JP2012119015A - Optical pickup device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical pickup device capable of enhancing productivity, and a method for manufacturing the same.SOLUTION: In the optical pickup device which optically records information on an optical disk and/or optically reproduces the information recorded on the optical disk includes a pickup case mounted with a predetermined optical component, an electronic component mounted on the outside surface of the pickup case, a plate to which the electronic component is fixed, and a flexible printed board of which one end is physically and electrically connected to the electronic component, the pickup case has a frame provided therein so as to surround a mounting portion of the electronic component, and a part of the flexible printed board is folded and fitted between the frame and the plate, or between the pickup case and the plate.

Description

  The present invention relates to an optical pickup device and a method for manufacturing the same, and is suitable for application to an optical pickup in which, for example, a laser diode and a laser driver, or a photodetector and a signal processing circuit are connected via a flexible printed board. .

  Conventionally, an optical pickup is configured such that electronic components such as a laser diode and a photodetector and optical components such as a polarizing beam splitter and an objective lens are respectively attached to predetermined positions of the pickup case. In this case, among these electronic components and optical components, the laser diode and the photodetector are fixed from the outside of the pickup case to a predetermined position on the outer surface of the pickup case using an adhesive.

  By the way, as a conventional optical pickup, there is an optical pickup in which a laser diode and a laser driver, and a photodetector and a signal processing circuit are connected via a flexible printed circuit board, respectively. There has been a problem that the work of fixing the diode and the photodetector at a predetermined position of the pickup case against the elastic force of the flexible printed circuit board takes a considerable time, and the productivity of the optical pickup is lowered.

  The present invention has been made in consideration of the above points, and an object of the present invention is to propose an optical pickup device capable of improving productivity and a method for manufacturing the same.

  In order to solve such a problem, in the present invention, a predetermined optical component is mounted in an optical pickup device that optically records information on an optical disk and / or optically reproduces information recorded on the optical disk. A pickup case; an electronic component attached to an outer surface of the pickup case; a plate on which the electronic component is fixed; a flexible printed circuit board having one end physically and electrically connected to the electronic component; and the pickup A frame provided so as to surround the mounting position of the electronic component in the case, and a part of the flexible printed circuit board is woven to be between the frame and the plate, or between the pickup case and the plate I tried to fit it.

  According to the present invention, in the method of manufacturing an optical pickup device that optically records information on an optical disc and / or optically reproduces information recorded on the optical disc, the optical pickup device includes a predetermined optical component. A pickup case on which the electronic component is mounted, an electronic component attached to the outer surface of the pickup case, a plate to which the electronic component is fixed, and a flexible printed circuit board having one end physically and electrically connected to the electronic component And the pickup case has a frame body that is formed so as to surround the mounting position of the electronic component in the pickup case, and a part of the flexible printed circuit board between the frame body and the plate, or the A first step of fitting between the pickup case and the plate; and the plate It was provided and a second step of fixing said pickup case is positioned.

  According to the optical pickup device and the manufacturing method thereof according to the present invention, when an electronic component is attached to the pickup case, the electronic component can be temporarily fixed to the pickup case by the elastic force of the flexible printed board.

  According to the present invention, the work of manually holding the plate so as to be positioned at a predetermined position against the elastic force of the flexible printed circuit board can be omitted, so that the productivity of the optical pickup can be improved.

It is a perspective view which shows the structural example of the conventional optical pick-up. It is a perspective view which shows the structural example of the conventional optical pick-up. It is a perspective view with which it uses for description of the manufacturing procedure of the conventional optical pick-up. 1 is a perspective view showing a schematic configuration of an optical pickup according to a first embodiment. FIG. 5 is a cross-sectional view for explaining a structure for attaching a laser diode to a pickup case in the optical pickup shown in FIG. 4. It is sectional drawing with which it uses for description of the attachment structure of the photodetector with respect to the pick-up case in the optical pick-up shown in FIG. FIG. 5 is a cross-sectional view for explaining a mounting structure of a laser diode and a photodetector with respect to a pickup case in the optical pickup shown in FIG. 4. It is a perspective view which shows schematic structure of the optical pick-up by 2nd Embodiment. It is sectional drawing with which it uses for description of the attachment structure of the laser diode with respect to the pick-up case in the optical pick-up shown in FIG. It is sectional drawing with which it uses for description of the attachment structure of the photodetector with respect to the pick-up case in the optical pick-up shown in FIG. It is sectional drawing with which it uses for description of the attachment structure of the laser diode with respect to the pick-up case in the optical pick-up shown in FIG. 8, and a photodetector. It is a perspective view which shows schematic structure of the optical pick-up by 3rd Embodiment. It is sectional drawing with which it uses for description of the attachment structure of the photodetector with respect to the pick-up case in the optical pick-up shown in FIG. It is sectional drawing with which it uses for description of the attachment structure of the laser diode with respect to the pick-up case in the optical pick-up shown in FIG. 12, and a photodetector. It is a perspective view which shows the modification of the attachment structure of the laser diode with respect to the pick-up case in an optical pick-up, and a photodetector. FIG. 16 is a cross-sectional view for explaining a mounting structure of a laser diode and a photodetector with respect to a pickup case in the optical pickup shown in FIG. 15.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

(1) First Embodiment (1-1) Configuration of Conventional Optical Pickup Device

  First, a configuration example of a conventional optical pickup and a manufacturing process thereof will be described.

