JP2012147338A - Imaging element manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging element manufacturing device for suppressing an increase of an imaging pixel which cannot interpolate output when an optical member is arranged on a focus detection pixel which is a part of a plurality of imaging pixels which are two-dimensionally disposed in the imaging element.SOLUTION: The imaging element manufacturing device includes: a defect pixel detecting section 130 detecting a defect pixel among a plurality of imaging pixels; an analysis section 131 obtaining an arrangement pattern in which the number of imaging pixels in which outputs cannot be interpolated by the defect pixel or a focus detection pixel is the smallest among a plurality of arrangement patterns of an optical member 211; and an instruction output section 132 adjusting a position of the imaging element 127 to the optical member 211 so that the optical member 211 is arranged by the arrangement pattern obtained by the analysis section 131.

Description

  The present invention relates to an image sensor manufacturing apparatus that arranges an optical member on focus detection pixels that are part of a plurality of image pickup pixels that are two-dimensionally arranged in an image sensor.

  There has been proposed an imaging apparatus that uses a part of a plurality of imaging pixels arranged two-dimensionally as a focus detection pixel of a phase difference detection method and performs imaging and focus detection with one imaging element. In this imaging apparatus, since the optical member is arranged on the focus detection pixel as a phase difference detection type light shielding mask, the focus detection pixel needs to be handled as a defective pixel in a pseudo manner.

  For this reason, there has been proposed an imaging apparatus that interpolates the output of the focus detection pixel by the output of the imaging pixels around the focus detection pixel.

  For example, when a focus detection pixel is formed by a pixel corresponding to a G color filter and a captured image is formed, an imaging apparatus that interpolates the output of the focus detection pixel using the output of the surrounding imaging pixels is used. Yes (see, for example, Patent Document 1).

  In addition, for example, there is an imaging apparatus that processes the output of imaging pixels arranged around focus detection pixels in accordance with a direction having continuity and obtains the output of focus detection pixels (see, for example, Patent Document 2). .

  According to these imaging devices, even if a part of the imaging pixels is used as the focus detection pixel, it is possible to perform good pixel interpolation and obtain an image with little deterioration.

JP 2000-156823 A JP 2009-094881 A

  However, in any of the above-described imaging devices, for example, when a defective pixel generated at the time of manufacturing the imaging device and a focus detection pixel come into contact with each other and an apparently large defective pixel block is generated, Since there is a high probability that a defective pixel is included in an imaging pixel used for interpolation of an output of a certain imaging pixel, there is a possibility that defective pixels that cannot interpolate the output increase. In addition, when the probability that a defective pixel is included in an imaging pixel used for interpolation of the output of the imaging pixel increases, there is a problem that the image quality of the captured image is degraded.

  Therefore, the present invention increases the number of imaging pixels that cannot interpolate the output when an optical member is arranged on some focus detection pixels of a plurality of imaging pixels arranged two-dimensionally in the imaging device. An object of the present invention is to provide an image pickup device manufacturing apparatus capable of suppressing the above.

  An image sensor manufacturing apparatus according to the present invention is an image sensor manufacturing apparatus in which an optical member is disposed on focus detection pixels of some of a plurality of image pixels that are two-dimensionally arranged in an image sensor, and includes defective pixel detection means. And an analysis means and a position adjustment means.

  The defective pixel detection means detects a defective pixel among the plurality of imaging pixels.

  The analysis unit obtains an arrangement pattern having the smallest number of the imaging pixels whose output cannot be interpolated by the defective pixel or the focus detection pixel among the plurality of arrangement patterns of the optical member.

  The position adjusting unit adjusts the position of the imaging element with respect to the optical member so that the optical member is arranged in an arrangement pattern obtained by the analyzing unit.

  According to the present invention, when an optical member is arranged on some focus detection pixels of a plurality of imaging pixels arranged two-dimensionally in the imaging device, the number of imaging pixels that cannot interpolate the output is increased. Can be suppressed.

