JP2012088831A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus with high cooling efficiency and high reliability.SOLUTION: An electronic apparatus 10 comprises a case body 11 for housing a server 20a, 20b and 20c inside, and pure water 12 filling inside of the case body 11 for cooling the server 20a, 20b and 20c. Also, the electronic apparatus 10 comprises: a cooling unit 13 for cooling the pure water 12; an ion removal unit 14 for removing ions in the pure water 12; a gas introduction unit 15 for introducing an inactive gas into the pure water 12; and a pump unit 16 for circulating the pure water 12 in a circulation path 18. The pure water 12 circulates through the loop shaped circulation path 18 which is airtight and watertight and is formed with the case body 11, the cooling unit 13, the ion removal unit 14, the gas introduction unit 15 and pipes.

Description

  The present invention relates to an electronic device.

  The electronic component rises in temperature due to heat generation during operation and becomes high temperature. And in order to prevent the malfunction or failure of the electronic component which became high temperature, cooling an electronic component is performed conventionally.

  For example, in a data center that accommodates a large number of electronic components such as servers or communication devices, cooling of the electronic components using air conditioning is performed. In the data center, an air conditioning system has been introduced in which a path is formed by a rack in which electronic components are accommodated, and a cold aisle in which cold air flows and a hot aisle in which air that has risen in temperature by cooling electronic components is formed. Yes.

  Thus, when cooling an electronic component using air, air is cooled with the cooling device using a refrigerant | coolant, and an electronic component is cooled using the cooled air. Therefore, a plurality of heats including a heat exchange stage in which the refrigerant is cooled by a cooling device such as a heat pump, a heat exchange stage in which the air is cooled using the refrigerant, and a heat exchange stage in which the electronic components are cooled with the cooled air. The electronic component is cooled through the replacement stage. For this reason, a loss occurs in each heat exchange, and a wasteful portion is generated in the input energy.

  In addition, even if cold aisle and hot aisle are formed in the data center room, if the airflow in the room cannot be controlled well, local heat exchange occurs and air conditioning efficiency is lowered.

  Furthermore, since air has a small heat capacity per unit volume, it is not suitable for cooling electronic components that generate a large amount of heat.

  And in order to cool an electronic component with a large calorific value, it has been proposed to cool it using a pipe through which a coolant flows.

  However, when piping is arranged in a rack in which electronic components are accommodated, the piping through which the coolant flows cools the air in the rack, and the cooled air cools the electronic components. The electronic components are cooled by interposing air having a small heat capacity. In addition, it is not an easy task to arrange a winding pipe in the rack.

  Furthermore, it has been proposed to fill an electrical insulating dielectric refrigerant in a housing containing the electronic parts, and directly cool the electronic parts using the dielectric refrigerant. However, if moisture is dissolved in the dielectric refrigerant from the atmosphere around the housing or corrosive components are dissolved in the dielectric refrigerant from the refrigerant contact part of electronic parts, the electrical conductivity of the dielectric refrigerant increases. This may cause malfunction or failure of electronic components.

JP 2009-537905 A JP 2002-189536 A JP 2004-363308 A JP 2002-374086 A

  As described above, an electronic device having a conventional cooling system has a problem with respect to cooling efficiency or system reliability.

  Accordingly, an object of the present specification is to provide an electronic device with high cooling efficiency and reliability.

  According to one aspect of the electronic device disclosed in the present specification, a housing that houses the electronic component, a pure water that is filled in the housing and cools the electronic component, and a cooling unit that cools the pure water, An ion removing unit that removes ions in the pure water; and a gas injecting unit that injects an inert gas into the pure water. The pure water includes a housing, a cooling unit, an ion removing unit, and a gas injecting unit. It circulates in the airtight path formed by.

  Further, according to one embodiment of the electronic device disclosed in the present specification, a housing that stores electronic components therein and is filled with pure water that cools the electronic components, a cooling unit that cools pure water, An air-tightness formed by a housing, a cooling unit, an ion removal unit, and a gas injection unit, which includes an ion removal unit that removes ions in water and a gas injection unit that injects an inert gas into pure water. The pure water circulates in the path.

