JP2012167167A - Curable resin composition, cured product thereof, resin composition for printed wiring board, printed wiring board, resin composition for flexible wiring board, resin composition for semiconductor sealing material and resin composition for interlayer insulation material for build-up substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curable resin composition that exhibits excellent flame retardancy and excellent heat resistance in a cured product thereof, to provide a cured product of the curable resin composition, and to provide a resin composition for a printed wiring board, a printed wiring board, a resin composition for a flexible wiring board, a resin composition for a semiconductor sealing material and a resin composition for an interlayer insulation material for a build-up substrate each using the curable resin composition.SOLUTION: The curable resin composition includes, as essential components, (A) an epoxy resin, (B) a curing agent and (C) a phosphorus atom-containing compound represented by structural formula (1) (wherein Xand Xare each independently a hydrogen atom or a hydroxy group; and A is a hydrogen atom or a hydroxy group, provided that at least either one of Xand Xis a hydroxy group).

Description

  The present invention relates to a curable resin composition excellent in flame retardancy and heat resistance, a cured product thereof, a printed wiring board resin composition using the curable resin composition, a printed wiring board, and a flexible wiring board resin. The present invention relates to a composition, a resin composition for a semiconductor sealing material, and a resin composition for an interlayer insulating material for a build-up substrate.

  Epoxy resin compositions containing an epoxy resin and its curing agent as essential components are excellent in various physical properties such as high heat resistance and moisture resistance, and are used in the field of electronic components such as semiconductor sealing materials and printed circuit boards, and conductive materials such as conductive pastes. Widely used in adhesives, other adhesives, matrix for composite materials, paints, photoresist materials, developer materials, etc.

  In recent years, in the fields of electronic parts such as printed wiring board materials and semiconductor encapsulants and conductive adhesives, halogen-based flame retardants such as bromine are blended together with antimony compounds in order to impart flame retardancy. However, in recent environmental and safety initiatives, environmentally and flame-resistant flame retardants that do not use halogen-based flame retardants that may cause dioxins and do not use antimony compounds that are suspected of carcinogenicity. There is a strong demand for the development of a conversion method. In the field of printed wiring board materials, the use of halogenated flame retardants is a factor that impairs reliability at high temperatures.

  As an epoxy resin composition that meets such required characteristics and has both flame retardancy and high heat resistance, for example, Patent Document 1 listed below includes 9,10-dihydro-9-oxa-10-phosphaphenanthrene- A technique in which 10-oxide (hereinafter abbreviated as “HCA”) is blended is disclosed (see Patent Document 1 below).

  However, in the field of electronic components and conductive adhesives described above, there is a demand for materials with higher heat resistance than ever, such as higher reflow processing temperatures due to the compatibility with lead-free solder. The epoxy resin composition containing HCA has good flame retardancy, but its heat resistance in the cured product is not sufficient, and in particular, it has high temperature storage reliability in the field of printed wiring board materials. It was a loss.

Japanese Patent Publication No. 6-17453

  Accordingly, the problems to be solved by the present invention are a curable resin composition excellent in flame retardancy and heat resistance in a cured product, the cured product, and a resin composition for a printed wiring board using the curable resin composition. It is providing the resin composition for printed circuit boards, the resin composition for flexible wiring boards, the resin composition for semiconductor sealing materials, and the interlayer insulation material for buildup boards.

  As a result of intensive studies to solve the above problems, the present inventors have determined that a phosphorus atom-containing compound having an aromatic nucleus has a hydroxyl group as a substituent on the aromatic nucleus as an additive flame retardant in the epoxy resin composition. When used, the cured product was found to have flame retardancy and excellent heat resistance, and the present invention was completed.

  That is, the present invention includes an epoxy resin (A), a curing agent (B), and the following structural formula (1).

（式中、Ｘ^１及びＸ^２は、それぞれ独立的に水素原子又は水酸基であり、Ａは水素原子又は水酸基である。）で表されるリン原子含有化合物（Ｃ）を必須成分とすることを特徴とする硬化性樹脂組成物に関する。

(Wherein, X ¹ and X ² are each independently a hydrogen atom or a hydroxyl group, and A is a hydrogen atom or a hydroxyl group). The phosphorus atom-containing compound (C) represented by The present invention relates to a curable resin composition.

