JP2012187706A - Entry sheet for boring with drill - Google Patents
Entry sheet for boring with drill Download PDFInfo
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- JP2012187706A JP2012187706A JP2012101623A JP2012101623A JP2012187706A JP 2012187706 A JP2012187706 A JP 2012187706A JP 2012101623 A JP2012101623 A JP 2012101623A JP 2012101623 A JP2012101623 A JP 2012101623A JP 2012187706 A JP2012187706 A JP 2012187706A
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- resin
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- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 239000011342 resin composition Substances 0.000 claims abstract description 27
- -1 amino acid derivative alcohols Chemical class 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000000126 substance Substances 0.000 claims abstract description 9
- 150000007524 organic acids Chemical class 0.000 claims abstract description 6
- 150000003839 salts Chemical class 0.000 claims abstract description 6
- 235000005985 organic acids Nutrition 0.000 claims abstract description 5
- 238000005553 drilling Methods 0.000 claims description 44
- 239000011888 foil Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 claims description 18
- 239000002202 Polyethylene glycol Substances 0.000 claims description 15
- 229920001223 polyethylene glycol Polymers 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000314 lubricant Substances 0.000 claims description 10
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 3
- QMXOFBXZEKTJIK-UHFFFAOYSA-N Glycinol Natural products C1=C(O)C=C2OCC3(O)C4=CC=C(O)C=C4OC3C2=C1 QMXOFBXZEKTJIK-UHFFFAOYSA-N 0.000 claims description 3
- SQUHHTBVTRBESD-UHFFFAOYSA-N Hexa-Ac-myo-Inositol Natural products CC(=O)OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC(C)=O SQUHHTBVTRBESD-UHFFFAOYSA-N 0.000 claims description 3
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims description 3
- CDAISMWEOUEBRE-GPIVLXJGSA-N inositol Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@@H]1O CDAISMWEOUEBRE-GPIVLXJGSA-N 0.000 claims description 3
- 229960000367 inositol Drugs 0.000 claims description 3
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- CDAISMWEOUEBRE-UHFFFAOYSA-N scyllo-inosotol Natural products OC1C(O)C(O)C(O)C(O)C1O CDAISMWEOUEBRE-UHFFFAOYSA-N 0.000 claims description 3
- 239000000811 xylitol Substances 0.000 claims description 3
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 3
- 229960002675 xylitol Drugs 0.000 claims description 3
- 235000010447 xylitol Nutrition 0.000 claims description 3
- 229940059574 pentaerithrityl Drugs 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 150000005846 sugar alcohols Polymers 0.000 abstract description 4
- 238000004804 winding Methods 0.000 abstract description 3
- 238000005461 lubrication Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 20
- 239000010410 layer Substances 0.000 description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 241000047703 Nonion Species 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920002538 Polyethylene Glycol 20000 Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- STVVMTBJNDTZBF-VIFPVBQESA-N L-phenylalaninol Chemical compound OC[C@@H](N)CC1=CC=CC=C1 STVVMTBJNDTZBF-VIFPVBQESA-N 0.000 description 1
- MMQZBEXYFLXHEN-UHFFFAOYSA-N OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O Chemical compound OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O MMQZBEXYFLXHEN-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000004280 Sodium formate Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 150000003862 amino acid derivatives Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 1
- 235000019254 sodium formate Nutrition 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 229960002920 sorbitol Drugs 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229940113165 trimethylolpropane Drugs 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、プリント配線板材料分野で使用されるドリル穴明け用エントリーシートに関するものである。 The present invention relates to an entry sheet for drilling used in the field of printed wiring board materials.
プリント配線板材料に使用される銅張積層板のドリル穴明け加工方法としては、銅張積層板を重ね、その最上部にアルミニウム箔等を配置し、ドリル穴明け加工を行う方法が一般的に採用されている。近年、プリント配線板材料に対する信頼性向上の要求や高密度化の進展に伴い、穴位置精度の向上や穴壁粗さの低減など高品質の穴明け加工が求められており、これに対応するために、ポリエチレングリコールのシートを使用した穴明け加工法(例えば特許文献1参照)、金属箔に水溶性樹脂層を形成した穴明け用滑剤シート(例えば特許文献2参照)、熱硬化性樹脂薄膜を形成したアルミニウム箔に水溶性樹脂層を形成した穴明け用エントリーシート(例えば特許文献3参照)などが提案・実用化されている。近年、プリント配線板の小型化および軽量化のために配線パターンの微細化とスルーホールの小径化の伸展に伴って、各シートに使用している樹脂成分が、ドリルビットに巻き付く現象が増加する傾向があり、特に0.1mmφ以下の小径加工時には、ドリルビットの折損が認められる場合もあり、更なる改善が必要であった。 As a drilling method for copper-clad laminates used for printed wiring board materials, a method is generally used in which drilling is performed by stacking copper-clad laminates and placing aluminum foil or the like on top of them. It has been adopted. In recent years, with the demand for improved reliability and increased density of printed wiring board materials, high-quality drilling has been required, such as improved hole location accuracy and reduced hole wall roughness. Therefore, a drilling method using a polyethylene glycol sheet (see, for example, Patent Document 1), a lubricant sheet for drilling in which a water-soluble resin layer is formed on a metal foil (see, for example, Patent Document 2), a thermosetting resin thin film An entry sheet for drilling (see, for example, Patent Document 3) in which a water-soluble resin layer is formed on an aluminum foil formed with a metal foil has been proposed and put to practical use. In recent years, the phenomenon that the resin component used in each sheet wraps around the drill bit has increased with the miniaturization of the wiring pattern and the reduction of the through-hole diameter to reduce the size and weight of the printed wiring board. In particular, when drilling a small diameter of 0.1 mmφ or less, breakage of the drill bit may be observed, and further improvement is necessary.
