JP2012221468A - Touch panel - Google Patents

Touch panel Download PDF

Info

Publication number
JP2012221468A
JP2012221468A JP2011090137A JP2011090137A JP2012221468A JP 2012221468 A JP2012221468 A JP 2012221468A JP 2011090137 A JP2011090137 A JP 2011090137A JP 2011090137 A JP2011090137 A JP 2011090137A JP 2012221468 A JP2012221468 A JP 2012221468A
Authority
JP
Japan
Prior art keywords
touch panel
film
substrate
upper film
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011090137A
Other languages
Japanese (ja)
Other versions
JP5777384B2 (en
JP2012221468A5 (en
Inventor
Nobuya Iwasaki
展也 岩▲崎▼
Maiko Kikuchi
麻衣子 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Component Ltd
Original Assignee
Fujitsu Component Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Component Ltd filed Critical Fujitsu Component Ltd
Priority to JP2011090137A priority Critical patent/JP5777384B2/en
Publication of JP2012221468A publication Critical patent/JP2012221468A/en
Publication of JP2012221468A5 publication Critical patent/JP2012221468A5/ja
Application granted granted Critical
Publication of JP5777384B2 publication Critical patent/JP5777384B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Position Input By Displaying (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel in which its upper film substrate does not deform inappropriately even if and because the upper film substrate dilates due to changes in temperature or humidity, by using a simple configuration.SOLUTION: A touch panel 10 comprises a lower substrate 12 and an upper film substrate 16 which is attached to the lower substrate 12 via an adhesion means 14 in a frame-like shape. The adhesion means 14 comprises a foam body 18 in a frame-like shape, a first adhesive layer 20 bonded to a first surface of the foam body 18, and a second adhesive layer 22 bonded to a second surface of the foam body 18.

Description

本発明は、導電膜面を互いに対向配置した抵抗膜式のタッチパネルに関する。   The present invention relates to a resistive film type touch panel in which conductive film surfaces are arranged to face each other.

従来の抵抗膜式のタッチパネルでは、枠状の両面接着テープ又は接着剤を用いて、上側のフィルム基板と下側の基板とを貼り合わせている。図12は、そのようなタッチパネル100の概略構成を示す分解斜視図であり、図13は図12のタッチパネル100の断面図である。なお明瞭化のため、タッチパネルの厚さ方向(図13の上下方向)を実際の寸法関係より拡大している。タッチパネル100は、ガラス等の下部基板102と、枠状の粘着層104を介して下部基板102に貼り付けられるPET等の上部フィルム基板106とを有する。粘着層104としては通常、両面接着テープ又は接着剤が使用される。   In a conventional resistive film type touch panel, an upper film substrate and a lower substrate are bonded together using a frame-shaped double-sided adhesive tape or adhesive. FIG. 12 is an exploded perspective view showing a schematic configuration of such a touch panel 100, and FIG. 13 is a cross-sectional view of the touch panel 100 of FIG. For the sake of clarity, the thickness direction of the touch panel (the vertical direction in FIG. 13) is expanded from the actual dimensional relationship. The touch panel 100 includes a lower substrate 102 made of glass or the like and an upper film substrate 106 made of PET or the like attached to the lower substrate 102 through a frame-like adhesive layer 104. As the adhesive layer 104, a double-sided adhesive tape or an adhesive is usually used.

図12に示すように通常は、枠状の粘着層104によって上部フィルム基板106の全周が固定されている。温度・湿度の変化により上部フィルム基板106が膨張すると、上部フィルム基板106の方が下部基板102より膨張率が高いので、図14に示すように、上部フィルム基板106が波打つような変形をしてしまうことがある。このような変形が発生すると、所定の押圧力でタッチ操作をしても入力が検知されなかったり、逆に、上部フィルム基板106及び下部基板102にそれぞれ設けられた互いに対向する導電膜(図示せず)同士がタッチ操作をしなくても接触してしまったりする(ショート)等の機能不良が生じ得る。   As shown in FIG. 12, the entire circumference of the upper film substrate 106 is usually fixed by a frame-shaped adhesive layer 104. When the upper film substrate 106 expands due to a change in temperature and humidity, the upper film substrate 106 has a higher expansion coefficient than the lower substrate 102. Therefore, as shown in FIG. May end up. When such a deformation occurs, an input is not detected even if a touch operation is performed with a predetermined pressing force, or conversely, conductive films (not shown) provided on the upper film substrate 106 and the lower substrate 102, respectively. 1), even if they do not touch each other, malfunctions such as contact (short) may occur.

上記波打ちを防止するために、例えば特許文献1には、弾性によりフィルムに外向きの延伸力を発生させる延伸作用部を備えた情報入力表示装置が開示されている。   In order to prevent the waviness, for example, Patent Document 1 discloses an information input display device including a stretching action unit that generates an outward stretching force on a film by elasticity.

特開2003−296023号公報JP 2003-296023 A

特許文献1に記載の発明では、フィルムを外向きに引っ張る延伸力を加える延伸作用部を別途設ける必要があり、タッチパネル全体の構成が複雑化する。また、適切な角度の傾斜部13aを備えた外装部材13を設ける必要があるので、タッチパネルの厚さ方向の寸法が増加し、タッチパネルの画面面積が外装部材13によっていくらか減少する。   In the invention described in Patent Document 1, it is necessary to separately provide a stretching action unit that applies a stretching force that pulls the film outward, which complicates the configuration of the entire touch panel. Moreover, since it is necessary to provide the exterior member 13 provided with the inclination part 13a of an appropriate angle, the dimension of the thickness direction of a touchscreen increases, and the screen area of a touchscreen is reduced somewhat by the exterior member 13. FIG.

また図15に示すタッチパネル200のような、FPC等の引出線202が下部基板204(ガラス)にのみ取り付けられ、枠状の粘着層206によって上部フィルム基板208の全周が固定されている形態の場合(FPCを基板間に挟み込むタイプでない場合)は、各部材間での熱膨張(熱収縮)率の違いによる他の問題も生じ得る。すなわち図15のようなタッチパネルでは、上部フィルム基板208(PETフィルム)とFPC202とを導通接続するためにガラス基板204とPETフィルム208とを導電接着部210において導電接着剤等によって接着するが、タッチパネル製造工程での熱処理後の冷却により、PETフィルム208はガラス204よりも大きく収縮する。このとき、図16に示すように、PETフィルム208の収縮によって、PETフィルム208上に形成したフィルム側電極212に破断(クラック)が生じて断線状態となることがある。   Further, like the touch panel 200 shown in FIG. 15, a leader line 202 such as an FPC is attached only to the lower substrate 204 (glass), and the entire periphery of the upper film substrate 208 is fixed by a frame-like adhesive layer 206. In other cases (when the FPC is not the type in which the FPC is sandwiched between the substrates), other problems due to the difference in thermal expansion (thermal contraction) rate between the members may occur. That is, in the touch panel as shown in FIG. 15, the glass substrate 204 and the PET film 208 are bonded to each other by a conductive adhesive or the like in the conductive bonding portion 210 in order to electrically connect the upper film substrate 208 (PET film) and the FPC 202. The PET film 208 contracts more than the glass 204 due to cooling after the heat treatment in the manufacturing process. At this time, as shown in FIG. 16, due to the shrinkage of the PET film 208, the film-side electrode 212 formed on the PET film 208 may be broken (cracked) and may be disconnected.

