JP2012084059A - Sensor support mechanism, and paper sheet handling device using the sensor support mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a position shift of a sensor.SOLUTION: A sensor support mechanism includes: a reference-side molded frame 51 formed as a region 50A substantially the entire region of which is hard; a detection-side molded frame 52 which is sectioned into a partially hard region and an easy-to-deform region 50B, and constitutes a conveyance path 16 together with the reference-side molded frame; first kind sensors (an optical sensor 22 and a magnetic sensor 23) which are arranged at one or both of the reference-side molded frame and the detection-side molded frame, and apply only slight bending stress to a periphery; and a second kind sensor (a thickness sensor 21) which is parted and arranged at both of the reference-side molded frame and the detection-side molded frame, and applies larger bending stress than the first kind sensors to the periphery. The first kind sensors are arranged in the hard region, and the second kind sensor is formed as a sensor module and arranged in the easy-to-deform region.

Description

  The present invention relates to a sensor support mechanism for supporting a sensor and a paper sheet handling apparatus using the sensor support mechanism.

  Examples of the paper sheet handling apparatus that handles paper sheets include an automatic transaction apparatus (ATM), a passbook entry machine, a ticket issuing machine, and a printer. An automatic transaction apparatus is an apparatus for depositing / withdrawing banknotes installed in a financial institution or a distribution institution. The passbook bookkeeping machine is a device that is mainly installed in financial institutions and for writing a passbook. The ticket issuing machine is a device that is installed in a transportation facility, a distribution facility, or the like and issues a ticket. Paper sheets may be in the form of a single sheet such as banknotes or tickets, and may be in the form of a booklet such as a bankbook.

  In the paper sheet handling device, various sensors are provided on the transport path, and various information on the paper sheets (hereinafter, “paper sheets” are transported by the various sensors while transporting the paper sheets along the transport path. Information)). For example, an automatic transaction apparatus, which is a kind of paper sheet handling apparatus, is provided with an optical sensor, a magnetic sensor, a thickness sensor, and the like on a conveyance path.

  An optical sensor is a sensor which acquires the leading position information of a banknote, the pattern information of a banknote, etc. as paper sheet information. The optical sensor is composed of two sensors, a light emitting side sensor and a light receiving side sensor. The optical sensor detects the light emitted from the light emitting side sensor toward the transport path by the light receiving side sensor, and determines the leading position information of the banknote or the pattern of the banknote according to the light blocking or reflected light by the banknote being transported. Get information.

  A magnetic sensor is a sensor which acquires the magnetic recording information of a banknote as paper sheet information. A magnetic sensor acquires the magnetic recording information of a banknote by reading the magnetic recording information written in the banknote conveyed.

  A thickness sensor is a sensor which acquires the thickness information of a banknote as paper sheet information. The thickness sensor includes two rollers arranged opposite to each other and constituting two conveying paths, a pressing spring that presses one of the two rollers against the other, and one roller. And a displacement sensor for detecting the amount of displacement. The thickness sensor acquires the bill thickness information by the displacement sensor detecting the amount of displacement of one of the rollers.

  One roller of the thickness sensor is a rotatable roller whose position varies depending on the thickness of the paper sheet being conveyed. Hereinafter, “one roller” is referred to as “detection roller”. The other roller of the thickness sensor is a rotatable roller whose position is fixed. In the other roller of the thickness sensor, the detection roller is pressed by a pressing spring, and the contact position between the detection roller and the other roller is a reference position for the displacement of the detection roller. Hereinafter, the “other roller” is referred to as a “reference roller”. In this configuration, the pressing spring presses the detection roller against the reference roller. And a displacement sensor will detect the displacement amount of the detection roller, if a detection roller fluctuates according to the thickness of the conveyed banknote.

  Since the thickness sensor has a pressing spring for pressing the detection roller against the reference roller, it is necessary to fix the surrounding frame. Therefore, the thickness sensor usually includes a lock spring and a lock lever for fixing the surrounding frame, and uses the tension of the lock spring to press the surrounding frame in the approaching direction with the lock lever. It has become.

  The thickness sensor having such a configuration gives a strong bending stress to the surrounding frame. On the other hand, since the optical sensor and the magnetic sensor do not have a spring, only a slight bending stress is applied to the surrounding frame (or almost no bending stress is applied).

  These optical sensors, magnetic sensors, and thickness sensors are attached to an integrated sensor support mechanism so that they can be attached to an automatic transaction apparatus as a paper sheet discrimination unit, for example (see, for example, Patent Document 1). ). In Patent Document 1, “paper sheet discrimination unit” is referred to as “banknote discrimination device”.

  The sensor support mechanism disclosed in Patent Document 1 has a configuration in which an optical sensor, a magnetic sensor, and a thickness sensor are attached to two opposed frames that constitute a conveyance path.

  Patent Document 2 discloses another example of the sensor support mechanism. The sensor support mechanism disclosed in Patent Document 2 has a frame in which a slit that allows a bill to pass is formed by integral molding, and two first magnetic sensors that detect whether or not a bill passes through the slit, It has the structure which has one 2nd magnetic sensor which detects the magnetic state of the magnetic circuit of two 1st magnetic sensors in the different position in the same slit. The sensor support mechanism disclosed in Patent Document 2 discriminates a passing bill by comparing the difference between the outputs of two first magnetic sensors and the output of one second magnetic sensor with standard data.

  Patent Document 3 also discloses another example of the sensor support mechanism. The sensor support mechanism disclosed in Patent Literature 3 has a frame in which a slit for allowing a bill to pass is formed by integral molding, and has two magnetic sensors for detecting whether or not a bill has passed through the slit. It has become. The sensor support mechanism disclosed in Patent Document 3 discriminates a passing bill by comparing the outputs of two magnetic sensors with standard data. In the frame in which the slit is formed, the slit is disposed substantially at the position of the center of gravity of the frame, and is supported by surrounding members on the side portion on the extension line of the slit.

Japanese Patent Laid-Open No. 7-14048 (FIGS. 1 and 2) JP-A-61-28185 (FIGS. 2 and 3) JP-A-61-202298 (FIGS. 2 and 3)

In the sensor support mechanism disclosed in Patent Document 1, the two frames constituting the transport path are made of a metal material such as stainless steel in order to obtain high rigidity.
However, a frame made of a metal material is expensive, and it is difficult to adjust the alignment of each sensor to a predetermined position. In addition, since the frame made of a metal material easily transmits vibration to the sensor, vibration noise is particularly likely to be mixed into the detection information of the thickness sensor.
For this reason, the sensor support mechanism disclosed in Patent Document 1 is required to be made of a resin material that is inexpensive and can be easily adjusted to align each sensor with a predetermined position.

