JP2012129454A - Light detector - Google Patents

Light detector Download PDF

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JP2012129454A
JP2012129454A JP2010281659A JP2010281659A JP2012129454A JP 2012129454 A JP2012129454 A JP 2012129454A JP 2010281659 A JP2010281659 A JP 2010281659A JP 2010281659 A JP2010281659 A JP 2010281659A JP 2012129454 A JP2012129454 A JP 2012129454A
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light
receiving element
emitting element
light emitting
light receiving
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JP5665180B2 (en
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Harumi Watabe
晴美 渡部
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a light detector which easily corresponds to a change in a size and a shape of an object to be detected, and has good assemblability.SOLUTION: A light detector 10 comprises: a light emission wall and a light-receiving wall disposed opposite each other; a light emission window and a light-receiving window provided on the light emission wall and the light-receiving wall; a case body 5 having a light emission element block holding part and a light-receiving element block holding part; a light emission element block and a light-receiving element block; and a light emission element holding substrate and a light-receiving element holding substrate. The light emission element holding substrate 6 in which the light emission element block is installed therein and the light-receiving element holding substrate 7 in which the light-receiving element block is installed therein are installed in the case body to detect the presence or absence of an object to be detected based on light ray passing through the light emission window and the light-receiving window.

Description

本発明は発光素子と受光素子とを対向配置し、その間を通過する被検出物の有無を非接触にて検出する光検出装置に関する。   The present invention relates to a light detection device in which a light emitting element and a light receiving element are arranged to face each other, and the presence or absence of an object to be detected passing between them is detected in a non-contact manner.

近年、発光素子と受光素子とを対向配置し、その間を通過する被検出物の有無を非接触にて検出する光検出装置が用いられている。   2. Description of the Related Art In recent years, a light detection device has been used in which a light emitting element and a light receiving element are arranged to face each other and the presence or absence of an object passing between them is detected in a non-contact manner.

上記光検出装置は、半導体素子によって構成されているため、構成が簡単で消費電力も少なく、検出性能も高いため広く採用されており、その構成に付いても色々な提案がなされている(例えば引用文献1、引用文献2)。   Since the above-mentioned photodetection device is composed of semiconductor elements, it is widely adopted because of its simple configuration, low power consumption, and high detection performance, and various proposals have been made for its configuration (for example, Cited reference 1, cited reference 2).

以下図面により各引用文献に示された従来技術に付いて説明する。なお、各従来技術において、発明の趣旨を変えない範囲で、部品名称等を本発明と同じにしている。
図14は引用文献1に記載された光検出装置(フォトインタラプタ)の断面図であり、光検出装置100は発光素子ブロック101を実装した発光素子基板102と、受光素子ブロック103を実装した受光素子基板104と、前記発光素子ブロック101と受光素子ブロック103を収納する貫通穴105a,105bと位置決めピン106を有し、断面がコ字形状の被検出物通過部109設けたモールド体105と、モールド体105のコ字形状の被検出物通過部における対向面の一方に設けたスリット板107により構成されている。
The prior art shown in each cited document will be described below with reference to the drawings. In each prior art, the component names and the like are the same as those of the present invention within the scope not changing the gist of the invention.
FIG. 14 is a cross-sectional view of the photodetection device (photointerrupter) described in the cited document 1. The photodetection device 100 includes a light emitting element substrate 102 on which the light emitting element block 101 is mounted and a light receiving element on which the light receiving element block 103 is mounted. A mold body 105 having a substrate 104, through-holes 105a and 105b for accommodating the light-emitting element block 101 and the light-receiving element block 103, and a positioning pin 106, provided with a detection object passage portion 109 having a U-shaped cross section, and a mold The slit 105 is provided on one of the opposing surfaces of the U-shaped detection object passage portion of the body 105.

次に光検出装置100の構成及び動作を説明する。光検出装置100は位置決めピン106によって測定装置(図示せず)に位置決め固定されており、発光素子ブロック101から発光された光束Pがスリット板107を通して受光素子ブロック103に受光されるよう構成されている。そして被検出物がモールド体105のコ字形状の被検出物通過部109を通過して、光束Pを横切ることによって被検出物の有無を非接触に検出している。   Next, the configuration and operation of the light detection apparatus 100 will be described. The light detecting device 100 is positioned and fixed to a measuring device (not shown) by positioning pins 106, and is configured such that the light beam P emitted from the light emitting element block 101 is received by the light receiving element block 103 through the slit plate 107. Yes. The detected object passes through the U-shaped detected object passing portion 109 of the mold body 105 and crosses the light beam P, thereby detecting the presence or absence of the detected object in a non-contact manner.

図15は引用文献2に記載された光検出装置(光結合装置)の断面図であり、光検出装置200は発光素子ブロック201に接続された発光素子リード部材202と、受光素子ブロック203に接続された受光素子リード部材204と、金属板を抜き曲げ加工して形成したケース体205とにより構成あれている。そして前記ケース体205は断面がコ字形状の被検出物通過部209を挟んで開口したスリット部205c、205dがあり、このスリット部205c、205dに対応する位置に
前記発光素子ブロック101と受光素子ブロック103を収納する発光素子ブロック保持部205aと受光素子ブロック保持部205bが形成されている。
FIG. 15 is a cross-sectional view of the light detection device (optical coupling device) described in the cited document 2. The light detection device 200 is connected to the light emitting element lead member 202 connected to the light emitting element block 201 and to the light receiving element block 203. The light receiving element lead member 204 and a case body 205 formed by punching and bending a metal plate. The case body 205 has slit portions 205c and 205d that are open with a U-shaped cross-section of the detected object passage portion 209 interposed therebetween. The light emitting element block 101 and the light receiving element are disposed at positions corresponding to the slit portions 205c and 205d. A light emitting element block holding portion 205a for storing the block 103 and a light receiving element block holding portion 205b are formed.