  The present invention further relates to a cured product obtained by curing the curable resin composition.

  The present invention further relates to a printed wiring board resin composition comprising the curable resin composition.

  The present invention further relates to a resin composition for a flexible wiring board comprising the curable resin composition.

  The present invention further relates to a printed wiring board obtained by impregnating a glass substrate with the curable resin composition and then curing the glass substrate.

  The present invention further relates to a resin composition for a semiconductor sealing material further containing an inorganic filler in addition to the curable resin composition.

  The present invention further relates to a resin composition for an interlayer insulating material for build-up substrates, comprising the curable resin composition.

  According to the present invention, a curable resin composition excellent in flame retardancy and heat resistance in a cured product, the cured product, and a resin composition for a printed wiring board using the curable resin composition, a printed wiring board, The resin composition for flexible wiring boards, the resin composition for semiconductor sealing materials, and the resin composition for interlayer insulation materials for buildup boards can be provided.

  Hereinafter, the present invention will be described in detail.

  As described above, the phosphorus atom-containing compound (C) used in the curable resin composition of the present invention has the following structural formula (1).

（式中、Ｘ^１及びＸ^２は、それぞれ独立的に水素原子又は水酸基であり、Ａは水素原子又は水酸基である。但し、Ｘ^１及びＸ^２の少なくとも一方は水酸基である。）で表されるものであり、具体的には、下記構造式ａ１〜ａ６のものが挙げられる。

(Wherein, X ¹ and X ² are each independently a hydrogen atom or a hydroxyl group, and A is a hydrogen atom or a hydroxyl group, provided that at least one of X ¹ and X ² is a hydroxyl group). Specifically, those of the following structural formulas a1 to a6 can be mentioned.

  In the present invention, among these, those represented by the structural formula a1, a2, or a3 are particularly excellent in solvent solubility and more remarkably excellent in heat resistance in the cured product of the curable resin composition. Is preferred.

The phosphorus atom-containing compound (C) described above can be produced, for example, by the following method.
For example, when the compound a1 is produced, it can be produced according to the following reaction method 1 using phenylhydroquinone as a raw material and phosphorus trichloride as a reaction catalyst. Further, when the compound a2 is produced, it can be produced according to the following reaction method 2 using dihydroxybiphenyl as a raw material and phosphorus trichloride as a reaction catalyst. Similarly, when producing the compound a3, It can be produced according to the following reaction method 3 using phenylhydroquinone as a raw material and phosphorus trichloride as a reaction catalyst.

  In the present invention, the proportion of the phosphorus atom-containing compound (C) is preferably in the range of 5 to 30% by mass based on the total mass of (A) to (C). It is preferable from the point which is excellent in the flame retardance of hardened | cured material that it is a ratio from which the mass ratio (phosphorus content) of a phosphorus atom will be 1.0-4.0 mass% on the basis of the total mass of-(C). Of these, a ratio of 1.0 to 3.0% by mass is preferable from the viewpoint of excellent heat resistance. Here, the mass proportion of the phosphorus atom is specifically determined based on “JIS K0102-46” by measuring the phosphorus content in the phosphorus atom-containing compound (C), and the total of (A) to (C). It is the value which calculated the mass of the phosphorus atom in mass.

  Next, as the epoxy resin (A) used in the curable resin composition of the present invention, various epoxy resins can be used. For example, bisphenol type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin. Biphenyl type epoxy resins such as biphenyl type epoxy resins and tetramethyl biphenyl type epoxy resins; phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol A novolac type epoxy resins, phenolic compounds and aromatic aldehydes having phenolic hydroxyl groups; Epoxy products of condensates, novolac epoxy resins such as biphenol novolac epoxy resins; triphenylmethane epoxy resins; tetraphenylethane epoxy resins; dicyclopentadiene-fe Addition reaction type epoxy resin; phenol aralkyl type epoxy resin; naphthol novolak type epoxy resin, naphthol aralkyl type epoxy resin, naphthol-phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, diglycidyloxynaphthalene An epoxy resin having a naphthalene skeleton in a molecular structure such as 1,1-bis (2,7-diglycidyloxy-1-naphthyl) alkane; a phosphorus atom-containing epoxy resin, and the like. Moreover, these epoxy resins may be used independently and may mix 2 or more types.

