JP2012220781A - Method of manufacturing display device - Google Patents

Method of manufacturing display device Download PDF

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JP2012220781A
JP2012220781A JP2011087541A JP2011087541A JP2012220781A JP 2012220781 A JP2012220781 A JP 2012220781A JP 2011087541 A JP2011087541 A JP 2011087541A JP 2011087541 A JP2011087541 A JP 2011087541A JP 2012220781 A JP2012220781 A JP 2012220781A
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resin precursor
dam
display device
substrate
manufacturing
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JP5468039B2 (en
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Shoji Furuhashi
省司 古橋
Setsuo Kobayashi
節郎 小林
Sakae Ishii
栄 石井
Shuji Iwasaki
修治 岩崎
Shigemi Ichito
茂美 市東
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Japan Display Inc
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Japan Display East Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a method of preventing resin from being extruded when parts are adhered together.SOLUTION: A gap between a substrate 38 and a display panel 10 is narrowed to spread a resin precursor 46. Viscosity of the resin precursor 46 is changed during the period of process in which the resin precursor 46 is spread. An adhesion layer 40 which adheres the substrate 38 and the display panel 10 is formed from the resin precursor 46. At least one of the substrate 38 and the display panel 10 has a dam 42 arranged along a region surrounding the center, and the dam 42 has cuts 44. The resin precursor 46 is arranged so as to be surrounded by the dam 42, the dam 42 is compressed between the substrate 38 and the display panel 10, and the resin precursor 46 is allowed to flow in the directions of the cuts 44 while resin precursor 46 is dammed off by the dam 42. In the process of changing the viscosity of the resin precursor 46, the viscosity of the tip portion of the resin precursor 46 which flows toward the cuts 44 is made higher than the viscosity of the resin precursor 46 of other areas.

Description

本発明は、表示装置の製造方法に関する。   The present invention relates to a method for manufacturing a display device.

液晶表示パネルにフロントパネルを貼り付けることが知られている（特許文献１）。また、２枚の平面基板同士を貼り合わせる方法として、２枚の基板の一方あるいは両方の接着面となる面の周辺部に、基板からはみ出した樹脂を溜めるための溝を設け、２枚の基板の接着面となる少なくとも一方の面に接着性樹脂を供給し、２枚の基板を樹脂供給面が対向するように配置し、加圧手段により樹脂を押し拡げて硬化させ、２枚の平面基板を貼り合わせる方法が知られている（特許文献２）   It is known to attach a front panel to a liquid crystal display panel (Patent Document 1). In addition, as a method of bonding two flat substrates together, a groove for storing the resin protruding from the substrate is provided at the periphery of one or both of the surfaces of the two substrates to be bonded surfaces. Adhesive resin is supplied to at least one surface to be an adhesive surface, two substrates are arranged so that the resin supply surfaces face each other, and the resin is spread and cured by a pressing means, and two planar substrates Is known (Patent Document 2).

特開２０１０−７８８９８号公報JP 2010-78898 A 特開平８−３６１５１号公報JP-A-8-36151

上記方法では、溝に樹脂を溜めることで樹脂の基板からのはみ出しを抑制することができるとしても、溝にあふれた樹脂はやはり基板からはみ出してしまう。したがって、溝のような凹部や、あるいはダムのような凸部などの構造物だけでは樹脂のはみ出しの問題を解決することは難しかった。   In the above method, even if the resin can be prevented from protruding from the substrate by storing the resin in the groove, the resin overflowing the groove still protrudes from the substrate. Therefore, it has been difficult to solve the problem of resin protrusion only with a structure such as a concave portion such as a groove or a convex portion such as a dam.

本発明は、貼り合わせのときの樹脂のはみ出しを防止する方法の提供を目的とする。   An object of this invention is to provide the method of preventing the protrusion of resin at the time of bonding.

