JP2012104403A - Mems switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a MEMS switch which can minimize occurrence of stiction in conduction state and can transmit a signal stably in conduction state.SOLUTION: A first fixed terminal 16a and a second fixed terminal 16b of a MEMS switch are deformed into a shape where each edge approaches most to a movable terminal 15 and the part excepting the edge separates gradually from the movable terminal 15 when they are pressed toward the movable terminal 15 by an independent element, i.e. a deformation guide 25a. The movable terminal 15 is configured to come into line contact with the edge of the first fixed terminal 16a and the edge of the second fixed terminal 17a in the conduction state.

Description

  The present invention relates to a MEMS (Micro Electro Mechanical Systems) switch, and more particularly to a direct contact type MEMS switch.

  1A and 1B partially show a conventional structure of a MEMS switch (see Patent Documents 1 and 2). Reference numeral 1 in the drawing denotes a lever main layer constituting a flexible lever FL. Reference numeral 2 denotes an insulating layer covering the upper surface of the lever main layer 1, 3 denotes a movable terminal formed on the upper surface of the insulating layer 2, 4 denotes a first signal layer, and 4 a denotes a first fixed layer composed of an end of the first signal layer 4. Terminal 5, 5 is the second signal layer, 5a is the second fixed terminal comprising the end of the second signal layer 5, GA1 is the gap between the first fixed terminal 4a and the second fixed terminal 5a, and CL1 is the first fixed terminal. This is the clearance between the terminal 4 a and the second fixed terminal 5 a and the movable terminal 3.

  In this MEMS switch, in order to make the first signal layer 4 and the second signal layer 5 in the non-conductive state conductive, a voltage is applied to a drive actuator (not shown) as shown in FIG. Thus, the flexible lever FL is bent upward to bring the upper surface of the movable terminal 3 into surface contact with the lower surfaces of the first fixed terminal 4a and the second fixed terminal 5a. On the other hand, in order to return the first signal layer 4 and the second signal layer 5 in the conductive state to the non-conductive state shown in FIG. 1B, voltage application to the drive actuator (not shown) is stopped. The flexible lever FL is restored and the upper surface of the movable terminal 3 is separated from the lower surfaces of the first signal layer 4 and the second signal layer 5.

  In the MEMS switch shown in FIGS. 1A and 1B, the upper surface of the movable terminal 3 is brought into surface contact with the lower surfaces of the first signal layer 4 and the second signal layer 5, so that the first signal layer 4 and the first signal layer 4. Since the two signal layers 5 are in a conductive state, the phenomenon that the movable terminal 3 sticks to the first fixed terminal 4a and the second fixed terminal 5a in the conductive state due to van der Waals force, meniscus force, etc., so-called, May cause stiction. When stiction occurs, even if the voltage application to the drive actuator is stopped, the surface contact between the upper surface of the movable terminal 3 and the lower surfaces of the first fixed terminal 4a and the second fixed terminal 5a is released. It becomes difficult to return the first signal layer 4 and the second signal layer 5 in the conductive state to the non-conductive state shown in FIG.

FIGS. 2A and 2B partially show another conventional structure of the MEMS switch (see Patent Document 3). The MEMS switch shown in FIGS. 1A and 1B Is different from
The plurality of hemispherical protrusions 4a1 and 5a1 are formed on the lower surfaces of the first fixed terminal 4a and the second fixed terminal 5a so as to face the upper surface of the movable terminal 3 via the clearance CL1.

  In this MEMS switch, in order to bring the first signal layer 4 and the second signal layer 5 in the non-conductive state into a conductive state, a voltage is applied to a drive actuator (not shown) as shown in FIG. Thus, the flexible lever FL is bent upward, and the upper surface of the movable terminal 3 is brought into multipoint contact with the lower ends of the plurality of hemispherical protrusions 4a1 and 5a1 of the first fixed terminal 4a and the second fixed terminal 5a. On the other hand, in order to return the first signal layer 4 and the second signal layer 5 in the conductive state to the non-conductive state shown in FIG. 2B, voltage application to the drive actuator (not shown) is stopped. The flexible lever FL is restored and the upper surface of the movable terminal 3 is separated from the lower ends of the plurality of hemispherical protrusions 4a1 and 5a1 of the first fixed terminal 4a and the second fixed terminal 5a.

  In the MEMS switch shown in FIGS. 2A and 2B, the upper surface of the movable terminal 3 is in multipoint contact with the lower ends of the plurality of hemispherical protrusions 4a1 and 5a1 of the first fixed terminal 4a and the second fixed terminal 5a. By doing so, the first signal layer 4 and the second signal layer 5 are brought into a conducting state, so that the movable terminal 3 in the conducting state is compared with the MEMS switch shown in FIGS. 1 (A) and 1 (B). And the first fixed terminal 4a and the second fixed terminal 5a can be reduced, and the occurrence of the stiction can be suppressed by reducing the contact area.

  By the way, in order to realize the multipoint contact in the MEMS switch shown in FIGS. 2A and 2B, at least the heights of the plurality of hemispherical protrusions 4a1 on the first fixed terminal 4a side should be the same. In addition, the heights of the plurality of hemispherical protrusions 5a1 on the second fixed terminal 5a side need to be the same. However, since the heights of the hemispherical protrusions 4a1 and 5a1 are on the order of μm or nm, and the hemispherical protrusions 4a1 and 5a1 are formed using a known thin film forming method, in practice, To avoid variations in the heights of the plurality of hemispherical protrusions 4a1 on the first fixed terminal 4a side and to avoid variations in the heights of the plurality of hemispherical protrusions 5a1 on the second fixed terminal 5a side. difficult.

  This variation in height causes a variation in the number of contact points of the multipoint contact. As a result, the contact area between the movable terminal 3 and the first fixed terminal 4a and the second fixed terminal 5a in the conductive state varies. And transmission loss may vary due to variations in the contact area. That is, in the MEMS switch shown in FIGS. 2A and 2B, although the occurrence of the stiction can be suppressed, it is difficult to perform stable signal transmission in the conductive state due to the variation in the contact area. .

JP 2008-053077 A JP 2009-252598 A JP 2007-012558 A

  The objective of this invention is providing the MEMS switch which can suppress generation | occurrence | production of the stiction in a conduction | electrical_connection state, and can perform the stable signal transmission in a conduction | electrical_connection state.

  To achieve the above object, the present invention provides a flexible lever, a movable terminal provided on the flexible lever, a first signal layer, and a first fixed terminal including an end portion of the first signal layer, A second signal layer; a second fixed terminal comprising an end of the second signal layer; and bending the flexible lever in a predetermined direction to convert the movable terminal into the first fixed terminal and the second fixed terminal. A MEMS switch comprising a drive actuator for bringing the first signal layer and the second signal layer into a conductive state by contacting with each other, wherein the first fixed terminal and the second fixed terminal are the first fixed terminal By pressing toward the movable terminal by a deformation guide which is a separate element from the terminal and the second fixed terminal, each end edge is closest to the movable terminal, and a portion excluding the end edge is movable. It has been deformed gradually away from the terminal, The movable terminal in the serial conduction state is configured to line contact with the edge and the end edge of the second fixed terminal of the first stationary terminal, it and its characterized.

