B have a function of positioning the position of the tray 3 with respect to the cassette 62 in the vertical direction in FIG. 9 (the position in the direction from the inlet / outlet 71 toward the back side of the cassette 62).

  On the inner surface 67a of the main shelf plate members 67A and 67B, a temporary storage shelf portion 67c protrudes at an upper position with a space from the uppermost main shelf portion 67b. In addition, on the inner surfaces 68a of the individual auxiliary shelf members 68A and 68B, a temporary storage shelf 68c protrudes at an upper position with a space from the uppermost main shelf 68b. The temporary storage shelves 67c and 68c have a rectangular shape in plan view and have a flat upper surface, like the main shelves 67b and 68b.

  The interval between the inner surfaces 67a of the main shelf members 67A and 67B and the interval between the inner surfaces 68a of the auxiliary shelf members 68A and 68B in the temporary storage shelves 67c and 68c are wider than those in the main shelves 67b and 68b. It is set. That is, the gap t1 'between the tray 3 placed on the temporary shelf sections 67c and 68c and the inner surface 67a of the main shelf board members 67A and 67B is set sufficiently larger than the gap t1 (FIG. 9). Therefore, even when the horizontal position of the tray 3 in FIG. 8 is shifted to some extent, the tray 3 does not contact the inner surface 67a. Similarly, the gap t2 ′ between the tray 3 placed on the temporary placement racks 67c and 68c and the inner surface 68a of the auxiliary shelf members 68A and 68B is set sufficiently larger than the gap t2 (FIG. 9). . Therefore, even when the vertical position of the tray 3 in FIG. 8 is shifted to some extent, the tray 3 does not contact the inner surface 68a.

  As will be described in detail later, the tray 3 after the alignment process and before the dry etching is temporarily placed on the temporary placement shelves 67c and 68c.

  Next, the lifter 61 will be described. 5 and 6, the bottom plate 65 of the cassette 62 is placed on the upper surface 63 a of the lifting platform 63 of the lifter 61. Specifically, as indicated by arrows in FIGS. 2 and 5, a cassette 62 in which the tray 3 has been received from the storage chamber 17 of the stock portion 13 with the door 72 opened and the external communication port 20 </ b> C is placed in the storage chamber 17. It is carried in and the bottom plate 65 is disposed on the upper surface 63 a of the lifting platform 63.

  On the upper surface 63a of the lifting / lowering base 63, fixed restricting portions 73A, 73B, and 73C for contacting the end surface of the bottom plate 65 and positioning the cassette 62 in the horizontal direction are provided. One restricting portion 73A is disposed on the back side in the loading direction (arrow in FIG. 5) of the cassette 62, and the two restricting portions 73B and 73C are disposed on both sides in the loading direction. In addition, the lifting platform 63 of the lifter 61 includes locking mechanisms 74A and 74B that are releasably engaged with the bottom plate 65 on the near side in the loading direction.

  Referring to FIG. 5, the lock mechanisms 74 </ b> A and 74 </ b> B are rods 76 supported by a bearing portion 75 fixed to the lower surface 63 b of the lifting platform 63 so as to be able to advance and retract in the loading direction of the cassette 62 (arrow in FIG. 5). Is provided. The rod 76 is elastically biased toward the back side in the loading direction by a spring 77. Further, the base end side of the movable restricting member 78 is fixed to the rod 76. Further, an operation knob 79 is provided at the end of the rod 76 protruding from the elevator 63.

  By operating the knob 79 and pulling and rotating the rod 76 against the biasing force of the spring 77, the lock mechanisms 74A and 74B can be set to either the “released state” or the “locked state” shown in FIG. . In the “released state”, the movable restricting member 78 is stored on the lower surface 63 side of the lifting platform 63 and does not protrude from the upper surface 63a. When the lock mechanisms 74A and 74B are in the “released state”, the cassette 62 is carried into the lifter 61, and the end surface of the bottom plate 65 is positioned with respect to the lifting platform 63 by the contact of the restricting portions 73A to 73C. When the lock mechanisms 74A and 74B are set to the “locked state” and the movable restricting member 78 is protruded through the notch 63c provided in the lifting platform 63, the restricting portions 73A to 73C and the movable restricting member 78 cause the bottom plate 65 of the cassette 62 to move. The upper surface 63a of the lifting platform 63 is locked so as not to move in the horizontal direction. That is, when the locking mechanisms 74A and 74B are set to the “locked state”, the cassette 62 is locked in a state where it is positioned with respect to the lifting platform 63. The lock mechanisms 74A and 74B are set to the “released state” only when the cassette 62 is attached or detached.

