JP2012137484A - 三次元表面の計測装置及び方法 - Google Patents
三次元表面の計測装置及び方法 Download PDFInfo
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Abstract
【解決手段】評価すべき三次元の微小凹凸面の上に溶液を介して溶液層定常化基板を載置する。レーザ照射部は、溶液層定常化基板を通して単一波長光のレーザ光を微小凹凸面に照射する。微小凹凸面から散乱及び回折した光を光学的にフーリエ変換したフーリエ変換像をフーリエ変換像取得部で取得する。このフーリエ変換像を、信号変換器により光強度分布として電気信号に光電変換する。この取得した光強度分布の波形を、基本波数及び少なくとも一つの高調波数に分解したそれぞれの波長とその振幅をスペクトル情報として抽出して、三次元の微小凹凸面の形状を評価する。
【選択図】 図1
Description
Claims (7)
- 単一波長光のレーザ光を照射するレーザ照射部と、
三次元の微小凹凸面の上に溶液を介して載置した溶液層定常化基板と、
前記微小凹凸面から散乱及び回折した光を光学的にフーリエ変換したフーリエ変換像を取得するフーリエ変換像取得部と、
このフーリエ変換像を光強度分布として、電気信号に光電変換する信号変換器と、
前記取得した光強度分布の波形を、基本波数及び少なくとも一つの高調波数に分解したそれぞれの波長とその振幅をスペクトル情報として抽出する演算器と、を備え、
この抽出したスペクトル情報により前記三次元の微小凹凸面の形状を評価することから成る三次元表面の計測装置。 - 前記三次元の微小凹凸面は、ウェハを研磨中の研磨パッドの表面である請求項1に記載の三次元表面の計測装置。
- 複数種類のコンディショナを用いてコンディショニングした研磨パッドの表面形状のフーリエ変換像をデータベース化し、かつ、研磨前後のウェハ厚を測定することにより得た研磨レートと前記データベース化したフーリエ変換像との相関を見出す請求項2に記載の三次元表面の計測装置。
- 前記溶液層定常化基板は、サファイア基板である請求項1に記載の三次元表面の計測装置。
- 前記レーザ照射部には、ファンクションジェネレータの出力を導くことによりパルス化したレーザ光を照射して、このパルス化レーザ光と、フーリエ変換像の取得を同期させた請求項1に記載の三次元表面の計測装置。
- 前記レーザ照射部は、単一波長光を発生させて照射するか、或いは、複数の波長を持った光発生機を用いて発生したレーザ光から、単一波長光を抽出して照射する請求項1に記載の三次元表面の計測装置。
- 三次元の微小凹凸面の上に溶液を介して載置した溶液層定常化基板を通して、単一波長のレーザ光を照射し、
前記微小凹凸面から散乱及び回折した光を光学的にフーリエ変換したフーリエ変換像を取得し、
このフーリエ変換像を光強度分布として電気信号に光電変換し、
前記光強度分布の波形を、基本波数及び少なくとも一つの高調波数に分解したそれぞれの波長とその振幅をスペクトル情報として抽出して、前記三次元の微小凹凸面の形状を評価することから成る三次元表面の計測方法。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014172154A (ja) * | 2013-03-12 | 2014-09-22 | Ebara Corp | 研磨パッドの表面性状測定装置 |
KR20140111924A (ko) * | 2013-03-12 | 2014-09-22 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 패드의 표면 성상 측정 방법 |
JP2015174156A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社荏原製作所 | 研磨装置 |
WO2016111335A1 (ja) * | 2015-01-07 | 2016-07-14 | 株式会社 荏原製作所 | 研磨パッドの表面性状測定装置を備えたcmp装置 |
US9453725B2 (en) | 2013-02-14 | 2016-09-27 | Qso Interferometer Systems Ab | Method and apparatus for quantitative measurement of surface accuracy of an area |
JP2018151353A (ja) * | 2017-03-15 | 2018-09-27 | ファナック株式会社 | 計測装置 |
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JPS6337205A (ja) * | 1986-07-31 | 1988-02-17 | Tokyo Seimitsu Co Ltd | 表面粗さ測定方法 |
JPH06347244A (ja) * | 1993-06-10 | 1994-12-20 | Tokyo Seimitsu Co Ltd | 表面粗さ測定方法及び装置 |
JPH09285955A (ja) * | 1996-04-23 | 1997-11-04 | Hitachi Ltd | 研磨方法及び研磨装置 |
JP2001223190A (ja) * | 2000-02-08 | 2001-08-17 | Hitachi Ltd | 研磨パッドの表面状態評価方法及びその装置とそれを用いた薄膜デバイスの製造方法及びその製造装置 |