本発明は、ドリルビットへの樹脂の巻き付きを抑制することにより、ドリルビットの折損が少なく、かつ穴位置精度に優れるドリル穴明け用エントリーシートを提供するものである。 The present invention provides an entry sheet for drilling that suppresses wrapping of a resin around a drill bit, thereby reducing breakage of the drill bit and excellent hole position accuracy.
本発明者らは、上記の課題を解決するため種々の検討を行った結果、水溶性樹脂(a)に、特定の水溶性物質(b)と水溶性滑材(c)を添加することにより、ドリルビットへの樹脂成分の巻き付き性が抑えられ、結果としてドリルビットの折損が抑えられることを見出し、本発明を完成するに至った。即ち、本発明は、シート状の基材に、水溶性樹脂(a)と、多価アルコール類、アミノ酸誘導体アルコール類、有機酸類および有機塩類からなる群から選択された1種もしくは2種以上の水溶性物質(b)ならびに水溶性滑材(c)を含有する樹脂組成物層を形成したドリル穴明け用エントリーシートである。 As a result of various studies to solve the above problems, the present inventors have added a specific water-soluble substance (b) and a water-soluble lubricant (c) to the water-soluble resin (a). The inventors have found that the wrapping property of the resin component around the drill bit is suppressed, and as a result, breakage of the drill bit is suppressed, and the present invention has been completed. That is, the present invention provides a sheet-like base material with one or more selected from the group consisting of a water-soluble resin (a), a polyhydric alcohol, an amino acid derivative alcohol, an organic acid and an organic salt. An entry sheet for drilling in which a resin composition layer containing a water-soluble substance (b) and a water-soluble lubricant (c) is formed.
本発明によればドリルビットへの樹脂巻き付きの少ないドリル穴明け用エントリーシートが得られる。樹脂巻き付きが抑えられる事により、同様の条件で穴明け加工を行った場合にはより穴位置精度に優れる。また、樹脂巻き付きが原因で生じるドリルビットの折損を抑える事が出来、穴明け工程の生産効率を著しく改善する事が出来る。 According to the present invention, an entry sheet for drilling with less resin winding around a drill bit can be obtained. By suppressing the resin wrapping, the hole position accuracy is further improved when drilling is performed under the same conditions. Further, breakage of the drill bit caused by the resin winding can be suppressed, and the production efficiency of the drilling process can be remarkably improved.
本発明において使用される水溶性樹脂(a)とは、平均分子量が10000以上であるポリエチレンオキサイド、ポリプロピレンオキサイド、ポリアクリル酸ソーダ、ポリアクリルアミド、ポリビニルピロリドン、カルボキシメチルセルロース、ポリテトラメチレングリコール、ポリエーテルエステル、ポリビニルアルコールが例示され、1種もしくは2種以上を適宜混合して使用することも可能である。 The water-soluble resin (a) used in the present invention is polyethylene oxide, polypropylene oxide, polyacrylic acid soda, polyacrylamide, polyvinyl pyrrolidone, carboxymethyl cellulose, polytetramethylene glycol, polyether ester having an average molecular weight of 10,000 or more. Polyvinyl alcohol is exemplified, and one kind or two or more kinds may be appropriately mixed and used.
本発明において使用される水溶性樹脂(a)の1種であるポリエーテルエステルとは、ポリアルキレンオキシドのエステル化物であれば、特に限定されるものではない。代表的な例としては、ポリエチレングリコール、ポリエチレンオキサイド、ポリプロピレングリコール、ポリテトラメチレングリコール、ポリプロピレンオキサイドやこれらの共重合物で例示されるグリコール類、またはエチレンオキサイド類の重合物と、フタル酸、イソフタル酸、テレフタル酸、セバシン酸等、及びそれらのジメチルエステル、ジエチルエステル等、ピロメリット酸無水物等で例示される多価カルボン酸、その無水物、またはそのエステルとを反応させて得られる樹脂などが挙げられ、1種もしくは2種以上を適宜混合して使用することも可能である。 The polyether ester which is one kind of the water-soluble resin (a) used in the present invention is not particularly limited as long as it is an esterified product of polyalkylene oxide. Typical examples include polyethylene glycol, polyethylene oxide, polypropylene glycol, polytetramethylene glycol, glycols exemplified by polypropylene oxide and copolymers thereof, or polymers of ethylene oxide, and phthalic acid, isophthalic acid. Terephthalic acid, sebacic acid, and the like, and dimethyl esters, diethyl esters and the like, polymellitic carboxylic acids exemplified by pyromellitic acid anhydride, the anhydrides, or resins obtained by reacting the esters, etc. It is also possible to use one kind or a mixture of two or more kinds as appropriate.