  The conveyance unit 12 will be described with reference to FIGS. 1 to 4. The single-arm type transfer device 15 accommodated in the transfer chamber 19 includes only one support fork (support portion) 28 that can hold the tray 3 by supporting the vicinity of the outer peripheral edge of the lower surface 3 b of the tray 3. The support fork 28 is connected to a two-link type horizontal movement mechanism 29 that can move in the horizontal direction (XY direction), and the horizontal movement mechanism 29 is mounted on a swing shaft 30 that extends in the vertical direction. The pivot shaft 30 can rotate around its own axis. Accordingly, the support fork 28 can be linearly moved and swiveled in two directions within a horizontal plane. The horizontal drive mechanism 29 and the turning shaft 30 are driven by the transport mechanism drive unit 31.

  Referring also to FIG. 14, the support fork 28 includes a base 38 connected to the horizontal movement mechanism 29, and a pair of arms 39 </ b> A and 39 </ b> B extending from the base 38 substantially in parallel. The lower surface 3b of the tray 3 is placed on these arms 39A and 38B. A protrusion 40 protruding upward is provided at the forefront of each arm 39A, 39B. Each protrusion 40 includes a regulating surface 40a that contacts the outermost peripheral edge of the tray 3 (circular in plan view in the present embodiment) to position the tray 3. On the other hand, the base 39 which is the base end side of the arms 39A and 39B is also provided with a protrusion 41 protruding upward, and the protrusion 41 also has a regulating surface 41a for contacting the outermost peripheral edge of the tray 3 to position the tray 3. Prepare. The restricting surface 40a of the protrusion 40 of the arms 39A and 39B and the restricting surface 41a of the protrusion 41 of the base 38 face each other.

  Referring to FIG. 1, the transfer chamber 19 includes a substantially circular main portion 19 a in plan view. Further, the transfer chamber 19f includes passage portions 19b and 19c that are substantially rectangular in a plan view that allows the main portion 19a and the communication ports 20A and 20B to communicate with each other. The size of the transfer chamber 19 is set to the minimum necessary for the transfer device 15 to perform a necessary operation. First, the diameter D of the main portion 19a in plan view is such that the wall surface of the main portion 19a interferes with the tray 3 when the turning shaft 30 rotates 360 degrees with the support fork 28 of the transport device 15 supporting the tray 3. It is set to the minimum size in the range that does not. The width W1 of the passage portion 19a is such that the wall of the passage portion 19a and the tray 3 interfere when the support fork 28 supporting the tray 3 reciprocates between the transfer chamber 19 and the processing chamber 16 through the communication port 20A. It is set to the minimum size in the range that does not. Similarly, the width W2 of the communication portion 19a is such that the wall surface of the passage portion 19b and the tray 3 are connected when the support fork 28 supporting the tray 3 reciprocates between the transfer chamber 19 and the storage chamber 17 through the communication port 29B. It is set to the minimum without interference.

  Referring to FIGS. 1 to 3, a rotation stage 33 (preparation stage) is accommodated in the transfer chamber 19 of the transfer unit 12. As shown most clearly in FIG. 3, the rotary stage 33 is attached to the upper end of a rotary shaft 36 extending in the vertical direction. The rotary shaft 36 is rotationally driven by a rotary stage drive mechanism unit 37. As will be described in detail later, the tray 3 transported by the transport device 15 is placed on the upper surface of the rotary stage 33.

  Referring to FIG. 1, the rotary stage 33 is disposed on the storage chamber 17 side of the stock portion 13 in the main portion 19 a (generally circular in plan view) of the transfer chamber 19. Specifically, the rotary stage 33 is disposed at a position between the turning shaft 30 of the transfer device 15 and the storage chamber 17. More specifically, when a virtual straight line L connecting the center C1 of the turning shaft 30 of the transfer device 15 and the center C2 of the storage chamber 17 is assumed, the center of rotation C3 of the rotation shaft 36 of the rotation of the rotary stage 33 is assumed. Is located on the straight line L and between the center C1 and the center C2. In the present embodiment, the center C1 of the turning shaft 30 substantially coincides with the center C4 in a plan view of the main portion 19a having a circular shape, and the center C2 of the storage chamber 17 is a cassette mounted on the lifter 61 in the storage chamber 17. 62 substantially coincides with the center C5 of the tray 3 in 62. In other words, on the imaginary straight line L, from the center C1 of the turning shaft 30 of the conveying device 15 (center C4 of the main portion 19a), the center C3 of the rotating shaft 36 of the rotary stage 33, the communication port 20B, and the storage chamber 17 Center C2 (center C5 of the tray 3 in the storage chamber 17) is arranged in this order.

