JP2012151252A - Connection component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection component which electrically connects an LSI module with a circuit board and stably supplies electric power source to the LSI module without causing loss.SOLUTION: A connection component has: a power terminal block connecting with two or more power terminals, which are provided at terminal parts on an upper surface of a circuit board and a lower surface of an LSI module, and made of a metal material; and a ground terminal block connecting with two or more ground terminals, which are provided at the terminal parts on the upper surface of the circuit board and the lower surface of the LSI module, and made of a metal material. The connection component connects the circuit board with the LSI module.

Description

  The present invention relates to a connection component.

  In general, a large number of circuit elements operate in an LSI (Large Scale Integration) module, and thus it is necessary to supply a large current from the circuit board to the LSI module. In addition, it is necessary to stably supply a current that increases or decreases due to a load variation of the LSI module.

  Conventionally, an LSI module is connected to a circuit board via a BGA (Ball Grid Array). The BGA as the connection terminal is uniform for both power supply system terminals and signal system terminals. For example, solder balls having a diameter of about 0.6 mm are used. A large number of these thin terminals are used in parallel to reduce the resistance of the connection portion of the power supply system, thereby reducing the loss at the connection portion and supplying current to the LSI module.

JP 2006-228897 A

  However, the conventional technique in which power is supplied from the circuit board to the LSI module via the BGA has a problem that when the power consumption of the LSI chip increases, the current flowing through the BGA terminal increases and the loss increases. Since current is supplied from a thin terminal, when the current flowing through the terminal fluctuates, the voltage generated at the terminal fluctuates. This leads to voltage fluctuation in the LSI module and affects the operation of the circuit element.

  In addition, since the signal terminal has no shield (not a coaxial structure), it becomes easy to be electrically coupled, so that the induction noise generated by one terminal is easily propagated to the surrounding terminals. The larger the fluctuation of the current voltage, the more easily affected.

  Therefore, the present invention provides a connection component that connects an LSI module and a circuit board and can stably supply power to the LSI module without loss.

  One aspect of the invention includes a power supply terminal block made of a metal material connected to two or more power supply terminals provided on a terminal portion on the upper surface of the circuit board and the lower surface of the LSI module, and the upper surface of the circuit board and the LSI module. A grounding terminal block made of a metal material that is connected to two or more grounding terminals provided on a terminal portion on the lower surface of the board, and connected to the circuit board and the LSI module. .

  According to the above aspect of the present invention, the terminals of the power supply system are the power supply terminal block and the ground terminal block, and the connection parts are configured to be collectively connected with a terminal having a large current flowing area between the circuit board and the LSI module. As a result, the area of the power supply terminal can be greatly increased, loss due to the terminal can be reduced, and power can be efficiently supplied to the LSI module.

It is a figure which shows the connection structure of the power supply which interposed the connection components which become embodiment of this invention between LSI module / circuit boards. It is a figure which shows the structural example-the 1 (when a signal terminal is arrange | positioned in a GND terminal block) of the connection components which become embodiment of this invention. It is a figure which shows the structural example-the 2 (when a signal terminal is arrange | positioned in a power supply terminal block) of the connection components which become embodiment of this invention. It is a figure which shows the structural example-the 3 (when a signal terminal is arrange | positioned both in a power supply terminal block and a GND terminal block) of the connection components which become embodiment of this invention. It is a figure which shows the structural example-the 4 (when a high potential power supply terminal block is provided) of the connection components which become embodiment of this invention. It is a figure which shows the structural example of the signal terminal formed in the GND terminal block in the connection component which becomes embodiment of this invention. It is a figure which shows the structural example (model 1) of a connection component at the time of arrange | positioning the signal terminal which becomes embodiment of this invention in a GND terminal block. It is a figure which shows the structural example (model 2) of a connection component at the time of arrange | positioning the signal terminal which becomes embodiment of this invention in a GND terminal block and a power supply terminal block. It is a figure which shows the equivalent circuit model of the connection structure by the connection components which become embodiment of this invention. It is a figure which shows the calculation result of each part voltage in the comparative example by the equivalent model of FIG. It is a figure which shows the calculation result of each part voltage in the connection component by the equivalent model of FIG. It is a figure which shows the connection structural example (the 1) by the connection component which becomes embodiment of this invention. It is a figure which shows the connection structural example (the 2) by the connection components which become embodiment of this invention. It is a figure which shows the connection structural example (the 3) by the connection components which become embodiment of this invention. It is a figure which shows the connection structural example (the 4) by the connection components which become embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a power supply connection configuration in which a connection component of the present invention is interposed between an LSI module and a circuit board. Here, the LSI chip 50 of the LSI module 2 is actually sealed with a metal lid, but FIG. 1 shows an image of the connection of the LSI module 2, the connection component 1, and the circuit board 3. For the sake of illustration only, the lid of the LSI chip 50 is omitted.

