JP2012146751A - Universal board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a universal board 1 used for repairing a printed board in which, when a jumper wire 11 or the like is mounted, a mounting operation of the jumper wire 11 or the like can be easier even in a state where leads are closely adjacent to each other by preventing a soldering iron from directly contacting with leads or electrodes of a component for a long time.SOLUTION: A plurality of pads 2, having a first clearance in a longitudinal direction and a second clearance in a lateral direction, are provided on an insulation base material 3. Furthermore, there are provided a plurality of first oblique pads 13a extending to one end portion in the lateral direction by inclining more to one direction in the longitudinal direction as closer to the end portion and a plurality of second oblique pads 13b extending to the one end portion in the lateral direction by inclining more to the other direction in the longitudinal direction as closer to the end portion. Pitches between the end portion positions of the first oblique pads 13a and the end portion positions of the second oblique pads 13b are set at equal intervals.

Description

  The present invention relates to a universal board used for repairing a printed board.

  When mounting a component on a printed circuit board, the lead or electrode of the component is soldered to a conductive foil (hereinafter referred to as “pad”) provided on the printed circuit board to make electrical connection with other components. Forming an electrical circuit. 2. Description of the Related Art In recent years, as light and thin electronic devices and the like have become smaller and more functional, components mounted on printed boards such as electronic devices are mostly surface mount components.

  And there is a case where a vacant seat is provided in order to mount a repair part on the assumption that a circuit failure occurs or a function is added to this printed circuit board, but a vacant seat may not be provided due to the demand for higher density. Is almost.

  For this reason, when there is a circuit failure, repair parts such as chip parts 106a and 106b and SOP (Small Outline Package) 109 as shown in FIG. A circuit for repair is formed by arranging the jumper wire 111 with the solder 112 by placing it on an already mounted component or the like via the insulating sheet 16 (see, for example, Patent Document 1).

JP-A-10-22592

  However, in the above-mentioned conventional printed circuit board refurbishment, a jumper wire is attached to the lead or electrode of the component with a soldering iron to add the component, so that the soldering iron directly touches the component for a long time and causes thermal damage to the component. However, in the worst case, there was a problem that the parts were broken.

  Further, when attaching jumper wires to a component having multi-pin leads such as SOP, there is a problem that the leads are closely adjacent to each other and it is difficult to attach the jumper wires.

  The present invention employs the following configuration in order to solve the above-described problems. That is, it is a universal substrate for modifying a printed circuit board, and a plurality of pads having a first gap in the longitudinal direction and a second gap in the short direction are provided on the insulating base material.

  According to the universal substrate of the present invention, there is provided a universal substrate for repairing a printed circuit board, wherein a plurality of pads having a first gap in the longitudinal direction and a second gap in the lateral direction are provided on the insulating base material. Because it is provided, the soldering iron does not directly touch the lead of the component for a long time, and even when the leads are closely adjacent, it is easy to install jumper wires and the like. .

1 is a configuration diagram of a universal substrate in Example 1. FIG. 1 is a configuration diagram of a universal substrate in Example 1. FIG. FIG. 6 is an operation explanatory diagram of the universal substrate according to the first embodiment. FIG. 6 is an operation explanatory diagram of the universal substrate according to the first embodiment. FIG. 6 is an operation explanatory diagram of the universal substrate according to the first embodiment. FIG. 6 is an operation explanatory diagram of the universal substrate according to the first embodiment. FIG. 6 is an operation explanatory diagram of the universal substrate according to the first embodiment. FIG. 6 is an operation explanatory diagram of the universal substrate according to the first embodiment. 6 is a configuration diagram of a universal substrate according to Embodiment 2. FIG. FIG. 10 is an operation explanatory diagram of the universal substrate according to the second embodiment. FIG. 10 is an operation explanatory diagram of the universal substrate according to the second embodiment. FIG. 10 is a configuration diagram of a modified example of the universal substrate according to the second embodiment. FIG. 10 is a configuration diagram of a modified example of the universal substrate according to the second embodiment. It is explanatory drawing of the repair method in the conventional printed circuit board.

  Embodiments of the present invention will be described below with reference to the drawings. Elements common to the drawings are given the same reference numerals.

