JP2012138642A - Electronic apparatus and substrate unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus and a substrate unit which reduce the size.SOLUTION: A substrate unit includes: a printed substrate and multiple connectors including a first and second connectors, which are provided at a predetermined surface of the printed substrate so as to face in directions opposite to each other and are located next to each other, and a third connector which is provided at the predetermined surface, is located next to the first connector, and faces in the same direction as the first connector. A gap between the first connector and the second connector is narrower than a gap between the first connector and the third connector.

Description

  The present invention relates to an electronic device and a substrate unit.

  An electronic device is known that includes a backplane having a plurality of connectors and a plurality of electronic device units connected to the connectors. The electronic device unit has a unit substrate on which electronic components are mounted, and signals and power are supplied to the electronic components mounted on the unit substrate by electrically connecting the unit substrate and the backplane. . For example, a technique for efficiently connecting electronic device units having different form factors to a backplane in a predetermined space is known.

JP-T-2004-503890

  Since a plurality of electronic device units are connected to the backplane, the backplane occupies a large proportion of the entire electronic device. Therefore, even if the electronic device unit can be efficiently connected in a limited space, if the backplane is large, the entire electronic device may be large. When the electronic device is increased in size, it leads to deterioration in cooling efficiency, an increase in manufacturing cost accompanying an increase in size of the housing and an increase in size of the cooling fan, and an increase in weight.

  Accordingly, the present invention has been made in view of the above problems, and an object thereof is to provide a miniaturized electronic device and a substrate unit.

  In order to solve the above problem, an electronic device disclosed in this specification is connected to a board unit having a printed board, a plurality of connectors provided on a predetermined surface of the printed board, and the plurality of connectors, respectively. And first and second electronic device units that face in opposite directions and protrude from the printed circuit board. Thereby, the connector on the printed circuit board connected to each of the first and second electronic device units can be arranged close to each other without the first and second electronic device units interfering with each other. Thereby, the size of the printed circuit board can be reduced, and the electronic device can also be reduced in size.

  Further, the board unit disclosed in the present specification includes a printed circuit board, first and second connectors adjacent to each other provided on a predetermined surface of the printed circuit board and facing opposite directions, and the first connector provided on the predetermined surface. A plurality of connectors that are adjacent to each other and face the same direction as the first connector, and the distance between the first connector and the second connector is the first connector and the third connector Narrower than the interval. Thereby, the connectors facing in opposite directions can be arranged close to each other. Thereby, a printed circuit board can be reduced in size.

  An electronic device disclosed in the present specification includes a plurality of electronic devices including the board unit and first, second, and third electronic device units connected to the first, second, and third connectors, respectively. Unit. Thereby, an electronic device can be reduced in size.

  The electronic device and the substrate unit disclosed in this specification are miniaturized.

It is a perspective view of a server. It is a front view of a unit system. It is a perspective view of a unit system. It is the perspective view seen from the back of a unit system. It is the figure which showed the connection state of a backplane and a unit board | substrate. It is the figure which showed the connection state of a backplane and a unit board | substrate. It is the figure which showed the connection state of a backplane and a unit board | substrate. It is explanatory drawing of attachment / detachment of a connector. It is explanatory drawing of a unit. It is a comparison figure of the unit system which concerns on Example 2, and the unit system which has a structure different from the unit system which concerns on Example 2. FIG. It is a comparison figure of the unit system which concerns on Example 2, and the unit system which has a structure different from the unit system which concerns on Example 2. FIG. FIG. 10 is an explanatory diagram of a unit system according to a third embodiment. It is a comparison figure of the unit system which concerns on Example 4, and the unit system which has a structure different from the unit system which concerns on Example 4. FIG. It is a comparison figure of the unit system which concerns on Example 5, and the unit system which has a structure different from the unit system which concerns on Example 5. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  An electronic device according to an example of an embodiment will be described. A server 1 will be described as an example of the electronic device. FIG. 1 is a perspective view of the server 1. The server 1 includes a frame 100, a backplane (printed circuit board) 10 held in the frame 100, and unit groups 20, 30, and 40 electrically connected to the backplane 10. Note that FIG. 1 shows a state in which the side plate provided on the side surface of the frame 100 is removed.

