JP2012124422A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device in which the welding step can be simplified by setting the same welding conditions for each terminal, and occurrence of distortion is prevented between the IC side leads.SOLUTION: A power generation controller 100 for vehicle comprises a packaged IC 50 having a plurality of projecting IC leads 51, and a resin case 10 having a plurality of resin case terminals 31 which expose at positions corresponding to the plurality of IC leads 51, respectively, in an IC housing section 11 for housing the IC 50. The IC leads 51 and corresponding resin case terminals 31 are bonded each other by welding. Protrusions 53 for resistance-welding are formed on the plurality of IC leads 51, and either the material and/or the cross-sectional shape is different from each other in some of the plurality of resin case terminals 31.

Description

  The present invention relates to a semiconductor device mounted on a vehicle alternator or the like.

  2. Description of the Related Art Conventionally, there is known a controller for an automotive alternator in which an IC chip with a lead is accommodated in a concave portion provided in a resin case and a case-side terminal and an IC chip terminal are welded. (For example, refer to Patent Document 1). In this controller, a projection for welding is formed on a terminal on the case side, and welding is performed between the terminal and the lead of the IC chip.

JP 2009-77462 A (page 73-10, FIG. 1-5)

  By the way, in the controller of the alternator for vehicles disclosed in Patent Document 1, each of the plurality of case-side terminals has different functions and roles, and the cross-sectional shape, material, and the like differ depending on each terminal. . For example, the terminal for energizing a large current and fixing the case is made of steel and made of a thick material, and has good contact as a male terminal of a connector that communicates with an ECU or the like The terminal for which is required is formed using a copper-based material.

  As described above, even though each of the plurality of case-side terminals has a different cross-sectional shape and material, the controller disclosed in Patent Document 1 has a welding protrusion on the case-side terminal for welding with the lead of the IC chip. Therefore, it is necessary to set welding conditions (welding current, welding time, etc.) for each terminal during welding, and there is a problem that the welding process becomes complicated. In addition, there is a problem that the displacement (degree of crushing) of the welding projections after welding is not uniform, the height of the leads after welding varies, and distortion occurs between the leads.

  The present invention was created in view of the above points, and its purpose is to simplify the welding process by making the welding conditions of each terminal the same, and distortion occurs between the IC-side leads. An object of the present invention is to provide a semiconductor device that can prevent this.

  In order to solve the above-described problems, a semiconductor device according to the present invention includes a packaged IC in which a plurality of leads protrude, and a plurality of ICs exposed at positions corresponding to the plurality of leads in an IC housing portion that houses the IC. In a semiconductor device having a resin case having a case-side terminal and corresponding leads and case-side terminals are joined to each other by welding, a plurality of leads are formed with resistance welding convex portions. At least one part of the side terminal is different from each other in at least one of material and cross-sectional shape. In particular, the surface corresponding to the convex portion of the case-side terminal has a planar shape with no irregularities.

  By providing a convex portion on the lead side of the IC instead of a plurality of case side terminals having different materials and cross-sectional shapes, it is possible to align welding conditions and simplify the welding process. In addition, the displacement (degree of crushing) of the convex portion after welding can be made uniform, the variation in the height of the lead after welding can be eliminated, and the occurrence of distortion between the leads can be prevented.

  Moreover, it is desirable that the plurality of leads described above have the same material and cross-sectional shape. In general, since IC leads are cut out from a common lead frame and molded, it is easy to make the material and the cross-sectional shape the same, thereby making it possible to completely make the welding conditions the same for a plurality of leads. .

  In addition, it is desirable that the tip of the above-described convex portion is in contact with the case-side terminal by a point or a line. Thus, melting can proceed from the tip side, and the lead of the IC and the case side terminal can be reliably joined by resistance welding.

  In addition, it is desirable that the above-described convex portion is formed by an additional process for an IC having a straight lead having no convex portion. As a result, a general-purpose IC can be used, and at the same time as the lead cutting process that is generally performed, the protrusion can be formed to simplify the process, thereby reducing costs.

  Also, it operates as a vehicle power generation control device that performs power generation control of the vehicle power generator, and each of the plurality of case-side terminals is connected to different configurations of the vehicle power generator and may have different roles and functions. desirable. The case-side terminal of the resin case that houses the IC used in the vehicle power generation control device has different roles and functions, so the materials and cross-sectional shape cannot be made uniform, but this is the case. However, it is possible to align the welding conditions by providing a convex portion on the IC lead and performing welding, thereby simplifying the welding process and preventing the distortion between the leads.

It is sectional drawing of the electric power generation control apparatus for vehicles of one Embodiment. It is a top view of the power generation control device for vehicles of one embodiment. It is a figure which shows IC accommodating part of a resin case. It is a top view of IC. It is a side view of IC. It is a side view of IC which has a straight-shaped IC lead. It is a figure which shows the specific example of the convex part formed by additional shaping | molding in IC lead. It is a figure which shows the structure of the generator for vehicles which shows the specific example of a connection using the connector terminal and external connection terminal with which the resin case was equipped.