（１）本発明に係る表示装置の製造方法は、基板と表示パネルの間に液状の樹脂前駆体を設ける工程と、前記基板と前記表示パネルの間隔を狭くして前記樹脂前駆体を拡げる工程と、前記樹脂前駆体から、前記基板と前記表示パネルを接着する接着層を形成する工程と、を含み、前記基板及び前記表示パネルの少なくとも一方は、中央を囲む領域に沿って配置されたダムを有し、前記ダムは切れ目を有し、前記樹脂前駆体を設ける工程で、前記樹脂前駆体を前記ダムに囲まれるように配置し、前記樹脂前駆体を拡げる工程で、前記ダムを前記基板と前記表示パネルの間で圧縮して、前記樹脂前駆体を前記ダムでせき止めながら前記切れ目の方向に流動させ、前記切れ目に向かって流動する先頭部分の前記樹脂前駆体の粘性を、他の部分の前記樹脂前駆体の粘性よりも高くすることを特徴とする。本発明によれば、切れ目に向かって流動する先頭部分の樹脂前駆体の粘性を高くすることで、ダムの切れ目から樹脂前駆体をはみ出すことを抑えることができる。   (1) A method of manufacturing a display device according to the present invention includes a step of providing a liquid resin precursor between a substrate and a display panel, and a step of widening the resin precursor by narrowing an interval between the substrate and the display panel. And a step of forming an adhesive layer that bonds the substrate and the display panel from the resin precursor, and at least one of the substrate and the display panel is disposed along a region surrounding the center. The dam has a cut, the step of providing the resin precursor, the resin precursor is disposed so as to be surrounded by the dam, and the step of expanding the resin precursor, the dam is disposed on the substrate. And compressing between the display panel, the resin precursor is caused to flow in the direction of the cut while being dammed by the dam, and the viscosity of the resin precursor at the leading portion flowing toward the cut is changed to the other part. Of the above Characterized by higher than the viscosity of the fat precursor. According to the present invention, it is possible to prevent the resin precursor from protruding from the dam cut by increasing the viscosity of the resin precursor at the leading portion that flows toward the cut.

（２）（１）に記載された表示装置の製造方法において、前記樹脂前駆体は、紫外線硬化樹脂前駆体であり、前記樹脂前駆体を拡げる工程で、前記ダムに囲まれて前記切れ目に隣接する位置で、紫外線の光エネルギーを前記樹脂前駆体に照射することを特徴としてもよい。   (2) In the method of manufacturing a display device described in (1), the resin precursor is an ultraviolet curable resin precursor, and is adjacent to the cut surrounded by the dam in the step of expanding the resin precursor. The resin precursor may be irradiated with light energy of ultraviolet rays at a position where the light is applied.

（３）（１）に記載された表示装置の製造方法において、前記樹脂前駆体を拡げる工程で、前記ダムに囲まれて前記切れ目に隣接する位置で前記樹脂前駆体を冷却することを特徴としてもよい。   (3) In the manufacturing method of the display device described in (1), in the step of expanding the resin precursor, the resin precursor is cooled at a position surrounded by the dam and adjacent to the cut. Also good.

（４）（３）に記載された表示装置の製造方法において、前記樹脂前駆体の冷却を、ペルチエ素子を使用して行うことを特徴としてもよい。   (4) In the display device manufacturing method described in (3), the resin precursor may be cooled using a Peltier element.

（５）（１）に記載された表示装置の製造方法において、前記樹脂前駆体を拡げる工程で、前記ダムに囲まれて前記切れ目に隣接する位置で前記樹脂前駆体の温度が相対的に低くなるように、前記ダムに囲まれる前記領域の中央で前記樹脂前駆体を加熱することを特徴としてもよい。   (5) In the method for manufacturing a display device according to (1), in the step of expanding the resin precursor, the temperature of the resin precursor is relatively low at a position surrounded by the dam and adjacent to the cut. As such, the resin precursor may be heated at the center of the region surrounded by the dam.

（６）（１）から（５）のいずれか１項に記載された表示装置の製造方法において、前記ダムは、前記樹脂前駆体と同じ材料からなり、前記流動する先頭部分の前記樹脂前駆体よりも粘性が高いことを特徴としてもよい。   (6) In the method of manufacturing a display device according to any one of (1) to (5), the dam is made of the same material as the resin precursor, and the resin precursor at the flowing front portion It may be characterized by having a higher viscosity.

