JP2012170912A - Cleaning tool and cleaning method for electronic component mounting facility - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning tool and a cleaning method for an electronic component mounting facility, in which cleaning work can be performed efficiently in simplified and low-priced configuration.SOLUTION: A cleaning tool 20 for an electronic component mounting facility, for cleaning an adsorption nozzle 10 or the like used for a component mounting device comprises: a body 21 that a worker can grip and operate; a jet nozzle 25 which is provided in a distal end of the body 21 and from which two-fluid 31 are jetted out; and a liquid tank 28 which is connected to the body 21 and connected with the jet nozzle 25 via a switching valve 26. The two-fluid 31 obtained by mixing particles 30a of cleaning water 30 into compressed air 23a is jetted to the adsorption nozzle 10 that is an object to be cleaned. Thus, cleaning work can be performed efficiently in simplified and low-priced configuration.

Description

  The present invention relates to a cleaning tool and a cleaning method for an electronic component mounting facility used for cleaning an object to be cleaned such as parts of the electronic component mounting facility.

  Many components of electronic component mounting equipment, such as a suction nozzle that sucks and holds electronic components in a component mounting apparatus, require cleaning to remove foreign substances attached during use. In the suction nozzle example, sticky foreign substances such as cream solder and various oils and fats used for joining parts are likely to adhere to the nozzle tip. In addition, a cleaning operation for removing these foreign substances is performed. Conventionally, as a method for this cleaning operation, air blow using a manual air gun, manual removal using a pin jig such as a piano wire, and submerged cleaning using an ultrasonic cleaning device have been used. These cleaning methods have difficulties in removing foreign substances, and depending on the level of difficulty in cleaning the target part, sufficient cleaning quality cannot be ensured. Therefore, dedicated automatic cleaning using a two-fluid nozzle that ejects fine water particles with compressed air. An apparatus has been proposed (see, for example, Patent Document 1). According to this method, there is an advantage that a high foreign matter removing ability can be ensured by collision of water particles with the foreign matter.

JP 2010-269214 A

  However, in the prior art shown in the above-mentioned patent document examples, due to the apparatus configuration, there are the following difficulties in terms of cost and usability. That is, in the prior art, a plurality of nozzles to be cleaned are held in a dedicated nozzle holder that holds a predetermined posture, and the two-fluid generator and the two-fluid nozzle are moved with respect to the nozzle holder while being composed of water particles and compressed air. Since it is the structure which injects 2 fluid with respect to a to-be-cleaned nozzle, it was inevitable that an apparatus structure became complicated and an installation cost became high. In addition, each time the cleaning operation is performed, an operation of attaching and detaching a plurality of nozzles to be cleaned to and from the nozzle holder is required. Therefore, the cleaning operation requires a lot of labor, and there is a problem in terms of work efficiency and usability.

  Therefore, an object of the present invention is to provide a cleaning tool and a cleaning method for an electronic component mounting facility that can efficiently perform a cleaning operation with a simple and inexpensive configuration.

  The cleaning tool for electronic component mounting equipment according to the present invention is an electronic device for cleaning the object to be cleaned by spraying two fluids obtained by mixing liquid particles in compressed air onto the object to be cleaned used in the electronic component mounting facility. A cleaning tool for a component mounting facility, which is connected to a supply source of compressed air and can be gripped and operated by an operator, an injection nozzle that is provided at a tip of the main body and injects the two fluids, A liquid tank connected to the main body portion and connected via the switching valve to the injection nozzle, and the switching valve supplies the compressed air in a state where the injection nozzle communicates with the liquid tank; Two fluids in which liquid particles sucked up from the liquid tank are mixed with compressed air are ejected from the ejection nozzle, and the switching valve shuts off the ejection nozzle and the liquid tank. By supplying the compressed air in the state, to inject only the compressed air that does not contain particles of liquid from the injection nozzle.

