JP2012065021A - Solid state imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid state imaging device capable of increasing a distance resolution and having a thinner shape.SOLUTION: A solid state imaging device includes a disk-shaped planar reflecting plate disposed on a first surface and having an aperture on its periphery part, and a plurality of reflecting plates disposed at a plurality of ring-shaped regions tilting along the direction of radius and having different diameters each other on a second surface opposed to the first surface. The solid state imaging device includes an image formation optical system for forming an image at a center part by reflecting light incident from a subject through the aperture between a plurality of reflecting plates and the planar reflecting plate. The solid state imaging device includes an imaging element module disposed at a center part on the second surface of the image formation optical system and including an imaging element that receives light from the image formation optical system to convert it into image data, a visible light transmission substrate placed between the image formation optical system and the imaging element, a micro lens array disposed on the imaging element side of the visible light transmission substrate and corresponding to a plurality of image blocks, and an image processing part that processes image data captured by the imaging element.

Description

  Embodiments described herein relate generally to a solid-state imaging device that simultaneously acquires a visible image and distance information.

  As an imaging technique capable of obtaining a depth direction distance as two-dimensional array information, various methods such as a technique using a reference light and a stereo distance measuring technique using a plurality of cameras are being studied. In particular, in recent years, there has been an increasing need for relatively inexpensive products as new input devices for consumer use.

  As a method for indirectly acquiring a distance image, an imaging device using a microlens is known. In this apparatus, an imaging optical system, an imaging element, and a microlens array having a plurality of microlenses are arranged between the imaging optical system and the imaging element. By the imaging optical system, a light beam group that forms an image near the surface of the microlens array from the same subject point through the lens aperture stop inner region is redistributed to the pixel region of the image sensor by the microlens. The distribution of the incident light is made by the difference in the incident angle to the microlens, and the difference in the incident angle to the microlens reflects the distance information. Therefore, an image focused on an arbitrary distance can be reconstructed by performing image processing on a pixel signal obtained by using each pixel for the distributed ray group.

  In addition, since an arbitrary viewpoint image within the aperture width of the imaging lens can be reconstructed, it is possible to calculate distance image information from a plurality of viewpoints based on the principle of triangulation. In general, when distance image information is calculated from a plurality of arbitrary viewpoints, the distance resolution is improved in proportion to the focal length of the imaging system and the separation distance between the viewpoints.

  In such an imaging apparatus, there is a problem that the optical system size and the distance resolution are traded off in both the vertical direction (focal length direction) and the horizontal direction (lens opening direction), which is an obstacle to miniaturization of the camera.

R. Ng, et al., Stanford Tech Report CTSR 2005-02, “Light Field Photography with a Hand-held Plenoptic Camera”

  The problem to be solved by the present invention is to provide a solid-state imaging device that can improve distance resolution and can be thinned.

  In the solid-state imaging device according to the present embodiment, a disk-shaped flat reflector having an opening on the outer periphery provided on the first surface and a second surface facing the first surface are each in the radial direction. And a plurality of reflectors provided in a plurality of annular regions formed so as to be inclined and have different diameters. In addition, imaging optics that reflects light from the subject incident through the aperture, reflects the light between the plurality of reflecting plates and the flat reflecting plate, propagates toward the center, and forms an image at the center. Has a system. Furthermore, an imaging region having a plurality of pixel blocks each including a plurality of pixels is provided. An imaging element that receives light from the imaging optical system and converts it into image data, a visible light transmitting substrate provided between the imaging optical system and the imaging element, and the visible light transmitting substrate A microlens array having a plurality of microlenses provided on the surface on the imaging element side and corresponding to the plurality of pixel blocks; an image processing unit for processing image data acquired by the imaging element; An imaging element module provided at the center of the second surface of the imaging optical system.

