JP2012089727A - Electronic device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact electronic device having a cured structure obtained by filling the gap between a first substrate and a second substrate, each having electrodes being bonded by solder bumps, with a resin containing filler where the first substrate, and the like, are less susceptible to flexure.SOLUTION: In the electronic device 100, the gap between a first substrate 111 and a second substrate 121 having electrodes 112 and 122 being bonded by solder bumps 113 is filled with a cured first resin composition 130 containing a filler, and the periphery thereof is sealed with a second resin composition 140. Since the cured second resin composition 140 has a Young's modulus lower than that of the cured first resin composition 130, flexure of the first substrate 111 caused by curing of the first resin composition 130 can be relaxed by the second resin composition 140.

Description

  The present invention relates to an electronic device for joining electrodes formed on a first substrate and a second substrate with solder bumps, and a method for manufacturing the same.

  Conventionally, an electronic device has a structure in which electrodes formed on a first substrate and a second substrate are joined by solder bumps, and a space between the solder bumps is filled with a resin containing a filler and cured.

  In such an electronic device, since the gap between the solder bumps of the first substrate and the second substrate connecting the electrodes is cured with the filler-containing resin, the mechanical strength is good.

  Currently, there are various proposals for the electronic device as described above (Patent Document 1).

JP 2003-031614 A

  However, the resin containing the filler has better mechanical strength than the resin not containing the filler, but the residual stress generated in the curing process cannot be ignored. For this reason, in an electronic device in which the gap between the first substrate and the second substrate is filled with the filler-containing resin, for example, the first substrate formed as a small chip may be curved.

  The present invention has been made in view of the above-described problems, and is small in size with a structure in which a gap between a first substrate and a second substrate for bonding mutual electrodes with solder bumps is filled with a resin containing a filler and cured. It is an object of the present invention to provide an electronic device that is unlikely to be bent on the first substrate, and a manufacturing method thereof.

  In the electronic device of the present invention, the electrode on the surface of the small first substrate and the electrode on the surface of the large second substrate are joined by solder bumps, and the gap is filled with the first resin composition containing a filler. The second resin composition is a cured and cured electronic device in which the outer peripheral portion of the first substrate and the surface of the second substrate are sealed with a second resin composition different from the first resin composition. Has a lower Young's modulus than the cured first resin composition.

  Therefore, in the electronic device of the present invention, the gap between the surface of the first substrate and the surface of the second substrate where the mutual electrodes are joined by the solder bump is cured with the first resin composition containing the filler. However, the outer peripheral part is sealed with the hardened | cured material of the 2nd resin composition whose Young's modulus is lower than the hardened 1st resin composition. For this reason, the curvature of the 1st board | substrate generate | occur | produced by hardening of a 1st resin composition is relieve | moderated by a 2nd resin composition.

  In the electronic device as described above, the second resin composition may have a glass transition point lower than that of the first resin composition.

  The manufacturing method of the present invention is a manufacturing method of the electronic device of the present invention, wherein the electrode on the surface of the small first substrate and the electrode on the surface of the large second substrate are joined by solder bumps, The second resin composition is filled with a first resin composition containing a filler in the gap with the second substrate, and the outer periphery of the first substrate and the surface of the second substrate are different from the first resin composition. The sealed and cured second resin composition has a lower Young's modulus than the cured first resin composition.

  In addition, although the manufacturing method of this invention has described several manufacturing processes in order, the order of the description does not limit the order which performs several manufacturing processes. For this reason, when implementing the manufacturing method of this invention, the order of the some manufacturing process can be changed in the range which does not interfere in content.

  In the electronic device of the present invention, the gap between the surface of the first substrate and the surface of the second substrate where the mutual electrodes are joined by solder bumps is cured with the first resin composition containing the filler, The outer peripheral part is sealed with the hardened | cured material of the 2nd resin composition whose Young's modulus is lower than the hardened 1st resin composition. For this reason, the curvature of the 1st board | substrate which generate | occur | produces by hardening of a 1st resin composition can be relieve | moderated by a 2nd resin composition.

It is sectional drawing which shows typically the electronic device of embodiment of this invention. It is process sectional drawing which shows 1 process of the manufacturing method of the electronic device of embodiment of this invention. It is process sectional drawing which shows 1 process of the manufacturing method of the electronic device of embodiment of this invention. It is process sectional drawing which shows 1 process of the manufacturing method of the electronic device of embodiment of this invention.

  An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic device 100 according to the present embodiment includes a solder bump 113 that connects an electrode 112 on the surface of the first substrate 111 of the small circuit chip 110 and an electrode 122 on the surface of the large second substrate 121. The electronic device 100 is bonded and filled with a first resin composition 130 containing a filler in the gap and cured. However, the outer peripheral portion of the first substrate 111 and the surface of the second substrate 121 are different from the first resin composition 130, and the second resin composition 140 has a lower Young's modulus than the cured first resin composition 130. It is sealed with a cured product.

(First resin composition).
First, the resin composition used for the first resin composition 130 will be described. The first resin composition 130 joins the electrodes 112 on the surface of the first substrate 111 of the small circuit chip 110 and the electrodes 122 on the surface of the large second substrate 121 with the solder bumps 113 and fills the gaps therebetween. . That is, in the electronic device 100 finally obtained, the first gap is formed so as to fill a gap between the electrode 112 on the surface of the first substrate 111 of the small circuit chip 110 and the electrode 122 on the surface of the large second substrate 121. The resin composition 130 may be formed. In this embodiment, the filling method is, for example, (i) When the resin composition according to the present invention is liquid at room temperature, the resin composition is applied directly to a support or adherend such as the second substrate 121 and the electrode 122. When the resin composition according to the present invention is a solid at room temperature, the resin varnish is once dissolved or dispersed in a solvent to form a resin varnish, and this resin varnish is applied to a support or an adherend And (ii) a method in which the resin composition according to the present invention is formed into a film and the film is laminated on a support or an adherend.

(I) When forming a resin layer The thermosetting resin contained in the resin composition according to the present invention is not particularly limited. For example, an epoxy resin, an oxetane resin, a phenol resin, a (meth) acrylate resin, Saturated polyester resin, diallyl phthalate resin, maleimide resin and the like can be mentioned, and among these, epoxy resin is preferable. Epoxy resins are preferably used because they are excellent in curability and storage stability, heat resistance of cured products, moisture resistance, chemical resistance, and the like.