  Here, as the phosphorus atom-containing epoxy resin, an epoxidized product of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (hereinafter abbreviated as “HCA”), HCA and a quinone compound Epoxy product of phenol resin obtained by reacting phenolic resin, epoxy resin obtained by modifying phenol novolac type epoxy resin with HCA, epoxy resin obtained by modifying cresol novolac type epoxy resin with HCA, and bisphenol A type epoxy resin using HCA and quinone An epoxy resin obtained by modifying with a phenol resin obtained by reacting with a compound, an epoxy resin obtained by modifying a bisphenol F type epoxy resin with a phenol resin obtained by reacting HCA and quinones, and the like Can be mentioned.

  Among the above-mentioned epoxy resins (A), novolak-type epoxy resins and epoxy resins having a naphthalene skeleton are preferable in the molecular structure particularly from the viewpoint of heat resistance, and bisphenol-type epoxy resins and novolaks from the viewpoint of solvent solubility. Type epoxy resin is preferred.

Examples of the curing agent (B) used in the curable resin composition of the present invention include amine compounds, amide compounds, acid anhydride compounds, phenol compounds, and the like. Specifically, examples of the amine compound include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF ₃ -amine complex, and guanidine derivative. Examples of the amide compound include dicyandiamide. And polyamide resins synthesized from dimer of linolenic acid and ethylenediamine. Examples of acid anhydride compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, and tetrahydrophthalic anhydride. Acid, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, etc., and phenolic compounds include phenol novolac resin, cresol novolac resin Aromatic hydrocarbon formaldehyde resin modified phenolic resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin (Zyloc resin), naphthol aralkyl resin, trimethylol methane resin, tetraphenylol ethane resin, naphthol novolak resin, naphthol-phenol co-condensation Novolac resin, naphthol-cresol co-condensed novolak resin, biphenyl-modified phenol resin (polyhydric phenol compound with phenol nucleus linked by bismethylene group), biphenyl-modified naphthol resin (polyvalent naphthol compound with phenol nucleus linked by bismethylene group) , Polyhydric phenols such as alkoxy group-containing aromatic ring-modified novolak resins (polyhydric phenol compounds in which a phenol nucleus and an alkoxy group-containing aromatic ring are linked with formaldehyde) Compounds.

  Among these, those containing a large amount of an aromatic skeleton in the molecular structure are preferred from the viewpoint of low thermal expansion, and specifically, phenol novolac resins, cresol novolac resins, aromatic hydrocarbon formaldehyde resin-modified phenol resins, phenol aralkyls. Resin, naphthol aralkyl resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol-cresol co-condensed novolak resin, biphenyl-modified phenol resin, biphenyl-modified naphthol resin, alkoxy group-containing aromatic ring-modified novolak resin (formaldehyde with phenol nucleus and A polyhydric phenol compound in which an alkoxy group-containing aromatic ring is linked is preferred because of its low thermal expansion.

  The blending ratio of the epoxy resin (A) and the curing agent (B) in the curable resin composition of the present invention is as described above, with respect to a total of 1 equivalent of the epoxy groups of the epoxy resin (A), the curing agent (B). It is preferable that the ratio of the active hydrogen or acid anhydride group is 0.7 to 1.5 equivalents.

  Moreover, a hardening accelerator (D) can also be suitably used together with the curable resin composition of this invention as needed. Various curing accelerators (D) can be used, and examples thereof include phosphorus compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, and amine complex salts. In particular, when used as a semiconductor sealing material, it is excellent in curability, heat resistance, electrical characteristics, moisture resistance reliability, etc., so that triphenylphosphine is used for phosphorus compounds and 2-ethyl 4-methyl is used for amine compounds. Imidazole is preferred.