そこで本発明は、より簡易な構成を用いて、上部フィルム基板と下部フィルム基板との膨張率の差に起因して上部フィルム基板が不適切に変形したり破断したりしないことを実現したタッチパネルを提供することを目的とする。   Therefore, the present invention provides a touch panel that realizes that the upper film substrate does not deform or break inappropriately due to a difference in expansion coefficient between the upper film substrate and the lower film substrate using a simpler configuration. The purpose is to provide.

上記目的を達成するために、請求項1に記載の発明は、透明導電性物質を被着してなる導電膜面を各々が備えた上部フィルム基板及び下部基板を、枠状の接着手段を用いて該導電膜面が互いに対向するように貼り合わせてなるタッチパネルにおいて、前記接着手段は、枠状の発泡体と、該発泡体が有する前記下部基板に対向する第1の面に貼り合わされた第1の粘着層と、前記発泡体が有する前記上部フィルム基板に対向する第2の面に貼り合わされた第2の粘着層とから構成される、タッチパネルを提供する。   In order to achieve the above object, the invention described in claim 1 uses an upper film substrate and a lower substrate each provided with a conductive film surface coated with a transparent conductive material, using a frame-like bonding means. In the touch panel in which the conductive film surfaces are bonded to each other, the bonding means includes a frame-shaped foam and a first surface bonded to the first surface facing the lower substrate of the foam. There is provided a touch panel including a first adhesive layer and a second adhesive layer bonded to a second surface facing the upper film substrate of the foam.

請求項2に記載の発明は、請求項1に記載のタッチパネルにおいて、前記接着手段は、発泡体を基材とする両面接着テープである、タッチパネルを提供する。   The invention described in claim 2 provides the touch panel according to claim 1, wherein the adhesive means is a double-sided adhesive tape having a foam as a base material.

請求項3に記載の発明は、請求項1又は2に記載のタッチパネルにおいて、前記発泡体は、ポリウレタン系材料、ポリオレフィン系材料、又はアクリルフォームから構成される、タッチパネルを提供する。   The invention according to claim 3 provides the touch panel according to claim 1 or 2, wherein the foam is made of a polyurethane material, a polyolefin material, or an acrylic foam.

請求項4に記載の発明は、請求項1〜3のいずれか1項に記載のタッチパネルにおいて、前記発泡体の厚さは0.2mm以上かつ0.6mm以下であり、前記第1及び第2の粘着層の各々の厚さは10μm以上かつ40μm以下である、タッチパネルを提供する。   According to a fourth aspect of the present invention, in the touch panel according to any one of the first to third aspects, the thickness of the foam is not less than 0.2 mm and not more than 0.6 mm, and the first and second Provided is a touch panel in which each of the adhesive layers has a thickness of 10 μm or more and 40 μm or less.

請求項5に記載の発明は、請求項1〜4のいずれか1項に記載のタッチパネルにおいて、前記発泡体の密度は240kg/m3以上かつ700kg/m3以下であり、前記発泡体の圧縮荷重は0.008MPa以上かつ0.032MPa以下であり、前記発泡体の圧縮残留歪は2%以上かつ4%以下である、タッチパネルを提供する。 The invention according to claim 5 is the touch panel according to any one of claims 1 to 4, wherein the density of the foam is 240 kg / m 3 or more and 700 kg / m 3 or less, and the compression of the foam A touch panel is provided in which the load is 0.008 MPa or more and 0.032 MPa or less, and the compression residual strain of the foam is 2% or more and 4% or less.

請求項6に記載の発明は、透明導電性物質を被着してなる導電膜面を各々が備えた上部フィルム基板及び下部基板を、枠状の接着手段を用いて該導電膜面が互いに対向するように貼り合わせてなるタッチパネルにおいて、前記接着手段は、枠状のフィルムと、該枠状のフィルムが有する前記下部基板に対向する第3の面に貼り合わされた第3の粘着層と、前記枠状のフィルムが有する前記上部フィルム基板に対向する第4の面に貼り合わされた第4の粘着層とから構成され、前記枠状フィルムの線膨張係数は前記上部フィルム基板の線膨張係数と同等以上であり、かつ前記枠状フィルムは、該枠状フィルムの延伸軸が前記上部フィルム基板の延伸軸と同一方向となるように配置される、タッチパネルを提供する。   According to the sixth aspect of the present invention, an upper film substrate and a lower substrate each provided with a conductive film surface formed by depositing a transparent conductive material are arranged so that the conductive film surfaces face each other using a frame-like bonding means. In the touch panel formed by bonding, the bonding means includes a frame-shaped film, a third pressure-sensitive adhesive layer bonded to a third surface facing the lower substrate of the frame-shaped film, and the And a fourth adhesive layer bonded to a fourth surface facing the upper film substrate of the frame-shaped film, and the linear expansion coefficient of the frame-shaped film is equal to the linear expansion coefficient of the upper film substrate. Thus, the frame-shaped film provides a touch panel that is arranged such that the stretching axis of the frame-shaped film is in the same direction as the stretching axis of the upper film substrate.

請求項7に記載の発明は、請求項6に記載のタッチパネルにおいて、前記第3の粘着層の粘着力は、膨張した前記枠状フィルムが前記下部基板に対して付着した状態で面方向にずれることができる程度に設定される、タッチパネルを提供する。   According to a seventh aspect of the present invention, in the touch panel according to the sixth aspect, the adhesive force of the third adhesive layer is shifted in the plane direction in a state where the expanded frame-shaped film is attached to the lower substrate. Provided is a touch panel set to such an extent that it can be performed.

請求項8に記載の発明は、請求項1〜7のいずれか1項に記載のタッチパネルにおいて、前記上部フィルム基板と前記下部基板とは導電接着剤によって電気的に接続されており、前記上部フィルム基板において、前記導電接着剤による導電接着部分とタッチ入力領域との間にスリットを設けた、タッチパネルを提供する。   The invention according to claim 8 is the touch panel according to any one of claims 1 to 7, wherein the upper film substrate and the lower substrate are electrically connected by a conductive adhesive, and the upper film In the substrate, a touch panel is provided in which a slit is provided between a conductive adhesive portion of the conductive adhesive and a touch input region.

