JP2012093227A - Analysis system and microchip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress optical adverse effects of surface properties on facing surfaces of a microchip and an optical member.SOLUTION: The analysis system comprises: a microchip 1 including a space which houses a sample or through which the sample passes, at the inside of the microchip 1; and an optical member 6 for guiding incident light to the space 5 inside of the microchip 1 or emission light from the space. Filler 4 having a refractive index approximate to the refractive index of either one of the optical member 6 and the microchip 1 is provided between the optical member 6 and an incidence surface for the incident light or an emission surface for the emission light in the microchip 1.

Description

  The present invention relates to a microchip having a space for storing or passing a sample and an analysis system using the microchip.

  A technique using a microchip integrated so that a process for measuring a component contained in a sample, for example, separation, extraction, chemical reaction, cell culture, etc., can be performed on one chip is known. The microchip has a fine channel, and the components of the sample passing through the fine channel are separated by, for example, electrophoresis or capillary force. An optical system is used to detect each separated component. For example, the components of the sample can be analyzed by irradiating the sample separated into the components in the fine flow path and detecting the transmitted light. As an optical analysis, for example, an absorptiometric method or a fluorometric method is known.

  Regarding the configuration of the microchip and the optical member for observing the sample in the microchip, for example, Patent Document 1 discloses a configuration in which the microchip is irradiated with measurement light with the tip of the optical fiber in contact with the microchip. Is disclosed. In this example, the concave portion is provided in the microchip portion where the tip of the optical fiber comes into contact, so that the emission end face of the optical fiber is prevented from contacting the microchip, and damage to the optical fiber is suppressed.

  In Patent Document 2, a gradient index rod lens is fixed in advance to a plate-like member with a flow path, and a condensing lens provided with an optical fiber is fixed. A configuration including an annular member to be fitted and fixed is disclosed.

International Publication No. 2010/010904 (paragraph [0112], FIG. 18) Japanese Patent Laying-Open No. 2004-117302 (paragraph 0061, FIG. 1)

  In the configuration of Patent Document 1, the surface properties (waviness and roughness) of the contact surface are often not uniform in both the irradiation end face of the optical fiber and the microchip. For this reason, the contact state of the contact portion between the irradiation end face of the optical fiber and the microchip is different for each apparatus or every time the microchip is replaced even in the same apparatus. As a result, the amount of light loss due to reflection at the contact portion interface and the generation of stray light due to irregular reflection may vary. This variation appears as a machine difference and a difference between measurements, and affects a channel difference in an apparatus that mounts and measures a plurality of microchips. Further, even if an attempt was made to improve the manufacturing method for suppressing the expression property of the end face of the optical fiber and the contact surface of the microchip in order to suppress this variation, there was a physical limit.

  In the configuration disclosed in Patent Document 2, the same problem as in Patent Document 1 may occur on the contact surface between the gradient index rod lens and the optical fiber. In addition, due to their physical contact, dirt adherence or damage due to foreign matter occurs. For this reason, it is necessary to take hard cords for preventing scratches and to take dirt removal maintenance, and it is necessary to take measures corresponding to delicate parts. As a result, the situation is not desirable in terms of cost and labor.

  Therefore, an object of the present invention is to suppress adverse optical effects due to surface properties on the facing surfaces of the microchip and the optical member.

  An analysis system disclosed in the present application includes a microchip having a space for accommodating or passing a sample therein, and an optical member that guides incident light into the space inside the microchip or emitted light from the space, A filler having a refractive index approximate to the refractive index of either the optical member or the microchip is provided between the optical member and the incident surface of the incident light or the exit surface of the emitted light in the microchip. It is done.

  Thus, by providing a filler having a refractive index similar to that of a microchip or an optical member between the optical member and the microchip, undulation, roughness, and scratches on the opposing surfaces of the microchip and the optical member, respectively. Etc. can be filled with a filler. Therefore, it is possible to reduce stray light caused by light loss or irregular reflection due to reflection between the light incident surface or the emission surface of these microchips and the surface of the optical element facing the light incident surface.

  Here, the microchip is integrated so that at least a part of the process for measuring components contained in the sample can be performed by one chip, and has a space for allowing the sample to pass through or to be stored therein. The shape, configuration, and size of the microchip are not limited to specific ones.