  The unit groups 20, 30, and 40 include unit boards on which electronic components such as a microprocessor, a memory, a hard disk, and a heat sink are mounted. The backplane 10 is for supplying signals and power to the unit groups 20, 30 and 40. The unit groups 20, 30, and 40 can be connected to and removed from the backplane 10. A unit group 40 is arranged on the lower rack 110 and the middle upper rack 130 of the frame 100. In the middle rack 120, unit groups 20 and 30 are arranged. The unit groups 20 and 30 are connected to the middle part of the backplane 10. The unit group 40 is arranged vertically so as to sandwich the unit groups 20 and 30. At the bottom of the frame 100, a caster 180 for movement and a stopper 182 for preventing the movement are provided.

  Next, the unit system 90 will be described. The unit system 90 includes a backplane 10 and unit groups 20, 30 and 40 connected to the backplane 10. 2 is a front view showing the unit system 90, FIG. 3 is a perspective view of the unit system 90, and FIG. 4 is a perspective view of the unit system 90 as seen from the back. 2 to 4, the unit connected to the back surface of the backplane 10 is omitted.

  The unit group 20 includes units (electronic device units) 20a and 20b, the unit group 30 includes units 30a to 30c, and the unit group 40 includes units 40a to 40d. The unit groups 20, 30, and 40 are connected to the same surface side of the backplane 10. Units 40 a and 40 b are connected to the upper stage of the backplane 10, and units 40 c and 40 d are connected to the lower stage of the backplane 10. Units 20 a and 20 b and units 30 a to 30 c are connected to the middle stage of the backplane 10.

  The units 30a to 30c connected in the middle stage of the backplane 10 are formed thinner than the units 20a and 20b. Each of the units 20a, 20b, 30a to 30c, and 40a to 40d has a unit substrate described later.

  Each of the units 20 a, 20 b, 30 a to 30 c is provided with handles 29 a, 29 b, 39 a to 39 c for connecting to the back plane 10 and for detaching from the back plane 10.

  As shown in FIGS. 2 to 4, the units 40a and 40b are connected to the backplane 10 in the same direction. The units 40c and 40d are also connected to the backplane 10 in the same direction. The units 40a and 40b and the units 40c and 40d are connected to the backplane 10 in the opposite direction.

  The units 20a and 20b are disposed on the outermost side of the middle portion of the backplane 10 and are connected to the backplane 10 in opposite directions.

  Next, the unit substrate will be described. 5 to 7 are views showing a connection state between the backplane 10 and the unit substrate. 5 to 7, the unit substrate of the unit connected to the back surface of the backplane 10 is also illustrated. 5 to 7, details of electronic components mounted on each unit board are omitted.

  As shown in FIGS. 5 to 7, the units 20a, 20b, 30a to 30c, and 40a to 40d have unit substrates 21a, 21b, 31a to 31c, and 41a to 41d, respectively. These unit substrates 21a, 21b, 31a to 31c, and 41a to 41d are provided with connectors 23a, 23b, 33a to 33c, and 43a to 43d on predetermined surfaces, respectively. The connectors 23a, 23b, 33a to 33c, 43a to 43d ensure electrical connection between the unit substrates 21a, 21b, 31a to 31c, 41a to 41d and the backplane 10, respectively.

  A plurality of connectors are provided for each unit board. The backplane 10 is provided with a plurality of connectors so as to correspond to the connectors provided on the unit substrate. A handle 19 is provided on the side surface of the backplane 10.

  By connecting a plurality of connectors provided on the backplane 10 and connectors provided on each of the unit substrates, signals and power are supplied to the electronic components mounted on the unit substrate. The electronic components are mounted on predetermined surfaces of the unit substrates 21a, 21b, 31a to 31c, and 41a to 41d. This electronic component generates heat when electric power is supplied.

  The connectors provided on the unit substrate are each mounted on the same surface as the surface on which the electronic component is mounted. The surface on which the electronic component is mounted is referred to as a mounting surface. When electronic components are mounted on both sides of the unit substrate, the surface on which the electronic components taller than the unit substrate surface are mounted is defined as a mounting surface.

  As shown in FIG. 7, the mounting surface of the unit substrate 31a and the mounting surfaces of the unit substrates 31b and 31c face each other in opposite directions.