  The epoxy resin contained in the resin composition according to the present invention may be either an epoxy resin that is solid at room temperature or an epoxy resin that is liquid at room temperature, or both of them. When the resin composition according to the present invention contains an epoxy resin, the degree of freedom in designing the melting behavior of the resin layer can be further increased.

  Among the epoxy resins contained in the resin composition according to the present invention, the epoxy resin that is solid at room temperature is not particularly limited. For example, bisphenol A type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, Examples include cresol novolac type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, trifunctional epoxy resins, and tetrafunctional epoxy resins. More specifically, those containing both a solid trifunctional epoxy resin and a cresol novolac type epoxy resin may be mentioned, and these may be used alone or in combination of two or more.

  Among the epoxy resins contained in the resin composition according to the present invention, the epoxy resin that is liquid at room temperature is not particularly limited, and examples thereof include bisphenol A type epoxy resins and bisphenol F type epoxy resins. It may be used alone or in combination of two or more. The epoxy equivalent of the epoxy resin that is liquid at room temperature is preferably 150 to 300, more preferably 160 to 250, and still more preferably 170 to 220. As a result, it is possible to prevent the shrinkage rate in the cured product of the resin layer from increasing, to reliably prevent warpage of the electronic device, and to reliably reduce the reactivity with the polyimide resin. Is prevented.

  In the resin composition according to the present invention, the blending amount of the thermosetting resin is preferably 25 to 75% by weight, particularly preferably 45 to 70% by weight, of the constituent material of the resin composition. When the thermosetting resin content in the resin composition is within the above range, it is possible to obtain good curability when curing the thermosetting resin and to design a good melting behavior of the resin layer. It becomes.

  Moreover, the resin composition which concerns on this invention contains a filler. Examples of the filler include, but are not limited to, organic fillers such as acrylic resin, polystyrene resin, polyethylene resin, epoxy resin, silicone resin, and cellulose resin, and inorganic fillers such as calcium carbonate, silica, alumina, and aluminum nitride. Among these, spherical silica is preferable from the viewpoint of imparting high fluidity.

  The filler content is preferably 10% by weight or more and 90% by weight or less, and more preferably 30% by weight or more and 80% by weight or less from the viewpoint of achieving both the fluidity and reliability of the resin.

  The resin composition according to the present invention may contain a compound having a flux action. Thereby, in the solder bonding step, the oxide film covering the surface of the solder is removed, so that good solder bonding can be performed. Although it does not specifically limit as a compound which has a flux effect | action, The compound provided with either a carboxyl group or a phenolic hydroxyl group, or both a carboxyl group and a phenolic hydroxyl group is preferable.

  The compound having a flux function having a carboxyl group means a compound having one or more carboxyl groups in the molecule, and may be liquid or solid. The compound having a phenolic hydroxyl group and having a flux action means a compound having one or more phenolic hydroxyl groups in the molecule, and may be liquid or solid. Further, the compound having a flux action comprising a carboxyl group and a phenolic hydroxyl group refers to a compound in which one or more carboxyl groups and phenolic hydroxyl groups are present in the molecule, and may be liquid or solid.

  Among these, examples of the compound having a flux function having a carboxyl group include aliphatic acid anhydrides, alicyclic acid anhydrides, aromatic acid anhydrides, aliphatic carboxylic acids, and aromatic carboxylic acids.

  Examples of the aliphatic acid anhydride relating to the compound having a flux function having a carboxyl group include succinic anhydride, polyadipic acid anhydride, polyazeline acid anhydride, and polysebacic acid anhydride.

  Examples of alicyclic acid anhydrides related to a compound having a carboxyl group and having a flux action include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, Examples include alkyltetrahydrophthalic anhydride and methylcyclohexene dicarboxylic acid anhydride.

  Aromatic acid anhydrides relating to compounds having a carboxyl group-containing flux function include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, glycerol tristrimellitic acid. Tate etc. are mentioned.

  Examples of the aliphatic carboxylic acid related to the compound having a flux group having a carboxyl group include a compound represented by the following general formula (1), formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid pivalate, caprylic acid, Examples thereof include lauric acid, myristic acid, palmitic acid, stearic acid, acrylic acid, methacrylic acid, crotonic acid, oleic acid, fumaric acid, maleic acid, oxalic acid, malonic acid, and succinic acid.

_{HOOC- (CH 2) n-COOH} (1)
(In formula (1), n represents an integer of 0 or more and 20 or less.)

  Aromatic carboxylic acids related to the compound having a flux function with a carboxyl group include benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, hemimellitic acid, trimellitic acid, trimesic acid, merophanic acid, planitic acid, pyromellitic acid , Meritic acid, triylic acid, xylic acid, hemelic acid, mesitylene acid, prenylic acid, toluic acid, cinnamic acid, salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5 -Dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid), 1,4-dihydroxy-2-naphthoic acid, 3 , Naphthoic acid derivatives such as 5-dihydroxy-2-naphthoic acid, phenolphthaline, diphf Such as Nord acid, and the like.

  Among these compounds having a flux function with carboxyl groups, the activity of the compound having a flux function, the amount of outgas generated when the resin layer is cured, the elastic modulus of the cured resin layer, the glass transition temperature, etc. From the viewpoint of good balance, the compound represented by the general formula (1) is preferable. And among the compounds shown by said general formula (1), while the compound whose n in Formula (1) is 3-10 can suppress that the elasticity modulus in the resin layer after hardening increases. It is particularly preferable in that the adhesion between the support and the adherend can be improved.

Among the compounds represented by the general formula (1), as the compound in which n in the formula (1) is 3 to 10, for example, n = 3 glutaric acid (HOOC— (CH ₂ ) ₃ —COOH), n = 4 adipic acid (HOOC— (CH ₂ ) ₄ —COOH), n = 5 pimelic acid (HOOC— (CH ₂ ) ₅ —COOH), n = 8 sebacic acid (HOOC— (CH ₂ ) ₈ -COOH) and of _{n = 10 HOOC- (CH 2)} 10 -COOH , and the like.

  Examples of the compound having a phenolic hydroxyl group and having a flux action include phenols, and specifically, for example, phenol, o-cresol, 2,6-xylenol, p-cresol, m-cresol, o-ethylphenol. 2,4-xylenol, 2,5 xylenol, m-ethylphenol, 2,3-xylenol, meditol, 3,5-xylenol, p-tertiarybutylphenol, catechol, p-tertiaryamylphenol, resorcinol, p- Mo-containing phenolic hydroxyl groups such as octylphenol, p-phenylphenol, bisphenol A, bisphenol F, bisphenol AF, biphenol, diallyl bisphenol F, diallyl bisphenol A, trisphenol, tetrakisphenol Mer, phenol novolak resins, o- cresol novolak resin, bisphenol F novolac resin, bisphenol A novolac resins.