It is a figure which shows the image pick-up element manufacturing apparatus of embodiment of this invention. It is a figure which shows an example of an image pick-up element. It is a figure which shows an example of an optical member. It is a figure which shows the flowchart explaining operation | movement of a control part. It is a figure which shows the flowchart explaining the operation | movement of S304. It is a figure which shows an example of the arrangement pattern of a defective pixel and an optical member. It is a figure which shows the pixel for a focus detection. It is a figure which shows an example of the arrangement pattern of a defective pixel and an optical member. It is a figure which shows the pixel for a focus detection. It is a figure which shows an example of the arrangement pattern of a defective pixel and an optical member. It is a figure which shows the pixel for a focus detection. It is a figure which shows an example of the arrangement pattern of a defective pixel and an optical member. It is a figure which shows the pixel for a focus detection. It is a figure which shows the flowchart explaining operation | movement of a control part. It is a figure which shows the flowchart explaining the operation | movement of S706.

  FIG. 1 is a diagram illustrating an image sensor manufacturing apparatus according to an embodiment of the present invention.

  1 includes an operation unit 111 (for example, a touch panel), a display unit 112 (for example, a monitor), an apparatus control unit 113, a control unit 116 (for example, a CPU), and a light source 117. A Y stage 119, an image reading unit 120, a stage control unit 121, a power driver 122, a Y stage motor 123, an X stage 124, a power driver 125, and an X stage motor 126.

  The control unit 116 includes a defective pixel detection unit 130 (defective pixel detection unit), an analysis unit 131 (analysis unit), an instruction output unit 132, and a storage unit 133.

  The defective pixel detection unit 130 detects a defective pixel that is generated when the image sensor 127 is manufactured among a plurality of image pixels that are two-dimensionally arranged in the image sensor 127. The defective pixel detection unit 130 corresponds to the operation of the control unit 116 such as S804 and S1006 described later, and may be configured by hardware or software.

  The analysis unit 131 obtains an arrangement pattern having the smallest number of image pickup pixels whose output cannot be interpolated by defective pixels or phase difference detection type focus detection pixels among the plurality of arrangement patterns of the optical member 211. The analysis unit 131 corresponds to the operation of the control unit 116 such as S802 to S807 and S308 and S1002 to S1013, which will be described later, and may be configured by hardware or software.

  The instruction output unit 132 outputs a control signal for adjusting the position of the imaging element 127 relative to the optical member 211 to the stage control unit 121. This instruction output unit 132 corresponds to, for example, the operation of the control unit 116 such as S309 and S707 described later, and may be configured by hardware or software. Further, the position adjustment means in the claims includes, for example, an instruction output unit 132, a stage control unit 121, a power driver 122, a Y stage motor 123, an X stage 124, a power driver 125, and an X stage motor 126. It may be configured.

  A captured image generation operation in the image sensor manufacturing apparatus according to the present embodiment will be described.

  First, the image sensor 127 is set on the Y stage 119 and the X stage 124. For example, from a plurality of imaging pixels (16 × 24 imaging pixels are shown as some of the plurality of imaging pixels) arranged in the two-dimensional coordinates of (i, j). The image sensor 127 is set on the Y stage 119 and the X stage 124. At this time, for example, as shown in FIG. 3, it is assumed that an optical member 211 including a plurality of light shielding masks 212 is disposed on the image sensor 127.

  Next, when a light source control signal is output from the control unit 116 to the device control unit 113 by operating the operation unit 111 by an operator or the like, the device control unit 113 turns on the light source 117. The light source is a uniform light source.

  Next, when the light from the light source 117 is condensed on the image sensor 127 via a condensing lens (not shown) and the optical member 211, the image sensor 127 converts the luminance into a voltage in each imaging pixel, and continuously outputs these voltages. Each pixel value is output to the image reading unit 120.