  Referring to FIG. 3, a transparent or translucent window 42 is provided on the upper end wall of the transport unit 18 at a position above the rotary stage 33. Two substrate detection sensors 43A and 43B and one notch detection sensor 44 are arranged above the window. As shown in FIGS. 1 and 7, the substrate detection sensor 43 </ b> A is located immediately above the center of the rotary stage 33. The substrate detection sensor 43B is located at a position away from the rotary stage 33 in plan view. The notch detection sensor 44 is located further outside the substrate detection sensor 43B than the rotation stage 33 in plan view. On the rotary stage 33, a light reflecting member 45A is fixed at a position directly below the substrate detection sensor 43A. Similarly, light reflecting members 45 </ b> B and 45 </ b> C are fixed on the bottom wall of the transport unit 18 at positions immediately below the substrate detection sensor 43 </ b> B and the notch detection sensor 44, respectively.

  The plasma processing unit 11 accommodates the tray 3 on which the substrate 2 is placed in the processing chamber 16 and performs etching. However, the etching method is not particularly limited. For example, the plasma processing unit 11 may be an ICP type or a parallel plate type. With reference to FIGS. 1, 10, and 15, in the plasma processing unit 11 of this embodiment, a stage 23 is provided on the bottom side of the processing chamber 16 to place the lower surface 3 b of the tray 3 on the upper end surface 23 a. On the upper end surface 23a of the stage 23, the same number (seven in the present embodiment) of flat cylindrical electrostatic chucks as the substrate accommodation holes 4 of the tray 3 protrudes. In addition, a lifting rod 24 is provided for transferring the tray 3 between the support fork 28 of the substrate transport mechanism 15 and the stage 23.

  The dry etching apparatus 1 includes a control unit 46 shown only in FIG. The control unit 46, based on the input from various sensors including the substrate detection sensors 43A and 43B and the notch detection sensor 44 in addition to the operator command input from the operation / input unit 47, the plasma processing unit 11 and the transfer device 15, the operation of the entire apparatus including the vacuum pump 48 and the display unit 49 is controlled. In particular, the control unit 46 includes a tray conveyance processing unit 51 that controls conveyance of the tray 3 by the conveyance mechanism 15, a lifter lifting / lowering processing unit 52 that controls lifting / lowering by the lifter driving mechanism 64 of the lifting platform 63 of the lifter 61, and the rotary stage 26. An alignment processing unit 53 that controls alignment processing by the notch detection sensor 44 and a substrate presence / absence confirmation processing unit 54 that controls confirmation of the presence / absence of the substrate 2 by the substrate detection sensors 43A and 43B are provided.

  Next, operation | movement of the dry etching apparatus 1 of this embodiment is demonstrated.

  Referring to FIG. 12, the first tray 3 after the start of the operation of the dry etching apparatus 1 is transported from one of the main shelves 67b and 68b of the cassette 62 in the storage chamber 17 of the stock section 13 by the transport device 15. It is carried into the transfer chamber 19 of the section 12 and placed on the upper surface of the rotary stage 33. Next, adjustment of the rotational angle position by rotation of the rotary stage 33, that is, alignment processing, is performed on the tray 3 placed on the rotary stage 33. Thereafter, the tray 3 is carried into the processing chamber 16 of the plasma processing unit 11 from the transfer chamber 19 through the transfer chamber 16 by the transfer device 15 and placed on the stage 23. By arranging the tray 3 on the stage 23, the plasma processing is performed on the substrate 2 placed on the substrate support surface 5a of the substrate support portion 5. After the plasma processing, the tray 3 is transported from the processing chamber 16 to the storage chamber 17 by the transport device 15 via the transport chamber 19 and collected in the empty main shelves 67b and 68b of the cassette 62.