Therefore, the inventor tried to construct a frame made of a metal material with a resin material in the sensor support mechanism disclosed in Patent Document 1.
However, in the sensor support mechanism using a frame (hereinafter referred to as “molded frame”) made of the resin material, the thickness sensor has a lock spring, and the tension of the lock spring is strong. It has been found that the tension of the locking spring is applied to the molding frame as a strong bending stress, which causes distortion in the molding frame, and as a result, the alignment accuracy of the optical sensor and the magnetic sensor decreases.

  Therefore, the inventor further seals the constituent members of the thickness sensor with a metal frame (hereinafter referred to as “sensor frame”) with respect to the sensor support mechanism using the molded frame made of a resin material ( The thickness sensor is modularized, and the tension of the lock spring of the thickness sensor is supported by a metal sensor frame. Hereinafter, the thickness sensor is referred to as a “thickness sensor module”.

  However, the sensor support mechanism using the molded frame and the thickness sensor module made of a resin material still causes a strain in the metal sensor frame due to the tension of the locking spring of the thickness sensor module. There is a problem that the tension of the lock spring is applied to the forming frame as a bending stress, which causes distortion in the forming frame, and as a result, the alignment accuracy of the optical sensor and the magnetic sensor may be lowered. There was found.

  Therefore, the inventor has the effect of the distortion of the molding frame generated around the thickness sensor module on the periphery of the optical sensor and the magnetic sensor with respect to the sensor support mechanism using the molding frame and the thickness sensor module made of a resin material. We thought that this problem could be solved if the configuration could not be reached.

  The present invention has been made in order to solve the above-described problems, and it is a main object of the present invention to provide a sensor support mechanism that does not easily cause displacement of the sensor, and a paper sheet handling apparatus that uses the sensor support mechanism. And

  In addition, since the sensor support mechanism disclosed in Patent Document 2 may not match the timing of vibration noise between the outputs of the two first magnetic sensors and the outputs of the one second magnetic sensor, There is a problem that vibration noise cannot be canceled for the difference between the output of the magnetic sensor and the output of one second magnetic sensor, and as a result, comparison with standard data may not be performed properly. It was.

  In addition, the sensor support mechanism disclosed in Patent Document 3 is arranged in consideration of vibration resistance. However, in the sensor support mechanism disclosed in Patent Document 3, when the natural frequency of the entire mechanism matches the vibration frequency due to the conveyance of the paper sheet, the frame vibrates, and vibration noise cannot be reliably deleted. There was a problem that there was a time.

  Furthermore, the sensor support mechanism disclosed in Patent Document 2 and the sensor support mechanism disclosed in Patent Document 3 are configured specifically for magnetic sensors, but in the discrimination of paper sheets (especially bills), Since banknotes of various countries have various physical quantity information (for example, security thread, OVI (Optically Variable Ink), watermark, etc.), not only magnetic sensors but also optical sensors, thickness sensors, etc. A configuration for acquiring various paper sheet information is necessary. For this reason, there is a problem that a sensor support mechanism that satisfies the characteristics of all sensors is desired. “OVI” is an ink whose optical properties change due to polarized light or the like.

  In addition, the sensor support mechanism disclosed in Patent Document 2 and the sensor support mechanism disclosed in Patent Document 3 are costly when the periphery of each sensor is hardened with a metal material, and the predetermined position of each sensor is increased. In addition, it is difficult to adjust the position of the sensor, and it is easy to transmit vibration to the sensor. For this reason, the sensor support mechanism disclosed in Patent Document 2 and the sensor support mechanism disclosed in Patent Document 3 are required to have a configuration that is inexpensive and can easily adjust the alignment of each sensor to a predetermined position. There was also a problem of being.

  It is a secondary object of the present invention to provide a sensor support mechanism that can solve these problems, and a paper sheet handling apparatus that uses the sensor support mechanism.

  In order to achieve the object, the first invention is a sensor support mechanism for supporting a plurality of types of sensors for acquiring paper sheet information, wherein the paper sheet is transported along a transport surface. And a reference-side molded frame formed as a region where the substantially entire region is formed, a partially rigid region and a region that is easily deformed, and disposed so as to face the reference-side molded frame, A detection-side molding frame that forms the conveying surface together with a reference-side molding frame, a first type sensor that applies only a slight bending stress to the periphery, and a second type that applies a bending stress that is stronger than the first type sensor to the periphery The first type sensor is disposed in one or both of the rigid region of the reference-side molded frame and the detection-side molded frame formed as a region where the substantially entire region is a rigid region. The second type sensor is formed as a sensor module whose constituent members are covered with a sensor frame made of a metal material, and the deformation of the reference side molding frame and the detection side molding frame formed as a hard region in the substantially whole area. It is set as the structure divided | segmented into the area | region which is easy to do.

  Here, the “first type sensor” means, for example, an optical sensor or a magnetic sensor, and the “second type sensor” means, for example, a thickness sensor. The “second type sensor” is formed as a sensor module covered with a metal frame. Thereby, this sensor support mechanism seals the bending stress of the intensity | strength given to the circumference | surroundings in a sensor module.

  However, when the sensor module is still distorted in the sensor frame made of a metal material having an elastic modulus due to the strong bending stress, the bending stress is applied to the molding frame, which causes distortion in the molding frame. As a result, the alignment accuracy of the first type sensor may be lowered. Therefore, this sensor support mechanism arranges the first type sensor in a rigid region, and arranges the second type sensor in both the reference side molding frame and the easily deformable region, thereby reducing the bending stress applied to the molding frame. Absorb in the molding frame around the second type sensor. As a result, this sensor support mechanism keeps (limits) the bending stress applied to the forming frame around the second type sensor when the metal sensor frame is distorted.

  Therefore, this sensor support mechanism is configured such that the influence of the distortion of the molding frame generated around the second type sensor does not reach the periphery of the first type sensor. As a result, this sensor support mechanism has a configuration in which it is difficult for the sensor support mechanism to be displaced.

  Note that the second type sensor may be configured such that the constituent members are not covered with the sensor frame made of a metal material, depending on the degree of the bending stress. Therefore, the second invention is a sensor support mechanism for supporting a plurality of types of sensors for acquiring paper sheet information, wherein the paper sheet is transported along a transport surface, and a substantially entire area is provided. It is divided into a reference side molding frame formed as a rigid area, a partially rigid area and an easily deformable area, and is disposed so as to face the reference side molding frame, together with the reference side molding frame. A detection-side molding frame that forms the conveying surface; a first type sensor that applies only a slight bending stress to the periphery; and a second type sensor that applies a bending stress stronger than the first type sensor to the periphery. The first type sensor is disposed in one or both of the rigid region of the reference side molding frame and the detection side molding frame formed as a region where the substantially entire region is rigid, and the second type sensor is A configuration that is arranged to be divided into the reference-side molding frame is substantially the entire region is formed as a rigid region and the easily deformable region of the detection-side molding frame.

