JP2012212826A - Wiring device and manufacturing method of multiwire wiring board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring device realizing high density and high yield by suppressing wire cut when a thinned wire is wired at high speed and to provide a manufacturing method of a multiwire wiring board.SOLUTION: The wiring device includes: a stylus wiring the wire on a substrate with an adhesive; a feeder supplying the wire to the stylus; a wire guide which is arranged between the feeder and the stylus and guides the wire from the feeder to a tip of the stylus. The wire guide has a wire passage allowing passage of the wire from the feeder, and the wire passage has a tolerance portion which can store the wire in a slackened state. The manufacturing method of the multiwire wiring board using the wiring device is provided.

Description

  The present invention relates to a wiring device used for manufacturing a multi-wire wiring board and a method for manufacturing a multi-wire wiring board using the same.

  Usually, a multi-wire wiring board has a conductive wire having an insulation coating around a core wire (hereinafter referred to as “wire”, and the conductive wire in the insulation coating is referred to as “core wire”) on a base material with an adhesive. At the same time, they are bonded together to form a wiring (hereinafter referred to as “wiring”. Also, a conductive wire formed by arranging the wires is referred to as “wiring”). Since the wiring is covered with insulation, it is possible to wire a plurality of wirings crossing each other. Compared to a general wiring board that forms wiring by etching copper foil or the like, the wiring per layer can be collected. It has the feature of high density.

  In multi-wire wiring boards, as the density increases, the number of wires that cross each other at a location where a plurality of wires intersect (hereinafter referred to as “multi-wiring locations”) tends to increase. It is necessary to form such multiple wiring. In such multiple wiring locations, existing wirings are stacked in multiple to form a convex portion, and a newly wired wiring is formed over the convex portion formed by the existing wiring. That is, in the multiple wiring location, the actual wiring length is required to be longer than the wiring length in plan view, as long as it exceeds the convex portion. On the other hand, the feeding speed of the stylus (hereinafter referred to as “wiring speed”) is constant, and the feeding speed of the feeder that supplies the wire to the stylus that performs wiring is also constant. The supply speed of the wire cannot catch up, and the length of the supplied wire becomes insufficient with respect to the required length of the wire. In an extreme case, the wire may be cut.

  As a method for suppressing such wire breakage, as shown in FIG. 3, a feeder 6 for supplying the wire 3 to the stylus 5 and a stylus for arranging the supplied wire 3 on the base material 13 with adhesive. 5 is provided with a dancer roller 12 for providing a slackness, an encoder 9 for detecting the slackness of the wire 3, and a controller for controlling the number of rotations of the feeder 6, and maintaining the slackness of the wire 3. It is considered (Patent Document 1).

  Further, a method of increasing the wire feed amount at the multiple wiring location by detecting the displacement of the stylus height at the convex portion due to the multiple wiring location is considered (Patent Document 2).

JP 2001-352149 A JP 2002-344112 A

  However, in recent years, for higher density, the core of the wire is required to be thinned from the conventional diameter of 0.08 mm to 0.065 mm, and the wiring speed is 21. There is a demand for double speed from 2 cm / s to 42.4 cm / s.

  When the core of the wire is thinned in this way, the strength of the core is reduced as compared with a conventional wire. In addition, as the wiring speed is increased, the tensile force applied to the wire during wiring is increased. For this reason, in the method of maintaining the slack with the dancer roller as in the cited document 1 or increasing the wire supply layer speed with the feeder as in the cited document 2, particularly in the multiple wiring place where the wires intersect triple or quadruple, Since the required wire length increases momentarily, there are cases where it cannot be adequately accommodated. In other words, the pulling force applied to the wire suddenly increases, and in an extreme case, there is a possibility that the risk of disconnection in the wiring increases.

  The present invention has been made in view of the above problems, and by enabling the wire breakage when a thinned wire is wired at a high speed to be suppressed, a fabric capable of achieving high density and high yield. An object of the present invention is to provide a wire device and a method of manufacturing a multi-wire wiring board using the same.