  The cleaning method of the present invention includes a main body part that is connected to a compressed air supply source and can be gripped and operated by an operator, an injection nozzle that is provided at a front end of the main body part and that ejects the two fluids, and the main body part By injecting two fluids in which liquid particles are mixed with compressed air onto an object to be cleaned used in an electronic component mounting facility. A cleaning method for cleaning the object to be cleaned by a cleaning tool for an electronic component mounting facility for cleaning the object to be cleaned, wherein the compressed air is discharged in a state where the switching valve communicates the spray nozzle and the liquid tank. By supplying two fluids, which are a mixture of liquid particles sucked up from the liquid tank and compressed air, are ejected from the ejection nozzle to clean the object to be cleaned, and the switching valve By supplying the compressed air in a state where the spray nozzle and the liquid tank are shut off, only the compressed air that does not contain liquid particles is sprayed from the spray nozzle and the liquid adhered to the object to be cleaned by the cleaning is removed. Remove.

  According to the present invention, a main body that can be gripped and operated by an operator, an injection nozzle that is provided at the front end of the main body and that ejects the two fluids, and is connected to the main body via the injection nozzle and the switching valve. And a liquid tank connected to each other, and using a cleaning tool configured to inject two fluids, which are liquid particles mixed with compressed air, onto an object to be cleaned, on an electronic component mounting facility, a simple and inexpensive configuration Can be cleaned efficiently.

The top view of the component mounting apparatus with which the suction nozzle used as the washing | cleaning object of the cleaning tool of one embodiment of this invention is mounted | worn Explanatory drawing of the suction nozzle used as the washing | cleaning object of the cleaning tool of one embodiment of this invention Structure explanatory drawing of the cleaning tool of one embodiment of the present invention Functional explanatory diagram of a cleaning tool according to an embodiment of the present invention Explanatory drawing of operation | movement of the cleaning method by the cleaning tool of one embodiment of this invention Functional explanatory drawing of the attachment used accompanying the cleaning tool of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 is an electronic component mounting facility used for an electronic component mounting line for manufacturing a mounting substrate by mounting an electronic component on a substrate, and includes a suction nozzle to be cleaned by a cleaning tool according to an embodiment of the present invention. A nozzle holder is installed.

  In FIG. 1, a substrate transport mechanism 2 is arranged in the X direction (substrate transport direction) at the center of the base 1a. The board transport mechanism 2 transports the board 3 carried in from the upstream side and positions it at a work position by a component mounting mechanism described below. On both sides of the substrate transport mechanism 2, component supply units 4 that supply electronic components to be mounted are arranged. A plurality of tape feeders 5 are arranged in parallel in the component supply unit 4, and the tape feeder 5 has a function of pitch-feeding the components held on the carrier tape to a take-out position by a component mounting mechanism described below. Yes.

  A Y-axis moving table 6 is disposed on one end in the X direction on the upper surface of the base 1a, and two X-axis moving tables 7 are slidably coupled to the Y-axis moving table 6 in the Y direction. ing. A mounting head 8 is mounted on each X-axis moving table 7 so as to be slidable in the X direction. The mounting head 8 is a multiple head composed of a plurality of unit mounting heads 9, and the component to be mounted is vacuum-sucked from the tape feeder 5 by a suction nozzle 10 (see FIG. 2) attached to the lower end of the unit mounting head 9. Hold by. The Y-axis moving table 6 and the X-axis moving table 7 constitute a head moving mechanism that moves the mounting head 8. By driving the head moving mechanism, the mounting head 8 is positioned by the component supply unit 4 and the substrate transport mechanism 2. Move between the two substrates 3. The head moving mechanism that moves the mounting head 8 and the mounting head 8 constitutes a component mounting mechanism that takes out components from the component supply unit 4 and mounts them on the substrate 3.

  A substrate recognition camera 11 that moves integrally with the mounting head 8 is mounted on the lower surface of the X-axis moving table 7. By driving the head moving mechanism to move the substrate recognition camera 11 above the substrate 3 held by the substrate transport mechanism 2, the substrate recognition camera 11 images the recognition mark formed on the substrate 3. A component recognition camera 12 and a nozzle storage unit 13 are disposed on the movement path of the mounting head 8 between the component supply unit 4 and the substrate transport mechanism 2. The component recognition camera 12 picks up an image of the component held by the mounting head 8 by performing a scanning operation in which the mounting head 8 taking out the component from the component supply unit 4 passes above the component recognition camera 12 in a predetermined direction. . A plurality of suction nozzles 10 mounted on the unit mounting head 9 are stored and held in the nozzle storage unit 13 corresponding to the component type. When the mounting head 8 accesses the nozzle housing portion 13 to perform the nozzle replacement operation, the suction nozzle 10 mounted on the unit mounting head 9 can be replaced according to the component type.