請求項9に記載の発明は、請求項8に記載のタッチパネルにおいて、前記スリットの形状が、前記上部フィルム基板の収縮方向に略垂直な直線、曲線、十字及び2本の線が直交しない十字のいずれかを含む、タッチパネルを提供する。   According to a ninth aspect of the present invention, in the touch panel according to the eighth aspect, the slit has a shape of a straight line, a curved line, a cross, and a cross in which two lines are not orthogonal to each other, substantially perpendicular to the shrinking direction of the upper film substrate. Provided is a touch panel including any of them.

請求項10に記載の発明は、請求項1〜7のいずれか1項に記載のタッチパネルにおいて、前記上部フィルム基板と前記下部基板とは導電接着剤によって電気的に接続されており、前記上部フィルム基板において、前記導電接着剤による導電接着部分とタッチ入力領域との間に点線状の切り込みを設けた、タッチパネルを提供する。   The invention according to claim 10 is the touch panel according to any one of claims 1 to 7, wherein the upper film substrate and the lower substrate are electrically connected by a conductive adhesive, and the upper film Provided is a touch panel in which a dotted line-like cut is provided between a conductive adhesive portion formed by the conductive adhesive and a touch input region on a substrate.

請求項11に記載の発明は、請求項8に記載のタッチパネルにおいて、前記スリットの内側近傍において、前記上部フィルム基板の導電被膜が除去されている、タッチパネルを提供する。   The invention according to claim 11 provides the touch panel according to claim 8, wherein the conductive film of the upper film substrate is removed in the vicinity of the inside of the slit.

請求項12に記載の発明は、請求項11に記載のタッチパネルにおいて、前記上部フィルム基板の前記導電被膜が、前記上部フィルム電極に形成されたフィルム側電極の延びる方向に垂直な方向に直線状に除去されている、タッチパネルを提供する。   The invention according to claim 12 is the touch panel according to claim 11, wherein the conductive film of the upper film substrate is linear in a direction perpendicular to a direction in which the film-side electrode formed on the upper film electrode extends. Provide a touch panel that has been removed.

本発明によれば、上部フィルム基板が温度変化又は湿度変化等により膨張した場合であっても、その膨張分を適切に吸収し、上部フィルム基板に波打ち等の不適切な変形が生じることを防止できる。   According to the present invention, even when the upper film substrate expands due to a change in temperature or humidity, the amount of expansion is properly absorbed, and inappropriate deformation such as undulation is prevented from occurring in the upper film substrate. it can.

また本発明によれば、引出線が上部フィルム基板に直接接続されておらず、導電接着部分を介して間接的に接続されている形態のタッチパネルにおいて、該導電接着部分の内側にスリット又は点線状の切り込みを形成することにより、フィルムの熱収縮によるフィルム側電極の破断・破損を防止することができる。   Further, according to the present invention, in the touch panel in which the leader line is not directly connected to the upper film substrate but indirectly connected through the conductive adhesive portion, a slit or dotted line is formed inside the conductive adhesive portion. By forming the notch, breakage / breakage of the film-side electrode due to heat shrinkage of the film can be prevented.

またスリットの内側において上部フィルム基板から導電被膜(ITO膜)を除去することにより、スリットを設けたことによるタッチ入力領域の電位の歪み(等電位線の乱れ)を防止することができる。   Further, by removing the conductive film (ITO film) from the upper film substrate inside the slit, it is possible to prevent potential distortion (disturbance of equipotential lines) in the touch input region due to the provision of the slit.

本発明の第1の実施形態に係るタッチパネルの概略構成を示す分解斜視図である。1 is an exploded perspective view showing a schematic configuration of a touch panel according to a first embodiment of the present invention. 図1のタッチパネルの断面図である。It is sectional drawing of the touch panel of FIG. 図1のタッチパネルにおいて上部フィルム基板が膨張した状態を示す断面図である。It is sectional drawing which shows the state which the upper film board | substrate expanded in the touch panel of FIG. 本発明の第2の実施形態に係るタッチパネルの概略構成を示す分解斜視図である。It is a disassembled perspective view which shows schematic structure of the touchscreen which concerns on the 2nd Embodiment of this invention. 図4のタッチパネルの断面図である。It is sectional drawing of the touch panel of FIG. 本発明の第3の実施形態に係るタッチパネルの概略構成を示す分解斜視図である。It is a disassembled perspective view which shows schematic structure of the touchscreen which concerns on the 3rd Embodiment of this invention. 図6のA部の部分拡大図である。It is the elements on larger scale of the A section of FIG. スリットの具体例を示す図であって、スリット形状が(a)直線の場合、(b)曲線又は円弧の場合、(c)十字の場合、及び(d)2直線が直交しない十字の場合を示す図である。It is a figure which shows the example of a slit, Comprising: When the slit shape is (a) a straight line, (b) In the case of a curve or an arc, (c) In the case of a cross, and (d) In the case of a cross in which two straight lines are not orthogonal FIG. スリットの代わりに点線状の切り込みを上部フィルム基板に設けた例を示す図である。It is a figure which shows the example which provided the dotted-line notch | incision in the upper film board | substrate instead of the slit. 上部フィルム基板のITO膜を部分的に除去した例を示す図である。It is a figure which shows the example which removed the ITO film | membrane of the upper film board | substrate partially. 図10のXI−XI断面を示す図である。It is a figure which shows the XI-XI cross section of FIG. 従来のタッチパネルの概略構成を示す分解斜視図である。It is a disassembled perspective view which shows schematic structure of the conventional touch panel. 図6のタッチパネルの断面図である。It is sectional drawing of the touch panel of FIG. 図6のタッチパネルにおいて上部フィルム基板が膨張して変形した状態を示す断面図である。It is sectional drawing which shows the state which the upper film board | substrate expanded and deform | transformed in the touch panel of FIG. 引出線が下部基板に取り付けられた従来のタッチパネルの概略構成を示す分解斜視図である。It is a disassembled perspective view which shows schematic structure of the conventional touch panel with which the leader line was attached to the lower board | substrate. 図15のタッチパネルにおいて、上部フィルム基板の収縮によりフィルム側電極が破損する例を示す図である。In the touch panel of FIG. 15, it is a figure which shows the example which a film side electrode breaks by shrinkage | contraction of an upper film board | substrate.