  A compound having either a carboxyl group or a phenolic hydroxyl group as described above, or a compound having both a carboxyl group and a phenolic hydroxyl group is incorporated three-dimensionally by reaction with a thermosetting resin such as an epoxy resin.

  Therefore, from the viewpoint of improving the formation of the three-dimensional network of the epoxy resin after curing, the compound having a flux action is a compound having a flux action and acting as a curing agent for the epoxy resin, that is, flux. An active curing agent is preferred. Examples of the flux active curing agent include, in one molecule, two or more phenolic hydroxyl groups that can be added to an epoxy resin, and one or more carboxyls directly bonded to an aromatic group that exhibits a flux action (reduction action). And a compound having a group. Such flux active curing agents include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,4- Benzoic acid derivatives such as dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,7- Examples thereof include naphthoic acid derivatives such as dihydroxy-2-naphthoic acid; phenolphthaline; and diphenolic acid. These may be used alone or in combination of two or more.

  The content of the compound having a flux action is preferably 1 to 30% by weight, particularly preferably 3 to 20% by weight, based on the resin composition. When the compounding amount of the compound having the flux action in the resin layer is within the above range, the flux activity of the resin layer can be improved, and the resin layer has an unreacted flux action with the thermosetting resin. The remaining compound can be suppressed. Note that migration may occur if a compound having an unreacted flux action remains.

  Among the compounds that act as curing agents for thermosetting resins, there are compounds that also have a flux action. For example, phenol novolak resins, cresol novolak resins, aliphatic dicarboxylic acids, aromatic dicarboxylic acids and the like that act as a curing agent for epoxy resins also have a flux action.

  Further, the resin composition according to the present invention preferably contains a curing agent other than the compound having a flux action. Thereby, the sclerosis | hardenability of a thermosetting resin can be improved more.

  It does not specifically limit as a hardening | curing agent contained in the resin composition which concerns on this invention, For example, phenols, amines, and thiols are mentioned. When the resin composition according to the present invention contains an epoxy resin as a thermosetting resin, the curing agent is preferably a phenol. When the resin composition according to the present invention contains an epoxy resin as a thermosetting resin, the curing agent is phenols, whereby in the resin layer, good reactivity with the epoxy resin can be obtained. Can obtain a low dimensional change during curing of the epoxy resin contained in the resin layer and appropriate physical properties after curing (for example, heat resistance, moisture resistance, etc.).

  When the resin composition according to the present invention contains an epoxy resin as a thermosetting resin, the phenols contained as a curing agent are not particularly limited, but have two or more functional groups capable of reacting with the epoxy resin. Is preferred. Thereby, the characteristic (for example, heat resistance, moisture resistance, etc.) of the hardened | cured material of the epoxy resin in a resin layer can be aimed at.

  Specific examples of phenols having two or more functional groups capable of reacting with such epoxy resins include, for example, bisphenol A, tetramethylbisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, and trisphenol. , Tetrakisphenol, phenol novolacs, cresol novolacs and the like. Of these, phenol novolacs and cresol novolacs are preferable. Thereby, the melt viscosity of a resin layer can be made suitable and the reactivity with an epoxy resin can be improved. Furthermore, the characteristics (for example, heat resistance, moisture resistance, etc.) of the cured epoxy resin in the resin layer can be further improved.

  When phenol novolacs are used as the curing agent contained in the resin composition according to the present invention, the compounding amount of the curing agent in the resin composition according to the present invention is 5 to 30% by weight of the constituent material of the resin composition. 10 to 25% by weight is particularly preferable. When the blending amount of the curing agent in the resin composition is in the above range, the thermosetting resin can be reliably cured in the resin layer, and the thermosetting resin and unreacted curing in the resin layer. The agent is prevented from remaining, and migration due to the presence of the residue can be suitably prevented.

  In addition, when the thermosetting resin contained in the resin composition which concerns on this invention is an epoxy resin, the compounding quantity of a phenol novolak resin may be prescribed | regulated by the equivalent ratio with respect to an epoxy resin. Specifically, the equivalent ratio of phenol novolacs to epoxy resin is preferably 0.5 to 1.2, particularly preferably 0.6 to 1.1, and 0.7 to 0.98. More preferably. When the blending amount of the phenol novolac resin with respect to the epoxy resin is in the above range, the thermosetting resin can be reliably cured in the resin layer, and the thermosetting resin and the unreacted curing agent in the resin layer. The occurrence of migration due to the presence of this residue can be suitably prevented.

  The resin composition according to the present invention can further contain, for example, an imidazole compound having a melting point of 150 ° C. or higher as a curing accelerator in addition to the above-described curing agent. Thereby, hardening of a resin layer can be performed reliably and the reliability of an electronic device can be improved. Examples of the imidazole compound having a melting point of 150 ° C. or higher include 2-phenylhydroxyimidazole and 2-phenyl-4-methylhydroxyimidazole. In addition, there is no restriction | limiting in particular in the upper limit of melting | fusing point of an imidazole compound, For example, it sets suitably according to the heating temperature in the case of hardening of a resin layer.

  When the resin composition according to the present invention contains such an imidazole compound as a curing accelerator, the blending amount of the curing agent in the resin composition is 0.005 to 10% by weight of the constituent material of the resin composition. Is preferable, and 0.01 to 5 weight% is especially preferable. When the blending amount of the curing agent in the resin composition is within the above range, the function as a curing accelerator of the thermosetting resin is more effectively exhibited, and the curability of the thermosetting resin is increased in the resin layer. In addition to improving the melt viscosity of the resin layer at the temperature at which the solder melts in the resin layer, a good solder joint can be obtained.

  In addition, the hardening accelerator as described above may be a single type or a combination of two or more types.

  Further, the resin composition according to the present invention includes a flux activator for enhancing the activity of a coupling agent, a compound having a flux action, and a resin compatibility, in addition to the compound having a flux action and the thermosetting resin. Various additives for improving various properties such as stability and workability may be appropriately contained.

  When the resin composition according to the present invention contains a coupling agent, the adhesion of the resin layer to the support and the adherend can be further enhanced.

  Examples of the coupling agent include an epoxy silane coupling agent and a silane coupling agent such as an aromatic-containing aminosilane coupling agent, and these may be used alone or in combination of two or more.