  Similar to the sensor support mechanism according to the first invention, the sensor support mechanism according to the second invention is formed by arranging the first type sensor in a rigid region and arranging the second type sensor in an easily deformable region. The bending stress applied to the frame is absorbed by the molding frame around the second type sensor. Therefore, this sensor support mechanism is configured such that the influence of the distortion of the molding frame generated around the second type sensor does not reach the periphery of the first type sensor. As a result, this sensor support mechanism has a configuration in which it is difficult for the sensor support mechanism to be displaced.

Further, the third invention is a paper sheet handling apparatus for handling paper sheets, and has a configuration in which the sensor support mechanism according to the first invention or the second invention is provided on a conveyance path for conveying the paper sheets.
Since this paper sheet handling apparatus uses the sensor support mechanism according to the first invention or the second invention, it is possible to suppress displacement of the sensor.

According to the 1st invention or the 2nd invention, the sensor support mechanism which suppresses the position shift of a sensor can be provided.
Further, according to the third invention, a paper sheet handling apparatus using the sensor support mechanism according to the first invention or the second invention can be provided.

It is a figure which shows the structure of the paper sheet handling apparatus which concerns on Embodiment 1. FIG. It is a figure which shows the structure of the sensor support mechanism which concerns on Embodiment 1. FIG. It is a figure (1) which shows the structure of the thickness sensor module used in Embodiment 1. FIG. It is a figure (2) which shows the structure of the thickness sensor module used in Embodiment 1. FIG. It is a figure which shows the structure of a comparative example. It is a figure which shows the structure of the paper sheet handling apparatus which concerns on Embodiment 2. FIG.

  Hereinafter, an embodiment of the present invention (hereinafter referred to as “the present embodiment”) will be described in detail with reference to the drawings. Each figure is only schematically shown so that the present invention can be fully understood. Therefore, the present invention is not limited to the illustrated example. Moreover, in each figure, the same code | symbol is attached | subjected about the common component and the same component, and those overlapping description is abbreviate | omitted.

[Embodiment 1]
<Configuration of paper sheet handling device>
Hereinafter, the configuration of the paper sheet handling apparatus according to the first embodiment will be described with reference to FIG. FIG. 1 is a diagram illustrating the configuration of the paper sheet handling apparatus according to the first embodiment.

  The paper sheet handling apparatus 10 according to the first embodiment is, for example, an automatic transaction apparatus (ATM), a passbook entry machine, a ticketing machine, a printer, or the like. Here, an automatic transaction apparatus will be described as the paper sheet handling apparatus 10. Hereinafter, the paper sheet handling apparatus 10 is referred to as “automatic transaction apparatus 10”. In addition, paper sheets may be referred to as “banknotes”.

  As shown in FIG. 1, an automatic transaction apparatus 10 includes a deposit / withdrawal port 12, a collective cassette 13, a reject cassette 14, a denomination safe 15, a conveyance path 16, a conveyance roller 17, and a paper sheet inside a housing 11. An identification unit 18 is provided.

The deposit / withdrawal port 12 is a customer service section into which bills are inserted and discharged.
The collective cassette 13 is a storage for replenishing and collecting banknotes with respect to the automatic transaction apparatus 10. The collective cassette 13 is configured to be freely attached to and detached from the automatic transaction apparatus 10. At the time of replenishment, the automatic transaction apparatus 10 pays out banknotes from the collective cassette 13, discriminates them with the paper sheet discrimination unit 18, and stores them in the denomination safe 15. Moreover, the automatic transaction apparatus 10 pays out banknotes from the denomination safe 15 and stores them in the collective cassette 13 at the time of collection. In addition, when the inside of the collective cassette 13 is filled with banknotes, it is exchanged for another empty collective cassette 13 by the recovery person. The collective cassette 13 is carried to a cash management center (not shown) by a collection member, and the internal banknotes are collected at the cash management center. When the inside of the collective cassette 13 becomes empty, the collective cassette 13 is carried to the automatic transaction apparatus 10 by the recovery person, and is again mounted and used inside the automatic transaction apparatus 10.

  The reject cassette 14 is a storage for storing reject banknotes that cannot be reused. The automatic transaction apparatus 10 stores the reject banknotes identified as being unusable by the paper sheet discrimination unit 18 at the time of deposit or withdrawal in the reject cassette 14.

The denomination safe 15 is a storage for storing banknotes by denomination.
The conveyance path 16 is a path through which bills are conveyed.
The transport roller 17 is a transport unit that transports banknotes.
The paper sheet discrimination unit 18 is a discrimination device that discriminates the authenticity, denomination, and degree of fouling of banknotes. The paper sheet discrimination unit 18 includes a thickness sensor 21, an optical sensor 22, and a magnetic sensor 23 (see FIG. 2). FIG. 2 is a diagram illustrating the configuration of the sensor support mechanism according to the first embodiment. The paper sheet discrimination unit 18 supports these sensors 21, 22, and 23 by the sensor support mechanism 1 shown in FIG.

<Configuration of sensor support mechanism>
The sensor support mechanism 1 is configured to satisfy the following characteristics because the following characteristics are required for each of the sensors 21, 22, and 23.

(Characteristics required for each sensor)
Each sensor 21, 22, 23 is required to have the following characteristics. The thickness sensor 21 corresponds to a “second type sensor” recited in the claims. The optical sensor 22 and the magnetic sensor 23 correspond to a “first type sensor” recited in the claims. Each sensor 21, 22, 23 is configured to be removable.

(1) Although the thickness sensor 21 has springs 33a and 33b (see FIG. 3A), the tension of the spring 33b is particularly strong, and the spring 33b gives a strong bending stress to the surroundings. The periphery is made of a highly rigid frame member (a member having a high rigidity to the extent that it is necessary to be made of at least a metal material), and the detection roller 32 (see FIG. 3A) and displacement are made of the highly rigid frame member. It is required to cover components such as the sensor 34 (see FIG. 3A).
(2) The optical sensor 22 and the magnetic sensor 23 are required to have high alignment accuracy in order to acquire paper sheet information from a predetermined part of a bill. For example, the optical sensor 22 is required to have high alignment accuracy because the output fluctuates when the focal length is deviated. In addition, since the output of the magnetic sensor 23 varies due to the variation in the gap from the detection surface of the sensor to the detected object, high alignment accuracy is required.

(Configuration to satisfy the characteristics required for each sensor)
The sensor support mechanism 1 has the following characteristics in order to satisfy the characteristics required for each sensor.