（７）（１）から（６）のいずれか１項に記載された表示装置の製造方法において、前記基板は、透明のガラス基板であることを特徴としてもよい。   (7) In the method for manufacturing a display device described in any one of (1) to (6), the substrate may be a transparent glass substrate.

（８）（１）から（６）のいずれか１項に記載された表示装置の製造方法において、前記基板は、タッチパネルであることを特徴としてもよい。   (8) In the method for manufacturing a display device described in any one of (1) to (6), the substrate may be a touch panel.

本発明の実施形態に係る方法で製造された表示装置の断面図である。It is sectional drawing of the display apparatus manufactured by the method which concerns on embodiment of this invention. 基板にダムを設けた例を示す図である。It is a figure which shows the example which provided the dam in the board | substrate. 表示パネルに樹脂前駆体を設けた例を示す図である。It is a figure which shows the example which provided the resin precursor in the display panel. 基板と表示パネルの間に液状の樹脂前駆体を設ける工程を示す図である。It is a figure which shows the process of providing a liquid resin precursor between a board | substrate and a display panel. 樹脂前駆体の粘性を変化させる工程を示す図である。It is a figure which shows the process of changing the viscosity of a resin precursor. 樹脂前駆体から接着層を形成する工程を示す図である。It is a figure which shows the process of forming an contact bonding layer from a resin precursor.

以下、本発明の実施形態について、図面を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の実施形態に係る方法で製造された表示装置の断面図である。   FIG. 1 is a cross-sectional view of a display device manufactured by a method according to an embodiment of the present invention.

表示装置は、表示パネル１０を有する。図１に示す表示パネル１０は、液晶パネルであり、ガラスなどからなる透明の一対の基板１２，１４を有し、両者間に液晶１５が挟まれてシール１６で封止されている。一方の基板１２はＴＦＴ（Thin Film Transistor）が形成された基板であり、他方の基板１４はカラーフィルタが形成された基板である。一対の基板１２，１４の相互に反対側の面にはそれぞれ偏光板１８が貼り付けられている。基板１２には、集積回路チップ２０が搭載され、フレキシブル配線基板２２が取り付けてある。フレキシブル配線基板２２は図示しない配線パターンを有し、取り付けに異方性導電フィルムを使用することで、表示パネル１０との電気的な接続も図ることができる。フレキシブル配線基板２２は、外部との電気的接続用のインターフェース端子としてのコネクタ２４を備えている。   The display device has a display panel 10. A display panel 10 shown in FIG. 1 is a liquid crystal panel, and includes a pair of transparent substrates 12 and 14 made of glass or the like, and a liquid crystal 15 is sandwiched between them and sealed with a seal 16. One substrate 12 is a substrate on which a TFT (Thin Film Transistor) is formed, and the other substrate 14 is a substrate on which a color filter is formed. Polarizing plates 18 are attached to the surfaces of the pair of substrates 12 and 14 opposite to each other. An integrated circuit chip 20 is mounted on the substrate 12 and a flexible wiring substrate 22 is attached thereto. The flexible wiring board 22 has a wiring pattern (not shown), and can be electrically connected to the display panel 10 by using an anisotropic conductive film for attachment. The flexible wiring board 22 includes a connector 24 as an interface terminal for electrical connection with the outside.

フレキシブル配線基板２２には、発光ダイオードなどの発光部品２６が搭載されている。発光部品２６はバックライト２８の光源となる。バックライト２８は、さらに、導光板３０、光学フィルム３２及び反射フィルム３４を含み、これらの詳細は周知であるため説明を省略する。表示パネル１０及びバックライト２８は、樹脂のモールド成形で形成されたフレーム３６に支持されている。   A light emitting component 26 such as a light emitting diode is mounted on the flexible wiring board 22. The light emitting component 26 serves as a light source for the backlight 28. The backlight 28 further includes a light guide plate 30, an optical film 32, and a reflective film 34, and the details thereof are well known, and thus description thereof is omitted. The display panel 10 and the backlight 28 are supported by a frame 36 formed by resin molding.