  In the resin composition according to the present invention, the amount of the silane coupling agent is preferably 0.01 to 5% by weight of the constituent material of the resin composition.

  When the resin composition according to the present invention is used as a resin varnish, the solvent is not particularly limited, but is preferably inert to the constituent materials of the resin composition as described above. For example, acetone, methyl ethyl ketone , Ketones such as methyl isobutyl ketone, diisobutyl ketone (DIBK), cyclohexanone, diacetone alcohol (DAA); aromatic hydrocarbons such as benzene, xylene, toluene; methyl alcohol, ethyl alcohol, isopropyl alcohol, n-butyl alcohol Alcohols such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, butyrocellosolve acetate (BCSA), etc .; N-methyl-2-pyrrolidone (NMP), tet Hydrofuran (THF), dimethylformamide (DMF), dibasic acid ester (DBE), 3- ethyl ethoxypropionate (EEP), dimethyl carbonate (DMC) and the like. In the resin varnish, the content of the solvent is preferably 10 to 60% by weight of the solid component mixed in the solvent.

(Ii) In the case of forming a film When the resin composition according to the present invention is formed into a film shape and used, the resin composition according to the present invention includes, in addition to a compound having a flux action and a thermosetting resin, It preferably contains a film-forming resin. When the resin composition according to the present invention contains a film-forming resin, a film can be reliably obtained.

  Examples of the film-forming resin include (meth) acrylic resin, phenoxy resin, polyester resin, polyurethane resin, polyimide resin, siloxane-modified polyimide resin, polybutadiene, polypropylene, styrene-butadiene-styrene copolymer, styrene-ethylene- Butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer Examples thereof include coalescence, polyvinyl acetate, and nylon. Among them, (meth) acrylic resin and phenoxy resin are preferable. By applying a (meth) acrylic resin or a phenoxy resin, it is possible to achieve both film formability and adhesion to a support and an adherend. The film-forming resin may be a single type or a combination of two or more types.

  In the film-forming resin, the (meth) acrylic resin is a polymer of (meth) acrylic acid and derivatives thereof, or a copolymer of (meth) acrylic acid and derivatives thereof with other monomers. means. Here, when it describes with (meth) acrylic acid etc., it means acrylic acid or methacrylic acid.

  Specific examples of the acrylic resin used as the film-forming resin include polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polyethyl acrylate, polybutyl acrylate, and polyacrylic acid-2-ethylhexyl. Polyacrylic acid ester; polymethacrylic acid ester such as polymethyl methacrylate, polyethyl methacrylate, polybutyl methacrylate; polyacrylonitrile, polymethacrylonitrile, polyacrylamide, butyl acrylate-ethyl acrylate-acrylonitrile copolymer, Acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, methyl methacrylate-styrene copolymer , Methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-α-methylstyrene copolymer, butyl acrylate-ethyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate-methacrylic acid copolymer, butyl acrylate-acrylic acid Ethyl-acrylonitrile-2-hydroxyethyl methacrylate-acrylic acid copolymer, butyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate copolymer, butyl acrylate-acrylonitrile-acrylic acid copolymer, butyl acrylate-ethyl acrylate -An acrylonitrile copolymer, an ethyl acrylate- acrylonitrile-N, N dimethylacrylamide copolymer, etc. are mentioned. Of these, butyl acrylate-ethyl acrylate-acrylonitrile copolymer and ethyl acrylate-acrylonitrile-N, N dimethylacrylamide copolymer are preferable.

  In addition, as an acrylic resin used as a film-forming resin, by using a (meth) acrylic resin obtained by copolymerizing a monomer having a functional group such as a nitrile group, an epoxy group, a hydroxyl group, or a carboxyl group, The adhesion of the film-like resin layer to the support and adherend, and the compatibility with the thermosetting resin and the like can be improved. In such a (meth) acrylic resin, the amount of the monomer having the functional group is not particularly limited, but is about 0.1 to 50 mol% with respect to the total weight of the (meth) acrylic resin. Is more preferable, about 0.5 to 45 mol% is more preferable, and about 1 to 40 mol% is more preferable. By setting within such a range, the adhesiveness of the film-like resin layer is preferably prevented from becoming too strong while improving the workability, while improving the adhesion between the support and the adherend. Can be planned.

  The weight average molecular weight of the acrylic resin is, for example, 1,000 or more and 1,000,000 or less, and preferably 3000 or more and 900,000 or less. When the weight average molecular weight of the acrylic resin is in the above range, the film-forming property of the resin composition can be further improved and the fluidity at the time of curing can be ensured.

  Further, when a phenoxy resin is used as the film-forming resin, a phenoxy resin having a number average molecular weight of 5000 to 15000 is preferable. By using such a phenoxy resin having a number average molecular weight, the fluidity of the film-like resin layer can be suppressed, and the thickness of the film-like resin layer can be made uniform.

  The skeleton of the phenoxy resin is not particularly limited, and examples thereof include bisphenol A type, bisphenol F type, and biphenyl skeleton type. Among these, a phenoxy resin having a saturated water absorption of 1% or less is preferable. Thereby, generation | occurrence | production of foaming, peeling, etc. resulting from a film-form resin layer can be suppressed.

  The saturated water absorption rate is obtained by processing a phenoxy resin into a film having a thickness of 25 μm, drying it in a 100 ° C. atmosphere for 1 hour (an absolutely dry state), and further placing the film in a constant temperature and humidity chamber at 40 ° C. and 90% RH. The weight change is measured every 24 hours, and the weight at the time when the weight change is saturated can be calculated by the following formula (2).

  Saturated water absorption (%) = {(weight at the time of saturation−weight at the time of absolute drying) / weight at the time of absolute drying} × 100 (2)

  When a polyimide resin is used as the film-forming resin, examples of the polyimide resin include those having an imide bond in the repeating unit. Examples of such a polyimide resin include those obtained by reacting diamine and acid dianhydride and heating and dehydrating and ring-closing the resulting polyamic acid. Examples of the diamine include aromatic diamines such as 3,3′-dimethyl-4,4′diaminodiphenyl, 4,6-dimethyl-m-phenylenediamine, 2,5-dimethyl-p-phenylenediamine, and siloxane diamine. 1,3-bis (3-aminopropyl) -1,1,3,3-tetramethyldisiloxane and the like. These may be used alone or in combination of two or more. Examples of the acid dianhydride include 3,3,4,4′-biphenyltetracarboxylic acid, pyromellitic dianhydride, 4,4′-oxydiphthalic dianhydride, and the like.

