JP2012141152A - Component detection probe and component detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component detection probe that can maintain a detection accuracy of a component.SOLUTION: A component detector includes: holding cylinders 21; front end probes 23 each having one end protruding from the holding cylinder 21 to contact a part 8 installed on an inspection substrate 7 and the other end slidably held by and positioned in the holding cylinder 21; and rear end probes 26 electrically contacting the other ends of the front end probes 23 sliding into the holding cylinders 21, where a pair of the rear end probes 26 are provided electrically insulated to each other in the holding cylinders 21, at least the other ends of the front end probes 23 are configured by a conductive material, and when the front end probes 23 slide into the holding cylinders 21, the other ends of the front end probes 23 cause short circuit in the pair of the rear end probes 26 on the other ends.

Description

  The present invention relates to a component detection probe for detecting the presence or absence of a component to be mounted on an inspection board, and a component detection apparatus including the component detection probe.

  As this type of component detection probe, various component detection probes (component presence / absence detection probes) disclosed in Patent Document 1 below are known. Among these component detection probes, the most common component detection probe is a component detection probe disclosed as a conventional technique, and maintains a conductive state with a holding cylinder made of a conductive material. The first contact probe made of metal (that is, conductive) that is slidably held by the holding cylinder, and the metal (that is, conductive) that is attached to the holding cylinder via an insulating collar. And a second contact probe.

  The component detection probe is moved by a predetermined distance from one end side of the first contact probe protruding from the holding cylinder toward the inspection board, and this one end side is mounted on the inspection board during the movement of the predetermined distance. The first contact probe is slid into the holding cylinder (pressed in) and the other end is electrically connected to the second contact probe attached in the holding cylinder. Contact. On the other hand, when the component is not mounted on the inspection board, the first contact probe does not slide into the holding cylinder because the state of contact with the component does not occur, so that the other end side of the first contact probe Does not contact the second contact probe. Therefore, according to this component detection probe, the resistance value between the first contact probe and the second contact probe (specifically, the first contact is connected to the holding cylinder and is passed through the holding cylinder). It is possible to reliably detect whether or not a component is executed on the inspection board by measuring a resistance value between the wire connected to the probe and the wire connected to the second contact probe. It has become.

Japanese Patent Laid-Open No. 6-230063 (2nd page, FIG. 5)

  However, this component detection probe has the following problems to be improved. That is, in this component detection probe, the first contact probe is in electrical contact with the holding cylinder while sliding (in other words, the two members in contact with each other in a sliding state are contact points). Therefore, an increase in contact resistance between the two due to a change with time is brought about at an early stage. For this reason, this component detection probe has a problem to be solved that the detection accuracy may be lowered early due to the increase in the contact resistance.

  The present invention has been made to improve such a problem, and a main object of the present invention is to provide a component detection probe and a component detection apparatus capable of maintaining the detection accuracy of components.

  To achieve the above object, the component detection probe according to claim 1 is slidably held by the holding cylinder in a state where one end side protrudes from the holding cylinder and the other end side is located in the holding cylinder. A component provided with the tip probe, a component mounted on an inspection board, and a rear end probe that comes into contact with the one end side and slides into the holding cylinder and makes electrical contact with the other end side of the tip probe A pair of detection probes, wherein the rear end probes are electrically insulated from each other and are arranged in the holding cylinder, and the front end probe is composed of a conductive material at least on the other end side, When sliding into the holding cylinder, the pair of rear end probes are short-circuited on the other end side.

  To achieve the above object, the component detection apparatus according to claim 2 is a measurement that is connected to the component detection probe according to claim 1 and is connected to the pair of rear end probes to measure a resistance value between the pair of rear end probes. And when the resistance value measured by the measurement unit exceeds a predetermined reference value, the component is in a non-mounted state, and when the resistance value is equal to or less than the reference value, the component is in a mounted state. And a processing unit for discrimination.