次に光検出装置200の構成及び動作を説明する。光検出装置200は、発光素子リード部材202と受光素子リード部材204によって測定装置(図示せず)に位置決め固定されており、発光素子ブロック201から発光された光束Pがスリット部205c、205dを通して受光素子ブロック203に受光されるよう構成されている。そして被検出物がコ字形状の被検出物通過部209を通過して、光束Pを横切ることによって被検出物の有無を非接触に検出している。   Next, the configuration and operation of the light detection apparatus 200 will be described. The light detecting device 200 is positioned and fixed to a measuring device (not shown) by a light emitting element lead member 202 and a light receiving element lead member 204, and a light flux P emitted from the light emitting element block 201 is received through the slit portions 205c and 205d. The element block 203 is configured to receive light. The detected object passes through the U-shaped detected object passing portion 209 and crosses the light beam P, thereby detecting the presence or absence of the detected object in a non-contact manner.

特開2000−12892号公報JP 2000-12892 A 特開2002−208727号公報JP 2002-208727 A

しかし、引用文献1における光検出装置100は樹脂成型したモールド体105に組み込まれているため、被検出物の大きさによって被検出物通過部109の高さや幅を変える必要があり、被検出物の大きさや形状に従って新規な成形型を起こして専用のモールド体を作り直す必要がある。   However, since the photodetection device 100 in the cited document 1 is incorporated in a resin-molded mold body 105, it is necessary to change the height and width of the detection object passage portion 109 depending on the size of the detection object. It is necessary to recreate a special mold body by raising a new mold according to the size and shape of the mold.

また引用文献2における光検出装置200は、ケース体205は金属板を抜き曲げ加工しているため、比較的被検出物の大きさや形状に従って変形させることは容易であるが、発光素子ブロック201や受光素子ブロック203がリード部材と一体的に構成されているため、被検出物の大きさによって被検出物通過部209の高さや幅を変える場合、リード部材の長さが異なった発光素子ブロック201や受光素子ブロック203を用意する必要があった。   In the light detection device 200 in the cited document 2, since the case body 205 is formed by bending a metal plate, it can be relatively easily deformed according to the size and shape of the object to be detected. Since the light receiving element block 203 is integrally formed with the lead member, when the height or width of the detected object passage portion 209 is changed depending on the size of the detected object, the light emitting element block 201 having a different length of the lead member. In addition, it is necessary to prepare the light receiving element block 203.

本発明の目的は上記問題点を解決しようとするものであり、形状変形の容易なケース体と独立に構成された発光素子ブロック及び受光素子ブロックと、この発光素子ブロック及び受光素子ブロックに組み付けは容易なリード部材を兼ねた保持部材とを、全て別体構成とすることによって、被検出物の大きさや形状の変化に対応が容易で、且つ組み立て性の良い光検出装置を提供することにある。   An object of the present invention is to solve the above-mentioned problems, and a light emitting element block and a light receiving element block configured independently of a case body whose shape is easy to deform, and an assembly to the light emitting element block and the light receiving element block are An object of the present invention is to provide a photodetection device that is easy to cope with changes in the size and shape of an object to be detected and that has good assemblability by making the holding member that also serves as an easy lead member separately. .

上記目的を達成するため本発明においては、発光素子と受光素子とを対向配置して被検出物の有無を検出する光検出装置において、底部によって結合され、所定の間隔を有する状態で対向配置された発光壁及び受光壁と、前記発光壁及び受光壁の対向位置に設けられた発光窓及び受光窓と、前記発光壁及び受光壁に各々設けられた略コ字形状の発光素子ブロック保持部と受光素子ブロック保持部とを備えたケース体と、発光素子基板上に実装された発光素子ブロックと受光素子基板上に実装された受光素子ブロックと、前記発光素子ブロックと受光素子ブロックとを収納する切り欠き部を備えた発光素子保持基板と受光素子保持基板とを有し、前記発光素子ブロックを組み込んだ発光素子保持基板と、前記受光素子ブロックを組み込んだ受光素子保持基板とを、前記ケース体の発光光素子ブロック保持部と受光素子ブロック保持部とに組み込むことにより、前記発光窓と受光窓を通過する光線によって被検出物の有無を検出することを特徴とする。   In order to achieve the above object, in the present invention, in a light detection device that detects the presence or absence of an object to be detected by arranging a light emitting element and a light receiving element to face each other, they are coupled by a bottom portion and arranged to face each other with a predetermined interval. A light emitting wall and a light receiving wall, a light emitting window and a light receiving window provided at positions opposed to the light emitting wall and the light receiving wall, and a substantially U-shaped light emitting element block holding portion provided on each of the light emitting wall and the light receiving wall; A case body having a light receiving element block holding portion, a light emitting element block mounted on a light emitting element substrate, a light receiving element block mounted on the light receiving element substrate, and the light emitting element block and the light receiving element block are accommodated. A light-emitting element holding substrate having a notch and a light-receiving element holding substrate; a light-emitting element holding substrate incorporating the light-emitting element block; and a light receiving element incorporating the light-receiving element block The presence or absence of an object to be detected is detected by a light beam passing through the light emitting window and the light receiving window by incorporating a child holding substrate into the light emitting element block holding unit and the light receiving element block holding unit of the case body. And

上記構成によれば、ケース体と発光素子ブロック及び受光素子ブロックと、この発光素子ブロック及び受光素子ブロックに組み付けは容易なリード部材を兼ねた保持部材とを、全て別体構成とすることによって、被検出物の大きさや形状の変化に対応が容易で、且つ組み立て性の良い光検出装置を提供することにある。   According to the above configuration, the case body, the light emitting element block, and the light receiving element block, and the holding member that also serves as a lead member that can be easily assembled to the light emitting element block and the light receiving element block, are all separated. An object of the present invention is to provide a photodetection device that can easily cope with changes in the size and shape of an object to be detected and that is easy to assemble.