The present invention relates to the following.
1. A stylus for arranging a wire on a substrate with an adhesive, a feeder for supplying the wire to the stylus, and a wire guide disposed between the feeder and the stylus and guiding the wire from the feeder to the tip of the stylus In the wiring apparatus, the wire guide has a wire passage that allows the wire from the feeder to pass therethrough, and has a tolerance portion that can be accommodated in a state where the wire is loosened in the cord wire passage. apparatus.
2. Item 2. The wiring device according to Item 1, wherein the wire passage in the wire guide swells in the slack direction of the wire at the margin.
3. Item 3. The wiring device according to item 1 or 2, wherein the wire passage in the wire guide has no corners.
4). Any one of Items 1 to 3, wherein the wire passage in the wire guide includes: an introduction portion that introduces a wire from the feeder; an accommodation portion that accommodates the introduced wire; and a delivery portion that is an outlet of the accommodated wire. A wiring device that is formed in a cylindrical shape having an inner diameter of at least a part of the housing portion larger than an inner diameter of the delivery portion.
5. Item 5. A method for manufacturing a multi-wire wiring board using the wiring device according to any one of items 1 to 4.

  ADVANTAGE OF THE INVENTION According to this invention, the wiring apparatus which can implement | achieve high density and high yield by enabling the wire breakage at the time of wiring a thin wire at high speed, and multi-wire wiring using the same A method for manufacturing a plate can be provided.

The outline of the wiring apparatus of this invention is represented. The wire guide used for the wiring apparatus of this invention is represented. The outline of the conventional wiring apparatus is represented.

  As an embodiment of the wiring device of the present invention, as shown in FIG. 1, a stylus 5 for wiring the wire 3 on a base material 13 with an adhesive, a feeder 6 for supplying the wire 3 to the stylus 5, In the wiring apparatus 1 that is disposed between the feeder 6 and the stylus 6 and has a wire guide 7 that guides the wire 3 from the feeder 6 to the tip of the stylus 5, the wire guide 7 passes the wire 3 from the feeder 6. Examples include a wire passage 14 to be passed and a tolerance portion 15 that can be accommodated in a state in which the wire 3 is loosened in the wire passage 14. The wire 3 supplied from the feeder 6 to the stylus 5 is always supplied with a slight margin. Thus, by providing the margin portion 15 in the wire passage 14 of the wire guide 7, this margin portion is provided. 15 can accommodate the wire 3 in a relaxed state. For this reason, the diameter of the core wire is 0.065 mm, which is thinner than the conventional wire (0.080 mm diameter), and the wiring speed is 42.4 cm / s, which is twice that of the conventional wire (21.2 cm / s). Even if it does, it can suppress that the wire 3 disconnects in the convex part in multiple wiring locations, such as a triple wiring and a quadruple wiring. In other words, when the convex portions at the multiple wiring portions such as the triple wiring and the quadruple wiring are wired, the supply speed of the wire 3 necessary for overcoming the convex portion is instantaneously increased. At this supply speed, the supply of the wire 3 tends not to catch up. However, since the wire 3 accommodated in the marginal portion 15 has a slack state, even if the supply speed of the wire 3 is instantaneously increased and the wire 3 is rapidly pulled, the length of the slack is increased. Since the wire 3 is pulled out quickly, it is possible to prevent the tensile force applied to the wire 3 from increasing momentarily. Therefore, even when the supply speed of the wire 3 suddenly increases, the load on the wire 3 can be buffered, so that the occurrence of wire breakage can be suppressed.

  The wire of the present invention refers to a core wire and a conductive wire having an insulating coating around it, and the core wire refers to a conductive wire in the insulating coating of the wire. Wiring refers to the formation of wiring by simultaneously bonding wires on an insulating substrate with an adhesive material, and wiring is a conductor formed by wiring wires. Say. A multiple wiring location refers to a location where a plurality of wirings intersect.

