JP2012089190A - Method for preventing position shift of uncured resist coated disk from lower surface-side stamper device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for preventing an uncured resist coated disk, positioned and placed on a lower stamper of a lower surface-side stamper device, from shifting in position when the lower surface-side stamper device moves, in a double-sided imprint device.SOLUTION: The method includes the steps of: (a) positioning and placing the disk having both surfaces coated with uncured resist on an upper surface of a lower stamper mounted on the lower surface-side stamper device and having a fine transfer pattern; (b) partly irradiating at least a part, not corresponding to the fine transfer pattern of the stamper, of the resist present at a boundary surface between the lower stamper and the disk lower surface side with UV light; and (c) curing the resist at the UV-light irradiated part to temporarily and partly fix the disk to the upper surface of the lower stamper.

Description

  The present invention relates to a method for preventing misregistration of a transferred object to be imprinted in a double-sided imprint apparatus suitable for an application for forming a fine structure on both sides like a discrete track medium.

  With the remarkable improvement in functions of various information devices such as computers, the amount of information handled by users is steadily increasing and has reached the tera unit range from giga. Under such circumstances, there is an increasing demand for semiconductor devices such as information storage / reproduction devices and memories having higher recording density than before.

  In order to increase the recording density, a finer processing technique is required. The conventional photolithographic method using an exposure process can finely process a large area at a time, but since it does not have resolution below the wavelength of light, it naturally has a microstructure below the wavelength of light (for example, 100 nm or less). It is not suitable for making. As a processing technique for a fine structure having a wavelength equal to or less than the wavelength of light, there are an exposure technique using an electron beam, an exposure technique using an X-ray, an exposure technique using an ion beam, and the like. However, the pattern formation by the electron beam drawing apparatus is different from the batch exposure method using a light source such as i-line or excimer laser, and the more patterns to be drawn by the electron beam, the longer the drawing (exposure) time is. . Therefore, as the recording density increases, the time required to form a fine pattern becomes longer, and the manufacturing throughput is significantly reduced. On the other hand, in order to increase the speed of pattern formation by an electron beam lithography system, the development of a collective figure irradiation method that irradiates an electron beam in a batch by combining masks of various shapes is progressing. The size of the electron beam drawing apparatus using the method is increased, and a mechanism for controlling the position of the mask with higher accuracy is further required, which increases the cost of the drawing apparatus itself and consequently increases the medium manufacturing cost. There are problems such as.

  As a processing technique for a fine structure having a wavelength equal to or less than the wavelength of light, a method using a printing technique has been proposed instead of the conventional exposure technique. For example, Patent Document 1 describes an invention related to “nanoimprint lithography (NIL) technology”. Nanoimprint lithography (NIL) technology uses a processing technique for fine structures below the wavelength of light, such as an electron beam exposure technique, to press a master (mold) with a predetermined fine structure pattern onto a resist-coated transfer substrate in advance. In this technique, the fine structure pattern of the original plate is transferred to the resist layer of the substrate to be transferred. As long as the original plate is available, there is no need for a particularly expensive exposure device, and replicas can be mass-produced with a normal printer-level device, so throughput is dramatically improved compared to electron beam exposure technology, etc., and manufacturing costs are greatly increased. Reduced to An apparatus used for such a purpose is called a “microstructure transfer apparatus” or an “imprint apparatus”.

  In the case of using a thermoplastic resin as a resist in the nanoimprint lithography (NIL) technique, the material is transferred by pressurizing it at a temperature near or above the glass transition temperature (Tg) of the material. This method is called a thermal transfer method. The thermal transfer method has an advantage that a general-purpose resin can be widely used as long as it is a thermoplastic resin. On the other hand, when using a photosensitive resin as a resist, it transfers with the photocurable resin which hardens | cures when light, such as an ultraviolet-ray, is exposed. This method is called an optical transfer method.

  The photoimprint type nanoimprint processing method requires the use of a special photo-curing resin, but the advantage of reducing the dimensional error of the finished product due to the thermal expansion of the transfer printing plate and printed material compared to the thermal transfer method. There is. In addition, there is no need for a heating mechanism or additional devices such as temperature rise, temperature control, and cooling on the device, and the imprint (microstructure transfer) device as a whole is also equipped with countermeasures against thermal distortion such as heat insulation. Therefore, there is an advantage that no design consideration is required.