  Next, the A / D converter provided in the image reading unit 120 divides each pixel value output from the image sensor 127 on the time axis to convert from analog to digital, and then outputs the converted value to the control unit 116.

  Then, the control unit 116 generates a captured image based on each pixel value output from the image reading unit 120 and displays it on the display unit 112 or the like. At this time, the control unit 116 interpolates the pixel value of the defective pixel using the pixel value output from the imaging pixel arranged around the defective pixel. That is, for example, in the imaging device 127 shown in FIG. 2, the imaging pixel located at (3, 4) is defined as a defective pixel, and the imaging pixels used to interpolate the defective pixel are (1, 4), (5 , 4), (3, 2), (3, 6), and assuming that the pixel values of these imaging pixels are Gr14, Gr54, Gr32, Gr36, respectively, (3, 4) The interpolation pixel value Gr34 of the image pickup pixel is obtained by calculating Gr34 = (Gr14 + Gr54 + Gr32 + Gr36) / 4. As described above, when the pixel value of the defective pixel is interpolated, an imaging pixel in a region of 5 pixels × 5 pixels around the defective pixel is necessary.

  Next, the operation of the control unit 116 when moving the image sensor 127 to the target position in the image sensor manufacturing apparatus of the present embodiment will be described. Note that the image sensor 127 is moved by the X stage 124 and the Y stage 119 in the X direction that is the movement direction of the X stage 124 or the Y direction that is the movement direction of the Y stage 119. Further, the image sensor 127 may be rotated in the θ direction around a point having a two-dimensional coordinate composed of the X direction and the Y direction.

  First, the control unit 116 calculates the distance (for example, the number of pixels) from the current position of the image sensor 127 (for example, the position of the center pixel of the image sensor 127 in two-dimensional coordinates) to the target position.

  Next, the control unit 116 converts the calculated distance into a physical length on the X stage 124 and the Y stage 119 based on the length of one pixel of the image sensor 127 that has been calibrated in advance, and the conversion is performed. A control signal indicating the distance is output to the stage control unit 121.

  Next, the stage control unit 121 obtains the movement distance Lx of the X stage 124 and the movement distance Ly of the Y stage 119 based on the distance indicated by the control signal output from the control unit 116.

  Then, the stage control unit 121 outputs a drive signal (for example, a pulse voltage) corresponding to the movement distance Lx to the X stage motor 126 via the power supply driver 125 to drive the X stage motor 126, and at the movement distance Ly. A corresponding drive signal is output to the Y stage motor 123 via the power driver 122 to drive the Y stage motor 123.

  Thereby, the image sensor 127 can be moved to the target position.

  In addition, a count error of the number of pulses of the drive signal output from the stage control unit 121 to the X stage motor 126 or the Y stage motor 123 via the power driver 125 or the power driver 122 occurs, and the image sensor 127 moves to the target position. If not, the control unit 116 again calculates the distance from the current position of the image sensor 127 to the target position, and a new control signal is output to the stage control unit 121.

  Next, the operation of the control unit 116 when arranging the optical member 211 on the image sensor 127 will be described.

  FIG. 4 is a flowchart illustrating the operation of the control unit 116 when the optical member 211 is disposed on the image sensor 127. The optical member 211 is arranged on the image sensor 127, and the arrangement pattern of the optical member 211 changes with the movement of the image sensor 127, and the image pixel used as a focus detection pixel (pseudo defective pixel). The position of is also changed.

  When the processing is started (S301), first, the control unit 116 checks the presence or absence of defective pixels generated during the manufacture of the image sensor 127 in the plurality of image sensors of the image sensor 127, and then the X stage 124 and the Y stage. Each position of 119 is initialized (S302). For example, among the pixel values output from the image sensor 127, the control unit 116 sets a pixel that outputs a pixel value that is equal to or greater than a preset specified value as a defective pixel. In addition, for example, the control unit 116 outputs a control signal to the stage control unit 121 to move the X stage 124 to a preset initial position in the X direction and to move the Y stage 119 in a preset Y direction. Move to position.