  According to the component detection probe of the first aspect, since at least the pair of the rear end probes does not include a configuration in which the portions that are in contact with each other in contact with each other are in contact with each other. As a result of being able to reliably avoid the situation where an increase is caused early, the resistance value between each rear end probe in the contact state with the other end side of the tip probe is set to a resistance value close to zero Ω over a long period of time. You can continue to measure.

  In the component detection apparatus according to the second aspect, the resistance value of the component detection probe in the mounted state of the component can be measured over a long period of time as a resistance value close to zero Ω. Therefore, according to this component detection apparatus, the resistance value of each component detection probe measured in this way can be measured in combination with the fact that the resistance value of the component detection probe when the component is not mounted can be measured as a very large resistance value. By comparing the value with the reference value, it is possible to continue to detect the mounting state of the component on the inspection board with high detection accuracy.

It is a block diagram in the non-inspection state of the components detection apparatus. FIG. 4 is a cross-sectional view of the component detection probe 12 in a non-conduction state along the central axis. It is a principal part block diagram in the test | inspection state of the components detection apparatus. FIG. 6 is a cross-sectional view of the component detection probe 12 in a conductive state along the central axis. FIG. 6 is a partially cutaway side view of the rear end probe 26.

  Hereinafter, an embodiment of a component detection probe 12 and a component detection apparatus 1 including the component detection probe 12 will be described with reference to the accompanying drawings.

  First, the configuration of the component detection apparatus 1 will be described with reference to FIGS.

  As shown in FIG. 1, the component detection apparatus 1 includes a pin board unit 2, a drive unit 3, a measurement unit 4, a processing unit 5, and a display unit 6, and includes one or more predetermined positions ( Whether or not a component (electronic component or the like) 8 is mounted at the mounting position) can be inspected. In this example, in order to facilitate understanding of the invention, as an example, components 8a and 8b (hereinafter also referred to as “component 8” unless otherwise distinguished) are mounted on two mounting positions A and B, respectively. I will give you a description.

  The pin board unit 2 includes a board body 11 and the same number of component detection probes 12 as components 8 to be inspected. The board body 11 is formed as a flat plate using a non-conductive material (for example, a synthetic resin material such as acrylic) as an example, and a component for detecting the presence or absence of the components 8 mounted on the inspection board 7. A through hole 11 a is formed along the thickness direction at a position corresponding to 8. In this example, since the components 8a and 8b mounted on the inspection board 7 are components to be inspected, through holes 11a are formed at positions corresponding to the components 8a and 8b, respectively.

  As shown in FIGS. 1 and 2, the component detection probe 12 includes a holding cylinder 21, a sleeve 22, a tip probe 23, a spring 24, an insulating cover 25, and a pair of rear end probes 26. The holding cylinder 21 is formed in a cylindrical shape using a metal material as an example. Note that the holding cylinder 21 may be formed in a polygonal cylinder shape (triangular cylinder shape, square tube shape, or the like) instead of the cylindrical shape. The sleeve 22 is formed using an insulating material (for example, a synthetic resin material), and is mounted inside one end side (the upper end side in FIG. 1 and the left end side in FIG. 2) of the holding cylinder 21. . Further, the sleeve 22 is formed with a through hole 22a (a circular hole having a cross-sectional shape on a plane orthogonal to the central axis as an example) through which a plunger 23a described later of the distal probe 23 is slidably inserted. In this example, as an example, the sleeve 22 is disposed so that the central axis of the through hole 22 a coincides with the central axis of the holding cylinder 21.