液晶パネルは、ＴＮ（Twisted Nematic）型、ＳＴＮ（Super Twisted Nematic）型、ＶＡ（Vertical Alignment）方式、ＩＰＳ（In-Plane Switching）方式など、構造や方式に限定されない。また、表示パネル１０は、液晶パネルに限定されるものではなく、有機エレクトロルミネッセンスパネルなどを使用することも可能である。表示パネル１０は、画像が表示されるように駆動される。   The liquid crystal panel is not limited to a structure or method such as a TN (Twisted Nematic) type, an STN (Super Twisted Nematic) type, a VA (Vertical Alignment) method, or an IPS (In-Plane Switching) method. The display panel 10 is not limited to a liquid crystal panel, and an organic electroluminescence panel or the like can be used. The display panel 10 is driven so that an image is displayed.

そして、基板３８が、接着層４０を介して表示パネル１０に接着されている。基板３８は、透明のガラス基板であってもよいし、タッチパネルであってもよい。接着層４０は、光透過性であって好ましくは透明の樹脂からなる。表示パネル１０の表示面側の偏光板１８の上に接着層４０が設けられている。接着層４０は、基板３８に密着するとともに、表示パネル１０（偏光板１８）に密着している。接着層４０はダム４２に囲まれている。ダム４２は、偏光板１８の上、すなわち、偏光板１８の面の領域内に配置されている。   The substrate 38 is bonded to the display panel 10 via the adhesive layer 40. The substrate 38 may be a transparent glass substrate or a touch panel. The adhesive layer 40 is light transmissive and preferably made of a transparent resin. An adhesive layer 40 is provided on the polarizing plate 18 on the display surface side of the display panel 10. The adhesive layer 40 is in close contact with the substrate 38 and in close contact with the display panel 10 (polarizing plate 18). The adhesive layer 40 is surrounded by a dam 42. The dam 42 is disposed on the polarizing plate 18, that is, in the region of the surface of the polarizing plate 18.

次に、本発明の実施形態に係る表示装置の製造方法を説明する。本実施形態では、上述した表示パネル１０と基板３８を用意する。基板３８及び表示パネル１０の少なくとも一方にはダム４２が設けられている。図２は、基板３８にダム４２を設けた例を示す図である。ダム４２は、基板３８の中央を囲む領域に沿って配置されている。ダム４２の材料に樹脂を使用する場合、その樹脂は半硬化状態であってもよいが、硬化していた方が好ましく、弾性変形することが好ましい。ダム４２は切れ目４４を有する。図２の例では、矩形の角部に切れ目４４が位置するようにダム４２を形成してあるが、矩形の辺に切れ目４４を配置してもよい。   Next, a method for manufacturing a display device according to an embodiment of the present invention will be described. In the present embodiment, the display panel 10 and the substrate 38 described above are prepared. A dam 42 is provided on at least one of the substrate 38 and the display panel 10. FIG. 2 is a diagram illustrating an example in which the dam 42 is provided on the substrate 38. The dam 42 is disposed along a region surrounding the center of the substrate 38. When a resin is used as the material of the dam 42, the resin may be in a semi-cured state, but is preferably cured and is preferably elastically deformed. The dam 42 has a cut 44. In the example of FIG. 2, the dam 42 is formed so that the cuts 44 are positioned at the corners of the rectangle, but the cuts 44 may be arranged on the sides of the rectangle.

そして、基板３８及び表示パネル１０の少なくとも一方に、接着層４０を形成するための樹脂前駆体４６を設ける。基板３８及び表示パネル１０の一方のみにダム４２を設けた場合、ダム４２を設けない方に樹脂前駆体４６を設ける。図３は、表示パネル１０に樹脂前駆体４６を設けた例を示す図である。本実施形態では、樹脂前駆体４６は、紫外線硬化樹脂前駆体である。ダム４２を、接着層４０を形成するための樹脂前駆体４６と同じ材料から形成してもよい。   Then, a resin precursor 46 for forming the adhesive layer 40 is provided on at least one of the substrate 38 and the display panel 10. When the dam 42 is provided only on one of the substrate 38 and the display panel 10, the resin precursor 46 is provided on the side where the dam 42 is not provided. FIG. 3 is a diagram illustrating an example in which the resin precursor 46 is provided on the display panel 10. In the present embodiment, the resin precursor 46 is an ultraviolet curable resin precursor. The dam 42 may be formed from the same material as the resin precursor 46 for forming the adhesive layer 40.

