JP2012168184A - Method for manufacturing spectroscopic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a spectroscopic module, which enables reduction in size of the spectroscopic module and easy mass-production of the spectroscopic modules by a wafer process.SOLUTION: A method for manufacturing a spectroscopic module 1 including light transmission parts 2 and 3 which allow transmission of light incident from a surface 2a; a spectroscopic part, which is provided on a convex surface 3a of the light transmission parts 2 and 3, for spectrally separating the light transmitted through the light transmission parts 2 and 3 and reflecting the spectrally separated light rays toward the surface 2a; and a light detection element 7, which is provided on the side of the surface 2a, for detecting the light rays spectrally separated and reflected by the spectroscopic part comprises: a step in which a diffraction layer 4 is formed along the convex surface 3a by disposing a material used for formation of the diffraction layer 4 onto the convex surface 3a and then contacting a mold to the material to cure the material; and a step in which the spectroscopic part is formed by providing a reflective layer 6 onto a surface of the diffraction layer 4.

Description

  The present invention relates to a method for manufacturing a spectroscopic module that spectrally detects and detects light.

  As a conventional spectroscopic module, a block-shaped support that is a biconvex lens is provided, a spectroscopic unit such as a diffraction grating is provided on one convex surface of the support, and light such as a photodiode is provided on the other convex surface side of the support. A device provided with a detection element is known (see, for example, Patent Document 1). In such a spectroscopic module, light incident from the other convex surface side is split by the spectroscopic unit, and the split light is detected by the photodetecting element.

JP-A-4-294223

  By the way, in recent years, it has been required to reduce the size of the spectral module and to easily mass-produce it. However, in the spectroscopic module as described above, a block-shaped support body, which is a biconvex lens, is used as the main body, and thus it is difficult to reduce the size and mass production.

  Accordingly, an object of the present invention is to provide a method of manufacturing a spectral module that can be reduced in size and can be easily mass-produced.

  In order to achieve the above object, a method for manufacturing a spectroscopic module according to the present invention includes a light transmitting portion that transmits light incident from one surface, and a light transmitting portion provided on the other surface of the light transmitting portion. A spectroscopic module comprising: a spectroscopic unit that splits the transmitted light and reflects the light to one surface side; and a photodetection element that is provided on the one surface side and detects light reflected and reflected by the spectroscopic unit. A method of forming a diffraction layer along the other surface by disposing a material for forming the diffraction layer on the other surface, bringing the mold into contact with the material, and curing the material; Forming a spectroscopic portion by forming a reflective layer on the surface of the diffraction layer. The aforementioned material may be a photocurable resin.

  According to the present invention, the spectral module can be reduced in size, and the spectral module can be easily mass-produced.

It is a top view of the spectroscopy module concerning a 1st embodiment. It is sectional drawing along the II-II line shown in FIG. It is a figure which shows the shape of a diffraction grating, (a) shows a blazed grating, (b) shows a binary grating, (c) shows the shape of a holographic grating. It is a figure which shows the glass wafer used when manufacturing a translucent board, (a) is a top view, (b) shows a side view. It is a figure which shows the position of the alignment mark formed in a translucent board, (a) shows the alignment mark of an upper translucent board, (b) shows the alignment mark of a lower translucent board. It is a figure for demonstrating the manufacturing process which forms a lens part, a diffraction layer, and a reflection layer in a translucent board. It is a figure for demonstrating the manufacturing process which forms a lens part, a diffraction layer, and a reflection layer in a translucent board. It is a figure for demonstrating the manufacturing process which forms a lens part, a diffraction layer, and a reflection layer in a translucent board. It is a figure which shows the process of bonding an upper translucent board and a lower translucent board on the basis of an alignment mark. It is sectional drawing corresponding to FIG. 2 which shows the spectroscopy module which concerns on 2nd Embodiment. It is a figure for demonstrating the manufacturing process which forms a grating lens part and a reflection layer in a translucent board. It is a figure for demonstrating the manufacturing process which forms a grating lens part and a reflection layer in a translucent board. It is sectional drawing corresponding to FIG. 2 which shows the spectroscopy module which concerns on 3rd Embodiment. It is sectional drawing corresponding to FIG. 2 which shows the spectroscopy module which concerns on 4th Embodiment. It is sectional drawing corresponding to FIG. 2 which shows the spectroscopy module which concerns on 5th Embodiment.