  Such a polyimide resin may be soluble or insoluble in the solvent described later, but is preferably soluble in the solvent. Since the polyimide resin is soluble in the solvent, the phase solubility with the constituent material contained in the solution material is improved, so that the handling is excellent. In particular, the siloxane-modified polyimide resin is preferably used because it can be dissolved in various solvents.

  The film-forming resin may be a commercial product.

  Further, when the resin composition according to the present invention is used after being formed into a film, the resin composition according to the present invention can be added with various plasticizers, stabilizers, antistatic agents, pigments, etc., as long as the effects are not impaired. An agent can be contained.

  When the resin composition according to the present invention is formed into a film and used, the blending amount of the film-forming resin in the resin composition according to the present invention is preferably 5 to 45% by weight of the constituent material of the resin composition. When the blending amount of the film-forming resin in the resin composition according to the present invention is in the above range, the elastic modulus in the film-like resin layer after curing is suppressed while suppressing the film-formation deterioration of the film-like resin layer. Can be suppressed. As a result, the adhesion between the film-like resin layer, the support and the adherend can be further improved. Furthermore, an increase in the melt viscosity of the film-like resin layer can be suppressed.

  When the resin composition according to the present invention is formed into a film and used, the resin composition according to the present invention contains a thermosetting resin, and such a thermosetting resin is not particularly limited. Although it is not, it is preferable to contain an epoxy resin. The epoxy resin refers to any of a monomer, an oligomer and a polymer having an epoxy group. Specific examples of epoxy resins include, for example, novolak epoxy resins such as phenol novolac epoxy resins and cresol novolac epoxy resins; bisphenol epoxy resins such as bisphenol A epoxy resins and bisphenol F epoxy resins; hydroquinone epoxy resins Biphenyl type epoxy resin; stilbene type epoxy resin; triphenolmethane type epoxy resin; triazine nucleus-containing epoxy resin; dicyclopentadiene modified phenol type epoxy resin; naphthol type epoxy resin and phenol aralkyl type having phenylene and / or biphenylene skeleton Epoxy resins, aralkyl type epoxy resins such as naphthol aralkyl type epoxy resins having a phenylene and / or biphenylene skeleton, and others Or higher functional epoxy resins.

  When the resin composition according to the present invention is molded into a film and used, and the resin composition according to the present invention contains an epoxy resin, the content of the epoxy resin contained in the resin composition according to the present invention is Although not particularly limited, it is preferably 10 to 90% by weight, particularly preferably 20 to 80% by weight. When the content of the epoxy resin contained in the resin composition is in the above range, both a low linear expansion coefficient and toughness after curing of the film-like resin layer can be achieved.

  When the resin composition according to the present invention is formed into a film and used, and the resin composition according to the present invention contains an epoxy resin, the softening point of the epoxy resin contained in the resin composition according to the present invention is Although it will not specifically limit if it has compatibility with film forming resin, 40-100 degreeC is preferable and 50-90 degreeC is especially preferable. By setting it as the said lower limit or more, since the tackiness of a film-form resin layer can be reduced, the workability | operativity of a film-form resin layer can be improved. Moreover, the raise of the melt viscosity of a film-form resin layer can be suppressed by setting it as the said upper limit or less.

  When the resin composition according to the present invention is formed into a film and used, and the resin composition according to the present invention contains an epoxy resin, the resin composition according to the present invention is not particularly limited. It is preferable to contain a curing agent. Such a hardening | curing agent should just act as a hardening | curing agent of an epoxy resin, and is selected suitably. Specifically, polyamines including aliphatic polyamines such as diethylenetriamine, triethylenetetramine, and metaxylylenediamine, aromatic polyamines such as diaminodiphenylmethane, m-phenylenediamine, and diaminodiphenylsulfone, dicyandiamide, and organic acid dihydrazide Amine-based curing agents such as compounds, aliphatic acid anhydrides such as hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, aromatic acid anhydrides such as tritometic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic acid, etc. Acid anhydride curing agent, phenol novolac resin, cresol novolac resin, phenol aralkyl (including phenylene and biphenylene skeleton) resin, naphthol aralkyl (including phenylene and biphenylene skeleton) resin Triphenol methane resin, dicyclopentadiene type phenol resin, bis (mono or di t-butylphenol) propane, methylene bis (2-propenyl) phenol, propylene bis (2-propenyl) phenol, bis [(2-propenyloxy) phenyl] Methane, bis [(2-propenyloxy) phenyl] propane, 4,4 ′-(1-methylethylidene) bis [2- (2-propenyl) phenol], 4,4 ′-(1-methylethylidene) bis [ 2- (1-phenylethyl) phenol], 4,4 ′-(1-methylethylidene) bis [2-methyl-6-hydroxymethylphenol], 4,4 ′-(1-methylethylidene) bis [2- Methyl-6- (2-propenyl) phenol], 4,4 ′-(1-methyltetradecylidene) bis Examples thereof include phenolic curing agents such as phenol.

  When the resin composition according to the present invention is molded into a film and used, and the resin composition according to the present invention contains an epoxy resin, the content of the curing agent in the resin composition according to the present invention is epoxy It is obtained by calculating the equivalent ratio of the epoxy equivalent of the resin and the curing agent. When the curing agent is a phenol resin, the equivalent ratio of the epoxy equivalent of the epoxy resin to the functional group of the curing agent is preferably 0.5 to 1.5, particularly preferably 0.7 to 1.3. By setting it as the said range, the heat resistance of a film and storability can be made compatible.

  When the resin composition according to the present invention is formed into a film and used, and the resin composition according to the present invention contains an epoxy resin, the resin composition according to the present invention may contain a curing accelerator. Good. Such a curing accelerator may be selected as long as it accelerates the curing reaction between the epoxy resin and the curing agent. Specific examples include imidazoles, amine-based catalysts such as 1,8-diazabicyclo (5,4,0) undecene, and phosphorus compounds such as salts of triphenylphosphine and tetra-substituted phosphonium with polyfunctional phenol compounds. Among these, imidazoles and phosphorus compounds that achieve both fast curability of the film-like resin layer, storage stability, and corrosivity of the aluminum pad on the semiconductor element are preferable.

