JP2012129322A - Component suction nozzle device - Google Patents

Component suction nozzle device Download PDF

Info

Publication number
JP2012129322A
JP2012129322A JP2010278641A JP2010278641A JP2012129322A JP 2012129322 A JP2012129322 A JP 2012129322A JP 2010278641 A JP2010278641 A JP 2010278641A JP 2010278641 A JP2010278641 A JP 2010278641A JP 2012129322 A JP2012129322 A JP 2012129322A
Authority
JP
Japan
Prior art keywords
nozzle
component
nozzle needle
needle
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010278641A
Other languages
Japanese (ja)
Other versions
JP5547052B2 (en
Inventor
Naohiro Kato
尚宏 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP2010278641A priority Critical patent/JP5547052B2/en
Publication of JP2012129322A publication Critical patent/JP2012129322A/en
Application granted granted Critical
Publication of JP5547052B2 publication Critical patent/JP5547052B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a function for preventing the jump-out of a nozzle needle when releasing a negative pressure at a low cost.SOLUTION: A nozzle needle 23 is vertically movably provided on a nozzle body 21 and the nozzle needle 23 is energized downwards by an elastic member 24. An electromagnet 25 is provided on the lower part of the nozzle body 21, and when the electromagnet 25 is energized, a nozzle holding state of holding the height position of the nozzle needle 23 to the nozzle body 21 at a position of compressing the elastic member 24 upwards is attained. In a nozzle movable state of turning off the energizing of the electromagnet 25 and not holding the nozzle needle 23, a component 22 is sucked to the nozzle needle 23, and it is switched to the nozzle holding state by turning on the energizing of the electromagnet 25 before mounting the component 22 on a substrate and then releasing the negative pressure. After releasing the negative pressure and releasing the component 22, it is switched to the nozzle movable state by turning off the energizing of the electromagnet 25 at prescribed timing before sucking the next component 22.

Description

本発明は、部品を吸着するノズルニードルがノズル本体に対して上下動可能に支持された部品吸着ノズル装置に関する発明である。   The present invention relates to a component suction nozzle device in which a nozzle needle for sucking a component is supported so as to be vertically movable with respect to a nozzle body.

例えば、図4に示すように、従来の吸着ノズル10は、部品実装機の装着ヘッドに保持されるノズル本体11と、このノズル本体11に上下動可能に支持されたノズルニードル12と、このノズルニードル12を下方に付勢するスプリング13とを備え、部品実装機の稼働中にノズル本体11を通してノズルニードル12に負圧を供給し、部品実装機のフィーダによって供給される部品14を、ノズルニードル12に吸着して回路基板上へ移送して実装すると共に、部品14の吸着動作時や実装動作時に下降するノズルニードル12の下端が部品14に突き当たったときや、ノズルニードル12に吸着した部品14が回路基板に突き当たったときに、その衝撃をスプリング13で緩衝することで、部品14や回路基板の損傷を防止するようにしたものがある。   For example, as shown in FIG. 4, a conventional suction nozzle 10 includes a nozzle body 11 held by a mounting head of a component mounting machine, a nozzle needle 12 supported by the nozzle body 11 so as to be movable up and down, and the nozzle A spring 13 for urging the needle 12 downward, supplying negative pressure to the nozzle needle 12 through the nozzle body 11 during operation of the component mounting machine, and supplying the component 14 supplied by the feeder of the component mounting machine to the nozzle needle When the lower end of the nozzle needle 12 that is lowered during the suction operation or mounting operation of the component 14 abuts against the component 14, or the component 14 that is attracted to the nozzle needle 12. So that the component 14 and the circuit board are prevented from being damaged by buffering the impact with the spring 13 when it hits the circuit board. There is a thing was.

この場合、ノズルニードル12の下端に部品14を吸着すると、ノズルニードル12の下端開口が部品14で塞がれた密閉状態になるため、図4(b)に示すように、負圧による吸引力によってノズルニードル12がスプリング13を上方に圧縮して吸い上げられた状態となる。この状態で、ノズルニードル12に吸着した部品14を回路基板に実装して負圧を解除して部品14を解放してから、吸着ノズル10全体を上昇させることになるが、負圧を解除した瞬間に、スプリング13の反発力によってノズルニードル12が下方に飛び出して、その下端が回路基板上の部品14に押し付けられた状態となり、当該部品14が損傷したり、或は、当該部品14が実装された回路基板が損傷する可能性がある。   In this case, when the component 14 is adsorbed to the lower end of the nozzle needle 12, the lower end opening of the nozzle needle 12 is closed with the component 14. Therefore, as shown in FIG. As a result, the nozzle needle 12 compresses the spring 13 upward and is sucked up. In this state, the component 14 adsorbed by the nozzle needle 12 is mounted on the circuit board, the negative pressure is released and the component 14 is released, and then the entire suction nozzle 10 is raised, but the negative pressure is released. At the moment, the nozzle needle 12 protrudes downward by the repulsive force of the spring 13 and the lower end thereof is pressed against the component 14 on the circuit board, and the component 14 is damaged or the component 14 is mounted. The damaged circuit board can be damaged.