Hereinafter, a preferred embodiment of a spectroscopic module according to the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.
[First Embodiment]

  As shown in FIGS. 1 and 2, the spectroscopic module 1 includes a rectangular plate-shaped main body 2, a lens unit (spectral unit) 3 provided on the back surface 2 b of the main unit 2, and a curved surface of the lens unit 3. A diffractive layer (spectral part) 4 formed along, a reflective layer (spectral part) 6 formed on the surface of the diffractive layer 4, and a light detection element provided at a substantially central part on the surface 2 a side of the main body 2. 7 and a flexible substrate 8 fixed to the end of the front surface 2a in the longitudinal direction. The spectroscopic module 1 diffracts incident light L1 incident from the surface 2a side into a plurality of diffracted lights L2 by diffracting it by the diffraction layer 4, reflects the diffracted light L2 toward the light detection element 7 by the reflection layer 6, By detecting the diffracted light L2 with the light detecting element 7, the wavelength distribution of the incident light L1, the intensity of the specific wavelength component, and the like are measured.

  The main body 2 is formed by sticking together a rectangular thin plate-like translucent plate 2c and a translucent plate 2d. A light absorbing layer 11 is formed on the surface 2 a of the main body 2, and a wiring 12 is formed on the surface of the light absorbing layer 11. Further, alignment marks 13 and 14 for alignment at the time of manufacturing are formed on the surface of the light absorption layer 11, and an alignment mark 17 (described later) is formed at a position corresponding to the alignment mark 13 on the back surface 2b.

  The light-transmitting plates 2c and 2d are made of a light-transmitting material such as BK7, Pyrex (registered trademark) glass, or quartz, and have the property of causing the incident light L1 and the diffracted light L2 to travel inside. The translucent plate 2c on the surface 2a side preferably has a thickness of 2 mm or less in order to form the light absorption layer 11 and the wiring 12 by a wiring forming process similar to the wafer process.

  In a predetermined region between the translucent plate 2c and the translucent plate 2d, a light absorption film 16 having a property of absorbing light is formed. The light absorption film 16 is made of a laminated film containing black resist, CrO, and CrO, and has a slit 16a for allowing the incident light L1 to pass therethrough and an opening 16b for allowing the diffracted light L2 to pass.

  The light absorption layer 11 has a property of absorbing light and is made of the same material as the light absorption film 16. The surface of the light absorption layer 11 (surface on the wiring 12 side) is a rough surface. The light absorption layer 11 has a slit 11a for allowing incident light L1 from the outside to pass through, and an opening 11b for allowing diffracted light L2 traveling from the translucent plates 2c and 2d toward the light detection element 7 to pass therethrough. Have

  The slit 11 a extends in a direction substantially orthogonal to the longitudinal direction at a position adjacent to the light detection element 7 in the longitudinal direction of the main body 2. The opening 11 b is formed in the substantially central portion of the main body 2 so as to face the light detection surface of the light detection element 7.

  The slit 16a and the opening 16b of the light absorption film 16 are formed so as to face the slit 11a and the opening 11b, respectively. Further, when viewed from the surface 2a side, the slit 16a has a size that surrounds the slit 11a, and the opening 16b has a size that surrounds the opening 11b. According to the slit 16a, it is possible to limit the range in which the incident light L1 is incident on the diffraction layer 4. Even if the incident light L1 travels to an unnecessary portion and reflected light (stray light) is generated at the unnecessary portion, the range through which the light passes is limited by the opening 16b. It is possible to prevent stray light from entering the detection element 7. As described above, the accuracy of the spectroscopic module 1 can be improved.

  The wiring 12 includes a plurality of terminal portions 12a electrically connected to the light detection element 7, a plurality of terminal portions 12b electrically connected to the flexible substrate 8, and a corresponding terminal portion 12a and terminal portion 12b. It is comprised from the wiring part 12c electrically connected. The terminal portion 12a, the terminal portion 12b, and the wiring portion 12c are made of a single layer film of aluminum or gold, or a laminated film such as Ti—Pt—Au, Ti—Ni—Au, or Cr—Au. The terminal portion 12a is disposed so as to surround the edge portion of the opening portion 11b, and the terminal portion 12b is disposed along an end portion in the longitudinal direction of the surface 2a.