  Next, the control unit 116 outputs a shooting instruction to the image reading unit 120 and stores each pixel value output from the image reading unit 120 in the storage unit 133 (S303).

  Next, the control unit 116 analyzes each pixel value stored in the storage unit 133 (S304), and stores the analysis result in the storage unit 133 (S305).

  Next, the control unit 116 moves the image sensor 127 to the next analysis target position among the plurality of analysis target positions set in advance (S306). At this time, for example, the control unit 116 moves the image sensor 127 pixel by pixel or a predetermined number of pixels.

  Next, the control unit 116 determines whether or not the image sensor 127 has been moved to all analysis target positions (S307).

  When it is determined that the image sensor 127 has not been moved to all analysis target positions (No in S307), the control unit 116 returns to S303.

  On the other hand, when it is determined that the image sensor 127 has been moved to all analysis target positions (Yes in S307), the control unit 116 is based on the analysis result for each analysis target position stored in the storage unit 133. Then, an optimum target position of the image sensor 127 when the number of image pickup pixels whose output cannot be interpolated by the defective pixel or the focus detection pixel is the smallest is obtained (S308).

  Next, the control unit 116 moves the image sensor 127 to the optimal target position (S309).

  Next, the control unit 116 temporarily fixes the moved image sensor 127 and then heats the thermosetting adhesive between the image sensor 127 and the optical member 211 to soften the thermosetting adhesive. Then, by cooling the thermosetting adhesive and curing the thermosetting adhesive, the image sensor 127 and the optical member 211 are bonded (S310).

  Then, the control unit 116 performs an electrical final check of the image sensor 127 based on each pixel value output from the image reading unit 120 and ends (S311).

  Next, the operation of S304 in FIG. 4 will be described.

  FIG. 5 is a flowchart illustrating the operation of S304.

  First, the control unit 116 binarizes each pixel value stored in the storage unit 133 in S303 of FIG. 4 using two threshold values th1 and th2 (th1 <th2) (S802). For example, when the pixel value is P, the control unit 116 outputs 0 (zero) as a normal imaging pixel and outputs 1 as a defective pixel for imaging pixels that output pixels in the range of th1 <P <th2. And

  Next, when the image sensor 127 is moved to a certain target position for analysis, the control unit 116 determines the number of defective pixel blocks having imaging pixels whose output cannot be interpolated with defective pixels or focus detection pixels. The evaluation value that can be interpolated is initialized (S803).

  Next, the control unit 116 detects a defective pixel block using each pixel value binarized in S802 (S804). For example, when the control unit 116 detects one defective pixel in all the pixels of the image sensor 127 when the image sensor 127 is moved to a certain analysis target position, the control unit 116 sets the defective pixel as a part of the defective pixel block, Furthermore, when the imaging pixel adjacent to the defective pixel is a defective pixel, the defective pixel is also a part of the defective pixel block, and this process is repeated until the adjacent imaging pixel is no longer a defective pixel.

  Next, the control unit 116 determines whether there is an imaging pixel that cannot be interpolated in the detected defective pixel block (S805). For example, the control unit 116 cannot interpolate an imaging pixel when a plurality of surrounding imaging pixels necessary to interpolate a certain imaging pixel in the defective pixel block are all defective pixels or focus detection pixels. Judged as a defective pixel. The control unit 116 determines that the defective pixel is a defective pixel that can be interpolated when all the plurality of surrounding imaging pixels necessary for interpolating the imaging pixel are not defective pixels or focus detection pixels.

  When it is determined that there is a defective pixel that cannot be interpolated in the detected defective pixel block (Yes in S805), the control unit 116 counts up the interpolation possible evaluation value (S806) and captures an image at a certain target position for analysis. It is determined whether or not all defective pixel blocks have been detected in all the pixels of the captured image when the element 127 is moved (S807).