  Referring to FIG. 12, the second and subsequent trays 3 after the start of the operation of the dry etching apparatus 1 are transferred to the main shelves 67 b and 68 b of the cassette 62 in the storage chamber 17 of the stock section 13 by the transport apparatus 15. Are carried into the transfer chamber 19 of the transfer unit 12 and placed on the upper surface of the rotary stage 33. Next, adjustment of the rotational angle position by rotation of the rotary stage 33, that is, alignment processing, is performed on the tray 3 placed on the rotary stage 33. The tray 3 after the alignment processing is transported from the transport chamber 19 to the storage chamber 17 by the transport device 15 and placed on the temporary storage shelves 67c and 68c of the cassette 62. Thereafter, the tray 3 is taken out from the temporary storage shelves 67 c and 68 c by the transfer device 15, carried into the processing chamber 16 of the plasma processing unit 11 from the storage chamber 17 through the transfer chamber 16, and placed on the stage 23. The By arranging the tray 3 on the stage 23, the plasma processing is performed on the substrate 2 placed on the substrate support surface 5a of the substrate support portion 5. After the plasma processing, the tray 3 is transported from the processing chamber 16 to the storage chamber 17 by the transport device 15 through the transport chamber 19 and collected in the main shelves 67b and 68b that are empty in the cassette 62.

  Hereinafter, the operation of the dry etching apparatus 1 when focusing on the second and subsequent trays 3 will be described more specifically.

  As shown in FIG. 13A, the support fork 28 directed toward the storage chamber 17 by turning of the turning shaft 30 passes through the communication port 20B by direct movement by the moving mechanism 29 as shown in FIG. Then, it enters the storage chamber 17 of the stock unit 13 and supports the tray 3 (which stores seven unprocessed substrates 2) supported by any of the main shelves 67b and 68b of the cassette 62. Referring also to FIG. 14, first, the arms 39 </ b> A and 39 </ b> B of the support fork 28 enter the cassette 62 from the entrance / exit 71 and are inserted into the lower surface 3 b of the tray 3 at intervals. Next, the cassette 3 mounted on the lifting platform 63 of the lifter 61 is lowered by the lifter drive mechanism 64, whereby the tray 3 is transferred from the main shelves 67b and 68b to the arms 39A and 39B of the support fork 28. Specifically, the lower surface 3a of the tray 3 supported by the main shelves 67b and 68b is supported by the upper surfaces of the arms 39A and 39B of the support fork 28 as the cassette 62 descends. At this time, by fitting between the support surface 40a of the projection 40 of the arms 39A and 39B and the support surface 41a of the projection 41 of the base 38, centering of the tray 3 with respect to the support fork 28 (arms 38A and 38B) (Positioning with respect to the support fork 28).

  The support fork 28 to which the tray 3 has been transferred from the main shelves 67b and 68b of the cassette 62 is retracted from the cassette 62 through the inlet / outlet 71 (see FIG. 14), and from the storage chamber 17 through the communication port 20B. Return to. As shown in FIG. 13C, the support fork 28 moves so that the tray 3 is positioned above the rotary stage 33. Subsequently, the rotary stage 33 is raised by the upward movement of the rotary shaft 36. The rotation stage 33 passes between the two arms 39 </ b> A and 39 </ b> B of the support fork 28 and protrudes above the support fork 28, whereby the tray 3 is placed on the upper surface of the rotation stage 33.

  Subsequently, the rotation angle position of the tray 3 disposed on the rotation stage 33 is adjusted by rotating the rotation stage 33 with the rotation shaft 36. When adjusting the rotational angle position, the notch 3c is detected by the output from the notch detection sensor 44, and the rotary stage 33 is rotated accordingly. Further, by monitoring the outputs of the substrate detection sensors 43 </ b> A and 43 </ b> B while rotating the rotary stage 33 by the rotation shaft 36, it is confirmed that the substrate 2 is accommodated in the substrate accommodation hole 4 of the tray 3. The presence / absence of the substrate 2 in the central substrate accommodation hole 4 of the tray 3 can be confirmed by the output from the substrate detection sensor 43A. The output of the substrate 2 in the remaining six substrate accommodation holes 4 of the tray 3 can be confirmed by the output from the substrate detection sensor 43B. The presence or absence can be confirmed. The notch detection sensor 44 constitutes a preliminary processing unit in the present invention together with the alignment processing unit 53 of the control unit 46 described above. Further, the substrate sensors 43A and 43B together with the alignment processing unit 53 of the control unit 46 that has been preliminarily formed constitute a preliminary processing unit in the present invention.