  According to the present invention, the first fixed terminal and the second fixed terminal are pressed toward the movable terminal by a deformation guide that is a separate element, so that each end edge is closest to the movable terminal, and Since the portion excluding the edge is gradually deformed from the movable terminal, the movable terminal has a predetermined linear contact area at the edges of the first fixed terminal and the second fixed terminal in the conductive state. Line contact can be ensured.

  That is, compared to the surface contact type MEMS switch shown in FIGS. 1A and 1B, the contact area between the movable terminal, the first fixed terminal, and the second fixed terminal in the conductive state can be reduced. By reducing the contact area, it is possible to reliably suppress the occurrence of stiction (a phenomenon in which the movable terminal sticks to both fixed terminals in the conductive state). In addition, as compared with the multipoint contact type MEMS switch shown in FIGS. 2A and 2B, the contact area between the movable terminal, the first fixed terminal, and the second fixed terminal varies in the conductive state. Therefore, it is possible to avoid a variation in transmission loss due to the variation suppression, and to perform stable signal transmission in a conductive state.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the stiction in a conduction | electrical_connection state can be suppressed, and the MEMS switch which can perform the stable signal transmission in a conduction | electrical_connection state can be provided.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

1A is a top view partially showing a conventional structure of a MEMS switch; FIG. 1B is a cross-sectional view taken along line S1 of FIG. 1A; FIG. It is sectional drawing which shows the state which the layer and the 2nd signal layer conducted. 2A is a top view partially showing another conventional structure of the MEMS switch; FIG. 2B is a cross-sectional view taken along the line S2 in FIG. 2A; FIG. It is sectional drawing which shows the state which 1 signal layer and 2nd signal layer were conduct | electrically_connected. FIG. 3 is a top view of the MEMS switch (first embodiment) according to the present invention. 4 is a cross-sectional view taken along line S11 in FIG. FIG. 5 is an enlarged view of a main part of FIG. FIG. 6 is a cross-sectional view taken along line S12 in FIG. FIG. 7 is an enlarged view of a main part of FIG. FIG. 8 is a sectional view taken along line S13 in FIG. FIG. 9 is a sectional view taken along line S14 in FIG. FIG. 10 is a cross-sectional view taken along line S15 in FIG. 11 is a top view of the switch unit shown in FIG. 3 before assembly. 12 is a bottom view before the cover unit shown in FIG. 3 is assembled. 13 is a cross-sectional view of the switch unit and the cover unit for explaining a procedure for assembling the MEMS switch shown in FIG. 3 using the switch unit shown in FIG. 11 and the cover unit shown in FIG. FIG. 14 is a cross-sectional view corresponding to FIG. 5 for explaining the operation when the non-conducting first signal layer and the second signal layer are made conductive in the MEMS switch shown in FIG. FIG. 15 is a top view of the movable terminal for explaining a contact area of the first fixed terminal and the second fixed terminal with respect to the movable terminal when the first signal layer and the second signal layer are in a conductive state. FIG. 16 is a cross-sectional view corresponding to FIG. 5 for explaining the MEMS switch (second embodiment) according to the present invention. FIGS. 17A and 17B are cross-sectional views corresponding to FIG. 5 for explaining a modification of the cover unit shown in FIG. FIG. 18 is a cross-sectional view corresponding to FIG. 5 for explaining the MEMS switch (third embodiment) according to the present invention. FIG. 19 is a cross-sectional view corresponding to FIG. 5 for explaining the MEMS switch (fourth embodiment) according to the present invention. FIG. 20 is a cross-sectional view corresponding to FIG. 5 for explaining the MEMS switch (fifth embodiment) according to the present invention. FIG. 21 is a cross-sectional view corresponding to FIG. 7 for explaining the MEMS switch (sixth embodiment) according to the present invention. FIG. 22A is a top view corresponding to FIG. 11 for explaining the MEMS switch according to the present invention (seventh embodiment); FIG. 22B is a diagram showing that the first signal layer and the second signal layer are in a conductive state. It is a top view of the movable terminal for demonstrating the contact area of the 1st fixed terminal with respect to a movable terminal when it exists in, and a 2nd fixed terminal. FIG. 23A is a top view corresponding to FIG. 11 for explaining the MEMS switch (eighth embodiment) according to the present invention; FIG. 23B is a diagram showing that the first signal layer and the second signal layer are in a conductive state. It is a top view of the movable terminal for demonstrating the contact area of the 1st fixed terminal with respect to a movable terminal when it exists in, and a 2nd fixed terminal.

  Hereinafter, various embodiments will be described with reference to FIGS. 3 to 23 as appropriate. In this description, the top, bottom, left, right, front, and back of FIG. 3 are respectively front, back, left, and right. The directions corresponding to these in the other figures are also referred to.

[First Embodiment]
A MEMS switch (first embodiment) according to the present invention will be described with reference to FIGS.

<Structure>
The MEMS switch shown in FIGS. 3 to 10 is assembled by combining the switch unit 10A shown in FIGS. 11 and 13 and the cover unit 10B shown in FIGS.

The switch unit 10A before assembly shown in FIGS. 11 and 13 can be seen from FIGS.
The first base layer 11 having a rectangular outline
A first insulating layer 12 having a rectangular outline formed on the upper surface of the first base layer 11
A second base layer 13 having a rectangular outline formed on the upper surface of the first insulating layer 12
A rectangular insulating second insulating layer 14 formed on the upper surface of the second base layer 13
A left and right flexible lever FL composed of a part of the second base layer 13 and a part of the second insulating layer 14
The movable terminal 15 formed on the upper surface of the displacement portion FLc (see FIG. 8) of the flexible lever FL
A first signal layer 16 and a second signal layer 17 formed symmetrically on the upper surface of the second insulating layer 14
Two symmetrical piezoelectric actuators PA (lower electrode layer 18, piezoelectric layer 19 and upper electrode layer 20) formed on the upper surface of two flexible portions FLb (see FIG. 8) of the flexible lever FL
Two pairs of first control terminal 21 and second control terminal 22 for applying a voltage to each piezoelectric actuator PA
Four pads for bonding PD (support pad 23 and connection pad 24)
It has.