  The curable resin composition of the present invention described in detail above preferably contains an organic solvent (E) in addition to the above components. Examples of the organic solvent (E) that can be used here include methyl ethyl ketone, acetone, dimethylformamide, methyl isobutyl ketone, methoxypropanol, cyclohexanone, methyl cellosolve, ethyl diglycol acetate, propylene glycol monomethyl ether acetate, etc. The proper amount used can be appropriately selected depending on the application, but for example, in a printed wiring board application, it is preferable to use a polar solvent having a boiling point of 160 ° C. or lower, such as methyl ethyl ketone, acetone, 1-methoxy-2-propanol, etc. The non-volatile content is preferably 40 to 80% by mass. On the other hand, in build-up adhesive film applications, examples of organic solvents (E) include ketones such as acetone, methyl ethyl ketone, and cyclohexanone, acetic acid such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate. Esters, carbitols such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc. are preferably used, and non-volatile content is 30 to 60 mass. It is preferable to use it in the ratio which becomes%.

  The thermosetting resin composition is a non-halogen flame retardant that substantially does not contain a halogen atom in order to exert flame retardancy, for example, in the field of printed wiring boards, as long as the reliability is not lowered. May be blended.

  Examples of the non-halogen flame retardants include nitrogen flame retardants, silicone flame retardants, inorganic flame retardants, organometallic salt flame retardants, and the like, and are not limited in any way. Even if it uses independently, multiple flame retardants of the same system may be used, and it is also possible to use a combination of flame retardants of different systems.

  Examples of the nitrogen-based flame retardant include triazine compounds, cyanuric acid compounds, isocyanuric acid compounds, phenothiazines, and the like, and triazine compounds, cyanuric acid compounds, and isocyanuric acid compounds are preferable.

  Examples of the triazine compound include melamine, acetoguanamine, benzoguanamine, melon, melam, succinoguanamine, ethylene dimelamine, melamine polyphosphate, triguanamine, and the like, for example, guanylmelamine sulfate, melem sulfate, melam sulfate, etc. Examples thereof include an aminotriazine sulfate compound, aminotriazine-modified phenol resin, and aminotriazine-modified phenol resin further modified with tung oil, isomerized linseed oil, and the like.

  Specific examples of the cyanuric acid compound include cyanuric acid and cyanuric acid melamine.

  The compounding amount of the nitrogen-based flame retardant is appropriately selected according to the type of the nitrogen-based flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. For example, an epoxy resin, It is preferable to mix in the range of 0.05 to 10 parts by mass in 100 parts by mass of the curable resin composition containing all of the curing agent, non-halogen flame retardant and other fillers and additives. It is preferable to mix | blend in the range of 1-5 mass parts.

  Moreover, when using the said nitrogen-type flame retardant, you may use together a metal hydroxide, a molybdenum compound, etc.

  The silicone flame retardant is not particularly limited as long as it is an organic compound containing a silicon atom, and examples thereof include silicone oil, silicone rubber, and silicone resin.

  The amount of the silicone-based flame retardant is appropriately selected depending on the type of the silicone-based flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. For example, an epoxy resin, It is preferable to mix in the range of 0.05 to 20 parts by mass in 100 parts by mass of the curable resin composition containing all of the curing agent, non-halogen flame retardant and other fillers and additives. Moreover, when using the said silicone type flame retardant, you may use a molybdenum compound, an alumina, etc. together.

  Examples of the inorganic flame retardant include metal hydroxide, metal oxide, metal carbonate compound, metal powder, boron compound, and low melting point glass.

  Specific examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, zirconium hydroxide and the like.

  Specific examples of the metal oxide include, for example, zinc molybdate, molybdenum trioxide, zinc stannate, tin oxide, aluminum oxide, iron oxide, titanium oxide, manganese oxide, zirconium oxide, zinc oxide, molybdenum oxide, and cobalt oxide. Bismuth oxide, chromium oxide, nickel oxide, copper oxide, tungsten oxide and the like.

  Specific examples of the metal carbonate compound include zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, basic magnesium carbonate, aluminum carbonate, iron carbonate, cobalt carbonate, and titanium carbonate.

  Specific examples of the metal powder include aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, and tin.

  Specific examples of the boron compound include zinc borate, zinc metaborate, barium metaborate, boric acid, and borax.

Specific examples of the low-melting-point glass include, for example, Ceeley (Bokusui Brown), hydrated glass SiO ₂ —MgO—H ₂ O, PbO—B ₂ O ₃ system, ZnO—P ₂ O ₅ —MgO system, P ₂ O ₅ —B ₂ O ₃ —PbO—MgO, P—Sn—O—F, PbO—V ₂ O ₅ —TeO ₂ , Al ₂ O ₃ —H ₂ O, lead borosilicate, etc. The glassy compound can be mentioned.