本発明において使用される水溶性物質(b)は、多価アルコール類、アミノ酸誘導体アルコール類、有機酸類および有機塩類からなる群から選択された水溶性物質であれば特に限定されるものではなく、1種もしくは2種以上を適宜混合して使用する事も可能である。これらの水溶性物質(b)として好ましいものは、多価アルコール類としては、トリメチロールプロパン、ペンタエリスリトール、ソルビトール、キシリトール、イノシトールが、アミノ酸誘導体アルコール類としてはグリシノール、フェニルアラニノールが、有機酸類としてはリンゴ酸、コハク酸、フマル酸、マレイン酸、蟻酸、酢酸、プロピオン酸、ステアリン酸などが、有機塩類としては、先に挙げた有機酸類の金属塩類が挙げられる。水溶性物質(b)の配合量は、水溶性樹脂(a)と水溶性滑剤(c)を併せたものの0.1〜5重量%、好ましくは0.2〜3重量%である。 The water-soluble substance (b) used in the present invention is not particularly limited as long as it is a water-soluble substance selected from the group consisting of polyhydric alcohols, amino acid derivative alcohols, organic acids and organic salts, It is also possible to use one kind or a mixture of two or more kinds as appropriate. Preferred as these water-soluble substances (b) are trimethylolpropane, pentaerythritol, sorbitol, xylitol, inositol as polyhydric alcohols, glycinol, phenylalaninol as amino acid derivative alcohols, and organic acids. Are malic acid, succinic acid, fumaric acid, maleic acid, formic acid, acetic acid, propionic acid, stearic acid and the like, and examples of organic salts include metal salts of the organic acids mentioned above. The blending amount of the water-soluble substance (b) is 0.1 to 5% by weight, preferably 0.2 to 3% by weight of the total of the water-soluble resin (a) and the water-soluble lubricant (c).
本発明における水溶性滑剤(c)とは平均分子量10000未満のポリエチレングリコール、ポリプロピレングリコール;ポリオキシエチレンオレイルエーテル、ポリオキシエチレンセチルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンノニルフェニルエーテル、ポリオキシエチレンオクチルフェニルエーテルなどで例示されるポリオキシエチレンのモノエーテル類;ポリオキシエチレンモノステアレート、ポリオキシエチレンソルビタンモノステアレート;ヘキサグリセリンモノステアレート、デカヘキサグリセリンモノステアレートなどで例示されるポリグリセリンモノステアレート類;ポリオキシエチレンプロピレン共重合体及び、それらの誘導体が挙げられ、1種もしくは2種以上を適宜混合して使用することも可能である。水溶性滑剤(c)の配合量は、水溶性樹脂(a)と水溶性滑剤(c)の配合量の合計100重量部に対して、10〜90重量部、より好ましくは20〜80重量部である。水溶性滑剤(c)が10重量部未満では粘度が高くなり過ぎることや、ドリル穴明け時の潤滑性に問題が生じ易く、90重量部を超えると樹脂層が脆くなる。 The water-soluble lubricant (c) in the present invention means polyethylene glycol, polypropylene glycol having an average molecular weight of less than 10,000; polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonyl Polyoxyethylene monoethers exemplified by phenyl ether, polyoxyethylene octylphenyl ether, etc .; polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate; hexaglycerin monostearate, decahexaglycerin monostearate, etc. And polyglycerin monostearates, including polyoxyethylene propylene copolymers and derivatives thereof, 1 type or 2 types It is also possible to use a mixture of above as appropriate. The amount of the water-soluble lubricant (c) is 10 to 90 parts by weight, more preferably 20 to 80 parts by weight, based on 100 parts by weight of the total amount of the water-soluble resin (a) and the water-soluble lubricant (c). It is. If the water-soluble lubricant (c) is less than 10 parts by weight, the viscosity tends to be too high, and problems are likely to occur in lubricity when drilling, and if it exceeds 90 parts by weight, the resin layer becomes brittle.
本発明で使用する樹脂組成物は、前記水溶性樹脂(a)、水溶性物質(b)、水溶性滑剤(c)を必須成分としたものであり、その混合方法は、工業的に使用される公知の方法であれば、特に制約はされない。具体的には上記樹脂組成物をロールやニーダー、またはその他の混錬手段を使用し、適宜加温或いは加熱して、均一な混合物とするか、その後、必要に応じて、水を含む溶媒に溶解もしくは分散させ樹脂組成物溶液とする方法などが例示される。 The resin composition used in the present invention comprises the water-soluble resin (a), the water-soluble substance (b), and the water-soluble lubricant (c) as essential components, and the mixing method is used industrially. Any known method may be used without any particular limitation. Specifically, the resin composition is rolled or kneaded, or other kneading means, and is appropriately heated or heated to obtain a uniform mixture, or, if necessary, a solvent containing water. Examples thereof include a method of dissolving or dispersing into a resin composition solution.
