JP2012103785A - Mounting substrate analysis device, mounting substrate analysis method and mounting substrate analysis program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for reducing time required for making countermeasures against a warp of a mounting substrate, in analyzing the mounting substrate.SOLUTION: In a computer of a mounting substrate analysis device, a substrate-warp analysis model storage unit 142 stores an analysis model of a mounting substrate. A reflow analysis execution unit 143 executes a reflow analysis on the analysis model. In the analysis model on which the reflow analysis has executed, a reflow analysis result determination unit 144 determines whether a distance between the substrate and components at a joint part is within a predetermined range. When the distance between the substrate and the components at the joint part is out of the predetermined range, a warp countermeasure process unit 145 executes a countermeasure process against a warp of the mounting substrate on the analysis model stored in the substrate-warp analysis model storage unit 142. A warp-countermeasure result storage unit 149 stores information indicating a result of the executed countermeasure process.

Description

  The present invention relates to a mounting board analysis apparatus, a mounting board analysis method, and a mounting board analysis program for analyzing a board on which a component is mounted.

  Electronic devices are equipped with a substrate on which components such as a semiconductor package are mounted. Hereinafter, the board on which the component is mounted is also called a mounting board.

  When developing an electronic device, the reliability of the mounting board mounted on the electronic device, such as a temperature cycle and a drop impact, is evaluated by a simulation using a computer. In the simulation of reliability evaluation, an analysis model of a mounting board to be evaluated is used.

  Here, there is a technique called reflow as a technique for mounting components on a board. Reflow is a technology that joins parts to the board by printing a solder paste with flux added to the solder powder, placing the part on the board, and then applying heat to melt the solder.

  In recent years, portable devices such as mobile phones have been required to be smaller and lighter, and at the same time, boards and components inside the device have been required to be smaller and thinner. Many of the thinner substrates and components have a laminated structure of different materials. For example, a substrate in which copper and an organic resin are alternately stacked is used. Some parts such as semiconductor packages are resin-sealed.

  There are various types of resins, and each resin has its own properties. For example, each resin has properties such as moisture absorption, dehumidification, and curing by heat. In addition, resin is more susceptible to heat than metal, for example, it changes with the application of heat, and unlike metal, it does not return to its original state even when the temperature drops. Due to such effects as resin adsorption and desorption, reaction effects, and thermal expansion mismatch between the metal and the resin, warping of the substrate and parts is likely to occur during reflow.

  If warpage occurs in the substrate or component during reflow, there is a high possibility that a solder open failure or a bridge failure will occur at the joint between the substrate and the component due to solder. The solder open defect is a defect in which a sufficient amount of solder is not supplied at the joint portion to join the substrate and the component, and the substrate and the component are not joined. The solder bridging defect is a defect in which the amount of solder joining the substrate and the component is too large at the joint, and the solder is connected to the solder at the adjacent joint.

  When performing the above-mentioned simulation of reliability evaluation, even if analysis such as temperature cycle or drop impact is performed on a mounting board analysis model in which solder joint failure occurs due to warpage of the board or parts. , The result has little meaning. For this reason, it is necessary to evaluate the board warpage caused by the reflow and take measures against the board warpage before the reliability evaluation of the mounting board is performed.

  As an evaluation method for warping of a substrate, for example, there is a method of making a prototype of a substrate and measuring the warp with a moire interference fringe warpage measuring device. If the warpage of the board is large due to the measurement, the copper in a part of the solid wiring layer is changed to a resin, or a board with the position of the fixed perforation changed, and the warpage is measured again. By repeating such operations, a prototype of the substrate with a warp countermeasure is created.

  There is a technology for analyzing the warpage of the substrate due to reflow or the like by simulation using a computer. For example, a technique for predicting warpage with high accuracy by viscoelastic analysis in consideration of the degree of cure of a resin that changes over time is known. In addition, for example, in a multilayer substrate, a technique for performing more accurate substrate warpage analysis by changing a physical property value of a conductor in an insulator is known.

WO2008 / 001922 JP 2010-026839 A

  In the conventional measures that repeat the above-mentioned trial production of a substrate, measurement of warpage, creation of a substrate with countermeasures against warpage, measurement of warpage, and so on ... until a substrate with sufficient countermeasures against warpage is obtained. , It may take several weeks. In addition, even in the method of analyzing the warpage of the substrate by simulation, it is necessary to feed back the result of the warpage analysis of the substrate to the design of the substrate and repeat the warpage analysis on the redesigned substrate. In some cases, it takes time to obtain a substrate with a countermeasure against warping.

  In recent years, the development cycle of devices such as mobile phones has become very fast, and the number of models developed at the same time has increased. For this reason, it is necessary to evaluate the reliability of the boards mounted on the equipment to be developed in a short time. However, it may take several weeks for the board warpage evaluation and countermeasures alone, and if the reliability evaluation and countermeasures for the mounting board such as temperature cycle and drop impact are included, it will take several months. Sometimes it takes.

  An object of one aspect of the disclosed technique is to provide a technique for solving the above-described problem and reducing the time spent for countermeasures against warping of a mounting board.

  The disclosed mounting board analyzing apparatus includes an analysis model storage unit that stores an analysis model of a board on which a component is mounted, and a substrate and a component bonded to the analysis model stored in the analysis model storage unit. Reflow analysis for executing reflow simulation for joining parts with solder, and reflow analysis for determining whether the distance between the board and the component in the joint is within a specified range in the analysis model after the simulation is executed When the distance between the result determination unit and the board and the component at the joint is outside the predetermined range, at least a part of the solid wiring layer of the board with respect to the analysis model stored in the analysis model storage unit Processing to change the material of the area, processing to set a rigid element that mimics the jig that suppresses the displacement of the board during reflow, or change the amount of solder at the joint between the board and the component A warpage countermeasure processing section that executes any one of the processes for reflecting the changed solder amount to the joint, and a warpage countermeasure result storage section that stores information indicating the result of the processing executed by the board warpage countermeasure processing section. With.

  With the disclosed technology, it is possible to reduce the time spent on countermeasures against warping of the mounting board by evaluating and taking countermeasures against warping in the analysis model of the mounting board. The reliability evaluation analysis of temperature cycle and drop impact, etc. can be performed using the analysis model of the mounting board with the countermeasure against warping as it is, so the time required for the reliability evaluation analysis should be reduced by several weeks. Can do.

It is a figure which shows the structural example of the mounting board | substrate analysis apparatus by this Embodiment. It is a figure which shows the structural example of the board | substrate curvature analysis process part by this Embodiment. It is a figure which shows the structural example of the hardware which implement | achieves the mounting board | substrate analysis apparatus by this Embodiment. It is a figure which shows the example of the component data by this Embodiment. It is a figure which shows the example of the components mounted in the board | substrate by this Embodiment. It is a figure which shows the example of the mask data by this Embodiment. It is a figure which shows the example of the solder table by this Embodiment. It is a figure which shows the example of the changeable area | region data by this Embodiment. It is a figure which shows the example of the jig | tool data by this Embodiment. It is a figure which shows the example of the model for a board | substrate analysis before and after execution of the reflow analysis by this Embodiment. It is a figure explaining the example of the curvature suppression technique by the pattern extraction of a solid wiring layer by this Embodiment. It is a figure explaining the example of the curvature suppression technique by the pattern extraction of a solid wiring layer by this Embodiment. It is a figure explaining the example of the curvature suppression technique by pin jig | tool installation by this Embodiment. It is a figure explaining the example of the curvature countermeasure technique by the solder amount change by this Embodiment. It is a figure explaining the example of the curvature countermeasure technique by the solder amount change by this Embodiment. It is a mounting substrate analysis process flowchart by the mounting substrate analysis apparatus of this Embodiment. It is a solid wiring pattern extraction process flowchart by the board | substrate curvature analysis process part of this Embodiment. It is a pin jig installation process flowchart by the board | substrate curvature analysis process part of this Embodiment. It is a solder amount change process flowchart by the board | substrate curvature analysis process part of this Embodiment.

  Hereinafter, the present embodiment will be described with reference to the drawings.

  FIG. 1 is a diagram illustrating a configuration example of a mounting board analyzing apparatus according to the present embodiment.

  A mounting board analysis apparatus 100 shown in FIG. 1 is an apparatus that performs simulation such as reliability evaluation analysis using a model of a board on which components are mounted. Hereinafter, the board on which the component is mounted is also referred to as a mounting board.

  The mounting board analysis apparatus 100 includes a board wiring diagram data storage unit 110, a model generation unit 120, a mounting board analysis model storage unit 130, a board warpage analysis processing unit 140, a reflow analysis result storage unit 150, and a reliability evaluation analysis unit 160. Prepare. Further, the mounting board analyzing apparatus 100 includes a board configuration data storage unit 210, a component data storage unit 220, a mask data storage unit 230, a solder table storage unit 240, a threshold data storage unit 250, a changeable area data storage unit 260, a jig. A data storage unit 270 is provided.

  The board wiring diagram data storage unit 110 is a storage unit accessible by a computer that stores board wiring diagram data. The board wiring diagram data is board wiring data generated by ECAD (Electronic Computer Aided Design). ECAD is CAD (Computer Aided Design) used for designing circuit wiring patterns.

  The model generation unit 120 is a three-dimensional analysis model for a mounting board based on data such as board wiring diagram data, board configuration data, component data, and mask data stored in each storage unit, and other set information. Is generated. The three-dimensional analysis model of the mounting board is used for simulations such as reflow warpage analysis and reliability evaluation analysis.

  The substrate configuration data storage unit 210 is a storage unit that stores computer configuration data and is accessible by a computer. The substrate configuration data includes information such as the layer configuration of the substrate and the thickness and material of each layer. Further, if there is a region where the material has been changed in advance in the solid wiring layer, the board configuration data also includes information on that region.