  FIG. 1 shows a configuration example of a conventional optical pickup 1. The optical pickup 1 includes electronic components such as a laser diode 2 and a photodetector 7, and optical components such as a polarizing beam splitter 3, a quarter wavelength plate 4, a rising mirror 5 and an objective lens 6. An electronic component and an optical component are each attached to a predetermined position of the pickup case 8.

  The laser diode 2 is a semiconductor laser that emits a laser beam having a predetermined wavelength such as 780 nm (CD), 650 nm (DVD), or 405 nm (BD), and is driven to blink by a laser driver (not shown) according to the recording data, for example, during recording operation. In the reproduction operation, the lighting is driven with a constant power.

  The laser light L1 emitted from the laser diode 2 is incident on the ¼ wavelength plate 4 via the polarization beam splitter 3, and the ¼ wavelength plate 4 converts the polarization state from linearly polarized light to circularly polarized light. The laser beam L1 is then incident on the objective lens 6 via the rising mirror 5, and is focused on the recording layer of the optical disk (not shown) by the objective lens 6. Thus, during the recording operation, data is recorded on the recording layer by the laser light L1 thus focused on the recording layer of the optical disc.

  The reflected light L2 of the laser light L1 on the recording layer of the optical disk is incident on the quarter-wave plate 4 through the objective lens 6 and the rising mirror 5, and the polarization state of the quarter-wave plate 4 is changed to a circular state. Conversion from polarized light to linearly polarized light. The reflected light L 2 is then condensed on the light receiving surface of the photodetector 7 via the polarization beam splitter 3. Thus, at this time, the light reception signal output from the photodetector 7 is transmitted to a signal processing circuit (not shown), and a tracking error signal and a focus error signal are generated in the signal processing circuit based on this light reception signal. Further, during the reproducing operation, the recording data of the optical disc is reproduced based on the received signal.

  Next, the mounting structure of the laser diode 2 and the photodetector 7 to the pickup case 8 in the conventional optical pickup 1 will be described.

  In such a conventional optical pickup 1, as shown in FIGS. 1 and 2, the laser diode 2 and the photodetector 7 are respectively provided at the center of rectangular sensor plates 10 and 11 provided separately from the pickup case 8. Fixed in position. The flexible printed circuit board 12 for connecting the laser diode 2 and the laser driver (not shown) and the flexible printed circuit board 13 for connecting the photodetector 7 and the signal processing circuit (not shown) are respectively provided in the pickup case 8. It arrange | positions so that a lower surface side may be passed.

  Further, the mounting portions of the laser diode 2 in the pickup case 8 are provided with base portions 8AA and 8AB corresponding to the respective ends in the longitudinal direction (arrow x direction) of the sensor plate 10, and these base portions 8AA and 8AB. An opening 14A for allowing the laser light L1 emitted from the laser diode 2 to pass therethrough is provided therebetween. The laser diode 2 is attached to the pickup case 8 so that both ends in the longitudinal direction of the sensor plate 10 are fixed to the corresponding base portions 8AA and 8AB of the pickup case 8 by the adhesive 15 respectively.

  Similarly, bases 8BA and 8BB are provided at locations where the photodetector 7 is attached in the pickup case 8 so as to correspond to the respective ends in the longitudinal direction of the sensor plate 11, and between the bases 8BA and 8BB. Is provided with an opening 14B for allowing the reflected light L2 incident on the photodetector 7 to pass therethrough. The photodetector 7 is attached to the pickup case 8 so that both ends in the longitudinal direction (arrow y direction) of the sensor plate 11 are fixed to the corresponding base portions 8BA and 8BB of the pickup case 8 with an adhesive 16, respectively. ing.

  In this case, the mounting operation of the laser diode 2 and the photodetector 7 to the pickup case 8 is performed according to the following procedure.

  First, as shown in FIG. 3, the flexible printed circuit boards 12 and 13 are placed on the outer surface of the pickup case 8 so that the sensor plates 10 and 11 are positioned at predetermined positions to be chucked by chuckers 20A and 20B of a positioning device (not shown). Bend almost vertically along. Then, the sensor plates 10 and 11 are chucked to the chuckers 20A and 20B of the positioning device while holding the flexible printed circuit boards 12 and 13 or the sensor plates 10 and 11 with tweezers so as to keep the state.