  An example of an optical transfer type imprint (microstructure transfer) apparatus is described in Patent Document 2. This apparatus is configured such that a stamper capable of transmitting ultraviolet rays is pressed against a substrate to which a photocurable resin is applied, and ultraviolet rays are irradiated from above. A predetermined fine structure pattern is formed on the transfer substrate pressing surface of the stamper.

  As shown in Patent Document 1 and Patent Document 2, in a conventional imprint apparatus, a predetermined fine structure pattern has been mainly formed only on one side of a transfer target. However, recently, in order to further increase the recording density, it has been strongly demanded to form a fine structure pattern on both sides like a discrete track medium.

  In order to meet such a demand, the present inventors filed a double-sided imprint apparatus as Japanese Patent Application No. 2009-294119. An outline sectional view of an example of the apparatus is shown in FIGS. 1 to 7 attached to the specification of Japanese Patent Application No. 2009-294119. The double-sided imprint apparatus invented by the present inventors includes an upper surface stamper device 5 supported by an elevating mechanism 17, a lower surface side stamper device 3 fixed on a moving table 9 placed on a guide rail 11, and a cover. The transfer table peeling device 7 and the moving table 9 can be reciprocated on the guide rail 11 by a moving drive mechanism 15, whereby the lower surface side is centered on the position of the upper surface side stamper device 5. The stamper device 3 and the transferred object peeling device 7 can alternately move to positions facing the upper surface side stamper device 5. In the double-sided imprinting apparatus invented by the present inventors, the lower surface side stamper device 3 and the transferred object peeling device 7 are integrally fixed to the moving table 9 placed on the guide rail 11. It can reciprocate around the position of the side stamper device 5. Thus, for example, when a disk coated with an uncured resist is placed on the lower surface side stamper device 3, the lower surface side stamper device 3 is shifted from the facing position of the upper surface side stamper device 5, and the upper surface side stamper device 5. The transferred object peeling device 7 is opposed to the other. When the uncured resist coating disk 43 is placed on the lower stamper 29 on the lower surface side stamper device 3, the lower surface side stamper device 3 is moved to a position facing the upper surface side stamper device 5, and the upper surface side stamper device 5 is lowered. A double-sided transfer operation is performed, and then the upper surface side stamper device is raised to peel the transferred disk 53 from the lower surface side stamper device 3. Thereafter, the transferred object peeling device 7 is opposed to the upper surface side stamper device 5, and the transferred disk 53 is peeled from the upper surface side stamper device 5. At this time, the next application disk can be placed on the lower surface side stamper device 3. Finally, the transferred disk 53 held by the transferred object peeling apparatus can be recovered by shifting the transferred object peeling apparatus from the facing position of the upper surface side stamper apparatus. As described above, since the next coating disk 43 has already been placed on the lower surface side stamper device 3, if the upper surface side stamper device 5 is lowered toward the lower surface side stamper device 3, the double-sided transfer operation is quickly and continuously performed. Can be implemented. As described above, according to the double-sided imprinting apparatus of the present invention, it is possible to continuously and efficiently perform double-sided imprinting on a transfer object with a set of press mechanisms, simplifying the structure of the apparatus, and improving throughput. Can be significantly increased.

  When the uncured resist-coated disk 43 is placed on the lower stamper 29, the alignment camera 23 of the lower surface stamper device 3 detects the center of the inner diameter of the disk 43 and the alignment mark at the center of the lower stamper 29, and the detection. Based on the signal, the XY stage 21 is driven, and the disk 43 and the lower stamper 29 are aligned. When the disk 43 and the lower stamper 29 are aligned, the disk handling arm 45 is lowered and the disk 43 is placed on the surface of the lower stamper 29. However, in the above-described double-sided imprint apparatus, the uncured resist coating disk 43 placed on the lower stamper 29 of the lower surface side stamper apparatus 3 is only subjected to the lower stamper by the viscosity and surface tension of the lower uncured resist 49b. 29 is only held in position. Therefore, when the lower surface side stamper device 3 is moved toward the upper surface side stamper device 5, an uncured resist coating disk 43 is caused by a change in acceleration when the lower surface side stamper device 3 starts moving, during movement, and when the movement stops. There was a case where the mounting position of was shifted. As a result, imprint defects occur in the transfer operation, which causes a decrease in yield of final good products.

US Pat. No. 5,772,905 (US005772905A) JP 2008-12844 A (P2008-12844A)

  Accordingly, an object of the present invention is to provide a method for preventing an uncured resist-coated disc positioned and placed on the lower stamper of the lower surface side stamper device from causing a positional shift when the lower surface side stamper device is moved. It is to be.