  The refractive index of the filler is assumed to approximate the refractive index of either the optical member or the microchip. The refractive index of the filler and the refractive index of the optical member or the microchip are essentially the same. Although it is preferable, in practice, it is difficult to make the refractive indexes exactly the same.

  The said analysis system WHEREIN: The edge part of the said optical member can be set as the aspect which is contacting the said entrance surface or the said output surface of the said microchip through the said filler. This makes it possible to bring these surfaces into contact with each other while filling a minute gap between the light incident surface or the exit surface of the microchip and the end portion of the optical member with the filler.

  The filler may be a fluid. Moreover, the said filler can be made into a gel form.

  The microchip is detachable with respect to the optical member, and the filling material is provided in advance on the portion of the microchip that becomes the incident surface or the emission surface before being mounted on the optical member. It can be set as the mode currently performed.

  The microchip may further include a detachable cover that prevents the filler from flowing out of the exit surface or the entrance surface before being attached to the optical member.

  A microchip having a space for accommodating or passing a sample therein, which approximates the refractive index of the microchip at a position to be a light incident surface to the internal space or a light emission surface from the space. A microchip including a filler having a refractive index and a removable cover for sealing the filler is also included in the present invention.

  According to the present invention, it is possible to suppress adverse optical effects due to the surface properties of the facing surfaces of the microchip and the optical member.

FIG. 1A is a plan view of the microchip in the first embodiment. 1B is a cross-sectional view taken along line BB in FIG. 1A, and FIG. 1C is a cross-sectional view taken along line CC. FIG. 2 is a diagram illustrating a configuration example when the optical member is a lens. FIG. 3 is a diagram illustrating a configuration example of an analysis system including a microchip according to the second embodiment. FIG. 4 is a diagram illustrating an example of a configuration in which the exit surface 6 c of the optical fiber 6 and the entrance surface of the microchip 1 are brought into contact with each other by a coil spring. FIG. 5A to FIG. 5C are diagrams illustrating a configuration example of a microchip according to the third embodiment. FIG. 6 is a diagram illustrating an example of a configuration in which a packaging material is provided on a microchip including a cover. FIG. 7 is a diagram illustrating a configuration example of a pack including an opening tool.

[First embodiment]
FIG. 1A to FIG. 1C are diagrams illustrating a configuration example of an analysis system including a microchip according to the first embodiment of the present invention. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line BB in FIG. 1A, and FIG. 1C is a cross-sectional view taken along line CC. In FIG. 1A, the optical fibers 6 and 7 shown in FIGS. 1B and 1C are omitted.

  In the example shown in FIGS. 1A to 1C, the microchip 1 has a fine channel 5 inside. The microchannel 5 extends linearly in the longitudinal direction of the microchip 1, and both ends of the microchannel 5 are open at the top for containing a sample. Moreover, in the upper part and the lower part in the vicinity of the center of the fine channel 5, there are provided concave portions 3b and 3a whose thickness is thinner than the surroundings. In the present embodiment, as an example, the bottom surface of the upper concave portion 3 b is an incident surface for incident light to the fine flow path 5, and the bottom surface of the lower concave portion 3 a is an output surface for outgoing light from the fine flow path 5. .

  The microchip 1 includes a lower substrate 1a having a groove for forming a fine flow path 5, and an upper substrate 1b provided thereon. The upper substrate 1b has through holes 2a and 2b at positions corresponding to both ends of the groove of the lower substrate 1a, respectively. The sample is introduced into the fine channel 5 or flows out of the fine channel 5 through the through holes 2a and 2b. Further, the upper portion of the upper substrate 1b near the center of the fine channel 5 has the concave portion 3b recessed inward as described above. Further, the lower portion of the lower substrate 1a near the center of the fine channel 5 also has the concave portion 3a recessed inward as described above.

  The upper substrate 1a and the lower substrate 1b are preferably transparent members (transparent members). Examples of the material of the upper substrate 1a and the lower substrate 1b include glass, silicon resin (PDMS), methyl methacrylate resin (PMMA), polystyrene resin (PS), polycarbonate resin (PC), and the like.