  As clearly shown in FIG. 13C, when adjusting the rotation angle position and checking the presence or absence of the substrate, the entire tray 3 on the rotation stage 33 is not accommodated in the main portion 19a of the transfer chamber 19, A part of the air enters the communication port 20 </ b> B between the transfer chamber 19 and the storage chamber 17 through the passage portion 19 b of the transfer chamber 19. Thus, by effectively using not only the main portion 19a of the transfer chamber 19 but also the passage portion 19b and the communication port 20B, the size of the transfer chamber 19 can be reduced as described above. Thus, the rotation angle position of the tray 3 can be adjusted and the presence or absence of the substrate can be confirmed on the rotary stage 33 disposed in the main portion 19a of the transfer chamber 19 while being set to the minimum necessary. In other words, by effectively using not only the main portion 19a of the transfer chamber 19 but also the passage portion 19b and the communication port 20B, the rotation stage 33 that eliminates the need to provide a dedicated chamber for housing the rotation stage 33. As described in detail with reference to FIG. 1, the rotary stage 33 is able to effectively use the passage portion 19b and the communication port 20B when adjusting the rotational angle position of the tray 3 on the top and confirming the presence or absence of the substrate. This is because the device 15 is disposed at a position between the turning shaft 30 and the storage chamber 17.

  After adjustment of the rotational angle position and confirmation of the presence or absence of the substrate, the rotary stage 33 is lowered by the downward movement of the rotary shaft 36, and the tray 3 is transferred from the rotary stage 33 to the support fork 28.

  The support fork from which the tray 3 is transferred from the rotary stage 33 is directed to the storage chamber 17 of the stock unit 13 by the turning of the turning shaft 30. The support fork 28 enters the storage chamber 17 through the communication port 20B. By the reverse operation of transferring the tray 3 from the main shelves 67b and 68b described with reference to FIG. 14 to the support arm 28, the temporary fork shelves 67c and 68c in the cassette 62 are vacated from the support fork 28. The tray 3 is transferred. That is, the support fork 28 that supports the tray 3 enters the cassette 62 from the entrance / exit 71, and the tray 3 is disposed on the temporary storage racks 67c and 68c. Next, the cassette 62 mounted on the lifting platform 63 of the lifter 61 is lifted by the lifter drive mechanism 64, whereby the tray 3 is transferred from the arms 39A, 39B of the support fork 28 to the temporary storage racks 67c, 68c.

  Referring to FIG. 12, the processes described so far for the second and subsequent trays 3, that is, the conveyance from the main shelves 67b and 68b of the cassette 62 to the rotary stage 33, the alignment process on the rotary stage 33 (rotation angle) Position adjustment) and conveyance from the rotary stage 33 to the temporary storage shelves 67c and 68c of the cassette 62 are performed during the plasma processing for the previous tray 3. In addition, the following processing is executed after the conveyance of the main shelves 67b and 68b of the cassette 62 from the processing chamber 16 of the plasma processing unit 11 to the previous tray 3 is completed.

  First, the support fork 28 is directed to the storage chamber 17 of the stock portion 13 by turning the turning shaft 30. The support fork 28 enters the storage chamber 17 through the communication port 20B, and is inserted below the lower surface 3b of the tray 3 supported by the temporary storage shelves 67c and 68c. Next, the cassette 62 mounted on the lifting platform 63 of the lifter 61 is lowered by the lifter driving mechanism 64, so that the tray 3 is transferred from the temporary storage shelves 67c and 68c to the arms 39A and 39B of the support fork 28.

  As shown in FIG. 13D, the support fork 28 that has received the tray 3 turns in the transfer chamber 19 and is directed to the processing chamber 16 of the plasma processing unit 11. Thereafter, the gate valve 21A is switched from the closed state to the opened state, and the communication port 20A is opened.

