JP2012129223A - Method for manufacturing surface-mounted component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface-mounted component which is improved in vibration resistance and in which a Manhattan phenomenon hardly occurs.SOLUTION: In the method for manufacturing a surface-mounted component, a side face electrode 17 is formed by folding a side face electrode part 18 along a side face of a pedestal 13 while the pedestal 13 is held with a die, and a support 19 formed on both sides of the side face electrode part 18 is cut at a plane almost the same with that of the side face electrode 17 to obtain an individual piece. Thus, even when an R shape is formed at a corner of the side face electrode 17, a surface-mounted component can be supported by the support 19, so that a Manhattan phenomenon hardly occurs.

Description

  The present invention relates to a method for manufacturing a surface mount component such as a chip inductor used in various electronic devices.

  In recent years, with the increase in the density of electronic devices, surface mounting components have progressed, and surface mounting is also required for components having a relatively high center of gravity such as inductors. Especially when used in applications where vibration is likely to be applied, such as in-vehicle use, a solder fillet is formed on the side surface when soldering by extending the electrode not only on the mounting surface but also on the side surface in order to ensure vibration resistance. What is configured as described above is desired.

  Next, such a conventional surface mount component will be described with reference to the drawings.

  FIG. 4 is a perspective view of a conventional surface mount component using an inductor as a circuit element.

  As shown in FIG. 4, the conventional surface mount component has a drum core 3 having an upper collar 1 and a lower collar 2 of a winding core, and an insulating coated copper wire wound between the upper collar 1 and the lower collar 2 of the drum core 3. A coil 4 that is turned and a terminal plate 5 that is a metal flat plate that is affixed to the bottom surface of the drum core 3 and connected to the coil 4, and a side electrode 6 is formed by bending a part of the terminal plate 5 from the mounting surface to the side surface. When a surface mount component is mounted on a substrate (not shown), a solder fillet (not shown) is formed on the side surface of the surface mount component.

  As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

Japanese Patent Laid-Open No. 11-283840

  In the above-described conventional electronic component, since the terminal plate 5 is formed so as to be bent from the mounting surface to the side surface, R7 is formed at the corner portion. Particularly in a component having a high center of gravity, the side surface is pulled by the solder during reflow soldering. The so-called Manhattan phenomenon is likely to occur. An object of the present invention is to provide a method for manufacturing a surface-mounted component that improves vibration resistance and is unlikely to cause a Manhattan phenomenon.

  In order to solve the above problems, the present invention provides a first step of forming a pedestal portion by integral molding on a terminal portion connected to a lead frame by integral molding, and a circuit element is bonded and fixed to the pedestal portion to connect the terminal portion and the circuit. A second step of electrically connecting the element and a third step of obtaining a surface mounting component by cutting the terminal portion into pieces, the terminal portion serving as a bottom electrode of the surface mounting component It consists of an electrode part, a side electrode part to be a side electrode of a surface mount component, and support parts provided on both sides of the side electrode part and connected to the lead frame. The side electrode portion is formed by being bent along the side surface of the pedestal portion while being sandwiched between the two, and in the third step, the support portion is cut on substantially the same plane as the side electrode.

  With the above configuration, even if R is formed from the bottom electrode to the side electrode, the support portion extends from the same surface as the bottom electrode toward the outside to almost the same surface as the side electrode. This can prevent the Manhattan phenomenon.

The figure explaining the manufacturing method of the surface mounting components in one embodiment of this invention The top view of the lead frame used for the surface mounting component in one embodiment of this invention Sectional drawing explaining the bending process of the side surface electrode of the surface mounting component in one embodiment of this invention Perspective view of conventional surface mount components

  Hereinafter, a surface mount component according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram for explaining a method of manufacturing a surface-mounted component using an inductor as a circuit element in an embodiment of the present invention.

  First, as shown in FIG. 1A, a pedestal portion 13 is formed by integrally molding a resin such as a liquid crystal polymer on a lead frame 11 on which terminal portions 12 are formed. As shown in FIG. 2, the lead frame 11 is formed by punching phosphor bronze having a thickness of about 0.1 mm, and tin plating is applied to the entire surface or at least the lower surface side (surface to be the mounting surface). .