  Thereafter, highly accurate position adjustment with respect to the sensor plates 10 and 11 is performed by the positioning device. This is because electronic components such as the laser diode 2 and the photodetector 7 need to be adjusted with high accuracy. After the position adjustment is completed, the sensor plate 10 is fixed to the corresponding base portions 8AA and 8AB of the pickup case 8 by the adhesive 15 and the sensor plate 11 is fixed to the corresponding base portion of the pickup case 8 by the adhesive 16. Fix to 8BA and 8BB.

  As described above, in the conventional optical pickup 1, when attaching the laser diode 2 or the photodetector 7 to the pickup case 8, the operator places the flexible printed circuit boards 10 and 11 substantially vertically along the outer surface of the pickup case 8. Although it is necessary to keep the bent state, at this time, the flexible printed circuit boards 10 and 11 generate a restoring force to return to the original state that is not bent. For this reason, keeping the flexible printed circuit boards 12 and 13 bent so that the sensor plates 10 and 11 are positioned at predetermined positions chucked by the chuckers 20A and 20B of the positioning device requires appropriate labor and accuracy. This is a work, and it has been a cause of lowering the productivity of the optical pickup 1 accordingly.

  Therefore, the optical pickup according to the present embodiment facilitates the work of attaching the laser diode 2 and the photodetector 7 to the pickup case 8 and can improve the productivity of the optical pickup. . Details of the optical pickup according to the present embodiment will be described below.

(1-2) Configuration of Optical Pickup According to this Embodiment FIG. 4 showing the same reference numerals as those in FIGS. 1 to 3 shows the optical pickup 30 according to this embodiment. The optical pickup 30 is configured in the same manner as the optical pickup 1 described above with reference to the drawings except that the mounting structure of the sensor plates 32 and 33 to the pickup case 31 is different.

  In practice, in the case of the optical pickup 30, the pickup case 31 has a U-shaped first frame so as to integrally surround the two base portions 31AA and 31AB to which the sensor plate 32 to which the laser diode 2 is fixed is attached. 31C is fixed to the pickup case 31, and a part of the flexible printed circuit board 34 connected to the laser diode 2 is folded into a predetermined shape between the first frame 31C and the sensor plate 32 as shown in FIG. It is inserted.

  The pickup case 31 of the optical pickup 30 has a U-shaped second frame 31D that integrally surrounds the two base portions 31BA and 31BB to which the sensor plate 33 to which the photodetector 7 is fixed is attached. As shown in FIG. 6, a part of the flexible printed circuit board 35 fixed to the case 31 and connected to the photodetector 7 is folded and fitted between the second frame 31 </ b> D and the sensor plate 33. ing.

  As a result, in the present optical pickup 30, the sensor plate 32 can be pressed against the corresponding two base portions 31AA and 31AB of the pickup case 31 by the elastic force of the bent flexible printed circuit board 34, and is similarly bent. The sensor plate 33 can be pressed against the corresponding two base portions 31BA and 31BB of the pickup case 31 by the elastic force of the flexible printed circuit board 35.

  Further, as shown in FIG. 7, protrusions 31 </ b> AAX and 31 </ b> ABX are formed on the base portions 31 </ b> AA and 31 </ b> AB of the pickup case 31 in parallel with the vertical direction (arrow z direction), and the sensor plate 32 has In addition, rectangular protrusions 32A and 32B are formed in parallel with the vertical direction so as to be fitted between the protrusions 31AAX and 31ABX of the base parts 31AA and 31AB.

  Thus, in the pickup 30, the sensor plate 32 is positioned so that the protrusions 32A and 32B of the sensor plate 32 are fitted between the protrusions 31AAX and 31ABX of the base parts 31AA and 31AB of the pickup case 31, respectively. Thus, the sensor plate 32 can be temporarily fixed to the pickup case 31 in a state where the sensor plate 32 is roughly positioned by the elastic force of the flexible printed board 34.

  Similarly, protrusions 31BAX and 31BBX project from the base portions 31BA and 31BB of the pickup case 31 in parallel with the vertical direction (arrow z direction), respectively, and the base portions 31BA are provided on the sensor plate 33. , 31BB rectangular protrusions 33A, 33B are formed in parallel with the longitudinal direction so that they can be fitted between the protrusions 31BAX, 31BBX.

  Thus, in the pickup 30, the sensor plate 33 is positioned so that the protrusions 33A and 33B of the sensor plate 33 are fitted between the protrusions 31BAX and 31BBX of the base parts 31BA and 31BB of the pickup case 31, respectively. Thus, the sensor plate 33 can be temporarily fixed to the pickup case 31 in a state where the sensor plate 33 is roughly positioned by the elastic force of the flexible printed circuit board 35.