そこで、特許文献1(特開2002−176293号公報)では、ノズル本体内に、スプリングに代えて、電磁力でノズルニードルを支持する2個の電磁石を上下の位置関係で設け、部品の吸着動作時や実装動作時に2個の電磁石の電流を個別に制御して、ノズルニードルを支持する電磁力を制御することで、部品の吸着動作時や実装動作時にノズルニードルから部品や回路基板に加わる衝撃を電磁力で緩衝するようにしている。   Therefore, in Patent Document 1 (Japanese Patent Laid-Open No. 2002-176293), instead of a spring, two electromagnets that support a nozzle needle with electromagnetic force are provided in the nozzle body in an up-and-down positional relationship, and a component adsorption operation By controlling the electromagnetic force that supports the nozzle needle by controlling the currents of the two electromagnets individually during mounting or mounting operation, the impact applied to the component or circuit board from the nozzle needle during component suction operation or mounting operation Is buffered by electromagnetic force.

また、特許文献2(特開平9−232795号公報)では、ノズル本体内に3つのピストン部を設けて、負圧により各ピストン部に作用する力が互いに打ち消し合うように構成することで、負圧によるノズルニードルの移動を防止するようにしている。   Further, in Patent Document 2 (Japanese Patent Laid-Open No. 9-232795), three piston portions are provided in the nozzle body so that the forces acting on the piston portions due to negative pressure cancel each other out. The movement of the nozzle needle due to pressure is prevented.

特開2002−176293号公報JP 2002-176293 A 特開平9−232795号公報Japanese Patent Laid-Open No. 9-232795

しかし、上記特許文献1,2の構成では、いずれも構成が複雑で、大型化・高コスト化する欠点がある。
そこで、本発明が解決しようとする課題は、構成を簡単化して、小型化・低コスト化の要求に対応できる部品吸着ノズル装置を提供することである。
However, each of the configurations of Patent Documents 1 and 2 has a drawback in that the configuration is complicated and the size and cost are increased.
Therefore, the problem to be solved by the present invention is to provide a component suction nozzle device that can simplify the configuration and meet the demands for miniaturization and cost reduction.

上記課題を解決するために、請求項1に係る発明は、部品実装機に保持されるノズル本体と、このノズル本体に上下動可能に支持されるノズルニードルと、このノズルニードルを下方に付勢する弾性部材とを備え、前記ノズルニードルに前記負圧で吸着した部品を基板に実装した後に該負圧を解除して該ノズルニードルから該部品を解放する部品吸着ノズル装置において、前記ノズル本体に対する前記ノズルニードルの高さ位置を部品吸着時に前記弾性部材を上方に圧縮した位置で保持するノズル保持状態と保持しないノズル可動状態とに切り換え可能な保持手段と、前記ノズル可動状態で前記ノズルニードルに吸着した部品を前記基板に実装してから前記負圧を解除する前に前記保持手段を前記ノズル保持状態に切り換え、該負圧を解除して該部品を解放した後に、次の部品を吸着する前の所定のタイミングで該保持手段を前記ノズル可動状態に切り換える制御手段とを備えた構成としたものである。   In order to solve the above-described problem, the invention according to claim 1 is directed to a nozzle main body held by a component mounting machine, a nozzle needle supported by the nozzle main body so as to be movable up and down, and biasing the nozzle needle downward. A component adsorbing nozzle device for releasing the negative pressure and releasing the component from the nozzle needle after mounting the component adsorbed by the negative pressure on the nozzle needle on the substrate. A holding means capable of switching between a nozzle holding state in which the height position of the nozzle needle is held at a position where the elastic member is compressed upward at the time of component adsorption and a nozzle movable state in which the nozzle member is not held; Before the negative pressure is released after mounting the sucked component on the board, the holding means is switched to the nozzle holding state, and the negative pressure is released. After releasing the said parts is obtained by a configuration in which a control means for switching said holding means at a predetermined timing before adsorbing the following components in the nozzle movably.

この場合、保持手段をノズル可動状態に切り換えれば、ノズルニードルが弾性部材により下方に付勢されるため、ノズル可動状態で部品の吸着動作や実装動作を行うことで、ノズルニードルから部品や基板に加わる衝撃を弾性部材で緩衝することができ、部品や基板の損傷を防止することができる。そして、ノズルニードルに吸着した部品を基板に実装してから負圧を解除する前に保持手段をノズル保持状態に切り換えるため、負圧を解除しても、ノズル本体に対するノズルニードルの高さ位置(弾性部材の圧縮量)を保持することができて、負圧解除時の部品や基板の損傷を防止することができる。しかも、保持手段をノズル保持状態とノズル可動状態とに切り換えるだけであるため、前述した特許文献1,2のものと比べて、構成が簡単であり、小型化・低コスト化の要求に対応できる。   In this case, if the holding means is switched to the nozzle movable state, the nozzle needle is urged downward by the elastic member. Therefore, by performing the adsorption operation and mounting operation of the component in the nozzle movable state, the component or the substrate is removed from the nozzle needle. The shock applied to the substrate can be buffered by the elastic member, and damage to the components and the board can be prevented. And since the holding means is switched to the nozzle holding state before releasing the negative pressure after mounting the component adsorbed on the nozzle needle on the substrate, the height position of the nozzle needle relative to the nozzle body (even if the negative pressure is released) The compression amount of the elastic member) can be maintained, and damage to the components and the board when the negative pressure is released can be prevented. In addition, since the holding means is simply switched between the nozzle holding state and the nozzle movable state, the configuration is simpler than those of the above-described Patent Documents 1 and 2, and the demand for downsizing and cost reduction can be met. .