  According to one embodiment of the electronic device disclosed in this specification, the cooling efficiency and reliability are high.

  The objects and advantages of the invention will be realized and obtained by means of the elements and combinations particularly pointed out in the appended claims.

  Both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention as claimed.

1 is a diagram illustrating a first embodiment of an electronic device disclosed in this specification. FIG. It is a figure which shows the housing | casing of the electronic device of FIG. It is a figure which shows the ion removal part of the electronic device of FIG. It is a figure which shows the gas injection | pouring part of the electronic device of FIG. It is a figure which shows the pump part of the electronic device of FIG. It is a figure which shows the housing | casing of 2nd Embodiment of the electronic device disclosed by this specification. It is a figure which shows the state from which some housing | casing was removed from the some housing | casing shown in FIG. It is a figure which shows a mode that a server is removed from the removed housing | casing. It is a figure which shows the relationship between specific resistance and time. It is a figure which shows the relationship between a chlorine concentration and time. It is a figure which shows the relationship between oxygen concentration and time.

  Hereinafter, a preferred embodiment of an electronic device disclosed in this specification will be described with reference to the drawings. However, the technical scope of the present invention is not limited to these embodiments, but extends to the invention described in the claims and equivalents thereof.

  FIG. 1 is a diagram illustrating a first embodiment of an electronic device disclosed in this specification. FIG. 2 is a diagram illustrating a housing of the electronic device of FIG. FIG. 3 is a diagram illustrating an ion removing unit of the electronic apparatus of FIG. FIG. 4 is a view showing a gas injection part of the electronic apparatus of FIG. FIG. 5 is a diagram illustrating a pump unit of the electronic device of FIG.

  The electronic device 10 of the present embodiment includes a housing 11 that houses servers 20a, 20b, and 20c, and pure water 12 that is filled in the housing 11 and cools the servers 20a, 20b, and 20c. The electronic device 10 includes a cooling unit 13 that cools the pure water 12, an ion removal unit 14 that removes ions in the pure water 12, a gas injection unit 15 that injects an inert gas into the pure water 12, A pump unit 16 for circulating the pure water 12 in the path 18 is provided.

  The electronic device 10 directly cools the servers 20a, 20b, and 20c that generate heat by operating with the cooled pure water 12. Since the pure water 12 has a large heat capacity, the cooling capacity of the servers 20a, 20b, and 20c is high.

  The casing 11 and the pump section 16, the pump section 16 and the cooling section 13, the cooling section 13 and the ion removing section 14, the ion removing section 14 and the gas injection section 15, and the gas injection section 15 and the casing 11 are airtight. Are connected by pipes that are watertight and watertight. Pure water 12 circulates in an airtight and watertight loop path 18 formed by the casing 11, the cooling unit 13, the ion removing unit 14, the gas injection unit 15, and the piping.

  The housing 11 houses a plurality of servers 20a, 20b, and 20c. The plurality of servers 20 a, 20 b, and 20 c are immersed in pure water 12 filled in the housing 11. Examples of the servers 20a, 20b, and 20c include electronic components such as blade servers or rack mount servers. When the servers 20a, 20b, and 20c are blade servers, components such as a CPU, a memory, and an interface are mounted on the blade in an exposed state. Therefore, the components mounted on the servers 20a, 20b, and 20c are immersed in the pure water 12, and the heat of the components that generate heat during operation is directly conducted to the pure water 12 and cooled. As a large-capacity storage device mounted on the servers 20a, 20b, and 20c, it is preferable to use a semiconductor memory that does not have a drive unit. Note that the server housed in the housing 11 is an example of an electronic component, and the device housed in the housing 11 may be another electronic component such as a communication device.