(Constitution)
FIG. 1 is an external view illustrating a configuration of a universal substrate according to the first embodiment. As shown in the figure, the universal substrate of Example 1 is composed of a flexible base 3 and a conductive foil pad 2 for attaching a surface mounting component. Note that the base material 3 may be made of, for example, a general glass epoxy material.

  The pad 2 is made of copper, and soldering worsens when oxidized. Therefore, in order to protect the pad surface, the cover 4 is affixed via a thin adhesive layer (not shown) so that air does not enter. In addition, although the oxidation can be prevented by coating the pad 2 with a preflux, since the preflux deteriorates due to secular change, the cover 4 is provided in order to maintain the quality for a long time. .

  The universal substrate 1 is wound around the winding core 5 in a tape shape together with the cover 4 so that the universal substrate 1 can be stored in a compact manner.

  FIG. 2 is a diagram illustrating a dimension example of the pad 2 formed on the base material 3 of the universal substrate 1 according to the first embodiment. As shown in the figure, the universal substrate 1 of Example 1 has a width Lpw in the Y direction which is the longitudinal direction on a tape-like base material 3 having a width W4 of approximately 12.5 mm (exactly 12.465 mm). = 0.4 mm pads 2 with a pitch Lp1 = 0.635 mm and a space between the pads ΔLp = Lp1−Lpw = 0.635 mm−0.4 mm = 0.235 mm, and three rows are formed in the X direction, which is the short direction. Has been.

  The widths in the X direction of the three rows of pads are W1 = 2.54 mm, W2 = 1.94 mm, W3≈6.085 mm, and a gap of about ΔW0 = 0.60 mm is provided at the left end. A gap of ΔW1 = 0.5 mm is provided between a pad of W1 = 2.54 mm and a pad of W2 = 1.94 mm, and ΔW3 is provided between a pad of W2 = 1.94 mm and a pad of W3 = 6.085 mm. = 0.8 mm gap is provided. As described above, instead of three rows of pads, two rows may be used, or four or more rows of pads with different gaps may be used.

(Operation)
With the above configuration, the universal substrate of the first embodiment operates as follows. This operation will be described in detail below with reference to operation explanatory diagrams of the universal substrate of the first embodiment shown in FIGS.

  First, the 0402 size square chip 6a of 0.4 mm × 0.2 mm size and the 0603 size square chip 6b of 0.6 mm × 0.3 mm size have the size shown in FIG. 3, and the pad 2 is as shown in FIG. Since the pad width Lpw is 0.4 mm and the gap ΔLp is 0.235 mm, the pad can be mounted in the Y direction as shown in FIGS. 4 and 5A and 5B.

  In other words, the 0402 size square chip 6a has a chip length Lcw of 0.4 mm, a terminal length Lc1 of 0.1 mm, and a central part length Lc2 of 0.2 mm, while the pad gap ΔLp is Since it is 0.235 mm, it can be mounted in the Y direction.

  The 0603 size square chip 6b has a chip length Lcw of 0.6 mm, a terminal length Lc1 of 0.1 mm to 0.15 mm, and a central part length Lc2 of 0.3 mm to 0.4 mm. On the other hand, since the pad width Lpw is 0.4 mm and the gap ΔLp is 0.235 mm, it can be mounted in the Y direction.

  The 1005 size square chip 6c has a chip length Lcw of 1.0 mm, a terminal length Lc1 of 0.2 mm to 0.27 mm, and a central part length Lc2 of 0.46 mm to 0.6 mm. Therefore, as shown in FIG. 4 and FIG. 5C, it can be mounted in the X direction, which is the short direction, in a portion where the gap ΔW1 between the pads is 0.5 mm.

  The 1608 size square chip 6d has a chip length Lcw of 1.6 mm, a terminal length Lc1 of 0.3 mm to 0.5 mm, and a central part length Lc2 of 0.6 mm to 1.0 mm. Therefore, as shown in FIG. 4 and FIG. 5 (d), it is possible to mount in the X direction on the portion where the gap ΔW2 between the pads is 0.8 mm and connect with the jumper wire 11 using the other pad portions. it can.