  In the optical pickup 30 having the above configuration, when the laser diode 2 is attached to the pickup case 31, first, the protrusions 32A and 32B of the sensor plate 32 are respectively connected to the corresponding base portions 31AA and 31AB of the pickup case 31, respectively. The sensor plate 32 is positioned so as to fit between the protrusions 31AAX and 31ABX. At this time, the sensor plate 32 is temporarily fixed to the pickup case 31 by the elastic force of the flexible printed circuit board 34 as described above.

  Thereafter, the sensor plate 32 is chucked on the chuck 20A of the positioning device, and the position adjustment device performs high-precision position adjustment with respect to the sensor plate 32. After the position adjustment is completed, the sensor plate 32 is fixed to the corresponding base portions 31AA and 31AB of the pickup case 31 with the adhesive 15 (FIG. 4).

  Similarly, in the optical pickup 30, when the photodetector 7 is attached to the pickup case 31, first, the protrusions 33 </ b> A and 33 </ b> B of the sensor plate 33 are respectively connected to the corresponding base portions 31 </ b> BA and 31 </ b> BB of the pickup case 31. The sensor plate 32 is positioned so as to be fitted between the protrusions 31BAX and 31BBX. At this time, the sensor plate 33 is temporarily fixed to the pickup case 31 by the elastic force of the flexible printed circuit board 35 as described above.

  Thereafter, the sensor plate 33 is chucked on the chuck 20B of the positioning device, and the position adjustment device performs high-precision position adjustment with respect to the sensor plate 33. After the position adjustment is completed, the sensor plate 33 is fixed to the corresponding base portions 31BA and 31BB of the pickup case 31 with the adhesive 16 (FIG. 4).

(1-3) Effects of this Embodiment As described above, according to the optical pickup 30 according to this embodiment, the sensor plates 32 and 33 to which the laser diode 2 and the photodetector 7 are attached are connected to the laser diode 2 or Since the flexible printed circuit boards 34 and 35 connected to the photodetector 7 can be temporarily fixed to the pickup case 31 by the elastic force, the chucks 20A and 20B of the positioning device chuck the sensor plates 32 and 33 at the positions. By adjusting the positioning device so as to go to (2), the work of keeping the flexible printed boards 34 and 35 bent manually can be omitted, and the productivity of the spectral pickup 30 can be improved.

(2) Second Embodiment (2-1) Configuration of Optical Pickup According to This Embodiment FIG. 8 in which the same reference numerals are assigned to the corresponding parts as in FIGS. 1 to 3 shows the second embodiment. The structure of the optical pick-up 40 is shown. In this optical pickup 40, a part of flexible printed circuit boards 44 and 45 connected to the laser diode 2 or the photodetector 7 are folded and fitted between a pickup case 41 and sensor plates 42 and 43. Except for this point, the configuration is the same as that of the optical pickup 30 according to the first embodiment.

  In practice, in the case of the optical pickup 40, for example, in the flexible printed circuit board 44 connected to the laser diode 2, a part of one end side to which the laser diode 2 is connected is bent into a U shape as shown in FIG. The bent part is fitted between the pickup case 41 and the sensor plate 42. Also, as shown in FIG. 10, the flexible printed circuit board 45 connected to the photodetector 7 is similarly bent in a U-shape at one end side to which the photodetector 7 is connected. The portion is fitted between the pickup case 41 and the sensor plate 43.

  Further, as shown in FIG. 11, the pickup case 41 includes two base portions 41AA and 41AB for fixing the sensor plate 42 to which the laser diode 2 is attached, and a sensor plate 43 to which the photodetector 7 is attached. Two base portions 41BA and 41BB for fixing are formed to protrude at predetermined positions on the outer surface.

  The pickup case 41 further includes a U-shaped first frame 41C integrally surrounding the two base portions 41AA and 41AB for fixing the sensor plate 42 to which the laser diode 2 is attached, and the photodetector 7. A U-shaped second frame body 41D that integrally surrounds the two base portions 41BA and 41BB for fixing the attached sensor plate 43 is fixed to the pickup case 41, respectively.

  As a result, in the optical pickup 40, the sensor plates 42 and 43 are placed inside the corresponding first or second frame 41C or 41D of the pickup case 41 by the elastic force of the bent flexible printed boards 44 and 45, respectively. It can be pressed against the side.

  The sensor plate 42 is provided with groove portions 42A and 42B in parallel with the longitudinal direction (arrow z direction) on both end sides in the longitudinal direction (arrow x direction), and the inner surface of the first frame 41C is applied to the sensor plate 42. Projection portions 41CA and 41CB are formed so as to protrude in parallel with the longitudinal direction so as to correspond to the groove portions 42A and 42B of the sensor plate 42, respectively.