  The specific resistance of the pure water 12 is preferably higher than 9 MΩ · cm in order to prevent malfunction or failure by short-circuiting the components on the servers 20a, 20b, and 20c. The specific resistance of pure water 12 is preferably as high as possible, and the specific resistance of pure water 12 is particularly preferably higher than 12 MΩ · cm, and more preferably higher than 15 MΩ · cm.

From the same viewpoint, the chlorine concentration in pure water (chlorine ion: Cl ⁻ ) is preferably lower than 10 ppb, particularly 15 ppb. Furthermore, in order to prevent corrosion due to oxidation of the contact portion with the pure water 12 in the path 18 including the housing 11 and to prevent the growth of viable bacteria, the oxygen concentration in the pure water 12 is 20 ppb, particularly more than 30 ppb. Preferably it is low.

  As the pure water 12, so-called ultrapure water is preferably used.

  The path 18 including the housing 11 has airtightness and watertightness, and a substance that can be dissolved in the pure water 12 such as moisture or impurities to increase the electrical conductivity of the pure water from the outside of the housing 11. Intrusion into the path 18 including the is prevented.

  In the housing 11, the pure water 12 sent from the gas injection unit 15 passes through the housing 11 while cooling the servers 20 a, 20 b, and 20 c and flows to the pump unit 16. It is preferable that a flow path of the pure water 12 is formed in the housing 11 so that the pure water 12 flows in one direction from the gas injection unit 15 side to the pump 16 side. In addition, it is preferable that the servers 20a, 20b, and 20c are arranged in the housing 11 so as not to cause a liquid pool in which the flow of the pure water 12 stagnates.

  The servers 20a, 20b, and 20c have wirings 21a, 21b, and 21c for power or communication. As shown in FIG. 2, the wirings 21 a, 21 b, and 21 c extend from the inside of the housing 11 to the outside through the through holes 11 a that penetrate the wall of the housing 11. The through-hole 11a, which is a portion through which the wall of the housing 11 passes, is closed by the synthetic resin 11b, and the airtightness and watertightness of the housing 11 are maintained.

  When replacing the servers 20a, 20b, and 20c in the housing 11, first, the circulation of the pure water 12 is stopped, the lid provided with the through hole 11a is removed, and the pure water 12 is placed in the housing 11 Unplug from. Then, the synthetic resin 11b is removed from the through hole 11a, and the wirings 21a, 21b, and 21c are removed from the servers 20a, 20b, and 20c. Then, after removing the servers 20 a, 20 b, and 20 c from the housing 11, a new server is stored in the housing 11.

  The cooling unit 13 includes a heat exchanger 13a that exchanges heat with the pure water 12 that circulates in the path 18, and a cooling tower 13b that supplies primary cooling water to the heat exchanger 13a.

  The heat exchanger 13a includes the cooled primary cooling water supplied by the cooling tower 13b and the pure water 12 as the secondary cooling water whose temperature has been increased by receiving heat from the servers 20a, 20b, and 20c in the housing 11. Exchange heat with In the cooling tower 13b, the primary cooling water is cooled using the heat of vaporization of water. The pure water 12 is cooled by passing heat to the primary cooling water. The cooled pure water 12 proceeds to the ion removing unit 14. On the other hand, the primary cooling water that has received heat and has risen in temperature returns to the cooling tower 13b. In addition, the heat exchanger 13a may be provided with a device having a refrigeration cycle such as a heat pump using a refrigerant according to a required cooling capacity.

  As shown in FIG. 3, the ion removal unit 14 includes a particle filter 14a, an activated carbon filter 14b, and an ion exchange filter 14c. The pure water 12 sent from the cooling unit 13 is filtered in the order of the particle filter 14a, the activated carbon filter 14b, and the ion exchange filter 14c.

  The particle filter 14a is filled with a filter for filtering fine particles such as a membrane filter. Fine particles in the pure water 12 may clog the activated carbon filter 14b or the ion exchange filter 14c. Further, the fine particles in the pure water 12 may cause a short circuit on the components on the servers 20a, 20b, and 20c. The particle filter 14a filters and removes such fine particles from the pure water 12. It is preferable to replace the internal filter of the particle filter 14a when the filtration capacity of the filter filled therein is lowered.