図1は、本発明に係る第1の実施形態に係るタッチパネル10の概略構成を示す分解斜視図であり、図2は図1のタッチパネル10の断面図である。タッチパネル10は、下部基板12と、枠状の接着手段14を介して下部基板12に貼り付けられる上部フィルム基板16とを有する。下部基板12及び上部フィルム基板16はそれぞれ、透明導電性物質を被着してなる導電膜面(図示せず)を有し、下部基板12及び上部フィルム基板16はそれぞれの導電膜面が対向するように貼り合わされる。下部基板12はガラス等の線膨張係数の比較的小さい部材であり、上部フィルム基板はPETフィルム等の下部基板12より線膨張係数の大きい部材である。また図1に示すように通常は、枠状の粘着層14によって上部フィルム基板16の全周が固定されている。   FIG. 1 is an exploded perspective view showing a schematic configuration of a touch panel 10 according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the touch panel 10 of FIG. The touch panel 10 includes a lower substrate 12 and an upper film substrate 16 that is attached to the lower substrate 12 via a frame-like bonding means 14. The lower substrate 12 and the upper film substrate 16 each have a conductive film surface (not shown) formed by applying a transparent conductive material, and the lower substrate 12 and the upper film substrate 16 face each other. Are pasted together. The lower substrate 12 is a member having a relatively small linear expansion coefficient such as glass, and the upper film substrate is a member having a larger linear expansion coefficient than the lower substrate 12 such as a PET film. As shown in FIG. 1, the entire circumference of the upper film substrate 16 is usually fixed by a frame-like adhesive layer 14.

図1、図2に示すように、接着手段14は、枠状の発泡体18と、発泡体18の下面又は第1の面(すなわち下部基板12に面する面)に貼り付けられた第1の粘着層20と、発泡体18の上面又は第2の面(すなわち上部フィルム基板16に面する面)に貼り付けられた第2の粘着層22とを有する。   As shown in FIGS. 1 and 2, the bonding means 14 includes a frame-shaped foam 18 and a first surface attached to the lower surface or the first surface (that is, the surface facing the lower substrate 12) of the foam 18. And the second adhesive layer 22 attached to the upper surface or the second surface of the foam 18 (that is, the surface facing the upper film substrate 16).

ここで、タッチパネル10の雰囲気の温度及び湿度の一方又は双方の変化(上昇)により上部フィルム基板16が膨張しても、発泡体18がそれに応じて変形し、上部フィルム基板16の不適切な変形(波打ち)等が防止される。詳細には、第1の粘着層20と第2の粘着層22との間に発泡体18が介在していることにより、上部フィルム基板16が膨張しても発泡体18がその両面が互いに面方向にずれるように変形するので、第2の粘着層22が第1の粘着層20に対してフィルムの伸びる方向に変位(延伸)する。従って、上部フィルム基板16の膨張分は吸収され、上部フィルム基板16は波打つような変形をしない。従って第2の粘着層22は、上部フィルム基板16と同等以上の膨張係数を有することが好ましい。   Here, even if the upper film substrate 16 expands due to a change (rise) in one or both of the temperature and humidity of the atmosphere of the touch panel 10, the foam 18 deforms accordingly, and the upper film substrate 16 is inappropriately deformed. (Waving) and the like are prevented. Specifically, since the foam 18 is interposed between the first adhesive layer 20 and the second adhesive layer 22, even if the upper film substrate 16 expands, both sides of the foam 18 face each other. Since the second adhesive layer 22 is deformed so as to be displaced in the direction, the second adhesive layer 22 is displaced (stretched) in the film extending direction with respect to the first adhesive layer 20. Accordingly, the expansion of the upper film substrate 16 is absorbed, and the upper film substrate 16 does not deform undulating. Therefore, the second adhesive layer 22 preferably has an expansion coefficient equal to or greater than that of the upper film substrate 16.

上述のような発泡体の両面に粘着層を貼り付けてなる接着手段は、例えば発泡体を基材とし、該発泡体の両面に粘着テープを取り付けてなる両面接着テープであり、このような両面接着テープは市販されているものでもよい。   The adhesive means formed by sticking the adhesive layer on both surfaces of the foam as described above is, for example, a double-sided adhesive tape in which the foam is a base material and the adhesive tape is attached to both surfaces of the foam. The adhesive tape may be a commercially available one.

また発泡体18を構成する好適な材料としては、ポリウレタン系材料、ポリオレフィン系材料、及びアクリルフォームが挙げられる。また発泡体の厚さは0.2mm以上であることが好ましく、0.6mm以下であることが好ましい。また下側粘着層20及び上側粘着層22の各々の厚さは、10μm以上であることが好ましく、40μm以下であることが好ましい。   Moreover, as a suitable material which comprises the foam 18, a polyurethane-type material, a polyolefin-type material, and an acrylic foam are mentioned. Moreover, it is preferable that the thickness of a foam is 0.2 mm or more, and it is preferable that it is 0.6 mm or less. The thickness of each of the lower adhesive layer 20 and the upper adhesive layer 22 is preferably 10 μm or more, and preferably 40 μm or less.

発泡体18の密度は、240kg/m3以上であることが好ましく、700kg/m3以下であることが好ましい。また発泡体18の圧縮荷重は0.008MPa以上であることが好ましく、0.032MPa以下であることが好ましい。さらに、発泡体18の圧縮残留歪は2%以上であることが好ましく、4%以下であることが好ましい。 The density of the foam 18 is preferably 240 kg / m 3 or more, and preferably 700 kg / m 3 or less. The compression load of the foam 18 is preferably 0.008 MPa or more, and preferably 0.032 MPa or less. Furthermore, the compressive residual strain of the foam 18 is preferably 2% or more, and preferably 4% or less.

図4は、本発明の第2の実施形態に係るタッチパネル30の概略構成を示す分解斜視図であり、図5は図4のタッチパネル30の断面図である。第2の実施形態が第1の実施形態と異なる点は、発泡体の代わりに高線膨張係数の枠状フィルムを使用する点にある。タッチパネル30は、下部基板32と、枠状の接着手段34を介して下部基板32に貼り付けられる上部フィルム基板36とを有する。下部基板32及び上部フィルム基板36はそれぞれ、透明導電性物質を被着してなる導電膜面(図示せず)を有し、下部基板32及び上部フィルム基板36はそれぞれの導電膜面が対向するように貼り合わされる。下部基板32はガラス等の線膨張係数の比較的小さい部材であり、上部フィルム基板はPETフィルム等の下部基板32より線膨張係数の大きい部材である。また図1に示すように通常は、枠状の粘着層34によって上部フィルム基板36の全周が固定されている。   FIG. 4 is an exploded perspective view showing a schematic configuration of the touch panel 30 according to the second embodiment of the present invention, and FIG. 5 is a cross-sectional view of the touch panel 30 of FIG. The second embodiment is different from the first embodiment in that a frame film having a high linear expansion coefficient is used instead of the foam. The touch panel 30 includes a lower substrate 32 and an upper film substrate 36 that is attached to the lower substrate 32 via a frame-shaped bonding means 34. The lower substrate 32 and the upper film substrate 36 each have a conductive film surface (not shown) formed by depositing a transparent conductive material, and the lower substrate 32 and the upper film substrate 36 face each other. Are pasted together. The lower substrate 32 is a member having a relatively small linear expansion coefficient such as glass, and the upper film substrate is a member having a larger linear expansion coefficient than the lower substrate 32 such as a PET film. As shown in FIG. 1, the entire circumference of the upper film substrate 36 is usually fixed by a frame-like adhesive layer 34.