  The first base layer 11 is made of a semiconductor material such as single crystal silicon or single crystal silicon carbide, or an insulating material such as quartz glass or sapphire. The first base layer 11 has a through hole 11a having a rectangular outline. Is formed. The first insulating layer 12 is made of an insulating material such as silicon oxide or silicon nitride. The first insulating layer 12 has a through hole 12a having the same contour that is continuous with the through hole 11a of the first base layer 11. Yes. The second base layer 13 is made of a semiconductor material such as single crystal silicon or single crystal silicon carbide, or an insulating material such as silicon oxide or silicon nitride, and the second base layer 13 includes an upper side of the through holes 11a and 12a. In FIG. 2, two substantially linear through holes 13a extending in the left-right direction are formed symmetrically. The second insulating layer 14 is made of an insulating material such as silicon oxide or silicon nitride, and the second insulating layer 14 is formed with two through holes 14a having the same contour that are continuous with the through holes 13a of the second base layer 13. Has been. The second insulating layer 14 can be omitted only when the second base layer 13 is made of an insulating material.

  The flexible lever FL is configured by a part of the first base layer 13 sandwiched between the two through holes 13a and a part of the second insulating layer 14 sandwiched between the two through holes 14a. In other words, at the substantially longitudinal center of the first base layer 13 and the second insulating layer 14, it extends in the left-right direction by a part of the first base layer 13 and a part of the second insulating layer 14, and A substantially strip-shaped flexible lever FL supported at both ends is formed, a part of the first base layer 13 is used as the lever main layer 13b, and a part of the second insulating layer 14 is the lever main layer 13b. It is used as an insulating layer 14b that covers the upper surface.

  Further, the lever main layer 13b and the insulating layer 14b constituting the flexible lever FL exist between the two pairs of linear through holes 13c and 14c extending in the front-rear direction and the two pairs of through holes 13c and 14c. A narrow portion (no symbol) is formed symmetrically. In this flexible lever FL, the two regions in which the through holes 13c and 14c and the narrow portion are formed function as hinge portions FLa, and the rectangular region on the left side and the rectangular region on the right side of each hinge portion FLa are flexible. The central rectangular region sandwiched between the two hinge portions FLa functions as the displacement portion FLc.

  The movable terminal 15 is made of a conductive material such as gold, gold-nickel alloy, or gold-ruthenium alloy, and has a rectangular shape smaller than the displacement portion FLc on the upper surface (the upper surface of the insulating layer 14b) of the displacement portion FLc of the flexible lever FL. It is formed with a contour. The movable terminal 15 may have a single-layer structure, but in order to improve adhesion to the upper surface of the insulating layer 14b, an adhesive layer (titanium layer, titanium nitride layer, titanium-tungsten alloy layer, It is preferable to form a two-layer structure in which a terminal layer is formed on the upper surface of the adhesion layer after forming a titanium oxide layer or a tantalum nitride layer, or a multilayer structure having three or more layers having an equivalent layer structure.

  The first signal layer 16 and the second signal layer 17 are made of a conductive material such as gold or copper, and a first portion (no reference) fixed to the upper surface of the second insulating layer 14 and an end of the first portion. It has a second portion (no symbol) extending upward from the edge, and a third portion (no symbol) extending substantially parallel to the upper surface of the movable terminal 15 from the edge of the second portion. The third portion corresponding to the end portion of the first signal layer 16 corresponds to the first fixed terminal 16a, and the third portion corresponding to the end portion of the second signal layer 17 corresponds to the second fixed terminal 17a. The first signal layer 16 and the second signal layer 17 may have a single-layer structure, but as shown in FIG. 5 in order to improve the adhesion to the upper surface of the insulating layer 14b and to ensure the thickness of the signal layer itself. After the adhesion layers 16-1 and 17-1 (titanium layer, titanium nitride layer, titanium-tungsten alloy layer, titanium oxide layer, tantalum nitride layer, etc.) are formed on the upper surface of the insulating layer 14b, the adhesion layer 16-1 Three-layer structure in which the first signal layers 16-2 and 17-2 are formed on the upper surfaces of the first signal layers 16-1 and 17-1 and the second signal layers 16-3 and 17-3 are formed on the upper surfaces thereof, or an equivalent layer structure It is preferable to have a multilayer structure of four or more layers having

  The lower electrode layer 18 constituting each piezoelectric actuator PA is made of a conductive material such as platinum, ruthenium, or tungsten, and the second insulating layer is formed from the upper surface of each flexible portion FLb (the upper surface of the insulating layer 14b) of the flexible lever FL. 14 is formed with a rectangular outline having a left-right dimension (length) larger than that of the flexible part FLb. Each lower electrode layer 18 may have a single layer concept, but in order to improve adhesion to the upper surface of the insulating layer 14b, an adhesive layer (titanium layer, titanium nitride layer, titanium-tungsten alloy) is formed on the upper surface of the insulating layer 14b. A two-layer structure in which an electrode layer is formed on the upper surface of the adhesion layer after forming a layer, a titanium oxide layer, a tantalum nitride layer, or the like, or a multilayer structure of three or more layers having an equivalent layer structure is preferable. . In addition, a rectangular projecting portion 18 a for forming the second control terminal 22 is provided at the end of each lower electrode layer 18 so as to reach the upper surface of the second insulating layer 14.

  The piezoelectric layer 19 constituting each piezoelectric actuator PA is made of a piezoelectric material such as lead zirconate titanate, lithium niobate, lithium tantalate, or aluminum nitride, and the lower electrode layer is formed on the upper surface of each lower electrode layer 18. A rectangular outline smaller than 18 is formed.

  The upper electrode layer 20 constituting each piezoelectric actuator PA is made of a conductive material such as platinum, ruthenium, gold, ruthenium oxide or iridium oxide, and has a rectangular outline smaller than the piezoelectric layer 19 on the upper surface of each piezoelectric layer 19. It is formed with. Each upper electrode layer 20 may have a single-layer structure, but in order to improve adhesion to the upper surface of the piezoelectric layer 19, an adhesive layer (titanium layer, titanium nitride layer, titanium-tungsten) is formed on the upper surface of the piezoelectric layer 19. An alloy layer, a titanium oxide layer, a tantalum nitride layer, etc.) and then an electrode layer is formed on the upper surface of the adhesion layer, or a multilayer structure of three or more layers having an equivalent layer configuration. preferable.

  3 to 10, each piezoelectric actuator PA has a three-layer structure, but between the lower electrode layer 18 and the piezoelectric layer 19 and between the piezoelectric layer 19 and the upper electrode layer 20. A layer structure in which a conductive material such as lanthanum nickel oxide, ruthenium oxide, iridium oxide, or strontium oxide is interposed in at least one of them may be employed.

  The first control terminal 21 is made of a conductive material such as gold or copper, and is formed on the upper surface of the end portion of each upper electrode layer 20 with a rectangular outline smaller than that of the upper electrode layer 20. The first control terminal 21 may have a single-layer structure, but in order to improve adhesion to the upper surface of the upper electrode layer 20, an adhesive layer (titanium layer, titanium nitride layer, titanium- (Tungsten alloy layer, titanium oxide layer, tantalum nitride layer, etc.) and then a two-layer structure in which a terminal layer is formed on the upper surface of the adhesion layer, or a multilayer structure of three or more layers having an equivalent layer configuration Is preferred.