The subject includes an upper surface side stamper device supported by an elevating mechanism, a lower surface side stamper device fixed to a moving table placed on a guide rail, and a transfer object peeling device, and the moving table is driven to move. The mechanism can reciprocate on the guide rail, whereby the lower surface stamper device and the transferred object peeling device face the upper surface stamper device with the position of the upper surface side stamper device as the center. In the double-sided imprinting apparatus that can move alternately, a method for preventing misalignment from the lower surface side stamper device of the uncured resist-coated disc,
(a) a step of positioning and placing a disk on which uncured resist is applied on both sides, placed on the upper surface of a lower stamper having a fine transfer pattern, mounted on the lower surface stamper device;
(b) irradiating at least a part of a portion of the resist existing on the interface between the lower stamper and the disk lower surface side that does not cover the fine transfer pattern of the stamper with UV light;
(c) curing the resist of the UV light irradiation part to partially fix the disk to the upper surface of the lower stamper;
This is solved by a method for preventing misalignment of an uncured resist-coated disk.

  According to the method of the present invention, after the disk on which both sides of the uncured resist are applied is positioned and placed on the upper surface of the lower stamper having the fine transfer pattern of the lower surface stamper device, the stamper and the disk At least a portion of the resist existing at the interface of the stamper that does not cover the fine transfer pattern of the stamper is irradiated with UV light to partially cure the resist, and the disk is partially applied to the lower stamper. It can be fixed to. As a result, even if there is a change in acceleration when the lower surface stamper device fixed to the moving table mounted on the guide rail starts moving, during movement, and when the movement stops, the lower stamper upper surface is not mounted. It is also possible to effectively prevent misalignment of the cured resist double-sided coated disk.

(A) And (B) is the partial expanded plan view of the lower surface side of the disk 43 partially hardened by the method of this invention. FIG. 2 is a partial schematic perspective view of an example of a UV light source 25 ′ used for partial irradiation of a disk 43 shown in FIG. 1. It is a schematic sectional drawing which shows one process at the time of enforcing the uncured resist application disc position shift prevention method of this invention. It is a schematic sectional drawing which shows one process at the time of enforcing the uncured resist application disc position shift prevention method of this invention. It is a schematic sectional drawing which shows one process at the time of enforcing the uncured resist application disc position shift prevention method of this invention.

  Hereinafter, preferred embodiments of the uncured resist-coated disc displacement prevention method of the present invention will be described with reference to the drawings. In the following description, for convenience of explanation, the same members as those shown in the drawings attached to Japanese Patent Application No. 2009-294119 which is the prior application of the inventor of the present application are designated by the reference numerals used in the accompanying drawings of the prior application. Use the same sign. For convenience of explanation, the dimensions of the illustrated members are exaggerated.

  1A and 1B are partially enlarged plan views of the lower surface side of a disk 43 partially cured by the method of the present invention. The upper surface side has the same configuration as the lower surface side. The disk 43 has a through-hole having a predetermined radius from the center (marked x in the figure). This is for inserting a rotating shaft such as a hard disk motor. A resist non-application region 51 where the lower surface side uncured resist 49b is not applied exists adjacent to the through hole. The resist non-application area 51 is used for conveying or handling the disk 43 by vacuum suction with the disk chuck 47. The entire region to which the lower surface side uncured resist 49b is applied is not used for transfer pattern formation. Of the region where the lower surface side uncured resist 49 b is applied, a region 49 c adjacent to the resist non-application region 51 indicated by a one-dot chain line (virtual line) is a region which does not cover the fine pattern of the lower stamper 29. In the method of the present invention, only a part of the resist coating region 49c not covered with the fine pattern of the lower stamper 29 is partially irradiated with UV light, and only the resist at the partial irradiation portion in the area 49c is cured to lower the disk 43. Temporarily fixed to the side stamper 29.

  As an example, the diameter (φ) of the disk 43 used in the optical imprint shown in FIGS. 1A and 1B is 65 mm, R1 is 10 mm, R2 is 12 mm, and R3 is 15 mm. Accordingly, an annular portion having a width of R3−R2 = 3 mm is a resist coating region 49c that does not cover the fine pattern of the lower stamper 29. As shown in FIG. 1A, in order to partially cure the resist of the annular portion 49c having a width of 3 mm, for example, UV light having a diameter (φ) of 5 mm is irradiated, and the minute range 52 (that is, FIG. The resist of the portion (indicated by hatching in A) is partially cured, and the disk 43 is temporarily fixed to the lower stamper 29. Alternatively, as shown in FIG. 1 (B), UV light having the same diameter (φ) 3 mm as the width of the annular portion 49c is irradiated, and the minute range 52 (that is, hatched in FIG. 1 (B)). It is possible to partially harden the resist of the second portion and temporarily fix the disk 43 to the lower stamper 29.