  Further, as shown in FIGS. 4 and 6A, the SOP (5-pin) 9a having a pitch of 0.65 mm has a pitch between three pads 2 and leads of Ls2−Lp2 == 1.30 mm−1. Although an error of 27 mm = 0.03 mm occurs, the error between each pad 2 and the lead is only 0.015 mm, and can be mounted without any problem.

  Further, the SOP (8 pins) 9b having a pitch of 0.65 mm has an Ls3−Lp3 = 1.950−1.905 pitch between the four pads 2 and the leads, as shown in FIGS. 4 and 6B. = 0.045 mm error occurs, and similarly, the error between each pad 2 and the lead is only 0.015 mm, which can be mounted without any problem.

  Further, as shown in FIG. 7A and FIG. 7B of the enlarged view of FIG. 7A, in the SOP (300 mil) 10 having a pitch of 1.27 mm, a single pad having a pitch Lp1 = 0.635 mm is provided. Both the pitch Lp2 and the lead pitch Ls2 are 1.27 mm and can be mounted without error. Note that 1 mil is 1/1000 inch and indicates 25.3955 μm = 0.0254 mm.

  Although not shown, SOP parts of 5.72 mm (225 mils) and 9.53 mm (375 mils) are mounted in the same manner as in FIG. be able to.

  In FIG. 8A, two universal substrates 1 of the first embodiment are arranged so as to be bilaterally symmetric and connected by connecting solder 12x, and the width of the left and right leads is further increased to 15.24 mm with a 1.27 pitch SOP component. FIG. 8 shows an example in which a 1.27 pitch SOP (600 mil) 14 of (= 600 mil) is mounted. In this case as well, as shown in FIG. Is equal to Lp2 = 1.27 mm, and can be mounted without error as shown in FIG.

  When two universal substrates 1 are arranged as shown in FIG. 8A, other SOP parts having a width of 11.43 mm (= 450 mil) and 13.34 mm (= 525 mil) can be mounted.

  After the chip parts and SOP mounted as described above are mounted using a soldering iron or a hot-air heating device, the soldering iron is removed as shown in FIGS. 4, 7 (a), and 8 (a). Using the pad portion vacated by the solder 12, the jumper wires 11 are attached in a zigzag pattern and connected to other components.

  The pitch in the Y direction of the pad has been described as a 0.635 mm pitch in order to increase versatility. However, it is also possible to correspond to a component having a lead of 0.5 mm pitch or 0.4 mm pitch, Good.

(Effect of Example 1)
As described above, according to the universal substrate of Example 1, on the insulating base material, 0.4 mm wide pads are spaced at intervals of 0.635 mm in the longitudinal direction, and 0.5 mm and 0. Since the pad is provided so as to be 8 mm, it is possible to prevent the soldering iron from directly touching a component lead or electrode for a long time, and it is easy to attach a jumper wire or the like even when the leads are closely adjacent to each other. can do.

  Moreover, since the base material and the pad are covered with a cover and formed into a tape shape, the corrosion of the pad can be prevented for a long period of time, and it can be easily processed into an arbitrary size. Large SOPs can also be installed.

(Constitution)
FIG. 9 is a configuration diagram of a universal substrate according to the second embodiment. As shown in the figure, in the universal substrate of Example 2, the slant pad 13a that extends to one end (the left end in FIG. 9) and inclines upward in the Y direction toward the end, and the bottom in the Y direction toward the end. The diagonal pad 13b which inclines in the direction is provided at a predetermined interval, the length Lpy1 from the end of the diagonal pad 13b to the end of the diagonal pad 13a, and the end from the end of the diagonal pad 13a to the end of the diagonal pad 13b The lengths Lpy2 are made equal.

  In the example of FIG. 9, four linear pads are provided between the lengths Lpy1, and one linear pad is disposed between the lengths Lpy2.

  With the above configuration, when the diagonal pads 13a and 13b are arranged in a straight line as shown in FIG. 10A described later, the pads 2 having a pitch of 0.635 mm are 0.635 mm / 2 = 0.3175 mm. Since other configurations are the same as those of the first embodiment, detailed description thereof is omitted for the sake of brevity.