  The second control terminal 22 is made of a conductive material such as gold or copper, and is formed on the upper surface of the protruding portion 18a of each lower electrode layer 18 with a rectangular outline smaller than the protruding portion 18a. The second control terminal 22 may have a single-layer structure, but in order to improve adhesion to the upper surface of the overhanging portion 18a, an adhesion layer (titanium layer, titanium nitride layer, titanium- (Tungsten alloy layer, titanium oxide layer, tantalum nitride layer, etc.) and then a two-layer structure in which a terminal layer is formed on the upper surface of the adhesion layer, or a multilayer structure of three or more layers having an equivalent layer configuration Is preferred.

  A total of four support pads 23 constituting each pad PD are made of a metal material such as gold, copper, or nickel, and are formed on the upper surface of the second insulating layer 14 corresponding to the left and right sides of the first signal layer 16 and the second signal layer 17. The first signal layer 16 and the second signal layer 17 have the same thickness and are formed with a rectangular outline or a circular outline. Each support pad 23 may have a single-layer structure. However, in order to improve the adhesion to the upper surface of the insulating layer 14b and to secure the thickness of the support pad itself, as shown in FIG. After the adhesion layer 23-1 (titanium layer, titanium nitride layer, titanium-tungsten alloy layer, titanium oxide layer, tantalum nitride layer, etc.) is formed, the first pad layer 23-2 is formed on the upper surface of the adhesion layer 23-1. It is preferable to form a three-layer structure in which the second pad layer 23-3 is formed on the upper surface or a multilayer structure of four or more layers having an equivalent layer structure.

  A total of four connection pads 24 constituting each pad PD are made of a metal material such as gold or copper, and are preferably formed on the upper surface of each support pad 23 with a smaller contour than the support pad 23. Each connection pad 24 may have a single-layer structure, but as shown in FIG. 7, in order to improve adhesion to the upper surface of the support pad 23, the adhesion layer 24-1 (titanium layer) is formed on the upper surface of the support pad 23. , A titanium nitride layer, a titanium-tungsten alloy layer, a titanium oxide layer, a tantalum nitride layer, etc.), and then a barrier layer 24-2 (a nickel layer, a titanium nitride layer, etc.) is formed on the upper surface of the adhesion layer 24-1. And it is preferable to set it as the 3 layer structure which formed the pad layer 24-3 on the upper surface, or the multilayered structure of 4 layers or more which has an equivalent layer structure.

On the other hand, the cover unit 10B before assembly shown in FIGS. 12 and 13 can be seen from FIGS.
-Cover layer 25 with a rectangular outline
Deformation guide 25a integrally formed on the lower surface of the cover layer 25
・ Four connection pads 26 for bonding
A bonding material 27 attached to each connection pad 26
It has.

  The cover layer 25 is made of an insulating material such as quartz glass, soda glass, borosilicate glass, benzocyclobutene, polyimide, or liquid crystal polymer, and the deformation guide 25a is formed by processing the lower surface of the cover layer 25 by photolithography or the like. The cover layer 25 is integrally formed at the center of the lower surface.

  3 to 10 show the deformation guide 25a integrally formed on the lower surface of the cover layer 25 with the same material as that of the cover layer 25. However, the deformation guide 25a is formed as a separate element from the cover layer 25. It may be formed on the lower surface of the layer 25. For example, (1) only the deformation guide 25a (= another element) is formed on the lower surface of the cover layer 25, or (2) the deformation guide 25a and a part of the cover layer 25 (2 described in the cover layer 25 in FIG. 5). A portion (= another element) including a layered portion below the dotted line may be formed on the lower surface of the cover layer 25. In this case, the material of another element (only the deformation guide 25a or a part including the deformation guide 25a and a part of the cover layer 25) may be the same as the material of the cover layer 25 or different from the material of the cover layer 25. May be.

  The deformation guide 25a has a hexagonal shape when viewed from the left side, and a first pressing surface 25a1 for pressing the first fixed terminal, which is formed of an inclined surface having a predetermined inclination angle or a curved surface having a predetermined shape, on the lower surface side thereof. The second pressing surface 25a2 for pressing the second fixed terminal, which is an inclined surface having the same inclination angle as the first pressing surface 25a1 or a curved surface having the same curved shape, is symmetrical in the front-rear direction. The first pressing surface 25a1 serves to press and deform the first fixed terminal 16a of the switch unit 10A toward the movable terminal 15 during assembly, which will be described later, and the second pressing surface 25a2 is second fixed during assembly, which will be described later. The terminal 17a is pressed toward the movable terminal 15 to be deformed.

  Each connection pad 26 is made of a metal material such as gold or copper, and is formed on the lower surface of the cover layer 25 so as to face each connection pad 24 of the switch unit 10A and with the same outline as each connection pad 24. . Each connection pad 26 may have a single layer structure. However, as shown in FIG. 7, in order to improve adhesion to the lower surface of the cover layer 25, an adhesive layer 26-1 (titanium layer) is formed on the lower surface of the cover layer 25. , A titanium nitride layer, a titanium-tungsten alloy layer, a titanium oxide layer, a tantalum nitride layer, etc.), and then a barrier layer 26-2 (a nickel layer, a titanium nitride layer, etc.) is formed on the upper surface of the adhesion layer 26-1. And it is preferable to set it as the 3 layer structure which formed the pad layer 26-3 on the upper surface, or the multilayered structure of 4 layers or more which has an equivalent layer structure.

  Each bonding material 27 is made of a solder material such as tin-silver-copper alloy or tin-palladium alloy, or a brazing material such as silver brazing or copper brazing, and is attached to the lower surface of each connection pad 26 in an appropriate amount.

  When assembling the MEMS switch shown in FIGS. 3 to 10 using the switch unit 10A and the cover unit 10B, as shown in FIG. 13, the switch unit 10A is set so that each connection pad 24 faces upward. The cover unit 10 </ b> B is positioned so that the connection pads 26 face the connection pads 24. Then, the switch unit 10A and the cover unit 10B are brought relatively close to each other, and the bonding material 27 attached to the lower surface of each connection pad 26 of the cover unit 10B is brought into contact with the upper surface of each connection pad 24 of the switch unit 10A. And while maintaining the space | interval of switch unit 10A and cover unit 10B, at least the joining location of the joining material 27 is heated and melted, and each connection pad 24 and each connection pad 26 are joined via the joining material 27, and a switch The unit 10A and the cover unit 10B are combined.

  As a means for heating and melting at least the joining portion of the bonding material 27, a heat applying means such as a reflow furnace can be preferably used. However, the bonding capable of performing the same joining without heating and melting at least the joining portion of the bonding material 27 is possible. If a technique such as diffusion bonding (thermocompression bonding) is used, the same bonding as described above can be performed without heating and melting at least the bonding portion of the bonding material 27.