  In the recess 3b above the microchannel 5, an end portion of the optical fiber 6 serving as a light guide means for guiding light from a light source (not shown) to the incident surface of the microchip is disposed. Further, an end portion of the optical fiber 7 serving as a light guide means for guiding the emitted light from the microchip 1 to a light detection means (not shown) is disposed in the concave portion 3b below the fine flow path 5. The optical fiber 6 can be said to be an optical member that constitutes a part of irradiation means for irradiating the light from the light source to the fine flow path 5. It can be said that the optical fiber 7 is an optical member that constitutes a part of light detection means for detecting light emitted from the microchip 1.

  The optical fiber 6 has a core 6a and a clad 6b. The core 6a is a part through which light passes. The clad 6b totally reflects light at the interface with the core 6a. The clad 6b is made of a material having a refractive index higher than that of the core 6a, and covers the core 6a. That is, in the optical fiber 6, light is guided inside the core 6 while repeating total reflection at the interface between the core 6a and the clad 6b, and light is emitted from the emission surface 6c which is the end surface of the core 6a. The light emitted from the surface 6c is light having a numerical aperture corresponding to the critical angle for total reflection at the interface between the core 6a and the clad 6b, and travels while spreading the light beam as the distance from the emission surface 6c increases. Similarly, the optical fiber 7 has a core 7a and a clad 7b, and the end surface of the core 7a serves as an incident surface 7c for light emitted from the microchip.

  The exit surface 6 c of the optical fiber 6 is provided at a position facing the entrance surface of the microchip 1. Here, the filler 4 is provided between the exit surface 6 of the optical fiber 6 and the entrance surface of the microchip. The filler 4 has a refractive index that approximates the refractive index of either the core 6 a of the optical fiber 6 or the upper substrate 1 b of the microchip 1. The difference between the refractive index of the core 6a or the microchip 1 and the refractive index of the filler 4 is 0.1 or less, preferably 0.05 or less. Further, the refractive index of the core 6a or the microchip 1 and the refractive index of the filler 4 are more preferably the same.

  Here, the exit surface 6 c of the core 6 a of the optical fiber 6 may be disposed so as to contact the entrance surface of the recess 3 b of the microchip 1 via the filler 4. As the filler 4, for example, optical matching oil having the same refractive index as that of the core 6 a or the microchip 1 can be used. In this case, the emitting surface 6c and the incident surface of the concave portion 3b of the microchip 1 can be brought into close contact with each other while filling the matching oil between the emitting surface 6c of the core 6a and the microchip 1. That is, when the exit surface 6c of the core 6a and the entrance surface of the recess 3b are brought into close contact with each other, a minute gap due to undulation, surface roughness, scratches, etc. is generated between them. Matching oil is filled to fill this minute gap. The matching oil is filled between the exit surface 6c and the entrance surface so as to follow the fine surface shape. Thereby, it can be set as the structure which does not interpose the air layer between the output surface 6c of the core 6a, and the recessed part 3b incident surface, and can reduce an interface. As a result, it is possible to reduce light quantity loss due to light reflection on the exit surface 6c and the entrance surface and stray light caused by irregular reflection.

  The filler 4 is preferably a fluid from the viewpoint of followability. That is, a liquid material that easily penetrates into the minute gaps can be used as the filler 4. On the other hand, a gel-like material can be used as the filler 4. By using the gel-like filler 4, it becomes difficult for the filler 4 to stick to the optical fibers 6 and 7 and the microchip 1. As a result, the surface of the optical fiber or microchip is less likely to become dirty. In addition, by using the filler 4 on the gel, the retention of the filler 4 is increased and the spillage is less likely to occur. For example, even when the upper and lower substrates of the microchip 1 are inclined rather than horizontal, or when the surface on which the filler 4 is provided faces downward, the position of the filler 4 can be maintained. As described above, the filler 4 having an appropriate viscosity according to the purpose can be used from the viewpoints of followability and retention. For example, with the miniaturization of the microchip 1, the surface roughness on the order of nm may become a problem on the contact surface of the optical member. In such a case, it is preferable to use a filler having a viscosity that can follow irregularities of the order of nm.