  The amount of the inorganic flame retardant is appropriately selected depending on the type of the inorganic flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. For example, an epoxy resin, It is preferable to mix in the range of 0.05 to 20 parts by mass in 100 parts by mass of the curable resin composition containing all of the curing agent, non-halogen flame retardant and other fillers and additives. It is preferable to mix | blend in 5-15 mass parts.

  Examples of the organic metal salt flame retardant include ferrocene, acetylacetonate metal complex, organic metal carbonyl compound, organic cobalt salt compound, organic sulfonic acid metal salt, metal atom and aromatic compound or heterocyclic compound or an ionic bond or Examples thereof include a coordinated compound.

  The amount of the organic metal salt flame retardant is appropriately selected depending on the type of the organic metal salt flame retardant, the other components of the curable resin composition, and the desired degree of flame retardancy. In 100 parts by mass of the curable resin composition in which all of epoxy resin, curing agent, non-halogen flame retardant and other fillers and additives are blended, it is preferably blended in the range of 0.005 to 10 parts by mass. .

  An inorganic filler can be mix | blended with the curable resin composition of this invention as needed. Examples of the inorganic filler include fused silica, crystalline silica, alumina, silicon nitride, and aluminum hydroxide. When particularly increasing the blending amount of the inorganic filler, it is preferable to use fused silica. The fused silica can be used in either a crushed shape or a spherical shape. However, in order to increase the blending amount of the fused silica and suppress an increase in the melt viscosity of the molding material, it is preferable to mainly use a spherical shape. In order to further increase the blending amount of the spherical silica, it is preferable to appropriately adjust the particle size distribution of the spherical silica. The filling rate is preferably higher in consideration of flame retardancy, and particularly preferably 20% by mass or more with respect to the total amount of the curable resin composition. Moreover, when using for uses, such as an electrically conductive paste, electroconductive fillers, such as silver powder and copper powder, can be used.

  Various compounding agents, such as a silane coupling agent, a mold release agent, a pigment, an emulsifier, can be added to the curable resin composition of this invention as needed.

  The curable resin composition of the present invention can be obtained by uniformly mixing the above-described components. The curable resin composition of the present invention in which the epoxy resin of the present invention, a curing agent, and further, if necessary, a curing accelerator are blended can be easily made into a cured product by a method similar to a conventionally known method. Examples of the cured product include molded cured products such as laminates, cast products, adhesive layers, coating films, and films.

  Applications for use of the curable resin composition of the present invention include printed wiring board materials, resin compositions for flexible wiring boards, interlayer insulating materials for build-up boards, semiconductor sealing materials, conductive pastes, and adhesive films for build-ups Resin casting materials, adhesives, and the like. Among these various applications, in printed circuit boards, insulating materials for electronic circuit boards, and adhesive films for build-up, passive parts such as capacitors and active parts such as IC chips are embedded in so-called electronic parts. It can be used as an insulating material for a substrate. Among these, from the characteristics such as high flame retardancy, high heat resistance, low thermal expansibility, and solvent solubility, it is preferably used for a resin composition for a flexible wiring board, an interlayer insulating material for a build-up board, and a semiconductor sealing material. .

  Here, in order to produce a printed circuit board from the curable resin composition of the present invention, the varnish-like curable resin composition containing the organic solvent (E) is further blended with the organic solvent (E) to obtain a varnish. A method of impregnating a reinforced resin composition into a reinforcing base material and stacking a copper foil to heat-press is mentioned. Examples of the reinforcing substrate that can be used here include paper, glass cloth, glass nonwoven fabric, aramid paper, aramid cloth, glass mat, and glass roving cloth. If this method is described in further detail, first, the varnish-like curable resin composition is heated at a heating temperature corresponding to the solvent type used, preferably 50 to 170 ° C., thereby being a prepreg which is a cured product. Get. The mass ratio of the resin composition and the reinforcing substrate used at this time is not particularly limited, but it is usually preferable that the resin content in the prepreg is 20 to 60% by mass. Next, the prepreg obtained as described above is laminated by a conventional method, and a copper foil is appropriately stacked, and then subjected to thermocompression bonding at a pressure of 1 to 10 MPa at 170 to 250 ° C. for 10 minutes to 3 hours, A desired printed circuit board can be obtained.