  The light detection element 7 is formed in a rectangular thin plate shape, and is disposed on the surface 2a of the main body 2 at a position facing the opening 11b. The photodetecting element 7 is mounted on the surface 2a side of the main body part by flip chip bonding, and a terminal part (not shown) formed on the surface 7a of the photodetecting element 7 and the terminal part 12a are electrically connected. . A light detection surface 7b for receiving the diffracted light L2 that has passed through the opening 11b is formed at a substantially central portion of the surface 7a. For example, a photodiode array, a C-MOS image sensor, or a CCD image sensor is used as the light detection element 7. An underfill resin 5 is filled between the light detection element 7 and the surface 2 a of the main body 2.

  The flexible substrate 8 is a printed circuit board having flexibility, and is connected to the terminal portion 12b by wire bonding.

  The lens unit 3 is provided at a position facing the slit 11 a on the back surface 2 b of the main body unit 2. The lens unit 3 is a lens having a shape close to a hemisphere, and the surface thereof is a convex curved surface 3a having a predetermined curvature. The lens unit 3 is disposed so that the center of curvature of the convex curved surface 3a and the center of the slit 11a substantially overlap.

  The diffraction layer 4 is formed along the convex curved surface 3 a of the lens unit 3. The diffraction layer 4 includes, for example, a blazed grating having a sawtooth cross section as shown in FIG. 3A, a binary grating having a rectangular cross section as shown in FIG. 3B, or as shown in FIG. A type of grating such as a holographic grating having a sinusoidal cross section is used. The light detection surface of the light detection element 7 extends in the direction of dispersion of the diffracted light L2 by the diffraction layer 4. A reflective layer 6 is formed on the surface of the diffraction layer 4 by vapor deposition of aluminum or gold.

  A method for manufacturing the above-described spectral module 1 will be described.

  First, the light absorption layer 11 is patterned so that the pattern of the slit 11a and the opening 11b is formed on the surface of the translucent plate 2c, and at the same time, the wiring 12 and the alignment marks 13 and 14 are patterned on the surface. Such patterning is performed by a wiring formation process similar to the wafer process.

  The light detection element 7 is mounted on the surface of the translucent plate 2c by flip chip bonding. At this time, positioning is performed using the alignment mark 14 as a reference. Thus, since the alignment mark 14 formed in the same process as the slit 11a is used as a reference, the slit 11a and the light detection surface 7b of the light detection element 7 can be positioned with high accuracy.

  Next, the lens part 3, the diffraction layer 4, and the reflective layer 6 are formed on the back surface of the translucent plate 2d. This process is performed by a wafer process in order to enable mass production. That is, as shown in FIGS. 4A and 4B, the glass wafer is provided with a dicing line divided into the size of the translucent plate 2d. Then, as shown in FIG. 5B, the lens mounting portion 15 and the alignment mark 17 are simultaneously formed by a photo etch process for each section.

  The lens mounting portion 15 is formed by providing a circular recess in the translucent plate 2d. The alignment mark 17 is provided at a position facing the alignment mark 13 on the surface 2a side shown in FIG. 5A in the thickness direction when the translucent plate 2c and the translucent plate 2d are bonded together. .

  And it mounts by sticking a small lens to each lens mounting part 15 of a glass wafer with optical resin etc., and, thereby, the lens part 3 is formed. Furthermore, after forming the diffraction layer 4 and the reflective layer 6 in the lens part 3, it divides | segments into each translucent board 2d by dicing along a dicing line.

  Here, with reference to FIGS. 6 to 8, a process of mounting the lens unit 3 and the like on the glass wafer will be described.

  As shown in FIGS. 6A to 6C, the lens mounting portion 15 and the alignment mark 17 are provided by forming a photosensitive resin pattern 19 on the surface of the glass wafer 18. At this time, the lens mounting portion 15 may be formed by etching the glass wafer 18 itself or by patterning a metal film. An optical resin 21 for applying a lens is applied to the lens mounting portion 15 formed as described above.

  Next, as shown in FIGS. 7A and 7B, the lens portion 3 is formed by mounting the lens 22 on the lens mounting portion 15. A photocurable resin 25 for forming the diffraction layer 4 is applied to the curved surface of the mounted lens 22.