  The tip probe 23 is formed in a columnar shape (in this example, a columnar shape as an example) and is slidably inserted into the through hole 22a of the sleeve 22, and one end side of the plunger 23a that protrudes outside the holding cylinder 21 The head 23b disposed on the upper end side in FIG. 1 (the left end side in FIG. 2) and the other end side of the plunger 23a located inside the holding cylinder 21 (the lower end side in FIG. A contact plate 23c disposed on the right end side) is provided. In this example, as an example, the tip probe 23 is configured such that the plunger 23a, the head portion 23b, and the contact plate 23c are integrally formed using a conductive metal material. In the tip probe 23, it is sufficient that at least the contact plate 23c has conductivity. Therefore, the plunger 23a and the head portion 23b can be configured using a non-conductive material such as a synthetic resin. In addition, the head portion 23b and the contact plate 23c are formed in a planar shape larger than the outer diameter of the plunger 23a (planar shape viewed from the axial direction of the plunger 23a) so that the tip probe 23 does not fall out of the sleeve 22. Has been.

  The spring 24 is constituted by a coil spring as an example, and is externally fitted to a portion of the plunger 23a that protrudes to the outside of the holding cylinder 21 (the head portion 23b and the sleeve in a state where this portion of the plunger 23a is inserted into the inside). 22). In addition, the spring 24 is disposed in a contracted state, thereby urging the head portion 23b in a direction that always separates from the sleeve 22. With this configuration, in the state where the external force in the direction of the sleeve 22 is not applied to the head portion 23b, the distal end probe 23 is moved away from the rear end probe 26 by the biasing force of the spring 24. The contact plate 23c is in contact with the end face located inside the holding cylinder 21. The insulating cover 25 is formed using an insulating material (for example, a synthetic resin material) and is mounted inside the other end side (the lower end side in FIG. 1 and the right end side in FIG. 2) of the holding cylinder 21. Yes.

  As shown in FIG. 5 as an example, the pair of rear end probes 26 has a conductive metal cylinder 31, a conductive metal contact 32, a conductive metal spring 33, and a conductive property. A metal connector 34 is provided. The metal cylinder 31 is formed in a cylindrical shape as an example, and a partition wall 31a is formed inside an intermediate portion along the longitudinal direction (left-right direction in the figure). The contact 32 is formed in a columnar shape (in this example, a columnar shape), and the rear end side (the right end side in the figure) is from the one end side (the left end side in the figure) to the inside of the metal cylinder 31. By being inserted into the metal cylinder 31, the tip end side (the left end side in the figure) is attached to the metal cylinder 31 in a state of protruding from the metal cylinder 31. With this configuration, the contact 32 is slidable along the axis of the metal cylinder 31 in a state where the rear end side is guided by the metal cylinder 31.

  The spring 33 is mounted between the rear end of the contact 32 inserted in the metal cylinder 31 and the partition wall 31a in the metal cylinder 31 so as to be extendable along the axis of the metal cylinder 31. Further, the end portion of the spring 33 on the rear end side of the contact 32 is connected to the rear end of the contact 32 in a conductive state, and the end portion of the spring 33 on the partition wall 31a side is connected to the partition wall 31a. It is connected in a secured state. With this configuration, the contact 32 is connected via the spring 33 so as not to fall out of the metal cylinder 31. The contact 32 is configured to be able to protrude into the metal cylinder 31 while sliding with respect to the metal cylinder 31 by elastic deformation of the spring 33. Note that in the pair of rear end probes 26, the protrusion lengths of the contacts 32 from the metal tube 31 on the front end side are aligned to the same length.

  A wire 35 wired between the measurement unit 4 and the connector 34 is connected to the connector 34. The connector 34 is formed in a columnar shape and is electrically connected to the metal cylinder 31 by being press-fitted into the metal cylinder 31 from the other end side (right end side in the figure) of the metal cylinder 31. ing. With the above configuration, in each rear end probe 26, the contact 32 is electrically connected to the measurement unit 4 via the spring 33, the metal cylinder 31, the connector 34, and the wire 35. In each of the rear end probes 26, the contact 32 is in direct electrical contact with the metal cylinder 31 on the outer peripheral surface because the outer peripheral surface thereof is in contact with the inner peripheral surface of the metal cylinder 31 in a slidable state. Although it is in a state, since the contact resistance at the sliding portion is unstable, as described above, it is in a state of being electrically connected to the metal cylinder 31 mainly via the spring 33.