  Similarly, the sensor plate 43 is provided with groove portions 43A and 43B in parallel with the longitudinal direction (arrow z direction) on both ends in the longitudinal direction (arrow y direction), and on the inner surface of the second frame body 41D. The protrusions 41DA and 41DB are formed so as to protrude in parallel with the longitudinal direction so as to correspond to the grooves 43A and 43B of the sensor plate 43, respectively.

  As a result, in this pickup 40, the sensor plate 42 is pushed against the inner surface of the first frame 41C so that the protrusions 41CA and 41CB of the first frame 41C are fitted into the grooves 42A and 42B of the sensor plate 42. By touching, the sensor plate 42 can be temporarily fixed in a state of being roughly positioned on the first frame 41C by the elastic force of the flexible printed circuit board 44. Similarly, the sensor plate 42 is secondly inserted into the grooves 43A and 43B of the sensor plate 43. The sensor plate 43 is pressed against the inner surface of the second frame body 41D so that the protrusions 41DA and 41DB of the frame body 41D are fitted, so that the sensor plate 43 is moved to the second side by the elastic force of the flexible printed circuit board 45. It can be temporarily fixed in a state of being roughly positioned on the frame body 41D.

  In the optical pickup 40 having the above configuration, when the laser diode 2 is attached to the pickup case 41, first, the protrusions of the first frame body 41C of the pickup case 41 are provided in the grooves 42A and 42B of the sensor plate 42, respectively. The sensor plate 42 is pressed against the first frame body 41C so as to fit 41CA and 41CB. At this time, the sensor plate 42 is temporarily fixed to the first frame body 41C by the elastic force of the flexible printed circuit board 44 as described above.

  Thereafter, the sensor plate 42 is chucked on the chuck 20A of the positioning device, and the position adjustment device performs high-precision position adjustment with respect to the sensor plate 42. After the position adjustment is completed, the sensor plate 42 is fixed to the corresponding base portions 41AA and 41AB of the pickup case 42 with the adhesive 15 (FIG. 8).

  Similarly, in the present optical pickup 40, when the photodetector 7 is attached to the pickup case 41, first, the protrusion 41DA of the second frame body 41D of the pickup case 41 is inserted into each groove 43A, 43B of the sensor plate 43. , 41DB, and the sensor plate 43 is pressed against the second frame body 41D so as to be fitted thereinto. At this time, the sensor plate 43 is temporarily fixed to the second frame body 41D by the elastic force of the flexible printed circuit board 45 as described above.

  Thereafter, the sensor plate 43 is chucked on the chuck 20B of the positioning device, and the position adjustment device performs high-precision position adjustment with respect to the sensor plate 43. After the position adjustment is completed, the sensor plate 43 is fixed to the corresponding base portions 41BA and 41BB of the pickup case 42 with the adhesive 16 (FIG. 8).

(2-2) Effects of this Embodiment As described above, according to the optical pickup 40 according to this embodiment, the sensor plates 42 and 43 to which the laser diode 2 and the photodetector 7 are attached are connected to the laser diode 2 or 43. Since the flexible printed circuit boards 44 and 45 connected to the photodetector 7 can be temporarily fixed to the first or second frame 41C or 41D of the pickup case 31 by the elastic force, the chuck 20A of the positioning device is located at that position. , 20B can adjust the positioning device so as to go to chuck the sensor plates 42, 43, so that the work of keeping the flexible printed boards 44, 45 in a bent state can be omitted. Productivity can be improved.

(3) Third Embodiment (3-1) Configuration of Optical Pickup According to this Embodiment FIG. 12 showing the same reference numerals in FIG. 12 corresponding to those in FIG. 1 to FIG. 3 is according to the third embodiment. The structure of the optical pick-up 50 is shown. The optical pickup 50 is configured in the same manner as the optical pickup 40 according to the second embodiment except that the shape of the protrusion 51DA of the frame 51D provided in the pickup case 41 and the shape of the recess 53A of the sensor plate 53 are different. Has been.

  In practice, in the case of the optical pickup 50, as shown in FIG. 13, the flexible printed circuit board 45 connected to the photodetector 7 is bent in a U-shape at one end side to which the photodetector 7 is connected. The bent part is fitted between the pickup case 41 and the sensor plate 53.

  As shown in FIG. 14, the pickup case 41 is formed with two base portions 41BA and 41BB for fixing the sensor plate 53 to which the photodetector 7 is attached, protruding at predetermined positions on the outer surface.

  Further, the pickup case 41 is fixed to the pickup case 41 with a U-shaped second frame 51D that integrally surrounds the two bases 41BA and 41BB for fixing the sensor plate 53 to which the photodetector 7 is attached. Has been.

  Accordingly, in the optical pickup 50, the sensor plate 53 can be pressed against the inner side surfaces of the corresponding second frames 41C and 51D of the pickup case 41 by the elastic force of the bent flexible printed circuit board 45. ing.