続いて、基板３８と表示パネル１０の間に液状の樹脂前駆体４６を配置する。例えば、図４に示すように、樹脂前駆体４６を下に向けた表示パネル１０を、ダム４２が設けられた基板３８の上方に配置する。ここで、樹脂前駆体４６はダム４２に囲まれるように配置する。   Subsequently, a liquid resin precursor 46 is disposed between the substrate 38 and the display panel 10. For example, as shown in FIG. 4, the display panel 10 with the resin precursor 46 facing downward is disposed above the substrate 38 provided with the dam 42. Here, the resin precursor 46 is disposed so as to be surrounded by the dam 42.

そして、基板３８と表示パネル１０の間隔を狭くして樹脂前駆体４６を拡げる。詳しくは、ダム４２を基板３８と表示パネル１０の間で圧縮して、樹脂前駆体４６をダム４２でせき止めながら切れ目４４の方向に流動させる。なお、ダム４２を、樹脂前駆体４６と同じ材料から形成した場合、このダム４２は、流動する先頭部分の樹脂前駆体４６（紫外線照射前の状態）よりも粘性を高くしておくか、硬化させておく。   And the space | interval of the board | substrate 38 and the display panel 10 is narrowed, and the resin precursor 46 is expanded. Specifically, the dam 42 is compressed between the substrate 38 and the display panel 10, and the resin precursor 46 is caused to flow in the direction of the break 44 while being dammed by the dam 42. In addition, when the dam 42 is formed from the same material as the resin precursor 46, the dam 42 has a higher viscosity than the resin precursor 46 (the state before the ultraviolet irradiation) of the flowing front portion or is cured. Let me.

樹脂前駆体４６を拡げる工程の期間中に樹脂前駆体４６の粘性を変化させる。詳しくは、切れ目４４に向かって流動する先頭部分の樹脂前駆体４６の粘性を、他の部分の樹脂前駆体４６の粘性よりも高くする。例えば、図５に示すように、ダム４２に囲まれて切れ目４４に隣接する位置Ｐ（点線で囲んだ領域）で、紫外線の光エネルギーを樹脂前駆体４６に照射する。樹脂前駆体４６はダム４２の切れ目４４に近傍で粘度が高いため、樹脂前駆体４６がダム４２の内側全体を充填し且つ基板３８からはみ出す迄の期間に、十分に樹脂前駆体４６を硬化させることができる。その結果、樹脂前駆体４６が硬化した接着層４０は、ダム４２で囲まれた領域に充填され且つ基板３８からこぼれることなく配置される。樹脂前駆体４６が基板３８からはみ出さないので、溢れた樹脂前駆体４６を拭き取る作業が不要となる。   During the step of expanding the resin precursor 46, the viscosity of the resin precursor 46 is changed. Specifically, the viscosity of the resin precursor 46 at the leading portion that flows toward the cut 44 is made higher than the viscosity of the resin precursor 46 at other portions. For example, as shown in FIG. 5, the resin precursor 46 is irradiated with ultraviolet light energy at a position P (region surrounded by a dotted line) surrounded by the dam 42 and adjacent to the cut 44. Since the resin precursor 46 has a high viscosity in the vicinity of the cut 44 of the dam 42, the resin precursor 46 is sufficiently cured during the period until the resin precursor 46 fills the entire inside of the dam 42 and protrudes from the substrate 38. be able to. As a result, the adhesive layer 40 in which the resin precursor 46 is cured fills the region surrounded by the dam 42 and is disposed without spilling from the substrate 38. Since the resin precursor 46 does not protrude from the substrate 38, the work of wiping off the overflowing resin precursor 46 is not necessary.