図4、図5に示すように、接着手段34は、枠状のフィルム材料38と、フィルム材料38の下面又は第3の面(すなわち下部基板32に面する面)に貼り付けられた第3の粘着層40と、枠状フィルム38の上面又は第4の面(すなわち上部フィルム基板36に面する面に貼り付けられた第4の粘着層42とを有する。ここで枠状フィルム38の線膨張係数は上部フィルム基板36の線膨張係数と同等以上であり、かつ枠状フィルム38は、枠状フィルム38の延伸軸が上部フィルム基板36の延伸軸と同一方向となるように配置される。   As shown in FIGS. 4 and 5, the adhesion means 34 is a frame-shaped film material 38 and a third surface affixed to the lower surface or the third surface (that is, the surface facing the lower substrate 32) of the film material 38. Adhesive layer 40 and the upper surface or the fourth surface of the frame-shaped film 38 (that is, the fourth adhesive layer 42 attached to the surface facing the upper film substrate 36. Here, the line of the frame-shaped film 38) The expansion coefficient is equal to or greater than the linear expansion coefficient of the upper film substrate 36, and the frame-shaped film 38 is arranged so that the stretching axis of the frame-shaped film 38 is in the same direction as the stretching axis of the upper film substrate 36.

ここで、タッチパネル30の雰囲気の温度及び湿度の一方又は双方が変化(上昇)すると、タッチパネル30の各構成要素は各々の線膨張係数に基づく量だけ膨張するが、枠状フィルム38の方が下部基板32よりも線膨張係数が高いので、両者を接着する第3の粘着層40の粘着力が極めて強い場合は、枠状フィルム38は膨張に伴って波打ち等の変形をする。しかし第2の実施形態では、第3の粘着層40は例えば両面接着テープであり、第3の粘着層40の下面(下部基板32に接着する面)の粘着力は、温度又は湿度等のタッチパネル30の環境が変化したときに、膨張した枠状フィルム38が下部基板32に対して付着した状態で(すなわち剥離せずに)面方向にいくらかずれることができる程度に設定される。従って枠状フィルム38には波打ち等の変形は生じない。   Here, when one or both of the temperature and humidity of the atmosphere of the touch panel 30 change (rise), each component of the touch panel 30 expands by an amount based on the respective linear expansion coefficient, but the frame-shaped film 38 is lower. Since the linear expansion coefficient is higher than that of the substrate 32, when the adhesive force of the third adhesive layer 40 that bonds the two is extremely strong, the frame-like film 38 is deformed such as undulation with expansion. However, in the second embodiment, the third adhesive layer 40 is, for example, a double-sided adhesive tape, and the adhesive force of the lower surface of the third adhesive layer 40 (the surface that adheres to the lower substrate 32) is a touch panel such as temperature or humidity. When the environment of 30 changes, the expanded frame-like film 38 is set to such an extent that it can be shifted somewhat in the surface direction in a state of being attached to the lower substrate 32 (that is, without peeling). Therefore, the frame-like film 38 is not deformed such as undulation.

一方、上述のように枠状フィルム38の線膨張係数は上部フィルム基板36の線膨張係数と同等以上であるので、上部フィルム基板36の方が枠状フィルム38よりも大きく膨張することはない。従って結果として、タッチパネルの雰囲気の温度又は湿度が変化しても、上部フィルム基板36に波打ち等の不都合な変形は生じない。   On the other hand, since the linear expansion coefficient of the frame-shaped film 38 is equal to or greater than the linear expansion coefficient of the upper film substrate 36 as described above, the upper film substrate 36 does not expand more than the frame-shaped film 38. Therefore, as a result, even if the temperature or humidity of the atmosphere of the touch panel is changed, the upper film substrate 36 does not have an inconvenient deformation such as undulation.

なお上部フィルム基板36と枠状フィルム38とを接着する第4の粘着層42の粘着力には特段の制約はないが、枠状フィルム38の線膨張係数の方が上部フィルム基板36の線膨張係数よりも相当に大きい場合は、両者が膨張したときに上部フィルム基板36に過度の引張り力が作用し得るので、第4の粘着層も、膨張した枠状フィルム38が上部フィルム基板36に対して面方向にいくらかずれることができる程度に設定されることが好ましい。   The adhesive force of the fourth adhesive layer 42 that bonds the upper film substrate 36 and the frame-shaped film 38 is not particularly limited, but the linear expansion coefficient of the frame-shaped film 38 is greater than that of the upper film substrate 36. If the coefficient is considerably larger than the coefficient, an excessive tensile force may act on the upper film substrate 36 when both expand, so that the expanded frame-like film 38 also has an expanded frame film 38 with respect to the upper film substrate 36. It is preferably set to such an extent that it can be shifted somewhat in the surface direction.

枠状の高線膨張係数フィルム38を構成する好適な材料としては、ポリカーボネート、ポリプロピレン、及びアクリル樹脂が挙げられる。これらの材料は、上部フィルム基板36として多くの場合使用されるポリエチレンテレフタレート(PET)フィルムよりも高い線膨張係数を有する。   Suitable materials for forming the frame-like high linear expansion coefficient film 38 include polycarbonate, polypropylene, and acrylic resin. These materials have a higher coefficient of linear expansion than the polyethylene terephthalate (PET) film often used as the upper film substrate 36.

なお上記実施形態では、接着手段14及び34を枠状(すなわち矩形のフィルム基板の4辺全てに接着されるもの)として構成したが、上部フィルム基板の対向する2辺のみ、又は3辺のみに接着する構成としてもよい。   In the above embodiment, the bonding means 14 and 34 are configured as a frame (that is, bonded to all four sides of the rectangular film substrate), but only on the two opposite sides or only on the three sides of the upper film substrate. It is good also as a structure to adhere | attach.

図6は、本発明の第3の実施形態に係るタッチパネル50の上面図である。タッチパネル50は、図12に示した従来のタッチパネル200と同様、FPC等の引出線52がガラス等の下部基板(図示せず)に取り付けられており、枠状の両面接着テープ等(図示せず)によって下部基板に固定されたPETフィルム等の上部フィルム基板54には直接取り付けられていない。従って上部フィルム基板54上に形成されたフィルム側電極56は、導電接着剤により形成された導電接着部分58(図示例では略円形形状とする)において下部基板に導通接続されている。   FIG. 6 is a top view of the touch panel 50 according to the third embodiment of the present invention. As with the conventional touch panel 200 shown in FIG. 12, the touch panel 50 has a lead line 52 such as FPC attached to a lower substrate (not shown) such as glass, and has a frame-like double-sided adhesive tape or the like (not shown). ) Is not directly attached to the upper film substrate 54 such as a PET film fixed to the lower substrate. Accordingly, the film-side electrode 56 formed on the upper film substrate 54 is electrically connected to the lower substrate at a conductive adhesive portion 58 (which has a substantially circular shape in the illustrated example) formed of a conductive adhesive.