  The activated carbon filter 14b is filled with activated carbon. The activated carbon filter 14 b filters the pure water 12 to adsorb fine particles or organic substances in the pure water 12 and removes them from the pure water 12. The activated carbon filter 14b performs pretreatment of pure water filtered by the ion exchange filter 14c. The activated carbon filter 14b preferably replaces the activated carbon when the adsorption capacity of the activated carbon filled therein is lowered.

The ion exchange filter 14c is filled with an ion exchange resin. As an ion exchange resin, ions in pure water 12 such as chlorine ions (Cl ⁻ ) are exchanged with hydrogen ions and hydroxide ions, respectively. The exchanged hydrogen ions and hydroxide ions react in pure water 12 to become water. The ion exchange filter 14c preferably exchanges the ion exchange resin when the ion exchange capacity of the ion exchange resin filled therein is lowered. For example, when the measured value of the specific resistance of the pure water 12 is 9 MΩ · cm or less, the ion exchange resin may be replaced. The exchanged ion exchange resin can be regenerated and used again.

As shown in FIG. 4, the gas injection unit 15 includes a gas injection tank 15a, a gas injection nozzle 15b, a pressure valve 15c, and a deaeration film 15d. The pure water 12 sent from the ion removing unit 14 flows into the gas injection tank 15a and is temporarily stored. An inert gas is injected into the pure water 12 in the gas injection tank 15a from the gas injection nozzle 15b. Further, an inert gas is injected and the inside of the gas injection tank 15a is pressurized. By injecting the inert gas, the solubility of oxygen in the pure water 12 decreases, so that dissolved oxygen escapes from the pure water 12 and the oxygen concentration in the pure water 12 decreases. When the pressure in the gas injection tank 15a becomes higher than a predetermined value, the inert gas and oxygen are released to the outside through the pressure valve 15c. As the inert gas, for example, nitrogen, argon or the like can be used. For example, oxygen in the pure water 12 reacts with iron in the path 18 to form iron hydroxide (Fe (OH) ₂ , Fe (OH) ₃ ). The gas injection unit 15 reduces such dissolved oxygen to prevent oxidation in the path 18. Then, the pure water 12 with the reduced oxygen concentration flows from the gas injection tank 15a to the housing 11.

  Further, the gas component in the pure water 12 flowing into the gas injection tank 15a is deaerated through the deaeration film 15d. The deaeration film 15d is a film that transmits only gas and does not transmit liquid. One surface of the deaeration membrane 15 d faces the path 18, and the pressure on the other surface side is reduced as compared with that in the path 18. In the gas injection unit 15, such a degassing film 15 d is arranged in front of the gas injection tank 15 a to remove oxygen contained in the pure water 12 as much as possible. It is sent to the tank 15a.

  For example, when 20 servers with a calorific value of 2 kW are stored in the housing 11 and 15 ° C. pure water is circulating in the path 18 at a flow rate of 60 L / min, the gas injection unit 15 Argon as an inert gas may be injected into the pure water 12 at a flow rate of 5 to 10 L / min.

  As shown in FIG. 5, the pump unit 16 includes a pump 16 a that generates a driving force for circulating pure water in the path 18. The pump 16 a sends the pure water 12 flowing from the housing 11 to the heat exchanger 13 a of the cooling unit 13. The pump 16a has a function of draining the pure water 12 in the path 18 to the outside.

  The pump unit 16 includes a supply water tank 16b for supplying pure water into the path 18, and a decompression pump 16c for degassing the supply water tank 16b. When the server is replaced or the like, the pure water 12 in the path 18 is drained, so the supply water tank 16 b is used to supply the reduced pure water 12 to the path 18.