  The partial irradiation location is not limited to the illustrated one location. A plurality of locations can be irradiated with UV light. The number of partial irradiation locations (in other words, the total area of partial curing) is necessary and sufficient to prevent the disc 43 placed on the upper surface of the lower stamper 29 from being displaced when the lower surface stamper device is moved. Any number (or a partially cured total area) may be used. The number of such partial irradiation locations (or the total area of partial curing) includes the moving speed of the lower surface stamper device 3, the pattern shape of the lower stamper 29, the type of resist used, the size of the disk 43, and the UV light source for partial irradiation. It can be determined by repeating the experiment several times in consideration of factors such as the diameter of the. Generally, as the moving speed of the lower surface side stamper device 3 increases and the size of the disk 43 increases, the number of partial irradiation locations (or the total area of partial curing) also increases.

  FIG. 2 is a partial schematic perspective view of an example of a UV light source 25 ′ used for partial irradiation of the disk 43 shown in FIG. 1. The UV light source 25 'has an original UV light source array 25a on its upper surface. As the light source array 25a, for example, a mercury lamp, a high-pressure mercury lamp, a low-pressure mercury mercury lamp, a xenon lamp, a UV-LED lamp, or the like can be appropriately selected and used. In particular, a UV-LED light source is preferable. The UV-LED lamp is significantly reduced in size as compared with the mercury lamp, and since the ultraviolet wavelength is 365 nm, the generation of heat is greatly suppressed, so there is no adverse effect or damage to the irradiated object. Furthermore, there is an advantage that the line stop time due to lamp replacement can be shortened because of low power consumption, environment-friendly and long life (10000 to 20000 hours). The UV light source 25 ′ has a through cavity 26 at the center according to the shape of the disk 43, and a partial irradiation light source 25 b is arranged along the outer peripheral edge of the through cavity 26. The number of the partial irradiation light sources 25b is not limited to the illustrated embodiment. One or more partial irradiation light sources 25b can also be used. As the partial irradiation light source 25b, for example, a UV light source using the optical fiber 65 as a waveguide can be suitably used. Alternatively, the intended object of the present invention can be achieved by individually controlling the ON / OFF of the UV-LED lamps only at the partially irradiated portions.

  The irradiation time of the UV light irradiated from the partial irradiation light source 25b may be a time that is necessary and sufficient to partially cure the resist at the portion. As an example, the irradiation time is about 0.5 second to 4 seconds. If the irradiation time is less than 0.5 seconds, the partial curing of the resist at that location is insufficient, and there is a possibility that temporary fixation between the disk 43 and the lower stamper 29 may be uncertain. On the other hand, if the irradiation time is longer than 4 seconds, the resist at that location is sufficiently cured, and the temporary fixation between the disk 43 and the lower stamper 29 is ensured. This is not preferable because it causes a decrease. The UV light irradiation time for partial curing is preferably about 1 second to 2 seconds.

  FIG. 3 is a schematic cross-sectional view showing one process when the uncured resist-coated disk misalignment prevention method of the present invention is carried out. The apparatus itself in which the method for preventing misalignment of the uncured resist-coated disk according to the present invention is substantially the same as the double-sided imprint apparatus disclosed in the aforementioned Japanese Patent Application No. 2009-294119, and the difference is disclosed in Japanese Patent Application No. 2009-294119. The lower UV light source 25 in the illustrated double-sided imprint apparatus is replaced with a UV light source 25 ′ provided with a partial irradiation light source 25b as shown in FIG. In FIG. 3, a disk 43 having a photocurable resist applied on both sides is conveyed by a disk chuck 47 attached to the tip of a disk handling arm 45. Since the resist 43a and 49b are applied to the outer peripheral edge of the disk 43, the disk 43 cannot be conveyed by chucking the outer peripheral edge of the disk 43. However, an area 51 where the resist 49a and 49b is not applied is formed around the central through hole of the disk 43. Therefore, it is preferable to convey the resist non-application area 51 by vacuum suction with the disk chuck 47. It is preferable that the disk handling arm 45 is configured to be movable up and down and to be able to advance and retract or rotate. When the disk 43 is transported directly above the lower stamper 29 by the disk handling arm 45, the alignment camera 23 of the lower surface stamper device 3 detects the center of the inner diameter of the disk 43 and the alignment mark at the center of the lower stamper 29, Based on the detection signal, the XY stage 21 is driven, and the disk 43 and the lower stamper 29 are aligned. When the disk 43 and the lower stamper 29 are aligned, the disk handling arm 45 is lowered, the disk 43 is placed on the surface of the lower stamper 29, the vacuum chucking of the disk chuck 47 is released, and then the disk handling arm Retreat 45. As a method of applying the resists 49a and 49b on both surfaces of the disk 43, for example, a known and commonly used method such as spin coating, spray coating, roll coating, and ink jet can be used. Regarding double-sided spin coating of resist onto a disk, a double-sided spin coater is commercially available from Nanotech Co., Ltd. located in Itabashi-ku, Tokyo. Double-sided air spray coaters, electrostatic spray coaters, and roll coaters are commercially available from Phi Corporation located in Meguro-ku, Tokyo. An apparatus for applying an ink-jet resist on both sides of a disk is disclosed in the specification of Japanese Patent Application No. 2009-161494 by the present applicant.