  When the resin composition according to the present invention is formed into a film and used, and the resin composition according to the present invention contains an epoxy resin, the content of the curing accelerator in the resin composition of the present invention is 0. 0.001 to 10% by weight is preferable, and 0.01 to 5% by weight is particularly preferable. By setting it as the said range, it becomes possible to maintain the balance of the quick-hardening property of a film-form resin layer, preservability, and the physical property after hardening.

  As the imidazole as a curing accelerator, an imidazole compound having a melting point of 150 ° C. or higher is preferable, and examples thereof include 2-phenylhydroxyimidazole, 2-phenyl-4-methylhydroxyimidazole, 2-phenyl-4-methylimidazole and the like. .

  Among the phosphorus compounds as curing accelerators, tetra-substituted phosphonium and polyfunctional phenols that excel in the fast curing properties of the film-like resin layer, the corrosiveness to aluminum pads of semiconductor elements, and the storage stability of the film-like resin layer Particularly preferred are salts with compounds.

  A salt of a tetra-substituted phosphonium and a polyfunctional phenol compound is not a simple mixture but a compound having a structure such as a salt structure or a supramolecular structure. The tetra-substituted phosphonium salt of the tetra-substituted phosphonium and the polyfunctional phenol compound is preferably a compound in which four alkyl groups or aromatic compounds are coordinated to the phosphorus atom from the balance between curability and storage stability of the film.

  The substituents of the tetra-substituted phosphonium are not particularly limited, and may be the same or different from each other, and a tetra-substituted phosphonium ion having a substituted or unsubstituted aryl group or alkyl group as a substituent is heated. It is stable and preferred for hydrolysis. Specific examples of the tetra-substituted phosphonium include tetraphenylphosphonium, tetratolylphosphonium, tetraethylphenylphosphonium, tetramethoxyphenylphosphonium, tetranaphthylphosphonium, tetrabenzylphosphonium, ethyltriphenylphosphonium, n-butyltriphenylphosphonium, 2-hydroxyethyl. Examples thereof include triphenylphosphonium, trimethylphenylphosphonium, methyldiethylphenylphosphonium, methyldiallylphenylphosphonium, tetra-n-butylphosphonium and the like. Among these, tetraphenylphosphonium is preferable from the balance between the fast curability of the film and the storage stability.

  The polyfunctional phenol compound of the molecular compound of the tetra-substituted phosphonium and the polyfunctional phenol compound is a compound having a phenolic hydroxyl group, and at least one of the hydroxyl groups is removed to form a phenoxide type compound. Specific examples include a hydroxybenzene compound, a biphenol compound, a bisphenol compound, a hydroxynaphthalene compound, a phenol novolac resin, and a phenol aralkyl resin.

  Examples of the polyfunctional phenol compound include bis (4-hydroxy-3,5-dimethylphenyl) methane (commonly called tetramethylbisphenol F), 4,4′-sulfonyldiphenol, and 4,4′-isopropylidenediphenol. (Commonly known as bisphenol A), bis (4-hydroxyphenyl) methane, bis (2-hydroxyphenyl) methane, (2-hydroxyphenyl) (4-hydroxyphenyl) methane and bis (4-hydroxyphenyl) methane, Bisphenols such as bis (2-hydroxyphenyl) methane and three mixtures of (2-hydroxyphenyl) (4-hydroxyphenyl) methane (for example, bisphenol FD manufactured by Honshu Chemical Industry Co., Ltd.), 1,2 -Benzenediol, 1,3-benzenediol, 1,4- Dihydroxybenzenes such as benzene diol, trihydroxybenzenes such as 1,2,4-benzenetriol, various isomers of dihydroxynaphthalene such as 1,6-dihydroxynaphthalene, 2,2′-biphenol, 4,4′- Although compounds such as various isomers of biphenols such as biphenol can be mentioned, 1,2-dihydroxynaphthalene and 4,4′-sulfonyldiphenol, which are excellent in the balance between fast curability and storage stability, are preferable.

  When the resin composition according to the present invention is formed into a film and used, such a film-shaped resin layer includes, for example, a compound having a flux action and a thermosetting resin, and, if necessary, a film-forming resin. And other components are dissolved in a solvent to prepare a film-like resin layer forming material (liquid material), and then the film-like resin layer forming material is subjected to a release treatment such as a polyester sheet. It is obtained by coating on the base material, removing the solvent at a predetermined temperature, and drying.

  Examples of the solvent used for the preparation of the film-shaped resin layer forming material include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, DIBK (diisobutyl ketone), cyclohexanone, DAA (diacetone alcohol), benzene, Aromatic hydrocarbons such as xylene and toluene, alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol and n-butyl alcohol, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, BCSA (butyrocell solve) Cellosolve such as acetate), NMP (N-methyl-2-pyrrolidone), THF (tetrahydrofuran), DMF (dimethylformamide), DBE (dibasic acid ester), E P (3- ethyl ethoxypropionate), DMC (dimethyl carbonate) and the like.

  Moreover, the thickness (average) of the film-like resin layer is not particularly limited, but is preferably about 3 to 100 μm, and more preferably about 5 to 50 μm.

(Second resin composition)
The second resin composition 140 can act as a stress relaxation material. As a material of the second resin composition 140, the same material as the first resin composition 130 may be used, or a different material may be used. Moreover, it is preferable that the content of a filler is smaller than the 1st resin composition, and the 2nd resin composition 140 may also contain a 50 weight% or less filler, for example. Moreover, it is more preferable that the 2nd resin composition 140 does not contain a filler from a viewpoint of reducing curvature more.
Further, although not particularly limited, from the viewpoint of improving the compatibility between the first resin composition and the second resin composition, when the epoxy resin curing system is used as the first resin composition 130, the second resin composition 140 is particularly preferably an epoxy resin curing system.

  Here, the cured second resin composition 140 has a lower Young's modulus than the cured first resin composition 130. The Young's modulus of the first resin composition 130 is, for example, 1 to 15 GPa at 25 ° C., and the Young's modulus of the second resin composition 140 is, for example, 0.01 to 5 GPa at 25 ° C. The Young's modulus of the cured second resin composition 140 is preferably 1/2 to 1/10 lower than the Young's modulus of the cured first resin composition 130. As a result, the connection between the small circuit chip 110 and the first substrate 111 is made more reliable, and the bending of the first substrate 111 caused by the curing of the first resin composition 130 is relieved by the second resin composition 140. It can be reduced by the action.