  Next, with reference to FIG. 2, attachment / detachment of the suction nozzle 10 in the mounting head 8 and fouling of the suction nozzle 10 will be described. As shown in FIG. 2A, the mounting head 8 has a configuration in which a plurality of unit mounting heads 9 are arranged in parallel, and a nozzle holder 9 a provided at the lower part of each unit mounting head 9 attracts the suction. The nozzle 10 is detachably mounted. In the component mounting operation, the mounting head 8 reciprocates between the component supply unit 4 and the substrate 3 positioned and held by the substrate transport mechanism 2 to repeatedly execute the component mounting operation. The nozzle replacement operation for accessing and replacing the suction nozzle 10 with respect to the nozzle holder 9a is performed.

  In the process of continuing the component mounting operation in this way, the suction nozzle 10 is a target of the cleaning operation. That is, in the component mounting operation, the component suction operation in which the suction surface 10c provided at the lower end portion of the shaft portion 10a of the suction nozzle 10 is brought into contact with the electronic component to be sucked and held and vacuum suction is performed from the suction hole 10b is repeated. Executed. In the process of repeatedly performing the component suction operation, as shown in FIG. 2B, the sticking foreign matter 14 such as cream solder and various oils and fats used for joining the components adheres to the suction surface 10c. When these foreign matter 14 adheres and accumulates on the suction surface 10c, normal component suction is hindered, so that the suction nozzle 10 removed from the mounting head 8 at every predetermined work interval is used as a target for cleaning to remove these foreign matter 14. Work is done.

  The cleaning tool 20 used for the cleaning operation of such electronic component mounting equipment will be described with reference to FIGS. The cleaning tool 20 has a function of cleaning the suction nozzle 10 by injecting two fluids in which liquid particles are mixed with compressed air, onto the suction nozzle 10 that is an object to be cleaned used in an electronic component mounting facility. Yes. Here, an example is shown in which cleaning water made of ordinary city water is used as the liquid used for cleaning. Although liquid other than water can be used, it is desirable to use water in terms of cost and environmental load.

  In FIG. 3, the cleaning tool 20 includes a main body 21, an injection nozzle 25, and a liquid tank 28. The main body portion 21 has a gripping portion 21a that is gripped by an operator, and has a gun shape in which an injection nozzle 25 is provided at the tip via an ejector portion 21b. An air flow path 21d (see also FIG. 4) that connects the bottom of the gripping part 21a and the ejector part 21b is provided inside the main body part 21, and the air flow path 21d is connected to the bottom of the gripping part 21a. An air source 23 which is a supply source of compressed air is connected through an air tube 22.

  An on / off valve 24 for turning on / off the air flow path 21d is provided inside the grip portion 21a. The on / off valve 24 moves the trigger portion 21c in the direction of arrow a by the operator who grips the grip portion 21a. By operating, the supply of compressed air from the air source 23 to the ejector portion 21b can be connected and disconnected. A tank connection mechanism 27 is connected to the lower portion of the ejector portion 21b via a switching valve 26. Further, the tank connection mechanism 27 is detachably mounted with a liquid tank 28 for storing cleaning water 30 therein. . The switching valve 26 includes an operation cock 26a. When the operator operates the operation cock 26a in the direction of the arrow b, the connection state between the water guide tube 29 inserted into the liquid tank 28 and the ejector portion 21b is turned on.・ Can be turned off. Thereby, the supply of the cleaning water 30 from the liquid tank 28 to the ejector portion 21b is connected / disconnected.