  Next, the attachment / detachment of the connector provided on the backplane 10 and the connector provided on the unit substrate will be briefly described. FIG. 8 is an explanatory diagram of attaching and detaching connectors.

  FIG. 8A is an enlarged view around the connector 33a provided on the unit substrate 31a. As shown in FIG. 8A, the connector 33a is connected to a connector 13a provided on the backplane 10. FIG. 8B shows a state where the connector 33a is detached from the connector 13a.

  The connector 13a has a predetermined direction in which insertion by the connector 33a is allowed. For example, it is not possible to insert the connector 33a into the connector 13a by detaching the unit substrate 31a from the state shown in FIG. 8A and inverting the unit substrate 31a. The same applies to other connectors provided on the backplane 10.

  As described above, the units 20 a and 20 b that are thicker than the units 30 a to 30 c are arranged on the outermost side in the middle portion of the backplane 10. The units 20a and 20b face in opposite directions, and the mounting surface faces the outside of the backplane 10 as shown in FIGS. The unit 20a and the unit 30a adjacent to the unit 20a can be connected to the backplane 10 while being close to each other while preventing interference. The same applies to the unit 20b and the unit 30c adjacent to the unit 20b. Thereby, since the unit system 90 is reduced in size, the frame 100 is also reduced in size. Further, the connector on the backplane 10 side connected to the unit boards 21a and 21b can be provided at a position closer to other connectors adjacent to the connector. Thereby, the backplane 10 can be reduced in size.

  All of the units 20a, 20b, and 40a to 40d protrude from the backplane 10. For this reason, when a cooling fan (not shown) is installed in the frame 100, the portion protruding from the backplane 10 has little resistance to air blown by the backplane 10, so that the unit can be efficiently cooled. Thereby, cooling efficiency improves.

  Next, the vent hole provided in the unit will be described. FIG. 9 is an explanatory diagram of the unit 20b. 9A is a perspective view of the unit 20b viewed from the right side, FIG. 9B is a perspective view of the unit 20b viewed from the left side, and FIG. 9C is a perspective view of the unit 20b viewed from the rear side. FIG.

  A front panel 27b1 made of metal is provided on the front surface of the unit 20b. The front panel 27b1 is formed in a fence shape, and a plurality of vent holes 28b1 are formed. Similarly, the upper panel 27b2 is provided with a plurality of vent holes 28b2. The rear panel 27b5 is also provided with two vent holes 28b5. The side panels 27b3 and 27b4 are not provided with vent holes. The vent holes 28b1, 28b2, 28b5 have a function of introducing and discharging the air blown by the cooling fan into the unit 20b. Further, as shown in FIG. 4, since the vent hole 28b5 formed in the back panel 27b5 protrudes from the backplane 10, air can be introduced into the unit 20b. Thereby, cooling efficiency improves.

  Next, a unit system 90a according to the second embodiment will be described. 10A and 10B are comparison diagrams comparing the unit system 90a according to the second embodiment with a unit system 90x having a structure different from the unit system 90a. 10A is a side view of the unit system 90x, and FIG. 10B is a side view of the unit system 90a. In addition, in FIG. 10, each member is simplified and shown.

  As shown in FIG. 10A, when the connector 53ax provided on the unit board 51ax and the connector 15ax provided on the backplane 10x are connected, the unit 50ax is connected to the backplane 10x. The same applies to the unit 70ax.

  As shown in FIG. 10A, the unit 50ax and the unit 70ax are connected in the same direction in the longitudinal direction of the backplane 10x. In other words, the connectors 53ax and 17ax connected to the connectors 53ax and 73ax, respectively, face the same direction. For this reason, the backplane 10x is enlarged by the space S corresponding to the height of the unit 70ax.

  On the other hand, as shown in FIG. 10B, the unit 50a and the unit 70a are connected to the backplane 10a in opposite directions in the longitudinal direction of the backplane 10a. That is, the connectors 15a and 17a connected to the connectors 53a and 73a face in opposite directions. For this reason, the connectors 15a and 17a can be provided at close positions on the backplane 10a. Thereby, compared with the unit system 90x, the backplane 10a which concerns on Example 2 can be reduced in size. Further, as shown in FIG. 10B, since the backplane 10a is downsized, both the units 50a and 70a protrude from the backplane 10a. Thereby, the cooling efficiency of the units 50a and 70a is improved.