  3 to 10 show the bonding material 27 provided in advance on the connection pad 26 side of the cover unit 10B. However, the bonding material 27 is provided in advance on the connection pad 24 side of the switch unit 10A. The same connection as described above can be performed. Further, it is possible to supply the bonding material 27 to the lower surface of each connection pad 26 or the upper surface of each connection pad 24 immediately before bonding without attaching the bonding material 27 to each connection pad 26 or each connection pad 24 in advance. Since the vertical dimension (thickness) of the bonding material 27 is on the order of μm or nm, the distance between the switch unit 10A and the cover unit 10B after the combination is better provided in advance on each connection pad 26 or each connection pad 24. Accuracy can be increased.

  By this assembly, as shown in FIGS. 4 and 5, the upper surface of the first fixed terminal 16a of the switch unit 10A is pressed toward the movable terminal 15 by the first pressing surface 25a1 of the deformation guide 25a of the cover unit 10B. By this pressing, the first fixed terminal 16a is deformed into a shape (an inclined shape or a curved shape) whose end edge is closest to the movable terminal 15 and a portion other than the end edge is gradually separated from the movable terminal 15. . Further, the upper surface of the second fixed terminal 17a of the switch unit 10A is pressed toward the movable terminal 15 by the second pressing surface 25a2 of the deformation guide 25a of the cover unit 10B. The edge is closest to the movable terminal 15 and the portion excluding the end edge is deformed into a shape (inclined shape or curved shape) gradually separated from the movable terminal 15.

  As described above, since the first pressing surface 25a1 and the second pressing surface 25a2 of the deformation guide 25a of the cover unit 10B have the same inclination angle or curved shape, as can be seen from FIG. 4 and FIG. The first fixed terminal 16a and the second fixed terminal 17a have substantially the same inclination angle θ or degree of curvature, and the edges of the first fixed terminal 16a and the second fixed terminal 17a face each other substantially in parallel through the gap GA11. Further, the end edges of the first both fixed terminals 16a and the second fixed terminal 17a face substantially parallel to the upper surface of the fixed terminal 15 via the clearance CL11.

  Incidentally, since there is a flat surface (no reference) between the first pressing surface 25a1 and the second pressing surface 25a2 of the deformation guide 25a of the cover unit 10B that does not contact the upper surfaces of the fixed terminals 16a and 17a, The upper surfaces of the tip portions of the first fixed terminal 16a and the second fixed terminal 17a are not in contact with the deformation guide 25a.

<Operation>
In the MEMS switch shown in FIGS. 3 to 10, in order to bring the first signal layer 16 and the second signal layer 17 in the non-conductive state into a conductive state, the control terminals 21 and 22 are connected to a variable DC power source (not shown). A predetermined driving voltage is applied from the variable DC power source to each piezoelectric actuator PA, and the piezoelectric layer 19 of each piezoelectric actuator PA is thereby contracted due to the piezoelectric effect, thereby causing each flexible lever FL to be flexible. The side of the displacement part FLc of the part FLb is bent symmetrically upward and downward, and the upper surface of the movable terminal 15 on the displacement part FLc is brought into contact with the first fixed terminal 16a and the second fixed terminal 17a (see FIG. 14).

  As described above, each of the first fixed terminal 16a and the second fixed terminal 17a has a shape in which each end edge is closest to the movable terminal 15 and a portion excluding the end edge is gradually separated from the movable terminal 15. Therefore, in the conductive state, the upper surface of the movable terminal 15 is in line contact with the end edges of the first fixed terminal 16a and the second fixed terminal 17a under a predetermined contact pressure and with predetermined linear contact areas CR16a and CR17a. (See FIG. 15).

  Between each flexible portion FLb and the displacement portion FLc of the flexible lever FL, there is a hinge portion FLa that is more flexible than these, and the displacement portion FLc uses the flexibility of each hinge portion FLa. As a result, the three-dimensional displacement is possible, so that there is a slight deviation in the height positions of the edges of the first fixed terminal 16a and the second fixed terminal 17a, or the first fixed terminal 16a and the second fixed terminal 16a. Even when the edge of the fixed terminal 17a is slightly inclined with respect to the upper surface of the movable terminal 15, the upper surface of the movable terminal 15 is moved to the ends of the first fixed terminal 16a and the second fixed terminal 17a by the three-dimensional displacement of the displacement portion FLc. The line can be surely brought into line contact.

<Effect>
(E1) According to the MEMS switch shown in FIGS. 3 to 10, the first fixed terminal 16 a and the second fixed terminal 17 a are pressed toward the movable terminal 15 by the deformation guide 25 a which is a separate element. As a result, each edge is closest to the movable terminal 15 and the portion excluding the edge is deformed gradually away from the movable terminal 15, so that the upper surface of the movable terminal 15 is in the conductive state. The first fixed terminal 16a and the second fixed terminal 17a can be reliably brought into line contact by having predetermined linear contact areas CR16a and CR17a at the end edges thereof.

  That is, compared with the surface contact type MEMS switch shown in FIGS. 1A and 1B, the contact area between the movable terminal 15 and the first fixed terminal 16a and the second fixed terminal 17a in the conductive state is reduced. In addition, the reduction of the contact area can surely suppress the occurrence of stiction (a phenomenon in which the movable terminal 15 sticks to both the fixed terminals 16a and 17a in the conductive state). Further, compared to the multipoint contact type MEMS switch shown in FIGS. 2A and 2B, the contact area between the movable terminal 15 and the first fixed terminal 16a and the second fixed terminal 17a in the conductive state is increased. Variations can be suppressed, and variations in transmission loss can be avoided by suppressing variations, and stable signal transmission can be performed in a conductive state.

  (E2) According to the MEMS switch shown in FIGS. 3 to 10, the first signal layer 16 including the first fixed terminal 16a and the second signal layer 17 including the second fixed terminal 17a are provided in the switch unit 10A. Since the deformation guide 25a is provided in the cover unit 10B coupled to the switch unit 10A, the deformation of the first fixed terminal 16a and the second fixed terminal 17a by the deformation guide 25a due to the coupling of the switch unit 10A and the cover unit 10B. The deformation amount of the first fixed terminal 16a and the second fixed terminal 17a by the deformation guide 25a, that is, the clearance CL11 can be easily set.

  (E3) According to the MEMS switch shown in FIGS. 3 to 10, the switch unit 10 </ b> A and the cover unit 10 </ b> B have the connection pads 24 and 26 for coupling each other, and the connection pad of the switch unit 10 </ b> A. 24 and the connection pad 26 of the cover unit 10B are joined via the joining material 27, so that the switch unit 10A and the cover unit 10B can be accurately coupled, and the deformed first fixed terminal 16a And the shape of the 2nd fixed terminal 17a can be maintained favorable.

  (E4) According to the MEMS switch shown in FIGS. 3 to 10, the deformation guide 25a has the first pressing surface 25a1 for pressing the first fixed terminal and the second pressing surface 25b1 for pressing the second fixed terminal. Therefore, the deformation of the first fixed terminal 16a and the second fixed terminal 17a can be reliably performed by the first pressing surface 25a1 and the second pressing surface 25b1 corresponding to each, and the first pressing surface 25a1 and the second pressing surface 25b1. The shapes of the first fixed terminal 16a and the second fixed terminal 17a after deformation can be easily controlled based on the inclination angle, the curved shape, and the like of the pressing surface 25b1.