ここで上述のような上部フィルム基板の熱収縮によるフィルム側電極の破断・破損を防止すべく、図6の部分拡大図7に示すように、導電接着部分58からフィルム面方向内側に離れ、かつ上部フィルム基板54のタッチ入力領域60の外側の領域に、スリット62が設けられる。   Here, in order to prevent the breakage and breakage of the film side electrode due to the heat shrinkage of the upper film substrate as described above, as shown in the partial enlarged view of FIG. A slit 62 is provided in a region outside the touch input region 60 of the upper film substrate 54.

スリット62は、図7にて破線62′で示すように、上部フィルム基板54の熱収縮に伴って変形し、導電接着部分58に生じる面方向内側への力を緩和して、フィルム側電極56に破断やクラックが生じないような形状に構成される。図8はその具体例を示しており、図7に示す直角形状の他、フィルム収縮方向に略垂直な直線62a(図8(a))、曲線又は円弧62b(図8(b))、十字62c(図8(c))及び2本の線が直交しない十字62d(図8(d))等の形状が挙げられるが、いずれも上部フィルム基板54の熱収縮に伴って変形し、導電接着部分58に生じる面方向内側への力を緩和して、フィルム側電極56に破断やクラックが生じないような形状に構成されている。   As shown by the broken line 62 ′ in FIG. 7, the slit 62 is deformed with the thermal contraction of the upper film substrate 54, relieving the inward force generated in the conductive adhesive portion 58, and the film side electrode 56. Is formed into a shape that does not cause breakage or cracks. FIG. 8 shows a specific example. In addition to the right-angled shape shown in FIG. 7, a straight line 62a (FIG. 8 (a)), a curve or arc 62b (FIG. 8 (b)), and a cross Examples include shapes such as 62c (FIG. 8C) and a cross 62d (FIG. 8D) in which the two lines are not perpendicular to each other. The film 58 is configured in such a shape that the film-side electrode 56 is not broken or cracked by reducing the inward force generated in the portion 58 in the plane direction.

なお本願発明における「スリット」は、上部フィルム基板に設けた切込み(すなわち幅を実質有さない)の他、上部フィルム基板の一部を除去したもの(すなわち一定の幅、大きさを有する)も含むものとする。   The “slit” in the present invention is not only a cut (that is, substantially not having a width) provided in the upper film substrate, but also a part of the upper film substrate (that is, having a certain width and size). Shall be included.

上部フィルム基板において導電接着部より内側にスリットを設けることにより、フィルム収縮による導電接着部でのフィルム側電極の破断を防止することができる。従ってフィルム収縮に耐え得るように導電接着部を大きくする必要はなく、故に額縁部を狭くでき、外形寸法が同じでも操作エリアの広いタッチパネルを実現することができる。   By providing a slit inside the conductive adhesive portion in the upper film substrate, it is possible to prevent the film side electrode from being broken at the conductive adhesive portion due to film shrinkage. Therefore, it is not necessary to enlarge the conductive adhesive portion so that it can withstand film shrinkage. Therefore, the frame portion can be narrowed, and a touch panel with a wide operation area can be realized even if the outer dimensions are the same.

また上述のスリットの代わりに、図9に示すように、上部フィルム基板54のタッチ入力領域60外側であって導電接着部分58のフィルム面方向内側に、点線状の切り込み64を設けてもよい。このような構成によっても、フィルム収縮による導電接着部分58への応力を軽減できる。なお点線状の切り込み64は、図9のように上部フィルム基板54の1辺の全長にわたって形成されてもよいが、導電接着部分58の近傍のみに形成されてもよい。   Further, instead of the above-described slit, as shown in FIG. 9, a dotted cut 64 may be provided outside the touch input region 60 of the upper film substrate 54 and inside the conductive adhesive portion 58 in the film surface direction. Even with such a configuration, it is possible to reduce the stress applied to the conductive bonding portion 58 due to film shrinkage. The dotted cut 64 may be formed over the entire length of one side of the upper film substrate 54 as shown in FIG. 9, but may be formed only in the vicinity of the conductive adhesive portion 58.

なお上述のように上部フィルム基板の一部にスリットを設けた場合は、図6に示すように、タッチ入力領域60内のスリット62近傍において電位の歪み(等電位線66の歪み)が生じ、タッチ入力操作に影響を与える虞がある。そこで図10に示すように、上部フィルム基板54のITO膜等の導電被膜を部分的に除去したITO除去部分74をスリット62の内側に形成することにより、電位の歪みを防止できる。上部フィルム基板54は通常、図10のXI−XI線に沿う断面図11に示すように、PETフィルム68と、PETフィルム68の上面(操作面)に形成されたハードコート膜70と、PETフィルム68の下面に形成されたITO膜等の導電被膜72とを有し、導電被膜72の下面の一部に上述のフィルム側電極56が形成されている。ここで図10及び図11に示すように、ITO膜72を等電位線66′の延びる方向(フィルム側電極の延びる方向)に垂直な方向に、タッチ入力領域60の1辺にわたって直線状に除去してITO除去部分74を形成することにより、スリット62による等電位線への影響が排除される。従って図10に示すように、歪みのない等電位線66′を確保して精度の高いタッチ入力(位置決め)操作が可能となる。なおITO除去部分74は、タッチ入力領域60をできるだけ広く確保すべく、スリット62の直近内側に設けられることが好ましい。   When a slit is provided in a part of the upper film substrate as described above, potential distortion (distortion of equipotential line 66) occurs in the vicinity of the slit 62 in the touch input region 60, as shown in FIG. There is a possibility of affecting the touch input operation. Therefore, as shown in FIG. 10, potential distortion can be prevented by forming an ITO removal portion 74 in which the conductive film such as the ITO film of the upper film substrate 54 is partially removed inside the slit 62. The upper film substrate 54 is usually a PET film 68, a hard coat film 70 formed on the upper surface (operation surface) of the PET film 68, and a PET film, as shown in the sectional view 11 along the line XI-XI in FIG. And a conductive film 72 such as an ITO film formed on the lower surface of 68, and the film-side electrode 56 described above is formed on a part of the lower surface of the conductive film 72. Here, as shown in FIGS. 10 and 11, the ITO film 72 is removed in a straight line over one side of the touch input region 60 in a direction perpendicular to the direction in which the equipotential lines 66 ′ extend (the direction in which the film side electrode extends). Thus, by forming the ITO removal portion 74, the influence on the equipotential line by the slit 62 is eliminated. Therefore, as shown in FIG. 10, an equipotential line 66 'without distortion can be secured and a highly accurate touch input (positioning) operation can be performed. The ITO removal portion 74 is preferably provided in the immediate inner side of the slit 62 in order to secure the touch input area 60 as wide as possible.