  In addition, as shown in FIGS. 1 and 2, the pair of rear end probes 26 configured as described above are in a state of being parallel to and spaced apart from each other with each contact 32 being inserted into the holding cylinder 21. It is attached (fixed) to the insulating cover 25. Further, as an example in this example, each rear end probe 26 is in a state parallel to the plunger 23a, and one end side (the upper end side in FIG. 1 and the left end side in FIG. 2) of the metal cylinder 31 is from the insulating cover 25. The other end (the lower end side in FIG. 1 and the right end side in FIG. 2) protrudes from the insulating cover 25 to the outside of the holding cylinder 21. Further, the contact plate 23c in a state where the external force in the direction toward the sleeve 22 is not applied to the head portion 23b (the contact plate 23c is in contact with the sleeve 22), and the contact 32 in each rear end probe 26. The distance L1 from the tip of the head is defined to be equidistant and shorter than the height H1 of the component 8 whose mounting state is to be inspected.

  Each component detection probe 12 configured as described above has the same length from the surface of the board body 11 to the tip (head portion 23b) of each tip probe 23 in the through hole 11a formed in the board body 11. It is attached to become.

  The drive unit 3 is controlled by the processing unit 5 to keep the inspection board 7 and the pin board unit 2 relatively close to each other while maintaining the inspection board 7 and the board body 11 of the pin board unit 2 parallel to each other. Move. In this example, as an example, the driving unit 3 moves the inspection board 7 toward and away from the pin board unit 2 while maintaining the inspection board 7 in a state parallel to the board body 11. The measuring unit 4 is electrically connected to the pair of rear end probes 26 (in this example, the connector 34 constituting the rear end probe 26) of each component detection probe 12 attached to the pin board unit 2 and the wire 35 as described above. Connected. In addition, the measurement unit 4 is controlled by the processing unit 5 to output an inspection signal (inspection current as an example) to the pair of rear end probes 26 of each component detection probe 12 and also due to the output of the inspection signal. Then, the voltage generated between each rear end probe 26 is measured, and the resistance value between the pair of rear end probes 26 of each component detection probe 12 is measured based on the measured voltage and the inspection current. In addition, the measurement unit 4 outputs the measured resistance value of each component detection probe 12 to the processing unit 5.

  The processing unit 5 obtains the resistance value (resistance value between the pair of rear end probes 26) for each of the component detection probes 12 output from the measurement unit 4 and a predetermined reference value (reference resistance value). By performing the comparison, a mounting state inspection process for inspecting the mounting state of the component 8 on the inspection substrate 7 to be inspected is executed. Further, the processing unit 5 displays the inspection result on the display unit 6 configured by, for example, a display device.

  Next, the operation of the component detection apparatus 1 will be described. As shown in FIG. 1, the inspection board 7 is assumed to be in a state where the component 8a is normally mounted at the mounting position A and the component 8b is not mounted at the mounting position B.

  As shown in FIG. 1, in the state where the inspection board 7 is separated from the pin board unit 2 (non-inspection state), in each component detection probe 12, the front end probe 23 is moved by the urging force of the spring 24. Has been separated from. That is, the tip probe 23, the contact plate 23c, and the contact 32 of the rear end probe 26 are not in contact with each other as shown in FIG.

  When executing the inspection on the inspection substrate 7, the processing unit 5 first controls the drive unit 3 to predefine the inspection substrate 7 from the above state toward the pin board unit 2 (downward in FIG. 1). After being moved by the distance (approaching the pinboard unit 2), the movement of the inspection board 7 is stopped. Thereby, the inspection board 7 is moved to the position shown in FIG. 3 with respect to the pin board unit 2 by the drive unit 3.