  If it is determined that all defective pixel blocks have not been detected (No in S807), the control unit 116 returns to S804 and detects the next defective pixel block.

  On the other hand, if it is determined that all defective pixel blocks have been detected (Yes in S807), the control unit 116 proceeds to S305 in FIG. 4 and stores the interpolable evaluation value as the analysis result in the storage unit 133.

  And the control part 116 respond | corresponds to the smallest interpolable evaluation value among the interpolation possible evaluation values memorize | stored for every analysis target position (analysis result for every said analysis target position) memorize | stored in the memory | storage part 133. FIG. The analysis target position is set as the optimum target position in S308 of FIG.

  For example, as shown in FIG. 6, the imaging pixel located at (1, 4) in all the imaging pixels of the imaging device 127 is the defective pixel 128, and the upper left end of the optical member 211 is at (2, 2). When the optical member 211 is arranged on the image sensor 127 in an arrangement pattern that overlaps with the imaging pixels that are positioned, as shown in FIG. 7, (2, 2) to (2, 7), (3, 2) ~ (3,7), (4,2) ~ (4,7), (5,2) ~ (5,7), (2,14) ~ (2,19), (3,14) ~ ( 3, 19), (4, 14) to (4, 19), and (5, 14) to (5, 19), the imaging pixels are the focus detection pixels (pseudo defective pixels) 129, respectively. At this time, the imaging pixels used when the output of the focus detection pixel 129 located at (3, 4) is interpolated are (1, 4), (5, 4), (3, 2), (3 , 6), and these imaging pixels are all defective pixels 128 and focus detection pixels 129. Therefore, the output of the focus detection pixel 129 located at (3,4) is interpolated. I can't.

  On the other hand, for example, as shown in FIG. 8, the imaging pixel located at (1, 4) in all the imaging pixels of the imaging element 127 is the defective pixel 128 and the upper left end of the optical member 211 is (2, 4). When the optical member 211 is arranged on the image sensor 127 in an arrangement pattern that overlaps with the image pickup pixel located at (), as shown in FIG. 9, (2, 4) to (2, 9), (3, 4) to (3, 9), (4, 4) to (4, 9), (5, 4) to (5, 9), (2, 16) to (2, 21), (3, 16) The imaging pixels positioned at (3, 21), (4, 16) to (4, 21), (5, 16) to (5, 21) are the focus detection pixels 129, respectively. At this time, the imaging pixels used when the output of the focus detection pixel 129 located at (3, 4) is interpolated are (1, 4), (5, 4), (3, 2), (3 , 6) and the imaging pixel located at (3, 2) is not the defective pixel 128 or the focus detection pixel 129. Therefore, the imaging pixel located at (3, 2) is used. The output of the focus detection pixel 129 located at (3, 4) can be interpolated.

  Further, for example, as shown in FIG. 10, in all the imaging pixels of the imaging element 127, the imaging pixels located at (1, 4) and (7, 4) are the defective pixels 128 and the upper left of the optical member 211. When the optical member 211 is arranged on the image sensor 127 in an arrangement pattern in which the end portion overlaps with the imaging pixel located at (2, 2), as shown in FIG. 11, (2, 2) to (2 , 7), (3,2) to (3,7), (4,2) to (4,7), (5,2) to (5,7), (2,14) to (2,19) ), (3, 14) to (3, 19), (4, 14) to (4, 19), and (5, 14) to (5, 19), the imaging pixels respectively are the focus detection pixels 129. Become. At this time, the imaging pixels used when the output of the focus detection pixel 129 located at (3, 4) is interpolated are (1, 4), (5, 4), (3, 2), (3 , 6) respectively. The imaging pixels used when the output of the focus detection pixel 129 located at (5, 4) is interpolated are (3,4), (7, 4), (5, 2), (5, 6) are the imaging pixels respectively located. Since each imaging pixel used for these interpolations is the defective pixel 128 and the focus detection pixel 129, the output of the focus detection pixel 129 located at (3, 4) and (5, 4) is interpolated. Can not do it.