発光素子保持基板と受光素子保持基板との、発光素子基板及び、受光素子基板の取り付け面側に接続電極を設け、発光素子保持基板と受光素子保持基板の切り欠き部に発光素子ブロックと受光素子ブロックとを組み込んだ状態において、前記発光素子基板及び、受光素子基板の素子電極が前記発光素子保持基板と受光素子保持基板の接続電極に接続されるようにすると良い。   Connection electrodes are provided on the light emitting element substrate and the light receiving element substrate mounting surface side of the light emitting element holding substrate and the light receiving element holding substrate, and the light emitting element block and the light receiving element are formed in the cutout portions of the light emitting element holding substrate and the light receiving element holding substrate. In a state where the block is incorporated, the light emitting element substrate and the element electrode of the light receiving element substrate may be connected to the connection electrodes of the light emitting element holding substrate and the light receiving element holding substrate.

ケース体における発光素子ブロック保持部と受光素子ブロック保持部との先端部を折り曲げて前記発光素子基板及び、受光素子基板の抜け防止部を形成すると良い。   The light emitting element substrate and the light receiving element substrate may be prevented from being detached by bending the tip portions of the light emitting element block holder and the light receiving element block holder in the case body.

ケース体における発光素子ブロック保持部と受光素子ブロック保持部との側壁面を折り曲げて前記発光素子ブロックと受光素子ブロックとのシールド部を形成すると良い。   It is preferable to form a shield part between the light emitting element block and the light receiving element block by bending the side wall surfaces of the light emitting element block holding part and the light receiving element block holding part in the case body.

上記構成によれば、金属板におけるケース体の抜き曲げ加工と同時に発光素子ブロック及び受光素子ブロックの抜け防止部及びシールド部を形成することができるため、コストアップすることなく、信頼性の高い光検出装置を提供することができる。   According to the above configuration, the light emitting element block and the light receiving element block can be formed at the same time as the case body in the metal plate. A detection device can be provided.

ケース体の底部に、測定装置との位置決めを行うための突起部を設けると良い。   A protrusion for positioning with the measuring device may be provided on the bottom of the case body.

上記の如く本発明によれば、ケース体と発光素子ブロック及び受光素子ブロックと、この発光素子ブロック及び受光素子ブロックに組み付け容易なリード部材を兼ねた保持部材とを、全て別体構成とすることによって、被検出物の大きさや形状の変化に対応が容易で、且つ組み立て性の良い光検出装置を提供することができる。   As described above, according to the present invention, the case body, the light emitting element block, the light receiving element block, and the holding member that also serves as a lead member that can be easily assembled to the light emitting element block and the light receiving element block are all separated. Thus, it is possible to provide a light detection device that can easily cope with changes in the size and shape of the object to be detected and that is easy to assemble.

本発明の第1実施形態における光検出装置のケース体の斜視図である。It is a perspective view of the case body of the photon detection device in the first embodiment of the present invention. 本発明の第1実施形態における光検出装置の構成要素の分解斜視図である。It is a disassembled perspective view of the component of the photon detection apparatus in 1st Embodiment of this invention. 本発明の第1実施形態における光検出装置の組み立て途中の斜視図である。It is a perspective view in the middle of the assembly of the photon detection device in the first embodiment of the present invention. 本発明の第1実施形態における光検出装置の完成斜視図である。It is a completion perspective view of the photon detection device in the first embodiment of the present invention. 図2に示す受光素子ブロックの詳細斜視図である。FIG. 3 is a detailed perspective view of the light receiving element block shown in FIG. 2. 図2に示す受光素子ブロックの詳細斜視図である。FIG. 3 is a detailed perspective view of the light receiving element block shown in FIG. 2. 図4に示す光検出装置を測定装置に取り付けた状態の断面図である。It is sectional drawing of the state which attached the photon detection apparatus shown in FIG. 4 to the measuring apparatus. 本発明の第2実施形態における光検出装置の組み立て途中の斜視図である。It is a perspective view in the middle of the assembly of the photodetector in 2nd Embodiment of this invention. 本発明の第2実施形態における光検出装置の完成斜視図である。It is a completion perspective view of the photon detection device in the second embodiment of the present invention. 本発明の第3実施形態における光検出装置のケース体の斜視図である。It is a perspective view of the case body of the photon detection apparatus in 3rd Embodiment of this invention. 本発明の第3実施形態における光検出装置の完成斜視図である。It is a completion perspective view of the photon detection device in the third embodiment of the present invention. 本発明の第4実施形態における光検出装置の完成斜視図である。It is a completion perspective view of the photodetector in 4th Embodiment of this invention. 図12に示す光検出装置を測定装置に取り付けた状態の断面図である。It is sectional drawing of the state which attached the photon detection apparatus shown in FIG. 12 to the measuring apparatus. 従来技術における光検出装置の断面図である。It is sectional drawing of the photon detection apparatus in a prior art. 従来技術における光検出装置の断面図である。It is sectional drawing of the photon detection apparatus in a prior art.