  In this state, in the component detection probe 12 for inspecting the mounting state of the component 8a at the mounting position A, since the component 8a is normally mounted, the tip probe 23 comes into contact with the component 8a and is inspected. As the substrate 7 moves, it is moved toward the rear end probe 26 against the urging force of the spring 24 (slid in the holding cylinder 21) as shown in FIGS. The contact plate 23c is in a state (contact state) in contact with the contact 32 of each rear end probe 26 (see FIG. 4). As described above, the rear end probe 26 is configured such that the contact 32 can enter the metal cylinder 31 against the urging force of the spring 33. Therefore, the stress that the component 8 a receives from the component detection probe 12 when the contact plate 23 c and the contact 32 of each rear end probe 26 abut is alleviated by the spring 33.

  On the other hand, in the component detection probe 12 for inspecting the mounting state of the component 8b at the mounting position B, since the component 8b is not mounted, the tip probe 23 does not contact the component 8b, and the component 8b. Since the height H1 is longer than the distance L1 between the contact plate 23c and the rear end probe 26, the test board 7 is not in contact with the height H1. As a result, in the component detection probe 12 on the side corresponding to the mounting position B, as shown in FIGS. 3 and 4, the tip probe 23 does not move to the rear probe 26 side. The rear end probe 26 (specifically, the contact 32) is maintained in a non-contact state (non-contact state).

  Next, the processing unit 5 controls the measurement unit 4 to measure the resistance value between the pair of rear end probes 26 in each component detection probe 12. In this example, in the component detection probe 12 for inspecting the mounting state of the component 8a at the mounting position A, the contact plate 23c is in contact with the contact 32 of the rear end probe 26 as described above. That is, the pair of rear end probes 26 is short-circuited by the contact plate 23c. In each rear end probe 26, the contact 32 that contacts the contact plate 23 c not only makes electrical contact with the metal cylinder 31 via the sliding portion with the metal cylinder 31, but also via the spring 33. 31 is electrically connected mainly to the wire rod 35 via the spring 33, the metal tube 31 and the connector 34, and further electrically connected to the measuring unit 4 via this wire rod 35. Yes. As a result, in the current path from one rear end probe 26 to the other rear end probe 26 of the pair of rear end probes 26, the contact formed by the portions that are in contact with each other in a sliding state in the two members. Does not exist. For this reason, in this component detection apparatus 1, the measurement unit 4 is short-circuited by the contact plate 23c without being affected by the change in resistance value due to the change over time in the contact resistance between the parts that contact in this sliding state. It is possible to continue to measure the resistance value between the pair of rear end probes 26 at that time as a resistance value very close to zero Ω.

  On the other hand, in the component detection probe 12 for inspecting the mounting state of the component 8b at the mounting position B, the contact plate 23c is not in contact with the contact 32 of the rear end probe 26 as described above. As a result, the measurement unit 4 measures the resistance value of the component detection probe 12 when the component 8b is not mounted as an extremely large resistance value close to infinity, and outputs the measured resistance value to the processing unit 5.

  The processing unit 5 inputs the resistance value of each component detection probe 12 measured by the measurement unit 4 in this way, and executes a mounting state inspection process. In this mounting state inspection process, the processing unit 5 compares the resistance value of each component detection probe 12 with a reference value, and determines that the component 8 is not mounted at the mounting position when the reference value is exceeded. The result is displayed on the display unit 6, and when the value is below the reference value, it is determined that the component 8 is mounted at the mounting position, and the inspection result is displayed on the display unit 6. Finally, the processing unit 5 controls the driving unit 3 to move the inspection board 7 away from the pin board unit 2 and stop it above the pin board unit 2. Thereby, the inspection with respect to the inspection substrate 7 is completed.

  As described above, in this component detection probe 12, the pair of rear end probes 26 come into contact with the contact plate 23c of the front end probe 23 slidably attached to the holding cylinder 21 without sliding. It is configured to be short-circuited by the contact plate 23c.