本発明において使用されるシート状の基材は、金属箔、有機フィルム・シートなど公知のシート状の基材であれば、特に限定されないが、アルミニウム箔が好ましい。アルミニウム箔の材質としては、純度95%以上のアルミニウムが好ましく、具体的には、JIS-H4160に規定される、5052、3004、3003、1N30、1050、1070、1085などが例示されるが、純度99.3%以上のアルミニウムがより好ましい。基材に高純度のアルミニウム箔を使うことでドリルビットの衝撃の緩和や食いつき性が向上し、樹脂組成物によるドリルビットの摩擦熱による発熱の軽減効果と相俟って、ドリル穴明け時の位置精度と穴品質の大幅向上が可能となる。基材の厚さは、50〜500μmの範囲が好ましい。厚みが50μm未満では穴明け後の積層板にバリが発生し易く、500μmを超えると、発生する切り粉の排出が困難になる。また、これらアルミニウム箔に、予め厚さ0.1〜10μmの接着用皮膜が形成されているアルミニウム箔の使用が樹脂組成物との密着性の点から最も好ましい。接着用皮膜に使用される接着剤としては、ウレタン系、酢酸ビニル系、塩化ビニル系、ポリエステル系及び、それらの共重合体や、エポキシ系、シアネート系などの接着剤が例示される。 The sheet-like substrate used in the present invention is not particularly limited as long as it is a known sheet-like substrate such as a metal foil or an organic film / sheet, but an aluminum foil is preferable. As the material of the aluminum foil, aluminum having a purity of 95% or more is preferable, and specifically, 5052, 3004, 3003, 1N30, 1050, 1070, 1085, etc. defined in JIS-H4160 are exemplified. More than 99.3% aluminum is more preferable. By using high-purity aluminum foil for the base material, the impact and biting of the drill bit are alleviated and combined with the effect of reducing the heat generated by the frictional heat of the drill bit due to the resin composition, Position accuracy and hole quality can be greatly improved. The thickness of the substrate is preferably in the range of 50 to 500 μm. If the thickness is less than 50 μm, burrs are likely to occur in the laminated plate after drilling, and if it exceeds 500 μm, it becomes difficult to discharge the generated chips. In addition, the use of an aluminum foil in which an adhesive film having a thickness of 0.1 to 10 μm is previously formed on these aluminum foils is most preferable from the viewpoint of adhesion to the resin composition. Examples of the adhesive used for the adhesive film include urethane-based, vinyl acetate-based, vinyl chloride-based, polyester-based and copolymers thereof, and epoxy-based and cyanate-based adhesives.
本発明において、シート状基材に樹脂組成物層を形成させる方法としては、例えば、樹脂組成物を、適宜加熱溶融するか、溶媒に溶解もしくは分散させた液状として、シート状基材に塗工して樹脂組成物層を形成させる方法や、予め樹脂組成物層(シート)を形成した後に、シート状基材の少なくとも片面に樹脂組成物層(シート)を重ね、ロール等で加熱するか又は接着剤等により、貼り合わせる方法などがある。樹脂組成物層(シート)の製造方法としては、工業的に使用される公知の方法であれば、特に限定されない。具体的には、樹脂組成物をロールやニーダー、または他の混練手段を使用し、適宜加熱溶融して混合し、ロール法やカーテンコート法などで、離型フィルム上に樹脂組成物層を形成する方法や、樹脂組成物をロールやT−ダイ押出機等を使用し、予め所望の厚さの樹脂組成物シートに成形する方法などが例示される。 In the present invention, as a method for forming the resin composition layer on the sheet-like base material, for example, the resin composition is appropriately heated and melted or applied to the sheet-like base material as a liquid dissolved or dispersed in a solvent. The method of forming a resin composition layer, or after forming a resin composition layer (sheet) in advance, the resin composition layer (sheet) is overlaid on at least one side of the sheet-like substrate and heated with a roll or the like. There is a method of bonding with an adhesive or the like. The method for producing the resin composition layer (sheet) is not particularly limited as long as it is a known method used industrially. Specifically, the resin composition is appropriately heated and melted and mixed using a roll, kneader, or other kneading means, and a resin composition layer is formed on the release film by a roll method or a curtain coat method. And a method of forming a resin composition into a resin composition sheet having a desired thickness in advance using a roll, a T-die extruder, or the like.
また、樹脂組成物を、水を含む溶媒に溶解もしくは分散させた樹脂組成物溶液をシート状の基材に形成する方法については、工業的に使用される公知の方法であれば特に限定されない。具体的には、ナイフコーターやダイコーターなどを用いて、基材上に樹脂組成物溶液の塗工層を形成し、乾燥炉で熱風乾燥により溶媒を蒸発させる方法などが例示される。塗工層を形成したシート状の基材を乾燥し、基材に樹脂組成物層を形成する方法は、工業的に用いられる公知の方法であれば特に制約はない。具体的には、熱風乾燥を用いる場合が多いが、必要に応じて赤外線やマイクロ波、高周波加熱を併用する方法などが例示される。乾燥条件としては、乾燥機の大きさ・能力や、目的とする樹脂組成物層厚み、塗工速度などにもよるが、例えば、乾燥ゾーンが3箇所に分かれている場合には、乾燥炉内の温度とその際の基材温度との差があまり大きくならないように、入り口側から60℃、90℃、120℃と徐々に昇温させ、最終的には基材温度が100℃以上になるような条件などが例示される。 The method for forming a resin composition solution in which a resin composition is dissolved or dispersed in a solvent containing water on a sheet-like substrate is not particularly limited as long as it is a known method used industrially. Specifically, a method of forming a coating layer of the resin composition solution on a substrate using a knife coater or a die coater and evaporating the solvent by hot air drying in a drying furnace is exemplified. The method for drying the sheet-like substrate on which the coating layer is formed and forming the resin composition layer on the substrate is not particularly limited as long as it is a known method used industrially. Specifically, hot air drying is often used, but a method of using infrared rays, microwaves, and high-frequency heating in combination as necessary is exemplified. The drying conditions depend on the size / capacity of the dryer, the desired resin composition layer thickness, the coating speed, etc., for example, when the drying zone is divided into three locations, The temperature is gradually raised from the entrance side to 60 ° C, 90 ° C, 120 ° C so that the difference between the temperature of the substrate and the substrate temperature at that time does not become too large, and finally the substrate temperature becomes 100 ° C or higher Such conditions are exemplified.