  The liquid tank 28 is a simple container such as a PET bottle. As shown in FIG. 4, the tank connection mechanism 27 is formed by screwing an external thread portion provided on the bottle neck portion 28 a with an internal thread portion of the tank connection mechanism 27. It is attached to. In this mounted state, the top of the bottle neck portion 28a is pressed against the seal member 27a mounted inside the tank connection mechanism 27, whereby the inside of the liquid tank 28 is sealed from the outside.

  As shown in FIG. 4, an orifice 21 e with a narrowed air flow path 21 d is provided inside the ejector portion 21 b, and the orifice 21 e opens into a suction space 21 f that communicates with the water guide tube 29 via a switching valve 26. is doing. Furthermore, the suction space 21f communicates with an ejection passage 21g provided through the ejector portion 21b, and the ejection passage 21g communicates with a nozzle hole 25a provided in the ejection nozzle 25. In addition, as a diameter size of the nozzle hole 25a, it is desirable to select from the range of 0.15-0.25 mm.

  By opening the trigger portion 21c, compressed air is supplied from the air source 23 to the air flow path 21d (arrow c), and the compressed air whose speed is reduced by the orifice 21e is jetted into the suction space 21f. (Arrow d), and flows through the injection passage 21g and is injected from the nozzle hole 25a of the injection nozzle 25 to the outside. And the inside of the suction space 21f becomes a negative pressure with respect to the outside due to the pressure drop caused by the high-speed jet.

  At this time, if the switching valve 26 is in the open state, the washing water 30 in the liquid tank 28 is sucked up into the suction space 21f through the water guide tube 29 (arrow e) by this negative pressure (arrow f). In the process of flowing down the injection flow path 21g by the jet of the compressed air 23a, the washing water 30 is dropletized into particles 30a having a fine particle size and mixed with the compressed air 23a, and the particles 30a are mixed with the compressed air 23a. The two fluids 31 are ejected from the nozzle hole 25a (arrow g). That is, the cleaning tool 20 is connected to an air source 23 that is a supply source of compressed air, and a main body 21 that can be held and operated by an operator, and an injection that jets two fluids 31 provided at the tip of the main body 21. The nozzle 25 and a liquid tank 28 connected to the main body 21 and connected to the spray nozzle 25 via a switching valve 26 are provided.

  On the other hand, if the switching valve 26 is in the closed state, the cleaning water 30 in the liquid tank 28 is not sucked into the suction space 21f via the water guide tube 29, and particles 30a are included from the nozzle hole 25a. Only uncompressed compressed air 23a is injected. That is, in the cleaning tool 20 of the present embodiment, the switching valve 26 supplies the compressed air 23a in a state where the injection nozzle 25 and the liquid tank 28 are in communication, so that the cleaning water 30 sucked up from the liquid tank 28 is supplied. The two fluids 31 in which the particles 30a and the compressed air 23a are mixed are injected from the injection nozzle 25, and the switching valve 26 supplies the compressed air 23a in a state where the injection nozzle 25 and the liquid tank 28 are shut off. Only compressed air 23a that does not include 30 particles 30a is jetted from the jet nozzle 25.

  Next, a cleaning method for cleaning an object to be cleaned with the cleaning tool 20 having the above-described configuration will be described with reference to FIG. Here, the foreign matter 14 adhering to the suction surface 10c of the suction nozzle 10 is removed by spraying the two fluids 31 in which the particles 30a of the cleaning water 30 are mixed with the compressed air 23a onto the suction nozzle 10 as the object to be cleaned. An example is shown.

  As shown in FIG. 5 (a), foreign matter 14 such as cream solder or oil and fat is adhered to the suction surface 10c of the suction nozzle 10 to be cleaned by repeated parts suction operation due to adhesive force. Yes. In the cleaning operation, the operator operates the cleaning tool 20 while holding the grip portion 21a, and aligns the ejection nozzle 25 so as to face the suction surface 10c of the suction nozzle 10. At this time, by operating the operation cock 26a, the switching valve 26 is opened, that is, the injection nozzle 25 and the liquid tank 28 are in communication with each other, and the trigger portion 21c is operated in this state to operate the compressed air 23a. Is supplied to the ejector portion 21b. Thereby, from the nozzle hole 25a of the injection nozzle 25, the 2 fluid 31 which mixed the particle | grains 30a with the compressed air 23a is injected with respect to the adsorption | suction surface 10c.