  In order to produce a flexible wiring board from the curable resin composition of the present invention, the epoxy resin (A), the curing agent (B), the phosphorus atom-containing compound (C), the curing accelerator (D), and an organic solvent are used. (E) is blended and applied to the electrically insulating film using a coating machine such as a reverse roll coater or a comma coater. Subsequently, it heats at 60-170 degreeC for 1 to 15 minutes using a heating machine, volatilizes a solvent, and B-stages an adhesive composition. Next, the metal foil is thermocompression bonded to the adhesive using a heating roll or the like. At that time, the pressure is preferably 2 to 200 N / cm and the pressure is preferably 40 to 200 ° C. If sufficient adhesive performance can be obtained, the process may be completed here. However, when complete curing is required, it is preferably post-cured at 100 to 200 ° C. for 1 to 24 hours. The thickness of the adhesive composition film after finally curing is preferably in the range of 5 to 100 μm.

  In order to adjust the semiconductor sealing material from the curable resin composition of the present invention, the epoxy resin (A), the curing agent (B ), Phosphorus atom-containing compound (C), curing accelerator (D), and compounding agents such as inorganic fillers, if necessary, using an extruder, kneader, roll, etc., until they are uniform. It can be obtained by melt mixing. At that time, silica is usually used as the inorganic filler, and the filling rate is preferably in the range of 30 to 95% by mass of the filler per 100 parts by mass of the epoxy resin composition. 70 parts by mass or more is particularly preferable in order to improve the moisture resistance and solder crack resistance and decrease the linear expansion coefficient, and 80 parts by mass or more is more effective in order to significantly increase these effects. Can be increased. For semiconductor package molding, the composition is molded by casting, using a transfer molding machine, an injection molding machine or the like, and further heated at 50 to 200 ° C. for 2 to 10 hours to form a semiconductor device which is a molded product. There is a way to get

  As a method for obtaining an interlayer insulating material for a build-up substrate from the curable resin composition of the present invention, for example, the curable resin composition appropriately blended with rubber, filler, etc., spray coating method on a wiring board on which a circuit is formed, After applying using a curtain coating method or the like, it is cured. Then, after drilling a predetermined through-hole part etc. as needed, it treats with a roughening agent, forms the unevenness | corrugation by washing the surface with hot water, and metal-treats, such as copper. As the plating method, electroless plating or electrolytic plating treatment is preferable, and examples of the roughening agent include an oxidizing agent, an alkali, and an organic solvent. Such operations are sequentially repeated as desired, and a build-up base can be obtained by alternately building up and forming the resin insulating layer and the conductor layer having a predetermined circuit pattern. However, the through-hole portion is formed after the outermost resin insulating layer is formed. In addition, a resin-coated copper foil obtained by semi-curing the resin composition on the copper foil is thermocompression-bonded at 170 to 250 ° C. on a circuit board on which a circuit is formed, thereby forming a roughened surface and plating treatment. It is also possible to produce a build-up substrate by omitting the process.

  The method for producing an adhesive film for buildup from the curable resin composition of the present invention is, for example, a multilayer printed wiring board in which the curable resin composition of the present invention is applied on a support film to form a resin composition layer. And an adhesive film for use.

  When the curable resin composition of the present invention is used for a build-up adhesive film, the adhesive film is softened under the temperature condition of the laminate in the vacuum laminating method (usually 70 ° C. to 140 ° C.), and simultaneously with the lamination of the circuit board, It is important to show fluidity (resin flow) that allows resin filling in via holes or through holes present in a circuit board, and it is preferable to blend the above-described components so as to exhibit such characteristics.

  Here, the diameter of the through hole of the multilayer printed wiring board is usually 0.1 to 0.5 mm, and the depth is usually 0.1 to 1.2 mm. It is usually preferable to allow resin filling in this range. When laminating both surfaces of the circuit board, it is desirable to fill about 1/2 of the through hole.

  Specifically, the method for producing the adhesive film described above is, after preparing the varnish-like curable resin composition of the present invention, coating the varnish-like composition on the surface of the support film, further heating, Or it can manufacture by drying an organic solvent by hot air spraying etc. and forming the layer ((alpha)) of a curable resin composition.