本発明では、次の部品を吸着する前の所定のタイミングで保持手段をノズル保持状態からノズル可動状態に切り換えるようにしているが、このとき、弾性部材の反発力によってノズルニードルが押し下げられるため、部品解放後に上昇するノズルニードルと解放した部品との間隔が弾性部材によるノズルニードルの押し下げ量以上になる前に、保持手段をノズル可動状態に切り換えると、弾性部材の反発力によって押し下げられたノズルニードルの下端が部品に衝突して部品や基板が損傷する可能性がある。   In the present invention, the holding means is switched from the nozzle holding state to the nozzle movable state at a predetermined timing before the next component is sucked, but at this time, because the nozzle needle is pushed down by the repulsive force of the elastic member, When the holding means is switched to the nozzle movable state before the interval between the nozzle needle that rises after releasing the part and the released part exceeds the pressing amount of the nozzle needle by the elastic member, the nozzle needle pressed down by the repulsive force of the elastic member There is a possibility that the lower end of the battery may collide with the component and damage the component or the board.

この対策として、請求項2のように、部品解放後に上昇するノズルニードルと解放した部品との間隔が弾性部材によるノズルニードルの押し下げ量以上になるまでノズル保持状態を維持し、それ以降に設定した所定のタイミングで該保持手段をノズル可動状態に切り換えるようにすると良い。このようにすれば、保持手段をノズル可動状態に切り換えたときに、弾性部材の反発力によって押し下げられたノズルニードルの下端が部品に衝突して部品や基板が損傷することを防止できる。   As a countermeasure against this, as in claim 2, the nozzle holding state is maintained until the interval between the nozzle needle that rises after releasing the part and the released part is equal to or greater than the amount by which the nozzle needle is pushed down by the elastic member, and is set thereafter. The holding means may be switched to the nozzle movable state at a predetermined timing. In this way, when the holding means is switched to the nozzle movable state, it is possible to prevent the lower end of the nozzle needle pushed down by the repulsive force of the elastic member from colliding with the component and damaging the component or the substrate.

この場合、請求項3のように、ノズルニードルを磁性材料で形成し、保持手段は、ノズル本体に対するノズルニードルの高さ位置(弾性部材の圧縮量)を電磁力で保持する電磁石により構成しても良い。これにより、1個の電磁石の通電をオン/オフするだけで、保持手段をノズル保持状態/ノズル可動状態に簡単に切り換えることができる。   In this case, as in claim 3, the nozzle needle is formed of a magnetic material, and the holding means is constituted by an electromagnet that holds the height position of the nozzle needle (the amount of compression of the elastic member) with respect to the nozzle body by electromagnetic force. Also good. As a result, the holding means can be easily switched between the nozzle holding state and the nozzle movable state simply by turning on / off energization of one electromagnet.

また、請求項4のように、保持手段は、ノズル本体に対するノズルニードルの高さ位置を弾性部材の反発力に抗して保持する保持機構と、該保持機構を駆動するアクチュエータとから構成しても良い。この場合も、保持機構を2つの位置に切り換えるだけの簡単な構成で本発明を実現できる。   According to a fourth aspect of the present invention, the holding means includes a holding mechanism that holds the height position of the nozzle needle with respect to the nozzle body against the repulsive force of the elastic member, and an actuator that drives the holding mechanism. Also good. In this case as well, the present invention can be realized with a simple configuration by simply switching the holding mechanism to two positions.

図1は本発明の実施例1を模式的に示す図で、(a)はノズルニードルの下端が部品に当接した時(吸着直前)の断面図、(b)はノズルニードルの下端で部品を吸着した後の状態を示す断面図である。1A and 1B are diagrams schematically showing Embodiment 1 of the present invention, in which FIG. 1A is a sectional view when the lower end of a nozzle needle comes into contact with a component (immediately before suction), and FIG. It is sectional drawing which shows the state after adsorb | sucking. 図2は実施例1のノズル保持状態/ノズル可動状態切り換えプログラムの処理の流れを示すフローチャートである。FIG. 2 is a flowchart illustrating the flow of processing of the nozzle holding state / nozzle movable state switching program according to the first embodiment. 図3は本発明の実施例2を模式的に示す図で、(a)はノズルニードルの下端が部品に当接した時(吸着直前)の断面図、(b)はノズルニードルの下端で部品を吸着した後の状態を示す断面図である。FIGS. 3A and 3B are diagrams schematically showing Embodiment 2 of the present invention, in which FIG. 3A is a cross-sectional view when the lower end of the nozzle needle comes into contact with the component (immediately before suction), and FIG. 3B is the lower end of the nozzle needle. It is sectional drawing which shows the state after adsorb | sucking. 図4は従来の吸着ノズルを模式的に示す図で、(a)はノズルニードルの下端が部品に当接した時(吸着直前)の断面図、(b)はノズルニードルの下端で部品を吸着した後の状態を示す断面図である。4A and 4B are diagrams schematically showing a conventional suction nozzle, where FIG. 4A is a cross-sectional view of the nozzle needle when the lower end of the nozzle needle comes into contact with the component (immediately before the suction), and FIG. It is sectional drawing which shows the state after having performed.