(1) The thickness sensor 21 is modularized by sealing (surrounding) the constituent members of the thickness sensor 21 with a frame made of a metal material such as stainless steel (hereinafter referred to as “sensor frames 36 and 37”). Accordingly, the tension of the spring 33b (see FIG. 3A) of the thickness sensor 21 is supported by the metal sensor frames 36 and 37.
(2) To reduce costs, facilitate the adjustment of the alignment of each sensor 21, 22, 23 to a predetermined position, and prevent noise from being mixed into the detection information of each sensor 21, 22, 23 The molding frame 50 (see FIG. 2) is made of a resin material that is inexpensive and can be easily adjusted to a predetermined position of each sensor.
(3) The molding frame 50 is divided into a hard region 50A and a region 50B that is easily deformed so that the influence of the distortion of the molding frame 50 generated around the thickness sensor 21 does not reach the periphery of the optical sensor 22 and the magnetic sensor 23. To do.

  That is, the thickness sensor 21 (see FIG. 3A) uses the pressure of the spring 33a to press the detection roller 32 against the reference roller 31, and uses the tension of the spring 33b to lock the surrounding molding frame with the lock lever 41. 50 is pressed in the approaching direction. However, the tension of the spring 33b is very strong. Therefore, distortion is likely to occur around the thickness sensor 21. Therefore, in the first embodiment, the thickness sensor 21 has a module structure sealed with sensor frames 36 and 37 made of a metal material such as high-stiffness stainless steel, and the tension of the spring 33b is supported by the sensor frames 36 and 37 made of metal material. Thus, the distortion around the thickness sensor 21 is suppressed. Hereinafter, the thickness sensor 21 may be referred to as a “thickness sensor module 21”. Further, the sensor frame 36 and the sensor frame 37 are separated from each other. When the sensor frame 36 and the sensor frame 37 are distinguished from each other, the sensor frame 36 is referred to as a “reference side sensor frame 36” and the sensor frame 37 is referred to as a “detection side sensor frame 37”. Called.

  However, in the sensor support mechanism 1, the metal sensor frames 36 and 37 are distorted only by the configuration, and the distortion of the metal sensor frames 36 and 37 is further formed around the thickness sensor module 21. 50 may be distorted.

  Therefore, when the sensor support mechanism 1 forms the molding frame 50 with a resin material, the entire molding frame 50 on the side on which the reference roller 31 is provided (a reference side molding frame 51 described later) is further formed by the rigid region 50A. In addition to the formed configuration, the molding frame 50 (the detection-side molding frame 52 described later) on which the detection roller 32 is provided is divided into a hard region 50A and a region 50B that is easily deformed. The sensor support mechanism 1 supports the thickness sensor module 21 in the easily deformable region 50 </ b> B to absorb the distortion of the metal sensor frames 36 and 37 in the easily deformable region 50 </ b> B of the molding frame 50. Further, the sensor support mechanism 1 supports the optical sensor 22 and the magnetic sensor 23 in the rigid region 50A, thereby avoiding the positional deviation of the optical sensor 22 and the magnetic sensor 23 during assembly.

  Hereinafter, the configuration of the thickness sensor module 21 will be described first, and then the configuration of the molding frame 50 of the sensor support mechanism 1 will be described.

(Configuration of thickness sensor module)
Hereinafter, the configuration of the thickness sensor module 21 will be described with reference to FIGS. 3 and 4. 3 and 4 are diagrams each showing a configuration of the thickness sensor module used in the first embodiment. FIG. 3A shows the configuration of the thickness sensor module 21 viewed from the side, and FIG. 3B shows the configuration of the thickness sensor module 21 viewed from the oblique side. 4A shows a component part of the reference side sensor frame 36 of the thickness sensor module 21 made of a metal material, and FIG. 4B shows a metal part of the reference side sensor frame 36 of the thickness sensor module 21. The component part by is shown.

  As shown in FIGS. 3 and 4, the thickness sensor module 21 includes a reference roller 31, a detection roller 32, springs 33 a and 33 b, a displacement sensor 34, and a lock lever 41.

The reference roller 31 is a rotatable roller having a fixed position.
The detection roller 32 is a rotatable roller whose position varies depending on the thickness of the conveyed paper sheet.
The spring 33 a is a pressing spring that presses the detection roller 32 against the reference roller 31.
The spring 33 b is a locking spring that pulls the lock lever 41 and fixes the reference side sensor frame 36 and the detection side sensor frame 37 with the lock lever 41.
The displacement sensor 34 is a sensor that detects the amount of displacement of the detection roller 32.
The lock lever 41 is a lock member that fixes the reference side sensor frame 36 and the detection side sensor frame 37 with a lock lever.

  In such a configuration, the spring 33 a presses the detection roller 32 against the reference roller 31. And the displacement sensor 34 will detect the displacement amount of the detection roller 32, if the detection roller 32 fluctuates according to the thickness of the conveyed banknote. Accordingly, the thickness sensor module 21 acquires bill thickness information as paper sheet information. The contact position between the detection roller 32 and the reference roller 31 is a reference position for displacement of the detection roller 32.

  As shown in FIG. 3 (b), the reference roller 31 is a cylindrical roller (hereinafter referred to as "lower part") formed on a surface of a columnar shaft 31a formed of a metal material such as stainless steel. The roller 31b "is provided).

  The reference roller 31 is sealed rotatably by a reference side sensor frame 36. The hatched portion shown in FIG. 4A indicates that the reference side sensor frame 36 is a member made of a metal material. The hatched portion is firmly fixed by means such as integral molding, screwing, or welding. For example, in the example illustrated in FIG. 4A, the reference side sensor frame 36 covers two side plates 36 a that sandwich the reference roller 31 from both sides and a lower portion of the reference roller 31 by bending one plate material. The bottom plate 36b is integrally provided. The two side plates 36a rotatably support the shaft 31a of the reference roller 31. Further, the two side plates 36 a are provided with projecting locking portions 36 c that engage with claws 41 b to be described later of the lock lever 41.

  The reference roller 31 is provided with a gap adjusting roller 31c at the axial end of the shaft 31a. The interval adjusting roller 31 c is in contact with the interval adjusting protrusion 37 c provided on the detection side sensor frame 37, thereby adjusting the interval of the detection side sensor frame 37 with respect to the reference side sensor frame 36.

  The detection roller 32 is provided with a cylindrical roller (hereinafter referred to as “upper roller 32b”) formed of a rubber material on the surface of a columnar shaft 32a formed of a metal material such as stainless steel. It has a configuration.

  The detection roller 32 is rotatably sealed by a detection side sensor frame 37. The hatched portion shown in FIG. 4B indicates that the detection side sensor frame 37 is a member made of a metal material. For example, in the example shown in FIG. 4B, the detection-side sensor frame 37 covers the two side plates 37a that sandwich the detection roller 32 from both sides and the upper side of the detection roller 32 by bending one plate material. The top plate 37b is provided. The two side plates 37a rotatably support the shaft 32a of the detection roller 32.