本実施形態によれば、切れ目４４に向かって流動する先頭部分の樹脂前駆体４６の粘性を高くすることで、ダム４２の切れ目４４から樹脂前駆体４６をはみ出すことを抑えることができる。こうして、図６に示すように、樹脂前駆体４６から、基板３８と表示パネル１０を接着する接着層４０を形成する。   According to the present embodiment, it is possible to prevent the resin precursor 46 from protruding from the cut 44 of the dam 42 by increasing the viscosity of the resin precursor 46 at the leading portion that flows toward the cut 44. Thus, as shown in FIG. 6, an adhesive layer 40 for bonding the substrate 38 and the display panel 10 is formed from the resin precursor 46.

上述した例では、紫外線の光エネルギーを樹脂前駆体４６に照射したが、変形例として、ダム４２に囲まれて切れ目４４に隣接する位置Ｐで樹脂前駆体４６を冷却してもよい。その場合、樹脂前駆体４６は紫外線硬化型でなくてもよい。樹脂前駆体４６の冷却は、図示しないペルチエ素子を使用して行う。   In the above-described example, the resin precursor 46 is irradiated with ultraviolet light energy. However, as a modification, the resin precursor 46 may be cooled at a position P surrounded by the dam 42 and adjacent to the cut 44. In that case, the resin precursor 46 may not be an ultraviolet curable type. The resin precursor 46 is cooled using a Peltier element (not shown).

あるいは、樹脂前駆体４６の粘性を変化させる工程で、ダム４２に囲まれて切れ目４４に隣接する位置で樹脂前駆体４６の温度が相対的に低くなるように、ダム４２に囲まれる領域の中央で樹脂前駆体４６を加熱してもよい。   Alternatively, in the step of changing the viscosity of the resin precursor 46, the center of the region surrounded by the dam 42 so that the temperature of the resin precursor 46 is relatively low at a position surrounded by the dam 42 and adjacent to the cut 44. The resin precursor 46 may be heated.

本発明は、上述した実施形態に限定されるものではなく種々の変形が可能である。例えば、実施形態で説明した構成は、実質的に同一の構成、同一の作用効果を奏する構成又は同一の目的を達成することができる構成で置き換えることができる。   The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the configuration described in the embodiment can be replaced with substantially the same configuration, a configuration that exhibits the same operational effects, or a configuration that can achieve the same purpose.

１０ 表示パネル、１２ 基板、１４ 基板、１５ 液晶、１６ シール、１８ 偏光板、１８ 偏光板、２０ 集積回路チップ、２２ フレキシブル配線基板、２４ コネクタ、２６ 発光部品、２８ バックライト、３０ 導光板、３２ 光学フィルム、３４ 反射フィルム、３６ フレーム、３８ 基板、４０ 接着層、４２ ダム、４４ 切れ目、４６ 樹脂前駆体。   DESCRIPTION OF SYMBOLS 10 Display panel, 12 board | substrate, 14 board | substrate, 15 liquid crystal, 16 seal | sticker, 18 polarizing plate, 18 polarizing plate, 20 integrated circuit chip, 22 flexible wiring board, 24 connector, 26 light emitting component, 28 backlight, 30 light guide plate, 32 Optical film, 34 reflective film, 36 frame, 38 substrate, 40 adhesive layer, 42 dam, 44 cut line, 46 resin precursor.

Claims (8)