以下、本発明を実施するための形態を具体化した2つの実施例1,2を説明する。   Hereinafter, two Examples 1 and 2 which embody the form for implementing this invention are demonstrated.

本発明の実施例1を図1及び図2に基づいて説明する。
まず、図1に基づいて本実施例1の吸着ノズル20の構成を説明する。
吸着ノズル20のノズル本体21は、筒状に形成され、図示しない部品実装機の装着ヘッドに交換可能に保持される。このノズル本体21には、負圧で部品22を吸着するノズルニードル23が上下動可能に支持され、該ノズルニードル23の下降限界位置がストッパ(図示せず)で規制されている。このノズルニードル23は、鉄系材料等の磁性材料で形成されている。ノズル本体21内には、ノズルニードル23を下方に付勢するスプリング、ゴム等の弾性部材24がノズルニードル23の上方に収納されている。
A first embodiment of the present invention will be described with reference to FIGS.
First, the configuration of the suction nozzle 20 of the first embodiment will be described with reference to FIG.
The nozzle body 21 of the suction nozzle 20 is formed in a cylindrical shape, and is exchangeably held by a mounting head of a component mounter (not shown). A nozzle needle 23 that adsorbs the component 22 with negative pressure is supported on the nozzle body 21 so as to be movable up and down, and a lower limit position of the nozzle needle 23 is regulated by a stopper (not shown). The nozzle needle 23 is made of a magnetic material such as an iron-based material. An elastic member 24 such as a spring or rubber that biases the nozzle needle 23 downward is housed in the nozzle body 21 above the nozzle needle 23.

ノズル本体21の下部には、電磁石25がノズルニードル23の外周を取り巻くように設けられ、この電磁石25に通電することで、その電磁力によりノズルニードル23を弾性部材24の反発力に抗して任意の高さ位置で吸着保持できるように構成され、特許請求の範囲でいう保持手段として機能する。電磁石25の通電がオフされると、ノズル本体21に対するノズルニードル23の高さ位置を保持しないノズル可動状態となり、部品22の吸着時に所定のタイミングで電磁石25に通電すると、ノズル本体21に対するノズルニードル23の高さ位置を弾性部材24を上方に圧縮した位置で保持するノズル保持状態となる。   An electromagnet 25 is provided below the nozzle body 21 so as to surround the outer periphery of the nozzle needle 23. By energizing the electromagnet 25, the electromagnetic force causes the nozzle needle 23 to resist the repulsive force of the elastic member 24. It is configured so that it can be sucked and held at an arbitrary height position, and functions as a holding means in the claims. When the energization of the electromagnet 25 is turned off, the nozzle is in a movable state that does not hold the height position of the nozzle needle 23 with respect to the nozzle body 21, and when the electromagnet 25 is energized at a predetermined timing when the component 22 is attracted, the nozzle needle with respect to the nozzle body 21. Nozzle holding state in which the height position of 23 is held at a position where the elastic member 24 is compressed upward.

この電磁石25の通電のオン/オフ(ON/OFF)は、コントローラ26によって制御される。このコントローラ26は、部品実装機の稼働中に後述する図2のノズル保持状態/ノズル可動状態切り換えプログラムを所定周期で実行することで、特許請求の範囲でいう制御手段として機能し、ノズル可動状態でノズルニードル23に吸着した部品22を基板に実装してから負圧を解除する前に電磁石25の通電をオンしてノズル保持状態に切り換え、該負圧を解除して該部品22を解放した後に、次の部品22を吸着する前の所定のタイミングで電磁石25の通電をオフしてノズル可動状態に切り換える。   ON / OFF of the energization of the electromagnet 25 is controlled by the controller 26. The controller 26 functions as a control means in the claims by executing a nozzle holding state / nozzle movable state switching program shown in FIG. After the component 22 adsorbed to the nozzle needle 23 is mounted on the substrate, before releasing the negative pressure, the electromagnet 25 is turned on to switch to the nozzle holding state, and the negative pressure is released to release the component 22. Later, at a predetermined timing before the next component 22 is attracted, the electromagnet 25 is turned off to switch to the nozzle movable state.

この際、電磁石25の通電をオフしてノズル可動状態に切り換えたときに、弾性部材24の反発力によってノズルニードル23が押し下げられるため、部品解放後に上昇するノズルニードル23と解放した部品22との間隔が弾性部材24によるノズルニードル23の押し下げ量以上になる前に、電磁石25の通電をオフしてノズル可動状態に切り換えると、弾性部材24の反発力によって押し下げられたノズルニードル23の下端が部品22に衝突して部品22や基板が損傷する可能性がある。   At this time, when the electromagnet 25 is turned off and switched to the nozzle movable state, the nozzle needle 23 is pushed down by the repulsive force of the elastic member 24, so that the nozzle needle 23 that rises after the part is released and the released part 22 When the electromagnet 25 is turned off and switched to the nozzle movable state before the interval becomes equal to or greater than the amount by which the nozzle needle 23 is pushed down by the elastic member 24, the lower end of the nozzle needle 23 pushed down by the repulsive force of the elastic member 24 is the component. There is a possibility that the parts 22 and the substrate may be damaged by colliding with the parts 22.