  In the detection side sensor frame 37, one side plate 37 a is opposed to a gap adjusting roller 31 c provided on the reference roller 31. One side plate 37a is provided with a spacing adjusting projection 37c at a position facing the spacing adjusting roller 31c. The interval adjusting protrusion 37 c is in contact with the interval adjusting roller 31 c of the reference roller 31, thereby adjusting the interval of the detection side sensor frame 37 with respect to the reference side sensor frame 36 to be constant.

  A shaft 42 is provided above the top plate 37 b of the detection side sensor frame 37. Further, lock levers 41 are provided on both sides of the detection side sensor frame 37, respectively.

  The shaft 42 is a member that connects two lock levers 41 provided on both sides of the detection-side sensor frame 37, and is a member that serves as a rotation axis of the two lock levers 41. The shaft 42 is in contact with the top plate 37 b of the detection side sensor frame 37. When the assembly operator rotates one lock lever 41 (left lock lever 41 in the illustrated example) in the release direction (clockwise direction in the illustrated example), the other lock lever is adjusted accordingly. 41 is also rotated in the release direction.

  One or both of the two lock levers 41 are urged in the locking direction (in the illustrated example, the counterclockwise direction) by the strong tension of the spring 33b. For this reason, when the assembly operator releases his / her hand from one lock lever 41, the two lock levers 41 rotate in the locking direction. At this time, the claw 41 b provided at the front ends of the two lock levers 41 engages with the protruding locking portions 36 c provided on the two side plates 36 a of the reference side sensor frame 36.

  As shown in FIGS. 2 and 3A, the pawl 41b of the lock lever 41 is tapered from the front end side toward the rear end side. Therefore, the spring 33b that biases the lock lever 41 presses the reference sensor frame 36 and the detection sensor frame 37 in the approaching direction via the lock lever 41 when locked. For example, the spring 33b rotates the lock lever 41 in the lock direction when locked. At this time, the claw 41 b provided at the tip of the lock lever 41 engages with the protruding locking portions 36 c provided on the two side plates 36 a of the reference side sensor frame 36. The spring 33b presses the reference side sensor frame 36 upward with the claw 41b of the lock lever 41, and lowers the detection side sensor frame 37 with the shaft 42 that is in contact with the top plate 37b of the detection side sensor frame 37. Press in the direction.

  Note that the thickness sensor module 21 is provided in a region 50B (see FIG. 2) of the detection-side molding frame 52, which will be described later, which is easily deformed. Therefore, the detection side molding frame 52 is deformed around the thickness sensor module 21. As a result, the detection side sensor frame 37 approaches the reference side sensor frame 36. The approach is stopped when the interval adjusting protrusion 37c of the detection-side sensor frame 37 abuts against the interval adjusting roller 31c of the reference roller 31. Thereby, the detection roller 32 is positioned at a predetermined interval with respect to the reference roller 31.

  As shown in FIG. 4, the thickness sensor module 21 having such a configuration has a module structure in which constituent members are sealed (enclosed) by sensor frames 36 and 37 made of metal. Thus, the thickness sensor module 21 supports the tension of the spring 33b (see FIG. 3A) with the sensor frames 36 and 37.

(Configuration of sensor support mechanism molding frame)
Hereinafter, the configuration of the molding frame 50 of the sensor support mechanism 1 will be described with reference to FIG.

As shown in FIG. 2, the sensor support mechanism 1 has two molded frames 50. The two molding frames 50 are each made of a resin material that is cheaper and less rigid than a metal material. The reason is that if the forming frame 50 is made of a metal material, the following defects (1) to (3) occur, and it is necessary to eliminate these defects.
(1) Since the metal material is more expensive than the resin material, the cost increases.
(2) Since the metal material has high rigidity and is difficult to process, it is difficult to adjust the alignment of the sensor to a predetermined position.
(3) Since the metal material easily transmits vibration to the sensor, vibration noise is particularly likely to be mixed into the detection information of the thickness sensor module 21.

  Therefore, the two molded frames 50 are (1) to suppress the cost increase, (2) to facilitate alignment adjustment of each sensor 21, 22, 23 to a predetermined position, and ( 3) It is made of a resin material in order to suppress transmission of vibration from the molding frame 50 to the sensor (particularly, the thickness sensor module 21) and suppress mixing of vibration noise into the detection information.

  The molding frame 50 is susceptible to static electricity because it needs to transport paper sheets. Therefore, it is preferable that the molding frame 50 is made of a conductive material. As a material of the molding frame 50, for example, xylon (modified PPE) may be used.

  The two molding frames 50 are disposed so as to face each other, thereby forming the transport path 16 (transport surface) on the surfaces facing each other. Therefore, the mutually opposing surfaces are formed substantially flat.

  The two forming frames 50 have sensors 21, 22, and 23 for acquiring paper sheet information attached to one or both of them. The two forming frames 50 are provided with a plurality of conveying rollers 17 for conveying paper sheets inside. Each conveyance roller 17 is arranged so as to protrude from the inside of the forming frame 50 to the conveyance path 16 and to rotate along the conveyance direction of the paper sheet.

  In the example illustrated in FIG. 2, the molding frame 50 disposed on the lower side of the two molding frames 50 supports the reference roller 31 (see FIG. 3) of the thickness sensor module 21. On the other hand, the molding frame 50 disposed on the upper side supports the detection roller 32 (see FIG. 3) of the thickness sensor module 21. Hereinafter, when the two molding frames 50 are distinguished, the lower molding frame 50 is referred to as a “reference-side molding frame 51”, and the upper molding frame 50 is referred to as a “detection-side molding frame 52”.

  The reference side molding frame 51 and the detection side molding frame 52 are connected by a connecting member 59. The connecting member 59 rotatably supports at least one of the two molding frames 50 (in the illustrated example, the detection-side molding frame 52) with a rotation shaft 59a. Therefore, the detection-side molding frame 52 rotates with respect to the reference-side molding frame 51 using the rotation shaft 59a as an open fulcrum. Thereby, the conveyance path 16 becomes an open state or a closed state. An assembly operator of the sensor support mechanism 1 can adjust the alignment of the sensors 21, 22, and 23 by opening the transport path 16 when the sensor support mechanism 1 is assembled.

  The connecting member 59 is provided at either the front end or the rear end of the transport path 16. The thickness sensor module 21 is attached to the side away from the connecting member 59, while the optical sensor 22 and the magnetic sensor 23 are attached to the side close to the connecting member 59. This is because the optical sensor 22 and the magnetic sensor 23 require high alignment accuracy, and by providing the optical sensor 22 and the magnetic sensor 23 on the side close to the connecting member 59, the alignment accuracy is improved.