基板と表示パネルの間に液状の樹脂前駆体を設ける工程と、
前記基板と前記表示パネルの間隔を狭くして前記樹脂前駆体を拡げる工程と、
前記樹脂前駆体から、前記基板と前記表示パネルを接着する接着層を形成する工程と、
を含み、
前記基板及び前記表示パネルの少なくとも一方は、中央を囲む領域に沿って配置されたダムを有し、前記ダムは切れ目を有し、
前記樹脂前駆体を設ける工程で、前記樹脂前駆体を前記ダムに囲まれるように配置し、
前記樹脂前駆体を拡げる工程で、前記ダムを前記基板と前記表示パネルの間で圧縮して、前記樹脂前駆体を前記ダムでせき止めながら前記切れ目の方向に流動させ、
前記切れ目に向かって流動する先頭部分の前記樹脂前駆体の粘性を、他の部分の前記樹脂前駆体の粘性よりも高くすることを特徴とする表示装置の製造方法。 Providing a liquid resin precursor between the substrate and the display panel;
Expanding the resin precursor by narrowing the distance between the substrate and the display panel;
Forming an adhesive layer for bonding the substrate and the display panel from the resin precursor;
Including
At least one of the substrate and the display panel has a dam arranged along a region surrounding a center, the dam has a cut,
In the step of providing the resin precursor, the resin precursor is disposed so as to be surrounded by the dam,
In the step of expanding the resin precursor, the dam is compressed between the substrate and the display panel, and the resin precursor is caused to flow in the direction of the cut while being dammed by the dam.
A method for manufacturing a display device, characterized in that the viscosity of the resin precursor in the leading portion that flows toward the cut is made higher than the viscosity of the resin precursor in other portions. 請求項１に記載された表示装置の製造方法において、
前記樹脂前駆体は、紫外線硬化樹脂前駆体であり、
前記樹脂前駆体を拡げる工程で、前記ダムに囲まれて前記切れ目に隣接する位置で、紫外線の光エネルギーを前記樹脂前駆体に照射することを特徴とする表示装置の製造方法。 In the manufacturing method of the display device according to claim 1,
The resin precursor is an ultraviolet curable resin precursor,
A method of manufacturing a display device, wherein, in the step of expanding the resin precursor, the resin precursor is irradiated with ultraviolet light energy at a position surrounded by the dam and adjacent to the cut. 請求項１に記載された表示装置の製造方法において、
前記樹脂前駆体を拡げる工程で、前記ダムに囲まれて前記切れ目に隣接する位置で前記樹脂前駆体を冷却することを特徴とする表示装置の製造方法。 In the manufacturing method of the display device according to claim 1,
A method of manufacturing a display device, wherein, in the step of expanding the resin precursor, the resin precursor is cooled at a position surrounded by the dam and adjacent to the cut. 請求項３に記載された表示装置の製造方法において、
前記樹脂前駆体の冷却を、ペルチエ素子を使用して行うことを特徴とする表示装置の製造方法。 In the manufacturing method of the display device according to claim 3,
A method of manufacturing a display device, wherein the resin precursor is cooled using a Peltier element. 請求項１に記載された表示装置の製造方法において、
前記樹脂前駆体を拡げる工程で、前記ダムに囲まれて前記切れ目に隣接する位置で前記樹脂前駆体の温度が相対的に低くなるように、前記ダムに囲まれる前記領域の中央で前記樹脂前駆体を加熱することを特徴とする表示装置の製造方法。 In the manufacturing method of the display device according to claim 1,
In the step of expanding the resin precursor, the resin precursor at the center of the region surrounded by the dam so that the temperature of the resin precursor is relatively low at a position adjacent to the cut surrounded by the dam. A method for manufacturing a display device, characterized by heating a body. 請求項１から５のいずれか１項に記載された表示装置の製造方法において、
前記ダムは、前記樹脂前駆体と同じ材料からなり、前記流動する先頭部分の前記樹脂前駆体よりも粘性が高いことを特徴とする表示装置の製造方法。 In the manufacturing method of the display device according to any one of claims 1 to 5,
The method for manufacturing a display device, wherein the dam is made of the same material as the resin precursor, and has a higher viscosity than the resin precursor at the leading portion of the fluid. 請求項１から６のいずれか１項に記載された表示装置の製造方法において、
前記基板は、透明のガラス基板であることを特徴とする表示装置の製造方法。 In the manufacturing method of the display device according to any one of claims 1 to 6,
The method for manufacturing a display device, wherein the substrate is a transparent glass substrate. 請求項１から６のいずれか１項に記載された表示装置の製造方法において、
前記基板は、タッチパネルであることを特徴とする表示装置の製造方法。 In the manufacturing method of the display device according to any one of claims 1 to 6,
The method for manufacturing a display device, wherein the substrate is a touch panel.
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