  The component data storage unit 220 is a storage unit that stores component data and is accessible by a computer. The component data is data related to a component such as a semiconductor package mounted on the substrate. The component data includes information such as the shape of the component, the constituent material, and the mounting position on the board.

  The mask data storage unit 230 is a storage unit that stores mask data and is accessible by a computer. The mask data is data relating to a mask used when printing solder paste on the substrate. The mask data has information such as mask thickness and printed solder diameter.

  The solder table storage unit 240 is a storage unit that stores a solder table and is accessible by a computer. The solder table is a table showing the relationship between information on solder balls attached to parts, information on solder paste printed on a substrate, information on solder bumps after reflow is performed, and the like. For example, by using a solder table, information on the solder joint length and volume after reflow can be obtained from information on the solder balls contained in the parts and mask information such as mask thickness and printed solder diameter. it can. In addition, by using a solder table, it is possible to obtain information such as a printed solder diameter of a mask that is required according to a change in the amount of solder.

  For example, the model generation unit 120 includes the substrate wiring diagram data stored in the substrate wiring diagram data storage unit 210, the layer configuration included in the substrate configuration data stored in the substrate configuration data storage unit 210, and the thickness of each layer. Based on this information, a three-dimensional substrate model is generated. The three-dimensional board model is a three-dimensional model showing the shape of the board to be analyzed on the computer.

  Further, the model generation unit 120 generates a mounting board model based on the generated three-dimensional board model and information such as the shape and mounting position of the component included in the component data stored in the component data storage unit 220. To do. The mounting board model is a three-dimensional model showing the shape of the mounting board on the computer.

  At this time, the model generation unit 120 generates a solder beam element representing solder for joining the substrate and the component for each joint portion between the substrate and the component, and the generated solder beam element is used as a joint portion between the substrate and the component. To place. The solder beam element is, for example, a columnar model generated in accordance with a solder joint length indicating a distance between a substrate to be joined and a component, or a solder volume. The solder beam element expands and contracts in the height direction of the pillar according to the distance between the substrate to be joined and the component. The model generation unit 120 includes a solder beam element generation unit (not shown) that generates a solder beam element for each joint.

  When generating a solder beam element for a certain joint, the model generation unit 120 acquires information on solder balls attached to the parts of the joint from the part data stored in the part data storage unit 220. . The acquired solder ball information is, for example, information such as a ball mounting diameter and a ball diameter for the solder ball of the corresponding joint. Further, the model generation unit 120 acquires mask information for printing solder paste on the corresponding joint from the mask data stored in the mask data storage unit 230. The acquired mask information is, for example, information such as mask thickness, printed solder diameter, mask aperture ratio, etc., for the mask at the corresponding joint.

  The model generation unit 120 generates a solder beam element based on the acquired solder ball information and mask information. For example, the model generation unit 120 refers to the solder table stored in the solder table storage unit 240 based on the acquired solder ball information and mask information, and obtains information on the solder volume and joint length after mounting. . Also, for example, the model generation unit 120 substitutes the acquired solder ball information and mask information into a predetermined calculation formula to obtain information on the solder volume and joint length after mounting.

  The model generation unit 120 generates a solder beam element having the obtained solder joint length as its height and the obtained solder volume as its volume. In the present embodiment, the solder beam element is assumed to be cylindrical. The model generation unit 120 arranges the generated cylindrical solder beam so that the surface of one circle is in contact with the substrate side of the joint and the surface of the other circle is in contact with the component side of the joint.

  Further, the model generation unit 120 performs a finite element mesh division according to the material definition for the board and each component constituting the mounting board model and the set number of integration points, and generates a mounting board analysis model. The mounting board analysis model is a three-dimensional analysis model of the mounting board. The generated mounting board analysis model is stored in the mounting board analysis model storage unit 130. Note that information on the material of each layer in the substrate is included in the substrate configuration data stored in the substrate configuration data storage unit 210. Further, the component material information is included in the component data stored in the component data storage unit 220.

  The mounting board analysis model storage unit 130 is a storage unit that stores a mounting board analysis model and is accessible by a computer.

  The board warpage analysis processing unit 140 executes reflow simulation analysis for joining the joint between the board and the component with solder, using the three-dimensional analysis model of the mounting board. In the reflow simulation, a high temperature state (about 240 ° C.) is set for the analysis model of the mounting board, and thermal stress analysis is performed using a finite element method (FEM). Hereinafter, the reflow simulation analysis for the analysis model of the mounting board is referred to as reflow analysis.

  The substrate warpage analysis processing unit 140 uses the threshold data stored in the threshold data storage unit 250 to determine whether there is a problem in the result of the reflow analysis. Here, the board warpage analysis processing unit 140 determines whether there is a problem of a joint portion due to board or component warpage in the analysis model of the mounting board after the reflow analysis is executed.

  The threshold data storage unit 250 is a storage unit that stores threshold data and is accessible by a computer. In the threshold data, a threshold value used for determining the result of the reflow analysis for the analysis model is set. For example, in the threshold value data, a threshold value related to the distance between the board and the component at the joint is set for each component.

  When it is determined that there is a problem in the result of reflow analysis, the board warpage analysis processing unit 140 is based on component data, solder table, threshold data, changeable area data, jig data, etc. stored in each storage unit. Then, take measures using an appropriate method to suppress or deal with the warping of the board. There are various methods for suppressing or coping with the warpage of the substrate, such as a method for suppressing warpage by removing a pattern of a solid wiring layer, a method for suppressing warpage by installing a pin jig, and a method for coping with warpage by changing the amount of solder.

  The changeable area data storage unit 260 is a storage unit that stores changeable area data and is accessible by a computer. In the changeable area data, information indicating a material changeable area in the solid wiring layer of the substrate is recorded.

  The jig data storage unit 270 is a storage unit that stores jig data and is accessible by a computer. In the jig data, information on a jig for fixing the substrate so as not to be deformed during reflow is recorded.

  The board warpage analysis processing unit 140 executes the reflow analysis again using the analysis model on which a countermeasure using a technique for suppressing or coping with the board warpage is applied. The substrate warpage analysis processing unit 140 stores the analysis model after execution of the reflow analysis in the reflow analysis result storage unit 150 if the problem due to the warpage of the substrate is settled as a result of the reflow analysis again. Details of the substrate warpage analysis processing unit 140 will be described later.

  The reflow analysis result storage unit 150 is a computer-accessible storage unit that stores an analysis model after execution of the reflow analysis. The analysis model after execution of the reflow analysis is a three-dimensional analysis model indicating the state of the mounting board after execution of the reflow.

  The reliability evaluation analysis unit 160 uses the analysis model after execution of the reflow analysis stored in the reflow analysis result storage unit 150 to execute a simulation of reliability evaluation analysis such as temperature cycle and drop impact.

  FIG. 2 is a diagram illustrating a configuration example of the substrate warpage analysis processing unit according to the present embodiment.

  The substrate warp analysis processing unit 140 shown in FIG. 2 includes a substrate warp analysis model generation unit 141, a substrate warp analysis model storage unit 142, a reflow analysis execution unit 143, a reflow analysis result determination unit 144, a warp countermeasure processing unit 145, and a warp. A countermeasure result storage unit 149 is provided.

  The board warp analysis model generation unit 141 gives a set constraint condition, load condition, physical property value, and the like to the mounting board analysis model stored in the mounting board analysis model storage unit 130 to perform board warp analysis. A model is created. The generated substrate warp analysis model is stored in the substrate warp analysis model storage unit 142.

  The substrate warp analysis model storage unit 142 is a computer-accessible storage unit that stores a substrate warp analysis model. The board warpage analysis model is a three-dimensional analysis model of the mounting board in which conditions necessary for executing the reflow analysis are set.

  The reflow analysis execution unit 143 executes the reflow analysis using the substrate warp analysis model stored in the substrate warp analysis model storage unit 142. In reflow analysis, the actual state of reflow execution is simulated on a computer, for example, the substrate warpage analysis model is brought to a high temperature state. At this time, each solder beam element representing the solder expands and contracts in accordance with the distance between the substrate of the arranged joint and the component.

  The reflow analysis result determination unit 144 uses the threshold data stored in the threshold data storage unit 250 to determine whether there is a problem with the warping of the substrate that has occurred as a result of the reflow analysis.

  For example, in the threshold data stored in the threshold data storage unit 250, a threshold value for determining a solder bridging defect and a threshold value for determining a solder open defect are set for each component as the threshold value of the solder connection shape. It shall be.

  If the distance between the substrate and the component is too short at a certain joint, that is, if the substrate and the component are too close, the solder may be crushed and spread between the substrate and the component, resulting in a bridging failure. In the threshold data of the present embodiment, a threshold value indicating an allowable lower limit of the distance between the board and the component at the joint is set as a criterion for determining the possibility of bridging failure. The reflow analysis result determination unit 144 determines that there is a possibility that a bridging failure may occur at the joint when the distance between the board and the component is lower than the threshold indicating the lower limit. It is determined that

  Further, if the distance between the substrate and the component is too long at a certain joint, that is, if the substrate and the component are too far apart, there is a possibility that the amount of solder becomes insufficient and an open defect may occur. In the threshold data of the present embodiment, a threshold value indicating an allowable upper limit of the distance between the board and the component at the joint is set as a criterion for determining the possibility of open failure. The reflow analysis result determination unit 144 determines that an open failure may occur at the joint when the distance between the board and the component exceeds a threshold value indicating an upper limit, and the result of the reflow analysis is NG. It is determined that

  As described above, the reflow analysis result determination unit 144 determines whether the distance between the board and the component in the joint is within the range from the set predetermined lower limit threshold to the upper limit threshold in the analysis model after execution of the reflow analysis. Determine.

  For example, in this embodiment, solder beam elements are arranged between the substrate and the components at each joint portion of the analysis model. Since the height of the solder beam element expands and contracts according to the distance between the substrate and the component, the distance between the substrate and the component at the joint portion of the analysis model is the height of the solder beam element. At this time, the reflow analysis result determination unit 144 determines whether the height of the solder beam element at the joint is within a predetermined range in the analysis model after the reflow analysis is performed.