  When supplying the pure water 12 to the path 18, first, the inside of the supply water tank 16 b is degassed by the decompression pump 16 c and decompressed. Next, pure water 12 is injected into the supply water tank 16b that has been depressurized. Since the gas component dissolved in the pure water 12 injected into the supply water tank 16b in the decompressed state escapes from the pure water 12, the pure water 12 is deaerated. Next, after the supply water tank 16 b is brought to atmospheric pressure, an inert gas is injected into the pure water 12. By injecting the inert gas, the solubility of oxygen in the pure water 12 decreases, so that dissolved oxygen escapes from the pure water 12 and the oxygen concentration in the pure water 12 decreases. Next, the pure water 12 is supplied from the supply water tank 16b to the pump 16a, and the pure water is sent out from the pump 16a into the path 18.

  The pure water 12 injected into the supply water tank 16b is supplied from, for example, a pure water production facility for semiconductor production.

  In addition, as shown in FIG. 1, the electronic device 10 includes a specific resistance sensor 17 a that measures the specific resistance of the pure water 12 circulating in the path 18. The electronic device 10 also includes an oxygen concentration sensor 17b that measures the oxygen concentration of the pure water 12 that circulates in the path 18, and a temperature sensor 17c that measures the temperature of the pure water 12 that circulates in the path 18. Each sensor is disposed in a portion of a path 18 between the gas injection unit 15 and the housing 11. Furthermore, the electronic device 10 is connected to the specific resistance sensor 17a, the oxygen concentration sensor 17b, and the temperature sensor 17c, and includes a control unit 17 that receives measurement values of the sensors.

  When the measured value of the specific resistance measured by the specific resistance sensor 17a is lower than a predetermined threshold, the control unit 17 controls the pump unit 16 to increase the circulation amount of the pure water 12 in the path 18. The amount of pure water 12 flowing through the ion removing unit 14 is increased.

  Further, when the measured value of the oxygen concentration measured by the oxygen concentration sensor 17b is higher than a predetermined threshold value, the control unit 17 controls the gas injection unit 15 to be injected into the gas injection tank 15a. Increase the amount of gas.

  Furthermore, the control part 17 controls the cooling part 13 and the primary cooling water sent out from the cooling tower 13b to the heat exchanger 13a when the measured value of the temperature measured by the temperature sensor 17c is higher than a predetermined threshold value. Increase the flow rate. The control unit 17 may control the pump unit 16 to increase the circulation amount of the pure water 12 in the path 18.

  It is preferable that an electronic component such as a server housed in the housing 11 is housed in the housing 11 after being cleaned to remove impurities such as fine particles or corrosive components. For example, an electronic component is cleaned as follows. First, after putting an electronic component in a quartz container, pure water is poured into the container to immerse the electronic component in pure water. Next, the container is irradiated with ultrasonic waves to ultrasonically clean the electronic components. Next, the specific resistance of pure water in the container after ultrasonic cleaning is measured, and the pure water in the container is replaced until the measured value exceeds 9 MΩ · cm, and ultrasonic cleaning is repeated. Then, after measuring the specific resistance of pure water in the container after ultrasonic cleaning and confirming that the measured value exceeds 9 MΩ · cm, the cleaned electronic component is stored in the housing 11.

  In some cases, an electronic component such as a server has an exposed resin portion. From such a resin portion, impurities such as chlorine ions may be dissolved in pure water. Therefore, the electronic component such as a server may be cleaned and stored in the housing 11 after the exposed resin portion is coated with a material inert to pure water. As the inert material, for example, fluororesin or ceramics can be used.

  According to the electronic device 10 of the present embodiment described above, since the electronic components such as the server are directly cooled using the pure water 12 having a heat capacity larger than that of the air, the cooling efficiency is high and the cooling capacity is excellent. In addition, since the pure water 12 is cooled by the primary cooling water and the server is directly cooled using the cooled pure water 12, the heat exchange loss is small because there are few stages of heat exchange.

  Further, according to the electronic device 10, ions, fine particles, organic substances, and the like in the pure water 12 circulating in the airtight path 18 are removed, and the oxygen concentration in the pure water 12 is lowered, so that the pure water 12 As a result, the high specific resistance of the pure water 12 is maintained. Therefore, impurities are prevented from being mixed into the pure water, and the insulation of the pure water 12 is maintained, so that the reliability of the electronic device is high.