この対策として、本実施例1では、部品22の解放後に上昇するノズルニードル23と解放した部品22との間隔が弾性部材24によるノズルニードル23の押し下げ量以上になるまでノズル保持状態(電磁石25のオン状態)を維持し、それ以降に設定した所定のタイミング(部品22の解放後のノズル本体21の上昇量が所定値以上になったタイミング)で電磁石25の通電をオフしてノズル可動状態に切り換えるようにしている。   As a countermeasure against this, in the first embodiment, the nozzle holding state (the electromagnet 25 of the electromagnet 25) is maintained until the distance between the released nozzle 22 and the released nozzle 22 is equal to or greater than the amount of pressing of the nozzle needle 23 by the elastic member 24. ON state) and the energization of the electromagnet 25 is turned off at a predetermined timing set thereafter (a timing when the amount of rise of the nozzle body 21 after the release of the component 22 becomes equal to or greater than a predetermined value) to make the nozzle movable. I try to switch.

以上説明した本実施例1のノズル保持状態/ノズル可動状態の切り換えは、コントローラ26によって図2のノズル保持状態/ノズル可動状態切り換えプログラムに従って次のようにして実行される。   The switching of the nozzle holding state / nozzle movable state of the first embodiment described above is executed by the controller 26 as follows according to the nozzle holding state / nozzle movable state switching program of FIG.

図2のノズル保持状態/ノズル可動状態切り換えプログラムは、部品実装機の稼働中に所定周期で繰り返し実行される。本プログラムが起動されると、まずステップ101で、今回実装すべき部品22を基板に実装したか否かを判定し、実装前と判定されれば、ステップ102に進み、電磁石25をオフ状態に維持してノズル可動状態に維持する。これにより、ノズル可動状態で部品22の吸着動作や実装動作が行われる。ノズル可動状態では、ノズルニードル23が弾性部材24により下方に付勢されるため、ノズル可動状態で部品22の吸着動作や実装動作を行うことで、ノズルニードル23から部品22や基板に加わる衝撃を弾性部材24で緩衝することができ、部品22や基板の損傷を防止することができる。   The nozzle holding state / nozzle movable state switching program in FIG. 2 is repeatedly executed at a predetermined cycle while the component mounter is in operation. When this program is started, first, in step 101, it is determined whether or not the component 22 to be mounted this time is mounted on the board. If it is determined that the component is not yet mounted, the process proceeds to step 102 and the electromagnet 25 is turned off. Maintain the nozzle in a movable state. Thereby, the suction operation and the mounting operation of the component 22 are performed in the nozzle movable state. Since the nozzle needle 23 is urged downward by the elastic member 24 in the nozzle movable state, the impact applied to the component 22 and the substrate from the nozzle needle 23 is performed by performing the adsorption operation and mounting operation of the component 22 in the nozzle movable state. It can be buffered by the elastic member 24, and damage to the component 22 and the substrate can be prevented.

その後、ノズルニードル23に吸着した部品22を基板に実装した時点で、上記ステップ101で「Yes」と判定されて、ステップ103に進み、負圧を解除する前か否かを判定し、負圧を解除する前と判定されれば、ステップ104に進み、電磁石25の通電をオンしてノズル保持状態に切り換える。これにより、その後、負圧が解除されても、ノズル本体21に対するノズルニードル23の高さ位置(弾性部材24の圧縮量)が保持される。   Thereafter, when the component 22 adsorbed to the nozzle needle 23 is mounted on the substrate, “Yes” is determined in Step 101, the process proceeds to Step 103, and it is determined whether or not the negative pressure is released. If it is determined that it is before canceling, the process proceeds to step 104 where the electromagnet 25 is turned on to switch to the nozzle holding state. Thereby, even if the negative pressure is released thereafter, the height position of the nozzle needle 23 relative to the nozzle body 21 (the compression amount of the elastic member 24) is maintained.

その後、負圧が解除されて部品22が解放された時点で、上記ステップ103で「Yes」と判定されて、ステップ105に進み、部品22の解放後のノズル本体21の上昇量が所定値以上になったか否かを判定する。ここで、所定値は、部品22の解放後の弾性部材24によるノズルニードル23の押し下げ量以上の値に設定されている。   Thereafter, when the negative pressure is released and the component 22 is released, it is determined “Yes” in Step 103, and the process proceeds to Step 105, where the amount of rise of the nozzle body 21 after the release of the component 22 is greater than or equal to a predetermined value. It is determined whether or not. Here, the predetermined value is set to a value equal to or greater than the amount by which the nozzle needle 23 is pushed down by the elastic member 24 after the part 22 is released.

このステップ105で、部品22の解放後のノズル本体21の上昇量が所定値未満と判定されれば、ステップ104に進み、電磁石25の通電をオン状態に維持してノズル保持状態に維持する。   If it is determined in step 105 that the amount of rise of the nozzle body 21 after the release of the component 22 is less than a predetermined value, the process proceeds to step 104 where the energization of the electromagnet 25 is maintained in the on state and maintained in the nozzle holding state.