  For example, the user may apply the filler 4 to the contact portion between the optical member and the microchip, or the analysis system may include means for automatically applying the filler 4. For example, the analysis system can include a tank for storing the filler 4, a pump for pumping the filler from the tank, and a nozzle for applying the pumped filler to the contact portion. Furthermore, it is possible to provide means for detecting the presence or absence of the filler 4 in the contact portion, and to control the supply of the filler 4 to the contact portion based on the detection result. Alternatively, a stamp mechanism that fills the contact portion with oil by applying a cloth or stamp filled with oil as the filler 4 to the contact surface of either the microchip or the optical system may be provided. .

  In the present embodiment, although not shown, the analysis system can have other necessary configurations. For example, when the microchip 1 separates a sample by using an electrophoresis method, the microchip 1 uses an electrode for applying a voltage in the major axis direction of the microchannel 5 or the microchannel 5. An opening having a width wider than that of the fine channel 5 may be provided on both ends of the sample to serve as a sample inlet and outlet. Furthermore, a liquid supply unit that supplies a sample or solution to the microchannel 5 of the microchip 1, a mechanism that controls the amount of liquid supply, a mechanism that controls the applied voltage, and the like may be provided in the analysis system. Furthermore, the analysis system may include a computer that controls the analysis operation by the microchip 1 and converts the measurement results into data. The microchip 1 is preferably detachable from the analysis system. Thereby, the microchip 1 can be replaced.

(Modification of optical member)
In the above example, the case where the optical member that guides the incident light to the microchip or the emitted light to the microchip is an optical fiber has been described. The optical member is not limited to an optical fiber. FIG. 2 is a diagram illustrating a configuration example when the optical member is a lens.

  In the example shown in FIG. 2, the bottom surface of the recess 3a of the lower substrate 1a is the incident surface, and the bottom surface of the recess 3b of the upper substrate 1b is the output surface. That is, the irradiation unit 11 that irradiates light to the fine flow path 5 of the microchip 1 is provided in the recess 3a of the lower substrate 1a. The emission surface at the upper end of the irradiation unit 11 is provided so as to face the incident surface of the recess 3 a of the microchip 1. The irradiation unit 11 is provided with an optical fiber 14 that guides light from a light source, and lenses 15 and 16 that collect the light emitted from the optical fiber 14 and irradiate the fine flow path 5 with the light. A surface of the lens 16 facing the microchip 1 is an emission surface 16 b of the irradiation unit 11. A filler 4 is provided between the exit surface 16 b and the entrance surface of the microchip 1. The refractive index of the filler 4 is preferably the same as the refractive index of the lens 16. Alternatively, the refractive index of the filler 4 may be the same as the refractive index of the microchip 1. The filler 4 fills the undulation, roughness, scratches, and the like of the exit surface 16b of the lens 16 and the entrance surface of the microchip 1.

  A light detection unit 12 that collects light emitted from the microchip 1 and guides it to the optical sensor 13 is provided in the recess 3b of the upper substrate 3b. The light detection unit 12 includes a light sensor 13 and lenses 8 and 9 for converting the light emitted from the microchip 1 into parallel light and guiding the light to the light sensor 13. The surface of the lens 8 facing the microchip 1 becomes the incident surface 8b for the light emitted from the microchip 1. A filler 4 is also provided between the incident surface 8 b and the exit surface of the microchip 1. The refractive index of the filler 4 is preferably the same as the refractive index of the lens 8 or the microchip 1. The filler 4 fills the undulation, roughness, scratches, and the like of the entrance surface 8b of the lens 8 and the exit surface of the microchip 1.

  The optical member is not limited to the lens of the modified example. In addition to the optical fiber and the lens, for example, a prism, a polarizing plate, a light pipe, a mirror, and the like can be used as an optical member that is in contact with or faces the microchip 1.

  Further, the direction of light irradiation is not limited from the top to the bottom as shown in FIG. 1, and may be from the bottom to the top as shown in FIG. 2, for example. Further, the filler 4 is not limited to the light incident side, and may be provided on both the incident side and the emission side, or may be provided only on one of them.

[Second Embodiment]
FIG. 3 is a diagram illustrating a configuration example of an analysis system including the microchip 1 according to the second embodiment. In FIG. 3, the same members as those in FIG. The configurations of the microchip 1, the filler 4, and the optical fiber 7 shown in FIG. 3 are the same as those in FIG.