(Operation)
With the above configuration, the universal substrate of the second embodiment operates as follows. This operation will be described in detail below with reference to the operation explanatory diagrams of FIGS.

  One universal substrate is turned upside down, and the diagonal pads 13a and 13b are aligned with each other as in the joint portion 13x, and fixed with connecting solder 12x. As long as the misalignment between the universal substrates does not occur, the connection may be made by tape or staples instead of being fixed by solder.

  FIG. 10B is an overall view of an example in which the 3-pin mini-mold 15 is mounted, and FIG. 11 is an enlarged view thereof. As shown in the figure, the 3-pin mini-mold 15 has a pitch Ls2 on the 2-pin side of 1.90 mm and an interval in the Y direction from the 1-pin side of Ls1 = 0.95 mm. As described above, the pads 2 on the substrate are shifted from each other by 1/2 pitch in the Y direction, that is, 0.3175 mm, and the distance Lp1 between the two pads 2 is 0.9525 mm and the distance between the four pads 2. Since Lp2 is 1.905 mm, each pin of the 3-pin mini-mold 15 can be accurately mounted on the pad 2 of the universal substrate as shown in FIG.

  In the above description of the embodiment, the example in which the opposing pads 2 are shifted by 0.3175 mm by joining the universal substrates 1 having the pads 2 having a pitch of 0.635 mm with the diagonal pads 13a and 13b has been described. As shown in FIGS. 12 and 13, the length Lpy1 from the end of the oblique pad 13b to the end of the oblique pad 13a and the length Lpy2 from the end of the oblique pad 13a to the end of the oblique pad 13b are as follows. It is sufficient that three linear pads are provided between the lengths Lpy1 and no linear pads are provided between the lengths Lpy2, or five linear pads are provided between the lengths Lpy1. And two linear pads may be arranged between the lengths Lpy2, or more linear pads may be provided with the same number difference.

(Effect of Example 2)
As described above, according to the universal substrate of the second embodiment, the first diagonal pad that extends to one end portion in the lateral direction and inclines in one direction in the longitudinal direction toward the end portion, and the other end in the longitudinal direction toward the other end portion. A plurality of inclined second oblique pads are provided, and the pitch between the end position of the first oblique pad and the end position of the second oblique pad is equally spaced. Components with pitches different from 0.635 mm pitch can also be mounted.

<< Other modifications >>
In the above description of the embodiments, the example in which the pads are provided on one side of the insulating base material has been described. However, the pads described in the above embodiments may be provided symmetrically on both sides. In this case, when the repair circuit is mounted, an insulating sheet may be disposed on the printed board, and the two-sided universal board may be disposed on the insulating sheet.

  As described above, the present invention can be widely used as a printed circuit board repair board.

DESCRIPTION OF SYMBOLS 1 Universal substrate 2 Pad 3 Base material 4 Cover 5 Core 6 Chip component 9 SOP component 11 Jumper wire 12x Connection solder 13a 13b Diagonal pad 13x Joint part 15 Mini mold Lp1 Pad space | interval (longitudinal direction)
Lpw Pad width (longitudinal direction)
ΔLp Pad gap length (longitudinal direction)
ΔW1, ΔW2 Pad gap length (short direction)

Claims (6)

It is a universal board that modifies the printed circuit board,
A universal substrate characterized in that a plurality of pads having a first gap in the longitudinal direction and a second gap in the short direction are provided on an insulating base material.   A plurality of the second gaps are provided in the short direction, and the length of the first gap is different from the length of the second gap, and the lengths of the second gaps are different from each other. The universal substrate according to claim 1, wherein the universal substrate is configured as described above.   2. The universal substrate according to claim 1, wherein any one of the pads extends to one end in a short direction.   The universal substrate according to claim 2, wherein the pitch of the pads in the longitudinal direction is 0.635 mm.   A plurality of first oblique pads that extend to one end in the short direction and incline in one direction in the longitudinal direction toward the end and a plurality of second oblique pads that incline in the other direction in the longitudinal direction toward the end are provided. 5. The universal substrate according to claim 1, wherein a pitch between an end position of the oblique pad and an end position of the second oblique pad is equal. 5.   The universal substrate according to claim 1, wherein the base material and the pad are covered with a cover to form a tape shape.

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