The Young's modulus can be measured, for example, as follows.
The evaluation product cured at 150 ° C./3 h was processed into a size of 10 × 100 × 0.5 mm, and the test piece was pulled at a test speed of 1 mm / min by using Tensilon RTA-100 manufactured by Orientec. The Young's modulus is derived from the measured SS curve.

  The glass transition point of the second resin composition 140 is preferably lower than the glass transition point of the first resin composition 130. The glass transition point of the 1st resin composition 130 is 70-180 degreeC, for example, and the glass transition point of the 2nd resin composition 140 is 20-120 degreeC, for example. The glass transition point of the second resin composition 140 is preferably 10 to 100 ° C. lower than the glass transition point of the first resin composition 130. Thereby, at the time of hardening of the 1st resin composition 130, the 2nd resin composition 140 becomes a stress relaxation material, and it can control curvature of the 1st substrate 111.

The glass transition point can be measured, for example, as follows.
Using TMA / SS6000 manufactured by Seiko Instruments Inc., the expansion rate of the cured product was measured when the temperature was increased from −100 ° C. to 300 ° C. at a heating rate of 10 ° C./min by the compression method (load 50 mN). The inflection point obtained from the curve is defined as the glass transition temperature (Tg).

  Furthermore, it is preferable that the thermal expansion coefficient (CTE) of the second resin composition 140 is higher than the thermal expansion coefficient of the first resin composition 130. The thermal expansion coefficient of the first resin composition 130 is, for example, 10 to 60, and the thermal expansion coefficient of the second resin composition 140 is, for example, 25 to 150. The thermal expansion coefficient of the second resin composition 140 is preferably 5 to 100 higher than the thermal expansion coefficient of the first resin composition 130. Thereby, at the time of hardening of the 1st resin composition 130, the 2nd resin composition 140 becomes a stress relaxation material, and it can control curvature of the 1st substrate 111.

The coefficient of thermal expansion (CTE) can be measured, for example, as follows.
Similarly to Tg measurement, the expansion of the cured product when the temperature was increased from −100 ° C. to 300 ° C. at a rate of temperature increase of 10 ° C./min by TMA / SS6000 manufactured by Seiko Instruments Inc. (load 50 mN). The coefficient of expansion is measured, and the coefficient of expansion with respect to temperature change is calculated as the coefficient of linear expansion (CTE).

  Next, a method for manufacturing the electronic device 100 as described above will be described below. First, as shown in FIG. 2, solder bumps 113 are formed on the electrodes 112 on the surface of the first substrate 111 of the small circuit chip 110.

  Subsequently, as shown in FIG. 3, the electrode 112 on the surface of the first substrate 111 of the small circuit chip 110 and the electrode 122 on the surface of the large second substrate 121 are joined by the solder bump 113. At this time, the first substrate 111 and the second substrate 121 may be pressure-cured.

  The pressure is preferably from 0.1 MPa to 10 MPa, more preferably from 0.5 MPa to 5 MPa. Thereby, it becomes difficult to generate voids in the cured product of the resin composition. The pressurization is preferably performed using a fluid, and examples thereof include gases such as nitrogen gas, argon gas, and air. Air is particularly preferred because of its low cost.

  Moreover, the heating temperature should just be the temperature more than the curing temperature of a resin layer, and although it selects suitably, it is 100-250 degreeC normally, Preferably it is 150-200 degreeC. The heating time is appropriately selected depending on the type of the resin layer, but is usually 0.5 to 3 hours, preferably 1 to 2 hours.

  As a method of curing the resin layer while pressurizing with a pressurized fluid, for example, an object to be heated is placed in a pressure vessel, and then the pressurized fluid is introduced into the pressure vessel and pressurized. , A method of heating an object to be processed, and more specifically, an object to be processed in a pressure oven while the object to be processed is placed in the pressure oven and a gas for pressurization is introduced into the pressure oven. The method of heating is mentioned.

  Further, as shown in FIG. 4, the gap between the first substrate 111 and the second substrate 121 is filled with a first resin composition 130 containing a filler. And as shown in FIG. 1, the 2nd resin composition 140 is apply | coated so that the 1st resin composition 130 may be covered, it heats, and the 1st resin composition 130 and the 2nd resin composition 140 are hardened. Thereby, the outer peripheral part of the 1st board | substrate 111 and the surface of the 2nd board | substrate 121 are sealed with the 2nd resin composition 140 different from the 1st resin composition 130. FIG.

  In the electronic device 100 of the present invention, the gap between the surface of the first substrate 111 and the surface of the second substrate 121 where the electrodes are joined by the solder bumps 113 is cured by the first resin composition 130 containing a filler. Has been.

  However, the outer peripheral portion is sealed with a cured product of the second resin composition 140 having a Young's modulus lower than that of the cured first resin composition 130. For this reason, the curvature of the 1st board | substrate 111 which generate | occur | produces by hardening of the 1st resin composition 130 can be relieve | moderated by the 2nd resin composition 140. FIG.

  The present invention is not limited to the present embodiment, and various modifications are allowed without departing from the scope of the present invention. For example, in the above embodiment, the solder bump 113 is illustrated as being formed on the electrode 112 of the first substrate 111 of the circuit chip 110. However, such a solder bump 113 may be formed on the electrode 122 of the second substrate 121, or may be formed on both (not shown). Alternatively, after filling the gap between the first substrate 111 and the second substrate 121 with the first resin composition 130, the first resin composition 130 is semi-cured and then the second resin composition 140 is applied. Good.

  Needless to say, the above-described embodiments and modifications can be combined within a range in which the contents do not conflict with each other. Further, in the above-described embodiments and modifications, the structure of each part has been specifically described, but the structure and the like can be changed in various ways within a range that satisfies the present invention.

Next, examples of the present invention will be described.
The following evaluation was performed about the obtained resin composition or its hardened | cured material. The evaluation results are shown in the table.

[Measurement of Young's modulus]
An evaluation product cured at 150 ° C./3 h was processed into a size of 10 × 100 × 0.5 mm, and the test piece was measured by a tensile method using a Tensilon RTA-100 manufactured by Orientec at a test speed of 1 mm / min. The Young's modulus was derived from the obtained SS curve.

[Measurement of glass transition temperature]
Using TMA / SS6000 manufactured by Seiko Instruments Inc., the expansion rate of the cured product was measured when the temperature was increased from −100 ° C. to 300 ° C. at a heating rate of 10 ° C./min by the compression method (load 50 mN). The inflection point obtained from the curve was defined as the glass transition temperature (Tg).