(第1実施形態)
以下図面により、本発明の実施の形態を説明する。図1〜図7は本発明の第1実施形態を示し、図1、図2は本発明の光検出装置の分解斜視図である。図1は金属板を抜き曲げ加工して形成したケース体5であり、底部5gによって結合され、所定の間隔を有する状態で対向配置された発光壁5c及び受光壁5dと、前記発光壁5c及び受光壁5dの対向位置に設けられた発光窓5e及び受光窓5fと、前記発光壁5c及び受光壁5dに各々設けられた略コ字形状の発光素子ブロック保持部5aと受光素子ブロック保持部5bとを備えている。
(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. 1 to 7 show a first embodiment of the present invention, and FIGS. 1 and 2 are exploded perspective views of the photodetecting device of the present invention. FIG. 1 shows a case body 5 formed by punching and bending a metal plate. The light emitting wall 5c and the light receiving wall 5d, which are coupled to each other by a bottom portion 5g and arranged to face each other at a predetermined interval, A light emitting window 5e and a light receiving window 5f provided at positions opposed to the light receiving wall 5d, and a substantially U-shaped light emitting element block holding part 5a and a light receiving element block holding part 5b respectively provided on the light emitting wall 5c and the light receiving wall 5d. And.

図2は光検出装置10を構成する各要素を示している。発光素子ブロク1は後述する如く樹脂封止された発光素子1aが発光素子基板2に実装されており、発光素子基板2の発光素子1aの実装面側に素子電極2a、2bが設けられている。同様に受光素子ブロク3は樹脂封止された受光素子3aが受光素子基板4に実装されており、受光素子基板4の受光素子3aの実装面側に素子電極4a、4bが設けられている。また、発光素子保持基板6は発光素子ブロック1を収納する切り欠き部6aを備え、発光素子ブロック1の組み込み面側に接続電極6b、6c(図では見えず)が設けられている。同様に受光素子保持基板7は受光素子ブロック3を収納する切り欠き部7aを備え、受光素子ブロック3の組み込み面側に接続電極7b,7cが設けられている。   FIG. 2 shows each element constituting the light detection device 10. In the light emitting element block 1, a light emitting element 1a sealed with resin is mounted on a light emitting element substrate 2 as described later, and element electrodes 2a and 2b are provided on the mounting surface side of the light emitting element 1a of the light emitting element substrate 2. . Similarly, in the light receiving element block 3, a resin-sealed light receiving element 3a is mounted on the light receiving element substrate 4, and element electrodes 4a and 4b are provided on the light receiving element 3a mounting surface side of the light receiving element substrate 4. The light-emitting element holding substrate 6 includes a notch 6a for housing the light-emitting element block 1, and connection electrodes 6b and 6c (not shown in the drawing) are provided on the side where the light-emitting element block 1 is assembled. Similarly, the light receiving element holding substrate 7 is provided with a notch 7 a for accommodating the light receiving element block 3, and connection electrodes 7 b and 7 c are provided on the mounting surface side of the light receiving element block 3.

図3は光検出装置10の組み立て途中の斜視図であり、発光素子保持基板6の切り欠き部6aに、発光素子ブロク1を組み込んだ発光素子ユニット11と、受光素子保持基板7の切り欠き部7aに、受光素子ブロク3を組み込んだ受光素子ユニット13とを構成することにより、発光素子基板2の発光素子電極2a,2bが、発光素子保持基板6の接続電極6a,6bに接続され、また、受光素子基板4の受光素子電極4a,4bが受光素子保持基板7の接続電極7a,7bに接続される。そして図3は発光素子ユニット11と受光素子ユニット13とを矢印で示すように、ケース体5の発光素子ブロック保持部5aと受光素子ブロック保持部5bとに挿入固定する前の状態を示している。   FIG. 3 is a perspective view in the middle of the assembly of the light detection device 10. The light emitting element unit 11 in which the light emitting element block 1 is incorporated in the notch 6 a of the light emitting element holding substrate 6 and the notch of the light receiving element holding substrate 7. By configuring the light receiving element unit 13 incorporating the light receiving element block 3 in 7a, the light emitting element electrodes 2a and 2b of the light emitting element substrate 2 are connected to the connection electrodes 6a and 6b of the light emitting element holding substrate 6, respectively. The light receiving element electrodes 4 a and 4 b of the light receiving element substrate 4 are connected to the connection electrodes 7 a and 7 b of the light receiving element holding substrate 7. 3 shows a state before the light emitting element unit 11 and the light receiving element unit 13 are inserted and fixed to the light emitting element block holding part 5a and the light receiving element block holding part 5b of the case body 5 as indicated by arrows. .

図4は光検出装置10の完成状態を示す斜視図である。すなわち発光素子ユニット11と受光素子ユニット13とをケース体5の発光素子ブロック保持部5aと受光素子ブロック保持部5bとに挿入固定した状態において、発光素子保持基板6の接続電極6a,6bと受光素子保持基板7の接続電極7a,7bとはケース体5の発光壁5c及び受光壁5dとに対して反対向きに取り付けられることによって、電気的接触を生じることがない。   FIG. 4 is a perspective view showing a completed state of the light detection device 10. That is, in a state where the light emitting element unit 11 and the light receiving element unit 13 are inserted and fixed to the light emitting element block holding part 5a and the light receiving element block holding part 5b of the case body 5, the connection electrodes 6a and 6b of the light emitting element holding substrate 6 and the light receiving element are received. The connection electrodes 7a and 7b of the element holding substrate 7 are attached to the light emitting wall 5c and the light receiving wall 5d of the case body 5 in opposite directions, so that no electrical contact occurs.