  Therefore, according to the component detection probe 12, at least a portion between the tips of the rear end probes 26 (between the contacts 32 of the pair of rear end probes 26 in this example) that are in contact with each other is used as a contact. As a result, it is possible to reliably avoid a situation in which an increase in contact resistance due to a change with time is caused at an early stage. As a result, a resistance value between the rear end probes 26 in a contact state with the contact plate 23c. Can be continuously measured as a resistance value close to zero Ω over a long period of time. In addition, according to this component detection probe 12, the contact 32 that contacts (contacts) the contact plate 23 c in each rear end probe 26 is electrically connected to the metal cylinder 31 via the spring 33. Since the contact 32 and the metal tube 31 do not include a configuration in which the contact portions are in contact with each other in the sliding state, the rear end probes 26 in the contact state with the contact plate 23c are not included. The resistance value can be continuously measured as a resistance value near zero Ω more reliably over a long period of time.

  Moreover, in the component detection apparatus 1 using this component detection probe 12, the resistance value of the component detection probe 12 (component detection probe 12 in the mounting state of the component 8) corresponding to the mounting position where the component 8 is mounted is described above. Thus, it can be measured over a long period of time as a resistance value close to zero Ω. Therefore, according to this component detection apparatus 1, the resistance value of the component detection probe 12 (component detection probe 12 when the component 8 is not mounted) corresponding to the mounting position where the component 8 is not mounted is set to a very large resistance value. Coupled with being able to be measured, the resistance value of each component detection probe 12 measured in this way is compared with a reference value, thereby continuously detecting the mounting state of the component 8 on the inspection board 7 with high detection accuracy. Can do.

  In addition, in the said component detection probe 12, although the structure which forms the holding cylinder 21 using a metal material is employ | adopted, the structure formed using a resin material is also employable. When this configuration is adopted, the holding cylinder 21 and the insulating cover 25 can be integrally formed by using an insulating material as the resin material, so that the manufacturing process can be simplified. Can do. The feature of the component detection probe 12 is that a pair of (two) rear end probes 26 are arranged on one component detection probe 12, and the front end probe 23 moves toward the rear end probe 26 in contact with the component 8. Therefore, as long as this configuration can be secured, it is needless to say that a configuration other than the above configuration can be adopted as the mounting structure of the tip probe 23 to the holding cylinder 21.

  In addition, the component detection apparatus 1 employs a configuration in which the inspection board 7 is moved toward and away from the pin board unit 2, but the drive unit 3 is controlled by the processing unit 5 to change the board body 11. It is also possible to adopt a configuration in which the pin board unit 2 is moved toward and away from the inspection board 7 while being maintained in a state parallel to the inspection board 7.

DESCRIPTION OF SYMBOLS 1 Component detection apparatus 4 Measuring part 5 Processing part 7 Inspection board 8 Parts 12 Component detection probe 21 Holding cylinder 23 Front end probe 26 Rear end probe

Claims (2)

A holding cylinder, a tip probe that is slidably held by the holding cylinder in a state where one end side protrudes from the holding cylinder and the other end side is located in the holding cylinder, a component mounted on an inspection board, and the one end A component detection probe comprising a rear end probe that comes into electrical contact with the other end side of the tip probe that comes into contact with and slides into the holding cylinder,
A pair of the rear end probes are disposed in the holding cylinder in a state of being electrically insulated from each other,
The tip probe is a component detection probe in which at least the other end side is made of a conductive material and shorts the pair of rear end probes on the other end side when sliding into the holding cylinder. The component detection probe according to claim 1,
A measuring unit connected to the pair of rear end probes to measure a resistance value between the pair of rear end probes;
A process for determining that the component is in a non-mounted state when the resistance value measured by the measuring unit exceeds a predetermined reference value, and that the component is in a mounted state when the resistance value is equal to or less than the reference value. And a component detection device.

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