  Further, the tray 3 is placed on the stage 23 by the operation shown in FIG. First, the support arm 28 enters the processing chamber 17 through the communication port 20 </ b> A and is disposed above the stage 23. Next, the elevating rod 24 is raised and the upper end pushes up the lower surface 3 b of the tray 3, whereby the tray 3 is transferred from the support arm 28 to the elevating rod 24. Thereafter, the lifting rod 24 is lowered, and the tray 3 is placed on the upper end surface 23 a of the stage 23. Referring also to FIG. 10, as the tray 3 descends toward the upper end surface 23 a of the stage 23, the substrate holding portion 23 b enters the substrate accommodation hole 4 from the lower surface 3 b side of the tray 3. Therefore, when the tray 3 is placed on the upper end surface 23a of the stage 23, the substrates 2 in the individual substrate accommodation holes 4 are lifted from the substrate support surface 5a of the substrate support portion 5 and placed on the upper end of the substrate holding portion 23b. Placed.

  After completing the placement of the tray 3 on the stage 23, a plasma etching process is performed on the substrate 2.

  After performing the etching process, the support fork 28 receives the tray 3 from the stage 23 in the processing chamber 16 by performing the reverse operation of the mounting on the stage 23 described with reference to FIG. Return. The support fork 28 supporting the tray 3 turns in the transfer chamber 19 and is directed to the storage chamber 17 of the stock unit 13. The support fork 28 enters the storage chamber 17 through the communication port 20B. The operation opposite to that when the tray 3 is transferred from the main shelves 67b and 68b to the support arm 28 described with reference to FIG. 14 (when the tray 3 is transferred from the support arm 28 to the temporary storage shelves 67c and 68c). The tray 3 is transferred from the support fork 28 to the vacant main shelves 67b and 68b of the cassette 62.

  The dry etching apparatus 1 of this embodiment is particularly characterized in the following points.

  First, during the dry etching process in the processing chamber 16 of the plasma processing unit 11 for the substrate 2 of one tray 3, the rotary stage is moved from the main shelves 67b and 68b of the cassette 62 for the next one tray 3. 33, rotation of the rotary stage 33 and rotation angle position adjustment of the tray 3 by the notch detection sensor 44 (substrate presence / absence detection is also performed simultaneously by the substrate detection sensors 43A and 43B), and provisional transfer of the cassette 62 from the rotation stage 33 to the cassette 62. Transport to the storage shelves 67b and 68c is executed. Therefore, high throughput can be realized while adopting the single arm type transfer device 15 having a simple configuration and low cost.

  Next, a mechanism for temporarily placing the tray 3 after the rotation angle position adjustment of the tray 3 (detection of substrate presence / absence by the substrate detection sensors 43A and 43B) before the dry etching process in the processing chamber 16 of the plasma processing unit 11 is as follows. Temporary storage shelves 67 c and 68 c are provided in the processing chamber 17 accommodated in the accommodating chamber 17 of the stock unit 13. For this purpose, there is no need to provide a dedicated chamber for temporary placement, and the dry etching apparatus can be downsized or the installation area can be reduced.

  In addition, the rotation angle position adjustment of the tray 3 and the substrate presence / absence detection, which are preliminary processes that need to be performed before the dry etching process in the processing chamber 16 of the plasma processing unit 11, are for accommodating the transport mechanism 15. Since it is executed by the rotary stage 33 (notch detection sensor 44, substrate detection sensors 43A, 43B) accommodated in the transfer chamber 19, it is not necessary to provide a dedicated chamber for these preliminary processes. However, the dry etching apparatus can be downsized or the installation area can be reduced.

  Furthermore, the cassette 62 is moved up and down by the lifter 61, so that the tray 3 is transferred between the main shelves 67b and 68b and the support forks 28, and the tray 3 between the support forks 28 between the temporary storage shelves 67c and 68c. Passing is implemented. Therefore, the support fork 28 of the single-arm type conveyance device 15 only needs to be able to move in the horizontal direction by the horizontal movement mechanism 29 and turn by the turning shaft 30. That is, the support fork 28 does not need to have an elevating function, and the configuration of the transport device 15 can be simplified.

  The present invention is not limited to the embodiments and can be variously modified.

  As shown in FIG. 4, a displacement sensor 81 (for example, a sensor for measuring the distance from a certain position to the substrate 2) for optically detecting the displacement of the substrate 2 with respect to the tray 3 is provided. Based on the output, the substrate position deviation confirmation processing unit 82 of the control unit 46 may determine whether or not the substrate 3 is displaced with respect to the tray 3.