  FIG. 11A is a top view of the unit system 90x, and FIG. 11B is a top view of the unit system 90a. In addition, also in FIG. 11 (A) (B), each member is simplified and shown.

  As shown in FIG. 11A, the units 50ax and 50bx are formed thicker than the units 60ax and 60bx. The units 50ax, 50bx, 60ax, and 60bx have unit substrates 51ax, 51bx, 61ax, and 61bx, respectively. On the unit boards 51ax, 51bx, 61ax, 61bx, electronic components 55ax, 55bx, 65ax, 65bx are mounted on predetermined surfaces, respectively. The units 50ax, 50bx, 60ax, 60bx all face the same direction. That is, the mounting surfaces of the unit substrates 51ax, 51bx, 61ax, 61bx are directed in the same direction.

  The unit substrate 51bx of the unit 50bx arranged on the outermost side of the backplane 10x faces the outside of the backplane 10x. However, the unit board 51ax of the unit 50ax disposed on the outer side of the back plane 10x on the side opposite to the unit 50bx faces the inside of the back plane 10x. For this reason, the connector 53ax is separated from the adjacent connector 63ax by an amount corresponding to the space S corresponding to the thickness of the unit 50ax. Therefore, it is necessary to separate the connectors 15ax and 16ax from the space S. For this reason, the size of the backplane 10x is increased.

  On the other hand, as shown in FIG. 11B, the units 50a and 60a and the units 50b and 60b face in opposite directions. The units 50a and 50b arranged on the outermost side of the backplane 10a face the outside of the backplane 10a. That is, the mounting surfaces of the unit substrates 51a and 51b that the units 50a and 50b have respectively face the outside of the backplane 10a.

  Accordingly, the connectors 15a and 16a can be provided close to each other without interfering with the units 50a and 60a. Thereby, the size of the backplane 10a can be reduced. As a result, the cooling efficiency is also improved.

  Next, a unit system 90b according to the third embodiment will be described. FIG. 12 is an explanatory diagram of a unit system 90b according to the third embodiment.

  Units 50a1 and 50a2 are provided at the corners on one diagonal line of the backplane 10b, and units 70a1 and 70a2 are provided at the corners on the other diagonal line. The units 50a1 and 50a2 have the same structure, and the units 70a1 and 70a2 have the same structure. The units 50a1, 50a2, 70a1, and 70a2 have unit substrates 51a1, 51a2, 71a1, and 71a2, respectively. The unit boards 51a1, 51a2, 71a1, and 71a2 are provided with connectors 53a1, 53a2, 73a1, and 73a2, respectively.

  In addition, a plurality of units (not shown) are connected to the backplane 10b between the unit 50a1 and the unit 70a2, and a plurality of units (not shown) are also connected between the unit 70a1 and the unit 50a2. Yes.

  The units 50a1 and 70a1 are vertically opposite to each other. Similarly, the units 70a2 and 50a2 are vertically opposite. The units 50a1 and 70a2 are opposite to each other in the left and right directions. Further, the units 70a1 and 50a2 are opposite to each other in the left and right directions. As described above, the units 50a1, 50a2, 70a1, and 70a2 face in the opposite direction vertically and horizontally. Therefore, the connectors 53a1, 53a2, 73a1, and 73a2 can be provided densely on the backplane 10b. Thereby, the backplane 10b can be reduced in size.

  As shown in FIG. 12, the units 50a1, 50a2, 70a1, and 70a2 protrude from the backplane 10b. For this reason, it can blow efficiently to unit 50a1, 50a2, 70a1, 70a2. As a result, the cooling efficiency of the units 50a1, 50a2, 70a1, and 70a2 is improved.

Next, a unit system 90c according to the fourth embodiment will be described.
FIG. 13 is a comparison diagram of a unit system 90c according to the fourth embodiment and a unit system 90x1 having a different structure from the unit system 90c. FIG. 13A is a top view of the unit system 90x1, and FIG. 13B is a top view of the unit system 90c.

  As shown in FIGS. 13A and 13B, the backplane 10x1 of the unit system 90x1 and the backplane 10c of the unit system 90c are substantially the same size. As shown in FIG. 13A, the ten units 70ax to 70jx are all connected to the backplane 10x1 in the same direction. Since the units 70ax to 70jx all face the same direction, the distance between the connectors provided on the backplane 10x1 is equal.