その後、部品22の解放後のノズル本体21の上昇量が所定値以上になった時点で、ステップ105で「Yes」と判定されて、ステップ102に進み、電磁石25の通電をオフしてノズル可動状態に切り換える。これにより、次の部品吸着動作は、ノズル可動状態で行われる。   Thereafter, when the rising amount of the nozzle body 21 after the release of the component 22 becomes equal to or greater than a predetermined value, “Yes” is determined in Step 105, the process proceeds to Step 102, the energization of the electromagnet 25 is turned off, and the nozzle is movable. Switch to state. Thereby, the next component suction operation is performed in a nozzle movable state.

以上説明した本実施例1では、電磁石25の通電をオフしてノズル可動状態に切り換えれば、ノズルニードル23が弾性部材24により下方に付勢されるため、ノズル可動状態で部品22の吸着動作や実装動作を行うことで、ノズルニードル23から部品22や基板に加わる衝撃を弾性部材24で緩衝することができ、部品22や基板の損傷を防止することができる。そして、ノズルニードル23に吸着した部品22を基板に実装してから負圧を解除する前に電磁石25の通電をオンしてノズル保持状態に切り換えるため、負圧を解除しても、ノズル本体21に対するノズルニードル23の高さ位置(弾性部材24の圧縮量)を保持することができて、負圧解除時の部品22や基板の損傷を防止することができる。しかも、電磁石25の通電のオン/オフを切り換えるだけであるため、前述した特許文献1,2のものと比べて、構成が簡単であり、小型化・低コスト化の要求に対応することができる。   In the first embodiment described above, if the electromagnet 25 is turned off and switched to the nozzle movable state, the nozzle needle 23 is urged downward by the elastic member 24. By performing the mounting operation, the impact applied to the component 22 and the substrate from the nozzle needle 23 can be buffered by the elastic member 24, and damage to the component 22 and the substrate can be prevented. Since the electromagnet 25 is turned on and switched to the nozzle holding state before releasing the negative pressure after mounting the component 22 adsorbed on the nozzle needle 23 on the substrate, the nozzle main body 21 even if the negative pressure is released. Therefore, the height position of the nozzle needle 23 (the amount of compression of the elastic member 24) can be maintained, and damage to the component 22 and the substrate when releasing the negative pressure can be prevented. In addition, since it is only necessary to switch on / off the energization of the electromagnet 25, the configuration is simpler than those of Patent Documents 1 and 2 described above, and it is possible to meet the demands for miniaturization and cost reduction. .

図3に示す本発明の実施例2では、ノズル本体21に対するノズルニードル23の高さ位置を弾性部材24の反発力に抗して保持する保持機構31と、該保持機構31を駆動するアクチュエータ32とから保持手段が構成されている。   In the second embodiment of the present invention shown in FIG. 3, a holding mechanism 31 that holds the height position of the nozzle needle 23 relative to the nozzle body 21 against the repulsive force of the elastic member 24, and an actuator 32 that drives the holding mechanism 31. And holding means.

具体的には、保持機構31は、ノズル本体21の下部にクランプ部材31aをノズルニードル23の外周面と接離可能に設け、ソレノイド等のアクチュエータ32の通電をオンすると、クランプ部材31aがノズルニードル23の外周面に圧接して、ノズル本体21に対するノズルニードル23の高さ位置を弾性部材24の反発力に抗して保持するノズル保持状態となり、アクチュエータ32の通電をオフすると、クランプ部材31aがノズルニードル23の外周面から離れて、ノズル可動状態となる。その他の構成は、前記実施例1と同じである。   Specifically, the holding mechanism 31 is provided with a clamp member 31a in the lower part of the nozzle body 21 so as to be able to contact and separate from the outer peripheral surface of the nozzle needle 23, and when the actuator 32 such as a solenoid is turned on, the clamp member 31a is moved to the nozzle needle. When the nozzle 32 is pressed against the outer peripheral surface of the nozzle body 23 to hold the height position of the nozzle needle 23 against the nozzle body 21 against the repulsive force of the elastic member 24 and the actuator 32 is turned off, the clamp member 31 a The nozzle moves away from the outer peripheral surface of the nozzle needle 23. Other configurations are the same as those of the first embodiment.

本実施例2でも、ノズル可動状態でノズルニードル23に吸着した部品22を基板に実装してから負圧を解除する前にアクチュエータ32の通電をオンしてノズル保持状態に切り換え、該負圧を解除して該部品22を解放する。部品22の解放後に上昇するノズルニードル23と解放した部品22との間隔が弾性部材24によるノズルニードル23の押し下げ量以上になるまでノズル保持状態(アクチュエータ32のオン状態)を維持し、それ以降に設定した所定のタイミング(部品22の解放後のノズル本体21の上昇量が所定値以上になったタイミング)でアクチュエータ32の通電をオフしてノズル可動状態に切り換える。   Also in the second embodiment, the actuator 32 is turned on to switch to the nozzle holding state before the negative pressure is released after the component 22 adsorbed to the nozzle needle 23 in the movable state of the nozzle is mounted on the substrate. Release and release the part 22. The nozzle holding state (actuator 32 on state) is maintained until the distance between the nozzle needle 23 that rises after the release of the component 22 and the released component 22 becomes equal to or greater than the amount by which the nozzle needle 23 is pushed down by the elastic member 24. The actuator 32 is turned off to switch to the nozzle movable state at a set predetermined timing (a timing when the rising amount of the nozzle body 21 after releasing the component 22 becomes equal to or greater than a predetermined value).