  The terminal portion 12 includes a buried portion 23 having a level difference from the mounting surface and embedded in the pedestal portion 13, a bottom electrode portion 16 disposed on the mounting surface and connected to the embedded portion 23 serving as the bottom electrode 15 of the surface mount component, Provided on both sides of the side electrode portion 18, the side electrode portion 18 connected to the bottom electrode portion 16 that becomes the side electrode 17 of the mounting component, the wiring portion 24 connected to the bottom electrode portion 16 that connects the circuit elements of the surface mounting component. And the support portion 19 connected to the bottom electrode portion 16, and the terminal portion 12 is connected to the entire lead frame 11 by the support portion 19.

  The side electrode portion 18 is formed by providing a U-shaped cutout portion 20, and support portions 19 are formed on both sides thereof.

  Next, as shown in FIG. 1B, the side electrode 17 is formed by bending the side electrode portion 18 along the side surface of the pedestal portion 13. At this time, as shown in FIG. 3, it is desirable to hold the pedestal portion 13 from above and below by the mold 25 and bend the side electrode portion 18 along the side surface of the pedestal portion 13 by the slide mold 26. When bent in this manner, the outside of the corner 27 has a radius of curvature of about 0.2 to 0.5 mm.

  Next, as shown in FIG. 1C, the drum core 21 is bonded and fixed to the pedestal portion 13 with an adhesive such as an epoxy resin, and the insulation coated copper wire 22 is wound around the drum core 21 and electrically connected to the wiring portion 24. At this time, the drum core 21 around which the insulation coated copper wire 22 is wound may be bonded and fixed to the pedestal portion 13 and then electrically connected to the wiring portion 24. In this way, the drum core 21 around which the insulation-coated copper wire 22 is wound as the circuit element 14 is attached to the pedestal portion 13.

  Next, after the wiring portion 24 is bent along the side surface of the pedestal portion 13, the support portion 19 is cut into pieces by cutting almost the same surface as the side surface electrode 17, and the surface mounting type as shown in FIG. Can be obtained.

  By using the manufacturing method as described above, all can be manufactured in the state of the lead frame 11 until final singulation, so that mass productivity can be improved and the Manhattan phenomenon can be prevented. can do. That is, by forming the side surface electrode 17 by bending the side surface electrode portion 18 with the mold 25 and the slide mold 26, even if the corner portion 27 is formed, the support portions 19 formed on both sides thereof are used as the bottom surface electrode 15. The support portion 19 is supported and the Manhattan phenomenon is less likely to occur.

  The surface mount component according to the present invention is industrially useful because it can improve the vibration resistance even when the center of gravity is high, and can manufacture a surface mount component capable of preventing the Manhattan phenomenon.

DESCRIPTION OF SYMBOLS 11 Lead frame 12 Terminal part 13 Base part 14 Circuit element 15 Bottom electrode 16 Bottom electrode part 17 Side electrode 18 Side electrode part 19 Support part 20 Notch part 21 Drum core 22 Insulation coating copper wire 23 Embedded part 24 Wiring part 25 Mold 26 Slide mold 27 corner

Claims (1)

A first step of integrally forming a pedestal portion by resin molding on a terminal portion connected to the lead frame, and a circuit element is bonded and fixed to the pedestal portion to electrically connect the terminal portion and the circuit element. A second step, and a third step of obtaining a surface-mounted component by cutting into pieces by cutting the terminal portion, wherein the terminal portion is a bottom electrode portion to be a bottom electrode of the surface-mounted component; A side electrode part to be a side electrode of a surface mount component, and a support part provided on both sides of the side electrode part and connected to the lead frame. The side electrode is formed of a metal after the first step. The side electrode portion is formed by being bent along the side surface of the pedestal portion while being sandwiched by a mold, and the support portion is cut in substantially the same plane as the side electrode in the third step. Be Method of producing the mounting parts.

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