  The threshold value for determining the height of the solder beam element may be, for example, a threshold value of the expansion / contraction amount of the solder beam element in the analysis model after the reflow analysis is performed on the solder beam element in the analysis model before the reflow analysis is performed. Further, for example, the threshold value for determining the height of the solder beam element may be a threshold value of the expansion / contraction rate of the solder beam element of the analysis model after execution of the reflow analysis with respect to the solder beam element in the analysis model before execution of the reflow analysis.

  The reflow analysis result determination unit 144 determines that there is no problem in the warping of the substrate when the distance between the substrate and the component is within a predetermined range at all the joints, and sets the analysis model after the reflow analysis is performed. Store in the reflow analysis result storage unit 150. The reflow analysis result determination unit 144 determines that there is a problem in the warping of the substrate when the distance between the substrate and the component is outside a predetermined range at any of the joints.

  The warp countermeasure processing unit 145 executes a countermeasure process using an appropriate technique for suppressing or dealing with the warpage of the board when the distance between the board and the component at any of the joints is outside a predetermined range. The warp countermeasure processing unit 145 stores information indicating the result of the executed countermeasure processing in the warp countermeasure result storage unit 149. The warp countermeasure processing unit 145 includes a solid wiring pattern removal processing unit 146, a pin jig installation processing unit 147, and a solder amount change processing unit 148.

  The solid wiring pattern removal processing unit 146 executes countermeasure processing using a warp suppression method by removing a pattern of a solid wiring layer on the substrate warp analysis model stored in the substrate warp analysis model storage unit 142. The warp suppression technique by removing the pattern of the solid wiring layer is a technique for suppressing the warpage of the substrate that occurs during reflow by changing the material of the region of the predetermined pattern in the solid wiring layer of the substrate. The solid wiring pattern removal processing unit 146 executes processing for changing the material of a partial region in the solid wiring layer of the substrate with respect to the substrate warp analysis model stored in the substrate warp analysis model storage unit 142.

  For example, the solid wiring pattern removal processing unit 146 extracts a region in which a predetermined displacement or more is detected in the analysis model after the reflow analysis is performed. In addition, the solid wiring pattern removal processing unit 146 refers to the changeable area data stored in the changeable area data storage unit 260 and acquires information on a region where the material can be changed in the solid wiring layer of the substrate. . The solid wiring pattern removal processing unit 146 performs processing for changing the material of a partial region in the region of the solid wiring layer in which the material can be changed, including a region where a displacement of a predetermined amount or more is detected. This is executed for the substrate warp analysis model stored in the model storage unit 142. The solid wiring pattern removal processing unit 146 stores information on a region where the material is changed in the warp countermeasure result storage unit 149.

  The pin jig installation processing unit 147 performs countermeasure processing using a warp suppression method by pin jig installation on the substrate warp analysis model stored in the substrate warp analysis model storage unit 142. The warpage suppression technique by installing a pin jig is a technique for suppressing the warpage of the substrate by installing a jig that suppresses the warpage of the substrate during reflow. The pin jig installation processing unit 147 performs a process of setting a rigid element simulating a jig that suppresses the displacement of the substrate during reflow for the substrate warpage analysis model stored in the substrate warpage analysis model storage unit 142. Execute.

  For example, the pin jig installation processing unit 147 extracts an area in which a predetermined displacement or more is detected in the analysis model after execution of the reflow analysis. Further, the pin jig installation processing unit 147 refers to the component data stored in the component data storage unit 220, and information on the mounting position of the component on the board, for example, information on the surface and area on which the component is mounted on the board. To get. The pin jig installation processing unit 147 performs a process of installing a predetermined rigid element that suppresses displacement in an area where a displacement greater than a predetermined amount is detected and in an area where it is determined that no component is mounted. This is executed for the substrate warp analysis model stored in the analysis model storage unit 142. Note that the information on the rigid element imitating the jig is recorded in the jig data stored in the jig data storage unit 270. The pin jig installation processing unit 147 stores information on a position where a predetermined rigid element is installed in the warp countermeasure result storage unit 149.

  The solder amount change processing unit 148 applies a countermeasure using a warping countermeasure technique by changing the solder amount to the substrate warp analysis model stored in the substrate warp analysis model storage unit 142. The warping countermeasure method by changing the amount of solder can be applied to the warpage of the board or component by changing the solder amount at the joint between the board and the component, which is estimated to result in open failure or bridging failure as a result of reflow execution. It is a technique to deal with. The solder amount change processing unit 148 changes the solder amount of the joint between the board and the component with respect to the board warp analysis model stored in the board warp analysis model storage unit 142, and the changed solder amount Execute the process to be reflected in the copy.

  For example, the solder amount change processing unit 148 extracts a joint where the distance between the board and the component is outside a predetermined range in the analysis model after the reflow analysis is performed. You may hold | maintain the junction part determined by the determination by the reflow analysis result determination part 144 that the distance of a board | substrate and components is out of a predetermined range.

  The solder amount change processing unit 148 generates a new solder beam element corresponding to the volume change of the solder beam element expanded and contracted by executing the reflow analysis for the extracted joint. The solder amount change processing unit 148 performs a process of changing the original solder beam element arranged in the board warpage analysis model stored in the board warpage analysis model storage unit 142 to the generated new solder beam element. Execute. The solder amount change processing unit 148 includes a solder beam element generation unit (not shown) that generates solder beam elements.

  Further, the solder amount change processing unit 148 obtains a new solder volume corresponding to the volume change of the solder beam element expanded and contracted by executing the reflow analysis for the extracted joint. Based on the new solder volume, the solder amount change processing unit 148 executes a process for obtaining a mask opening ratio or a printed solder diameter at the joint of the mask used for printing the solder paste on the substrate. The solder amount change processing unit 148 stores the obtained mask opening ratio or printed solder diameter information in the warp countermeasure result storage unit 149.

  The warp countermeasure result storage unit 149 is a storage unit accessible by a computer that stores information indicating the result of the warp countermeasure. The information indicating the result of the warp countermeasure process is information indicating the result of the countermeasure process against the warp of the board executed by the warp countermeasure processing unit 145.

  The warp countermeasure result stored in the warp countermeasure result storage unit 149 can be output on a display, printed out, or copied to a portable recording medium according to a user instruction. It is.

  By reflecting the results of the warp countermeasures by the simulation of the present embodiment in the actual substrate manufacturing process and reflow process, the actual substrate warpage can be suppressed and dealt with.

  FIG. 3 is a diagram illustrating a configuration example of hardware for realizing the mounting board analyzing apparatus according to the present embodiment.

  A mounting board analyzing apparatus 100 of the present embodiment shown in FIG. 1 includes, for example, a CPU (Central Processing Unit) 11, a main memory 12, a storage device 13, a communication device 14, a medium reading / writing device 15, an input. This is realized by the computer 10 including the device 16, the output device 17, and the like. The storage device 13 is, for example, an HDD (Hard Disk Drive). The medium reading / writing device 15 is, for example, a CD-R drive or a DVD-R drive. The input device 16 is, for example, a keyboard or a mouse. The output device 17 is a display, for example.

  The mounting board analyzing apparatus 100 shown in FIG. 1 and each functional unit included in the mounting board analyzing apparatus 100 can be realized by hardware such as the CPU 11 and the memory 12 provided in the computer 10 and a software program. A program that can be executed by the computer 10 is stored in the storage device 13, read into the memory 12 at the time of execution, and executed by the CPU 11.

  The computer 10 can also read a program directly from a portable recording medium and execute processing according to the program. In addition, each time the program is transferred from the server computer, the computer 10 can sequentially execute processing according to the received program. Furthermore, this program can be recorded on a recording medium readable by the computer 10.

  FIG. 4 is a diagram illustrating an example of component data according to the present embodiment.

  The mounted component data 225 illustrated in FIG. 4A and the individual component detailed data 226 illustrated in FIG. 4B are examples of component data stored in the component data storage unit 220. Although not shown here, the part data storage unit 220 also stores three-dimensional shape data of each part mounted on the board as a part of the part data.

  The mounted component data 225 shown in FIG. 4A is data of components to be mounted on a substrate to be simulated. The mounted component data 225 shown in FIG. 4A includes information such as a component name, a mounting surface, a mounting position, and a component size.

  In the mounted component data 225 shown in FIG. 4A, the component name indicates the name of the component mounted on the board. The mounting surface indicates the surface of the board on which the component is mounted. The mounting position indicates the coordinate (x, y) in the plane direction in the model of the board on which the component is mounted. The component size indicates the component size in the surface direction in the board model.

  Individual component detailed data 226 shown in FIG. 4B is an example of detailed data of each component mounted on the board. The individual component detailed data 226 shown in FIG. 4B is an example of detailed data for the component indicated by the component name “bbbb” in the mounted component data 225 shown in FIG.

  As shown in FIG. 4B, in the individual part detailed data 226, data indicating the size, data indicating the material, data indicating the physical property value, and the like are recorded for each part of the part. For example, in a solder ball part, the ball pitch, ball diameter, ball height, etc. are data indicating the size, the material is data indicating the material, and the Young's modulus, thermal expansion coefficient, etc. are data indicating the physical property values. is there.

  FIG. 5 is a diagram showing an example of components to be mounted on the board according to the present embodiment.

  FIG. 5 shows an example of the component 600 indicated by the component name “bbbb” in the mounted component data 225 shown in FIG. A part 600 shown in FIG. 5 shows an example of an actual part.

  FIG. 5A is a diagram of a part 600 having a part name “bbbb” as viewed from the side. FIG. 5B is a view of the part 600 having the part name “bbbb” as viewed from the bottom. The bottom surface of the component 600 is the surface facing the mounting destination board. Solder balls 610 are attached to the bottom surface of the component 600 at a predetermined pitch.