以上説明した本実施例2でも、前記実施例1と同様の効果を得ることができる。
尚、アクチュエータ32は、空気圧のアクチュエータを用いても良い。
In the second embodiment described above, the same effect as that of the first embodiment can be obtained.
The actuator 32 may be a pneumatic actuator.

20…吸着ノズル、21…ノズル本体、22…部品、23…ノズルニードル、24…弾性部材、25…電磁石(保持手段)、26…コントローラ(制御手段)、31…保持機構(保持手段)、31a…クランプ部材、32…アクチュエータ   DESCRIPTION OF SYMBOLS 20 ... Adsorption nozzle, 21 ... Nozzle body, 22 ... Parts, 23 ... Nozzle needle, 24 ... Elastic member, 25 ... Electromagnet (holding means), 26 ... Controller (control means), 31 ... Holding mechanism (holding means), 31a ... Clamp member, 32 ... Actuator

Claims (4)

部品実装機に保持され、負圧が導入されるノズル本体と、
前記ノズル本体に上下動可能に支持され、前記負圧で部品を吸着するノズルニードルと、
前記ノズル本体に内蔵され、前記ノズルニードルを下方に付勢する弾性部材とを備え、 前記ノズルニードルに前記負圧で吸着した部品を基板に実装した後に該負圧を解除して該ノズルニードルから該部品を解放する部品吸着ノズル装置において、
前記ノズル本体に対する前記ノズルニードルの高さ位置を部品吸着時に前記弾性部材を上方に圧縮した位置で保持するノズル保持状態と保持しないノズル可動状態とに切り換え可能な保持手段と、
前記ノズル可動状態で前記ノズルニードルに吸着した部品を前記基板に実装してから前記負圧を解除する前に前記保持手段を前記ノズル保持状態に切り換え、該負圧を解除して該部品を解放した後に、次の部品を吸着する前の所定のタイミングで該保持手段を前記ノズル可動状態に切り換える制御手段とを備えていることを特徴とする部品吸着ノズル装置。
A nozzle body that is held by a component mounter and into which negative pressure is introduced;
A nozzle needle that is supported by the nozzle body so as to be movable up and down, and adsorbs a component under the negative pressure;
An elastic member that is built in the nozzle body and biases the nozzle needle downward, and after mounting the component adsorbed by the negative pressure on the nozzle needle on the substrate, the negative pressure is released from the nozzle needle. In the component suction nozzle device for releasing the component,
Holding means capable of switching between a nozzle holding state in which the height position of the nozzle needle relative to the nozzle body is held at a position where the elastic member is compressed upward at the time of component adsorption, and a nozzle movable state in which the nozzle member is not held;
Before the negative pressure is released after mounting the component adsorbed to the nozzle needle in the nozzle movable state on the substrate, the holding means is switched to the nozzle holding state, and the negative pressure is released to release the component. And a control unit that switches the holding unit to the nozzle movable state at a predetermined timing before the next component is sucked.
前記制御手段は、部品実装後に前記保持手段を前記ノズル保持状態に切り換えてから前記負圧を解除して前記部品を解放した後に前記ノズル本体と前記ノズルニードルを上昇させて、該ノズルニードルと解放した部品との間隔が前記弾性部材による該ノズルニードルの押し下げ量以上になるまで前記ノズル保持状態を維持し、それ以降に設定した前記所定のタイミングで該保持手段を前記ノズル可動状態に切り換えることを特徴とする請求項1に記載の部品吸着ノズル装置。   The control means switches the holding means to the nozzle holding state after mounting the components, releases the negative pressure and releases the components, and then raises the nozzle body and the nozzle needle to release the nozzle needle. The nozzle holding state is maintained until the distance between the component and the component becomes equal to or greater than the pressing amount of the nozzle needle by the elastic member, and the holding means is switched to the nozzle movable state at the predetermined timing set thereafter. The component suction nozzle device according to claim 1, wherein 前記ノズルニードルは、磁性材料で形成され、
前記保持手段は、前記ノズル本体に対する前記ノズルニードルの高さ位置を電磁力で保持する電磁石により構成されていることを特徴とする請求項1又は2に記載の部品吸着ノズル装置。
The nozzle needle is formed of a magnetic material,
3. The component suction nozzle device according to claim 1, wherein the holding unit includes an electromagnet that holds a height position of the nozzle needle with respect to the nozzle body by electromagnetic force.
前記保持手段は、前記ノズル本体に対する前記ノズルニードルの高さ位置を前記弾性部材の反発力に抗して保持する保持機構と、該保持機構を駆動するアクチュエータとから構成されていることを特徴とする請求項1又は2に記載の部品吸着ノズル装置。   The holding means includes a holding mechanism that holds the height position of the nozzle needle with respect to the nozzle body against a repulsive force of the elastic member, and an actuator that drives the holding mechanism. The component suction nozzle device according to claim 1 or 2.
JP2010278641A 2010-12-14 2010-12-14 Parts suction nozzle device Active JP5547052B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010278641A JP5547052B2 (en) 2010-12-14 2010-12-14 Parts suction nozzle device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010278641A JP5547052B2 (en) 2010-12-14 2010-12-14 Parts suction nozzle device