図5は発光素子ブロク1の詳細斜視図、図6は受光素子ブロク3の詳細斜視図である。図5において発光素子ブロク1は発光素子基板2の上面に形成された素子電極2aに発光素子1aがダイボンディングされており、ワイヤー1bによって素子電極2bに接続され、さらに透明樹脂1cによって発光素子1aとワイヤー1bとが封止されている。すなわち発光素子ブロク1は発光素子1aとワイヤー1bとを封止した透明樹脂1cによって構成されており、発光素子ブロク1の部分が、発光素子保持基板6の切り欠き部6aに組み込まれる部分である。そしてこの組み込み状態において発光素子基板2の両側に形成された素子電極2a,2bが、発光素子保持基板6の接続電極6b,6cとが圧接によって接続される。   FIG. 5 is a detailed perspective view of the light emitting element block 1, and FIG. 6 is a detailed perspective view of the light receiving element block 3. In FIG. 5, the light-emitting element block 1 has a light-emitting element 1a die-bonded to an element electrode 2a formed on the upper surface of the light-emitting element substrate 2, and is connected to the element electrode 2b by a wire 1b. And the wire 1b are sealed. That is, the light emitting element block 1 is configured by a transparent resin 1c in which the light emitting element 1a and the wire 1b are sealed, and the portion of the light emitting element block 1 is a part to be incorporated into the cutout portion 6a of the light emitting element holding substrate 6. . In this assembled state, the element electrodes 2a and 2b formed on both sides of the light emitting element substrate 2 are connected to the connection electrodes 6b and 6c of the light emitting element holding substrate 6 by pressure contact.

図6において受光素子ブロク3は受光素子基板4の上面に形成された素子電極4aに受光素子3aがダイボンディングされており、ワイヤー3bによって素子電極4bに接続され、さらに透明樹脂3cによって受光素子3aとワイヤー3bとが封止されている。すなわち受光素子ブロク3は受光素子3aとワイヤー3bとを封止した透明樹脂3cによって構成されており、受光素子ブロク3の部分が、受光素子保持基板7の切り欠き部7aに組み込まれる部分である。そしてこの組み込み状態において発光素子基板4の両側に形成された素子電極4a,4bが、発光素子ブロック保持基板7の接続電極7b,7cとが圧接によって接続される。   In FIG. 6, in the light receiving element block 3, the light receiving element 3a is die-bonded to the element electrode 4a formed on the upper surface of the light receiving element substrate 4, and is connected to the element electrode 4b by the wire 3b, and further, the light receiving element 3a by the transparent resin 3c. And the wire 3b are sealed. That is, the light receiving element block 3 is constituted by a transparent resin 3c in which the light receiving element 3a and the wire 3b are sealed, and the portion of the light receiving element block 3 is a portion to be incorporated into the cutout portion 7a of the light receiving element holding substrate 7. . In this assembled state, the element electrodes 4a and 4b formed on both sides of the light emitting element substrate 4 are connected to the connection electrodes 7b and 7c of the light emitting element block holding substrate 7 by pressure contact.

次に、図7により光検出装置10の組み付けと、検出動作に付いて説明する。 図7は光検出装置10を測定装置50に取り付けた状態の断面図であり、光検出装置10を測定装置50のマザーボード51に位置決めし、発光素子保持基板6の接続電極6b、6cと受光素子保持基板7の接続電極7b,7cとを測定装置50のザーボード51の上面に形成された接続電極51a、51bに半田52の半田付け等の手段によって固定する。この状態において発光素子ブロック1から発光された光束Pが発光窓5e及び受光窓5fを通して受光素子ブロック3に受光される。そして被検出物がケース体5のコ字形状の被検出物通過部9を通過して、光束Pを横切ることによって被検出物の有無を非接触にて検出する。   Next, assembly of the light detection device 10 and detection operation will be described with reference to FIG. FIG. 7 is a cross-sectional view of the state in which the light detection device 10 is attached to the measurement device 50. The light detection device 10 is positioned on the mother board 51 of the measurement device 50, and the connection electrodes 6b and 6c of the light emitting element holding substrate 6 and the light receiving element. The connection electrodes 7 b and 7 c of the holding substrate 7 are fixed to the connection electrodes 51 a and 51 b formed on the upper surface of the motherboard 51 of the measuring device 50 by means such as soldering of the solder 52. In this state, the light beam P emitted from the light emitting element block 1 is received by the light receiving element block 3 through the light emitting window 5e and the light receiving window 5f. The detected object passes through the U-shaped detected object passage portion 9 of the case body 5 and crosses the light beam P, thereby detecting the presence or absence of the detected object in a non-contact manner.

上記の如く、本発明の光検出装置10においては、被検出物の形状や大きさが変化した場合にも、ケース体5の絞り加工において発光壁5c及び受光壁5dの長さを調整し、且つ、発光素子保持基板6と受光素子保持基板7の長さを調整することによって、発光素子ブロック1及び受光素子ブロック3の構成を変化させることなく対応することができる。   As described above, in the light detection device 10 of the present invention, the lengths of the light emitting wall 5c and the light receiving wall 5d are adjusted in the drawing process of the case body 5 even when the shape or size of the detection object changes. In addition, by adjusting the lengths of the light-emitting element holding substrate 6 and the light-receiving element holding substrate 7, it is possible to cope without changing the configurations of the light-emitting element block 1 and the light-receiving element block 3.