  The thickness sensor module 21 is divided into a reference side sensor frame 36 and a detection side sensor frame 37 and is directly attached to the molding frame 50 on the corresponding side. Further, the optical sensor 22 and the magnetic sensor 23 have sensor detection openings formed integrally with the molding frame 50 and are directly attached to the molding frame 50.

  The reference side molding frame 51 and the detection side molding frame 52 are fixed by the lock lever 41 (see FIG. 3) of the thickness sensor module 21.

  The “reference side molding frame 51” is configured as a region 50A that is entirely rigid. Further, the “detection-side molded frame 52” is partitioned into a partially rigid region 50A and an easily deformable region 50B. Here, the “hard region 50A” means a region where the reinforcing rib 53 is provided, while the “easy to deform region 50B” means a region where the reinforcing rib 53 is not provided. Yes. Accordingly, the detection-side molded frame 52 has a configuration in which the reinforcing rib 53 is partially provided.

  The reinforcing rib 53 is a part provided to reinforce the bending strength of the molding frame 50. One or a plurality of reinforcing ribs 53 are provided at locations where the molding frame 50 requires a certain level of strength. The reinforcing rib 53 can be configured as a separate member from the molded frame 50, but here, in order to suppress an increase in the cost of the sensor support mechanism 1, the reinforcing rib 53 is a part molded integrally with the molded frame 50. It shall be. For example, the reinforcing rib 53 prevents the side plate of the molding frame 50 from falling when the molding frame 50 is molded into a box shape.

The reason why the “detection-side molded frame 52” is divided into the hard region 50A and the easily deformable region 50B is as follows (1) to (3).
(1) The reason is that the thickness sensor module 21 is supported by the low-rigidity, easily deformable region 50B in anticipation of the detection-side molded frame 52 being deformed by the tension of the spring 33b of the thickness sensor module 21. .
(2) The reason is that when the thickness sensor module 21 is arranged in the easily deformable region 50B and the sensor frames 36 and 37 of the thickness sensor module 21 are distorted, the tension of the spring 33b of the thickness sensor module 21 The generated distortion of the molding frame 50 is limited (limited) around the thickness sensor module 21, and the influence of the distortion of the molding frame 50 generated around the thickness sensor module 21 does not reach the periphery of the optical sensor 22 and the magnetic sensor 23. It is for doing so.
(3) The reason is that the optical sensor 22 and the magnetic sensor 23, which require high alignment accuracy, are arranged in the hard region 50A, so that the alignment of the optical sensor 22 and the magnetic sensor 23 is performed in the rigid region 50A. This is based on the dimensions, so that the optical sensor 22 and the magnetic sensor 23 are aligned with a predetermined position with high accuracy, and the positional deviation of the optical sensor 22 and the magnetic sensor 23 during assembly is suppressed as much as possible.

<Operation of sensor support mechanism>
Hereinafter, the operation of the sensor support mechanism 1 will be described with reference to FIGS. 2 and 5. FIG. 5 is a diagram illustrating a configuration of a comparative example. The sensor support mechanism 2 as a comparative example shown in FIG. 5 includes a region 50A where the entire molding frame 50 is rigid. When the sensor support mechanism 1 paper sheet P (see FIG. 5) according to the first embodiment shown in FIG. 2 is transported, it operates as follows.

  The thickness sensor module 21 is divided and provided on both the reference side molding frame 51 and the detection side molding frame 52. In the thickness sensor module 21, the detection roller 32 is pressed against the reference roller 31 by a spring 33. When the paper sheet P (see FIG. 5) is conveyed, the detection roller 32 is displaced, and the displacement sensor 34 is detected by the detection roller. 32 displacement amounts are detected. Thereby, the thickness sensor module 21 acquires the thickness information of the paper sheet P as the paper sheet information.

  The optical sensor 22 and the magnetic sensor 23 are provided in one or both of the reference-side molding frame 51 and the detection-side molding frame 52 at a conveyance path gap position necessary for acquiring paper sheet information. When the paper sheet P (see FIG. 5) is conveyed, the optical sensor 22 and the magnetic sensor 23 acquire the optical information and magnetic information of the paper sheet P as the paper sheet information.

  By the way, if the thickness sensor module 21 is not configured as a metal module, the following failure occurs. That is, the detection-side molded frame 52 is elastically deformed when a large load is applied by a spring or the like as in the thickness sensor 21 because the resin material is less rigid than the metal material. When the detection-side molding frame 52 is elastically deformed, the position of the reference roller 31 of the thickness sensor 21 changes, or the lock of the lock lever 41 does not function. Thereby, the thickness sensor 21 cannot apply an appropriate load to the detection roller 32, and the detection roller 32 cannot be operated normally. As a result, the thickness sensor 21 cannot acquire thickness information accurately.

  Therefore, the sensor support mechanism 1 according to the first embodiment seals the thickness sensor 21 with metal sensor frames 36 and 37, and attaches a lock lever 41 to the metal material sensor frames 36 and 37 to thereby obtain a thickness. As the sensor module 21, the thickness sensor 21 is modularized to give the thickness sensor 21 high rigidity.

  The thickness sensor module 21 is sealed with metal sensor frames 36 and 37 so that all the constituent members are connected with the metal material, so that static electricity generated during high-speed conveyance of the paper sheet P can be prevented. , Can escape through the metal material. As a result, it is possible to prevent the paper sheet P and the constituent members from being charged. As a result, the sensor support mechanism 1 according to the first embodiment can prevent jamming of the paper sheet P during the high-speed conveyance of the paper sheet P. Occurrence can be suppressed.

  However, the thickness sensor module 21 may be distorted in the sensor frames 36 and 37 due to the tension of the spring 33b. When the sensor frames 36 and 37 are distorted, the tension of the spring 33b is applied to the forming frame 50 as a strong bending stress, which causes distortion in the forming frame 50. As a result, the alignment accuracy of the optical sensor 22 and the magnetic sensor 23 is increased. May be reduced.

  Further, since the thickness sensor module 21 is configured such that the detection roller 32 is in direct contact with the paper sheet P, the vibration of the molding frame 50 is more likely to be mixed into the detection information than the optical sensor 22 and the magnetic sensor 23.

  Therefore, in the sensor support mechanism 1 according to the first embodiment, the region of the molding frame 50 to which the thickness sensor module 21 is attached is configured as a region 50B that is not provided with the reinforcing rib 53 and is easily deformed. The sensor support mechanism 1 absorbs the distortion of the sensor frames 36 and 37 by this easily deformable region 50B. Therefore, the sensor support mechanism 1 can suppress a decrease in alignment accuracy of the optical sensor 22 and the magnetic sensor 23, and thus can suppress a positional shift between the optical sensor 22 and the magnetic sensor 23.