  On the other hand, for example, as illustrated in FIG. 12, in all the imaging pixels of the imaging element 127, the imaging pixels located at (1, 4) and (7, 4) are defective pixels 128 and the upper left of the optical member 211. When the optical member 211 is arranged on the image pickup device 127 in an arrangement pattern in which the end portion overlaps the image pickup pixel located at (2, 4) of the image pickup device 127, as shown in FIG. ) To (2,9), (3,4) to (3,9), (4,4) to (4,9), (5,4) to (5,9), (2,16) to Image pickup pixels located at (2, 21), (3, 16) to (3, 21), (4, 16) to (4, 21), and (5, 16) to (5, 21) are focus-detected. Pixel 129. At this time, the imaging pixels used when the output of the focus detection pixel 129 located at (3, 4) is interpolated are (1, 4), (5, 4), (3, 2), (3 , 6) respectively. The imaging pixels used when the output of the focus detection pixel 129 located at (5, 4) is interpolated are (3,4), (7, 4), (5, 2), (5, 6) are the imaging pixels respectively located. Since the imaging pixels located at (3, 2) and (5, 2) are not the defective pixel 128 and the focus detection pixel 129, the pseudo defective pixels located at (3, 4) and (5, 4), respectively. Can be interpolated.

  As described above, in the image sensor manufacturing apparatus according to the present embodiment, the analysis target position corresponding to the smallest interpolable evaluation value among the interpolable evaluation values stored for each of the plurality of analysis target positions is set to the image sensor 127. It is the optimum target position. In other words, the image sensor 127 is moved by an arrangement pattern in which the number of image pickup pixels whose output cannot be interpolated by defective pixels or focus detection pixels among the plurality of arrangement patterns of the optical member 211 is minimized. is there. As a result, even when some of the plurality of imaging pixels of the imaging element 127 are used as focus detection pixels, an increase in imaging pixels that cannot interpolate the output can be suppressed. It can suppress that it falls. In addition, since the yield of the image sensor 127 is improved, cost reduction can be expected.

  Next, another operation of the control unit 116 when the optical member 211 is arranged on the image sensor 127 will be described.

  FIG. 14 is a flowchart illustrating another operation of the control unit 116 when the optical member 211 is disposed on the image sensor 127. The optical member 211 is not disposed on the image sensor 127 until the optimum target position of the image sensor 127 is obtained (S706).

  When the process is started (S701), first, the control unit 116 checks the presence or absence of defective pixels generated during the manufacture of the image sensor 127 in the plurality of image sensors of the image sensor 127, and then the X stage 124 and the Y stage. Each position of 119 is initialized (S702). For example, among the pixel values output from the image sensor 127, the control unit 116 sets a pixel that outputs a pixel value that is equal to or greater than a preset specified value as a defective pixel. In addition, for example, the control unit 116 outputs a control signal to the stage control unit 121 to move the X stage 124 to a preset initial position in the X direction and to move the Y stage 119 in a preset Y direction. Move to position.

  Next, the control unit 116 outputs a shooting instruction to the image reading unit 120 and stores each pixel value output from the image reading unit 120 in the storage unit 133 (S703).

  Next, the control unit 116 detects a defective pixel block from each pixel value stored in the storage unit 133 and stores the position of the defective pixel block in the storage unit 133 (S704). For example, the control unit 116 binarizes all pixel values of the image sensor 127 when the image sensor 127 is moved to a certain analysis target position (for example, 0 (zero) for normal image pixels and 1 for defective pixels). ) And detecting one defective pixel in all pixels based on the binarized all pixel values, the defective pixel is made a part of the defective pixel block, and an imaging pixel adjacent to the defective pixel is If it is a defective pixel, the defective pixel is also made a part of the defective pixel block, and this process is repeated until the adjacent imaging pixel is no longer a defective pixel.