  FIG. 5C shows the structure of a part on the component 600 where the solder ball 610 is attached. Each part of the solder ball 610, the Cu post 620, the chip 630, and the resin 640 shown in FIG. 5C corresponds to each part in the individual component detailed data 226 shown in FIG. 4B.

  FIG. 6 is a diagram showing an example of mask data according to the present embodiment.

  The mask data 235 illustrated in FIG. 6 is an example of mask data stored in the mask data storage unit 230. The mask data 235 illustrated in FIG. 6 includes information such as a mask thickness, a printing surface, a printing position, and a printed solder diameter.

  In the mask data 235 shown in FIG. 6, the mask thickness is the thickness of the mask for printing the solder paste on the substrate. The printed surface indicates the surface of the substrate on which the solder paste is printed using a mask. The printing position indicates the coordinate (x, y) in the surface direction in the model of the board of the joint where the solder paste is printed. The printed solder diameter indicates the diameter of the mask opening, that is, the diameter of the solder paste printed on the joint on the substrate.

  FIG. 7 is a diagram illustrating an example of a solder table according to the present embodiment.

  A solder table 245 illustrated in FIG. 7 is an example of a solder table stored in the solder table storage unit 240.

  In the solder table 245 shown in FIG. 7, BGA (Ball grid array) information indicates information related to solder balls attached to the components. The substrate information indicates information related to the bonding portion of the substrate. The supplied solder information indicates information on the solder paste to be printed on the board. Solder information after mounting indicates information on solder bumps after reflow according to the combination of solder balls and solder paste.

  In the BGA information of the solder table 245 shown in FIG. 7, the warpage amount indicates the warpage amount of the component to which the solder ball is attached. The ball mounting diameter indicates the diameter of the solder ball mounting portion on the component chip. The ball diameter indicates the maximum diameter of the solder ball. The ball volume indicates the volume of the solder ball. The ball height indicates the height from the solder ball mounting site to the tip that contacts the solder paste on the board. Ball pitch indicates the distance between solder balls on a part.

  In the board information of the solder table 245 shown in FIG. 7, the land diameter indicates the diameter of the land provided at the joint on the board.

  In the supplied solder information of the solder table 245 shown in FIG. 7, the printed solder diameter indicates the diameter of the mask opening, that is, the diameter of the solder paste printed on the land. The thickness of the mask indicates the thickness of the solder paste. The solder volume in the supplied solder information indicates the volume of solder by the solder paste after the reflow is executed. Since the solder paste contains flux, the volume of the solder paste before the reflow is not equal to the volume of the solder by the solder paste after the reflow is performed.

  In the post-mounting solder information of the solder table 245 shown in FIG. 7, the solder volume indicates the volume of the solder bump after execution of reflow. The average height indicates the height of the solder bump after the reflow is performed, that is, the solder joint length at the joint between the substrate and the component.

  Information indicating the relationship of solder as shown in the solder table 245 of FIG. 7 may be obtained theoretically by calculation or may be obtained from the result of an experiment.

  For example, in the supplied solder information, a reflow experiment is performed on a solder paste printed with a combination of a plurality of printed solder diameters and mask thicknesses, and the volume of solder by the solder paste after reflow is measured. From the experimental results, an approximate expression with the printed solder diameter and mask thickness as explanatory variables and the solder volume as the objective variable is obtained. There is a technique for obtaining an approximate expression from the experimental results in the existing technique, and the technique is also used in spreadsheet software. Each printed solder diameter and mask shown in the supplied solder information of the solder table 245 in FIG. 7 is calculated by substituting an arbitrary printed solder diameter and mask thickness into the approximate expression obtained from the result of such an experiment. The relationship between thickness and solder volume can be obtained. In addition to the solder volume, the solder joint length after reflow can be calculated by generating an approximate expression.

  In the present embodiment, a solder table 245 as shown in FIG. 7 is generated in advance and held in the solder table storage unit 240. By referring to the solder table 245 stored in the solder table storage unit 240 as necessary, it is possible to easily obtain various information regarding the solder at the joint between the board and the component.

  For example, referring to the solder table 245 shown in FIG. 7, the solder volume in the supplied solder information, that is, the volume of the solder paste can be obtained from information such as the printed solder diameter and the mask thickness. By referring to the solder table 245 shown in FIG. 7, the solder volume in the post-mounting solder information, that is, the joint between the board and the component is obtained from information such as the ball mounting diameter, ball diameter, printed solder diameter, and mask thickness. The volume of solder to be obtained can be obtained. It is also possible to obtain the solder joint length after reflow is performed.

  Further, for example, when the BGA information is fixed by referring to the solder table 245 shown in FIG. 7, the volume of the solder paste necessary to satisfy the solder volume in the post-mounting solder information, that is, the supplied solder information Solder volume can also be obtained. By referring to the solder table 245 shown in FIG. 7, it is possible to obtain a printed solder diameter necessary for printing a target solder paste from the solder volume of the supplied solder information. Further, the mask aperture ratio can be obtained from the relationship between the land diameter of the board information and the printed solder diameter of the supplied solder information.

  Instead of generating the solder table 245 shown in FIG. 7, by directly substituting values into the approximate expression used to generate the solder table 245, the solder volume, solder joint length, mask printed solder diameter, Information such as the mask aperture ratio may be obtained.

  FIG. 8 is a diagram showing an example of changeable area data according to the present embodiment.

  The changeable area data 265 shown in FIG. 8 is an example of changeable area data stored in the changeable area data storage unit 260. In the solid wiring layer, there are areas where the material cannot be changed, such as an area necessary for wiring, due to the design of the substrate. The changeable area data 265 shown in FIG. 8 is information in which an area where the material for each solid wiring layer can be changed is registered in advance.

  In the changeable area data 265 shown in FIG. 8, the layer indicates a solid wiring layer on the substrate to be analyzed. The area where pattern removal is possible is an area where the material can be changed. In the pattern removal possible area, the start point coordinates and end point coordinates are coordinates (x, y) along the surface direction of the substrate. In the pattern extraction possible area, a rectangular area whose diagonal is two points of the start point coordinate and the end point coordinate is an area where the material can be changed.

  FIG. 9 is a diagram illustrating an example of jig data according to the present embodiment.

  The jig data 275 shown in FIG. 9 is an example of jig data stored in the jig data storage unit 270.

  In the jig data 275 shown in FIG. 9, the diameter indicates the diameter of a pin jig that can be installed. The element type indicates the type of element that represents the pin jig on the computer. The pin jig is a jig for forcibly holding the substrate so that the substrate is not warped. In the analysis simulation, the element that represents the pin jig is an element that forcibly suppresses the displacement of the board in the analysis model, so the element type that represents the pin jig is “rigid” indicating a rigid element. It becomes.

  Hereinafter, an example of a method for suppressing or coping with the warpage of the substrate according to the present embodiment will be specifically described.

  FIG. 10 is a diagram illustrating an example of a substrate analysis model before and after execution of reflow analysis according to the present embodiment.

  A substrate model 300 shown in FIG. 10 is a side view of the three-dimensional model of the substrate portion in the substrate warpage analysis model stored in the substrate warpage analysis model storage unit 142. Hereinafter, the substrate part model in the analysis model is also referred to as a substrate model 300. As shown in FIG. 10, the displacement of the displacement amount appears in the substrate model 300 that is not displaced by warpage before the reflow analysis is performed, after the reflow analysis is performed. The displacement in the substrate model 300 represents the warp of the actual substrate.

  In the warp countermeasure processing unit 145, the solid wiring pattern removal processing unit 146 and the pin jig installation processing unit 147 execute processing for suppressing the warpage of the substrate on the substrate model 300.

  FIG. 11 and FIG. 12 are diagrams for explaining an example of a warp suppressing method by removing a pattern of a solid wiring layer according to the present embodiment.

FIG. 11A shows a part of a cross section of the substrate model 300. In FIG. 11A, L ₁ , L ₂ ,..., L ₁₀ are wiring layers, and copper is set as a material. Resin is set as a material in a layer between the wiring layers.

As shown in FIG. 11 (A), the substrate model 300, a portion of the solid wiring layer L ₂ is assumed to advance material is a region that has changed from copper resin. Since the characteristics such as thermal expansion and moisture absorption / desorption differ depending on the material, the balance of the board becomes poor at the part where the material is changed in a part of the solid wiring layer, and warpage is likely to occur during reflow.

In the warp countermeasure processing unit 145, the solid wiring pattern removal processing unit 146 extracts, from the result of the reflow analysis, a node whose displacement amount exceeds a predetermined threshold in the board model 300. Here, when the reflow analysis is performed on the board model 300 shown in FIG. 11A, a predetermined threshold value is set on the board model 300 around the area where copper is previously removed in the L ₂ solid wiring layer. It is assumed that the displacement amount exceeding is measured.

  FIG. 11B shows a region in which a displacement amount exceeding a predetermined threshold is measured in the substrate model 300 after execution of the reflow analysis. In FIG. 11B, the lattice represents a mesh in the substrate model 300. In FIG. 11B, black dots indicate nodes whose displacement amount is equal to or greater than a predetermined threshold value, and white dots indicate nodes whose displacement amount is maximum.

  The solid wiring pattern removal processing unit 146 changes the material of a partial region in the solid wiring layer of the substrate model 300 including a region where a displacement amount greater than or equal to a predetermined amount is measured. At this time, the solid wiring pattern removal processing unit 146 refers to the changeable region data stored in the changeable region data storage unit 260 and confirms the region where the material change is permitted.

  FIG. 12A shows an example of a region where the material is changed. In FIG. 12A, the lattice represents a mesh in the substrate model 300 as in FIG. 11B. In FIG. 12A, as in FIG. 11B, black dots indicate nodes whose displacement is equal to or greater than a predetermined threshold, and white dots indicate nodes whose displacement is maximum. In FIG. 12A, a hatched area indicates an area of a predetermined pattern for changing the material.