  In the connection configuration of the present invention, the LSI chip 50 is connected to the LSI module 2 mounted on the LSI substrate 100 on the upper surface of the connection component 1, and the circuit board 3 is connected to the lower surface of the connection component 1. In the present invention, instead of a connection using a large number of thin connection surfaces such as a power supply terminal and a ground (hereinafter abbreviated as GND (Ground)) terminal, an LSI is formed with a power supply terminal surface formed on the connection component 1 and a thick connection surface of the GND terminal surface. It is characterized by being connected to the module 2 and the circuit board 3.

  The connection surface of the circuit board 3 and the LSI module 2 has the same arrangement as that of the connection component 1, and a pattern of a power supply terminal, a GND terminal, and a signal terminal is formed, and the circuit board 3 / connection component 1 / LSI module is connected. This connection is made by means such as soldering.

  Hereinafter, specific examples of the connection parts will be described with reference to FIGS.

  FIG. 2 shows a configuration example of the connection component of the present invention-part 1 (when a signal terminal is arranged in the GND terminal block). In the embodiment of FIG. 2, a configuration example is shown in which signal terminals are arranged in the GND terminal block 10 of the connection component 1. 2A shows a top view of the connection component 1, and FIG. 2B shows a cross-sectional view taken along line A-A 'of FIG.

  The connection component 1 has a power supply terminal block 20, a GND terminal block 10, and a signal terminal 30, and is connected to the LSI module 2 on the upper surface and the circuit board 3 on the lower surface, as described in FIG.

  As shown in FIG. 2, a power supply terminal block 20 is disposed at the center, a GND terminal block 10 is disposed around the power terminal block 20, and a signal terminal 30 is disposed inside the GND terminal block 10. The power supply terminal block 20 and the GND terminal block 10 are insulated by an insulator 11. In the present invention, the connection is made with the thick connection surfaces of the power supply terminal block 20 and the GND terminal block 10 instead of the connection using many thin connection surfaces such as the conventional power supply pins and GND pins.

  In this way, by interposing the connection component 1 that collectively connects the circuit board 3 / LSI module 2 with wide terminals, the area of the power supply system terminal is greatly increased, so that the loss at the terminals is reduced, and the circuit board is reduced. Thus, efficient power supply from 3 to the LSI module 2 becomes possible.

  Further, the signal terminal 30 includes a signal line 31 that is insulated from the GND terminal block 10 by an insulator 32. By adopting a structure in which the signal lines 31 are arranged in the GND terminal block 10, the influence of noise between the signal lines 31, between the signal lines 31 / power supply terminal blocks 20, and between the signal lines 31 / GND terminal blocks is eliminated. It becomes possible.

  Further, the connection component 1 has a power supply terminal block 20 at the center, a GND terminal block 10 around the power supply terminal block 20, and a signal line 31 inside the GND terminal block 10.

  Here, the connection surface of the circuit board 3 and the LSI module 2 has the same arrangement as the power supply terminal block 20, the GND terminal block 10, and the signal terminal 30 in the connection component 1, and the patterns of the power supply terminal, the GND terminal, and the signal terminal, respectively. Is formed. And soldering etc. are used for the connection between the circuit board 3 / connection component 1 / LSI module.

  FIG. 3 shows a configuration example-part 2 of the connection component of the present invention (when a signal terminal is arranged in a power supply terminal block). In the embodiment of FIG. 3, a configuration example in which the signal terminals 30 are arranged in the power supply terminal block 20 of the connection component 1 is shown. 3A shows a top view of the connection component 1, and FIG. 3B shows a cross-sectional view taken along line A-A 'in FIG. Thus, since the signal terminal 30 is made of a metal material and disposed in the power terminal block 20 separated by the GND terminal block 10 and the insulator 11, noise interference with terminals outside the block is suppressed. The The signal terminals 30 in the power supply terminal block 20 are insulated from each other as well as from the power supply terminal block 20, and have the same structure as that of the high-frequency cable, so that there is no influence of noise (signal terminal structure). The details of this will be described later with reference to FIG.