  In addition, a rectangular recess 53A is provided substantially at the center of the sensor plate 53 in parallel with the longitudinal direction (arrow y direction) of the sensor plate 53, and the sensor plate 53 is provided on the inner surface of the second frame 51D. Corresponding to the concave portion 53A of 53, a rectangular parallelepiped protruding portion 51DA of a size that can be fitted into the concave portion 53A is formed to protrude.

  Thus, in the present pickup 50, the sensor plate 53 is pressed against the inner surface of the second frame 51D so that the protrusion 51DA of the second frame 51D is fitted into the recess 53A of the sensor plate 53. The sensor plate 53 can be temporarily fixed in a state where the sensor plate 53 is roughly positioned on the second frame 51D by the elastic force of the printed circuit board 45.

  In the optical pickup 50 having the above configuration, when the photodetector 7 is attached to the pickup case 41, first, the protruding portion 51DA of the second frame 51D of the pickup case 41 is fitted into the concave portion 53A of the sensor plate 53. So that the sensor plate 53 is pressed against the second frame 51D. At this time, the sensor plate 53 is temporarily fixed to the second frame 51D by the elastic force of the flexible printed circuit board 45 as described above.

  Thereafter, the sensor plate 53 is chucked on the chuck 20B of the positioning device, and the position adjustment device performs high-precision position adjustment with respect to the sensor plate 53. After the position adjustment is completed, the sensor plate 53 is fixed to the corresponding base portions 41BA and 41BB of the pickup case 42 with the adhesive 16 (FIG. 8).

(3-2) Effects of this Embodiment As described above, according to the optical pickup 50 according to this embodiment, the flexible print in which the sensor plate 53 to which the photodetector 7 is attached is connected to the photodetector 7. Since the elastic force of the substrate 45 can temporarily fix the second frame 51D of the pickup case 41, the positioning device is adjusted so that the chuck 20B of the positioning device goes to chuck the sensor plate 53 at that position. As a result, it is possible to omit the work of keeping the flexible printed circuit board 45 in a bent state manually, and the productivity of the spectral pickup 50 can be improved.

(4) Other Embodiments In the first, second, and third embodiments described above, the electrons that are connected to the flexible printed boards 34, 35, 44, and 45 and attached to the optical pickups 30, 40, and 50 are shown. The components are the laser package and the photodetector of the optical pickup. However, the present invention is not limited to this, and any electronic component may be used as long as it is an electronic component connected via the flexible printed boards 34, 35, 44, and 45. .

  In the first, second, and third embodiments, the pickup cases 31, 41, and 51 are provided with sensor plates 32, 33, 42, 43, to which the laser diode 2 or the photodetector 7 is fixed, and U-shaped frame bodies 31C, 31D, 41C, 41D, and 51D are provided so as to integrally surround two base portions 31AA, 31AB, 31BA, 31BB, 41AA, 41AB, 41BA, and 41BB to which 53 is attached, and a laser diode 2 or a part of the flexible printed circuit boards 34, 35, 44, and 45 connected to the photodetector 7 is folded and fitted into a predetermined shape, but the present invention is not limited to this, and the pickup case 31, 41 and 51 pedestals 31AA, 31AB, 31BA, 31BB, 41AA, 41AB, 41BA and 41B Then, the sensor plates 32, 33, 42, 43 and 53 are hooked, and the laser diode 2 or a part of the flexible printed circuit board 34, 35, 44 and 45 connected to the photodetector 7 is folded into a predetermined shape and fitted. If it can be inserted, the sensor plates 32, 33, 42, 43 and 53 can be hooked in the shape of a key-like claw even if it is not a U-shaped frame, for example, a U-shaped frame. It doesn't matter.

  Further, in the first, second and third embodiments described above, the sensor plates 32, 33, 42, 43 and 53 in which the laser diode 2 or the photodetector 7 is fixed to the pickup cases 31, 41 and 51 are used. Are provided with U-shaped frames 31C, 31D, 41C, 41D and 51D so as to integrally surround the two base portions 31AA, 31AB, 31BA, 31BB, 41AA, 41AB, 41BA and 41BB. The case where a part of the flexible printed boards 34, 35, 44 and 45 connected to the photodetector 7 is folded and fitted into a predetermined shape has been described. However, the present invention is not limited to this, and the pickup case 31, Sensor plates 32, 33, 42, 43, and 5 are pedestals provided in separate parts fixed to 41 and 51. The hook, a portion of the flexible printed circuit board 34,35,44 and 45 connected to the laser diode 2 or photodetector 7 may if be fitted folded into a predetermined shape.