  Here, as shown in FIG. 12A, in the substrate model 300, a circular region having a predetermined radius centered on the node having the maximum displacement amount in the node region where the displacement amount of the predetermined threshold value or more is measured. Change the material from copper to resin.

  In addition, about the magnitude | size of the area which changes material, a shape, a position, and a number, arbitrary designs are possible.

  For example, the size of the circular area where the material is changed may be a circular area having a preset fixed radius, the size of the area where a displacement amount greater than a predetermined threshold is measured, or the area where the material can be changed. It is good also as a circle area of a variable radius according to the size of. The shape of the region where the material is changed need not necessarily be a circle. For example, it may be an ellipse, or may be a shape matched to a region where a displacement amount equal to or greater than a predetermined threshold is measured, or a region where the material can be changed.

  In addition, the position of the area where the material is changed is not limited to the position where the displacement is the maximum, but for example, the position closest to the center of gravity of the area where the displacement greater than the predetermined threshold is measured is the center. Any position including an area where a displacement amount greater than a predetermined value, such as a position, is measured may be used.

  Further, the number of regions for changing the material is also arbitrary. For example, the material of a predetermined number of regions may be changed with a circular pattern of a predetermined size from within a region where a displacement amount equal to or greater than a predetermined threshold is measured.

FIG. 12B shows a cross section of the substrate model 300 in which the material of the solid wiring layer is partially changed. In the example shown in FIG. 12 (B), in the displacement direction (i.e. FIG. 12 (B) downward in) L ₁₀ is the outermost solid wiring layer, the material of the partial area is changed.

  It should be noted that it is possible to arbitrarily set the solid wiring layer from which the material is preferentially changed. For example, as shown in FIG. 12B, in the substrate model 300, the material can be changed with priority in the order from the outermost solid wiring layer in the displaced direction toward the inner side. In addition, when some solid wiring layers as shown in FIG. 11A are pre-extracted, the balance is emphasized, and the material is preferentially selected from the solid wiring layers symmetrical to the pre-exclusive solid wiring layer. It can also be changed. Further, the range of the solid wiring layer whose material is changed may be limited to two layers from the outside in the direction in which the substrate is displaced.

  The solid wiring pattern removal processing unit 146 executes such processing for changing the material of a partial region in the solid wiring layer of the substrate on the substrate warp analysis model stored in the substrate warp analysis model storage unit 142. To do.

  The substrate warpage analysis processing unit 140 performs reflow on the substrate warpage analysis model stored in the substrate warpage analysis model storage unit 142 and whose material of a partial region of the substrate has been changed by the solid wiring pattern removal processing unit 146. The analysis execution unit 143 performs reflow analysis again.

  The reflow analysis result determination unit 144 determines the result of the reflow analysis again. When the problem has not been solved yet, if there is a region where the material can be changed on the substrate, the warp countermeasure processing unit 145 further changes the material of a partial region of the substrate by the solid wiring pattern removal processing unit 146. You may try.

  If the problem has not been solved yet, if there is no area where the material can be changed on the substrate, the warp countermeasure processing unit 145 executes another warp countermeasure process.

  In this way, by changing the material of a partial region in the solid wiring layer of the board with respect to the analysis model of the mounting board, it is possible to execute the countermeasure process for suppressing the warpage of the mounting board with the analysis model of the mounting board.

  FIG. 13 is a diagram for explaining an example of a warp suppressing technique by installing a pin jig according to the present embodiment.

  FIG. 13A shows an example in which the substrate 500 is held down by the pin jig 700 when the actual substrate 500 is reflowed. In the warp suppressing method by installing the pin jig, as shown in FIG. 13A, the part that is predicted to be warped of the substrate 500 is fixed so as to be suppressed by the pin jig 700, and then reflow is executed. .

  Since the pin jig 700 is a tool that suppresses the warp of the substrate 500 by pressing down, the surface on which the pin jig 700 is installed in the substrate 500 is a surface in the direction of swelling due to the warp. At this time, the pin jig 700 cannot be installed when a part is mounted on the surface side in the direction in which the board 500 is warped in the direction where the warp is expected to occur.

  In the warp countermeasure processing unit 145, the pin jig installation processing unit 147 executes a warp suppression method by pin jig installation on a simulation using an analysis model.

  The pin jig installation processing unit 147 extracts a node having a displacement amount equal to or greater than a predetermined threshold in the board model from the result of the reflow analysis. The pin jig installation processing unit 147 determines a node on which a rigid element imitating the pin jig is installed on the computer from the nodes in the region where the displacement amount is equal to or greater than a predetermined threshold. In the board model, the surface on which the rigid element imitating the pin jig is installed is a surface in the direction in which the element of the board model is displaced by reflow analysis.

  At this time, the pin jig installation processing unit 147 confirms the mounting surface and mounting position of the component with the component data stored in the component data storage unit 220. As described above, the pin jig cannot be installed at the position where the component is mounted. For this reason, the pin jig installation processing unit 147 is a surface in the direction in which the elements of the board model are displaced by the reflow analysis, and for the nodes in the area where the component mounting is set, the displacement amount of the nodes exceeds a predetermined threshold. Even nodes in the region of are not set as nodes for setting rigid elements.

  FIG. 13B shows an example in which the node having the maximum displacement is determined as the node for installing the rigid element. The upper part of FIG. 13B is a view of the substrate model 300 after the reflow analysis is viewed from the side. 13B shows a portion where the displacement amount of the substrate model 300 shown in the upper diagram of FIG. 13B is large from the lower surface of the substrate model 300 shown in the upper diagram of FIG. 13B. FIG.

  In the lower diagram of FIG. 13B, the lattice represents a mesh in the substrate model 300 as in FIG. 11B. Further, in FIG. 13B, as in FIG. 11B, black dots indicate nodes whose displacement amount is equal to or greater than a predetermined threshold, and white dots indicate nodes whose displacement amount is maximum. In FIG. 13B, the hatched area indicates a position where the rigid element is installed.

  As shown in the upper diagram of FIG. 13B, the pin jig installation processing unit 147 is a node where the displacement amount is large in the board model 300 after execution of the reflow analysis, in this case, the node where the displacement amount is not less than a predetermined threshold value. To extract. At this time, it is assumed that the extracted nodes are as shown in the lower diagram of FIG. The pin jig installation processing unit 147 determines a node having the maximum displacement among the nodes in the region where the displacement is equal to or greater than a predetermined threshold as a node for installing a rigid element imitating the pin jig.

  As for the position of the node where the rigid element imitating the pin jig is installed, any design is possible as long as the node is in a region where a displacement greater than or equal to a predetermined value is detected. For example, the node closest to the center of gravity of the region where the displacement amount is equal to or greater than a predetermined threshold may be set as the node for installing the rigid element. Further, for example, a node closest to the center of a component mounted on the opposite surface at a node in a region where the displacement is equal to or greater than a predetermined threshold may be set as a node for installing the rigid element.

  The pin jig installation processing unit 147 refers to the jig data stored in the jig data storage unit 270 and generates a rigid element imitating the pin jig. The pin jig installation processing unit 147 installs the generated rigid element at the determined node position in the substrate model 500 before execution of the reflow analysis.

  FIG. 13C shows an example of the substrate model 300 on which a rigid element 310 simulating a pin jig is installed and before the reflow analysis is executed. In the board model 300 shown in FIG. 13C, the rigid element 310 does not move from the installed position even if the reflow analysis is executed. Therefore, even if the reflow analysis is performed at the position where the rigid element 310 of the board model 300 shown in FIG. 13C is installed, the board model 300 is not displaced.

  The pin jig installation processing unit 147 performs a process for setting a rigid element that imitates a jig for suppressing the displacement of the substrate at the time of reflow execution, and a substrate warp analysis model stored in the substrate warp analysis model storage unit 142. Run against.

  In the substrate warpage analysis processing unit 140, the reflow analysis execution unit 143 applies the substrate warpage analysis model stored in the substrate warpage analysis model storage unit 142 to which the rigid element is set by the pin jig installation processing unit 147. Then, reflow analysis is performed again.

  The reflow analysis result determination unit 144 determines the result of the reflow analysis again. If the problem has not been solved yet, if there is an area where the rigid element can be set on the board, the warp countermeasure processing unit 145 further sets the rigid element on the board by the pin jig installation processing unit 147. You may try.

  If the problem has not yet been solved and there is no region where the rigid element can be set on the board, the warp countermeasure processing unit 145 executes another warp countermeasure process.

  In this way, it is possible to execute a countermeasure process to suppress the warpage of the board with the analysis model of the mounting board by setting a rigid element that imitates a jig that suppresses the displacement of the board when performing reflow on the analysis model of the mounting board. It becomes possible.

  When the analysis model after execution of the reflow analysis is stored in the reflow analysis result storage unit 150, the installed rigid element is removed.

  14 and 15 are diagrams for explaining an example of a warping countermeasure method by changing the amount of solder according to the present embodiment.

  FIG. 14A shows an example of a joint portion between the actual substrate 500 and the component 600. The left diagram in FIG. 14A shows an example of the joint portion between the substrate 500 and the component 600 before execution of reflow, and the right diagram in FIG. 14A shows the joint between the substrate 500 and the component 600 after execution of reflow. The example of a part is shown.

  In the left view of FIG. 14A, the solder ball 610 is attached in advance to the component 600 side. The solder paste 520 is printed on the land 510 of the substrate using a mask. The land 510 is a copper pad at the junction in the substrate 500.

  The solder balls 610 on the component 600 side and the solder paste 520 printed on the substrate 500 are dissolved by execution of reflow to form solder bumps 800 shown in the right diagram of FIG. The shape of the solder bump 800 after execution of reflow is determined by the volume of the solder ball 610 and the solder paste 520, the surface tension of the solder, and the like.

  The distance between the substrate 500 and the component 600 at the joint after the reflow is performed, that is, the solder joint length, is affected by the warp of the substrate 500 and the component 600 that occurs during the reflow.

  As the solder joint length increases, the amount of solder required to join the substrate 500 and the component 600 increases. Therefore, if the solder joint length is increased due to warpage of the substrate 500 or the component 600, the amount of solder initially supplied becomes insufficient, and the possibility of an open failure increases.

  If the solder joint length is shortened, the amount of solder required to join the substrate 500 and the component 600 is reduced. Therefore, if the joint length of the solder is shortened due to the warp of the substrate 500 or the component 600, the amount of solder initially supplied becomes too large, and the possibility of a bridge failure increases.

  In the warping countermeasure method by changing the amount of solder, the amount of solder for joining the substrate 500 and the component 600 is adjusted to prevent an open defect or a bridge defect due to the warp of the substrate 500 or the component 600.

  In the analysis model of this embodiment, the solder at the joint between the substrate and the component is expressed by a beam element that expands and contracts according to the distance between the substrate and the component.

  FIG. 14B shows an example of the solder beam element 320 arranged at the joint between the substrate and the component in the analysis model. A solder beam element 320 shown in FIG. 14B is a cylindrical beam element that represents the solder at the joint between the substrate and the component on the analysis model.

  The height h of the solder beam element 320 represents the distance between the substrate and the component at the joint, that is, the solder joint length. The solder beam element 320 expands and contracts in the height direction according to the distance between the substrate and the component. The volume α of the solder beam element represents the volume of solder at the joint between the substrate and the component.

  For example, information on the solder ball 610 attached to the component 600 is obtained from the component data stored in the component data storage unit 220. Further, the information of the solder paste 520 is obtained from the mask data stored in the mask data storage unit 230.

  By referring to the solder table stored in the solder table storage unit 240 based on the information of the obtained solder balls 610 and the information of the solder paste 520, the height of the solder bump 800 after reflow, that is, the solder joint length, Is obtained. For example, in the solder table 245 shown in FIG. 7, the average height of the post-mounting solder information is the height of the solder bump 800 after the reflow is performed, that is, the solder joint length. Further, in the solder table 245 shown in FIG. 7, the solder volume of the post-mounting solder information is the volume of the solder bump 800 after the reflow is executed.

When generating the solder beam element 320, the model generation unit 120 sets the obtained solder joint length to the height h of the solder beam element 320. Further, the model generation unit 120 sets the volume of the obtained solder bump 800 after execution of reflow as the volume α of the solder beam element 320. The bottom area a of the solder beam element 320 is
(Volume α of solder beam element 320) ÷ (height h of solder beam element 320)
Is required.

  FIG. 14C shows an example in which the solder beam element 320 is arranged at the joint portion of the analysis model. In FIG. 14C, a part model 330 is a part part model in the analysis model. As shown in FIG. 14, the solder beam element 320 is arranged such that one bottom surface is in contact with the substrate model 300 and the other bottom surface is in contact with the component model 330 at the joint of the analysis model. .

  When the reflow analysis is performed by the reflow analysis execution unit of the substrate warp analysis processing unit 140, the solder beam element 320 expands and contracts in the height direction according to the displacement of the substrate model 300 and the component model 330.

  FIG. 15A shows an example in which the elongation amount Δh of the height h of the solder beam element 320 after execution of the reflow analysis is a positive value, that is, Δh> 0. When the board and the component are separated due to displacement at the joint portion of the analysis model after execution of the reflow analysis, the extension amount Δh of the solder beam element 320 disposed between them is shown in FIG. Thus, it becomes a positive value. As described above, if the substrate and the component at the joint are separated by reflow, that is, if the joint length of the solder at the joint is increased, the possibility that the joint becomes an open defect increases.

  FIG. 15B shows an example in which the elongation amount Δh of the height h of the solder beam element 320 after execution of the reflow analysis is a negative value, that is, Δh <0. In the joint portion of the analytical model after the reflow analysis is performed, when the board and the component are brought close to each other due to the displacement, the extension amount Δh of the solder beam element 320 disposed between them is shown in FIG. Thus, it becomes a negative value. As described above, when the substrate and the component at the joint portion are brought close to each other by reflow, that is, when the joint length of the solder at the joint portion is shortened, there is a high possibility that the joint portion will have a bridge failure.

  In order to cope with such a situation, the solder amount change processing unit 148 of the warp countermeasure processing unit 145 changes the solder amount between the board and the component, and the changed solder amount is used as the model storage unit 142 for board warpage analysis. The process which reflects in the junction part of the board | substrate curvature analysis model memorize | stored in FIG.

  For example, the solder amount change processing unit 148 is configured such that the distance between the substrate and the component at each joint, that is, the height of the solder beam element 320 at each joint, in the model for board warpage analysis after the reflow analysis is performed by the reflow analysis execution unit 143. It is determined whether the length h + Δh is within a predetermined range.

For example, the solder amount change processing unit 148 has, for each joint, the height h + Δh of the solder beam element 320 is equal to or less than a predetermined threshold Th _Long indicating a criterion for the possibility of open failure, and the possibility of bridging failure. It is determined whether it is more than a predetermined threshold value Th _Short indicating the determination criterion. That is, the solder amount change processing unit 148 performs the following for each joint.
Th _Short ≦ h + Δh ≦ Th _Long
It is determined whether or not the above is satisfied.

Note that these threshold values Th _Long and Th _Short may be the same as the threshold values of the threshold data stored in the threshold data storage unit 250 used in the reflow analysis result determination unit 144 described above, or may be thresholds set separately. For example, the threshold values Th _Long and Th _Short are set for each pitch of components and solder balls. Further, the threshold values Th _Long and Th _Short may not be the threshold value of the height h + Δh of the solder beam element 320 but the threshold value of the elongation amount Δh or the threshold value of the elongation rate Δh / h.

The solder amount change processing unit 148 changes the amount of solder to be supplied for a joint where the height h + Δh of the solder beam element 320 is outside a predetermined range, that is, for a joint where h + Δh> Th _Long or h + Δh <Th _Short. Perform the process.

  When the reflow analysis is performed, the solder beam element 320 expands and contracts in the height direction according to the distance between the board and the component, and the bottom area a does not change. Therefore, as shown in FIG. , Changes to α 'after execution of reflow analysis.

  In an actual mounting board, the volume of the solder bump 800 does not change depending on the solder joint length. For example, depending on the expansion and contraction of the solder joint length, the thickness of the solder bump 800, the contact area with the board 500, The contact area changes. The thickness of the solder bump 800, the contact area with the substrate 500, and the contact area with the component 600 are affected by changes, and bonding defects such as an open defect and a bridge defect occur.

  The solder beam element 320 does not change the bottom area a regardless of the expansion and contraction of the height according to the distance between the substrate and the component. That is, it can be considered that the bottom area a of the solder beam element 320 is maintained in an ideal state. Assuming this, the volume α ′ of the solder beam element 320 after execution of the reflow analysis indicates the amount of solder that can avoid joint failure at the joint.

  The solder amount change processing unit 148 adjusts the mask aperture ratio or the printed solder diameter at the corresponding joint portion of the mask so that the actual volume of the solder bump 800 becomes the volume α ′ of the solder beam element 320 after the reflow analysis is performed. To do.

  Changing the volume of the solder ball 610 attached to the component 600 is not easy because it requires a change at the component manufacturer level. Therefore, when adjusting the volume of the solder bump 800 after execution of reflow, the supply amount of the solder paste 520 printed on the substrate 500 is adjusted. Also, it is not easy to adjust the mask thickness for each joint. Therefore, when adjusting the supply amount of the solder paste 520 printed on the substrate 500, the mask opening ratio and the printed solder diameter at the opening of the corresponding joint portion of the mask are adjusted.

For example, the solder amount change processing unit 148 calculates from the bottom area a and the height h + Δh of the solder beam element 320 after execution of the reflow analysis.
α ′ = a × (h + Δh)
Thus, the volume α ′ of the solder beam element 320 after execution of the reflow analysis is obtained.

  In addition, the solder amount change processing unit 148 obtains information on the solder balls 610 attached to the component 600 from the component data stored in the component data storage unit 220. Further, the solder amount change processing unit 148 obtains the mask thickness of the mask to be used from the mask data stored in the mask data storage unit 230.

  The solder amount change processing unit 148 includes a solder table stored in the solder table storage unit 240 based on the volume α ′ of the obtained solder beam element 320, information on the obtained solder ball 610, and the obtained mask thickness. Referring to, obtain the changed printed solder diameter at the relevant joint. For example, referring to the solder ball 610 information in the BGA information, the mask thickness in the supplied solder information, and the solder volume in the post-mounting solder information in the solder table 245 shown in FIG. The printed solder diameter is obtained. The obtained printed solder diameter is the changed printed solder diameter at the corresponding joint of the mask.

  As described above, the solder amount change processing unit 148 obtains the mask aperture ratio or the printed solder diameter after the change in the corresponding joint portion of the mask for the joint portion that is highly likely to cause a joint failure. The solder amount change processing unit 148 stores the obtained mask opening ratio or printed solder diameter information in the warp countermeasure result storage unit 149 as a warp countermeasure result.

  Also, the solder amount change processing unit 148 changes the solder beam element 320 at the corresponding joint portion of the board warpage analysis model stored in the board warpage analysis model storage unit 142 in accordance with the change in the supplied solder amount.

For example, the solder amount change processing unit 148 uses the volume α ′ of the solder beam element 320 after execution of the reflow analysis and the height h of the original solder beam element 320 before execution of the reflow analysis. The bottom area a ′ is obtained. The bottom area a ′ of the new solder beam element 320 is
a ′ = α ′ / h = a × (h + Δh) / h
Is required.

  The solder amount changing processing unit 148 generates a solder beam element 320 having a height h of the original solder beam element 320 and a new bottom area a ′. The solder amount change processing unit 148 changes the original solder beam element 320 at the corresponding joint of the board warpage analysis model stored in the board warpage analysis model storage unit 142 to the generated new solder beam element 320. .

  As described above, by the process of changing the solder amount with respect to the analysis model of the mounting board, it is possible to execute the countermeasure process for dealing with the warping of the board or the component with the analysis model of the mounting board.

  FIG. 16 is a mounting board analysis processing flowchart by the mounting board analyzing apparatus of the present embodiment.

  In the mounting board analyzing apparatus 100, the model generation unit 120 generates a three-dimensional board model indicating the shape of the board to be analyzed on the computer based on the board wiring diagram data and board configuration data (step S10).

  The model generation unit 120 generates a mounting board model indicating the shape of the mounting board on the computer based on the three-dimensional board model and the component data (step S11). At this time, the model generation unit 120 arranges solder beam elements representing solder for joining the substrate and the component for each joint between the substrate and the component.

  The model generation unit 120 performs material definition and finite element mesh division on the mounting board model, and generates a mounting board analysis model, which is a mounting board analysis model (step S12). The generated mounting board analysis model is stored in the mounting board analysis model storage unit 130.

  In the board warpage analysis processing section 140, the board warpage analysis model generation section 141 gives the constraint conditions, load conditions, physical property values, etc. set for the mounting board analysis model, and the reflow analysis conditions are set. A substrate warp analysis model, which is a substrate analysis model, is generated (step S13). The generated substrate warp analysis model is stored in the substrate warp analysis model storage unit 142.

  The reflow analysis execution unit 143 executes the reflow analysis using the substrate warp analysis model stored in the substrate warp analysis model storage unit 142 (step S14).

  The reflow analysis result determination unit 144 determines whether the reflow analysis result is OK (step S15). For example, the reflow analysis result determination unit 144 refers to the threshold value data, and in the analysis model after the flow analysis is performed, the distance between the board and the component in the joint portion is a range from the set lower limit threshold to the upper limit threshold. It is determined whether it is within. The reflow analysis result determination unit 144 determines that the reflow analysis result is OK if the distance between the substrate and the component in all the joints is within a range from a predetermined lower limit threshold to an upper limit threshold. The reflow analysis result determination unit 144 determines that the reflow analysis result is NG if the distance between the substrate and the component at any of the joints is outside the range from the predetermined lower limit threshold to the upper limit threshold.

  If the reflow analysis result is OK (YES in step S15), the substrate warpage analysis processing unit 140 records the reflow analysis result in the reflow analysis result storage unit 150 (step S17). Here, the substrate warpage analysis processing unit 140 stores the analysis model after execution of the reflow analysis in the reflow analysis result storage unit 150 as the reflow analysis result. The reliability evaluation analysis unit 160 uses the analysis model after execution of the reflow analysis stored in the reflow analysis result storage unit 150 to execute a simulation of reliability evaluation analysis such as temperature cycle and drop impact (step S18).

  If the reflow analysis result is not OK (NO in step S15), that is, if the reflow analysis result is NG, the substrate warpage analysis processing unit 140 executes warpage countermeasure processing (step S16). Details of the warp countermeasure processing will be described later. The substrate warpage analysis processing unit 140 records the reflow analysis result after execution of the warp countermeasure processing in the reflow analysis result storage unit 150 (step S17). Here, the substrate warpage analysis processing unit 140 stores the analysis model after execution of the reflow analysis in the reflow analysis result storage unit 150 as the reflow analysis result. The reliability evaluation analysis unit 160 uses the analysis model after execution of the reflow analysis stored in the reflow analysis result storage unit 150 to execute a simulation of reliability evaluation analysis such as temperature cycle and drop impact (step S18).

  The flow of warp countermeasure processing by the substrate warpage analysis processing unit 140 in the mounting board analyzing apparatus 100 of the present embodiment will be described with reference to FIGS.

  Here, an example will be described in which, when the result of the reflow analysis is NG, processing is preferentially performed in the order of solid wiring pattern removal processing, pin jig installation processing, and solder change processing. It should be noted that which warp countermeasure processing is given priority is arbitrary. The priority order of the warp countermeasure processing may be determined in advance, or may be designated by the operator at the start of analysis execution.

  In addition, if a warp problem cannot be completely solved even if a certain warp countermeasure process is executed, the process may proceed to the next warp countermeasure process while leaving the result of the previous warp countermeasure process. The result of the warp countermeasure process may be reset and the process proceeds to the next warp countermeasure process. Here, if a warp problem cannot be completely solved even if a certain warp countermeasure process is executed, the process proceeds to the next warp countermeasure process while leaving the result of the previous warp countermeasure process.

  FIG. 17 is a flowchart of a solid wiring pattern removal process performed by the substrate warp analysis processing unit of the present embodiment.

  Here, only the outermost solid wiring layer in the direction in which the substrate is displaced in the analysis model after the reflow analysis is executed is set as the solid wiring layer to be changed.

  In the board warpage analysis processing unit 140, the solid wiring pattern removal processing unit 146 of the warp countermeasure processing unit 145 extracts a node having a displacement amount greater than or equal to a predetermined value from the result of reflow analysis, that is, the analysis model after execution of the reflow analysis ( Step S100).

  The solid wiring pattern removal processing unit 146 refers to the changeable region data stored in the changeable region data storage unit 260 and acquires information on the region where the material can be changed (step S101).

  The solid wiring pattern removal processing unit 146 determines whether there is a region where the material can be changed in a predetermined pattern centered on the extracted node (step S102). Here, the solid wiring pattern removal processing unit 146 determines, for each extracted node, whether or not a predetermined pattern centered on the node is included in an area where the material can be changed. Note that the area where the material change has already been set is not included in the area where the material change is allowed.

  If there is no region where the material can be changed in the predetermined pattern (NO in step S102), the substrate processing analysis processing unit 140 proceeds to the pin jig installation processing by the pin jig installation processing unit 147 of the warp countermeasure processing unit 145.

  If there is an area where the material can be changed in the predetermined pattern (YES in step S102), the solid wiring pattern removal processing unit 146 changes the material of the area of the predetermined pattern around the extracted node in the solid wiring layer to resin. (Step S103). The analysis model to be subjected to material change here is a substrate warp analysis model stored in the substrate warp analysis model storage unit 142, that is, an analysis model before execution of the reflow analysis. The solid wiring pattern removal processing unit 146 changes the material of the mesh element in the region of the predetermined pattern centered on the extracted node in the solid wiring layer to be changed from copper to resin in the substrate warp analysis model. The central node of the pattern area to be changed is, for example, the node having the maximum displacement. When the material is further changed, for example, the extracted node closest to the node having the maximum displacement is set as the center node of the pattern region to be changed under the condition that the change regions do not overlap.

  The warp countermeasure processing unit 145 records the information of the area where the material has been changed in the warp countermeasure result storage unit 149 as the warp countermeasure processing result (step S104).

  The reflow analysis execution unit 143 executes the reflow analysis using the substrate warpage analysis model stored in the substrate warpage analysis model storage unit 142 in which the material of a partial region in the solid wiring layer of the substrate is changed ( Step S105).

  The reflow analysis result determination unit 144 determines whether the reflow analysis result is OK (step S106). This process is the same as the process of step S15 in FIG.

  If the reflow analysis result is not OK (NO in step S106), that is, if the reflow analysis result is NG, the board warpage analysis processing unit 140 returns to the process in step S100, and further changes the material in the solid wiring layer of the board. Try.

  If the reflow analysis result is OK (YES in step S106), the substrate warp analysis processing unit 140 ends the warp countermeasure process and proceeds to the process in step S17 in FIG.

  FIG. 18 is a flowchart of the pin jig installation processing by the substrate warpage analysis processing unit of the present embodiment.

  In the substrate warp analysis processing unit 140, the pin jig installation processing unit 147 of the warp countermeasure processing unit 145 extracts a node having a displacement amount greater than or equal to a predetermined value from the reflow analysis result, that is, the analysis model after the reflow analysis is executed ( Step S110).

  The pin jig installation processing unit 147 refers to the component data stored in the component data storage unit 220, and acquires information on the mounting position of each component (step S111).

  The pin jig installation processing unit 147 determines whether there is a node at which the pin jig can be installed among the extracted nodes (step S112). Here, the pin jig installation processing unit 147 determines whether or not a component is mounted on the surface in the displaced direction for each extracted node from the information on the mounting position of the component.

  If there is no node at which the pin jig can be installed (NO in step S112), the substrate processing analysis processing unit 140 proceeds to a solder amount changing process by the solder amount changing processing unit 148 of the warp countermeasure processing unit 145.

  If there is a node on which the pin jig can be installed (YES in step S112), the pin jig installation processing unit 147 installs a predetermined rigid element at the position of the extracted node (step S113). Here, the analysis model to which the rigid element is to be installed is a substrate warp analysis model stored in the substrate warp analysis model storage unit 142, that is, an analysis model before execution of the reflow analysis. Information about the rigid element to be installed is obtained from the jig data stored in the jig data storage unit 270. The node where the rigid element is installed is, for example, the node having the maximum displacement.

  The warp countermeasure processing unit 145 records the information on the position where the rigid element is installed in the warp countermeasure result storage unit 149 as the warp countermeasure processing result (step S114).

  The reflow analysis execution unit 143 executes the reflow analysis using the substrate warp analysis model in which the rigid elements are installed, which is stored in the substrate warp analysis model storage unit 142 (step S115).

  The reflow analysis result determination unit 144 determines whether the reflow analysis result is OK (step S116). This process is the same as the process of step S15 in FIG.

  If the reflow analysis result is not OK (NO in step S116), that is, if the reflow analysis result is NG, the substrate warpage analysis processing unit 140 returns to the process in step S110 and further attempts to install a rigid element.

  If the reflow analysis result is OK (YES in step S116), the board warpage analysis processing unit 140 ends the warp countermeasure process and proceeds to the process in step S17 in FIG.

  FIG. 19 is a flowchart of a solder amount changing process by the board warpage analysis processing unit of the present embodiment.

