JP2012082366A5 - - Google Patents

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Publication number
JP2012082366A5
JP2012082366A5 JP2010231490A JP2010231490A JP2012082366A5 JP 2012082366 A5 JP2012082366 A5 JP 2012082366A5 JP 2010231490 A JP2010231490 A JP 2010231490A JP 2010231490 A JP2010231490 A JP 2010231490A JP 2012082366 A5 JP2012082366 A5 JP 2012082366A5
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JP
Japan
Prior art keywords
component
glycol
acid
dimethyl
mol
Prior art date
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JP2010231490A
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English (en)
Japanese (ja)
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JP2012082366A (ja
JP5488386B2 (ja
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Priority to JP2010231490A priority Critical patent/JP5488386B2/ja
Priority claimed from JP2010231490A external-priority patent/JP5488386B2/ja
Publication of JP2012082366A publication Critical patent/JP2012082366A/ja
Publication of JP2012082366A5 publication Critical patent/JP2012082366A5/ja
Application granted granted Critical
Publication of JP5488386B2 publication Critical patent/JP5488386B2/ja
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JP2010231490A 2010-10-14 2010-10-14 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン Active JP5488386B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010231490A JP5488386B2 (ja) 2010-10-14 2010-10-14 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010231490A JP5488386B2 (ja) 2010-10-14 2010-10-14 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン

Publications (3)

Publication Number Publication Date
JP2012082366A JP2012082366A (ja) 2012-04-26
JP2012082366A5 true JP2012082366A5 (OSRAM) 2013-08-29
JP5488386B2 JP5488386B2 (ja) 2014-05-14

Family

ID=46241590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010231490A Active JP5488386B2 (ja) 2010-10-14 2010-10-14 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン

Country Status (1)

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JP (1) JP5488386B2 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6218306B2 (ja) * 2013-05-31 2017-10-25 アキレス株式会社 ポリウレタンフォーム
JP5989902B2 (ja) * 2014-03-26 2016-09-07 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
KR102260532B1 (ko) * 2015-04-17 2021-06-03 세키스이가가쿠 고교가부시키가이샤 경화체, 전자 부품, 표시 소자 및 광 습기 경화형 수지 조성물
JP7003453B2 (ja) * 2017-06-08 2022-01-20 Dic株式会社 ウレタン（メタ）アクリレート樹脂
JP7300384B2 (ja) * 2017-08-10 2023-06-29 株式会社クラレ ポリウレタンホットメルト接着剤、それを用いた積層体及び積層体の製造方法
JP6753550B2 (ja) * 2018-02-21 2020-09-09 Dic株式会社 湿気硬化型ポリウレタンホットメルト樹脂組成物
JP2019203083A (ja) * 2018-05-24 2019-11-28 Dic株式会社 湿気硬化型ウレタンホットメルト樹脂組成物、及び、積層体
JP7196435B2 (ja) * 2018-06-28 2022-12-27 Dic株式会社 湿気硬化型ポリウレタンホットメルト樹脂組成物
KR102324490B1 (ko) * 2018-11-02 2021-11-10 주식회사 엘지화학 수지 조성물
JP2023058877A (ja) * 2021-10-14 2023-04-26 Dic株式会社 接着剤、電池用包装材用接着剤、積層体、電池用包装材、電池用容器及び電池
WO2024122083A1 (ja) * 2022-12-06 2024-06-13 Dic株式会社 湿気硬化型ポリウレタン樹脂組成物、接着剤、及び、積層体

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