  Further, the sensor support mechanism 1 according to the first embodiment attenuates the vibration of the molding frame 50 by the region 50B that is easily deformed. Therefore, the sensor support mechanism 1 can suppress the vibration of the molding frame 50 from being transmitted to the thickness sensor module 21.

  In the sensor support mechanism 1 according to the first embodiment, the region of the molded frame 50 to which the optical sensor 22 and the magnetic sensor 23 are attached is configured as a rigid region 50A provided with the reinforcing rib 53. In the sensor support mechanism 1, since the molding frame 50 is molded as one component, the rigid region 50 </ b> A allows the optical sensor 22 and the magnetic sensor 23 to be accumulated without accumulating the component tolerances in the optical sensor 22 and the magnetic sensor 23. It can be securely attached at a desired position.

  As described above, the sensor support mechanism 1 is provided with the rigid region 50A and the easily deformable region 50B in the molded frame 50, and the sensor (here, the thickness sensor 21) that needs to be pressurized by the spring is easily deformed into the easily deformable region 50B. By arranging the sensors (here, the optical sensor 22 and the magnetic sensor 23) that do not need to be pressurized by a spring in the rigid region A, the characteristics of the sensors 21, 22, and 23 can be satisfied with a small number of parts. it can.

On the other hand, the sensor support mechanism 2 as a comparative example shown in FIG. 5 is configured as a region 50A in which the substantially entire region of the molding frame 50 is rigid. Therefore, in the sensor support mechanism 2, the distortion of the sensor frames 36 and 37 further causes the molding frame 50 to be distorted, which may reduce the alignment accuracy of the optical sensor 22 and the magnetic sensor 23. Therefore, the sensor support mechanism 2 may cause a positional shift between the optical sensor 22 and the magnetic sensor 23.
Further, the sensor support mechanism 2 cannot suppress the vibration of the molding frame 50 from being transmitted to the thickness sensor module 21.

  As described above, according to the sensor support mechanism 1 according to the first embodiment, since the entire molding frame 50 is made of a resin material, the sensor 21, 22, and 23 can be easily positioned at low cost. Can be provided.

  Further, according to the sensor support mechanism 1, it is possible to suppress a decrease in the alignment accuracy of the optical sensor 22 and the magnetic sensor 23 by absorbing the distortion of the sensor frames 36 and 37 by the easily deformable region 50B. Accordingly, it is possible to suppress the positional deviation between the optical sensor 22 and the magnetic sensor 23.

  Furthermore, according to the sensor support mechanism 1, the characteristics required for the thickness sensor 21 and the characteristics required for the optical sensor 22 and the magnetic sensor 23 can be satisfied with a small number of components.

  In the first embodiment, one optical sensor 22 and one magnetic sensor 23 are attached to the rigid region 50A of the sensor support mechanism 1. However, the sensor support mechanism 1 may be configured such that the plurality of optical sensors 22 and the plurality of magnetic sensors 23 are attached to the rigid region 50A.

  However, in the case of such a configuration, the sensor support mechanism 1 causes vibration noise and the second output of the first optical sensor 22 as in the mechanism disclosed in Patent Document 2 or Patent Document 3, for example. May be mixed between the output of the first optical sensor 22 or the output of the first magnetic sensor 23 and the output of the second magnetic sensor 23.

  However, even if vibration noise is mixed, the paper sheet discrimination unit 18 using the sensor support mechanism 1 is different from the mechanism disclosed in Patent Document 2 or Patent Document 3 in that the optical sensor 22 and the magnetic sensor 23 are rigid. Since it is attached to the region 50A and the timing of vibration noise matches, vibration noise can be easily and reliably canceled for each output difference. Therefore, the paper sheet discrimination unit 18 using the sensor support mechanism 1 can stably and appropriately compare with the standard data.

  Further, the paper sheet discrimination unit 18 using the sensor support mechanism 1 is disclosed in Patent Document 2 or Patent Document 3 when the natural frequency of the entire sensor support mechanism matches the frequency of the paper sheet P being conveyed. Unlike the mechanism, the vibration can be absorbed in the easily deformable region 50B and the influence on the hard region 50A can be suppressed, so that the vibration noise can be canceled reliably.

[Embodiment 2]
The paper sheet handling apparatus according to the second embodiment is configured not to attach a paper sheet discrimination unit in which the sensors 21, 22 and 23 are integrated, but to attach the sensors 21, 22 and 23 separately. ing. Each sensor 21, 22, 23 attached separately functions as a paper sheet discrimination unit by outputting detection information to the control unit of the paper sheet handling apparatus.

  Hereinafter, the configuration of the paper sheet handling apparatus according to the second embodiment will be described with reference to FIG. FIG. 6 is a diagram illustrating the configuration of the paper sheet handling apparatus according to the second embodiment.

  The automatic transaction apparatus 10B as a paper sheet handling apparatus according to the second embodiment is configured to attach the sensors 21, 22, and 23 separately. Therefore, the automatic transaction apparatus 10B can disperse | distribute and arrange | position each sensor 21,22,23 to the some part of the conveyance path 16, as shown in FIG.

  In the example shown in FIG. 6, the automatic transaction apparatus 10 </ b> B uses the sensor support mechanism 1 </ b> B for the conveyance path 16 bent in an L shape. In the sensor support mechanism 1B, a vertical portion of the transport path 16 is configured by a rigid region 50A, and a lateral portion of the transport path 16 is configured by a region 50B that is easily deformed. Thereby, the sensor support mechanism 1B can arrange | position the optical sensor 22 and the magnetic sensor 23 in the vertical direction part of the conveyance path 16, and can arrange | position the thickness sensor module 21 in the horizontal direction part of the conveyance path 16. FIG. However, it is necessary for the sensor support mechanism 1B to secure a route for supplying power to the sensors 21, 22, and 23.

  The sensor support mechanism 1B according to the second embodiment operates in the same manner as the sensor support mechanism 1 according to the first embodiment.

  Therefore, according to the sensor support mechanism 1B according to the second embodiment, as with the sensor support mechanism 1 according to the first embodiment, the entire molding frame 50 is made of a resin material. , 22 and 23 can be provided with a simple configuration.

  Further, according to the sensor support mechanism 1B, similarly to the sensor support mechanism 1 according to the first embodiment, the deformation of the sensor frames 36 and 37 is absorbed by the easily deformable region 50B, so that the optical sensor 22 and the magnetic sensor 23 It is possible to suppress a decrease in alignment accuracy, and thus it is possible to suppress a positional shift between the optical sensor 22 and the magnetic sensor 23.