  The stylus used in the present invention refers to a member that applies ultrasonic vibration while applying a load to a wire and adheres the wire onto a substrate with an adhesive. The feeder is a member that supplies the wire to the stylus. Depending on the wiring speed of the stylus, the feeder is always slightly smaller than the length of the wire that is actually wired. It has a function to send out the wire with a margin. Also, when the wire cannot be sent any more (ie, when the wiring is stopped, the sent wire is clogged with a stylus or wire guide), the sending is stopped and the wire is fixed. It has a function to do. The wiring speed is the stylus feed speed.

  The wire guide used in the present invention refers to a member that guides a wire from a feeder to the tip of a stylus where wiring is performed. As shown in FIG. 2, the wire guide 7 has a wire passage 14 that allows the wire 3 from the feeder 6 to pass inside, and the wire passage 14 can accommodate the wire 3 in a relaxed state. A portion 15 is provided. By accommodating the wire 3 in a slack state in the margin portion 15, the wire 3 is accommodated in the margin portion 15 without being subjected to a tensile load. For this reason, even if the required supply speed of the wire 3 is instantaneously increased at the convex portion at the multiple wiring location 2 such as a triple wiring or a quadruple wiring, even if the supply speed of the wire 3 by the feeder 6 cannot catch up By extending the wire 3 accommodated in the portion 15 in a relaxed state, the wire 3 having a required length is immediately supplied. Therefore, since it can suppress that the pulling force concerning the wire 3 becomes large instantaneously, generation | occurrence | production of a wire break can be suppressed. Note that the wire guide 7 is preferably manufactured by processing a material that does not easily wear, such as super steel alloy or ceramics.

  It is desirable that the wire passage in the wire guide has a shape swelled in the slack direction of the wire at the margin. The slack direction of the wire refers to a direction in which slack is generated when an excessive length of wire is supplied from the feeder to the stylus. For example, when the delivery direction of the wire 3 is diagonally downward as shown in FIG. In this way, by making the shape of the wire passage 14 swelled in the slack direction of the wire 3 at the margin 15, the wire 3 can be stored in a free state where no load is applied to the wire 3. Even when the necessary increase in supply speed occurs instantaneously when wiring to the multiple wiring location 2, the wire 3 can be easily pulled out quickly.

  The wire passage in the wire guide preferably has no corners. Here, having no corners means that the entire wire passage 14 in the wire guide 7 is formed of a smooth curve as shown in FIG. As a result, even when the wire 3 is pulled out, it is possible to prevent the wire 3 from being caught by the wire passage 14. It becomes easy to pull out the wire 3 quickly. Furthermore, it is possible to suppress damage to the wire 3 and generation of foreign matter due to the wire passage 14 cutting off the insulating coating that covers the wire 3.

  As shown in FIG. 2, the wire passage 14 in the wire guide 7 includes an introduction portion 16 that introduces the wire 3 from the feeder 6, an accommodation portion 17 that accommodates the introduced wire 3, and an outlet of the accommodated wire 3. It is desirable that the inner diameter of at least a part of the accommodating portion 17 is larger than the inner diameter of the feeding portion 18. Thereby, since the volume of the accommodating part 17 can be ensured and the wire 3 having a length with a certain margin can be accommodated, it is possible to cope with an instantaneous increase in supply speed. Further, since the delivery section 18 has a narrowed inner diameter, the supply position of the wire 3 to the stylus 5 can be stabilized, so that the wiring accuracy can be ensured.

  EXAMPLES Hereinafter, although the suitable Example of this invention is described, this invention is not limited to a following example.