1 is a cross-sectional view illustrating a solid-state imaging device according to a first embodiment. Sectional drawing which shows the image pick-up element module of 1st Embodiment. 1 is a perspective view illustrating a solid-state imaging device according to a first embodiment. The figure explaining a folding | turning imaging optical system. The figure explaining a folding | turning imaging optical system. The figure explaining the image after passing micro lens in 1st Embodiment. The figure explaining the method of estimating a distance from a parallax image in 1st Embodiment. Sectional drawing which shows the solid-state imaging device of 2nd Embodiment. Sectional drawing which shows the image pick-up element module of 2nd Embodiment. The perspective view which shows the solid-state imaging device of 2nd Embodiment. The figure explaining the image after passing micro lens in 2nd Embodiment. Sectional drawing which shows the solid-state imaging device of 3rd Embodiment.

  In the solid-state imaging device according to the present embodiment, a disk-shaped flat reflector having an opening on the outer peripheral portion provided on the first surface and a second surface facing the first surface are each in the radial direction. A plurality of reflectors provided in a plurality of annular regions formed so as to be inclined and have different diameters, and light from a subject incident through the opening is provided with the plurality of reflectors. An imaging optical system that reflects between the flat reflector and propagates toward the central portion and forms an image at the central portion, and an imaging region having a plurality of pixel blocks each including a plurality of pixels, An imaging device that receives light from the imaging optical system and converts it into image data, a visible light transmission substrate provided between the imaging optical system and the imaging device, and the imaging of the visible light transmission substrate Corresponding to the plurality of pixel blocks provided on the element side surface Provided at the center of the second surface of the imaging optical system, including a microlens array having a plurality of microlenses arranged, and an image processing unit that processes image data acquired by the imaging device. And an image sensor module.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
A solid-state imaging device according to the first embodiment is shown in FIG. 1, and an imaging element module included in the solid-state imaging device is shown in FIG.

  The solid-state imaging device 1 according to the first embodiment includes a first imaging optical system 10 that forms an image of a subject on an imaging surface, and an imaging element module 20.

  The first imaging optical system 10 is configured by a reflective imaging lens based on a folded reflection optical structure. The light 100L and 100R emitted from the subject and incident from the left and right are reflected not by refraction of the light between the lens and the air but by the reflecting plate adjusted in inclination, and propagated through the visible light transmitting member from the same point. This is an optical system that collects the radiation rays 100L and 100R at a single point. The first imaging optical system 10 includes a disc-shaped visible light transmitting member 12 and a planar reflecting plate 14 provided on a first surface of the visible light transmitting member 12 on which light from a subject is incident. The visible light transmitting member 12 includes a plurality (three in the figure) of reflecting plates 16a, 16b, and 16c provided on the second surface facing the first surface.

  The flat reflector 12 is provided so as to cover a region other than the outer peripheral region 13 of the first surface of the visible light transmitting member 12, and light rays 100L and 100R are incident on the outer peripheral region 13 of the first surface. It is an opening in the shape of a ring. Each of the plurality of reflecting plates 16a, 16b, and 16c is provided on the second surface of the visible light transmitting member 12 in an annular region having a different diameter, and is inclined along the radial direction of the visible light transmitting member 12. Is provided. That is, the second surface of the visible light transmitting member 12 is formed with grooves in an annular region that is inclined along the radial direction of the visible light transmitting member 12 and has a different diameter. In these grooves, the reflecting plate 16a, The structure is formed by embedding 16b and 16c. These grooves are machined to have the same height on the same circumference with the designed inclination by lathe processing or etching process. Further, the imaging element module 20 is embedded in the central portion of the second surface of the visible light transmitting member 12. Note that the second surface of the visible light transmitting member 12 has a visible light absorbing member 17 in a region excluding the region where the reflectors 16a, 16b, and 16c are provided and the region where the imaging element module 20 is provided. Covered by. With such a configuration, the light 100L and 100R incident from the opening 13 provided on the first surface is reflected by the reflecting plates 16a, 16b, and 16c and the planar reflecting plate 12 to be a visible light transmitting member. 12, and enters the image sensor module 20.