  Hereinafter, a vehicle power generation control device according to an embodiment to which a semiconductor device of the present invention is applied will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a vehicle power generation control device according to an embodiment. FIG. 2 is a plan view of the vehicle power generation control device according to the embodiment. As shown in these drawings, the vehicle power generation control device 100 of the present embodiment includes a resin case 10 and a packaged IC (integrated circuit) 50. The resin case 10 includes a connector terminal 20 used for transmitting and receiving signals to and from an external control device, external connection terminals 21 and 22 having a function of fixing the resin case 10, and other generators for vehicles. It has external connection terminals 23 and 24 used for inputting and outputting voltage and current to and from the configuration. Further, the resin case 10 has an IC housing portion 11. A plurality of resin case terminals (case side terminals) 31 serving as the other ends of the various terminals described above are exposed in the IC housing portion 11.

  The IC 50 has a plurality of IC leads 51 connected to each of the plurality of resin case terminals 31 and is accommodated in the IC accommodating portion 11 of the resin case 10. The IC 50 is assembled with a cooling fin 60 that dissipates its own heat generation.

  FIG. 3 is a view showing the IC accommodating portion 11 of the resin case 10. FIG. 4 is a plan view of the IC 50. FIG. 5 is a side view of the IC 50. In the present embodiment, five resin case terminals 31 are exposed in the IC accommodating portion 11, and five IC leads 51 protrude from the IC 50. Each of the five IC leads 51 is welded to each of these five resin case terminals 31 that are integrally formed with the resin case 10 and exposed to the outside. As a specific welding method, projection welding as resistance welding is used.

  Each of the five resin case terminals 31 has a different role and function. For example, in the resin case terminal 31 integrated with the connector terminal 20, a copper-based material is used to improve contact with a connector portion (not shown) provided at an end portion of a harness for connection with an external control device. used. Further, in the resin case terminal 31 integrated with the external connection terminals 21 and 22 having a fixing function with the resin case 10, an iron-based material having a large plate thickness is used in order to maintain strength. Furthermore, the resin case terminal 31 integrated with the external connection terminals 23 and 24 used for inputting / outputting voltage and current to / from other configurations of the vehicle generator has a relatively thin plate thickness. Ferrous materials are used. On the other hand, the five IC leads 51 are formed from a single plate (lead frame) when the IC 50 is manufactured, and all the five IC leads 51 have the same material and the same cross-sectional shape.

  By the way, in this embodiment, the IC lead 51 is formed with a projection 53 for projection welding in the vicinity of its tip. The convex portion 53 has a protruding shape whose tip can be contacted with a resin case terminal 31 to be welded by a line or a point, and is a part of a straight shape (flat plate shape, planar shape) IC lead 51 ′ having no convex portion. Is added by pressing. In addition, the surface corresponding to the convex part 53 of the resin case terminal 31 used as a welding other party has a planar shape without an unevenness | corrugation.

  FIG. 6 is a side view of an IC 50 'having a straight IC lead 51'. As this IC 50 ', a conventional product before the improvement according to the present invention can be used as it is. By processing a part of the IC lead 51 ′ of the IC 50 ′ as the conventional product, an IC 50 (FIG. 5) having the IC lead 51 having the convex portion 53 formed therein is obtained. By adding the convex portion 53 to the IC lead 51 ′ having the same material and the same cross-sectional shape, the welding condition is changed during welding and the welding procedure is not complicated, and the collapsed state of the convex portion 53 after welding is made uniform. Therefore, in the conventional structure, it is possible to prevent distortion that has occurred due to the difference in displacement due to variation in the degree of collapse of the IC lead after welding.

  FIG. 7 is a diagram illustrating a specific example of the convex portion 53 formed on the IC lead by additional molding. FIG. 7A shows a convex portion 53 having a projecting shape with a semicircular cross section. FIG. 7B shows a convex portion 53 having a protruding shape with a pointed cross section. FIG. 7C shows a convex portion 53 that is a hemispherical protruding shape.

  In this embodiment, the convex part 53 is added not to the resin case terminal 31 side using mainly an iron-based material but to the IC lead 51 side using a copper-based material. In this way, by providing the convex portion 53 on the material side having high thermal conductivity, heat generation on the material side where heat conductivity is high and heat at the time of welding easily escapes can be increased, and the temperature at the time of welding can be made uniform. Stability is obtained.

  In general, the IC lead 51 '(FIG. 6) is used by cutting a long one to a predetermined length. Therefore, if the step of forming the convex portion 53 is performed simultaneously with this cutting step, the step of forming the convex portion toward the resin case terminal 31 that has been conventionally performed can be abolished. The cost can be reduced by the conversion.

  FIG. 8 is a diagram illustrating a configuration of a vehicular generator that illustrates a specific connection example using the connector terminal 20 and the external connection terminals 21 to 24 provided in the resin case 10. As shown in FIG. 8, the vehicular generator 200 incorporates a vehicular power generation control device 200 that performs power generation control of the vehicular power generator 200, and uses a connection harness for the ECU 300 as an external control device. Connected.