  As shown in FIGS. 8A and 8B, a light transmissive mold 24 made of quartz or the like is brought into contact with the applied photocurable resin 25. In this state, UV curing treatment is performed by irradiating the photocurable resin 25 with ultraviolet rays from above the light transmissive mold 24, thereby forming the diffraction layer 4 on the curved surface of the lens 22. Moreover, it is preferable to stabilize the diffraction layer 4 by performing heat curing after the UV curing treatment. After the diffraction layer 4 is formed, the reflective layer 6 is formed by evaporating aluminum or gold on the outer surface thereof. The diffraction layer 4 can be formed of a photosensitive resin or glass, an organic / inorganic hybrid material, a resin or glass that is deformed by heat, an organic / inorganic hybrid material, or the like.

  Here, the curvature radius of the curved surface of the lens 22 is larger than the curvature radius of the diffraction layer 4, and the curvature radius of the diffraction layer 4 reflects the curvature radius of the light transmitting mold 24. Further, the position where the diffraction layer 4 is formed reflects the position where the light transmissive mold 24 abuts.

  Therefore, even when the lens 22 has a tolerance in the radius of curvature or when an error occurs in the mounting position of the lens 22 on the glass wafer 18, the formation position (XYZ direction) of the diffraction layer 4 is made constant. Can do.

  As described above, the translucent plate 2c and the translucent plate 2d provided with the respective components are bonded together. The pasting is performed by sandwiching the light absorption film 16 between the translucent plates 2c and 2d, applying an optical resin, and curing. Further, as shown in FIG. 9, the bonding is performed with reference to the alignment mark 13 of the translucent plate 2c and the alignment mark 17 of the translucent plate 2d. Thereby, the slit 11a, the diffraction layer 4, and the light detection element 7 can be positioned with high accuracy.

  The effect of the spectral module 1 mentioned above is demonstrated.

  In the spectroscopic module 1, since the main body 2 is plate-like, the main body 2 can be reduced in size by being thinned. And since the main-body part 2 is plate-shaped, a spectroscopic module can be manufactured using a wafer process, for example. That is, a large number of spectroscopic modules 1 are provided by providing the lens unit 3, the diffraction layer 4, the reflection layer 6, and the light detection element 7 in a matrix on a glass wafer to be a large number of main body units 2, and dicing the glass wafer. Can be manufactured. In this way, the spectroscopic module 1 can be easily mass-produced.

  Further, since the wiring 12 is formed on the surface 2 a of the main body 2, the external wiring and the light detection element 7 are not directly connected, and the external wiring is connected via the wiring 12 provided on the main body 2. The photodetecting element 7 can be electrically connected. As a result, when the spectroscopic module 1 is handled or connected to an external device, it is possible to prevent local stress from being applied to the photodetecting element 7, so that the spectroscopic module 1 can be downsized. Further, peeling of the light detection element 7 and damage to the spectral module 1 can be prevented. In addition, by directly connecting the light detection element 7 to the wiring 12 provided in the main body 2, the distance between the main body 2 and the light detection surface 7 b of the light detection element 7 can be shortened. The incidence of stray light can be prevented.

  Further, since the light absorption layer 11 that absorbs light is formed between the wiring 12 and the main body 2, the diffracted light L <b> 2 reflected from the reflective layer 6 is irregularly reflected between the wiring 12 and the main body 2. Can be prevented.

  Further, since the surface of the light absorbing layer 11 (the surface on the wiring 12 side) is a rough surface, stray light incident on the light absorbing layer 11 from the main body 2 side temporarily passes through the light absorbing layer 11 and is connected to the main body by the wiring 12. Even when the light is reflected to the part 2 side, stray light can be absorbed, and irregular reflection between the wiring 12 and the main body part 2 can be further prevented.

  Furthermore, peeling of the wiring 12 formed on the surface of the light absorbing layer 11 is prevented by making the surface of the light absorbing layer 11 (the surface on the wiring 12 side) rough.

  In addition, since the flexible substrate 8 and the light detection element 7 can be electrically connected via the wiring 12 provided in the main body 2 without being directly connected, it is possible to suppress stress on the light detection element 7. can do. Thereby, even when the spectral module 1 is downsized, it is possible to prevent the light detection element 7 from being peeled off and the spectral module 1 from being damaged.

  Further, since the main body 2 has the laminated light-transmitting plates 2c and 2d, the process of mounting the light detecting element 7 on the surface of the light-transmitting plate 2c, the lens portion 3, the diffraction layer 4, and the reflection The spectroscopic module 1 can be manufactured by a process of mounting a spectroscopic portion such as the layer 6 on the back surface of the translucent plate 2d and a process of bonding the translucent plates 2c and 2d. That is, for example, the process of mounting the light detection element 7 and the spectroscopic unit on the glass wafer can be divided into processes that are performed only from one side of each glass wafer, rather than from both sides. Thereby, the manufacturing process of the spectroscopic module 1 can be optimized for the wafer process, and mass production can be performed more easily.