  Furthermore, according to the sensor support mechanism 1B, as with the sensor support mechanism 1 according to the first embodiment, the characteristics required for the thickness sensor 21 and the characteristics required for the optical sensor 22 and the magnetic sensor 23 with a small number of parts. Can be met.

  Moreover, according to the sensor support mechanism 1 </ b> B, the sensors 21, 22, and 23 are arranged as a part of the conveyance path 16 in the paper sheet handling apparatus 10 without performing area division called a paper sheet discrimination unit. Can do.

The present invention is not limited to the above-described embodiment, and various changes and modifications can be made without departing from the gist of the present invention.
For example, although Embodiment 1 and Embodiment 2 have been described using an automatic transaction apparatus as the paper sheet handling apparatus, the present invention is applied to a passbook bookkeeping machine, ticket issuing machine, printer, and other paper sheet handling apparatuses. be able to.
Further, the thickness sensor 21 as the second type sensor may be configured such that the constituent members are not covered with the metal sensor frames 36 and 37 depending on the tension of the spring 33b.

1 Sensor support mechanism 2 Sensor support mechanism (comparative example)
DESCRIPTION OF SYMBOLS 10 Paper sheet handling apparatus 11 Case 12 Deposit / withdrawal port 13 Collective cassette 14 Reject cassette 15 Denomination safe 16 Conveyance path 17 Conveyance roller 18 Sheet identification unit 21 Thickness sensor module (thickness sensor)
22 Optical Sensor 23 Magnetic Sensor 31 Reference Roller 31a Shaft 31b Lower Roller 31c Spacing Adjustment Roller 32 Detection Roller 32a Shaft 32b Upper Roller 33a, 33b Spring (Biasing Member)
34 Displacement sensor 36 Reference side sensor frame 36a Side plate 36b Bottom plate 36c Locking portion 37 Detection side sensor frame 37a Side plate 37b Top plate 37c Spacing adjustment projection 41 Lock lever (lock member)
41a Bearing 41b Claw 42 Shaft 50 Molding frame 50A Hard region 50B Deformable region 51 Reference side molding frame 52 Detection side molding frame 53 Reinforcement rib 59 Connecting member 59a Rotating shaft P Paper sheet

Claims (9)

In a sensor support mechanism for supporting a plurality of types of sensors for acquiring paper sheet information,
A transport path along which the paper sheets are transported along a transport surface;
A reference-side molded frame formed as a hard region in substantially the entire area;
A detection-side molding frame that is partially partitioned into a rigid region and a region that is easily deformed, and that forms the transport surface together with the reference-side molding frame by being disposed facing the reference-side molding frame;
A first type sensor that gives only a slight bending stress to the surroundings;
A second type sensor that gives a stronger bending stress than the first type sensor in the periphery,
The first type sensor is disposed in one or both of the rigid region of the reference-side molded frame and the detection-side molded frame formed as a region where substantially the entire region is rigid,
The second type sensor is formed as a sensor module whose constituent members are covered with a sensor frame made of a metal material, and the reference-side molded frame and the detection-side molded frame that are formed as substantially rigid regions. A sensor support mechanism, wherein the sensor support mechanism is divided into regions that are easily deformed. The sensor support mechanism according to claim 1,
Both the reference side molding frame and the detection side molding frame are formed of a resin material,
Further, the reference-side molded frame is formed as the rigid region in which substantially the entire region is reinforced by reinforcing ribs for reinforcing bending strength,
The sensor-side support mechanism characterized in that the detection-side molded frame is partially partitioned into the hard region reinforced by the reinforcing rib and the easily deformable region not reinforced by the reinforcing rib. . In the sensor support mechanism according to claim 1 or 2,
The sensor frame covers a displacement sensor for detecting a displacement amount, and includes a reference side sensor frame that engages with the reference side molding frame and a detection side sensor frame that engages with the detection side molding frame. Is divided,
The detection-side molding frame includes a lock member that fixes the reference-side molding frame and the detection-side molding frame in a state where the detection-side sensor frame is pressed and fixed to the reference-side sensor frame side. A sensor support mechanism. The sensor support mechanism according to claim 3,
The lock member is configured as a lock lever having a claw at the tip,
The reference side sensor frame includes a locking portion that engages with the claw of the lock lever,
The sensor support mechanism, wherein the lock lever fixes the reference-side molding frame and the detection-side molding frame by engaging the claw with the locking portion of the reference-side sensor frame. In the sensor support mechanism according to claim 3 or 4,
The first type sensor is an optical sensor that detects optical information of the paper sheet, or a magnetic sensor that detects magnetic recording information of the paper sheet,
The sensor support mechanism according to claim 1, wherein the second type sensor is a thickness sensor that detects thickness information of the paper sheet. The sensor support mechanism according to claim 5,
The second type sensor is formed as a thickness sensor module that detects thickness information of the paper sheet,
The thickness sensor module is
In the reference side sensor frame, a position is fixed and a reference roller that is rotatable along the conveyance path is provided.
A detection roller that is disposed in the detection-side sensor frame so as to face the reference roller and has a position that varies according to the thickness of the paper sheet, and that is rotatable along the conveyance path; and A sensor support mechanism comprising the displacement sensor for detecting a displacement amount. The sensor support mechanism according to claim 6,
Furthermore, the detection roller includes an interval adjustment roller at an axial end,
The detection-side sensor frame includes an interval adjustment protrusion,
The interval adjustment protrusion is in contact with the interval adjustment roller when the reference side forming frame and the detection side forming frame are fixed by the lock member, thereby detecting the detection side sensor frame with respect to the reference side sensor frame. The sensor support mechanism is characterized in that the interval of the sensor is adjusted to be constant. In a sensor support mechanism for supporting a plurality of types of sensors for acquiring paper sheet information,
A transport path along which the paper sheets are transported along a transport surface;
A reference-side molded frame formed as a hard region in substantially the entire area;
A detection-side molding frame that is partially partitioned into a rigid region and a region that is easily deformed, and that forms the transport surface together with the reference-side molding frame by being disposed facing the reference-side molding frame;
A first type sensor that gives only a slight bending stress to the surroundings;
A second type sensor that gives a stronger bending stress than the first type sensor in the periphery,
The first type sensor is disposed in one or both of the rigid region of the reference-side molded frame and the detection-side molded frame formed as a region where substantially the entire region is rigid,
The second type sensor is divided and arranged in the reference side molding frame formed as a region having a substantially entire region and the easily deformable region of the detection side molding frame. . In the paper sheet handling equipment that handles paper sheets,
A paper sheet handling apparatus comprising the sensor support mechanism according to any one of claims 1 to 8 on a conveyance path for conveying paper sheets.

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