  The disk 43 is, for example, a donut-shaped disk-shaped disk substrate having a through hole formed at the center, such as an HDD, CD, or DVD. If necessary, a conventional thin film such as a metal layer, a resin layer, or an oxide film layer may be formed on the surface of the disk 43 to form a multilayer structure. As the resists 49a and 49b, for example, a synthetic resin material added with a photosensitive substance can be used. As the synthetic resin material, for example, cycloolefin polymer, polymethyl methacrylate (PMMA), polystyrene polycarbonate, polyethylene terephthalate (PET), polylactic acid (PLA), polypropylene, polyethylene, polyvinyl alcohol (PVA), etc. can be used. Examples of the photosensitive substance include peroxides, azo compounds (for example, azobisisobutyronitrile), ketones (for example, benzoin, acetone, etc.), diazoaminobenzene, metal complex salts, dyes, and the like. It is done.

  FIG. 4 is a schematic sectional view showing the next step of the double-sided imprinting operation by the double-sided imprinting apparatus shown in FIG. As described with reference to FIG. 3, when the disk 43 having the resists 49a and 49b coated on both sides is placed on the upper surface of the lower stamper 29, UV light is emitted from the partial irradiation light source 25b of the UV light source 25 ′ for a short time (for example, (1 second to 2 seconds) is irradiated and only a part of the region 49c not applied to the fine pattern of the lower stamper 29 is cured among the regions where the uncured resist 49b is applied, and the disk 43 is temporarily fixed to the lower stamper 29 Let

  When the disk 43 is temporarily fixed to the lower stamper 29 in the step shown in FIG. 4, the lower surface stamper device 3 and the transferred object peeling device 7 are moved by the moving drive mechanism 15 to the moving table 9 as shown in FIG. Is moved along the guide rail 11, and when the lower surface side stamper device 3 is moved to a position facing the upper surface side stamper device 5, it is stopped at that position. Since the disk 43 is temporarily fixed to the lower stamper 29, even if acceleration is applied during this movement, the disk 43 does not deviate from the position where it was initially placed and positioned. If necessary, the alignment camera 23 of the lower surface stamper device 3 detects the alignment mark of the lower stamper 29 and the alignment mark of the upper stamper 35 and drives the XY stage 21 based on the detection signal to The stamper 29 and the upper stamper 35 are aligned. When the lower stamper 29 and the upper stamper 35 are aligned, the upper side stamper device 5 is lowered by the elevating mechanism 17 and is pressed against the disk 43 with a predetermined pressure and brought into contact therewith. Next, UV light is irradiated from the light source array 25a (see FIG. 2) of the UV light source 25 'of the lower surface side stamper device 3 and the UV light source 37 of the upper surface side stamper device 5 to cure the resists 49a and 49b. As a result, the pattern of the lower stamper 29 is transferred to the lower surface side resist 49b of the disk 43, and the pattern of the upper stamper 35 is transferred to the upper surface side resist 49a.

  Since the disc peeling operation itself after the transfer is the same as the peeling operation described in Japanese Patent Application No. 2009-294119, description thereof is omitted.