In addition, since the light absorption film 16 provided between the translucent plates 2c and 2d can absorb the stray light traveling in the main body 2, the stray light incident on the light detection element 7 can be absorbed. It is possible to reduce noise.
[Second Embodiment]

  The spectroscopic module 31 according to the second embodiment is mainly different from the spectroscopic module 1 according to the first embodiment in that the lens unit 3 and the diffraction layer 4 are integrally formed.

  That is, in the spectroscopic module 31 according to the second embodiment, as shown in FIG. 10, the diffraction layer portion 23a is placed on the back surface 2b of the main body portion 2 at a position facing the slit 11a, and the convex curved surface 23c of the lens portion 23b. A grating lens portion 23 integrally provided on the top is provided.

  Next, the manufacturing method of the grating lens part 23 is demonstrated with reference to FIG.11 and FIG.12.

  As shown in FIGS. 11A to 11C, the grating lens mounting portion 26 and the alignment mark 17 are provided by forming a photosensitive resin pattern 29 on the surface of the glass wafer 18. At this time, the grating lens mounting portion 26 may be formed by etching the glass wafer 18 itself or by patterning a metal film. A photocurable resin 33 for forming the grating lens portion 23 is applied to the grating lens mounting portion 26.

  As shown in FIGS. 12A and 12B, a light transmissive mold 34 made of quartz or the like is brought into contact with the applied photocurable resin 33. In this state, UV curing treatment is performed by irradiating the photocurable resin 33 with ultraviolet rays from above the light transmissive mold 34 to form the grating lens portion 23. Moreover, it is preferable to stabilize the grating lens part 23 by performing heat curing after the UV curing treatment. After forming the grating lens portion 23, the reflective layer 6 is formed by evaporating aluminum or gold on the outer surface thereof. The grating lens portion 23 can be formed of a photosensitive resin or glass, an organic / inorganic hybrid material, a resin or glass that is deformed by heat, an organic / inorganic hybrid material, or the like.

Since the spectroscopic module 31 according to the second embodiment can form the lens portion and the diffractive layer with an integral mold, the lens portion and the diffractive layer can be formed with high positional accuracy and manufactured. The process can be shortened.
[Third Embodiment]

  The spectral module 41 according to the third embodiment is different from the spectral module 1 according to the first embodiment in that the light absorption film 16 is not formed between the translucent plate 2c and the translucent plate 2d. Is different.

That is, in the spectral module 41 according to the third embodiment, as shown in FIG. 13, the translucent plate 2c and the translucent plate 2d are directly bonded by optical resin or direct bonding.
[Fourth Embodiment]

  The spectroscopic module 51 according to the fourth embodiment is mainly different from the spectroscopic module 1 according to the first embodiment in that the main body 52 is formed of a single translucent plate.

That is, in the spectroscopic module 51 according to the fourth embodiment, as shown in FIG. 14, the main body 52 is composed of a translucent plate 52 a and the light absorption layer 11 and the wiring layer 12 formed on the surface 52 b. It is configured.
[Fifth Embodiment]

  The spectral module 61 according to the fifth embodiment is mainly different from the fourth embodiment in that a light absorption layer 64 is formed on the wiring 63.

  That is, in the spectroscopic module 61 according to the fifth embodiment, as shown in FIG. 15, the wiring 63 is formed on the surface 65a of the translucent plate 65, and the light absorption layer 64 is formed thereon. In addition to the slit 64 a and the opening 64 b, the light absorption layer 64 is formed with an opening 64 c for exposing the terminal portion 63 a and the terminal portion 63 b in the wiring layer 63 from the light absorption layer 64.

  In the spectroscopic module 61 according to the fifth embodiment, since the wiring 63 having high adhesion to the light transmitting member is directly formed on the light transmitting plate 65, the strength of the wiring 63 can be improved.

  The present invention is not limited to the embodiment described above. For example, in this embodiment, the slit is formed in the light absorption layer, but may be provided by forming a slit in the light detection element. Thereby, since the slit and the light detection element are manufactured by the same process, the positional accuracy of the slit and the light detection surface can be improved. Note that the slit to the photodetecting element can be formed by wet etching using alkali, silicon deep dry etching, or a composite technique thereof.