  In the imaging element module 20, a plurality of pixels 24 having photodiodes are formed on a semiconductor substrate 22, and a driving / reading circuit (not shown) that drives these pixels 24 and reads signals from these pixels 24. ) Is formed. On the upper part of the pixel 24, when p and q are natural numbers, for example, a color filter 26 is formed for each pixel unit of p × q pixels or for each pixel block 24A. For example, the color filter 26 may have a Bayer arrangement of red, green, and blue. A pixel condensing microlens 28 may be formed for each pixel on the color filter 26.

  In the pixel block 24A composed of p × q pixels, the larger the p × q is, the more the number of viewpoints of the light beam is improved and the angular resolution is improved. However, the image sensor 21 has a × b pixels. If so, the total number of microlenses is (a × b) / (p × q), so the number of pixels of the reconstructed two-dimensional image (= (a × b) / (p × q)) ) And the two-dimensional image resolution is reduced. Therefore, the distance accuracy affected by the angular resolution and the resolution of the two-dimensional image may be appropriately designed according to each application.

  Further, a visible light transmitting substrate 34 that transmits visible light and on which a microlens array 32 having a plurality of microlenses 32 a is formed is provided above the color filter 26. A transmission layer 36 is formed on the surface of the visible light transmission substrate 34 opposite to the surface on which the microlens array 32 is formed, and a visible light reflection layer 38 is formed around the transmission layer 36. Light incident on the image sensor module 20 passes through the transmission layer 36, the visible light transmission plate 34, the microlens array 32, the microlens 28, and the color filter 26 and enters the pixel. The microlens array 32 is obtained by etching a transparent substrate such as a glass substrate, or by molding a transparent resin on the transparent substrate and processing the lens shape, or by applying a transparent photosensitive resin on the transparent substrate, A lens processed by photolithography and subsequent heat treatment can be used. For the visible light reflection layer 38, for example, a specular reflection film made of a metal material such as aluminum or silver having a high visible light reflectance can be used.

  The visible light transmitting substrate 34 is bonded to the semiconductor substrate 22 by a resin material spacer 9 provided around the imaging region where the pixels 24 are formed. Note that alignment when the semiconductor substrate 22 and the visible light transmitting substrate 34 are bonded is performed with reference to an alignment mark or the like. The visible light transmitting substrate 34 may be, for example, a material that cuts unnecessary infrared light, or a film that cuts infrared light may be formed.

  The semiconductor substrate 22 is provided with a read electrode pad 42 of the pixel 24, and a through electrode 44 penetrating the semiconductor substrate 22 is formed below the electrode pad 42. The semiconductor substrate 22 is electrically connected to the chip 50 through the through electrode 44 and the bump 46. The chip 50 is formed with an image processing circuit that drives the image sensor 21 and processes the read image data.

  A light shielding cover 60 for blocking unnecessary light is attached around the semiconductor substrate 22, the visible light transmitting substrate 34, and the chip 50. The light shielding cover 60 is provided with a module electrode 62 that electrically connects the chip 50 and the outside.

  In the present embodiment, the microlens array 32 is disposed at the focal length of the first imaging optical system 10. Further, the distance between the microlens 32a and the image sensor 21 is separated by the focal length of the microlens 32a.

  In the present embodiment configured as described above, the light incident from the outer periphery of the first imaging optical system 10 has a parallax in the pixels in the corresponding pixel block 24A by the microlens 32a. The incident light is separated as a group, and the pixel signal in the corresponding pixel block 24A is subjected to image processing in an image processing circuit, thereby obtaining distance image information and a visible image.