  In the example shown in FIG. 3, a fixing member 17 that fixes the positional relationship between the incident surface or the emitting surface of the microchip 1 and the optical member is provided. The fixing member 17 includes a holding substrate 17a provided on the upper substrate 1b of the microchip 1 so as to cover the microchip 1, and guide portions 17b and 17c for fixing the microchip 1 to the holding substrate 17a. The guide portions 17b and 17c extend from the holding substrate 17a along the side surface of the microchip 1 and are formed so as to go around the surface of the microchip 1 opposite to the holding substrate 17a. Further, a through hole penetrating from the upper surface to the lower surface is provided near the center of the holding substrate 17a. The tip portion of the optical fiber 6 is inserted into the through hole.

  The clad 6b of the optical fiber 6 is provided with a protrusion 6d. The protruding portion 6d is formed so that the protruding portion 6d hits the edge of the through hole in a state where the optical fiber 6 is inserted into the through hole. It is preferable that the protruding portion 6d is provided at a position where the emission surface 6c of the optical fiber 6 contacts the incident surface of the microchip 1 in a state where the protruding portion 6d is engaged and the optical fiber 6 is fixed. Here, the protruding portion 6d is arranged so that a slight gap is formed between the protruding portion 6d and the surface of the fixing member 17 in a state where the exit surface 6c of the optical fiber 6 is in contact with the incident surface of the microchip 1. May be. When the protrusion 6d is in contact with the surface of the fixing member 17, the protrusion 6d cannot go below the fixing member 17, so that the tip of the optical fiber does not reach the microchip and does not contact depending on the dimensional variation of the parts. Cases can occur. Therefore, a gap is provided between the protruding portion 6d and the fixing member 17 by a length corresponding to the dimensional variation of the parts so that the optical fiber 6 and the microchip 1 can contact with each other more reliably. it can.

  Further, for example, the tip of the optical fiber 6 may be urged so as to be pressed against the incident surface of the microchip 1 by urging means such as a coil spring or a screw. FIG. 4 is a diagram illustrating an example of a configuration in which the exit surface 6 c of the optical fiber 6 and the entrance surface of the microchip 1 are brought into contact with each other by a coil spring.

  In the example shown in FIG. 4, a ferrule 27 having a protrusion is provided at the tip portion of the optical fiber 6 so as to surround the clad 6 b. Further, a cylindrical holder 29 surrounding the tip portion of the optical fiber 6 is provided fixed to the fixing member 17. The bottom surface of the holder 29 has an opening through which the optical fiber 6 passes, and the protrusion of the ferrule 27 is placed on the edge of the opening. A coil spring 28 is wound around the outer side of the ferrule 72. One end side of the coil spring 28 is in contact with the protrusion of the ferrule 27, and the other end side is in contact with the holder 29.

  In the configuration example shown in FIG. 4, the ferrule 27 holds the end of the optical fiber 6. The ferrule 27 is held in a holder 29 so as to be movable in the vertical direction while being urged by a coil spring 28. That is, the optical fiber 6 is configured to be brought into contact with the concave portion 3b of the microchip 1 with an appropriate pressing force. The exit surface 6 c of the optical fiber 6 is biased so as to be pressed against the microchip 1. The biasing means is not limited to the coil spring 28. For example, the biasing means may be one that presses the optical member against the microchip by a screwing means, or is formed of an elastic body other than a spring, such as rubber or oil. May be.

  By providing the fixing member as in the above-described embodiment, the optical member can be fixed so as to be reliably in contact with the incident surface or the emitting surface of the microchip. Further, by further including an urging unit that presses the optical member against the microchip, the optical member can be brought into contact with the incident surface or the emission surface of the microchip more reliably. Variations in optical effects such as light loss and stray light due to the structure of the facing portion (contact portion) between the optical member and the microchip can be more reliably suppressed.

Moreover, it can be set as the structure which can remove the microchip 1 from a fixing member.
The configuration of the fixing member 17 is not limited to the example shown in FIG. For example, the holding substrate 17 may be provided below the microchip 1, or the holding substrate 17 may be provided both above and below the microchip 1.

[Third Embodiment]
FIG. 5A to FIG. 5C are diagrams illustrating a configuration example of the microchip 1 in the third embodiment. The microchip shown in FIGS. 5A to 5C includes a cover that seals the filler on the exit surface or the entrance surface of the microchip when the microchip is not attached to the optical member.