  Next, the control unit 116 acquires a plurality of types of arrangement patterns of the optical member 211 (S705). Note that a plurality of types of arrangement patterns of the optical member 211 may be stored in the storage unit 133 in advance, or may be input by operating the operation unit 111 by an operator.

  Next, the control unit 116 obtains the optimum target position of the image sensor 127 based on the plurality of types of arrangement patterns of the optical member 211 and the position of the defective pixel block stored in the storage unit 133 (S706). ).

  Next, the control unit 116 moves the image sensor 127 to the optimal target position (S707). At this time, for example, the control unit 116 moves the image sensor 127 pixel by pixel or a predetermined number of pixels.

  Next, the control unit 116 temporarily fixes the moved image sensor 127 and then heats the thermosetting adhesive between the image sensor 127 and the optical member 211 to soften the thermosetting adhesive. Then, by cooling the thermosetting adhesive and curing the thermosetting adhesive, the image sensor 127 and the optical member 211 are bonded (S708).

  Then, the control unit 116 performs an electrical final check of the image sensor 127 based on each pixel value output from the image reading unit 120 and ends (S709).

  Next, the operation of S706 in FIG. 14 will be described.

  FIG. 15 is a flowchart for explaining the operation of S706 of FIG.

  First, the control unit 116 binarizes each pixel value stored in the storage unit 133 in S703 of FIG. 5 using two threshold values th1 and th2 (th1 <th2) (S1002). For example, when the pixel value is P, the control unit 116 sets 0 (zero) as a normal pixel and 1 as a defective pixel for pixels that output pixels in the range of th1 <P <th2.

  Next, the control unit 116 sets the position of the captured image including the binarized pixel values and the position of the optical member 211 to predetermined initial positions (S1003).

  Next, the control unit 116 binarizes the captured image again based on the positional relationship between the captured image and the optical member 211 (S1004). For example, the control unit 116 sets the pixel value that does not overlap the optical member 211 set at the initial position to 0 (zero) as a normal pixel and sets the pixel value that forms the captured image set at the initial position to the initial position. A pixel value overlapping the set optical member 211 is set to 1 as a defective pixel.

  Next, the control unit 116 initializes an interpolable evaluation value (S1005).

  Next, the control unit 116 detects a defective pixel block using each pixel value binarized in S1004 (S1006). For example, when the control unit 116 detects one defective pixel in all the pixels of the image sensor 127 when the image sensor 127 is moved to a certain analysis target position, the control unit 116 sets the defective pixel as a part of the defective pixel block, Furthermore, when the imaging pixel adjacent to the defective pixel is a defective pixel, the defective pixel is also a part of the defective pixel block, and this process is repeated until the adjacent imaging pixel is no longer a defective pixel.

  Next, the control unit 116 determines whether or not there is an imaging pixel that cannot be interpolated in the detected defective pixel block (S1007). For example, the control unit 116 cannot interpolate an imaging pixel when a plurality of surrounding imaging pixels necessary to interpolate a certain imaging pixel in the defective pixel block are all defective pixels or focus detection pixels. Judged as a defective pixel. The control unit 116 determines that the defective pixel is a defective pixel that can be interpolated when all the plurality of surrounding imaging pixels necessary for interpolating the imaging pixel are not defective pixels or focus detection pixels.

  If it is determined that there is a defective pixel that cannot be interpolated in the detected defective pixel block (Yes in S1007), the control unit 116 counts up the interpolation possible evaluation value (S1008) and captures an image at a certain target position for analysis. It is determined whether or not all defective pixel blocks have been detected in all the pixels of the captured image when the element 127 is moved (S1009).

  When determining that all defective pixel blocks have not been detected (No in S1009), the control unit 116 returns to S1006 and detects the next defective pixel block.