  Further, in the first embodiment described above, positions corresponding to the ridges 31AAX, 31ABX, 31BAX, and 31BBX formed in parallel to the vertical direction on the respective base portions 31AA, 31AB, 31BA, and 31BB of the pickup case 31. The case where the sensor plates 32 and 33 are roughly positioned by fitting the protrusions 32A, 32B, 33A and 33B of the sensor plate 32 formed by the elastic force of the flexible printed boards 34 and 35 has been described. The invention is not limited to this. For example, two U-shaped ridges are provided on the inner surface of each of the bases 31AA, 31AB, 31BA and 31BB of the pickup case 31, and both sides are formed by the U-shaped ridges. Alternatively, the sensor plate may be fitted. By doing in this way, it becomes unnecessary to provide a protrusion part and a groove part in the sensor plate side, and the labor which processes sensor plate 32 and 33 can be saved.

  Further, in the second embodiment described above, the protrusions formed in parallel with the vertical direction on the inner side surfaces of the U-shaped frames 41C and 41D surrounding the respective base portions 41AA, 41AB, 41BA and 41BB of the pickup case 41 integrally. The sensor plates 42 are formed by fitting the groove portions 42A, 42B, 43A and 43B of the sensor plates 42 and 43 formed at the corresponding positions into the strip portions 41CA, 41CB, 41DA and 41DB by the elastic force of the flexible printed boards 44 and 45. However, the present invention is not limited to this. For example, two U-shaped protrusions are integrally surrounded by the bases 41AA, 41AB, 41BA, and 41BB of the pickup case 41. It is provided on the inner surface of the U-shaped frames 41C and 41D, and the U-shaped protrusions Sensor plate may be fitted. By doing in this way, since a protrusion part and a groove part are not provided in the sensor plate side, the effort which processes the sensor plates 42 and 43 can be saved.

  Further, in the third embodiment described above, the sensor plate 42 is provided with grooves 42A and 42B in parallel with the longitudinal direction (arrow z direction) on both ends in the longitudinal direction (arrow x direction), and the first plate On the inner surface of the frame 41C, protrusions 41CA and 41CB are formed so as to protrude in parallel with the longitudinal direction corresponding to the grooves 42A and 42B of the sensor plate 42, respectively, while at the substantially central part of the sensor plate 53 Is provided with a rectangular recess 53A in parallel with the longitudinal direction (arrow y direction) of the sensor plate 53, and on the inner surface of the second frame 51D, the recess corresponding to the recess 53A of the sensor plate 53 is provided. Although a rectangular parallelepiped protruding portion 51DA of a size that can be fitted into 53A is formed to protrude, for example, as shown in FIGS. Two substantially circular recesses 62A and 62B are provided at both ends in the longitudinal direction (arrow x direction), and the inner surface of the first frame 61C corresponds to each recess 62A and 62B of the sensor plate 62, respectively. Thus, substantially cylindrical projecting portions 61CA and 61CB are formed to project in parallel to the inner side direction (arrow z direction) of the frame body 61C, and substantially circular recesses are formed on both ends of the sensor plate 63 in the longitudinal direction (arrow y direction). 63A and 63B are provided, and on the inner side surface of the second frame body 61D, a substantially cylindrical protrusion parallel to the inner side direction (arrow x direction) of the frame body 61D in correspondence with the recesses 63A and 63B of the sensor plate 63, respectively The portions 61DA and 61DB may be protruded.

  Further, in the above-described third embodiment, the protrusions 41CA and 41CB formed on the inner surface of the U-shaped frame 41C that integrally surrounds the bases 41AA, 41AB, 41BA, and 41BB of the pickup case 41, respectively. The groove portions 42A and 42B of the sensor plate 42 formed at the corresponding positions on the protruding portions 51DA and 51DB formed on the inner side surface of the frame 51D, and the concave portion 53A of the sensor plate 53 are elastic of the flexible printed boards 44 and 45, respectively. Although the case where the sensor plates 42 and 53 are roughly positioned by being fitted by force has been described, the present invention is not limited to this, and for example, each base portion 41AA of the pickup case 41 includes two U-shaped protrusions. , 41AB, 41BA, and 41BB integrally surrounding the U-shaped frame bodies 41C and 51D Only, may be the sensor plate from both sides are fitted through the U-shaped protrusions. By doing so, it is not necessary to provide a protrusion, protrusion, recess, groove, or the like on the sensor plate side, so that it is possible to save labor for processing the sensor plates 42 and 53.

  Further, in the first, second and third embodiments described above, the first and second frames 31C, 31D, 41C, 41D, 51D, 61C and 61D are separate parts from the pickup cases 31 and 41. Although the case where the pickup case 41 and the frame bodies 41C and 51D are fixed later has been described, the present invention is not limited thereto, and may be formed integrally with the pickup cases 31 and 41, for example.