[Second Embodiment]
A MEMS switch (second embodiment) according to the present invention will be described with reference to FIG.

The MEMS switch shown in FIG. 16 is different from the MEMS switch (first embodiment) shown in FIGS.
A spacer 25b for controlling the distance between the switch unit 10A and the cover unit 10B coupled to the switch unit 10A is further provided on the lower surface of the cover unit 25. Other configurations are the same as those of the MEMS switch (first embodiment) shown in FIGS.

  The spacer 25b shown in FIG. 16 is integrally formed on the lower surface of the cover layer 25 by processing the lower surface of the cover layer 25 by a photolithography method or the like. The number of the spacers 25b is four, and the other two spacers are provided such that the lower ends of the two spacers 25b are in contact with the upper surface of the second insulating layer 14 that contacts the left and right sides of the first signal layer 16. The lower end of 25 b is in contact with the upper surface of the second insulating layer 14 that hits the left and right sides of the second signal layer 17. The vertical dimension (height) of each spacer 25b is the same, and the distance between the switch unit 10A and the cover unit 10B coupled to the switch unit 10A is controlled by the vertical dimension (height).

  The formation position and number of the spacers 25b can be arbitrarily changed as long as the operation of the MEMS switch is not hindered and the distance between the switch unit 10A and the cover unit 10B coupled to the switch unit 10A can be controlled. it can. For example, the number of spacers 25b formed on the lower surface of the cover layer 25 is two, and the lower end of one of the spacers 25b is in contact with the upper surface of the second insulating layer 14 corresponding to one of the left and right sides of the first signal layer 16. In addition, even if a configuration in which the lower end of the other spacer 25b is in contact with the upper surface of the second insulating layer 14 corresponding to one of the left and right sides of the second signal layer 17, the switch unit 10A and the switch unit 10A are coupled. The distance from the cover unit 10B thus made can be controlled. As shown in FIG. 17A, the number of spacers 25b ′ formed on the lower surface of the cover layer 25 is two, and the lower end of one of the spacers 25b ′ is the first signal layer 16. The switch unit 10 </ b> A and the switch unit can be used even when a configuration in which the upper surface of the first portion is in contact with the lower end of the other spacer 25 b ′ is in contact with the upper surface of the first portion of the second signal layer 17 is employed. The distance between the cover unit 10B and the cover unit 10B can be controlled. Further, even if a form in which four or two spacers 25b and two spacers 25b ′ are formed on the lower surface of the cover layer 25 is adopted, the switch unit 10A and the cover coupled to the switch unit 10A are used. The interval with the unit 10B can be controlled.

  In FIG. 16, each spacer 25b is integrally formed on the lower surface of the cover layer 25 with the same material as that of the cover layer 25. You may form in a lower surface. For example, (1) only each spacer 25b (= another element) is formed on the lower surface of the cover layer 25, or (2) each spacer 25b and a part 25 ′ of the cover layer 25 (the cover layer 25 in FIG. 17B). A portion (= another element) including the deformation guide 25a and a lower portion of the cover layer 25 (3) each spacer 25b and a part of the cover layer 25. 25 ′ (a layered portion below the straight line marked in the cover layer 25 in FIG. 17B) (= another element, not including the deformation guide 25a) is formed on the lower surface of the cover layer 25. You may do it. In this case, another element (only each spacer 25b, a part including each spacer 25b and part 25 'of the cover layer 25 and the deformation guide 25a, or a part including each spacer 25b and part 25' of the cover layer 25) The material of (the deformation guide 25a is not included)) may be the same as the material of the cover layer 25, or may be different from the material of the cover layer 25.

  Of course, when the form shown in FIG. 17A is adopted, or when the form in which the four or two spacers 25b and the two spacers 25b ′ are formed on the lower surface of the cover layer 25 is adopted. However, each spacer may be formed on the lower surface of the cover layer 25 as a separate element from the cover layer 25 by the same method as in the above (1) to (3). In these cases, the material of the separate element is the cover. It may be the same as the material of the layer 25 or may be different from the material of the cover layer 25.

  FIG. 16 shows that each spacer 25b is provided on the cover unit 10B side. However, even if each spacer 25b is provided on the switch unit 10A side, the switch unit 10A and the cover unit coupled to the switch unit 10A are provided. The interval with 10B can be controlled in the same manner as described above. For example, (1) four spacers 25b may be formed integrally or as separate elements on the upper surface of the second insulating layer 14 of the switch unit 10A so as to have the same form as in FIG. The number of 25b is set to two so as to be in the form similar to that in FIG. 16 in the combined state, or (3) the two spacers 25b ′ are connected to the switch unit 10A so as to have the same form as in FIG. The first signal layer 16 and the second signal layer 17 may be formed as separate elements on the upper surface of the first portion, or (4) the four or two spacers 25b and the two spacers 25b ′ may be combined. It may be formed.

According to the MEMS switch shown in FIG. 16, the same effects as the effects (E1) to (E4) described in the [first embodiment] including the above-described modification can be obtained.
Since the distance between the switch unit 10A and the cover unit 10B coupled to the switch unit 10A can be controlled by each spacer (at least one of 25b and 25b ′), the first fixed terminal 16a and the first fixed terminal 16a by the deformation guide 25a 2 The deformation amount of the fixed terminal 17a, that is, the clearance CL11 can be set more easily.
Such effects can be obtained.

[Third Embodiment]
A MEMS switch (third embodiment) according to the present invention will be described with reference to FIG.

The MEMS switch shown in FIG. 18 is different from the MEMS switch (first embodiment) shown in FIGS.
The first deformation guide 25c for pressing the first fixed terminal and the second deformation guide 25d for pressing the second fixed terminal are integrally formed individually on the lower surface of the cover layer 25 of the cover unit 10B. Other configurations are the same as those of the MEMS switch (first embodiment) shown in FIGS.

  The first deformation guide 25c and the second deformation guide 25d have a trapezoidal shape when viewed from the left side, and the first deformation guide 25c has a lower surface formed of an inclined surface having a predetermined inclination angle or a curved surface having a predetermined shape. A first pressing surface 25c1 for pressing the fixed terminal is formed, and a second fixing made of an inclined surface having the same inclination angle as the first pressing surface 25c1 or a curved surface having the same curved shape is formed on the lower surface of the second deformation guide 25d. A second pressing surface 25d1 for terminal pressing is formed.