  In the example shown in FIG. 5A, a laminate material 18 as a cover is provided so as to cover the recess 3b. The laminate material 18 has adhesiveness to the upper substrate 1b, and is attached to the upper substrate 1b at the peripheral portion of the recess 3b on the upper substrate 1b. The laminate material 18 can also be called a seal. Before the microchip 1 is set in the analysis system, the cover is removed.

  In the example shown in FIG. 5B, the cover is a lid 19 having a pawl at the peripheral edge. The claw at the peripheral edge of the lid 19 fits in the groove provided in the upper substrate 1b, so that the lid 19 covers and fixes the recess 3b, and the filler 4 in the recess 3b is sealed.

  In the example shown in FIG. 5C, the cover is a sheet 21 that covers the entire surface of the upper substrate 1b. The sheet 21 is formed to cover the entire surface of the upper substrate 1b and further extend to the side surface of the upper substrate 1b. The material of the sheet 21 may be, for example, the same material as the laminate material 18 in FIG.

  When the microchip 1 of the above example is used for measurement, the cover is removed and then attached to the analyzer. That is, the user may remove the cover before attaching the microchip 1 to the analysis system (analysis apparatus). This makes it possible to prevent the filler 4 from being washed away when the microchip 1 is not attached to the analysis system (analyzer). Further, for example, it is possible to reduce the trouble of applying the filler 4 by the user, and to prevent measurement without the filler 4 due to forgetting to apply. Further, for the user, in addition to the microchip 1, the trouble of managing the filler 4 that is a consumable is also reduced. In addition, the function of automatically refilling the filler 4 is not necessary, and the complexity of the apparatus can be avoided.

[Fourth Embodiment]
FIG. 6 is a diagram illustrating an example of a configuration in which the microchip 1 having a cover is further provided with a packaging material that wraps the microchip.

  In the example illustrated in FIG. 6, the microchip 1 is provided with a packaging material 26 that wraps the microchip as a first-layer cover. A part of the packaging material 26 is bonded to the microchip 1 by, for example, heat sealing. For example, the packaging material 26 can be bonded to a portion surrounding the periphery of the recess 3b of the upper substrate 1b and the recess 3a of the lower substrate 1a, which serve as a measurement unit. Further, the packaging material 26 can be adhered to the periphery of the through holes 2a and 2b of the upper substrate 1b, which is an opening of the microchip 1.

  The packaging material 26 has openings at positions corresponding to the measurement parts (recesses 3a and 3b) and the openings (through holes 2a and 2b) of the microchip 1. Covers 18 a, 18 b, 25 and a pack 22 are provided so as to close the opening of the packaging material 26. That is, covers 18 a and 18 b are provided so as to close the upper and lower measurement parts of the microchip 1, a cover 25 is provided so as to close the first opening of the microchip 1, and the opening of the second microchip 1. A pack 22 is provided so as to close the door. Here, the first opening and the second opening communicate with each other through the flow path. The cover 18a, 18b, 25 and the pack 22 have a measurement part peripheral edge or an opening peripheral part attached to the microchip similarly to the packaging material 26. These covers and packs are preferably detachable from the microchip 1 independently of the packaging material 26. For example, the packaging material 26 and these covers or packs can be attached to the microchip 1 in a state where they are connected by a broken line. Alternatively, the packaging material 26, 18a, 18b, 25 and the pack may be connected and integrated to be integrally removed. Note that the packaging material, the cover, and the pack can be set again when the microchip 1 is discarded or stored for reuse by being attached to the microchip 1 with an adhesive material that can be repeatedly bonded.

  The pack 22 can be sealed with a liquid necessary for measurement with the microchip 1. For example, when the microchip 1 is used for analysis using electrophoresis, the electrophoresis buffer can be sealed in the pack 22. In this way, the opening of the microchip is closed with a liquid-sealed pack, so that the pack is stored separately from the reservoir (opening) before use and is opened for the first time before use. The liquid can be supplied to the opening of the liquid crystal display.