本発明おいて、シート状の基材に形成される樹脂組成物層の厚さは5〜200μmの範囲が好ましい。樹脂組成物層厚さが5μm 未満では、潤滑性能不足から得られる穴品質が低下し、200μm を超えると、小径での穴明け時に樹脂成分のドリルビットへの巻き付き現象が改善されず、穴位置精度が悪化する。以上により、本発明のドリル穴明け用エントリーシートが得られる。 In the present invention, the thickness of the resin composition layer formed on the sheet-like substrate is preferably in the range of 5 to 200 μm. If the resin composition layer thickness is less than 5 μm, the hole quality obtained due to insufficient lubrication performance will deteriorate, and if it exceeds 200 μm, the wrapping phenomenon of the resin component around the drill bit will not be improved when drilling with a small diameter, and the hole position will not be improved. Accuracy deteriorates. As described above, the entry sheet for drilling according to the present invention is obtained.
本発明のドリル穴明け用エントリーシートは、プリント配線材料、例えば銅張積層板または多層銅張積層板をドリル穴明け加工する際に、プリント配線材料を1枚または複数枚を重ねたものの少なくとも最上面に、プリント配線材料に接するように配置し、ドリル穴明け用エントリーシートの樹脂組成物層面側から、ドリル穴明けを行うものである。以下に、実施例、比較例を示し、本発明を具体的に説明する。 The entry sheet for drilling according to the present invention is at least the most preferable one in which one or a plurality of printed wiring materials are stacked when drilling a printed wiring material, for example, a copper-clad laminate or a multilayer copper-clad laminate. It arrange | positions on an upper surface so that a printed wiring material may be touched, and drills a hole from the resin composition layer surface side of the entry sheet for drilling. Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples.
(実施例1)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(商品名:パオゲンPP-15、第一工業製薬株式会社製) 50重量部、ポリオキシエチレンモノステアレート(商品名:ノニオンS-40、日本油脂株式会社製) 50重量部、キシリトール2重量部を、ニーダーを使用し、温度150℃の窒素雰囲気中で混錬した後、T−ダイ押出機を使用してPETフィルム上に押し出し、厚さ100μmの樹脂シートを得た。この樹脂シートを、予めポリエステル系接着剤(商品名:R820、セメダイン株式会社製)を5μm厚塗布した厚さ100μmのアルミニウム箔(材質:1070)の片面に、温度100℃に設定した誘電加熱ロールと加圧ロールを用いて貼り付け、総厚200μmのドリル穴明け用エントリーシートを得た。得られたドリル穴明け用エントリーシートを、厚さ0.4mm、両面12μm銅張積層板(商品名:HL832 0.4T/T、三菱ガス化学株式会社製)を2枚重ねた上面に配置し、下面に当て板(紙フェノール積層板)を配置し、ドリルビット:0.15mmφ(商品名:NEUL004S、ユニオンツール株式会社製)、回転数:150000 rpm、送り速度:12μm/rev.の条件で3000ヒットのドリル穴明け加工を行い、穴評価を行った結果を表1に示した。
Example 1
Polyethylene glycol dimethyl terephthalate polycondensate (trade name: Paogen PP-15, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) 50 parts by weight, polyoxyethylene monostearate (trade name: Nonion S-40, manufactured by NOF Corporation) 50 parts by weight and 2 parts by weight of xylitol were kneaded in a nitrogen atmosphere at a temperature of 150 ° C. and then extruded onto a PET film using a T-die extruder to obtain a resin sheet having a thickness of 100 μm. Obtained. This resin sheet is a dielectric heating roll set at a temperature of 100 ° C on one side of a 100 µm thick aluminum foil (material: 1070) coated with 5 µm thick polyester adhesive (trade name: R820, manufactured by Cemedine Co., Ltd.) in advance. And a pressure roll to obtain an entry sheet for drilling with a total thickness of 200 μm. Place the resulting drill hole entry sheet on the top surface of two stacked 0.4mm thick, double-sided 12μm copper clad laminates (trade name: HL832 0.4T / T, manufactured by Mitsubishi Gas Chemical Co., Ltd.) A hitting plate (paper phenol laminate) is placed on the drill bit: 0.15 mmφ (trade name: NEUL004S, manufactured by Union Tool Co., Ltd.), rotation speed: 150000 rpm, feed speed: 12 μm / rev. Table 1 shows the results of drilling and hole evaluation.