  As can be seen from FIG. 18, the upper surface of the first fixed terminal 16a of the switch unit 10A is pressed toward the movable terminal 15 by the first pressing surface 25c1 of the first deformation guide 25c of the cover unit 10B. Accordingly, the first fixed terminal 16 a is deformed into a shape in which the end edge is closest to the movable terminal 15 and the portion excluding the end edge is gradually separated from the movable terminal 15. Further, the upper surface of the second fixed terminal 17a of the switch unit 10A is pressed toward the movable terminal 15 by the second pressing surface 25d1 of the second deformation guide 25d of the cover unit 10B. The terminal 17 a is deformed into a shape in which the edge of the terminal 17 a is closest to the movable terminal 15 and the portion excluding the edge is gradually separated from the movable terminal 15.

  Note that the deformation guides 25c and 25d may be formed on the lower surface of the cover layer 25 as a separate element from the cover layer 25, as described in the above [First Embodiment]. Is omitted.

  The MEMS switch shown in FIG. 18 differs from the MEMS switch shown in FIGS. 3 to 10 in the form of the deformation guide, but the effects (E1) to (E4) described in [First Embodiment] and Similar effects can be obtained.

[Fourth Embodiment]
A MEMS switch (fourth embodiment) according to the present invention will be described with reference to FIG.

The MEMS switch shown in FIG. 19 is different from the MEMS switch (first embodiment) shown in FIGS.
The first deformation guide 25e for pressing the first fixed terminal and the second deformation guide 25e for pressing the second fixed terminal are integrally formed individually on the lower surface of the cover layer 25 of the cover unit 10B. Other configurations are the same as those of the MEMS switch (first embodiment) shown in FIGS.

  The first deformation guide 25e and the second deformation guide 25f have a triangular shape when viewed from the left side, and the lower surface of the first deformation guide 25e is a first surface formed of an inclined surface having a predetermined inclination angle or a curved surface having a predetermined shape. A first pressing surface 25e1 for pressing the fixed terminal is formed, and a second fixed surface made of an inclined surface having the same inclination angle as the first pressing surface 25e1 or a curved surface having the same curved shape is formed on the lower surface of the second deformation guide 25f. A second pressing surface 25f1 for terminal pressing is formed.

  As can be seen from FIG. 19, the first fixed terminal 16a of the switch unit 10A is pressed toward the movable terminal 15 by the first pressing surface 25e1 of the first deformation guide 25e of the cover unit 10B at the top corner. Due to the pressing, the edge of the first fixed terminal 16 a is closest to the movable terminal 15, and the portion other than the edge is gradually separated from the movable terminal 15. Further, the upper surface of the second fixed terminal 17a of the switch unit 10A is pressed toward the movable terminal 15 by the second pressing surface 25f1 of the second deformation guide 25f of the cover unit 10B. The terminal 17 a is deformed into a shape in which the edge of the terminal 17 a is closest to the movable terminal 15 and the portion excluding the edge is gradually separated from the movable terminal 15.

  Note that the deformation guides 25e and 25f may be formed on the lower surface of the cover layer 25 as separate elements from the cover layer 25, as described in the above [First Embodiment]. Is omitted.

  The MEMS switch shown in FIG. 19 differs from the MEMS switch shown in FIGS. 3 to 10 in the form of the deformation guide, but the effects (E1) to (E4) described in [First Embodiment] and Similar effects can be obtained.

[Fifth Embodiment]
A MEMS switch (fifth embodiment) according to the present invention will be described with reference to FIG.

The MEMS switch shown in FIG. 20 is different from the MEMS switch (first embodiment) shown in FIGS.
The first deformation guide 25g for pressing the first fixed terminal and the second deformation guide 25h for pressing the second fixed terminal are individually and integrally formed on the lower surface of the cover layer 25 of the cover unit 10B. Other configurations are the same as those of the MEMS switch (first embodiment) shown in FIGS.

  The first deformation guide 25g and the second deformation guide 25h have a cylindrical shape or a prismatic shape, and the lower end of the first deformation guide 25g is a pressing portion for pressing the first fixed terminal, and the second deformation guide 25h. The lower end of is a pressing portion for pressing the second fixed terminal.

  As can be seen from FIG. 20, the upper surface of the first fixed terminal 16a of the switch unit 10A is pressed toward the movable terminal 15 by the lower end of the first deformation guide 25g of the cover unit 10B. The fixed terminal 16 a is deformed into a shape in which the end edge is closest to the movable terminal 15 and the portion excluding the end edge is gradually separated from the movable terminal 15. Further, the upper surface of the second fixed terminal 17a of the switch unit 10A is pressed toward the movable terminal 15 by the lower end of the second deformation guide 25h of the cover unit 10B. The edge is closest to the movable terminal 15, and the portion excluding the edge is deformed into a shape that is gradually separated from the movable terminal 15.

  Since the deformation guides 25g and 25h may be formed on the lower surface of the cover layer 25 as separate elements from the cover layer 25, as described in the above [First Embodiment], the description here will be given. Is omitted.

  The MEMS switch shown in FIG. 20 differs from the MEMS switch shown in FIGS. 3 to 10 in the form of the deformation guide, but the effects (E1) to (E4) described in the [first embodiment] and Similar effects can be obtained.

[Sixth Embodiment]
A MEMS switch (sixth embodiment) according to the present invention will be described with reference to FIG.

The MEMS switch shown in FIG. 21 is different from the MEMS switch (first embodiment) shown in FIGS.
Each pad PD of the switch unit 10A is composed of a support pad 23 and a connection pad 24 ′ formed on the upper surface of the support pad 23. A bonding material to each connection pad 26 ′ of the cover unit 10B. 27 is that the connection pads 24 ′ of the switch unit 10 A and the connection pads 26 ′ of the cover unit 10 B are directly joined by diffusion bonding (thermocompression bonding).

  Each connection pad 24 ′ on the switch unit 10 </ b> A side is made of a diffusion-bondable metal material such as gold, gold-tin alloy, tin-lead alloy, or nickel-based alloy, and is preferably formed on the upper surface of each support pad 23. It is formed with a smaller contour. Each connection pad 24 ′ may have a single layer structure, but as shown in FIG. 21, in order to improve adhesion to the upper surface of the support pad 23, the adhesion layer 24-1 ′ ( A titanium layer, a titanium nitride layer, a titanium-tungsten alloy layer, a titanium oxide layer, or a tantalum nitride layer), and then a pad layer 24-2 ′ is formed on the upper surface of the adhesion layer 24-1 ′, Alternatively, a multilayer structure of three or more layers having an equivalent layer configuration is preferable.

  Each connection pad 26 'on the cover unit 10B side is made of a metal material that can be diffusion bonded such as gold, gold-tin alloy, tin-lead alloy, nickel-based alloy, and the like. It is formed with the same outline as each connection pad 24 ′ so as to face each pad 24 ′. Each connection pad 26 ′ may have a single layer structure, but as shown in FIG. 21, in order to improve adhesion to the lower surface of the cover layer 25, the adhesive layer 26-1 ′ ( A titanium layer, a titanium nitride layer, a titanium-tungsten alloy layer, a titanium oxide layer, or a tantalum nitride layer), and then a pad layer 26-2 ′ is formed on the upper surface of the adhesion layer 26-1 ′. Alternatively, a multilayer structure of three or more layers having an equivalent layer configuration is preferable.