(第2実施形態)
次に図8、図9により本発明の第2実施形態における光検出装置20に付いて説明する。なお図8、図9に示す光検出装置20は図4に示す第1実施形態における光検出装置10と基本的構成は同じなので、同一部材には同一番号を付し、重複する説明を省略する。
(Second Embodiment)
Next, the light detection device 20 according to the second embodiment of the present invention will be described with reference to FIGS. 8 and 9 has the same basic configuration as the photodetector 10 in the first embodiment shown in FIG. 4, and therefore, the same members are denoted by the same reference numerals, and redundant description is omitted. .

図8、図9において、光検出装置20が図4における光検出装置10と異なるところは、ケース体5における発光素子ブロック保持部5aと受光素子ブロック保持部5bとを構成している外側の壁部に、発光素子基板2と受光素子基板4との抜け防止を行うため抜け防止部5hを設けたことである。すなわち図8に示す如く、外側の壁部の長さを抜け防止部5hの長さだけ長く構成し、図9に示すごとく、発光素子ユニット11と受光素子ユニット13とをケース体5の発光素子ブロック保持部5aと受光素子ブロック保持部5bとに挿入した後に、外側の壁部の長くなった先端部を折り曲げることにより抜け防止部5hが形成される。すなわち光検出装置20ではケース体5に曲げ加工を1つ加えるだけで抜け防止部5hが形成されるので、光検出装置20では構成上の信頼性を高めることができる。   8 and 9, the light detection device 20 differs from the light detection device 10 in FIG. 4 in that the outer wall constituting the light emitting element block holding portion 5 a and the light receiving element block holding portion 5 b in the case body 5. In order to prevent the light-emitting element substrate 2 and the light-receiving element substrate 4 from coming off, a drop prevention part 5h is provided in the part. That is, as shown in FIG. 8, the length of the outer wall portion is made longer by the length of the prevention portion 5h, and the light emitting element unit 11 and the light receiving element unit 13 are made light emitting elements of the case body 5 as shown in FIG. After insertion into the block holding part 5a and the light receiving element block holding part 5b, the removal preventing part 5h is formed by bending the long end of the outer wall part. That is, in the light detection device 20, the removal preventing portion 5 h is formed by adding only one bending process to the case body 5, so that the structural reliability of the light detection device 20 can be increased.

(第3実施形態)
次に図10、図11により本発明の第3実施形態における光検出装置30に付いて説明する。なお図10は光検出装置30におけるケース体5の斜視図、図11は光検出装置30の完成斜視図である。なお、図10、図11に示す光検出装置30は図9に示す第2実施形態における光検出装置20と基本的構成は同じなので、同一部材には同一番号を付し、重複する説明を省略する。
(Third embodiment)
Next, the photodetecting device 30 according to the third embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a perspective view of the case body 5 in the light detection device 30, and FIG. 11 is a completed perspective view of the light detection device 30. 10 and FIG. 11 has the same basic configuration as that of the light detection device 20 in the second embodiment shown in FIG. To do.

図10、図11において、光検出装置30が図9における光検出装置20と異なるところは、ケース体5における発光素子ブロック保持部5aと受光素子ブロック保持部5bとを構成している内側の壁部に、発光素子ブロック1と受光素子ブロック3とのシールドを行うためシールド部5i1、5i2を設けたことである。   10 and 11, the light detection device 30 is different from the light detection device 20 in FIG. 9 in that the inner wall constituting the light emitting element block holding portion 5 a and the light receiving element block holding portion 5 b in the case body 5. In other words, shield portions 5 i 1 and 5 i 2 are provided to shield the light emitting element block 1 and the light receiving element block 3.

すなわち図10に示す如く、外側の壁部にシールド部5i1、5i2を形成するための板部材を形成しておき、ケース体5の発光素子ブロック保持部5aと受光素子ブロック保持部5bとに発光素子ユニット11と受光素子ユニット13とを矢印で示す方向に挿入する。そして図11に示すごとく、外側の壁部に設けた板部材を折り曲げることによりシールド部5i1、5i2を形成する。   That is, as shown in FIG. 10, plate members for forming the shield portions 5i1 and 5i2 are formed on the outer wall portion, and light is emitted to the light emitting element block holding portion 5a and the light receiving element block holding portion 5b of the case body 5. The element unit 11 and the light receiving element unit 13 are inserted in the direction indicated by the arrows. And as shown in FIG. 11, the shield parts 5i1 and 5i2 are formed by bending the board member provided in the outer wall part.

なお、発光素子ユニット11と受光素子ユニット13とは、発光素子ブロック保持部5aと受光素子ブロック保持部5bに対して一方の方向から挿入することができるので、シールド部5i1は予め折り曲げておき、発光素子ユニット11と受光素子ユニット13とを挿入した後は、一方のシールド部5i2のみを折り曲げて、図11に示す光検出装置30を完成させることができる。
上記構成によって光検出装置30は発光素子ブロク1の発光素子1aと、受光素子ブロク3の受光素子3aがシールド部5i1、5i2によってシールドされるため、ノイズ障害のない光検出装置30が提供できる。
Since the light emitting element unit 11 and the light receiving element unit 13 can be inserted from one direction with respect to the light emitting element block holding part 5a and the light receiving element block holding part 5b, the shield part 5i1 is bent in advance, After inserting the light emitting element unit 11 and the light receiving element unit 13, only the one shield part 5i2 can be bent to complete the photodetecting device 30 shown in FIG.
With the above configuration, the light detection device 30 can provide the light detection device 30 free from noise disturbance because the light emitting element 1a of the light emitting element block 1 and the light receiving element 3a of the light receiving element block 3 are shielded by the shield portions 5i1 and 5i2.