(実施例2)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(商品名:パオゲンPP-15、第一工業製薬株式会社製) 30重量部、ポリオキシエチレンモノステアレート(商品名:ノニオンS-40、日本油脂株式会社製) 70重量部、コハク酸0.5重量部を、ニーダーを使用し、温度150℃の窒素雰囲気中で混錬した後、T−ダイ押出機を使用してPETフィルム上に押し出し、厚さ60μmの樹脂シートを得た。この樹脂シートを、予めポリエステル系接着剤(商品名:R820、セメダイン株式会社製)を5μm厚塗布した厚さ70μmのアルミニウム箔(材質:1N30)の片面に、温度100℃に設定した誘電加熱ロールと加圧ロールを用いて貼り付け、総厚130μmのドリル穴明け用エントリーシートを得た。得られたドリル穴明け用エントリーシートを、厚さ0.4mm、両面12μm銅張積層板(商品名:HL832 0.4T/T、三菱ガス化学株式会社製)を2枚重ねた上面に配置し、下面に当て板(紙フェノール積層板)を配置し、ドリルビット:0.12mmφ(商品名:MD J531Cユニオンツール株式会社製)、回転数:150000rpm、送り速度:12μm/rev.の条件で3000ヒットのドリル穴明け加工を行い、穴評価を行った結果を表2に示した。
(Example 2)
Polyethylene glycol dimethyl terephthalate polycondensate (trade name: Paogen PP-15, Daiichi Kogyo Seiyaku Co., Ltd.) 30 parts by weight, polyoxyethylene monostearate (trade name: Nonion S-40, manufactured by NOF Corporation) 70 parts by weight and 0.5 parts by weight of succinic acid were kneaded in a nitrogen atmosphere at a temperature of 150 ° C using a kneader, then extruded onto a PET film using a T-die extruder, and a resin sheet with a thickness of 60 µm Got. This resin sheet is a dielectric heating roll set at a temperature of 100 ° C on one side of a 70 µm thick aluminum foil (material: 1N30) coated with a polyester adhesive (trade name: R820, manufactured by Cemedine Co., Ltd.) 5 µm thick. And a pressure roll to obtain an entry sheet for drilling with a total thickness of 130 μm. Place the resulting drill hole entry sheet on the top surface of two stacked 0.4mm thick, double-sided 12μm copper clad laminates (trade name: HL832 0.4T / T, manufactured by Mitsubishi Gas Chemical Co., Ltd.) Place a contact plate (paper phenol laminate) on the drill bit, drill bit: 0.12mmφ (Product name: MD J531C Union Tool Co., Ltd.), rotation speed: 150000rpm, feed rate: 12μm / rev. Table 2 shows the results of drilling and hole evaluation.
(実施例3)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(パオゲンPP-15) 40重量部、ポリオキシエチレンモノステアレート(ノニオンS-40) 60重量部を、攪拌槽において水180重量部に溶解した後、イソプロピルアルコールを80重量部添加し固形分27.8%、粘度14000センチポイズ(25℃)の樹脂溶液を得た。この水溶液にグリシノール1部とイノシトール1部を添加した。この樹脂溶液を、ダイコーターを用いて予めポリエステル系接着剤(R820)を5μm厚塗布した100μmのアルミニウム箔(材質:1085)の片面に330μm厚塗布し、炉長3m×3室のロールサポートタイプの乾燥炉、(設定温度:60-100-140℃)中を、上面に風速20m/minで熱風を吹き付ける条件で、0.1m/秒で通過させて乾燥し総厚200μmのドリル穴明け用エントリーシートを得た。得られたドリル穴明け用エントリーシートを使用し、実施例1と同様にして、ドリル穴明け加工を行い、穴評価を行った結果を表3に示した。
(Example 3)
Polyethylene glycol / dimethyl terephthalate polycondensate (Paogen PP-15) 40 parts by weight and polyoxyethylene monostearate (Nonion S-40) 60 parts by weight were dissolved in 180 parts by weight of water in a stirring tank, and then isopropyl alcohol was added. Adding 80 parts by weight, a resin solution having a solid content of 27.8% and a viscosity of 14,000 centipoise (25 ° C.) was obtained. To this aqueous solution, 1 part of glycinol and 1 part of inositol were added. This resin solution is applied on a single side of 100μm aluminum foil (material: 1085) with 5μm thick polyester adhesive (R820) using a die coater. In a drying oven (set temperature: 60-100-140 ° C) under conditions where hot air is blown onto the top surface at a wind speed of 20 m / min. A sheet was obtained. Table 3 shows the results of drilling and hole evaluation performed in the same manner as in Example 1 using the obtained drilling entry sheet.
(実施例4)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(パオゲンPP-15) 20重量部、ポリエチレングリコール(商品名:PEG20000、三洋化成株式会社製) 20重量部ポリオキシエチレンモノステアレート(ノニオンS-40) 60重量部を、攪拌槽において280重量部の水に溶解した後、イソプロピルアルコールを40重量部添加し、固形分23.8%、粘度7000センチポイズ(25℃)の樹脂溶液を得た。この樹脂溶液に更にギ酸ナトリウム0.5部とペンタエリスリトール1部を混合した。この樹脂溶液を、ダイコーターを用いて70μmのアルミニウム箔(1070)の片面に43μm厚塗布し、炉長3m×3室のロールサポートタイプの乾燥炉(設定温度:60-90-120℃)中を、上面に風速15m/minで熱風を吹き付ける条件で、0.07m/秒で通過させ、総厚80μmのドリル穴明け用エントリーシートを得た。得られたドリル穴明け用エントリーシートを、厚さ0.2mm、両面12μm銅張積層板(商品名:HL832 0.2T/T、三菱ガス化学株式会社製)を4枚重ねた上面に配置し、下面に当て板(紙フェノール積層板)を配置し、ドリルビット:0.105mmφ(商品名: MDJ492B、ユニオンツール株式会社製)、回転数:160000 rpm、送り速度:5μm/rev.の条件で3000ヒットのドリル穴明け加工を行い、穴評価を行った結果を表4に示した。
Example 4
Polyethylene glycol / dimethyl terephthalate polycondensate (Paogen PP-15) 20 parts by weight, polyethylene glycol (trade name: PEG 20000, manufactured by Sanyo Chemical Co., Ltd.) 20 parts by weight polyoxyethylene monostearate (Nonion S-40) 60 parts by weight After being dissolved in 280 parts by weight of water in a stirring tank, 40 parts by weight of isopropyl alcohol was added to obtain a resin solution having a solid content of 23.8% and a viscosity of 7000 centipoise (25 ° C.). To this resin solution, 0.5 part of sodium formate and 1 part of pentaerythritol were further mixed. This resin solution is applied to one side of 70μm aluminum foil (1070) using a die coater in a thickness of 43μm, in a roll support type drying oven (set temperature: 60-90-120 ℃) with a furnace length of 3m x 3 chambers. Was passed at 0.07 m / sec under conditions where hot air was blown onto the top surface at a wind speed of 15 m / min to obtain an entry sheet for drilling with a total thickness of 80 μm. The resulting drill hole entry sheet is placed on the top surface where four sheets of copper-clad laminate (product name: HL832 0.2T / T, manufactured by Mitsubishi Gas Chemical Co., Inc.) with a thickness of 0.2mm and double-sided are placed on the bottom surface. And a drill bit: 0.105 mmφ (trade name: MDJ492B, manufactured by Union Tool Co., Ltd.), rotation speed: 160000 rpm, feed rate: 5 μm / rev. Table 4 shows the results of the drilling of 3,000 hits under the above conditions and the hole evaluation.