  When the microchip 1 shown in FIG. 6 is set in the analyzer and measurement is performed, the covers 18a, 18b, and 25 are removed. As an example, the suction means of the analyzer is connected to the through-hole 2b that is one opening of the microchip, suction from the downstream reservoir is started, and the opening means (for example, a needle-like member) provided in the analyzer is further provided. The pack 22 can be pierced from the top toward the through-hole 2b. As a result, the liquid in the Mac 22 is introduced into the fine flow path 5.

  In addition, the pack 22 can also be provided with an opening tool. For example, as shown in FIG. 7, a pointed penetrating member can be formed inside the sealed container of the pack 22. Thereby, by pressing downward from the upper surface of the pack 22, a penetration hole is formed in the lower surface, and the liquid can be taken out from the pack 22. An opening tool is not restricted to this, For example, the pulling tab provided in the outer side of the sealing container may be sufficient. Moreover, the microchip 1 may be provided with an opening part.

  Further, the form of the sealed container is not limited to the pack 22 shown in FIG. For example, the sealed container may be provided in the packaging material, and the packaging material may include at least one of an electrode for applying a high voltage or a temporary storage dish for diluting and hemolyzing the sample. Specifically, the electrode can be formed integrally with the packaging material by depositing carbon printing, Ag, Au, or the like on the packaging material partially bonded to the microchip 1. Moreover, a temporary storage tray can be formed by providing a removable cover in the concave area | region provided in a packaging material or the microchip 1, for example. When this cover prevents dust and the like from being placed on the concave area and the cover is removed, the concave area can be used as a temporary storage tray for liquid like a palette of paint.

  Further, the pack 22 may be provided so as to seal the filling material 4 and close the measurement part (the concave parts 3a and 3b serving as the light emission surface or the incident surface). Thereby, before using the microchip 1, the filler 4 can be stored separately from the measurement unit, and can be filled so as to cover the measurement unit by opening it at the time of use.

  As described above, the liquid storage and supply function is provided not in the microchip body but in the pack which is an attached sealing means, so that the microchip can be prevented from becoming complicated and the risk of yield deterioration can be avoided. For example, the microchip can be configured to include only elements that require the accuracy required for analysis.

  The form of the cover is not limited to the above example. Moreover, the cover of said 3rd, 4th embodiment is applicable to any of the said 1st Embodiment and 2nd Embodiment.

  As mentioned above, although embodiment of this invention was described, embodiment of this invention is not restricted to the said 1st-4th embodiment. For example, the microchip 1 is used as a space for allowing a sample to undergo chemical reaction, physical reaction, separation, extraction, culture, etc. It is also possible to adopt a storage space.

  Moreover, the example to which the microchip and the analysis system according to the present invention are applied is not limited to the analysis using the electrophoresis method. In addition, the present invention can be applied to analysis in which a sample is reacted, separated, extracted, detected, cultured, etc. in the space inside the microchip. Examples of extraction and separation include solvent extraction, column separation, electrophoretic separation, and liquid phase separation. Examples of the reaction include diazotization reaction, nitration reaction, antigen-antibody reaction, enzyme reaction, oxidation-reduction reaction and the like.

Claims (7)

A microchip having a space for accommodating or passing a sample therein;
An optical member for guiding incident light into the space inside the microchip or outgoing light from the space;
A filler having a refractive index approximate to the refractive index of either the optical member or the microchip is provided between the optical member and the incident surface of the incident light or the exit surface of the emitted light in the microchip. An analysis system is provided.   The analysis system according to claim 1, wherein an end portion of the optical member is in contact with the incident surface or the emission surface of the microchip via the filler.   The analysis system according to claim 1, wherein the filler is a fluid.   The analysis system according to claim 1, wherein the filler is in a gel form.   The microchip is detachable with respect to the optical member, and the filling material is provided in advance on the portion of the microchip that becomes the incident surface or the emission surface before being mounted on the optical member. The analysis system according to any one of claims 1 to 4.   The microchip further includes a detachable cover that prevents the filler from flowing out of the exit surface or the entrance surface before being attached to the optical member. 2. The analysis system according to item 1. A microchip having a space for accommodating or passing a sample therein,
A filler having a refractive index that approximates the refractive index of the microchip at a position that becomes an incident surface of light into the internal space or an output surface of light from the space;
A microchip comprising: a removable cover that seals the filler.

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