  FIG. 4 shows a configuration example of the connection component of the present invention-part 3 (when signal terminals are arranged in both the power supply terminal block and the GND terminal block). In the embodiment of FIG. 4, a configuration example in which the signal terminals 30 are arranged in the power supply terminal block 20 and the GND terminal block 10 of the connection component 1 is shown. 4A shows a top view of the connection component 1, and FIG. 4B shows a cross-sectional view taken along line A-A 'of FIG. 4A.

  The connection component 1 according to the embodiment includes a GND terminal block 10 in which the signal terminals 30 are disposed, a power supply terminal block 20 in which the signal terminals 30 are disposed, and insulation that insulates the GND terminal block 10 from the power supply terminal block 20. It has a body 11. Thus, since the signal terminal 30 is disposed in the power supply terminal block 20 and the GND terminal block 10 made of a metal material, noise interference from terminals outside the block is suppressed. Further, the signal terminals 30 in the power supply terminal block 20 and the GND terminal block 10 are insulated from each other and insulated from the power supply terminal block 20 and the GND terminal block 10 and adopt the same structure as the high-frequency cable. There is no influence of noise.

  As described above, the present structure in which the signal terminals 30 are arranged in both the power supply terminal block 20 and the GND terminal block 10 increases the degree of freedom in designing the arrangement of the signal terminals 30.

  FIG. 5 shows a configuration example of the connection component of the present invention-part 4 (when a high potential power supply block is provided). In the embodiment of FIG. 5, a configuration example is shown in which a high-potential power terminal block is further arranged in the power terminal block 20 of the connection component 1. As in FIG. 2, the signal terminal 30 is arranged in the GND terminal block 10. FIG. 5A shows a top view of the connection component 1, and FIG. 5B shows a cross-sectional view taken along line A-A 'of FIG.

  The connection component 1 of the embodiment includes a GND terminal block 10 in which a signal terminal 30 is disposed, a power supply terminal block 20, a high-potential power supply terminal block 20a provided in the power supply terminal block 20, and a GND terminal block 10. It has the insulator 11 which insulates the power supply terminal block 20, and the insulator 12 which insulates the power supply terminal block 20a for high potentials.

  In the example of FIG. 5, when a plurality of potentials are required, the power supply terminal block 20 is disposed around the terminal having a high potential. As in this embodiment, the terminals having a high potential can be prevented from touching from the outside by arranging the terminals having a high potential in a point-symmetric manner inside. Further, since the power supply terminal block and the GND terminal block have a coaxial structure, the spread of the electromagnetic field created by the power supply terminal block can be suppressed and the influence of noise can be reduced.

  FIG. 6 shows an example of the structure of signal terminals arranged in the GND terminal block in the connection component of the present invention. As shown in FIG. 6, the signal line 31 is arranged in the GND terminal block 10 (or the power supply terminal block 20), and an insulator 32 is provided between the GND terminal block 10 (or the power supply terminal block 20) and the signal line 31. Insulated with. In the embodiment, the diameter of the signal line 31 is 0.4 mmφ, the diameter of the area of the signal terminal 30 through which the signal line passes through the metal block is 1.3 mmφ, and the gap between the signal line 31 and the insulator 32 (fluorine resin). The structure is filled with This is the same as the cross-sectional structure of a commercially available cable for high-frequency signal transmission (for example, a high-frequency cable SX-17 manufactured by Waka Seisakusho). Therefore, it is possible to transmit even a signal having a very high frequency.

  As described above, the signal line 31 can be expected to transmit a high-frequency signal without being affected by external noise and without being a noise source for the other signal lines 31.

  Here, an area that can be used as a power supply system terminal of the connection component of the present invention is obtained based on a BGA-connected LSI module (outer dimension: 40 × 40 mm) that is generally provided.

Now, if the number of signal lines is 260,
One signal terminal (area surrounding the signal line) = 1.33 mm ²
Area for 260 signal terminals = 345 mm ²
Area that can be used as a power supply system terminal = 1255 mm ² (40 × 40 mm−signal terminal area) (1)
It becomes.