JP2007027781A (ja) * | 1995-03-28 | 2007-02-01 | Applied Materials Inc | ポリッシングパッド |
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JPS6337205A (ja) * | 1986-07-31 | 1988-02-17 | Tokyo Seimitsu Co Ltd | 表面粗さ測定方法 |
JPH06347244A (ja) * | 1993-06-10 | 1994-12-20 | Tokyo Seimitsu Co Ltd | 表面粗さ測定方法及び装置 |
JP2007027781A (ja) * | 1995-03-28 | 2007-02-01 | Applied Materials Inc | ポリッシングパッド |
JPH09285955A (ja) * | 1996-04-23 | 1997-11-04 | Hitachi Ltd | 研磨方法及び研磨装置 |
JP2001223190A (ja) * | 2000-02-08 | 2001-08-17 | Hitachi Ltd | 研磨パッドの表面状態評価方法及びその装置とそれを用いた薄膜デバイスの製造方法及びその製造装置 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9453725B2 (en) | 2013-02-14 | 2016-09-27 | Qso Interferometer Systems Ab | Method and apparatus for quantitative measurement of surface accuracy of an area |
KR101921763B1 (ko) * | 2013-03-12 | 2018-11-23 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 패드의 표면 성상 측정 방법 |
KR20140111924A (ko) * | 2013-03-12 | 2014-09-22 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 패드의 표면 성상 측정 방법 |
JP2014172153A (ja) * | 2013-03-12 | 2014-09-22 | Ebara Corp | 研磨パッドの表面性状測定方法 |
US8932883B2 (en) | 2013-03-12 | 2015-01-13 | Ebara Corporation | Method of measuring surface properties of polishing pad |
TWI593508B (zh) * | 2013-03-12 | 2017-08-01 | Ebara Corp | Surface characteristics of the polishing pad measuring device |
US10401285B2 (en) | 2013-03-12 | 2019-09-03 | Ebara Corporation | Apparatus for measuring surface properties of polishing pad |
KR20140111923A (ko) * | 2013-03-12 | 2014-09-22 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 패드의 표면 성상 측정 장치 |
KR101930966B1 (ko) * | 2013-03-12 | 2018-12-19 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 패드의 표면 성상 측정 장치 |
JP2014172154A (ja) * | 2013-03-12 | 2014-09-22 | Ebara Corp | 研磨パッドの表面性状測定装置 |
JP2015174156A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社荏原製作所 | 研磨装置 |
US9669515B2 (en) | 2014-03-13 | 2017-06-06 | Ebara Corporation | Polishing apparatus |
JPWO2016111335A1 (ja) * | 2015-01-07 | 2017-10-19 | 株式会社荏原製作所 | 研磨パッドの表面性状測定装置を備えたcmp装置 |
US10369675B2 (en) | 2015-01-07 | 2019-08-06 | Ebara Corporation | CMP apparatus having polishing pad surface property measuring device |
WO2016111335A1 (ja) * | 2015-01-07 | 2016-07-14 | 株式会社 荏原製作所 | 研磨パッドの表面性状測定装置を備えたcmp装置 |
JP2018151353A (ja) * | 2017-03-15 | 2018-09-27 | ファナック株式会社 | 計測装置 |
US10203201B2 (en) | 2017-03-15 | 2019-02-12 | Fanuc Corporation | Measurement device |
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