  Using the double-sided imprint apparatus as shown in FIG. 3, the effect of the method for preventing misalignment of the uncured resist-coated disk of the present invention was tested. A commercially available photo-curable methyl methacrylate resist having a thickness of 50 nm was formed by spin coating on the upper surface side and the lower surface side of a glass disk 43 of φ65 mm, R1 = 10 mm, R2 = 12 mm, R3 = 15 mm and a thickness of 0.635 mm. It was applied with a film thickness. The disk 43 was positioned and placed on the upper surface of the lower stamper 29 by the alignment camera 23. Next, the resist coating film in the region not covered with the fine pattern of the lower stamper 29 on the lower surface side of the disk 43 is irradiated with UV light guided by a φ5 mm optical fiber from the partial irradiation light source 25b of the UV light source 25 ′ for 2 seconds. Then, the resist of the irradiated portion was cured, and the disk 43 was temporarily fixed to the upper surface side of the lower stamper 29. Thereafter, the lower surface stamper device 3 was moved to a position facing the upper surface side stamper device 5 at a speed of 0.6 m / sec by the movement drive mechanism 15 and stopped. At this position, it was determined whether or not the disc 43 was misaligned. As a result, it was confirmed that the disk 43 was not displaced at all from the position positioned with respect to the lower stamper 29.

  As a comparative example, processing was performed in the same way as described in Example 1 except that the temporary fixation by partial irradiation was not performed, and the lower side stamper device 3 was moved at a speed of 0.6 m / sec by the moving drive mechanism 15. It moved to the position which opposes the upper surface side stamper apparatus 5, and stopped. At this position, it was determined whether or not the disc 43 was misaligned. As a result, it was detected that the disc 43 was displaced by 100 μm or more from the position initially positioned with respect to the lower stamper 29. Since the imprint position accuracy on the disk needs to be 20 μm or less, this deviation is so large that it cannot be ignored.

  As mentioned above, although the preferable embodiment of the method for preventing misalignment of the uncured resist-coated disc of the present invention has been described, the present invention is not limited to the illustrated embodiment, and various modifications can be made. For example, the embodiment of the present invention is not limited to the embodiment of the double-sided imprint apparatus, and the single-sided imprint apparatus uses the uncured resist-coated disk misalignment prevention method of the present invention in a case involving the movement of the disk. You can also.

DESCRIPTION OF SYMBOLS 1 Outline sectional drawing of an example of the double-sided imprint apparatus in which the method for preventing misalignment of an uncured resist-coated disk of the present invention is used. Rail 15 Movement drive mechanism 17 Elevating mechanism 19 Control unit 21 XY stage 23 Alignment camera 25 ′ Lower UV light source 25b Partial irradiation light source 27 Stamper mounting table 29 Lower stampers 31a and 31b Protein lamp 33 Stamper support table 35 Upper stamper 37 Upper UV light sources 39a, 39b Protein lamps 41a, 41b Stopper 43 Disc 45 Disc handling arm 47 Disc chuck 49a Upper uncured resist 49b Lower uncured resist 49c Lower uncured resist 49b is applied Region 51 uncured resist uncoated portion 52 partial irradiation region not applied to the fine pattern of the lower stamper 29 of the

Claims (5)

It comprises an upper surface side stamper device supported by an elevating mechanism, a lower surface side stamper device fixed to a moving table placed on a guide rail, and a transferred object peeling device, and the moving table is moved by the moving drive mechanism to the guide. It can reciprocate on the rail, so that the lower surface side stamper device and the transferred object peeling device move alternately to positions facing the upper surface side stamper device, with the position of the upper surface side stamper device as the center. In the double-sided imprint apparatus that can be, a method of preventing misalignment from the lower surface side stamper apparatus of the uncured resist-coated disc,
(a) a step of positioning and placing a disk on which uncured resist is applied on both sides, placed on the upper surface of a lower stamper having a fine transfer pattern, mounted on the lower surface stamper device;
(b) irradiating at least a part of a portion of the resist existing on the interface between the lower stamper and the disk lower surface side that does not cover the fine transfer pattern of the stamper with UV light;
(c) curing the resist of the UV light irradiation part to partially fix the disk to the upper surface of the lower stamper;
A method for preventing misalignment of the uncured resist-coated disc from the lower surface side stamper device, comprising:   The method according to claim 1, wherein in the step (b), the UV light is irradiated by being guided by an optical fiber.   The method according to claim 1, wherein in the step (b), the UV light is irradiated by a UV-LED lamp.   2. The method according to claim 1, wherein in the step (b), the irradiation time of the UV light is within a range of 0.5 second to 4 seconds.   5. The method according to claim 4, wherein in the step (b), the irradiation time of the UV light is within a range of 1 second to 2 seconds.

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