  On the other hand, if it is determined that all defective pixel blocks have been detected (Yes in S1009), the control unit 116 stores the interpolation possible evaluation value in the storage unit 133 (S1010).

  Next, the control unit 116 obtains a binarized captured image when the image sensor 127 is moved to the next analysis target position among a plurality of preset analysis target positions (S1011).

  Next, the control unit 116 determines whether or not the binarized captured image is obtained by moving the image sensor 127 to all analysis target positions (S1012).

  When determining that the binarized captured image is not obtained by moving the image sensor 127 to all analysis target positions (No in S1012), the control unit 116 returns to S1004.

  On the other hand, if it is determined that the binarized captured image is obtained by moving the image sensor 127 to all analysis target positions (Yes in S1012), the control unit 116 stores the analysis stored in the storage unit 133. An optimum target position is obtained based on the analysis result for each target position (S1013). For example, the control unit 116 corresponds to the smallest interpolable evaluation value among the interpolable evaluation values stored for each analysis target position (the analysis result for each analysis target position) stored in the storage unit 133. The target position for analysis is set as the optimal target position.

  Then, the control unit 116 proceeds to S707 in FIG.

  In this way, in the state assumed (simulated) that the optical member 211 is disposed on the focus detection pixel, the number of imaging pixel blocks whose output cannot be interpolated by the defective pixel or the focus detection pixel is obtained. The imaging element 127 may be moved so that the arrangement pattern of the optical members 211 when the number is the smallest is obtained.

  Even if comprised in this way, since the increase in the imaging pixel which cannot interpolate an output can be suppressed, it can suppress that the image quality of a picked-up image falls.

  In the above embodiment, when the defective pixel block includes an image element that cannot be interpolated, the interpolation evaluation value is counted up. However, the number of image elements that cannot be interpolated in all the image pixels. May be set as an interpolable evaluation value.

111 Operation Unit 112 Display Unit 113 Device Control Unit 116 Control Unit 117 Light Source 119 Y Stage 120 Image Reading Unit 121 Stage Control Unit 122 Power Driver 123 Y Stage Motor 124 X Stage 125 Power Driver 126 X Stage Motor 127 Image Sensor 128 Defective Pixel 129 Focus detection pixel 130 Defective pixel detection unit 131 Analysis unit 132 Instruction output unit 133 Storage unit 211 Optical member 212 Shading mask

Claims (4)

An imaging device manufacturing apparatus that arranges an optical member on a part of focus detection pixels of a plurality of imaging pixels arranged two-dimensionally in the imaging device,
Defective pixel detection means for detecting defective pixels among the plurality of imaging pixels;
An analyzing means for obtaining an arrangement pattern having the smallest number of the imaging pixels, the output of which cannot be interpolated by the defective pixel or the focus detection pixel among the plurality of arrangement patterns of the optical member;
Position adjusting means for adjusting the position of the imaging element with respect to the optical member so that the optical member is arranged in an arrangement pattern obtained by the analyzing means;
An imaging device manufacturing apparatus comprising: The imaging device manufacturing apparatus according to claim 1,
The analysis unit obtains the number of the imaging pixels whose output cannot be interpolated by the defective pixel or the focus detection pixel in a state where the optical member is arranged on the focus detection pixel. An imaging device manufacturing apparatus. The imaging device manufacturing apparatus according to claim 1,
The analysis unit obtains the number of imaging pixels whose output cannot be interpolated by the defective pixel or the focus detection pixel in a state where the optical member is assumed to be disposed on the focus detection pixel. An image pickup device manufacturing apparatus. The imaging device manufacturing apparatus according to claim 1,
The analysis unit moves the image sensor one pixel at a time when obtaining an arrangement pattern with the smallest number of the image pickup pixels whose output cannot be interpolated by the defective pixel or the focus detection pixel. Imaging device manufacturing apparatus.