(比較例1)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(商品名:パオゲンPP-15、第一工業製薬株式会社製) 50重量部、ポリオキシエチレンモノステアレート(商品名:ノニオンS-40、日本油脂株式会社製) 50重量部をニーダーを使用し、温度150℃の窒素雰囲気中で混錬した後、T−ダイ押出機等を使用してPETフィルム上に押し出し、厚さ100μmの樹脂シートを得た。この樹脂シートを、予めポリエステル系接着剤(商品名:R820、セメダイン株式会社製)を5μm厚塗布した厚さ100μmのアルミニウム箔(材質:1070)の片面に、温度100℃に設定した誘電加熱ロールと加圧ロールを用いて貼り付け、総厚200μmのドリル穴明け用エントリーシートを得た。このドリル穴明け用エントリーシートを、実施例1と同条件で穴明け加工を行い、穴評価を行った結果を表1に示した。
(Comparative Example 1)
Polyethylene glycol dimethyl terephthalate polycondensate (trade name: Paogen PP-15, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) 50 parts by weight, polyoxyethylene monostearate (trade name: Nonion S-40, manufactured by NOF Corporation) 50 parts by weight was kneaded in a nitrogen atmosphere at a temperature of 150 ° C. using a kneader, and then extruded onto a PET film using a T-die extruder or the like to obtain a resin sheet having a thickness of 100 μm. This resin sheet is a dielectric heating roll set at a temperature of 100 ° C on one side of a 100 µm thick aluminum foil (material: 1070) coated with 5 µm thick polyester adhesive (trade name: R820, manufactured by Cemedine Co., Ltd.) in advance. And a pressure roll to obtain an entry sheet for drilling with a total thickness of 200 μm. Table 1 shows the results of drilling the drilling entry sheet under the same conditions as in Example 1 and evaluating the holes.
(比較例2)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(商品名:パオゲンPP-15、第一工業製薬株式会社製) 30重量部、ポリオキシエチレンモノステアレート(商品名:ノニオンS-40、日本油脂株式会社製) 70重量部をニーダーを使用し、温度150℃の窒素雰囲気中で混錬した後、T−ダイ押出機等を使用してPETフィルム上に押し出し、厚さ60μmの樹脂シートを得た。この樹脂シートを、予めポリエステル系接着剤(商品名:R820、セメダイン株式会社製)を5μm厚塗布した厚さ70μmのアルミニウム箔(材質:1N30)の片面に、温度100℃に設定した誘電加熱ロールと加圧ロールを用いて貼り付け、総厚130μmのドリル穴明け用エントリーシートを得た。このドリル穴明け用エントリーシートを、実施例1と同条件で穴明け加工を行い、穴評価を行った結果を表2に示した。
(Comparative Example 2)
Polyethylene glycol dimethyl terephthalate polycondensate (trade name: Paogen PP-15, Daiichi Kogyo Seiyaku Co., Ltd.) 30 parts by weight, polyoxyethylene monostearate (trade name: Nonion S-40, manufactured by NOF Corporation) 70 parts by weight was kneaded in a nitrogen atmosphere at a temperature of 150 ° C. using a kneader, and then extruded onto a PET film using a T-die extruder or the like to obtain a resin sheet having a thickness of 60 μm. This resin sheet is a dielectric heating roll set at a temperature of 100 ° C. on one side of a 70 μm thick aluminum foil (material: 1N30) coated with a polyester adhesive (trade name: R820, manufactured by Cemedine Co., Ltd.) in a thickness of 5 μm. And a pressure roll to obtain an entry sheet for drilling with a total thickness of 130 μm. Table 2 shows the result of drilling the drilling entry sheet under the same conditions as in Example 1 and evaluating the holes.
