JP2012106341A5 - - Google Patents

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Publication number
JP2012106341A5
JP2012106341A5 JP2012055615A JP2012055615A JP2012106341A5 JP 2012106341 A5 JP2012106341 A5 JP 2012106341A5 JP 2012055615 A JP2012055615 A JP 2012055615A JP 2012055615 A JP2012055615 A JP 2012055615A JP 2012106341 A5 JP2012106341 A5 JP 2012106341A5
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JP
Japan
Prior art keywords
fluororesin
group
cmp apparatus
thermoplastic resin
adhesive
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JP2012055615A
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Japanese (ja)
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JP5472344B2 (en
JP2012106341A (en
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Priority to JP2012055615A priority Critical patent/JP5472344B2/en
Priority claimed from JP2012055615A external-priority patent/JP5472344B2/en
Publication of JP2012106341A publication Critical patent/JP2012106341A/en
Publication of JP2012106341A5 publication Critical patent/JP2012106341A5/ja
Application granted granted Critical
Publication of JP5472344B2 publication Critical patent/JP5472344B2/en
Expired - Fee Related legal-status Critical Current
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Claims (7)

被研磨部材を研磨パッド上に保持するヘッド部表面及びアーム部表面、スラリー供給管表面、並びに、装置本体内壁よりなる群から選択される少なくとも１つの被覆対象をフッ素樹脂により被覆したＣＭＰ装置であって、
フッ素樹脂による被覆は、該フッ素樹脂層と、フッ素樹脂以外の熱可塑性樹脂からなる熱可塑性樹脂層と、粘着剤層とがこの順に積層されてなる積層体を該粘着剤層により被覆対象に貼着させて行うものであり、
前記フッ素樹脂は、接着性フッ素樹脂である
ことを特徴とするＣＭＰ装置。 A CMP apparatus in which at least one coating target selected from the group consisting of a head surface and an arm section surface holding a member to be polished on a polishing pad, a slurry supply pipe surface, and an inner wall of the apparatus main body is coated with a fluororesin. And
The coating with the fluororesin is performed by attaching a laminate in which the fluororesin layer, a thermoplastic resin layer made of a thermoplastic resin other than the fluororesin, and an adhesive layer are laminated in this order to the object to be coated. It is done by wearing,
The CMP apparatus , wherein the fluororesin is an adhesive fluororesin . 装置本体内壁をフッ素樹脂により被覆したＣＭＰ装置であって、A CMP apparatus in which the inner wall of the apparatus body is coated with a fluororesin,
フッ素樹脂による被覆は、該フッ素樹脂層と、フッ素樹脂以外の熱可塑性樹脂からなる熱可塑性樹脂層と、粘着剤層とがこの順に積層されてなる積層体を該粘着剤層により装置本体内壁に貼着させて行うものであり、The coating with the fluororesin is performed by applying a laminate in which the fluororesin layer, a thermoplastic resin layer made of a thermoplastic resin other than the fluororesin, and an adhesive layer are laminated in this order to the inner wall of the apparatus main body by the adhesive layer. It is done by sticking,
前記フッ素樹脂は、接着性フッ素樹脂であるThe fluororesin is an adhesive fluororesin
ことを特徴とするＣＭＰ装置。A CMP apparatus characterized by that. 接着性フッ素樹脂を構成する接着性含フッ素重合体は、カルボニル基、カルボニル基を含む基、エポキシ基、水酸基、アミノ基、シリル基、炭素−炭素二重結合、スルホン酸基、エーテル結合及びシアノ基よりなる群から選択される少なくとも１種の結合基を有する請求項１又は２記載のＣＭＰ装置。 The adhesive fluorine-containing polymer constituting the adhesive fluororesin includes carbonyl group, group containing carbonyl group, epoxy group, hydroxyl group, amino group, silyl group, carbon-carbon double bond, sulfonic acid group, ether bond and cyano. The CMP apparatus according to claim 1 , wherein the CMP apparatus has at least one linking group selected from the group consisting of groups. 熱可塑性樹脂は、ポリアミド系樹脂である請求項１、２又は３記載のＣＭＰ装置。 Thermoplastic resins, CMP apparatus according to claim 1, 2 or 3 wherein the polyamide resin. 熱可塑性樹脂は、エチレン／ビニルアルコール樹脂である請求項１、２又は３記載のＣＭＰ装置。 4. The CMP apparatus according to claim 1, wherein the thermoplastic resin is an ethylene / vinyl alcohol resin. 熱可塑性樹脂は、エポキシ変性ポリエチレン樹脂である請求項１、２又は３記載のＣＭＰ装置。 The CMP apparatus according to claim 1, 2 or 3 , wherein the thermoplastic resin is an epoxy-modified polyethylene resin. フッ素樹脂層は、厚みが１〜２０μｍである請求項１、２、３、４、５又は６記載のＣＭＰ装置。 Off fluororesin layer, CMP apparatus according to claim 2, 3, 4, 5 or 6, wherein a thickness of 1 to 20 [mu] m.
JP2012055615A 2012-03-13 2012-03-13 CMP equipment Expired - Fee Related JP5472344B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012055615A JP5472344B2 (en) 2012-03-13 2012-03-13 CMP equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012055615A JP5472344B2 (en) 2012-03-13 2012-03-13 CMP equipment

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006070032A Division JP2007245266A (en) 2006-03-14 2006-03-14 Cmp device

Publications (3)

Publication Number Publication Date
JP2012106341A JP2012106341A (en) 2012-06-07
JP2012106341A5 true JP2012106341A5 (en) 2012-11-22
JP5472344B2 JP5472344B2 (en) 2014-04-16

Family

ID=46492538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012055615A Expired - Fee Related JP5472344B2 (en) 2012-03-13 2012-03-13 CMP equipment

Country Status (1)

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JP (1) JP5472344B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7224128B2 (en) * 2018-08-09 2023-02-17 株式会社荏原製作所 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and substrate cleaning tool manufacturing method
WO2022071526A1 (en) * 2020-09-30 2022-04-07 ダイキン工業株式会社 Fluororesin, multilayer product, and tube

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3286682B2 (en) * 1992-10-15 2002-05-27 東ソー株式会社 Polyphenylene sulfide resin composition and molded article for light reflection
JP2003133270A (en) * 2001-10-26 2003-05-09 Jsr Corp Window material for chemical mechanical polishing and polishing pad
JP2003179021A (en) * 2001-12-11 2003-06-27 Sony Corp Chemical/mechanical polisher
JP2005288286A (en) * 2004-03-31 2005-10-20 Nippon Paper Industries Co Ltd Manufacturing method of hard coat film and hard coat film

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