[Measurement of thermal expansion coefficient]
Using a TMA / SS6000 manufactured by Seiko Instruments Inc., the expansion rate of the cured product was measured at a temperature increase rate of 10 ° C./min from −100 ° C. to 300 ° C. by the compression method (load 50 mN). The expansion coefficient with respect to the change was calculated as a linear expansion coefficient (CTE).

Example 1
[Preparation of resin composition]
As the first resin composition, bisphenol F type epoxy resin (DIC Corporation, EXA-830LVP, epoxy equivalent 160) 24.99% by weight and phenol novolak (Sumitomo Durez Co., Ltd., PR51740, softening point 110 ° C.) 14 99 wt%, 2-phenyl-4-methylimidazole (manufactured by Shikoku Chemicals Co., Ltd., 2P4MZ) 0.05 wt%, inorganic silica (manufactured by Admatechs Co., Ltd., SO-E3) 59.97 wt% After weighing and dispersing and kneading with three rolls, a defoaming treatment was performed under vacuum to obtain a paste-like resin composition. Moreover, as a 2nd resin composition composition, bisphenol F-type epoxy resin (DIC Corporation make, EXA-830LVP, epoxy equivalent 160) 62.42 weight%, phenol novolak (Sumitomo Durez KK make, PR51740, softening (Point 110 ° C.) 37.45% by weight and 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.12% by weight, and after being dispersed and kneaded with three rolls, A defoaming treatment was performed under vacuum to obtain a paste-like resin composition.

[Production of electronic devices]
A semiconductor element (size: 15 × 15 × 0.65 mm) having solder bumps on a circuit board on which a circuit pattern is formed (ELC-4785GS, manufactured by Sumitomo Bakelite Co., Ltd.) is formed on the paste-like first resin composition. Although it heated at 280 degreeC and 10 second with the flip chip bonder, it filled with the space | gap (0.05 mm) formed between a semiconductor chip and a board | substrate. Then, the 2nd resin composition was apply | coated so that the 1st resin composition might be covered with the method of apply | coating sealing around a chip | tip. Finally, the first and second resin compositions were cured by heating at 150 ° C. for 120 minutes to obtain a semiconductor device.

(Example 2)
As the second resin composition, bisphenol F type epoxy resin (DIC Corporation, EXA-830LVP, epoxy equivalent 160) 49.95% by weight, phenol novolak (Sumitomo Durez Co., Ltd., PR51740, softening point 110 ° C.) 29 .97% by weight, 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.1% by weight, inorganic silica (manufactured by Admatechs Co., Ltd., SE2100) 19.98% by weight A resin composition and a semiconductor device were obtained by the same production method as in Example 1 except that the mixture was dispersed and kneaded with three rolls.

(Comparative Example 1)
As the second resin composition, bisphenol F-type epoxy resin (DIC Corporation, EXA-830LVP, epoxy equivalent 160) 24.99% by weight, phenol novolak (Sumitomo Durez Co., Ltd., PR51740, softening point 110 ° C.) 14 99% by weight, 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.05% by weight, inorganic silica (manufactured by Admatechs Co., Ltd., SE2100) 59.97% by weight A resin composition and a semiconductor device were obtained by the same production method as in Example 1 except that the mixture was dispersed and kneaded with three rolls.

(Comparative Example 2)
As the first resin composition, 62.42% by weight of bisphenol F type epoxy resin (DIC Corporation, EXA-830LVP, epoxy equivalent 160) and phenol novolak (Sumitomo Durez Co., Ltd., PR51740, softening point 110 ° C.) 37 .45% by weight and 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.12% by weight were weighed and dispersed and kneaded with three rolls to obtain a paste-like resin composition. A resin composition and a semiconductor device were obtained by the same production method as in Example 1 except for the production.

(result)
[Warpage of semiconductor device]
The warpage of the obtained semiconductor device was measured using a surface roughness meter SURFCOM 480A (manufactured by ACCRETECH). The displacement was measured from the substrate side, and the value with the largest difference was read as the warp value. Each code is as follows.
A: The amount of warpage was 80 μm or less.
A: The amount of warpage exceeded 80 μm and was 100 μm or less.
(Triangle | delta): The curvature amount exceeded 100 micrometers and was 120 micrometers or less.
X: The amount of warpage exceeded 120 μm.

[Reliability evaluation]
Reliability evaluation was performed by evaluating the peelability and connectivity of a semiconductor device after performing a reflow resistance test under conditions of JEDEC level 3 (* 1) and 260 ° C. peak SMT reflow (3 times). The evaluation was performed at N = 10. The number of semiconductor devices determined to be NG was counted, where NG was one where peeling or poor connection occurred. Subsequently, a temperature cycle test of −55 ° C. to 125 ° C. was performed on the semiconductor device in which no defect occurred, and peeling or connectivity after 500 cycles was evaluated. At this time, the number of the semiconductor devices determined to be NG was counted by setting NG as one where peeling or poor connection occurred.

  * 1: JEDEC (Joint Electron Engineering Engineering Council) level 3 conditions are 30 ° C., 60% RH, 192 hours.

100 Electronic Device 110 Circuit Chip 111 First Substrate 112 Electrode 113 Solder Bump 121 Second Substrate 122 Electrode 130 First Resin Composition 140 Second Resin Composition

Claims (6)

An electronic device in which an electrode on the surface of a small first substrate and an electrode on the surface of a large second substrate are joined by solder bumps, filled with a first resin composition containing a filler in the gap, and cured. There,
The outer periphery of the first substrate and the surface of the second substrate are sealed with a second resin composition different from the first resin composition, and the cured second resin composition is cured first An electronic device having a Young's modulus lower than that of a resin composition.   The electronic device according to claim 1, wherein the second resin composition has a glass transition point lower than that of the first resin composition.   The electronic device according to claim 1, wherein the first resin composition contains a thermosetting resin.   4. The electronic device according to claim 1, wherein the first resin composition contains the filler in an amount of 10 wt% to 90 wt%.   The electronic device according to any one of claims 1 to 4, wherein the second resin composition does not contain a filler. A method for manufacturing an electronic device according to any one of claims 1 to 5,
Join the electrodes on the surface of the small first substrate and the electrodes on the surface of the large second substrate with solder bumps,
Filled with a first resin composition containing a filler in the gap between the first substrate and the second substrate,
Sealing the outer periphery of the first substrate and the surface of the second substrate with a second resin composition different from the first resin composition;
The method for producing an electronic device, wherein the cured second resin composition has a lower Young's modulus than the cured first resin composition.

Images