(比較例3)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(パオゲンPP-15) 40重量部、ポリオキシエチレンモノステアレート(ノニオンS-40) 60重量部を、攪拌槽において水180重量部に溶解した後、イソプロピルアルコールを80重量部添加し固形分27.8%、粘度14000センチポイズ(25℃)の樹脂溶液を得た。この樹脂溶液を、ダイコーターを用いて予めポリエステル系接着剤(R820)を5μm厚塗布した100μmのアルミニウム箔(材質:1085)の片面に330μm厚塗布し、炉長3m×3室のロールサポートタイプの乾燥炉、(設定温度:60-100-140℃)中を、上面に風速20m/minで熱風を吹き付ける条件で、0.1m/秒で通過させて乾燥し総厚200μmのドリル穴明け用エントリーシートを得た。このドリル穴明け用エントリーシートを、実施例3と同条件で穴明け加工を行い、穴評価を行った結果を表3に示した。
(Comparative Example 3)
Polyethylene glycol / dimethyl terephthalate polycondensate (Paogen PP-15) 40 parts by weight and polyoxyethylene monostearate (Nonion S-40) 60 parts by weight were dissolved in 180 parts by weight of water in a stirring tank, and then isopropyl alcohol was added. Adding 80 parts by weight, a resin solution having a solid content of 27.8% and a viscosity of 14,000 centipoise (25 ° C.) was obtained. This resin solution is applied on a single side of 100μm aluminum foil (material: 1085) with 5μm thick polyester adhesive (R820) using a die coater. In a drying oven (set temperature: 60-100-140 ° C) under conditions where hot air is blown onto the top surface at a wind speed of 20 m / min. A sheet was obtained. Table 3 shows the results of drilling the drilling entry sheet under the same conditions as in Example 3 and evaluating the holes.
(比較例4)
ポリエチレングリコール・ジメチルテレフタレート重縮合物(パオゲンPP-15) 20重量部、ポリエチレングリコール(商品名:PEG20000、三洋化成株式会社製) 20重量部、ポリオキシエチレンモノステアレート(ノニオンS-40) 60重量部を、攪拌槽において280重量部の水に溶解した後、イソプロピルアルコールを40重量部添加し、固形分23.8%、粘度7000センチポイズ(25℃)の樹脂溶液を得た。この樹脂溶液を、ダイコーターを用いて70μmのアルミニウム箔(1070)の片面に43μm厚塗布し、炉長3m×3室のロールサポートタイプの乾燥炉(設定温度:60-90-120℃)中を、上面に風速15m/minで熱風を吹き付ける条件で、0.07m/秒で通過させ、総厚80μmのドリル穴明け用エントリーシートを得た。このドリル穴明け用エントリーシートを、実施例4と同条件で穴明け加工を行い、穴評価を行った結果を表4に示した。
(Comparative Example 4)
Polyethylene glycol / dimethyl terephthalate polycondensate (Paogen PP-15) 20 parts by weight, polyethylene glycol (trade name: PEG 20000, manufactured by Sanyo Chemical Co., Ltd.) 20 parts by weight, polyoxyethylene monostearate (Nonion S-40) 60 parts by weight A part was dissolved in 280 parts by weight of water in a stirring tank, and then 40 parts by weight of isopropyl alcohol was added to obtain a resin solution having a solid content of 23.8% and a viscosity of 7000 centipoise (25 ° C.). This resin solution is applied to one side of 70μm aluminum foil (1070) using a die coater in a thickness of 43μm, in a roll support type drying oven (set temperature: 60-90-120 ℃) with a furnace length of 3m x 3 chambers. Was passed at 0.07 m / sec under conditions where hot air was blown onto the top surface at a wind speed of 15 m / min to obtain an entry sheet for drilling with a total thickness of 80 μm. Table 4 shows the results of drilling the drilling entry sheet under the same conditions as in Example 4 and evaluating the holes.
(穴評価の方法)
評価はドリル穴明け加工を行った際の穴位置精度とドリルビットへの樹脂の巻きつき量の目視観察によった。
・穴位置精度:重ねた銅張積層板の最下板の裏側に明いたビット2本×3000穴/本=6000穴の位置について、指令座標とのズレを測定し、それぞれズレ量の平均と標準偏差および最大値を求めた。この操作を3回繰り返した。
(Method of hole evaluation)
The evaluation was based on visual observation of the hole position accuracy when drilling and the amount of resin wound around the drill bit.
・ Hole position accuracy: Measure the deviation from the command coordinates for the position of 2 bits × 3000 holes / piece = 6000 holes, which are bright on the back side of the bottom plate of the stacked copper clad laminate, Standard deviation and maximum value were determined. This operation was repeated three times.
Claims (4)
ポリエチレングリコール・ジメチルテレフタレート重縮合物およびポリエチレングリコールからなる群から選択された1種もしくは2種以上の水溶性樹脂(a)と、
ペンタエリスリトール、キシリトール、イノシトール、グリシノール、有機酸類および有機塩類からなる群から選択された1種もしくは2種以上の水溶性物質(b)、ならびに
ポリオキシエチレンモノステアレートである水溶性滑剤(c)
を含有する樹脂組成物層を形成したドリル穴明け用エントリーシート。 To the sheet-like base material,
One or more water-soluble resins (a) selected from the group consisting of polyethylene glycol / dimethyl terephthalate polycondensate and polyethylene glycol;
One or more water-soluble substances (b) selected from the group consisting of pentaerythritol, xylitol, inositol, glycinol, organic acids and organic salts, and a water-soluble lubricant which is polyoxyethylene monostearate (c)
An entry sheet for drilling, in which a resin composition layer containing is formed.
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