  The MEMS switch shown in FIG. 21 differs from the MEMS switch shown in FIGS. 3 to 10 in the form of the coupling portion, but the effects (E1) to (E4) described in [First Embodiment] and Similar effects can be obtained.

[Seventh Embodiment]
A MEMS switch (seventh embodiment) according to the present invention will be described with reference to FIG.

The MEMS switch shown in FIG. 22 (A) is different from the MEMS switch (first embodiment) shown in FIGS.
The tip of the first fixed terminal 16b of the switch unit 10A is tapered so that the left and right dimension (width) of the edge is smaller than the left and right dimension (width) of the movable terminal 15, and the tip of the second fixed terminal 17b The portion is tapered so that the left-right dimension (width) of the edge is smaller than the left-right dimension (width) of the movable terminal 15. Other configurations are the same as those of the MEMS switch (first embodiment) shown in FIGS.

  Since the left and right dimension (width) of the edge of the first fixed terminal 16b and the second fixed terminal 17b is smaller than the left and right dimension (width) of the movable terminal 15, as shown in FIG. The line contact between the upper surface of the movable terminal 15 and the edges of the first fixed terminal 16b and the second fixed terminal 17b in the state is a line having a smaller left-right dimension (width) than the linear contact areas CR16a and CR17a shown in FIG. The contact areas CR16b and CR17b are used.

According to the MEMS switch shown in FIG. 22A, the same effects as the effects (E1) to (E4) described in the [first embodiment] can be obtained.
-By changing the left and right dimensions (widths) of the edges of the first fixed terminal 16b and the second fixed terminal 17b, the upper surface of the movable terminal 15 in the conductive state and the first fixed terminal 16b and the second fixed terminal 17b. The linear contact area with the edge of can be arbitrarily adjusted.
Such effects can be obtained.

[Eighth Embodiment]
A MEMS switch (eighth embodiment) according to the present invention will be described with reference to FIG.

The MEMS switch shown in FIG. 23 (A) is different from the MEMS switch (first embodiment) shown in FIGS.
Two convex portions 16 c 1 having a semicircular contour are integrally formed at the edge of the first fixed terminal 16 c of the switch unit 10 A with a space in the left-right direction, and the same as the edge of the second fixed terminal 17 c The two contours 17c1 of the contour are integrally formed with a space in the left-right direction. Other configurations are the same as those of the MEMS switch (first embodiment) shown in FIGS.

  Since the two convex portions 16c1 and 17c1 having a semicircular contour are formed on the edges of the first fixed terminal 16b and the second fixed terminal 17b, the movable portion in the conductive state is movable as shown in FIG. The line contact between the upper surface of the terminal 15 and the edges of the first fixed terminal 16b and the second fixed terminal 17b is performed using the arc-shaped edges of the convex portions 16c1 and 17c1. That is, the measurement is performed with linear contact areas CR16c and CR17c having a smaller left-right dimension (width) than the linear contact areas CR16a and CR17a shown in FIG.

  FIG. 23 (A) shows a case in which two convex portions 16c1 and 17c1 are formed on the end edges of the first fixed terminal 16b and the second fixed terminal 17b, respectively. The number of the convex portions 16c1 and 17c1 is shown in FIG. The number of protrusions 16c1 on the first fixed terminal 16b side and the number of protrusions 17c1 on the second fixed terminal 17b side may be different. Moreover, the outline of each convex part 16c1 and 17c1 may be a rectangular shape or another shape.

According to the MEMS switch shown in FIG. 23A, the same effects as the effects (E1) to (E4) described in the [first embodiment] can be obtained.
-By changing the number, contour and size of the convex portions 16c1 and 17c1, the linear contact area between the upper surface of the movable terminal 15 and the edges of the first fixed terminal 16b and the second fixed terminal 17b in the conductive state is increased. It can be adjusted arbitrarily.
Such effects can be obtained.

  DESCRIPTION OF SYMBOLS 10A ... Switch unit, 11 ... 1st base layer, 12 ... 1st insulating layer, 13 ... 2nd base layer, 14 ... 2nd insulating layer, FL ... Flexible lever, 15 ... Movable terminal, 16 ... 1st signal layer 16a, 16b, 16c ... first fixed terminal, 16c1 ... convex portion, 17 ... second signal layer, 17a, 17b, 17c ... second fixed terminal, 17c1 ... convex portion, PA ... piezoelectric actuator, 24, 24 '... Connection pad, 10B ... cover unit, 25 ... cover layer, 25a, 25c, 25d, 25e, 25f, 25g, 25h ... deformation guide, 25a1, 25c1, 25e1 ... first pressing surface, 25a2, 25d1, 25f1 ... second pressing Surface, 25b, 25b '... spacer, 26, 26' ... connection pad, 27 ... bonding material.

Claims (6)

A flexible lever, a movable terminal provided on the flexible lever, a first signal layer, a first fixed terminal including an end portion of the first signal layer, a second signal layer, and the second signal layer A second fixed terminal composed of an end of the first signal layer, and the movable lever is brought into contact with the first fixed terminal and the second fixed terminal by bending the flexible lever in a predetermined direction, thereby causing the first signal layer and the first fixed layer to be in contact with each other. A MEMS switch comprising a drive actuator for bringing the two signal layers into a conductive state,
The first fixed terminal and the second fixed terminal are pressed toward the movable terminal by a deformation guide that is a separate element from the first fixed terminal and the second fixed terminal, so that each edge is The part closest to the movable terminal and excluding the edge is gradually deformed from the movable terminal. In the conductive state, the movable terminal is connected to the edge of the first fixed terminal and the second terminal. It is configured to make line contact with the edge of the fixed terminal.
A MEMS switch characterized by that. The first signal layer including the first fixed terminal and the second signal layer including the second fixed terminal are provided in a switch unit, and the deformation guide is provided in a cover unit coupled to the switch unit.
The MEMS switch according to claim 1. The switch unit and the cover unit each have a connection pad for coupling each other, and the connection pad of the switch unit and the connection pad of the cover unit are bonded via a bonding material or directly. Yes,
The MEMS switch according to claim 2. The deformation guide has a first pressing surface for pressing the first fixed terminal and a second pressing surface for pressing the second fixed terminal.
The MEMS switch according to any one of claims 1 to 3, wherein: A spacer for controlling a distance between the switch unit and a cover unit coupled to the switch unit;
The MEMS switch according to claim 2 or 3, wherein One or more protrusions are integrally formed on each edge of the first fixed terminal and the second fixed terminal, and the movable terminal is connected to the edge of the protrusion of the first fixed terminal in the conductive state. It is comprised so that line contact may be made to the edge of the convex part of the 2nd above-mentioned fixed terminal.
The MEMS switch according to any one of claims 1 to 5, wherein:

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