(第4実施形態)
次に図12、図13により本発明の第4実施形態における光検出装置40に付いて説明する。なお図12は光検出装置40の完成斜視図であり、図13は光検出装置40を測定装置50に取り付けた状態の断面図である。
なお、図12に示す光検出装置40は図4に示す第1実施形態における光検出装置10と基本的構成が対応し、また図13に示す測定装置50への取り付け構成は図7に示す測定装置50への取り付け構成に対応しているので、同一部材には同一番号を付し、重複する説明を省略する。
(Fourth embodiment)
Next, the photodetecting device 40 according to the fourth embodiment of the present invention will be described with reference to FIGS. 12 is a completed perspective view of the photodetecting device 40, and FIG. 13 is a cross-sectional view of the photodetecting device 40 attached to the measuring device 50.
The light detection device 40 shown in FIG. 12 corresponds to the basic structure of the light detection device 10 in the first embodiment shown in FIG. 4, and the mounting structure to the measurement device 50 shown in FIG. 13 is the measurement shown in FIG. Since it corresponds to the attachment configuration to the device 50, the same number is assigned to the same member, and the duplicate description is omitted.

図12において、光検出装置40が図4における光検出装置10と異なるところは、ケース体5における発光素子ブロック保持部5aと受光素子ブロック保持部5bとを構成している外側の壁部に、位置決め部5kと、ケース体5の底部5gに位置決め突起5jを設けたことである。   In FIG. 12, the light detection device 40 is different from the light detection device 10 in FIG. 4 on the outer wall portion constituting the light emitting element block holding portion 5a and the light receiving element block holding portion 5b in the case body 5. The positioning projection 5j is provided on the positioning portion 5k and the bottom portion 5g of the case body 5.

次に、図13により光検出装置40の組み付けと、検出動作に付いて説明する。
図13は光検出装置40を測定装置50に取り付けた状態の断面図であり、光検出装置40のケース体5における外側の壁部に設けた位置決め部5kと、ケース体5の底部5gに設けた位置決め突起5jを測定装置50のマザーボード51に設けた位置決め凹部51cに嵌め込んで位置決めし、発光素子保持基板6の接続電極6b、6cと受光素子保持基板7の接続電極7b,7cとを測定装置50のザーボード51の上面に形成された接続電極51a、51bに半田52による半田付け等の手段によって固定する。この状態にける光検出装置40の動作は、図7に示す光検出装置10の動作と同じである。
Next, assembly of the light detection device 40 and detection operation will be described with reference to FIG.
FIG. 13 is a cross-sectional view of the state in which the light detection device 40 is attached to the measurement device 50. The positioning protrusion 5j is fitted into a positioning recess 51c provided on the mother board 51 of the measuring device 50 for positioning, and the connection electrodes 6b, 6c of the light emitting element holding substrate 6 and the connection electrodes 7b, 7c of the light receiving element holding substrate 7 are measured. The connection electrodes 51 a and 51 b formed on the upper surface of the board 51 of the device 50 are fixed by means such as soldering with solder 52. The operation of the photodetector 40 in this state is the same as the operation of the photodetector 10 shown in FIG.

上記の如く、本発明の光検出装置においては、被検出物の形状や大きさが変化した場合にも、ケース体5の絞り加工において発光壁5c及び受光壁5dの長さを調整し、且つ、発光素子保持基板6と受光素子保持基板7の長さを調整することによって、発光素子ブロック1及び受光素子ブロック3の構成を変化させることなく対応することができる。   As described above, in the light detection device of the present invention, even when the shape or size of the object to be detected changes, the lengths of the light emitting wall 5c and the light receiving wall 5d are adjusted in the drawing process of the case body 5, and By adjusting the lengths of the light-emitting element holding substrate 6 and the light-receiving element holding substrate 7, it is possible to cope without changing the configurations of the light-emitting element block 1 and the light-receiving element block 3.

1、101,201 発光素子ブロック
1a 発光素子
1b、3b ワイヤー
1c、3c 透明樹脂
2、102,202 発光素子基板
2a,2b、4a、4b 素子電極
3、103、203 受光素子ブロック
3a 受光素子
4、104 受光素子基板
5、205 ケース体
5a、205a 発光素子ブロック保持部
5b、205b 受光素子ブロック保持部
5c 発光壁
5d 受光壁
5e 発光窓
5f 受光窓
5g 底部
5h 抜け防止部
5i1,5i2 シールド部
5k 位置決め部
5j 位置決め突起
6 発光素子保持基板
6a,7a 切り欠き部
6b、6c、7b、7c、51a、51b 接続電極
7 受光素子保持基板
9、109、209 被検出物通過部
10,20,30,40,100,200 光検出装置
11 発光素子ユニット
13 受光素子ユニット
50 測定装置
51 マザーボード
51a,51b 接続電極
51c 位置決め凹部
52 半田
DESCRIPTION OF SYMBOLS 1, 101,201 Light emitting element block 1a Light emitting element 1b, 3b Wire 1c, 3c Transparent resin 2, 102, 202 Light emitting element substrate 2a, 2b, 4a, 4b Element electrode 3, 103, 203 Light receiving element block 3a Light receiving element 4, 104 light receiving element substrate 5, 205 case body 5a, 205a light emitting element block holding part 5b, 205b light receiving element block holding part 5c light emitting wall 5d light receiving wall 5e light emitting window 5f light receiving window 5g bottom part 5h omission prevention part 5i1, 5i2 shield part 5k positioning Part 5j Positioning projection 6 Light emitting element holding substrate 6a, 7a Notch 6b, 6c, 7b, 7c, 51a, 51b Connection electrode 7 Light receiving element holding substrate 9, 109, 209 Detected object passing part 10, 20, 30, 40 , 100, 200 Photodetector 11 Light emitting element unit 13 Light receiving element Unit 50 measuring device 51 motherboards 51a, 51b connecting electrode 51c positioning recess 52 solder