  FIG. 7 shows a configuration example (model 1) of connection parts when the signal terminals of the present invention are arranged in the GND terminal block. 7 includes a power supply terminal block 20 having an outer shape of 16 × 16 mm, a GND terminal block 10 having an outer shape of 40 × 40 mm, and 260 signal terminals 30 arranged in the GND terminal block 10 (marked in the drawing). And have.

Now, assuming that the interval between the signal terminals (the signal terminal area including the insulator 32) 30 is 0.8 mm, the configuration of the connecting part of the model 1 in this embodiment in which the signal line passes only through the GND terminal block 10 is as follows.
Area of power terminal block: 256mm ² (16x16mm) (2)
GND terminal block area: 999 mm ² ((1)-(2)) (3)
Number of signal terminals: 260.

  FIG. 8 is a diagram showing a configuration example (model 2) of connection parts when the signal terminals of the present invention are arranged in the GND terminal block and the power supply terminal block.

  In the model 2 of the embodiment of FIG. 8, the signal line passes through both the GND terminal block 10 and the power supply terminal block 20. In this embodiment, since the signal line passes through each block, a total of 260 signal terminals 30 are allocated to the areas of the GND terminal block 10 and the power supply terminal block 20.

The connecting part of the model 2 in FIG. 8 includes a power supply terminal block 20 having an outer shape of 18.6 × 18.6 mm, and 194 signal terminals 30 in which 64 signal terminals 30 (circles in the figure) are arranged in the block. And a GND terminal block 10 having an outer shape of 40 × 40 mm arranged in the block. Reference numeral 10a denotes a remaining area of the GND terminal block 10 when 194 signal terminals 30 are arranged in order from the outside.
The configuration of connecting parts of model 2 is
Area of power supply terminal block: 261 mm ² (18.6 × 18.6 mm—64 signal terminals) (4)
GND terminal block area: 993.9 mm ² (5)
Number of signal terminals: 260.

As described above, the areas of the power supply terminal block 20 and the GND terminal block 10 in the connection parts of the models 1 and 2 described in FIGS. Comparative examples are as follows.
<Comparative example> (There is no terminal in the center of the module)
LSI module size: 40x40mm
Terminal pitch: 1mm
Solder ball diameter: 0.6 mm
Number of terminals: 800 (250 for signal system, 550 for power supply system)
The electrode area of the comparative example is
Area for 250 signal terminals = 70.7 mm ²
The area for 550 power supply terminals = 155.5 mm ² .

  Since the connection parts of the present invention have almost no difference in the area of the block to be written between the model 1 and the model 2, the model 1 shown in FIG. The area of 550 power supply system terminals in the comparative example was assumed to include the power supply terminal and the GND terminal in half.

  The area of the power supply terminal block is about 3.3 times that of the connection of the power supply terminal by BGA. By increasing the area of the power supply terminal, it is possible to reduce the power loss at the terminal and to expect to efficiently supply power to the LSI module. Further, the area of the GND terminal block is about 13 times that of the connection of the GND terminal by BGA. As described above, the increase in the GND area can be expected to suppress the floating and fluctuation of the GND potential.

  Hereinafter, the effect of the connection component introduction of the present invention will be verified with reference to FIGS.

  FIG. 9 shows an equivalent circuit model of a connection configuration using the connection component of the present invention. In order to verify the effect of increasing the area of the power supply system terminal, the connection part of the circuit board and the LSI module is assumed to be an equivalent circuit, and the voltage of each part when current flows from the circuit board to the LSI module is calculated. did. Rv represents the resistance of the power supply terminal, Rc represents the resistance inside the LSI module, and Rg represents the resistance of the GND terminal.

  In order to express the effect of reducing the resistance of the power supply system terminal by using a connection component in a simple ratio, the resistance of each part in the BGA connection is set as Rv = 1, Rg = 1, and Rc = 1 as a comparative example. .

  On the other hand, the resistance of each part when using the connection component (FIG. 7) was set to Rv = 1 / 3.3, Rg = 1/13, and Rc = 1 from the area ratio. Rc is the same as that of the comparative example because it is outside the connection component.

  In addition, since the circuit is a power supply system, it is assumed that the current flowing between the circuit board and the LSI module flows uniformly in the connection cross-sectional area. The current flows through a path returning from the circuit board through Rv, Rc, Rg to the circuit board, and flows through a path in which three resistors are connected in series. Therefore, a voltage generated according to the size of each resistor is calculated. .