  A spectroscopic module according to another embodiment is provided on a plate-like main body portion that transmits light incident from one surface and the other surface side of the main body portion, and splits the light transmitted through the main body portion to one surface. And a photodetecting element that is provided on one surface side and that detects the light that is split and reflected by the spectroscopic unit.

  In this spectroscopic module, since the main body is plate-shaped, it is possible to reduce the size by reducing the thickness of the main body. And since a main-body part is plate shape, a spectroscopic module can be manufactured using a wafer process, for example. That is, a large number of spectroscopic modules can be manufactured by providing a plurality of spectroscopic units and photodetecting elements in a matrix and dicing the wafer as a large number of main body units. In this way, the spectroscopic module can be easily mass-produced.

  In a spectroscopic module according to another embodiment, it is preferable that a wiring electrically connected to the light detection element is provided on one surface side. According to such a configuration, the external wiring and the light detection element can be electrically connected via the wiring provided in the main body portion without directly connecting the external wiring and the light detection element. . This prevents local stress from being applied to the photodetection element when handling the spectroscopic module or connecting to an external device, so that even if the spectroscopic module is downsized, photodetection is possible. It is possible to prevent element peeling and damage to the spectral module. In addition, by directly connecting the light detection element to the wiring provided in the main body, the distance between the main body and the light detection element is shortened, so that attenuation of light reflected and reflected by the spectroscopic part or stray light Incident can be prevented.

  In the spectroscopic module according to another embodiment, it is preferable that a light absorption layer for absorbing light is provided between one surface and the wiring. According to such a configuration, it is possible to prevent light reflected and reflected by the spectroscopic unit from being diffusely reflected between the wiring and the main body unit and entering the light detection element.

  In the spectroscopic module according to another embodiment, it is preferable that the surface of the light absorbing layer (surface on the wiring side) is a rough surface. According to such a configuration, it is possible to further prevent the irregularly reflected light between the wiring and the main body from entering the light detection element.

  In the spectral module according to another embodiment, it is preferable that a flexible substrate electrically connected to the wiring is provided on one surface side. When a flexible substrate is directly connected to the photodetecting element, local stress is likely to be applied to the photodetecting element, particularly when the spectroscopic module is miniaturized. However, according to such a configuration, since the flexible substrate and the light detection element can be electrically connected via the wiring provided in the main body, it is possible to suppress stress on the light detection element. be able to. Thereby, even when the spectral module is downsized, it is possible to prevent the photodetection element from being peeled off and the spectral module from being damaged.

  In the spectroscopic module according to another aspect, it is preferable that the main body has at least two light-transmitting plates stacked. According to such a configuration, the process of mounting the light detection element on one light-transmitting plate, the process of mounting the spectroscopic unit on the other light-transmitting plate, and the process of bonding these light-transmitting plates A spectral module can be manufactured. That is, for example, the process of mounting the light detection element and the spectroscopic unit on the wafer can be divided into processes that are performed only from one side of the wafer, rather than from both sides. Thereby, the manufacturing process of the spectroscopic module can be optimized for the wafer process, and mass production can be performed more easily.

  In a spectroscopic module according to another embodiment, it is preferable that a light absorbing film that absorbs light is provided in a predetermined region between adjacent translucent plates (stacked translucent plates). . According to such a configuration, stray light traveling in the main body can be absorbed by the light absorption film, so that stray light incident on the light detection element can be reduced and noise can be reduced.

  DESCRIPTION OF SYMBOLS 1 ... Spectroscopic module, 2 ... Main-body part, 2c, 2d ... Translucent board, 3 ... Lens part, 4 ... Diffraction layer (spectral part), 6 ... Reflection layer (spectral part), 7 ... Photodetection element.

Claims (2)

A light transmitting portion that transmits light incident from one surface;
A spectroscopic unit that is provided on the other surface of the light transmission unit and that splits the light transmitted through the light transmission unit and reflects the light to the one surface side;
A photodetecting element that is provided on the one surface side and detects light reflected and reflected by the spectroscopic unit;
Disposing a material for forming a diffraction layer on the other surface, bringing a mold into contact with the material, and curing the material, thereby forming the diffraction layer along the other surface; ,
Forming a spectroscopic part by forming a reflective layer on the surface of the diffraction layer.   The method for manufacturing a spectral module according to claim 1, wherein the material is a photocurable resin.

Images