  Connection between the vehicle power generation control device 100 and each component in the ECU 300 or the vehicle generator 200 is performed using the connector terminal 20 and the external connection terminals 21 to 24 described above. Specifically, the connector terminal 20 is used for connection with the ECU 300, and communication signals are transmitted / received via the connector terminal 20. The external connection terminal 21 is used for connection with the output terminal (B terminal) of the vehicle generator 200. The external connection terminal 22 is used for connection to another part of the vehicle generator 200 (for example, the negative-side radiating fin of the rectifier) where the ground potential is applied. The external connection terminal 23 is used for connection with one of the phase windings of the stator winding of the vehicle generator 200, and the phase voltage is detected. The external connection terminal 24 is used for connection to one end of the field winding of the vehicular generator 200, and excitation current is supplied or circulated.

  As described above, in the vehicle power generation control device 100 according to the present embodiment, the convex portion 53 is provided on the IC lead 51 side of the IC 50 instead of the plurality of resin case terminals 31 having different materials and cross-sectional shapes. The welding conditions can be made uniform, and the welding process can be simplified. In addition, the displacement (degree of crushing) of the convex portion 53 after welding can be made uniform, variation in the height of the IC lead 51 after welding can be eliminated, and the occurrence of distortion between the IC leads 51 can be prevented. it can.

  In general, since the IC lead 51 of the IC 50 is cut out from a common lead frame and formed, it is easy to make the material and the cross-sectional shape the same. Can be the same.

  Further, by causing the tip of the convex portion 53 to contact the resin case terminal 31 with a point or a line, the melting proceeds from the tip side, and the IC lead 51 of the IC 50 and the resin case terminal 31 are reliably resistance welded (projection welding). ).

  Further, by forming the convex portion 53 by an additional process with respect to the IC having the straight lead without the convex portion (FIG. 6), a general-purpose IC can be used and the lead cutting generally performed is performed. At the same time as the process, the convex portion 53 can be formed to simplify the process, and the cost can be reduced.

  In addition, since the resin case terminal 31 of the resin case 10 that houses the IC 50 used in the vehicle power generation control device 100 has different roles and functions, the material and the cross-sectional shape cannot be made uniform. Even in such a case, it is possible to align the welding conditions by providing the convex portion 53 on the IC lead 51 of the IC 50 and performing welding, thereby simplifying the welding process and preventing the distortion between the leads. .

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation implementation is possible within the range of the summary of this invention. For example, in the above-described embodiment, the present invention is applied to the vehicle power generation control device 100. However, the present invention may be applied to semiconductor devices other than the vehicle power generation control device 100.

  In the embodiment described above, the IC lead 51 of the IC 50 is connected to a different configuration of the vehicle generator 200 via the external connection terminals 21 to 24 and also connected to the ECU 300 via the connector terminal 20. Although the case has been described, the connection destination of the IC lead 51 may be changed as appropriate. For example, the case where it connects with only the different structure of the generator 200 for vehicles, and does not connect with ECU300 etc. can be considered.

  In the above-described embodiment, the case where the convex portion 53 is added in a separate process has been described. However, when the IC 50 is manufactured, for example, when the IC lead 51 is cut out from the lead frame, the convex portion 53 is formed. Also good.

  As described above, according to the present invention, it is possible to align the welding conditions by providing the convex portion 53 on the IC lead 51 side of the IC 50 instead of the plurality of resin case terminals 31 having different materials and cross-sectional shapes. The welding process can be simplified.

DESCRIPTION OF SYMBOLS 10 Resin case 11 IC accommodating part 20 Connector terminal 21, 22, 23, 24 External connection terminal 31 Resin case terminal 50 IC (integrated circuit)
51 IC Lead 53 Protrusion 60 Cooling Fin 100 Power Generation Control Device for Vehicle 200 Generator for Vehicle 300 ECU

Claims (6)

An IC in which a plurality of leads are packaged and a resin case having a plurality of case-side terminals exposed at positions corresponding to each of the plurality of leads in an IC housing portion that houses the IC; In the semiconductor device in which the corresponding ones of the case side terminals are joined by welding,
Protrusions for resistance welding are formed on the plurality of leads,
At least some of the plurality of case-side terminals are different from each other in at least one of material and cross-sectional shape. In claim 1,
The surface corresponding to the convex part of the case side terminal has a planar shape without unevenness, The semiconductor device characterized by things. In claim 1 or 2,
The plurality of leads are the same in material and cross-sectional shape. In any one of Claims 1-3,
The semiconductor device according to claim 1, wherein a tip of the convex portion is in contact with the case-side terminal by a point or a line. In any one of Claims 1-4,
The semiconductor device according to claim 1, wherein the convex portion is formed by an additional process with respect to the IC having the straight lead having no convex portion. In any one of Claims 1-5,
Operates as a vehicle power generation control device that performs power generation control of a vehicle generator,
Each of the plurality of case-side terminals is connected to a different configuration of the vehicular generator and has a different role and function.

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