  The thickness of the formed layer (α) is usually not less than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the thickness of the resin composition layer is preferably 10 to 100 μm.

  In addition, the said layer ((alpha)) may be protected with the protective film mentioned later. By protecting with a protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches.

  The above-mentioned support film and protective film are made of polyolefin such as polyethylene, polypropylene and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyester such as polyethylene naphthalate, polycarbonate, polyimide, and further. Examples thereof include metal foil such as pattern paper, copper foil, and aluminum foil. In addition, the support film and the protective film may be subjected to a release treatment in addition to the mud treatment and the corona treatment.

  Although the thickness of a support film is not specifically limited, Usually, it is 10-150 micrometers, Preferably it is used in 25-50 micrometers. Moreover, it is preferable that the thickness of a protective film shall be 1-40 micrometers.

  The above support film is peeled off after being laminated on a circuit board or after forming an insulating layer by heat curing. If the support film is peeled after the adhesive film is heat-cured, adhesion of dust and the like in the curing process can be prevented. In the case of peeling after curing, the support film is usually subjected to a release treatment in advance.

  Next, the method for producing a multilayer printed wiring board using the adhesive film obtained as described above is, for example, when the layer (α) is protected with a protective film, Lamination is performed on one or both sides of the circuit board by, for example, vacuum laminating so that α) is in direct contact with the circuit board. The laminating method may be a batch method or a continuous method using a roll. Further, the adhesive film and the circuit board may be heated (preheated) as necessary before lamination.

The laminating conditions are preferably a pressure bonding temperature (laminating temperature) of 70 to 140 ° C., a pressure bonding pressure of preferably 1 to 11 kgf / cm ² (9.8 × 10 ^{4 to} 107.9 × 10 ⁴ N / m 2), Lamination is preferably performed under reduced pressure with an air pressure of 20 mmHg (26.7 hPa) or less.

  When the curable resin composition of the present invention is used as a conductive paste, for example, a method of dispersing fine conductive particles in the curable resin composition to obtain a composition for anisotropic conductive film, liquid at room temperature And a paste resin composition for circuit connection and an anisotropic conductive adhesive.

  The method for obtaining the cured product of the present invention may be based on a general curing method for a curable resin composition, but for example, the heating temperature condition may be appropriately selected depending on the kind of curing agent to be combined and the use. However, what is necessary is just to heat the composition obtained by the said method in the temperature range of about room temperature-250 degreeC.

  Therefore, by using this phenol resin, the solvent solubility is dramatically improved compared to the conventional phenol resin modified with phosphorus, and when it is made into a cured product, flame retardancy, heat resistance and heat reliability can be expressed. Applicable to the most advanced printed wiring board materials. In addition, the phenol resin can be easily and efficiently produced by the production method of the present invention, and a molecular design corresponding to the target level of performance described above becomes possible.

  Next, the present invention will be specifically described with reference to examples and comparative examples.

Synthesis Example 1 (Synthesis of phosphorus atom-containing compound (P1))
A dry flask equipped with a condenser and a nitrogen introducing tube was charged with 78 ml of liquid phosphorus trichloride and 80 g (0.43 mol) of benzoquinone and reacted. The generated hydrochloric acid gas was trapped with an aqueous NaOH solution. The resulting suspension was heated to 100 ° C. over 30 minutes and reacted until no HCl gas was generated. Subsequently, 3 g of zinc chloride (ZnCl ₂ ) was added, and the temperature was raised to 140 ° C. over 1 hour. At this point, it was confirmed that HCl gas was generated again. After 1 hour, the mixture was stirred at 160 ° C. to remove all volatile components. After 4 hours, the temperature was lowered to 50 ° C., 30 ml of water was carefully added and further stirred. Subsequently, 20 ml of toluene and 100 ml of water were added, cooled to 0 ° C., filtered, and washed with 100 ml of cold water to obtain 98.8 g of an intermediate. This solid was confirmed by analysis to have a structure in which the target product was hydrolyzed (0.395 mmol, yield 92 mass%).
This solid was heated and dissolved in a flask refluxed with nitrogen, and the generated water was removed by stirring at 140 ° C. for 1 hour. 2] Oxaphosphinene 6-oxide was obtained (yield 85% by mass). The phosphorus atom content of the obtained phosphorus compound (P2) was 13.4% by mass. The NMR analysis result of the phosphorus compound (P1) is shown below.