  2 ... Laser diode, 7 ... Photodetector, 15, 16 ... Adhesive, 20 ... Chuck, 30, 40, 50 ... Optical pickup, 31, 41 ... Pickup case, 31AA, 31AB, 31BA, 31BB, 41AA, 41AB, 41BA, 41BB ... Stand, 31C, 31D, 41C, 41D, 51D, 61C, 61D ... Frame, 31AAX, 31ABX, 31BAX, 31BBX, 32A, 32B, 33A, 33B, 41CA, 41CB, 41DA, 41DB, 41CA, 41CB, 41CC, 41CD ... Projection, 51DA, 61DA, 61DB, 61CA, 61CB ... Projection, 32, 33, 42, 43, 53, 62, 63 ... Sensor plate , 34, 35, 44, 45 .. Flexible printed circuit board, 42A, 42B, 43A 43B ...... groove, 53A, 63A, 63B, 62A, 62B ...... recess.

Claims (12)

In an optical pickup device for optically recording information on an optical disc and / or optically reproducing information recorded on the optical disc,
A pickup case on which predetermined optical components are mounted;
Electronic components attached to the outer surface of the pickup case;
A plate on which the electronic component is fixed;
A flexible printed circuit board having one end physically and electrically connected to the electronic component;
A frame provided so as to surround the mounting part of the electronic component in the pickup case,
An optical pickup device, wherein a part of the flexible printed circuit board is woven and fitted between the frame and the plate or between the pickup case and the plate. The optical pickup device according to claim 1, wherein the electronic component is a laser diode. The optical pickup device according to claim 1, wherein the electronic component is a photodetector. A part of the flexible printed circuit board is fitted between the frame and the plate,
A positioning portion that is provided on the pickup case and / or the plate, and that defines an approximate position of the plate that is pressed against an attachment location of the pickup case by the elastic force of the flexible printed circuit board;
The positioning part is
A protrusion provided on the plate;
The optical pickup device according to claim 1, further comprising a groove portion that is provided in a predetermined position of the pickup case so as to correspond to the protruding portion of the plate. A part of the flexible printed board is fitted between the pickup case and the plate,
A positioning part that is provided on the frame and / or the plate and that defines an approximate position of the plate that is pressed against the frame by the elastic force of the flexible printed circuit board;
The positioning part is
A protrusion formed on the frame;
The optical pickup device according to claim 1, further comprising: a groove portion that is provided in a predetermined position on the plate so as to be able to fit in correspondence with the protruding portion of the frame. A part of the flexible printed board is fitted between the pickup case and the plate,
A positioning part that is provided on the frame and / or the plate and that defines an approximate position of the plate that is pressed against the frame by the elastic force of the flexible printed circuit board;
The positioning part is
A protrusion formed on the frame;
The optical pickup device according to claim 1, further comprising: a concave portion that is provided so as to be fitted to a predetermined position of the plate so as to correspond to the protruding portion of the frame. In a method of manufacturing an optical pickup device for optically recording information on an optical disc and / or optically reproducing information recorded on the optical disc,
The optical pickup device is:
A pickup case on which predetermined optical components are mounted;
Electronic components attached to the outer surface of the pickup case;
A plate on which the electronic component is fixed;
A flexible printed circuit board having one end portion physically and electrically connected to the electronic component;
The pickup case is
Having a frame formed so as to surround the mounting position of the electronic component in the pickup case;
A first step of fitting a part of the flexible printed circuit board between the frame and the plate or between the pickup case and the plate;
And a second step of positioning and fixing the plate to the pickup case. The method of manufacturing an optical pickup device according to claim 6, wherein the electronic component is a laser diode. The method of manufacturing an optical pickup device according to claim 6, wherein the electronic component is a photodetector. The optical pickup device is:
A protrusion provided on the pickup case and / or the plate and defining a rough position of the plate that is pressed against an attachment location of the pickup case by the elastic force of the flexible printed circuit board and the plate A positioning portion having a groove portion that can be fitted in a predetermined position of the pickup case so as to correspond to the protrusion portion of
In the second step,
The method of manufacturing an optical pickup device according to claim 6, wherein a part of the flexible printed board is fitted between the frame body and the plate in a state where the plate is roughly positioned by the positioning unit. The optical pickup device is:
Protrusions provided on the frame body and / or the plate, and defining a rough position of the plate pressed against the frame body by the elastic force of the flexible printed circuit board and the frame body A positioning portion having a groove portion that can be fitted to a predetermined position of the plate in correspondence with the protruding portion,
In the second step,
The method for manufacturing an optical pickup device according to claim 6, wherein a part of the flexible printed board is fitted between the pickup case and the plate in a state where the plate is roughly positioned by the positioning unit. The optical pickup device is:
Protrusions provided on the frame body and / or the plate and defining a rough position of the plate pressed against the frame body by the elastic force of the flexible printed circuit board and the frame body A positioning portion having a concave portion provided so as to be fitted to a predetermined position of the plate in correspondence with the protruding portion,
In the second step,
The method for manufacturing an optical pickup device according to claim 6, wherein a part of the flexible printed board is fitted between the pickup case and the plate in a state where the plate is roughly positioned by the positioning unit.

Images