  Then, in the process of continuing the injection of the two fluids 31 for a predetermined time, the physical force due to the particles 30a colliding with the foreign matter 14 without interruption is superior to the adhesion force of the foreign matter 14 to the suction surface 10c. As shown, the foreign matter 14 is removed from the suction surface 10c, and the suction surface 10c is cleaned. At this time, the particles 30a included in the two fluids 31 enter the suction hole 10b of the shaft portion 10a and adhere to the inside. If such particles 30a are left in the suction hole 10b, the secondary contaminants in which fine foreign matters contained in the particles 30a re-adhere to the inner surface of the shaft portion 10a after the moisture of the particles 30a evaporates. In order to induce, it is necessary to perform liquid drainage drying to blow off and remove the washed particles 30a.

  That is, the operation cock 26a is switched to a closed state, that is, a state where the injection nozzle 25 and the liquid tank 28 are shut off, and in this state, the compressed air 23a is supplied to the ejector portion 21b. As a result, as shown in FIG. 5C, only the compressed air 23a that does not include the particles 30a is ejected from the nozzle hole 25a of the ejection nozzle 25 onto the adsorption surface 10c. As a result, the particles 30a entering the suction holes 10b and the particles 30a adhering to the outer surface of the shaft portion 10a are blown off by the compressed air 23a and removed.

  That is, in the cleaning method shown in the present embodiment, the particles of the cleaning water 30 sucked up from the liquid tank 28 are supplied by supplying the compressed air 23a with the switching valve 26 in communication with the spray nozzle 25 and the liquid tank 28. In a state where the two fluids 31 in which 30a and the compressed air 23a are mixed are jetted from the jet nozzle 25 to wash the suction nozzle 10 which is an object to be cleaned, and the switching valve 26 shuts off the jet nozzle 25 and the liquid tank 28. By supplying the compressed air 23a, only the compressed air 23a that does not include the particles 30a of the cleaning water 30 is injected from the injection nozzle 25, and the cleaning water 30 attached to the adsorption nozzle 10 by the cleaning is removed.

  In the example shown in FIG. 5, an example in which the operator operates the cleaning tool 20 to position the injection nozzle 25 with respect to the suction surface 10 c in the cleaning operation of jetting the two fluids 31 to the suction surface 10 c. However, as shown in FIG. 6, an alignment attachment 32 may be attached to the injection nozzle 25 in advance.

  That is, in FIG. 6A, the attachment 32 is provided with a nozzle fixing portion 32a having a shape for fitting the injection nozzle 25, and the injection nozzle 25 is fitted to the nozzle fixing portion 32a and fixed with a set screw or the like. By fixing by means (not shown), the attachment 32 is aligned and fixed to a predetermined position with respect to the injection nozzle 25. In the attachment 32, the ejection space 32b for ejecting the two fluids 31 from the ejection nozzle 25, the nozzle mounting portion 32c for positioning the suction surface 10c to be cleaned in the ejection space 32b, and the ejection space 32b are ejected. Further, a discharge opening 32d for discharging the two fluids 31 is provided.

  When the cleaning operation is performed, as shown in FIG. 6B, the shaft portion 10a is fitted into the nozzle mounting portion 32c, and the collar portion 10d is held in contact with the nozzle mounting end surface 32e. In this state, the nozzle hole 25a of the injection nozzle 25 is at a position facing the suction surface 10c that is a site to be cleaned. In this state, the two fluids 31 are ejected from the nozzle holes 25a, and the ejection is continued for a predetermined time. Thereby, the two fluids 31 reliably collide with the suction surface 10c of the suction nozzle 10, and the foreign matter 14 attached to the suction surface 10c is removed.

  As described above, in this embodiment, the cleaning tool 20 for electronic component mounting equipment can be gripped and operated by an operator, and the two fluids 31 provided at the tip of the main body 21 are provided. A two-fluid 31 comprising an injection nozzle 25 to be injected and a liquid tank 28 connected to the main body portion 21 and connected to the injection nozzle 25 via a switching valve 26, wherein the particles 30a of the cleaning water 30 are mixed with the compressed air 23a. Is sprayed onto the suction nozzle 10 that is the object to be cleaned. By using the cleaning tool 20 having such a configuration for the electronic component mounting equipment, it is possible to efficiently perform a cleaning operation with a simple and inexpensive configuration.