NMR (DMSO):
δ (1H) = 8.0 (d, 1H, 606Hz), 8.03-8.1 (m, 1H), 7.87-8.0 (m, 1H), 7.78-7.85 (m, 1H), 7.58-7.66 (m, 1H), 7.44-7.47 (m, 1H), 7.15-7.22 (m, 1H), 6.88-6.95 (m, 1H); δ (31P) = 15.6 ppm,

Examples 1 and 2 and Comparative Examples 1 and 2
According to the formulation shown in Table 1, the epoxy resin composition was prepared by the following method, and then cured under the following conditions to produce a laminate and various evaluations were performed. The results are shown in Table 2.

[Preparation of epoxy resin composition]
According to the composition shown in Table 2 below, an epoxy resin, a curing agent and other components were blended, and the nonvolatile content (NV) of the composition was finally adjusted to 58% by mass.

[Laminate creation conditions]
Base material: 100 μm; glass cloth “# 2116” manufactured by Nitto Boseki Co., Ltd.
Number of plies: 6
Pre-pregation condition: 160 ° C / 2 weight foil: 18 µm; Nikko Metal Co., Ltd. JTC foil curing condition: 200 ° C, 40 kg / cm ² after 1.5 hours molding Plate thickness: 0.8 mm

[Physical property test conditions]
Glass transition temperature: measured by TMA method (compression load method) after removing copper foil by etching. Temperature rising speed 10 ° C / min.

Combustion test: Test method conforms to UL-94 vertical test.

Heat-resistant peelability test (T288 test): In accordance with IPC TM650, heat-resistant peelability evaluation (with copper foil) at 288 ° C was performed.

Abbreviations in the table are as follows.
N-690: Cresol novolac type epoxy resin (“Epiclon N-690” manufactured by DIC Corporation, epoxy equivalent: 214 g / eq.)
HP-7200H: dicyclopentadiene type epoxy resin (“Epiclon HP-7200H” manufactured by DIC Corporation, epoxy equivalent: 279 g / eq.)
P1: Phosphorus atom-containing compound (P1) obtained in Synthesis Example 1
HCA: 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide TD-2090: phenol novolac type phenol resin (“TD-2090” manufactured by DIC Corporation, hydroxyl group equivalent 105 g / eq)
2E4MZ: 2-ethyl-4-methylimidazole

Claims (11)

Epoxy resin (A), curing agent (B), and the following structural formula (1)

(Wherein, X ¹ and X ² are each independently a hydrogen atom or a hydroxyl group, and A is a hydrogen atom or a hydroxyl group, provided that at least one of X ¹ and X ² is a hydroxyl group). A curable resin composition comprising a phosphorus atom-containing compound (C) as an essential component. The curing agent (B) has an active hydrogen or acid anhydride group, and the blending ratio of the epoxy resin (A), the curing agent (B), and the above is that of the epoxy resin (A). The curable resin composition according to claim 1, wherein the active hydrogen or acid anhydride group in the curing agent (B) is in a proportion of 0.7 to 1.5 equivalents with respect to a total of 1 equivalent of epoxy groups. The said phosphorus atom containing compound (C) is mix | blended in the ratio from which the mass ratio of the phosphorus atom in the total mass of said (A), (B), and (C) will be 1.0-4.0 mass%. The curable resin composition according to claim 1 or 2. The curable resin composition according to claim 1, further comprising a curing accelerator (D) in addition to the components (A) to (C). The curable resin composition according to claim 4, further comprising an organic solvent (E) in addition to the components (A) to (D). Hardened | cured material formed by hardening | curing the curable resin composition as described in any one of Claims 1-5. The resin composition for printed wiring boards which consists of a composition of Claim 5. The resin composition for flexible wiring boards which consists of a composition of Claim 5. A printed wiring board obtained by impregnating a glass substrate with the composition according to claim 5 and then curing the glass substrate. The resin composition for semiconductor sealing materials which contains an inorganic filler in addition to the composition of Claim 4. The resin composition for interlayer insulation materials for buildup boards which consists of a composition of Claim 4.