Claims (6)

発光素子と受光素子とを対向配置して被検出物の有無を検出する光検出装置において、底部によって結合され、所定の間隔を有する状態で対向配置された発光壁及び受光壁と、前記発光壁及び受光壁の対向位置に設けられた発光窓及び受光窓と、前記発光壁及び受光壁に各々設けられた略コ字形状の発光素子ブロック保持部と受光素子ブロック保持部を備えたケース体と、発光素子基板上に実装された発光素子ブロックと受光素子基板上に実装された受光素子ブロックと、前記発光素子ブロックと受光素子ブロックとを収納する切り欠き部を備えた発光素子保持基板と受光素子保持基板とを有し、前記発光素子ブロックを組み込んだ発光素子保持基板と、前記受光素子ブロックを組み込んだ受光素子保持基板とを、前記ケース体の発光素子ブロック保持部と受光素子ブロック保持部とに組み込むことにより、前記発光窓と受光窓を通過する光線によって被検出物の有無を検出することを特徴とする光検出装置。   In a light detection device for detecting the presence or absence of an object to be detected by opposingly arranging a light emitting element and a light receiving element, a light emitting wall and a light receiving wall which are coupled by a bottom and arranged to face each other with a predetermined interval, and the light emitting wall And a light emitting window and a light receiving window provided at positions opposite to the light receiving wall, a substantially U-shaped light emitting element block holding portion and a case body provided with the light receiving element block holding portion respectively provided on the light emitting wall and the light receiving wall; A light-emitting element holding substrate having a light-emitting element block mounted on the light-emitting element substrate, a light-receiving element block mounted on the light-receiving element substrate, and a notch for housing the light-emitting element block and the light-receiving element block; A light-emitting element holding substrate incorporating the light-emitting element block, and a light-receiving element holding substrate incorporating the light-receiving element block. By incorporating the a click holding portion and the light receiving element block holder, the light detecting device and detects the presence or absence of the detected object by rays passing through the light emitting window and the light receiving window. 前記発光素子保持基板と受光素子保持基板との、発光素子基板及び、受光素子基板の取り付け面側に接続電極を設け、発光素子保持基板と受光素子保持基板の切り欠き部に発光素子ブロックと受光素子ブロックとを組み込んだ状態において、前記発光素子基板及び、受光素子基板の素子電極が前記発光素子保持基板と受光素子保持基板の接続電極に接続される請求項1記載の光検出装置。   A connection electrode is provided on the light emitting element substrate and the light receiving element substrate mounting surface side of the light emitting element holding substrate and the light receiving element holding substrate, and the light emitting element block and the light receiving element are formed in the cutout portions of the light emitting element holding substrate and the light receiving element holding substrate. The light detection device according to claim 1, wherein the light emitting element substrate and the element electrode of the light receiving element substrate are connected to connection electrodes of the light emitting element holding substrate and the light receiving element holding substrate in a state where the element block is incorporated. 前記ケース体における発光素子ブロック保持部と受光素子ブロック保持部との先端部を折り曲げて前記発光素子基板及び、受光素子基板の抜け防止部を形成した請求項1又は2に記載の光検出装置。   The light detection device according to claim 1, wherein tip portions of the light emitting element block holding portion and the light receiving element block holding portion in the case body are bent to form the light emitting element substrate and a removal preventing portion of the light receiving element substrate. 前記ケース体における発光素子ブロック保持部と受光素子ブロック保持部との側壁面を折り曲げて前記発光素子ブロックと受光素子ブロックとのシールド部を形成した請求項1から3に記載の光検出装置。   4. The light detection device according to claim 1, wherein a shield portion between the light emitting element block and the light receiving element block is formed by bending side wall surfaces of the light emitting element block holding part and the light receiving element block holding part in the case body. 前記ケース体の底部に、測定装置との位置決めを行うための突起部を設けた請求項1から4に記載の光検出装置。   The light detection device according to claim 1, wherein a protrusion for positioning the measurement device is provided on a bottom portion of the case body. 前記ケース体は金属板部材にて構成されている請求項1から6に記載の光検出装置。
The light detection device according to claim 1, wherein the case body is formed of a metal plate member.
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JPS62208835A (en) * 1986-03-11 1987-09-14 Fuji Electric Co Ltd Fixing/supporting method for small component
JP2000012892A (en) * 1998-06-17 2000-01-14 Shichizun Denshi:Kk Photointerrupter

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015007993A1 (en) * 2013-07-18 2015-01-22 Msc & Sgcc Device for the dimensional inspection of containers having contact optical detection
FR3008795A1 (en) * 2013-07-18 2015-01-23 Msc & Sgcc DEVICE FOR DIMENSIONALLY CONTROLLING CONTAINERS WITH OPTICAL CONTACT DETECTION
CN105473982A (en) * 2013-07-18 2016-04-06 Msc&Sgcc公司 Device for the dimensional inspection of containers having contact optical detection
US9970790B2 (en) 2013-07-18 2018-05-15 Msc & Sgcc Device for the dimensional inspection of containers having contact optical detection

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