10、30、50、100、200 タッチパネル
12、32、102、204 下部基板
14、34、104、306 接着手段
16、36、54、106、208 上部フィルム基板
18 発泡体
20、22、40、42 粘着層
38 枠状高線膨張係数フィルム
52、202 引出線
58、210 導電接着部分
60 タッチ入力領域
62、62a、62b、62c、62d スリット
64 点線状切り込み
72 ITO膜
74 ITO除去部分
10, 30, 50, 100, 200 Touch panel 12, 32, 102, 204 Lower substrate 14, 34, 104, 306 Adhesive means 16, 36, 54, 106, 208 Upper film substrate 18 Foam 20, 22, 40, 42 Adhesive layer 38 Frame-like high linear expansion coefficient film 52, 202 Lead line 58, 210 Conductive adhesion part 60 Touch input area 62, 62a, 62b, 62c, 62d Slit 64 Dotted line cut 72 ITO film 74 ITO removal part

Claims (12)

透明導電性物質を被着してなる導電膜面を各々が備えた上部フィルム基板及び下部基板を、枠状の接着手段を用いて該導電膜面が互いに対向するように貼り合わせてなるタッチパネルにおいて、
前記接着手段は、枠状の発泡体と、該発泡体が有する前記下部基板に対向する第1の面に貼り合わされた第1の粘着層と、前記発泡体が有する前記上部フィルム基板に対向する第2の面に貼り合わされた第2の粘着層とから構成される、タッチパネル。
In a touch panel in which an upper film substrate and a lower substrate each provided with a conductive film surface coated with a transparent conductive material are bonded to each other using a frame-like adhesive means so that the conductive film surfaces face each other ,
The adhering means opposes the frame-shaped foam, the first adhesive layer bonded to the first surface facing the lower substrate of the foam, and the upper film substrate of the foam. The touch panel comprised from the 2nd adhesion layer affixed on the 2nd surface.
前記接着手段は、発泡体を基材とする両面接着テープである、請求項1に記載のタッチパネル。   The touch panel according to claim 1, wherein the adhesive means is a double-sided adhesive tape having a foam as a base material. 前記発泡体は、ポリウレタン系材料、ポリオレフィン系材料、又はアクリルフォームから構成される、請求項1又は2に記載のタッチパネル。   The touch panel according to claim 1, wherein the foam is made of a polyurethane material, a polyolefin material, or an acrylic foam. 前記発泡体の厚さは0.2mm以上かつ0.6mm以下であり、前記第1及び第2の粘着層の各々の厚さは10μm以上かつ40μm以下である、請求項1〜3のいずれか1項に記載のタッチパネル。   The thickness of the foam is 0.2 mm or more and 0.6 mm or less, and the thickness of each of the first and second adhesive layers is 10 μm or more and 40 μm or less. The touch panel according to item 1. 前記発泡体の密度は240kg/m3以上かつ700kg/m3以下であり、前記発泡体の圧縮荷重は0.008MPa以上かつ0.032MPa以下であり、前記発泡体の圧縮残留歪は2%以上かつ4%以下である、請求項1〜4のいずれか1項に記載のタッチパネル。 The foam has a density of 240 kg / m 3 or more and 700 kg / m 3 or less, the compression load of the foam is 0.008 MPa or more and 0.032 MPa or less, and the compression residual strain of the foam is 2% or more. And the touch panel of any one of Claims 1-4 which is 4% or less. 透明導電性物質を被着してなる導電膜面を各々が備えた上部フィルム基板及び下部基板を、枠状の接着手段を用いて該導電膜面が互いに対向するように貼り合わせてなるタッチパネルにおいて、
前記接着手段は、枠状のフィルムと、該枠状のフィルムが有する前記下部基板に対向する第3の面に貼り合わされた第3の粘着層と、前記枠状のフィルムが有する前記上部フィルム基板に対向する第4の面に貼り合わされた第4の粘着層とから構成され、
前記枠状フィルムの線膨張係数は前記上部フィルム基板の線膨張係数と同等以上であり、かつ前記枠状フィルムは、該枠状フィルムの延伸軸が前記上部フィルム基板の延伸軸と同一方向となるように配置される、タッチパネル。
In a touch panel in which an upper film substrate and a lower substrate each provided with a conductive film surface coated with a transparent conductive material are bonded to each other using a frame-like adhesive means so that the conductive film surfaces face each other ,
The bonding means includes a frame-shaped film, a third adhesive layer bonded to a third surface facing the lower substrate included in the frame-shaped film, and the upper film substrate included in the frame-shaped film. And a fourth adhesive layer bonded to the fourth surface opposite to
The linear expansion coefficient of the frame-shaped film is equal to or greater than the linear expansion coefficient of the upper film substrate, and the frame-shaped film has the stretching axis of the frame-shaped film in the same direction as the stretching axis of the upper film substrate. The touch panel is arranged as follows.
前記第3の粘着層の粘着力は、膨張した前記枠状フィルムが前記下部基板に対して付着した状態で面方向にずれることができる程度に設定される、請求項6に記載のタッチパネル。   The touch panel according to claim 6, wherein the adhesive force of the third adhesive layer is set to such an extent that the expanded frame-like film can be shifted in the surface direction in a state of being attached to the lower substrate. 前記上部フィルム基板と前記下部基板とは導電接着剤によって電気的に接続されており、前記上部フィルム基板において、前記導電接着剤による導電接着部分とタッチ入力領域との間にスリットを設けた、請求項1〜7のいずれか1項に記載のタッチパネル。   The upper film substrate and the lower substrate are electrically connected by a conductive adhesive, and in the upper film substrate, a slit is provided between a conductive adhesive portion by the conductive adhesive and a touch input region. Item 8. The touch panel according to any one of items 1 to 7. 前記スリットの形状が、前記上部フィルム基板の収縮方向に略垂直な直線、曲線、十字及び2本の線が直交しない十字のいずれかを含む、請求項8に記載のタッチパネル。   The touch panel according to claim 8, wherein the shape of the slit includes any of a straight line, a curved line, a cross, and a cross in which two lines are not orthogonal to each other, substantially perpendicular to the contraction direction of the upper film substrate. 前記上部フィルム基板と前記下部基板とは導電接着剤によって電気的に接続されており、前記上部フィルム基板において、前記導電接着剤による導電接着部分とタッチ入力領域との間に点線状の切り込みを設けた、請求項1〜7のいずれか1項に記載のタッチパネル。   The upper film substrate and the lower substrate are electrically connected by a conductive adhesive, and a dotted line cut is provided between the conductive adhesive portion by the conductive adhesive and the touch input area in the upper film substrate. The touch panel according to any one of claims 1 to 7. 前記スリットの内側近傍において、前記上部フィルム基板の導電被膜が除去されている、請求項8に記載のタッチパネル。   The touch panel according to claim 8, wherein the conductive film of the upper film substrate is removed in the vicinity of the inside of the slit. 前記上部フィルム基板の前記導電被膜が、前記上部フィルム電極に形成されたフィルム側電極の延びる方向に垂直な方向に直線状に除去されている、請求項11に記載のタッチパネル。   The touch panel according to claim 11, wherein the conductive film of the upper film substrate is linearly removed in a direction perpendicular to a direction in which a film side electrode formed on the upper film electrode extends.
JP2011090137A 2011-04-14 2011-04-14 Touch panel Expired - Fee Related JP5777384B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011090137A JP5777384B2 (en) 2011-04-14 2011-04-14 Touch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011090137A JP5777384B2 (en) 2011-04-14 2011-04-14 Touch panel