  In the above-described embodiment, the case where the object to be cleaned is the suction nozzle 10 that sucks and holds the component in the component mounting apparatus 1 that is an electronic component mounting facility has been described. Is not limited. For example, in the unit mounting head 9 to which the suction nozzle 10 is mounted, the inside of the nozzle sliding hole of the nozzle holder 9a that slidably holds the suction nozzle 10 or a screen mask used in a screen printing apparatus that is an electronic component mounting facility The present invention can also be applied to an object to be cleaned that has a narrow cleaning site and is difficult to clean by ordinary air blow or the like.

  INDUSTRIAL APPLICABILITY The cleaning tool and cleaning method for electronic component mounting equipment according to the present invention has an effect that it is possible to efficiently perform cleaning operations with a simple and inexpensive configuration, and cleans objects to be cleaned such as parts of electronic component mounting equipment. It can be used for the purpose.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 8 Mounting head 9a Nozzle holder 10 Adsorption nozzle 10a Shaft part 10c Adsorption surface 20 Cleaning tool 21 Main body part 21a Gripping part 21b Ejector part 23a Compressed air 24 On-off valve 25 Injection nozzle 25a Nozzle hole 26 Switching valve 28 Liquid tank 30 Washing water 30a Particle 31 2 fluid

Claims (4)

A cleaning tool for an electronic component mounting facility for cleaning the object to be cleaned by spraying two fluids in which liquid particles are mixed with compressed air onto the object to be cleaned used in the electronic component mounting facility,
A main body that is connected to a compressed air supply source and can be gripped and operated by an operator;
An injection nozzle that is provided at a tip of the main body and injects the two fluids;
A liquid tank connected to the main body part and connected via the switching nozzle and a switching valve;
The switching valve supplies the compressed air in a state where the spray nozzle and the liquid tank are in communication with each other, whereby two fluids in which liquid particles sucked up from the liquid tank are mixed with the compressed air are mixed with the spray nozzle. Spray from
Electronic component mounting equipment, wherein only the compressed air containing no liquid particles is injected from the injection nozzle by supplying the compressed air in a state where the switching valve shuts off the injection nozzle and the liquid tank. Cleaning tool for.   The object to be cleaned is used in a suction nozzle that sucks and holds a component in a component mounting apparatus, a nozzle holder that is provided in a mounting head to which the suction nozzle is mounted and holds the suction nozzle slidably, and a screen printing apparatus. The cleaning tool for electronic component mounting equipment according to claim 1, wherein the cleaning tool is a screen mask. A main body that is connected to a compressed air supply source and can be gripped and operated by an operator;
An injection nozzle that is provided at a tip of the main body and from which the two fluids are injected;
A liquid tank connected to the main body and connected via the injection nozzle and a switching valve, and injecting two fluids in which liquid particles are mixed with compressed air to an object to be cleaned used in an electronic component mounting facility A cleaning method for cleaning the object to be cleaned by a cleaning tool for an electronic component mounting facility for cleaning the object to be cleaned,
The switching valve supplies the compressed air in a state where the spray nozzle and the liquid tank are in communication with each other, whereby two fluids in which liquid particles sucked up from the liquid tank are mixed with the compressed air are mixed with the spray nozzle. To spray the object to be cleaned,
By supplying the compressed air in a state where the switching valve shuts off the injection nozzle and the liquid tank, only the compressed air that does not contain liquid particles is injected from the injection nozzle to the object to be cleaned by the cleaning. A cleaning method characterized by removing adhering liquid.   The object to be cleaned is used in a suction nozzle that sucks and holds a component in a component mounting apparatus, a nozzle holder that is provided in a mounting head to which the suction nozzle is mounted and holds the suction nozzle slidably, and a screen printing apparatus. The cleaning method according to claim 3, wherein the cleaning method is any one of a screen mask.

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