  The arrangement of the plasma processing unit 11, the transfer unit 12, and the stock unit 13 in a plan view is not limited to the L shape (FIG. 1) as in the embodiment. For example, like the modified dry etching apparatus 1 shown in FIG. 16, the plasma processing unit 11 and the stock unit 13 are arranged on opposite sides of the transport unit 12, and the plasma processing unit 11, the stock unit 13, and the transport You may arrange | position so that the part 12 may exhibit substantially linear shape by planar view.

  The specific configuration related to the stock unit 13 is not limited to that of the embodiment. For example, the dry etching apparatus 1 of the modified example shown in FIG. 17 includes a transfer unit 83 provided adjacent to the stock unit 13. The tray 3 containing the substrate 2 before processing is supplied from the transfer unit 83 to the stock unit 13, and these trays 3 are returned from the stock unit 13 to the transfer unit 71 after processing the substrate 2. In the stock unit 13, a temporary storage unit (not shown) for arranging the tray 3 after alignment is provided. A transfer robot 85 is accommodated in the transfer chamber 84 in the transfer unit 83.

  As conceptually indicated by an arrow A <b> 1 in FIG. 17, the transfer robot 85 performs an operation of accommodating the substrate 2 before dry etching in the substrate accommodation hole 4 of the tray 3, that is, an operation of transferring the substrate 2 to the tray 3. Execute. In addition, the transfer robot 85 performs an operation of transferring the dry-etched substrate 2 from the tray 3 as conceptually indicated by an arrow A2 in FIG. Furthermore, the transfer robot 72 carries the operation of carrying the tray 3 containing the substrate 2 before processing into the stock unit 13 from the transfer unit 83 (arrow B1 in FIG. 17), and the tray 3 storing the substrate 2 after processing. Is carried out from the stock unit 13 to the transfer unit 83 (arrow B2 in FIG. 14).

  The tray may have a bottomed substrate receiving hole. Further, the present invention is not limited to the case where the substrate is accommodated in the tray. For example, the present invention can be applied to a large substrate corresponding to the tray 3 in the embodiment. Furthermore, the present invention is not limited to a dry etching apparatus, but can be applied to other plasma processing apparatuses such as a CVD apparatus.

DESCRIPTION OF SYMBOLS 1 Dry etching apparatus 2 Substrate 3 Tray 3a Upper surface 3b Lower surface 3c Notch 4 Substrate accommodation hole 5 Substrate support part 5a Substrate support surface 11 Plasma treatment part 12 Conveyance part 13 Stock part 15 Conveyance device 16 Processing chamber 17 Containment room 19 Conveyance room 20A, 20B, 20C Communication port 21A, 21B Gate valve 23 Stage 23a Upper end surface 23b Substrate holding part 24 Lifting rod 28 Support fork 29 Horizontal movement mechanism 30 Rotating shaft 31 Conveying mechanism driving unit 33 Rotating stage 36 Rotating shaft 37 Rotating stage driving mechanism 38 Base 39A, 39B Arm 40 Protrusion 40a Restriction surface 41 Protrusion 41a Restriction surface 42 Window 43A, 43B Substrate detection sensor 44 Notch detection sensor 45A, 45B, 45C Light reflecting member 46 Control unit 47 Operation / input unit 48 Vacuum pump 49 Display Section 51 Tray transport processing section 52 Lifter lifting / lowering processing section 53 Alignment processing section 54 Substrate presence / absence confirmation processing section 61 Lifter 62 Cassette 63 Lifting table 63a Upper surface 63b Lower surface 63c Notch 64 Lifter drive mechanism 65 Bottom plate 66 Top plate 66a Handle 67A, 67B Main shelf Plate member 67a Inner surface 67b Main shelf portion 67c Temporary shelf portion 68A, 68B Sub shelf member 68a Inner surface 68b Main shelf portion 68c Temporary shelf portion 71 Entrance / exit 72 Door 73A, 73B, 73C Restriction portion 74A, 74B Lock mechanism 75 Bearing portion 76 Rod 77 Spring 78 Movable restricting member 79 Knob 81 Position deviation sensor 82 Substrate position deviation confirmation processing section 83 Transfer section 84 Transfer chamber 85 Transfer robot

Claims (15)