  Further, in the cooling unit 13, the cooling tower 13b uses the heat of vaporization of water to cool the primary cooling water, so that the energy used for cooling is small and the cooling efficiency of the primary cooling water is high. Further, as described above, since the electronic device 10 directly cools the electronic components such as the server using the pure water 12, since the heat exchange efficiency is high, the total energy used for cooling is reduced. Further, since the pressure loss that occurs in the heat exchange between the air and the refrigerant in the conventional electronic device using air does not occur in the electronic device 10, the total energy used for cooling is further reduced.

  In addition, in conventional electronic devices, electronic components may be directly cooled using a fluorine-based dielectric refrigerant. However, the fluorine-based dielectric refrigerant is expensive and the use of pure water Compared to the use of dielectric refrigerant, the cost is greatly reduced.

  Next, a second embodiment of the electronic device described above will be described below with reference to FIGS. For points that are not particularly described in the second embodiment, the description in detail regarding the first embodiment is applied as appropriate. Moreover, the same code | symbol is attached | subjected to the same component.

  FIG. 6 is a diagram illustrating a housing of the second embodiment of the electronic device disclosed in this specification. FIG. 7 is a diagram illustrating a state in which some housings are removed from the plurality of housings illustrated in FIG. 6. FIG. 8 is a diagram illustrating a state in which the server is removed from the removed housing.

  The electronic device of the present embodiment includes a plurality of casings 31a to 31e, and the plurality of casings 31a to 31e are connected by a removable pipe 32 having airtightness and watertightness through which pure water 12 is circulated. Has been.

  Servers 40a to 40e are accommodated in the plurality of casings 31a to 31e, respectively.

  The pure water 12 sent from the gas injection part 15 flows into the housing 31e through the removable pipe 33 having airtightness and watertightness, and after cooling the server 40e accommodated in the housing 31e, It flows into the adjacent casing 31d through the pipe 32.

  Similarly, the pure water 12 flowing into the casing 31d cools the server 40d stored in the casing 31d, and then flows into the adjacent casing 31c through the pipe 32. Hereinafter, similarly, the pure water 12 circulates in adjacent housings and finally flows into the housing 31a.

  The pure water 12 that has flowed into the housing 31a is cooled to the server 40a housed in the housing 31a, and then sent to the pump unit 16 through a removable pipe 34 having airtightness and watertightness.

  In the present embodiment, the replacement of the server in the housing is performed by the following procedure, for example.

  First, the pipe 32 connected to the casing that houses the server to be replaced is removed, and the removed pipe 32 is connected to the remaining casing to re-form the path 18. In the example shown in FIG. 7, the housing 31 b in FIG. 6 is removed, and the housing 31 a and the housing 31 c are connected by a pipe 32. The plurality of remaining casings 31a, 31c, 31d, and 31e form a part of the path 18 having airtightness and watertightness, and the servers 31a, 31c, 31d, and 31e are operated by operating the electronic devices. Can be operated normally.

  After removing the server 40b from the removed casing 31b, for example, as shown in FIG. 8, a new server is stored in the casing 31b. And the housing | casing 31b where the server was replaced | exchanged is again arrange | positioned between the housing | casing 31a and the housing | casing 31c, and the piping 32 is connected.

  In addition, when exchanging the server accommodated in the housing | casing 31a or the housing | casing 31e, the piping 33 or the piping 34 will be removed and it will be connected to another housing | casing.

  Other configurations of the present embodiment are the same as those of the first embodiment described above.

  According to the electronic apparatus of the present embodiment described above, even while one server is exchanged, other servers can be operated while being cooled.

  In the present invention, the electronic device of the above-described embodiment can be appropriately changed without departing from the gist of the present invention. In addition, the configuration requirements of one embodiment can be applied to other embodiments as appropriate.

  For example, in the cooling unit, heat exchange may be performed so as to increase the temperature of pure water that is the secondary cooling water.