  FIG. 10 shows the result of calculation with the equivalent circuit model of FIG. 9 for the case of BGA connection as a comparative example. The graph of FIG. 10 shows the voltage of each resistance portion with respect to time.

The voltage V is a voltage obtained by placing a 20% noise voltage on a 1V DC voltage. The input voltage V is divided by three resistors connected in series as follows.
Vv = (Rc + Rg) V / (Rv + Rc + Rg)
Vg = (Rg) V / (Rv + Rc + Rg)
In FIG. 10, since Rv = 1, Rg = 1, and Rc = 1, Vv is 2/3 of V ((about 0.67V), Vg is 1/3 of V (about O.33V). The potential difference in the LSI module is Vv−Vg, which is 1/3 of V (about 0.33 V).

  The ripple component represents the fluctuation of the DC potential, and the magnitude of the ripple was 20% with respect to the DC potential. Note that the value of 20% is a value that clearly shows that the fluctuation in Vg becomes smaller due to the decrease in Rg of the connecting parts. Further, it is assumed that the noise has risen, fallen, and has a voltage fluctuation of 10 ms each having a ripple width of 10 times.

  Since the voltage division by the three resistors is calculated without including inductance and capacitance, voltages proportional to the resistors are generated as Vv and Vg.

  FIG. 11 shows a calculation result of each part voltage in the connection component based on the equivalent model of FIG.

  The input voltage V is divided by three resistors connected in series. The area of Rv of the connection component is expanded by about 3.3 times and the area of Rg is expanded by about 13 times the area of the resistance Rv of the power supply terminal and the area of the resistance Rg of the GND terminal used in FIG. . Therefore, with respect to the comparative example of FIG. 10, the resistance of Rv is 1 / 3.3, and the resistance of Rg is 1/13.

  FIG. 11 shows the calculation results when Rv = 1 / 3.3, Rg = 1/13, and Rc = 1 in FIG. According to this, it can be seen that a voltage of about 0.78 V is generated for Vv and a voltage of about 0.06 V is generated for Vg (DC level).

  That is, as in the connection component of the present invention, the Rv is reduced by blocking the power supply system terminal, so that the loss at Rv is reduced and most of the supplied voltage is applied to the LSI module. In addition, a decrease in Rg suppresses a rise in the GND potential and suppresses voltage fluctuations that occur in the GND potential.

  As described above, in the connection component of the present invention, the LSI module and the circuit board can be connected with a lower resistance than before, so that the loss of power supply can be reduced, and the rise and fluctuation of the GND potential of the LSI module can be reduced.

  Next, a connection configuration between the connection component, the LSI module, and the circuit board will be described with reference to FIGS. In the connection configuration example shown below, in the structure of the LSI module, a metal lid member for sealing the LSI chip is omitted. In addition, in the cross-sectional views of FIGS. 12 to 15, only the connection configuration of the connection component to the LSI module and the circuit board is shown, and the signal terminal portion in each block in the connection component is omitted.

  FIG. 12 shows a connection configuration example (part 1) using the connection component of the present invention.

  The connection configuration of this embodiment includes a connection component 1 having a power terminal block 20 and a GND terminal block 10 that are blocked with a metal material, an LSI module 2 including an LSI substrate 100 on which an LSI chip 50 is mounted, and a circuit board. It consists of three.

  On the lower surface of the LSI module 2, a GND electrode 101 and a power supply electrode 102 are provided corresponding to the pattern of each block of the connection component 1. Similarly, a GND electrode 201 and a power supply electrode 202 are provided on the upper surface of the circuit board 3 corresponding to the pattern of each block of the connection component 1. In the circuit board 3, a large number of vias are used to take the power supply electrode 202 from the power supply layer 205 to the surface. Reference numeral 203 denotes a surface insulating layer made of a solder resist or the like.

  Furthermore, each block of the connection component 1 and the pattern electrodes (power supply electrode 102 and power supply electrode 202) provided on the LSI substrate 100 and the circuit board 3 of the LSI module 2 are connected by soldering.

  FIG. 13 shows a connection configuration example (part 2) using the connection component of the present invention.

  The connection configuration of this embodiment includes a connection part 1 having a power terminal block 20 and a GND terminal block 10 that are blocked with a metal material, an LSI module 2 having an LSI substrate 100 on which an LSI chip 50 is mounted, and countersink processing. The circuit board 3 includes a power supply electrode 202 connected to a terminal metal block 204 formed on the power supply layer 205 by being embedded in the power supply layer 205 and a surface insulating layer 203 made of solder resist.