Publications (3)

Publication Number Publication Date
JP2012221468A true JP2012221468A (en) 2012-11-12
JP2012221468A5 JP2012221468A5 (en) 2014-05-08
JP5777384B2 JP5777384B2 (en) 2015-09-09

Family

ID=47272847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011090137A Expired - Fee Related JP5777384B2 (en) 2011-04-14 2011-04-14 Touch panel

Country Status (1)

Country Link
JP (1) JP5777384B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014156642A1 (en) * 2013-03-25 2014-10-02 Dic株式会社 Adhesive tape and electronic equipment
JP2015193793A (en) * 2014-03-26 2015-11-05 日東電工株式会社 Resin foam, foam member, and touch panel-mounting appliance
JPWO2017175521A1 (en) * 2016-04-04 2018-12-20 アルプス電気株式会社 Capacitive sensor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT517870B1 (en) 2015-10-30 2019-03-15 Chemiefaser Lenzing Ag High concentration mixer for producing a cellulosic suspension with high cellulose concentration

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123728A (en) * 1990-09-14 1992-04-23 Hitachi Aic Inc Touch panel
JPH06214705A (en) * 1992-10-15 1994-08-05 Daido Maruta Senko Kk Analog-type transparent touch panel
JP2003280800A (en) * 2002-01-21 2003-10-02 Matsushita Electric Ind Co Ltd Touch panel
JP2004210866A (en) * 2002-12-27 2004-07-29 Soken Chem & Eng Co Ltd Pressure-sensitive adhesive resin composition, double-side pressure-sensitive adhesive tape using it, and touch panel using it
JP2006259815A (en) * 2005-03-15 2006-09-28 Matsushita Electric Ind Co Ltd Touch panel
JP2008234470A (en) * 2007-03-22 2008-10-02 Fujitsu Component Ltd Touch panel structure
JP2009064343A (en) * 2007-09-07 2009-03-26 Fujitsu Component Ltd Touch panel
JP2009108314A (en) * 2007-10-12 2009-05-21 Dic Corp Water-proofing double-sided adhesive tape
JP2009242541A (en) * 2008-03-31 2009-10-22 Sekisui Chem Co Ltd Impact-absorbing tape

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123728A (en) * 1990-09-14 1992-04-23 Hitachi Aic Inc Touch panel
JPH06214705A (en) * 1992-10-15 1994-08-05 Daido Maruta Senko Kk Analog-type transparent touch panel
JP2003280800A (en) * 2002-01-21 2003-10-02 Matsushita Electric Ind Co Ltd Touch panel
JP2004210866A (en) * 2002-12-27 2004-07-29 Soken Chem & Eng Co Ltd Pressure-sensitive adhesive resin composition, double-side pressure-sensitive adhesive tape using it, and touch panel using it
JP2006259815A (en) * 2005-03-15 2006-09-28 Matsushita Electric Ind Co Ltd Touch panel
JP2008234470A (en) * 2007-03-22 2008-10-02 Fujitsu Component Ltd Touch panel structure
JP2009064343A (en) * 2007-09-07 2009-03-26 Fujitsu Component Ltd Touch panel
JP2009108314A (en) * 2007-10-12 2009-05-21 Dic Corp Water-proofing double-sided adhesive tape
JP2009242541A (en) * 2008-03-31 2009-10-22 Sekisui Chem Co Ltd Impact-absorbing tape

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014156642A1 (en) * 2013-03-25 2014-10-02 Dic株式会社 Adhesive tape and electronic equipment
JP5700178B2 (en) * 2013-03-25 2015-04-15 Dic株式会社 Adhesive tape and electronic equipment
JPWO2014156642A1 (en) * 2013-03-25 2017-02-16 Dic株式会社 Adhesive tape and electronic equipment
JP2015193793A (en) * 2014-03-26 2015-11-05 日東電工株式会社 Resin foam, foam member, and touch panel-mounting appliance
JPWO2017175521A1 (en) * 2016-04-04 2018-12-20 アルプス電気株式会社 Capacitive sensor

Also Published As

Publication number Publication date
JP5777384B2 (en) 2015-09-09

Similar Documents

Publication Publication Date Title
US6572941B1 (en) Glare-resistant touch panel
JP2020510850A (en) Flexible display panel, method of manufacturing the same, and display device
KR102252054B1 (en) Sensor device, display device, and input device
JP2001142644A (en) Touch panel
JP2002328779A (en) Touch penal and electronic equipment using the same
JP2002222055A (en) Touch panel
JP5777384B2 (en) Touch panel
CN103324250A (en) Electronic device provided with touch screen and assembling method thereof
US20090244024A1 (en) Display device with touch panel and a method for manufacturing the same
JP5912985B2 (en) Touch panel and manufacturing method thereof
JP2010208305A (en) Laminated substrate, display device, manufacturing method of laminated substrate, and manufacturing method of display device
JP2016061977A (en) Display device and portable terminal apparatus
US20130335347A1 (en) Touch display devices, cover lens thereof and bonding equipment for fabricating touch display device
CN112396964A (en) Display panel and display device
WO2021031080A1 (en) Foldable display screen, fabrication method therefor and display device
JP2012221468A5 (en)
WO2011021579A1 (en) Input device
US20140347576A1 (en) Display device
TWM376828U (en) Touch panel
JP2015079477A (en) Touchscreen panel and manufacturing method therefor
US10919282B1 (en) Flexible display module and flexible display device
US20130327562A1 (en) Touch panel
JP4348505B2 (en) Touch panel, manufacturing method thereof, and display device
WO2019044155A1 (en) Input device
JP2005222266A (en) Display unit with touch sensor and double coated adhesive tape with touch sensor for display unit

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140325

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140325

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141118

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141119

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150116

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150609

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150707

R150 Certificate of patent or registration of utility model

Ref document number: 5777384

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees