JP2012098468A - Method for surface processing on electrophotographic photoreceptor and method for manufacturing electrophotographic photoreceptor with processed surface - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for surface processing on an electrophotographic photoreceptor for obtaining an electrophotographic photoreceptor having high uniformity of a surface profile by using a sheet type mold member in a flexible state.SOLUTION: A surface of a sheet type mold member is pressed to a surface of a cylindrical electrophotographic photoreceptor while rotating the electrophotographic photoreceptor so as to transfer the surface profile of the mold member to the surface of the electrophotographic photoreceptor. In this process, the electrophotographic photoreceptor and the mold member are laid in such a manner that, in a cross section perpendicular to the rotation axis of the electrophotographic photoreceptor, an angle θ formed by a line segment (A) and a line segment (B) is 5° or more, where the line segment (A) connects the center of the rotation axis of the photoreceptor and a contact start point where the surface of the mold member starts to be in contact with the surface of the photoreceptor and the line segment (B) connects the center of the rotation axis of the photoreceptor and a release point where the surface of the mold member starts to detach from the surface of the photoreceptor; and the mold member is pulled in a rotating direction of the electrophotographic photoreceptor at the release point.

Description

  The present invention relates to a surface processing method for an electrophotographic photosensitive member and a method for manufacturing a surface processed electrophotographic photosensitive member.

  In order to effectively reduce the frictional force on the surface of the electrophotographic photosensitive member, it is preferable to precisely control the surface shape of the electrophotographic photosensitive member.

  As a surface processing method for an electrophotographic photosensitive member, Patent Document 1 discloses a technique in which a mold member having an uneven shape on the surface is brought into contact with the surface of the electrophotographic photosensitive member to perform compression molding.

  Patent Document 2 discloses a surface processing method improved in terms of temperature control and uniform contact pressure.

JP 2001-66814 A JP 2007-233356 A

  However, in the surface processing method of Patent Document 1, the reproducibility of the surface shape of the electrophotographic photosensitive member is not sufficient. Further, since a highly rigid mold member is used, the work load such as installation at the time of replacement when the mold member is deteriorated and surface processing conditions are set large.

  On the other hand, in the surface processing method of Patent Document 2, since a sheet-like material is used as the mold member, a reduction in work load upon replacement of the mold member is expected.

  However, in the surface processing method of Patent Document 2, it is necessary to accurately fix the mold member to the support, but accurate fixing of the mold member is not easy. If the mold member is fixed with wrinkles, the uniformity and reproducibility of the surface shape of the electrophotographic photosensitive member tends to decrease.

  In addition, when the shape of the surface of the mold member is transferred (shape transfer) to the surface of the workpiece by embossing technology or nanoimprint technology, the temperature of the mold member and the workpiece are both heated and contacted. Ideally, the process of releasing (releasing) the two after the temperature has sufficiently decreased. Therefore, it is necessary to ensure a sufficient contact time between the mold member and the workpiece during shape transfer. However, in the surface processing method of Patent Document 2, since a sheet-like mold member is fixed to a flat support and used, it is difficult to ensure sufficient contact time between the mold member and the workpiece. It was. Therefore, in the surface processing method of Patent Document 2, the temperature of the mold member and the workpiece is precisely controlled and shape transfer is performed even in a short contact time. However, the surface shape of the electrophotographic photosensitive member is uniform. There is room for further improvement in terms of sex.

  An object of the present invention is to provide a surface processing method of an electrophotographic photosensitive member for obtaining an electrophotographic photosensitive member having a highly uniform surface shape by using a sheet-like mold member in a bendable state.

The present invention relates to the surface of the electrophotographic photosensitive member, wherein the surface of the electrophotographic photosensitive member is rotated while pressing the surface of the cylindrical electrophotographic photosensitive member and the surface of the sheet-shaped die member to rotate the electrophotographic photosensitive member. A surface processing method of an electrophotographic photoreceptor to be transferred to
On the cross section orthogonal to the rotation axis of the electrophotographic photosensitive member,
(1) A line segment connecting a rotation axis center of the electrophotographic photosensitive member and a contact start point at which the surface of the electrophotographic photosensitive member starts to contact the surface of the mold member is defined as a line segment A. When a line segment connecting the rotation axis center and the release point at which the surface of the mold member begins to separate from the surface of the electrophotographic photosensitive member is defined as a line segment B, an angle θ formed by the line segment A and the line segment B Disposing the electrophotographic photosensitive member and the mold member such that is 5 ° or more, and
(2) A surface processing method for an electrophotographic photosensitive member, wherein the mold member is pulled in a rotation direction of the electrophotographic photosensitive member at the release point.

  According to the present invention, it is possible to provide a surface processing method of an electrophotographic photosensitive member for obtaining an electrophotographic photosensitive member having high surface shape uniformity by using a sheet-shaped mold member in a bendable state.

It is a figure which shows an example of the surface processing apparatus for enforcing the surface processing method of the electrophotographic photoreceptor of this invention. It is a figure which shows an example of the surface processing apparatus for enforcing the surface processing method of the electrophotographic photoreceptor of this invention. It is a figure which shows an example of the surface processing apparatus for enforcing the surface processing method of the electrophotographic photoreceptor of this invention. It is the figure which expanded the surface (processed surface) of the type | mold member used for the surface processing method of the electrophotographic photoreceptor of this invention. (A) is the figure which looked at the shape of the mold member used in Example 55 from the mold member. (B) is the figure which looked at the shape of the mold member used in Example 55 from the side of the mold member. (A) is the figure which looked at the shape of the mold member used in Example 56 and 57 from the mold member. (B) is the figure which looked at the shape of the mold member used in Example 56 and 57 from the side of the mold member. (A) is the figure which looked at the shape of the mold member used in Example 64 from the mold member. (B) is the figure which looked at the shape of the mold member used in Example 64 from the side of the mold member. (A) is the figure which looked at the shape of the mold member used in Example 65 from the mold member. (B) is the figure which looked at the shape of the mold member used in Example 65 from the side of the mold member. (A) is a view showing a surface processing apparatus for an electrophotographic photosensitive member used in Reference Example 1. FIG. (B) is a view showing a surface processing apparatus for an electrophotographic photosensitive member used in Reference Example 2. FIG.

  Hereinafter, the present invention will be described in detail with reference to the drawings and examples.

  FIG. 1 is a view showing an example of a surface processing apparatus for carrying out the surface processing method of an electrophotographic photosensitive member of the present invention.

  In FIG. 1, reference numeral 1 denotes a cylindrical electrophotographic photosensitive member which is a workpiece. 2 is a sheet-like mold member. In FIG. 1, the mold member 2 is placed on a flat plate-like pressure member 3, and the surface (processed surface) of the mold member 2 is in pressure contact with the surface (processed surface) of the electrophotographic photosensitive member 1. Contact). The mold member 2 does not need to be fixed to the flat pressure member 3. A temperature control device (not shown) is installed inside the pressure member 3. The surface (processed surface) of the mold member 2 that is in pressure contact with the surface (processed surface) of the electrophotographic photoreceptor 1 corresponds to the uneven shape to be formed on the surface (processed surface) of the electrophotographic photoreceptor 1. An uneven shape is formed. The surface processing apparatus shown in FIG. 1 is used to continuously process the surface of the electrophotographic photosensitive member 1 while rotating the electrophotographic photosensitive member 1, so that the surface of the electrophotographic photosensitive member 1 has a desired function (for example, excellent in image formation). It is possible to have a concavo-convex shape having cleaning properties and electrical characteristics. In FIG. 1, o is the rotational axis center of the electrophotographic photosensitive member 1. The rotation of the electrophotographic photosensitive member 1 may be driven rotation or drive rotation. As the uneven shape to be provided on the surface of the electrophotographic photosensitive member, for example, a shape in which a cylindrical, prismatic or hemispherical convex portion is continuous, or conversely, a shape in which a cylindrical, prismatic or hemispherical concave portion is continuous Is mentioned. In addition, a shape in which convex or concave line shapes are continuous at regular or random intervals is also exemplified. The direction of the convex or concave line shape may be the circumferential direction of the cylindrical electrophotographic photosensitive member or the rotational axis direction.

  The mold member is preferably temperature-controlled from the viewpoint of ease of surface processing of the electrophotographic photosensitive member. In FIG. 1, the mold member 2 is controlled to a predetermined temperature by a temperature control device (not shown) installed inside the pressurizing member as described above. Further, the mold member 2 and the electrophotographic photosensitive member 1 are pressed and contacted at the contact start point a. The surface of the mold member 2 and the surface of the electrophotographic photosensitive member 1 always move while keeping in close contact until the release point b is reached after the pressure contact.

  In the present invention, in order to keep the state in which the mold member 2 and the electrophotographic photosensitive member 1 are in close contact with each other, a line segment connecting the rotation axis center o and the contact start point a is defined as a line segment A, and the rotation axis center o is released from the mold. When the line segment connecting the point b is a line segment B, the electrophotographic photosensitive member and the mold member are arranged so that the angle θ formed by the line segment A and the line segment B is 5 ° or more. The angle θ is more preferably 20 ° or more.

  Further, the sheet-like mold member 2 is pulled in the rotation direction of the electrophotographic photosensitive member 1 at the release point b. Here, the rotation direction is a tangential direction at the release point b of the cross-sectional circle of the electrophotographic photosensitive member 1 on the cross section orthogonal to the rotation axis of the electrophotographic photosensitive member 1 (upward to the left in FIG. 1). . In order to precisely adjust the amount and uniformity of the pulling force of the mold member 2 and the position of the release point b when the mold member 2 is pulled, as shown in FIG. A columnar support member 5 may be provided. The support member 5 may be in contact with the surface of the electrophotographic photosensitive member 1 through the mold member 2 as long as the force of pulling the mold member 2 is not hindered. The force for pulling the mold member 2 can be adjusted within a range in which the mold member 2 is not damaged and a range in which the rotation speed of the designated electrophotographic photosensitive member 1 is not hindered.

  Examples of the mold member 2 include a metal sheet having a concavo-convex shape on the surface, a resin having a concavo-convex shape patterned on the surface by a resist, a metal, a silicon wafer sheet, and a resin sheet in which particles are dispersed. Can be mentioned. Moreover, the mold member by which the metal coating was given to the resin sheet which has an uneven | corrugated shape on the surface can also be used. In addition, a mold member obtained by performing a necessary etching process after drawing a fine shape on a silicon wafer by photolithography or electron beam can also be used. Moreover, the mold member obtained by the nickel electroforming method which used as a mother die (master) what described the fine shape by laser processing etc. to resin, such as a polyimide, can also be used.

  In the surface processing apparatus shown in FIG. 1, a mold member 2 is installed between a pressure member 3 and an electrophotographic photosensitive member 1. As the electrophotographic photosensitive member 1 rotates, the surface (surface to be processed) is continuously brought into pressure contact with the surface of the mold member 2. In the surface processing apparatus shown in FIG. 1, the electrophotographic photosensitive member 1 has a holding member 4 inserted in the support.

  Examples of the material of the holding member 4 include metal, metal oxide, plastic, and glass. Among these, metals are preferable, stainless steel is more preferable, and SUS304 is more preferable from the viewpoint of mechanical strength, dimensional accuracy, and durability.

  Further, as the pressure member 3 for bringing the electrophotographic photosensitive member 1 and the mold member 2 into pressure contact, in addition to the flat plate-shaped pressure member as described above, for example, a cylindrical shape as shown in FIG. A pressure member can also be used. Alternatively, the electrophotographic photoreceptor 1 and the mold member 2 may be brought into pressure contact with each other by pressing with a pressure member from above the electrophotographic photoreceptor 1. Further, the electrophotographic photoreceptor 1 and the mold member 2 may be brought into pressure contact with a combination of various pressure members.

  In addition, when an imbalance of the applied pressure occurs between both end portions and the central portion of the cylindrical electrophotographic photosensitive member 1, an elastic layer (rubber layer) is used as a surface layer on the pressing member in order to eliminate this. Etc.) is preferably provided. Furthermore, in order to eliminate the imbalance of the pressing force in the rotation direction of the electrophotographic photosensitive member 1, a mechanism for adjusting the pressing force at any time while providing a pressure monitor with a load cell is provided. Is preferred.

  Examples of the material of the pressure member include metals, metal oxides, plastics, and glass. Among these, metals are preferable, stainless steel is more preferable, and SUS304 is more preferable from the viewpoint of mechanical strength, dimensional accuracy, and durability.

  Although the temperature control of the mold member 2 can be directly performed by a temperature control device installed outside or inside the mold member 2, as described above, the temperature control is performed on the pressure member on which the mold member is installed. By doing so, it is preferable to indirectly control the temperature of the mold member. Examples of the method for controlling the temperature of the pressure member 3 include a method of installing a temperature control device inside the pressure member 3 as described above. A temperature control device may be installed outside the pressure member 3. The temperature control device is roughly classified into a heating device and a cooling device. Examples of the heating device include a ceramic heater, a far infrared heater, a halogen heater, a cartridge heater, and an electromagnetic induction heater. Examples of the cooling device include a water cooling device and an air cooling device. These heating devices and cooling devices may be used in combination. In order to ensure temperature uniformity, it is preferable to use a temperature control device such as a temperature controller using a thermocouple. In addition, from the viewpoint of improving pressure uniformity and temperature uniformity, when the pressure member with the temperature control device installed therein is cylindrical, the diameter of the pressure member should be as large as possible without causing adverse effects. preferable.

  An electrophotographic photoreceptor basically has a support and a photosensitive layer formed on the support. Further, as the photosensitive layer, a laminated photosensitive layer in which a charge generation layer and a charge transport layer are laminated in this order from the support side is often used, and the charge transport layer may be a surface layer of an electrophotographic photoreceptor. It is common.

  Hereinafter, an electrophotographic photoreceptor in which a charge transport layer (thermoplastic charge transport layer) using a thermoplastic resin as a binder resin is a surface layer, or a surface layer that is a cured layer on the thermoplastic charge transport layer. A preferable temperature range will be described by taking the electrophotographic photosensitive member provided as an example.

  In the present invention, as the temperature range, the heating temperature of the charge transport layer at the contact start point a is Ta, the glass transition temperature of the charge transport layer is Tg, the charge transport layer at the mold release point b between the mold member and the electrophotographic photosensitive member. It is preferable to set the temperature of each member so that Tg <Ta and Tb <T2, where Tb is the maximum temperature, T1 is the drying temperature when forming the charge transport layer, and T2 is the melting point of the charge transport material. More preferably, T1 <Ta and Tb <Tg. In order to control the temperature in this way, from the viewpoint of improving the controllability of the temperature, a member (holding member 4 in FIGS. 1 to 3) having a larger heat capacity than the support of the electrophotographic photosensitive member is placed inside the support. It is preferable to insert. Further, the temperature of the support of the electrophotographic photosensitive member may be controlled by providing a mechanism for controlling the temperature of the support of the electrophotographic photosensitive member in the holding member. It is also effective to provide a cooling mechanism outside.

  Using such a configuration, by bringing the mold member 2 into contact with the surface of the electrophotographic photosensitive member 1, the width of contact between the electrophotographic photosensitive member and the mold member (distance from the contact start point a to the release point b). Can be made wider (longer). Further, by pulling the mold member, it is possible to make the mold member release timing uniform in the longitudinal direction of the cylindrical electrophotographic photosensitive member and to suppress the vibration of the mold member that occurs during the mold release. Furthermore, the surface (processed surface) of the mold member can be pressed against the surface (processed surface) of the electrophotographic photosensitive member with a uniform applied pressure. As a result, an electrophotographic photosensitive member having a highly uniform surface shape can be obtained.

  Further, by pulling the mold member with a force of 0.5 N or more per 1 cm width of the mold member, the vibration of the mold member at the time of mold release is suppressed and the surface (processed surface) of the electrophotographic photoreceptor is stable. Pressurization is possible, which is more effective for making the surface shape of the electrophotographic photosensitive member uniform.

  Next, the material, layer structure, and physical properties of the electrophotographic photosensitive member that is the workpiece will be described.

  The photosensitive layer of the electrophotographic photosensitive member may be a single-layer type photosensitive layer containing a charge transport material and a charge generation material in the same layer, or a charge generation layer containing a charge generation material and a charge transport material. It may be a laminated photosensitive layer having a charge transporting layer. Among these, a laminate type photosensitive layer is preferable from the viewpoint of electrophotographic characteristics. The laminated photosensitive layer may be a layer in which a charge generation layer and a charge transport layer are laminated in this order from the support side, or a layer in which a charge transport layer and a charge generation layer are laminated in order from the support side. Good, but the former is common. In addition, the charge generation layer may have a stacked structure, and the charge transport layer may have a stacked structure. Further, a protective layer may be formed on the photosensitive layer for the purpose of improving the durability of the electrophotographic photosensitive member.

  The support may be anything that exhibits conductivity (conductive support), for example, iron, copper, gold, silver, aluminum, zinc, titanium, lead, nickel, tin, antimony, indium, chromium, aluminum. Examples of the support include a metal (alloy) support such as an alloy or stainless steel. Further, a metal (alloy) or plastic support having a film formed by vacuum deposition of aluminum, an aluminum alloy, an indium oxide-tin oxide alloy, or the like can also be used. It is also possible to use a support made by impregnating plastic or paper with conductive resin such as carbon black, tin oxide particles, titanium oxide particles and silver particles together with a binder resin, or a support made of conductive binder resin. it can. In addition, the surface of the support may be subjected to cutting treatment, roughening treatment, anodizing treatment, or the like for the purpose of suppressing interference fringes due to scattering of laser light.

  Between the support and an undercoat layer or photosensitive layer (charge generation layer, charge transport layer) described later, a conductive layer for the purpose of suppressing interference fringes due to scattering of laser or the like and covering scratches on the support May be provided. The conductive layer can be formed using a conductive layer coating liquid obtained by dispersing and / or dissolving carbon black and conductive particles in a solvent together with a binder resin. In addition, the conductive layer coating solution may contain a compound that is cured and polymerized by heating, ultraviolet irradiation or radiation irradiation. The surface of the conductive layer in which the conductive particles are dispersed tends to be roughened.

  The thickness of the conductive layer is preferably 0.2 μm or more and 40 μm or less, more preferably 1 μm or more and 35 μm or less, and more preferably 5 μm or more and 30 μm or less.

  Examples of the binder resin used in the conductive layer include polymers / copolymers of vinyl compounds such as styrene, vinyl acetate, vinyl chloride, acrylic acid ester, methacrylic acid ester, vinylidene fluoride, trifluoroethylene, and polyvinyl Examples include alcohol, polyvinyl acetal, polycarbonate, polyester, polysulfone, polyphenylene oxide, polyurethane, cellulose resin, phenol resin, melamine resin, silicon resin, and epoxy resin.

  Examples of conductive particles include particles of metals (alloys) such as aluminum, zinc, copper, chromium, nickel, silver, and stainless steel, those deposited on the surface of plastic particles, zinc oxide, titanium oxide, Examples thereof include particles of metal oxides such as tin oxide, antimony oxide, indium oxide, bismuth oxide, indium oxide doped with tin, and tin oxide doped with antimony and tantalum. These may be used alone or in combination of two or more. When two or more types are used in combination, they may be simply mixed, or may be in the form of a solid solution or fusion.

  An undercoat layer having a barrier function or an adhesive function may be provided between the support or the conductive layer and the photosensitive layer (charge generation layer, charge transport layer). The undercoat layer is formed for improving the adhesion of the photosensitive layer, improving the coating property, improving the charge injection property from the support, and protecting the photosensitive layer from electrical breakdown. The undercoat layer can be formed by applying an undercoat layer coating solution obtained by dissolving a resin in a solvent, and drying the obtained coating film.

  Examples of the resin used for the undercoat layer include polyvinyl alcohol, poly-N-vinylimidazole, polyethylene oxide, ethyl cellulose, ethylene-acrylic acid copolymer, casein, polyamide, N-methoxymethylated 6 nylon, and copolymer nylon. , Glue, gelatin and the like.

  The thickness of the undercoat layer is preferably 0.05 μm or more and 7 μm or less, and more preferably 0.1 μm or more and 2 μm or less.

  A photosensitive layer is provided on the support, the conductive layer or the undercoat layer.

  Examples of the charge generating material used in the photosensitive layer include pyrylium and thiapyrylium dyes, phthalocyanine pigments having various central metals and various crystal systems (α, β, γ, ε, X type, etc.), anthanthrone, and the like. Examples thereof include pigments, benzpyrenequinone pigments, pyranthrone pigments, azo pigments such as monoazo, disazo, and trisazo, indigo pigments, quinacridone pigments, asymmetric quinocyanine pigments, and quinocyanine pigments. These charge generation materials may be used alone or in combination of two or more.

  Examples of the charge transport material used in the photosensitive layer include pyrene compounds, N-alkylcarbazole compounds, hydrazone compounds, N, N-dialkylaniline compounds, diphenylamine compounds, triphenylamine compounds, triphenylmethane compounds, pyrazoline compounds, styryl. Compounds and stilbene compounds.

  In the case of a multilayer photosensitive layer, the charge generation layer is formed by applying a charge generation layer coating solution obtained by dispersing a charge generation material together with a binder resin and a solvent, and drying the resulting coating film. can do. For the dispersion treatment, a disperser such as a homogenizer, an ultrasonic disperser, a ball mill, a vibration ball mill, a sand mill, an attritor, or a roll mill can be used. The binder resin is preferably used in an amount of 0.3 to 4 times (mass ratio) with respect to the charge generation material. The charge generation layer may be a vapor generation film of a charge generation material.

  The charge transport layer can be formed by applying a charge transport layer coating solution obtained by dissolving a charge transport material and a binder resin in a solvent, and drying the resulting coating film. In addition, when a charge transport material having film-forming properties is used alone, it is possible to form a charge transport layer by itself without using a binder resin.

  Examples of the binder resin used for the charge generation layer and the charge transport layer include thermoplastic resins and curable resins. Specifically, for example, polymers / copolymers of vinyl compounds such as styrene, vinyl acetate, vinyl chloride, acrylic acid ester, methacrylic acid ester, vinylidene fluoride, trifluoroethylene, polyvinyl alcohol, polyvinyl acetal, polycarbonate , Polyarylate, polyester, polysulfone, polyphenylene oxide, polyurethane, cellulose resin, phenol resin, melamine resin, silicon resin, epoxy resin and the like. Among these, as the binder resin used for the charge transport layer, polycarbonate, polyarylate, and polyester which are thermoplastic resins are preferable.

  The thickness of the charge generation layer is preferably from 0.01 μm to 5 μm, and more preferably from 0.1 μm to 2 μm.

  The film thickness of the charge transport layer is preferably 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 35 μm or less.

  It is also possible to form the above-described charge transport layer using a curable material. Further, a cured layer (a layer formed using a curable material) can be formed on the above-described charge transport layer as the second charge transport layer or the protective layer. Further, the protective layer may contain conductive particles.

  The curable material is preferably a polymerizable and / or crosslinkable charge transporting monomer / oligomer. Polymerizable and / or crosslinkable monomers and oligomers include compounds having a chain polymerizable functional group such as acryloyloxy group and styryl group, and compounds having a sequential polymerizable functional group such as hydroxyl group, alkoxysilyl group and isocyanate group Is mentioned. Among these, a compound having a hole transporting group and an acryloyloxy group in one molecule is preferable. Examples of means for curing the curable material include heat, light, and radiation such as an electron beam.

  The film thickness when the above-described charge transport layer is a cured layer is preferably 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 35 μm or less. When the cured layer is formed as the second charge transport layer or protective layer on the above-described charge transport layer, the film thickness is preferably 0.1 μm or more and 20 μm or less, more preferably 1 μm or more and 10 μm or less. .

  Various additives can be added to each layer. Examples of the additive include deterioration inhibitors such as antioxidants and ultraviolet absorbers, organic resin particles such as fluorine atom-containing resin particles and acrylic resin particles, and inorganic particles such as silica, titanium oxide, and alumina.

In the surface processing method of the electrophotographic photosensitive member of the present invention, the surface of the mold member (processed surface) is brought into pressure contact with the surface (processed surface) of the electrophotographic photosensitive member, whereby the uneven shape of the surface of the mold member is converted to an electron. This is a method of transferring to the surface of a photographic photoreceptor. For this reason, the physical properties of the surface of the electrophotographic photoreceptor (surface layers such as a charge transport layer and a protective layer) are particularly important. More specifically, the hardness and elastic deformation rate of the surface of the electrophotographic photosensitive member, the glass transition temperature of the constituent material of the surface of the electrophotographic photosensitive member, and the melting point are very important. The universal hardness value (HU) of the surface of the electrophotographic photosensitive member is preferably in the range of 150 to 350 N / mm ² , and the elastic deformation rate is preferably in the range of 40 to 70%. The glass transition temperature and melting point of the binder resin (thermoplastic resin) and the charge transport material constituting the surface layer of the electrophotographic photosensitive member are preferably in the range of 40 to 300 ° C. These values are values calculated using the method described in JP 2007-233356 A.

  Hereinafter, the present invention will be described in more detail with reference to specific examples. In the examples, “part” means “part by mass”.

(Examples 1-3)
An aluminum cylinder having a diameter of 30 mm, a length of 357.5 mm, and a thickness of 1 mm was used as a cylindrical support (conductive support).

  Next, barium sulfate particles coated with tin oxide (trade name: Pastoran PC1, Mitsui Kinzoku Mining Co., Ltd.) 60 parts, titanium oxide particles (trade name: TITANIXJR, Teika Co., Ltd.) 15 parts, resol Type phenolic resin (trade name: Phenolite J-325, manufactured by Dainippon Ink & Chemicals, Inc., solid content 70%) 43 parts, silicone oil (trade name: SH28PA, manufactured by Toray Silicone Co., Ltd.) 0.015 parts , 3.6 parts of silicone resin particles (trade name: Tospearl 120, manufactured by Toshiba Silicone Co., Ltd.) and 50 parts of 2-methoxy-1-propanol / 50 parts of methanol are placed in a ball mill for 20 hours. By conducting a dispersion treatment, a coating solution for a conductive layer was prepared. This conductive layer coating solution was dip-coated on a support, and the resulting coating film was heated in an oven for 1 hour to cure, thereby forming a conductive layer having a thickness of 15 μm.

  Next, 10 parts of copolymer nylon (trade name: Amilan CM8000, manufactured by Toray Industries, Inc.) and 30 parts of methoxymethylated nylon 6 (trade name: Toresin EF-30T, manufactured by Teikoku Chemical Co., Ltd.) are added to 400 parts of methanol. An undercoat layer coating solution was prepared by dissolving in 200 parts of / n-butanol mixed solvent. The undercoat layer coating solution was applied onto the conductive layer by dip coating, and the resulting coating film was dried at 100 ° C. for 30 minutes to form an undercoat layer having a thickness of 0.45 μm.

  Next, 20 parts of a crystalline hydroxygallium phthalocyanine crystal (charge generation material) having strong peaks at 7.4 ° and 28.1 ° with a black angle of 2θ ± 0.2 ° in CuKα characteristic X-ray diffraction, the following structural formula 0.2 part of a calixarene compound represented by (1),

10 parts of polyvinyl butyral (trade name: ESREC BX-1, manufactured by Sekisui Chemical Co., Ltd.) and 600 parts of cyclohexanone were placed in a sand mill using glass beads having a diameter of 1 mm and dispersed for 4 hours. A coating solution for a charge generation layer was prepared by adding parts. The charge generation layer coating solution was dip-coated on the undercoat layer, and the resulting coating film was dried at 80 ° C. for 15 minutes to form a charge generation layer having a thickness of 0.17 μm.

  Next, 70 parts of a compound represented by the following structural formula (2) (charge transporting material (hole transporting compound)),

Further, 100 parts of polycarbonate (trade name: Iupilon Z400, manufactured by Mitsubishi Engineering Plastics Co., Ltd.) is dissolved in a mixed solvent of 600 parts of monochlorobenzene / 200 parts of dimethoxymethane (methylal) to prepare a coating solution for the charge transport layer. Prepared. The charge transport layer coating solution was dip-coated on the charge generation layer, and the resulting coating film was dried at 100 ° C. for 30 minutes to form a charge transport layer having a thickness of 15 μm.

Next, 0.5 part of fluorine atom-containing resin (trade name: GF-300, manufactured by Toagosei Co., Ltd.) as a dispersant for the polytetrafluoroethylene particles is added to 1,1,2,2,3,3. 4-Heptafluorocyclopentane (trade name: Zeolora H, manufactured by Nippon Zeon Co., Ltd.) 30 parts / 1-propanol 30 parts mixed solvent, polytetrafluoroethylene particles (trade name) : LUBRON L-2, manufactured by Daikin Industries Co., Ltd., Ltd.) 10 parts was added, a high-pressure dispersing machine (trade name: microfluidizer M-110EH, US Microfluidics Corp.) four dispersion treatment with a pressure of 600 kgf / cm ² at Was given. This was filtered using a polyflon filter (trade name: PF-040, manufactured by Advantech Toyo Co., Ltd.) to obtain a lubricant dispersion. Thereafter, 90 parts of a compound (hole transporting compound) represented by the following structural formula (3),

60 parts of 1,1,2,2,3,3,4-heptafluorocyclopentane and 60 parts of 1-propanol were added to the lubricant dispersion, and a polyflon filter (trade name: PF-020, Advantech Toyo ( The coating liquid for protective layer (second charge transport layer) was prepared by filtering using a product manufactured by KK This protective layer coating solution was applied onto the charge transport layer, and the resulting coating film was dried at 50 ° C. for 10 minutes in the air. Thereafter, the coating film was irradiated with an electron beam for 1.6 seconds while rotating the cylinder at 200 rpm under the conditions of an acceleration voltage of 150 kV and a beam current of 3.0 mA in nitrogen, and then it took 30 seconds from 25 ° C. to 125 ° C. in nitrogen. The coating film was cured while the temperature was raised. The absorbed dose of the electron beam at this time was measured and found to be 15 kGy. The oxygen concentration in the atmosphere of electron beam irradiation and heat curing reaction was 15 ppm. Thereafter, the coating film was cooled to 25 ° C. in the air, and dried at 100 ° C. for 30 minutes in the air to form a protective layer (second charge transport layer, cured layer) having a thickness of 5 μm.

  Thus, an electrophotographic photoreceptor having a support, a conductive layer, an undercoat layer, a charge generation layer, a charge transport layer, and a protective layer (second charge transport layer) was produced.

  The obtained electrophotographic photosensitive member was placed in a surface processing apparatus having the configuration shown in FIG. 1 in an environment of 25 ° C. As the pressurizing member 3, a material made of SUS304 was used, and a heater for heating was installed inside the pressurizing member 3. In the surface processing, the pressure member 3 is moved from the right direction to the left direction in FIG. 1, and the electrophotographic photosensitive member 1 is rotated in the clockwise direction in FIG. The surface (worked surface) of the mold member 2 is continuously brought into pressure contact with the mold member 2. As the mold member 2, a sheet-shaped mold member made of nickel having a thickness of 50 μm and having a surface (processed surface) having a shape in which cylindrical convex portions are continuous as shown in FIG. 4 was used. The diameter Y (major axis diameter) of the cylinder on the surface (processed surface) of the mold member 2 was 5 μm, the height Z of the cylinder was 2 μm, and the pitch X of the cylinder was 7.5 μm. A cylindrical holding member 4 made of SUS304 having the same diameter as that of the support was inserted into the support of the electrophotographic photoreceptor 1. At this time, temperature control of the holding member 4 was not performed.

  Using the surface processing apparatus configured as described above, the electrophotographic photosensitive member was surface processed under the surface processing conditions shown in Table 1. Table 1 shows the glass transition temperature of the charge transport layer and the melting point of the charge transport material, which were measured separately.

  Various temperature measurements were performed by the following methods.

  The temperature of the mold member is measured by bringing a tape contact type thermocouple (trade name: ST-14K-008-TS1.5-ANP, manufactured by Anri Keiki Co., Ltd.) into contact with the surface (machined surface) of the mold member. did. The temperature of the charge transport layer during the surface processing was measured by separately manufacturing an electrophotographic photoreceptor for temperature measurement. An electrophotographic photoreceptor for temperature measurement was produced as follows.

  First, a charge transport layer having a film thickness of 15 μm is formed in the same manner as the electrophotographic photoreceptor for surface processing, and then an ultrafine thermocouple having a tip diameter of 25 μm (trade name: KFT-25-100, manufactured by Ambe SMT Co., Ltd.) ) Was fixed with silver paste at four locations on the surface of the charge transporting layer (four equal parts in the longitudinal direction of the cylindrical electrophotographic photosensitive member). A single film (1 cm square) of a protective layer having a thickness of 5 μm separately formed on the thermocouple was covered and fixed to obtain an electrophotographic photoreceptor for temperature measurement.

  Using the electrophotographic photosensitive member for temperature measurement obtained as described above, the temperature change during surface processing was continuously monitored while performing surface processing. Note that the temperature at the contact start point a for contact between the surface of the electrophotographic photosensitive member (processed surface) and the surface of the mold member (processed surface) is such that the surface of the mold member and the surface of the electrophotographic photosensitive member are pressed by a pressure member. The maximum value of the temperature at the time of passing through the nip portion that occurred when being brought into pressure contact was used. The temperature of the charge transport layer of the electrophotographic photosensitive member at the release point b was the maximum value immediately after the release.

  The pulling force of the mold member is measured by incorporating a load cell (trade name: TT-FR1kN, manufactured by TEAC Corporation) into the surface processing apparatus and continuously monitoring the pulling force during the surface processing while performing the surface processing. did.

  The surface-processed electrophotographic photosensitive member was observed with a laser microscope (trade name: VK8500, manufactured by Keyence Corporation), and the depth of the recess was measured. The measurement of the depth of the recess was performed by setting the position No. 50 mm from the upper end of the coating of the surface layer (protective layer) to the center as the measurement position. 1 and the central portion is the position No. No. 2 and a position of No. 50 mm from the coating lower end of the coating toward the center. It was set to 3. At these three positions, each was measured as an average value in observation per 100 μm square. The results are shown in Table 1.

A: Variation at 3 points is within 0.02 μm B: Variation at 3 points is within 0.05 μm C: Variation at 3 points is within 0.10 μm D: Variation at 3 points is within 0.15 μm E: The variation at three points was 0.16 μm or more The ease of replacement of the mold member was evaluated.

○: Replacement / installation of mold parts and surface processing conditions can be set in a short time △: Replacement / installation of mold parts and surface processing conditions take a long time ×: Difficulties in replacement / installation of mold parts and surface processing conditions The results are shown in Table 1.

(Examples 4 to 7)
A surface processing apparatus having the configuration shown in FIG. 2 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 1 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

  In Example 4, a columnar support member 5 that supports the mold member was provided. The support member 5 is a columnar member made of SUS304 having an outer diameter of 50 mm and an inner diameter of 20 mm, and is rotatably arranged so that its axis is substantially parallel to the rotation center axis of the electrophotographic photosensitive member. When processing the surface of the electrophotographic photosensitive member 1, the plate-like pressure member 3 provided with a heater is moved from the right direction to the left direction in FIG. 2, and the electrophotographic photosensitive member 1 is rotated clockwise in FIG. In this manner, the surface (processed surface) of the mold member 2 was continuously brought into pressure contact with the surface (processed surface) of the electrophotographic photoreceptor 1.

(Examples 8 to 12)
A surface processing apparatus having the structure shown in FIG. 1 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 1 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 13 to 14)
A surface processing apparatus having the structure shown in FIG. 2 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 4 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 15 to 16)
A surface processing apparatus having the structure shown in FIG. 3 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 1 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1. In Examples 15 to 16, instead of the flat plate-like pressure member 3 provided with a heater inside as shown in FIG. 1 used in Example 1, a heater was provided inside as shown in FIG. A cylindrical pressure member 6 was used. As the cylindrical pressure member 6, a hollow cylinder made of SUS304 having an outer diameter of 35 mm and an inner diameter of 10 mm was used as a frame member, and a rod-shaped heating member was inserted therein. When positioning the cylindrical pressure member 6 shown in FIG. 3, the cylindrical pressure member 6 was rotatably arranged so that the axis of the cylindrical pressure member 6 was substantially parallel to the cylinder axis of the electrophotographic photosensitive member. When processing the surface (processed surface) of the electrophotographic photoreceptor 1, the cylindrical pressure member 6 is rotated counterclockwise in the figure, and the electrophotographic photoreceptor 1 is rotated in the clockwise direction in the figure. The surface (processed surface) of the mold member 2 is continuously brought into pressure contact with the surface (processed surface) of the photoreceptor 1.

(Examples 17 to 19)
A surface processing apparatus having the structure shown in FIG. 2 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 4 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Example 20)
The surface processing apparatus having the configuration shown in FIG. 1 is used as the surface processing apparatus, and the support of the electrophotographic photosensitive member is changed to an aluminum cylinder having an outer shape of 12 mm, a length of 357.5 mm, and a wall thickness of 1 mm. A cylindrical holding member 4 made of SUS304 having the same diameter was inserted. Further, the surface processing conditions are as shown in Table 1. Except for these, an electrophotographic photosensitive member whose surface was processed in the same manner as in Example 1 was produced and evaluated. The results are shown in Table 1.

(Examples 21 to 23)
A surface processing apparatus having the structure shown in FIG. 1 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 1 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 24-26)
A surface processing apparatus having the structure shown in FIG. 2 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 4 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 27 to 28)
A surface processing apparatus having the structure shown in FIG. 3 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 15 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Example 29)
An electrophotographic photosensitive member having no protective layer was produced by forming the charge transport layer in the same manner as in Example 1. Thereafter, the surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus, and the surface processing conditions were as shown in Table 1. Other than these, an electrophotographic photosensitive member having a surface processed in the same manner as in Example 1 was produced and evaluated. The results are shown in Table 1.

(Example 30)
A surface processing apparatus having the structure shown in FIG. 2 is used as the surface processing apparatus, and the compound represented by the structural formula (2) is replaced with the compound represented by the following structural formula (4) (charge transporting material (hole transporting compound)).

The electrophotographic photoconductor subjected to surface processing was manufactured in the same manner as in Example 20 except that the surface processing conditions were changed as shown in Table 1 and evaluated. The results are shown in Table 1.

(Examples 31-32)
2 is used as the surface processing apparatus, the compound represented by the structural formula (2) is changed to the compound represented by the structural formula (4), and the surface processing conditions are as shown in Table 1. Except as described above, a surface-processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 1. The results are shown in Table 1.

(Example 33)
A surface processing apparatus having the structure shown in FIG. 3 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 31 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 34 to 35)
A surface processing apparatus having the structure shown in FIG. 1 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 31 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Example 36)
A surface processing apparatus having the structure shown in FIG. 2 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 31 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 37 to 38)
A surface processing apparatus having the structure shown in FIG. 3 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 33 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Example 39)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 34 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 40 to 43)
A surface processing apparatus having the structure shown in FIG. 2 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 31 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 44 to 45)
A surface processing apparatus having the structure shown in FIG. 3 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 33 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 46 to 48)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 34 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Examples 49 to 50)
A surface processing apparatus having the structure shown in FIG. 2 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 31 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Example 51)
As the surface processing apparatus, the surface processing apparatus having the configuration shown in FIG. 2 is used, and the mold member has a surface having a shape in which hexagonal columnar convex portions are continuous as shown in FIGS. 5 (A) and 5 (B). Surface) (the major axis diameter Rpc of the hexagonal column is 1.0 μm, the distance D between the hexagonal columns is 0.5 μm, and the height F of the hexagonal column is 1.0 μm). Except as described in the table, a surface-processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 31. The results are shown in Table 1.

(Example 52)
As the surface processing apparatus, the surface processing apparatus having the configuration shown in FIG. 3 is used, and the mold member has a surface with a cylindrical convex portion as shown in FIGS. 6 (A) and 6 (B) (processing) Surface mold) (the major axis diameter Rpc of the cylinder is 2.0 μm, the distance D between the cylinders is 0.5 μm, and the height F of the cylinder is 5.0 μm). Except for the above, an electrophotographic photosensitive member having a surface processed in the same manner as in Example 33 was produced and evaluated. The results are shown in Table 1.

(Example 53)
A polyarylate having a repeating structural unit represented by the following structural formula (5) instead of polycarbonate in Example 29

(M and n are copolymerization ratios, m: n = 7: 3)
The compound represented by the structural formula (2) was changed to the compound represented by the structural formula (4). Furthermore, the surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus, and the surface processing conditions shown in Table 1 were set. Except for these, an electrophotographic photoreceptor having a surface processed in the same manner as in Example 29 was produced and evaluated. The results are shown in Table 1.

(Example 54)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus, and a surface processed electrophotographic photosensitive member was manufactured and evaluated in the same manner as in Example 34 except that the surface processing conditions were as shown in Table 1. Went. The results are shown in Table 1.

(Example 55)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus. At that time, the temperature was controlled so that the cylindrical holding member made of SUS304 inside the support of the electrophotographic photosensitive member was kept at 30 ° C., and the surface processing conditions were as shown in Table 1. Other than those, surface-processed electrophotographic photosensitive members were manufactured and evaluated in the same manner as in Example 37. The results are shown in Table 1.

(Example 56)
As the surface processing apparatus, a surface processing apparatus having the configuration shown in FIG. 2 is used, and the mold member has a convex line shape as shown in FIGS. 7A and 7B (the direction of the line shape is a cylindrical electrophotography). The mold member has the surface (processed surface) with a continuous shape (same as the circumferential direction of the photoreceptor) (the convex spacing D is 10 μm, the convex width D1 is 10 μm, and the convex height F is 2 μm). An electrophotographic photosensitive member having a surface processed in the same manner as in Example 31 was manufactured and evaluated except that the surface processing conditions were as shown in Table 1. The results are shown in Table 1.

(Example 57)
As the surface processing apparatus, a surface processing apparatus having the configuration shown in FIG. 2 is used, and the mold member has a convex line shape as shown in FIGS. 8A and 8B (the direction of the line shape is a cylindrical electrophotography). The mold member has the surface (processed surface) with a continuous shape (same as the circumferential direction of the photoreceptor) (the convex spacing D is 3 μm, the convex width D1 is 1 μm, and the convex height F is 3 μm). An electrophotographic photosensitive member having a surface processed in the same manner as in Example 31 was manufactured and evaluated except that the surface processing conditions were as shown in Table 1. The results are shown in Table 1.

(Comparative Example 1)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus. At that time, the mold member was not pulled but only supported, and the surface processing conditions were as shown in Table 1. Except for these, an electrophotographic photosensitive member whose surface was processed in the same manner as in Example 1 was produced and evaluated. The results are shown in Table 1.

(Comparative Example 2)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus. At that time, the mold member was not pulled but only supported, and the surface processing conditions were as shown in Table 1. Except for these, an electrophotographic photosensitive member whose surface was processed in the same manner as in Example 1 was manufactured and evaluated. The results are shown in Table 1.

(Comparative Example 3)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus. At that time, the mold member was only placed on a flat plate-like pressure member (θ = 0 °), and it was not pulled, and the surface processing conditions were as shown in Table 1. Except for these, an electrophotographic photosensitive member whose surface was processed in the same manner as in Example 1 was produced and evaluated. The results are shown in Table 1.

(Comparative Example 4)
A surface processing apparatus having the configuration shown in FIG. 1 was used as the surface processing apparatus. At that time, the mold member was pulled in the direction parallel to the flat plate-like pressure member without making an angle (θ = 0 °), and the surface processing conditions were as shown in Table 1. Except for these, an electrophotographic photosensitive member whose surface was processed in the same manner as in Example 1 was produced and evaluated. The results are shown in Table 1.

(Reference Example 1)
Electrophotographic surface processed in the same manner as in Example 1 except that the surface processing apparatus described in Japanese Patent Application Laid-Open No. 2007-233356 (FIG. 9A) was used and the surface processing conditions were as shown in Table 1. Photoconductors were manufactured and evaluated. The results are shown in Table 1. When processing the surface of the electrophotographic photosensitive member 9-1, the mold member 9-2 was fixed on a flat plate-like pressure member 9-3 provided with a heater. Further, the plate-shaped mold member 9-2 is moved from the left to the right in FIG. 9, and the electrophotographic photosensitive member 9-1 is rotated counterclockwise in FIG. The surface (processed surface) of the mold member 9-2 was continuously brought into pressure contact with the surface (processed surface). In FIG. 9A, reference numeral 9-7 denotes a support member for the electrophotographic photosensitive member.

(Reference Example 2)
An electrophotographic photosensitive member having a surface processed by the method of Example 4 described in JP-A No. 2001-66814 (FIG. 9B) was produced and evaluated. A mold member made of SUS was used. In FIG. 9B, A is a mold member and B is an electrophotographic photosensitive member.

DESCRIPTION OF SYMBOLS 1 Electrophotographic photoreceptor 2 Mold member 3 Pressure member 4 Holding member 5 Support member 6 Pressure member a Contact start point b Release point o Center of rotation axis 9-1 Electrophotographic photoreceptor 9-2 Mold member 9-3 Addition Pressure member 9-7 Support member for electrophotographic photosensitive member A type member B electrophotographic photosensitive member

Claims (4)

An electron that transfers the shape of the surface of the mold member to the surface of the electrophotographic photosensitive member while rotating the electrophotographic photosensitive member by pressing the surface of the cylindrical electrophotographic photosensitive member and the surface of the sheet-shaped die member A surface processing method for a photographic photoreceptor,
On the cross section orthogonal to the rotation axis of the electrophotographic photosensitive member,
(1) A line segment connecting a rotation axis center of the electrophotographic photosensitive member and a contact start point at which the surface of the electrophotographic photosensitive member starts to contact the surface of the mold member is defined as a line segment A. When a line segment connecting the rotation axis center and the release point at which the surface of the mold member begins to separate from the surface of the electrophotographic photosensitive member is defined as a line segment B, an angle θ formed by the line segment A and the line segment B Disposing the electrophotographic photosensitive member and the mold member such that is 5 ° or more, and
(2) A surface processing method for an electrophotographic photosensitive member, wherein the mold member is pulled in a rotation direction of the electrophotographic photosensitive member at the release point.   2. The surface processing method for an electrophotographic photosensitive member according to claim 1, wherein, in (1), the electrophotographic photosensitive member and the mold member are arranged so that the angle θ is 20 ° or more.   3. The surface processing method for an electrophotographic photosensitive member according to claim 1, wherein in (2), the mold member is pulled with a force of 0.5 N or more per 1 cm width of the mold member.   A method for producing a surface-processed electrophotographic photosensitive member by processing the surface of the electrophotographic photosensitive member by the surface processing method according to claim 1.

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