  On the lower surface of the LSI module 2, a GND electrode 101 and a power supply electrode 102 are provided corresponding to the pattern of each block of the connection component 1. Further, on the upper surface of the circuit board 3, a GND electrode 201 and a power supply electrode 202 are provided corresponding to the pattern of each block of the connection component 1.

  Furthermore, each block of the connection component 1 and the pattern electrodes provided on the LSI substrate 100 and the circuit board 3 of the LSI module 2 are connected by soldering.

  FIG. 14 shows a connection configuration example (part 3) using the connection component of the present invention.

  The connection configuration of the present embodiment includes a power supply terminal block 20 and a GND terminal block 10 that are blocked with a metal material and a metal block 25 that raises the power supply terminal block 20 to contact the power supply electrode 202 of the circuit board 3. 1. An LSI module 2 having an LSI substrate 100 on which an LSI chip 50 is mounted, and a circuit board having a surface insulating layer 203 made of a power supply electrode 202 and a solder resist formed on a power supply layer 205 in the substrate by countersinking. It consists of three.

  On the lower surface of the LSI module 2, a GND electrode 101 and a power supply electrode 102 are provided corresponding to the pattern of each block of the connection component 1. Further, on the upper surface of the circuit board 3, a GND electrode 201 and a power supply electrode 202 are provided corresponding to the pattern of each block of the connection component 1.

  Furthermore, each block of the connection component 1 and the pattern electrodes provided on the LSI substrate 100 and the circuit board 3 of the LSI module 2 are connected by soldering.

  FIG. 15 shows a connection configuration example (part 4) using the connection component of the present invention.

  In this embodiment, an alignment mechanism for the connection component 1 and other components is added, and the electrode structures of the LSI module 2 and the circuit board 3 other than the connection component 1 are exactly the same.

  The positioning mechanism between the connection component 1 and the other components includes a guide 110 that guides the bonding with the LSI module 2 provided on the connection component 1 side, a positioning pin 120 that positions the circuit board 3, and a circuit board. It consists of a coupling hole 206 for coupling to the positioning pin 120 of the connection component 1 provided on the third side.

  By introducing the connection parts of the present invention described above, the area of the power supply terminal and the area of the GND terminal can be greatly increased compared to the conventional BGA connection configuration, the loss due to the terminals is reduced, and the power to the LSI module is reduced. Can be efficiently supplied. In addition, the GND potential of the LSI module can be brought close to the GND potential of the circuit board.

  Furthermore, by making the signal line the same shape as the high-frequency cable and placing it inside the GND terminal block, a structure that is not affected by external noise and that does not generate external noise is realized, and the power supply voltage of the LSI module Stabilization and signal noise countermeasures are possible at the same time.

  The present invention relates to a connecting part technology in the form of a metal block capable of reducing power loss and stabilizing a power supply in supplying power to an LSI module.

DESCRIPTION OF SYMBOLS 1 Connection component 2 LSI module 3 Circuit board 10 GND (grounding) terminal block 11, 12 Insulator 20, 20a Power supply terminal block 25 Metal block 30 Signal terminal 31 Signal line 32 Insulator 50 LSI chip 100 LSI substrate 101 GND electrode 102 Power supply Electrode 110 Guide 120 Positioning pin 201 GND electrode 202 Power supply electrode 203 Surface insulating layer 204 Metal block 205 Power supply layer 206 Bonding hole

Claims (5)

A power supply terminal block made of a metal material connected to two or more power supply terminals provided on a terminal portion on the upper surface of the circuit board and the lower surface of the LSI module;
A ground terminal block made of a metal material connected to two or more ground terminals provided on a terminal portion on the upper surface of the circuit board and the lower surface of the LSI module;
A connection component for connecting the circuit board and the LSI module.   The connection component according to claim 1, wherein a plurality of signal terminals are arranged in the power supply terminal block and / or the ground terminal block.   The connecting part according to claim 1, wherein the power supply terminal block is divided into blocks according to potential levels, and a block having a high potential is arranged at a central portion of the power supply terminal block.   The connection part according to claim 1, wherein the circuit board has a metal block embedded at a position corresponding to a block pattern of the connection part.   The connecting component according to claim 1, further comprising a guide corresponding to a width of the LSI module and a positioning pin inserted into a coupling hole provided in the circuit board.

Images