  [Reference example]

  Hereinafter, the effect of the electronic device disclosed in this specification will be further described using a reference example. However, the present invention is not limited to such reference examples.

[Reference Example 1]
As an ion exchange filter of the ion exchange part, a cartridge for ultrapure water manufactured by Nihon Millipore Corporation was used. The flow rate of pure water in the path was 75 L / min. At this time, the specific resistance of pure water and the change over time in the chlorine concentration were measured. FIG. 9 is a diagram showing the relationship between specific resistance and time. It was found that the specific resistance value was stable at about 11 MΩ · cm. FIG. 10 is a diagram showing the relationship between the chlorine concentration (Cl ⁻ ion) and time. It was found that the chlorine concentration value was stable at about 3 ppb.

[Reference Example 2]
In the gas injection part, argon as an inert gas was injected into the pure water 12 at a flow rate of 5 L / min. The flow rate of pure water in the path was 60 L / min. The time-dependent change of the oxygen concentration in the pure water at this time was measured. FIG. 11 is a diagram showing the relationship between the oxygen concentration and time. It was found that about 6 hours after the argon gas injection, the oxygen concentration dropped to about 0.05 ppm, and it was stable at that value.

  All examples and conditional words mentioned herein are intended for educational purposes to help the reader deepen and understand the inventions and concepts contributed by the inventor. All examples and conditional words mentioned herein are to be construed without limitation to such specifically stated examples and conditions. Also, such exemplary mechanisms in the specification are not related to showing the superiority and inferiority of the present invention. While embodiments of the present invention have been described in detail, it should be understood that various changes, substitutions or modifications can be made without departing from the spirit and scope of the invention.

DESCRIPTION OF SYMBOLS 10 Electronic device 11 Case 11a Through-hole 11b Synthetic resin 12 Pure water 13 Cooling part 13a Heat exchanger 13b Cooling tower 14 Ion removal part 14a Activated carbon filter 14b Ion exchange filter 14c Particle filter 15 Gas injection part 15a Gas injection tank 15b Gas injection nozzle 15c Pressure valve 15d Deaeration membrane 16 Pump part 16a Pump 16b Supply water tank 16c Pressure reducing pump 17 Control part 17a Resistivity sensor 17b Oxygen concentration sensor 17c Temperature sensor 18 Path 20a, 20b, 20c Server (electronic component)
21a, 21b, 21c Wiring 31a, 31b, 31c, 31d, 31e Housing 32 Piping 40a, 40b, 40c, 40d, 40e Server (electronic component)

Claims (7)

A housing for storing electronic components therein;
Pure water that fills the housing and cools electronic components;
A cooling unit for cooling the pure water;
An ion removing unit for removing ions in the pure water;
A gas injection part for injecting an inert gas into the pure water;
With
The pure water circulates in an airtight path formed by the casing, the cooling unit, the ion removing unit, and the gas injection unit. A plurality of the housings,
The electronic device according to claim 1, wherein the plurality of housings are connected to each other by an airtight removable pipe that circulates the pure water.   The electronic device according to claim 1, wherein a specific resistance of the pure water is higher than 9 MΩ · cm.   The electronic device according to claim 3, wherein the oxygen concentration in the pure water is lower than 20 ppb and the chlorine concentration is lower than 10 ppb.   The electronic device as described in any one of Claims 1-4 provided with the particle filter which removes the microparticles | fine-particles in the said pure water. The wiring of the electronic component extends from the inside to the outside through the wall of the housing,
The electronic device according to any one of claims 1 to 5, wherein a portion through which the wall of the housing passes is closed with a synthetic resin. A housing that contains electronic components inside and is filled with pure water that cools the electronic components;
A cooling section for cooling pure water;
An ion removal unit for removing ions in pure water;
A gas injection part for injecting an inert gas into pure water;
With
An electronic device in which pure water circulates in an airtight path formed by the casing, the cooling unit, the ion removing unit, and the gas injection unit.

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