  On the other hand, as shown in FIG. 13B, eleven units 70a to 70k are connected to the unit system 90c. The units 70a to 70e and the units 70f to 70k face in the opposite direction. That is, the units 70a to 70e face the same direction, but the units 70f to 70k face the opposite direction. The units 70a and 70k arranged on the outermost side of the backplane 10c face the outside of the backplane 10c. Further, the units 70a and 70d protrude from the backplane 10c.

  Further, the adjacent units 70e and 70f face in opposite directions. For this reason, the connectors 17e and 17f can be provided close to each other on the backplane 10c. Accordingly, the distance between the connectors 73e and 73f is narrower than the distance between the connectors 73e and 73d, and is smaller than the distance between the connectors 73f and 73g. Thereby, a connector can be densified and can be provided in the backplane 10c.

  On the other hand, since the connectors 17ax to 17jx provided in the unit system 90x1 are arranged at equal intervals, the eleventh connector 17kx cannot be provided in the backplane 10x1. Therefore, only a maximum of 10 units can be connected to the backplane 10x1.

  In other words, if 10 units are connected in the unit system 90c, the size of the backplane 10c can be further reduced than the size of the backplane 10x1.

  Next, a unit system 90d according to the fifth embodiment will be described. FIG. 14 is a comparison diagram of the unit system 90d according to the fifth embodiment and a unit system having a structure different from that of the unit system according to the fifth embodiment. 14A is a top view of a unit system 90x2 having a structure different from that of the unit system 90d, and FIG. 14B is a top view of the unit system 90d.

  As shown in FIG. 14A, six units 80ax to 80fx are connected to the backplane 10x2. Further, the units 80ax to 80fx all face the same direction. For this reason, the distance between the connectors provided on the backplane 10x2 is uniform.

  On the other hand, as shown in FIG. 14B, six units 80a to 80f are connected to the backplane 10d. As shown in FIGS. 14A and 14B, when the thicknesses of the unit 80ex and the unit 80e are compared, the unit 80e is formed thicker. Further, the backplane 10x2 and the backplane 10d are substantially the same size.

  In the unit system 90d according to the fifth embodiment, the units 80a to 80c and the units 80d to 80f are directed in opposite directions. Further, the units 80a and 80f connected on the outermost side of the backplane 10d face the outside of the backplane 10d. Further, as shown in FIG. 14B, the units 80c and 80d face in opposite directions. Specifically, the mounting surface of the unit substrate 81c and the mounting surface of the unit substrate 81d are not opposed to each other and face in opposite directions. For this reason, the interval between the connectors 83c and 83d can be provided narrower than the interval between the connectors 83c and 83b and smaller than the interval between the connectors 83d and 83e.

  Therefore, the back plane 10d can connect the same number of units 80a to 80f that are thicker than the units 80ax to 80fx to the back plane 10d that is substantially the same size as the back plane 10x2. In other words, if the units have the same size, the backplane 10d can be further reduced.

  The above-described embodiment is an example of an embodiment suitable for the disclosed electronic device. However, the present invention is not limited to this, and various modifications can be made without departing from the scope of the present embodiment.

  In the above embodiment, the server has been described as an example, but it may be a router or an exchange.

Claims (4)

A printed circuit board,
Adjacent first and second connectors provided on a predetermined surface of the printed circuit board facing in opposite directions, and third connectors provided on the predetermined surface adjacent to the first connector and facing in the same direction as the first connector A plurality of connectors including,
The board unit, wherein an interval between the first connector and the second connector is narrower than an interval between the first connector and the third connector. A substrate unit according to claim 1;
And a plurality of electronic device units including first, second, and third electronic device units connected to the first, second, and third connectors, respectively. Each of the first and second electronic device units has first and second unit boards having mounting surfaces on which electronic components are mounted, respectively.
3. The electronic device according to claim 2, wherein the mounting surfaces of the first and second unit substrates are opposite to each other without facing each other. The plurality of electronic device units include an outermost electronic device unit disposed on the outermost side farthest from the center of the printed circuit board,
The electronic device according to claim 2, wherein the outermost electronic device unit includes a unit substrate having a mounting surface on which an electronic component is mounted facing outward on a side opposite to the center of the printed circuit board.

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