  In the board warpage analysis processing section 140, the solder amount change processing section 148 of the warpage countermeasure processing section 145 selects one joint from the result of reflow analysis, that is, the analysis model after execution of the reflow analysis (step S120).

  The solder amount change processing unit 148 determines whether the height of the solder beam element as an analysis result in the selected joint, that is, the distance between the board and the component in the selected joint is within a predetermined range ( Step S121).

  If the height of the solder beam element as the analysis result is within the predetermined range (YES in step S121), the solder amount change processing unit 148 proceeds to the process in step S126.

  If the height of the solder beam element as the analysis result is not within the predetermined range (NO in step S121), that is, if the height of the solder beam element as the analysis result is out of the predetermined range, the solder amount change processing unit 148 , The following steps S122 to S125 are performed.

  The solder amount change processing unit 148 obtains the mask opening ratio or the printed solder diameter at the joint portion of the mask on which the solder paste is printed based on the volume of the solder beam element as the analysis result (step S122). Here, the supply amount of the solder paste at the corresponding joint is changed according to the volume of the solder beam element as the analysis result. For example, the solder amount change processing unit 148 acquires solder ball information at the corresponding joint from the component data stored in the component data storage unit 220, and mask thickness information is stored in the mask data storage unit 230. Get from data. The solder amount change processing unit 148 refers to the solder table stored in the solder table storage unit 240 based on the volume of the solder beam element as an analysis result and information on the acquired solder ball and mask thickness. Obtain the mask aperture ratio or printed solder diameter.

  The warp countermeasure processing unit 145 records the obtained mask aperture ratio or printed solder diameter information as a warp countermeasure processing result in the warp countermeasure result storage unit 149 (step S123).

  Also, the solder amount change processing unit 148 generates a new solder beam element based on the volume of the solder beam element as a result of analysis (step S124). Here, a new solder beam element is generated in accordance with the change in the supply amount of the solder paste. For example, the solder amount change processing unit 148 generates a new solder beam element from the volume of the solder beam element as the analysis result and the height of the solder beam element before execution of the reflow analysis.

  The solder amount change processing unit 148 converts the solder beam element of the corresponding joint in the board warpage analysis model before execution of the reflow analysis stored in the board warpage analysis model storage unit 142 into the generated new solder beam element. Change (step S125).

  The solder amount change processing unit 148 determines whether the processing has been completed for all joints in the analysis model after the reflow analysis is performed (step S126).

  If the processing has not been completed for all the joint portions (NO in step S126), the solder amount change processing portion 148 returns to the processing in step S120 and proceeds to the processing for the next joint portion.

  If the processing has been completed for all the joints (YES in step S126), the reflow analysis execution unit 143 stores the board warp analysis for the board warp analysis in which the solder beam element is changed, which is stored in the board warp analysis model storage unit 142. A reflow analysis is executed using the model (step S127).

  The board warpage analysis processing unit 140 ends the warpage countermeasure process and proceeds to the process of step S17 in FIG.

  In the mounting board analyzing apparatus 100 according to the present embodiment described above, the board warpage analysis processing unit 140 repeatedly performs warpage evaluation and countermeasures in a simulation using the analysis model of the mounting board to take measures against the problem of warpage. A model for analyzing the mounting board after execution of the reflow analysis is obtained. In the mounting board analyzing apparatus 100 shown in FIG. 1, it is possible to directly perform a simulation of reliability evaluation analysis such as temperature cycle and drop impact using the mounting board analysis model obtained after execution of the reflow analysis.

  Thus, it is not necessary to return the work to the board design each time the mounting board warpage is evaluated by the mounting board analyzing apparatus 100 according to the present embodiment, so that the time spent for countermeasures against the warping of the mounting board can be reduced. This makes it possible to shorten the time required for reliability evaluation analysis.

  Although the present embodiment has been described above, the present invention can naturally be modified in various ways within the scope of the gist thereof.

  For example, in the present embodiment, the changeable area data stored in the changeable area data storage unit 260 is information on the area where the material can be changed, but the changeable area data is prohibited from changing the material. It may be data of the area. When the changeable area data is data of an area where the change of the material is prohibited, an area other than the area where the change of the material is prohibited is a region where the material can be changed.

DESCRIPTION OF SYMBOLS 100 Mounting board analysis apparatus 110 Board wiring diagram data storage part 120 Model generation part 130 Mounting board analysis model storage part 140 Board warpage analysis processing part 141 Board warpage analysis model generation part 142 Board warpage analysis model storage part 143 Reflow analysis execution Unit 144 Reflow analysis result determination unit 145 Warpage countermeasure processing unit 146 Solid wiring pattern removal processing unit 147 Pin jig installation processing unit 148 Solder amount change processing unit 149 Warpage countermeasure result storage unit 150 Reflow analysis result storage unit 160 Reliability evaluation analysis unit 210 Substrate configuration data storage unit 220 Component data storage unit 230 Mask data storage unit 240 Solder table storage unit 250 Threshold data storage unit 260 Changeable region data storage unit 270 Jig data storage unit

Claims (6)

An analysis model storage unit for storing an analysis model of the board on which the component is mounted;
A reflow analysis execution unit that executes a reflow simulation for joining the joint between the substrate and the component with solder to the analysis model stored in the analysis model storage unit;
A reflow analysis result determination unit for determining whether the distance between the substrate and the component at the joint is within a predetermined range in the analysis model after the simulation is performed;
When the distance between the substrate and the component at the joint is outside a predetermined range, at least a material of a partial region in the solid wiring layer of the substrate with respect to the analysis model stored in the analysis model storage unit To change the amount of solder at the joint between the board and the component, and to reflect the changed amount of solder on the joint A substrate warpage countermeasure processing unit that executes any of the processes to be performed;
A mounting board analyzing apparatus comprising: a warping countermeasure result storage section for storing information indicating a result of processing executed by the board warpage countermeasure processing section. A changeable region information storage unit for storing changeable region information indicating a material changeable region in the solid wiring layer of the substrate;
In the process of changing the material of a partial region in the solid wiring layer of the substrate by the substrate warp countermeasure processing unit,
In the area of the solid wiring layer in which the material can be changed by the changeable area information stored in the changeable area information storage unit, including the area in which the displacement of a predetermined level or more is detected in the analysis model after the simulation is executed The process of changing the material of a partial area of the analysis model is executed on the analysis model stored in the analysis model storage unit,
The mounting board analyzing apparatus according to claim 1, wherein information on a region where the material is changed is stored in the warp countermeasure result storage unit. A component information storage unit for storing component information including information on a mounting position of the component on the board;
In the process of setting a rigid element that imitates a jig that suppresses displacement of the substrate during reflow execution by the substrate warpage countermeasure processing unit,
Displacement is suppressed in an area where a predetermined displacement or more is detected in the analysis model after execution of the simulation, and in an area where a part is determined not to be mounted based on the part information stored in the part information storage unit. A process of installing a predetermined rigid element is executed on the analysis model stored in the analysis model storage unit,
The mounting board analyzing apparatus according to claim 1 or 2, wherein information on a position where the predetermined rigid element is installed is stored in the warp countermeasure result storage unit. In the analysis model stored in the analysis model storage unit, the circuit board and the component generated on the basis of the joint length and volume of the solder used in the joint are connected to the circuit board and the component. Solder beam elements that expand and contract in response to changes in distance are arranged.
In the processing of changing the solder amount of the joint between the board and the component by the substrate warpage countermeasure processing unit and reflecting the changed solder amount in the joint, the analysis model after the simulation is executed is performed between the substrate and the component. For joints where the distance is outside the specified range,
A new solder beam element corresponding to the volume change of the solder beam element expanded and contracted by the execution of the simulation is generated, and the original solder beam element arranged in the analysis model stored in the analysis model storage unit is Execute the process to change to the new solder beam element generated,
Processing for obtaining a mask opening ratio or a printed solder diameter at the joint portion of the mask used for printing the solder paste on the substrate based on the new solder volume corresponding to the volume change of the solder beam element expanded and contracted by the execution of the simulation And
The mounting board analyzing apparatus according to any one of claims 1 to 3, wherein information on the obtained mask aperture ratio or printed solder diameter is stored in the warpage countermeasure result storage unit. Computer
Performing a reflow simulation for joining the joint between the board and the component with solder on the analysis model of the board on which the component is mounted, which is stored in a storage unit accessible by the computer;
In the analysis model after execution of the simulation, a process of determining whether the distance between the board and the component at the joint is within a predetermined range;
When the distance between the board and the component at the joint is outside a predetermined range, the material of at least a part of the solid wiring layer of the board is changed with respect to the analysis model stored in the storage unit. Processing to set a rigid element that mimics the jig that suppresses displacement of the board when executing processing or reflow, or to change the solder amount at the joint between the board and the component, and to reflect the changed solder amount to the joint The process of doing either,
A process of executing a simulation assuming reflowing for the analysis model stored in the storage unit after executing the processing;
A method for analyzing a mounting board, comprising: storing information indicating a result of the executed process in a storage unit accessible by the computer. Computer
A procedure for executing reflow simulation for joining a joint between a board and a component by soldering to a model for analyzing a board on which the component is mounted, stored in a storage unit accessible by the computer;
In the analysis model after execution of the simulation, a procedure for determining whether the distance between the board and the component at the joint is within a predetermined range;
When the distance between the board and the component at the joint is outside a predetermined range, the material of at least a part of the solid wiring layer of the board is changed with respect to the analysis model stored in the storage unit. Processing to set a rigid element that mimics the jig that suppresses displacement of the board when executing processing or reflow, or to change the solder amount at the joint between the board and the component, and to reflect the changed solder amount to the joint The procedure to do either,
A procedure for executing a simulation assuming reflowing on the analysis model stored in the storage unit after executing the processing;
A mounting board analysis program for executing a procedure for storing information indicating a result of the executed processing in a storage unit accessible by the computer.

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