  FIG. 1 shows how a multi-wire wiring board is manufactured using the wiring device of the present invention. A wire having a core wire diameter of 0.065 mm was used. As shown in FIG. 2, the wire guide has a wire passage 14 through which the wire 3 from the feeder 6 passes, and has a tolerance portion 15 that can be accommodated in a state in which the wire 3 is loosened in the wire passage 14. is there. The wire passage 14 in the wire guide does not have a corner, and the wire passage 14 in the wire guide 7 accommodates the introduction portion 16 for introducing the wire 3 from the feeder 6 and the introduced wire 3. The container 17 is formed in a cylindrical shape having an accommodating part 17 and a delivery part 18 serving as an outlet of the accommodated wire 3, and at least a part of the inner diameter of the accommodation part 17 is formed larger than the inner diameter of the delivery part 18. .

  As shown in FIG. 1, the wire 3 was laid out over the wire 3 already crossed and bonded in triplicate. The wiring was performed at a wiring speed of 42.4 cm / s. The wire 3 is guided by the wire guide 7 from the feeder 6, and the wiring direction is controlled by the stylus 5. Specifically, an X-axis movement table (not shown) and a Y-axis movement mechanism (not shown) are controlled based on position data on the XY coordinates that specify the position on the base material 13 with adhesive. The position of the stylus 5 of the wiring apparatus 1 is aligned with the starting point 10 for wiring new wiring. The direction in which wiring is laid out from that position is determined from, for example, wiring layout data, and the direction of the stylus 5 is set. Thereafter, the wire 3 is pressed with the stylus 5 to fix the surface of the insulating coating of the wire 3 on the side in contact with the base material with adhesive 13. At this time, when ultrasonic vibration is applied to the stylus 5, an adhesive (not shown) on the base material 13 with adhesive is heated by vibration and activated to increase the adhesive force. While the wire 3 having a required length is supplied by the feeder 6, the wire 3 is pressed and adhered onto the base material 13 with the adhesive material with the stylus 5 in a predetermined direction. When the end point 11 is reached, the wire 3 is cut by the cutter 8.

  As described above, a wire having a core wire diameter of 0.065 mm is used, and the wire is moved over the wire 3 already crossed and bonded in triple at a wire speed of 42.4 cm / s. Then, although the wire 3 was wired, no wire breakage occurred.

(Comparative example)
The wire guide has a wire passage 14 through which the wire 3 from the feeder 6 passes, but the margin portion 15 is not provided in the wire passage 14. That is, the wire guide 7 having a linear wire passage 14 as used in the wiring device 1 of FIG. 3 was used. Other than this, in the same manner as in the example, as a result of overcoming the wire 3 that had already been crossed and bonded in triplicate and arranging the wire 3, the occurrence of wire breakage was observed.

DESCRIPTION OF SYMBOLS 1 ... Wiring apparatus 2 ... Multiple wiring location 3 ... Wire 4 ... Head 5 ... Stylus 6 ... Feeder 7 ... Wire guide 8 ... Cutter 9 ... Encoder 10 ... Start point 11 ... End point 12 ... Dancer roller 13 ... Base material 14 with adhesive material ... Wire passage 15 ... tolerance part 16 ... introduction part 17 ... accommodating part 18 ... sending part

Claims (5)

A stylus for arranging a wire on a substrate with an adhesive, a feeder for supplying the wire to the stylus, and a wire guide disposed between the feeder and the stylus and guiding the wire from the feeder to the tip of the stylus In the wiring apparatus having
The wiring apparatus, wherein the wire guide has a wire passage that allows a wire from the feeder to pass therethrough, and has a tolerance portion that can be accommodated in the wire passage while the wire is loosened.   2. The wiring device according to claim 1, wherein the wire passage in the wire guide swells in the slack direction of the wire at a marginal portion.   The wiring device according to claim 1 or 2, wherein the wire passage in the wire guide does not have a corner portion.   The wire passage in the wire guide according to any one of claims 1 to 3, wherein an introduction part that introduces a wire from a feeder, an accommodation part that accommodates the introduced wire, and a delivery part that serves as an outlet of the accommodated wire; A wiring device in which the inner diameter of at least a part of the accommodating portion is formed larger than the inner diameter of the delivery portion.   The manufacturing method of the multi-wire wiring board using the wiring apparatus in any one of Claim 1 to 4.

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