Publications (2)

Publication Number Publication Date
JP2012129322A true JP2012129322A (en) 2012-07-05
JP5547052B2 JP5547052B2 (en) 2014-07-09

Family

ID=46646060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010278641A Active JP5547052B2 (en) 2010-12-14 2010-12-14 Parts suction nozzle device

Country Status (1)

Country Link
JP (1) JP5547052B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102849461A (en) * 2012-08-16 2013-01-02 深圳职业技术学院 Electromagnetic adsorption device and object moving system
JP2018078256A (en) * 2016-11-11 2018-05-17 ヤマハ発動機株式会社 Component mounting device
CN108501005A (en) * 2018-02-01 2018-09-07 东莞市天合机电开发有限公司 A kind of positioning grabbing device of L-type sheet metal component
CN110911331A (en) * 2018-09-14 2020-03-24 东莞市中麒光电技术有限公司 Suction nozzle convenient for transferring and fixing LED chips and method for transferring and fixing single LED chip on backboard
CN112884983A (en) * 2021-01-12 2021-06-01 万梅 Drink-brewing vending machine

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196042U (en) * 1981-06-03 1982-12-11
JPH0878891A (en) * 1994-09-08 1996-03-22 Hitachi Techno Eng Co Ltd Electronic parts mounting apparatus
JPH09232795A (en) * 1996-02-26 1997-09-05 Sony Corp Suction device and mounting device
JP2002043336A (en) * 2000-07-26 2002-02-08 Shibaura Mechatronics Corp Electronic component crimping device
JP2002176293A (en) * 2000-12-07 2002-06-21 Juki Corp Method and device for mounting electronic part
US6688833B1 (en) * 1999-05-21 2004-02-10 Matsushita Electric Industrial Co., Ltd. Part sucking nozzle lifter

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196042U (en) * 1981-06-03 1982-12-11
JPH0878891A (en) * 1994-09-08 1996-03-22 Hitachi Techno Eng Co Ltd Electronic parts mounting apparatus
JPH09232795A (en) * 1996-02-26 1997-09-05 Sony Corp Suction device and mounting device
US6688833B1 (en) * 1999-05-21 2004-02-10 Matsushita Electric Industrial Co., Ltd. Part sucking nozzle lifter
JP4512275B2 (en) * 1999-05-21 2010-07-28 パナソニック株式会社 Component suction nozzle lifting device
JP2002043336A (en) * 2000-07-26 2002-02-08 Shibaura Mechatronics Corp Electronic component crimping device
JP2002176293A (en) * 2000-12-07 2002-06-21 Juki Corp Method and device for mounting electronic part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102849461A (en) * 2012-08-16 2013-01-02 深圳职业技术学院 Electromagnetic adsorption device and object moving system
JP2018078256A (en) * 2016-11-11 2018-05-17 ヤマハ発動機株式会社 Component mounting device
CN108501005A (en) * 2018-02-01 2018-09-07 东莞市天合机电开发有限公司 A kind of positioning grabbing device of L-type sheet metal component
CN110911331A (en) * 2018-09-14 2020-03-24 东莞市中麒光电技术有限公司 Suction nozzle convenient for transferring and fixing LED chips and method for transferring and fixing single LED chip on backboard
CN112884983A (en) * 2021-01-12 2021-06-01 万梅 Drink-brewing vending machine

Also Published As

Publication number Publication date
JP5547052B2 (en) 2014-07-09

Similar Documents

Publication Publication Date Title
JP5547052B2 (en) Parts suction nozzle device
US8766750B2 (en) Electromagnetic switching apparatus
JPWO2013183123A1 (en) Component insertion assembly equipment
CN106887365A (en) DC relay
JP2012089493A (en) Electromagnetic switching device
KR102376224B1 (en) Film suction mechanism
KR101414715B1 (en) Switching device, method of assembling or operating such switching device and electrical device comprising such switching device
KR20150004799A (en) Electromagnetic contactor
CN105234953A (en) Suction cup for adsorption device and adsorption device provided with same
JP6321371B2 (en) Solenoid valve device
KR20170079601A (en) Direct Relay
CN105451532B (en) Electronic component mounting apparatus
CN104043886A (en) Solder Ball Printer And Solder Ball Printing Method
JP2010282834A (en) Electromagnetic contactor
EP1916690A4 (en) Relay
KR101507316B1 (en) Magnetic type picking apparatus
CN104692116B (en) Material assembling mechanism
JP2010027752A (en) Mounting head, and component mounting machine
JP2012227259A (en) Spherical body suction device, spherical body mounting device, and spherical body suction method
JP5848931B2 (en) Switch device with reset function
JP5106081B2 (en) Work suction holding method
KR101684476B1 (en) Magnetic contactor
JP2002018758A (en) Device for sucking parts
CN220264381U (en) Pick-and-place device and processing equipment
JP2020115433A (en) relay

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20131115

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140417

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140428

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140514

R150 Certificate of patent or registration of utility model

Ref document number: 5547052

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250