A stock unit including a main storage unit for storing an object before and after plasma processing, and a temporary storage unit;
A plasma processing unit for performing plasma processing on the object carried from the stock unit;
A transport unit that houses a transport device that transports the object with a single arm; and
A preparatory stage accommodated in the transfer unit, where the object before being carried into the plasma processing unit from the stock unit is disposed;
A preliminary processing unit for executing a preliminary processing for the plasma processing on the object in cooperation with the preparation stage;
The transfer device transfers the object before the plasma processing from the main storage portion of the stock unit to the preparation stage, and transfers the object after the preliminary processing from the preparation stage to the temporary portion of the stock unit. A plasma processing apparatus that transports the object after plasma processing to the plasma processing unit through a placement unit, and transports the object after plasma processing from the plasma processing unit to the main storage unit of the stock unit. While performing the plasma processing on one target object in the plasma processing unit,
The transport device transports another one of the objects from the main storage unit of the stock unit to the preparation stage, and the preparation processing unit applies to the one other object on the preparation stage. The preliminary processing is executed, and the transport device transports the another object after the preliminary processing from the preparation stage to the temporary placement unit of the stock unit. Plasma processing equipment. The preparatory stage is rotatable about a rotation axis extending in a vertical direction;
The plasma processing according to claim 1, wherein the preliminary processing unit adjusts a rotation angle position of the object placed on the preparation stage by rotating the preparation stage around the rotation axis. apparatus. The object comprises a notch on the outer periphery,
The preliminary processing unit includes a notch detection sensor that optically detects the notch of the object placed on the preparation stage, and rotates the preparation stage according to an output from the notch detection sensor. The plasma processing apparatus of Claim 3 which adjusts the rotation angle position of the said target object.   The plasma processing apparatus according to any one of claims 1 to 4, wherein the preliminary processing unit performs an inspection as to whether or not the object is in a state suitable for the plasma processing. The object is a transportable tray containing a substrate,
The preliminary processing unit includes a substrate detection sensor that optically detects the presence or absence of the substrate in the tray placed on the preparation stage, and determines the presence or absence of a substrate based on an output from the substrate detection sensor; The plasma processing apparatus according to claim 5. The object is a transportable tray containing a substrate,
The preliminary processing unit includes a displacement detection sensor that optically detects a displacement of the substrate with respect to the tray placed on the preparation stage, and the substrate with respect to the tray based on an output from the substrate detection sensor. The plasma processing apparatus of Claim 5 or Claim 6 which determines the presence or absence of position shift.   The plasma processing apparatus according to claim 1, wherein the preparation stage moves up and down along a vertical direction. By the conveying device accommodated in the conveying part, the object of the plasma processing accommodated in the main accommodating part of the stock part is conveyed to the preparation stage accommodated in the conveying part,
Performing a preliminary treatment for the plasma treatment on the object placed on the preparation stage;
The object after completion of the preliminary processing is transported to the temporary placement part of the stock part by the transport device,
A plasma processing method, wherein the counter object is transferred from the temporary placement unit to the plasma processing unit by the transfer device to perform plasma processing.   While the plasma processing is being performed on one object in the plasma processing unit, another object is transported from the main storage unit of the stock unit to the preparation stage, Performing the preliminary processing on the other one object, and further transporting the another one object after the preliminary processing from the preparation stage to the temporary placement section of the stock section, The plasma processing method according to claim 9.   The preliminary processing is to adjust the rotational angular position of the object placed on the preparation stage by rotating the preparation stage around a rotation axis extending along the vertical axis direction. The plasma processing method according to claim 10. The object comprises a notch on the outer periphery,
The preparatory process is to rotate the preparation stage in accordance with an output from a notch detection sensor that optically detects the notch of the object placed on the preparation stage. The plasma processing method as described.   The plasma processing method according to claim 9 or 10, wherein the preliminary processing is an inspection of whether or not the object is in a state suitable for the plasma processing. The object is a transportable tray containing a substrate,
The plasma according to claim 13, wherein the preliminary processing is determination of the presence or absence of a substrate based on an output from a substrate detection sensor that optically detects the presence or absence of the substrate in the tray placed on the preparation stage. Processing method. The object is a transportable tray containing a substrate,
The preliminary process is a determination of whether or not the substrate is displaced based on an output from a displacement detection sensor that optically detects the displacement of the substrate with respect to the tray placed on the preparation stage. The plasma processing method according to claim 13.