  Next, the first imaging optical system 10 will be described. First, the folding optical lens that is the imaging optical system 10 will be described. The folded optical lens 10 includes a circular reflecting plate 14 on a first surface of a visible light transmitting member 12 having a high visible light transmittance and a plurality of reflecting plates 16a, 16b, 16c formed on a second surface, Have As shown in FIG. 3, the light enters from the outer peripheral portion (opening) 13 where the planar reflection 14 is not formed. Refraction formed of general glass or the like by repeatedly reflecting between the flat reflector 14 provided on the first surface and the plurality of reflectors 16a, 16b, 16c provided on the second surface. The ray trajectory of the mold imaging lens group is reproduced. For example, as shown in FIG. 4, a two-group refractive lens of a convex lens 74 and a concave lens 75 is provided, and a light beam 73 is emitted from a subject point 72 located on the optical axis 71 and passes through the convex lens 74 to the concave lens 75. Consider an optical system 70 that forms an image at an image point 76 after being incident. In the case of this optical system 70, as shown in FIG. 5A, the light is allowed to pass through the opening 77 before the light beam enters the convex lens 74.

  As shown in FIG. 5B, refraction by the convex lens can be reproduced by the reflecting plate 16 inclined so that the thickness with the flat reflecting plate 14 increases toward the inside of the flat reflecting plate 14.

  Further, the refraction by the concave lens can be reproduced by the reflecting plate 16 inclined so that the thickness with the flat reflecting plate 14 becomes thinner toward the inside of the flat reflecting plate 14 as shown in FIG.

Further, the linear progression of the light beam can be reproduced by the reflection of the parallel plates 14 and 16. As shown in FIG. 5E, θ ₁ > θ _{3 at} the incident angle (θ ₁ ) of light incident from the outside of the annular opening and the incident angle (θ ₃ ) of light incident from the inner side. However, as shown in FIG. 5D, these angles are also maintained in the reflection of the parallel plate.

In this way, the light ray trajectory of the refractive imaging lens group can be reproduced by the planar reflecting plate 14 and the plurality of reflecting plates 16a, 16b, and 16c. As a result, a reflective optical system that is thin compared to the focal length can be configured as in the first imaging optical system 10 shown in FIG. 1. At this time, since the image is formed by reflection, there is a problem with the refraction type. The chromatic dispersion of the refractive index is as follows. When the refractive index of the lens base material is different from that of air, there is chromatic dispersion at the time of entering the lens base material and at the time of emission to the module, but chromatic aberration is generated compared to an optical system using refraction at a plurality of lens groups. There are few opportunities. Therefore, chromatic aberration can be suppressed. Here, the inclined reflecting plates 16a, 16b, and 16c are formed only on one surface (first surface) of the visible light transmitting member 12, but the reflecting plates may be provided on both surfaces. In the figure, the inclined reflecting plate is a flat plate, but in order to effectively correct chromatic aberration at the time of incidence on the lens base material, it may be inclined with a curvature.

  As the visible light transmitting member 12 serving as a base material of the folded lens, glass, synthetic quartz, calcium fluoride, or other optical plastics can be used. However, instead of the structure filled with the visible light transmitting member 12, a cavity is provided, and the first and second reflectors may propagate while reflecting between the cavities. For the reflectors 14, 16a, 16b, and 16c, a reflective film made of a metal material such as silver, aluminum, and stainless steel having a high visible light reflectance can be used.

  Next, the optical relationship between the first imaging optical system 10, the microlens array 32, and the image sensor will be described.

  Light from the same subject enters from the outer periphery, which is the annular opening 13 of the reflective imaging lens, and has a parallax in the pixel 24 in the corresponding pixel block 24A by each microlens 32a of the microlens array 32. Incident as a group. The distribution of the incident light beam to the pixels 24 is made by the difference in the incident angle to the microlens 32a, and the difference in the incident angle to the microlens 32a reflects the distance information. As shown in FIG. 6, the light intensity distribution formed in the pixel block 24A has a shape similar to an annular opening.

  Next, a method for estimating the distance from the parallax image will be described.

  Here, a method of obtaining distance image information and a visible image by performing image processing on a pixel signal in a certain pixel block 24A will be described.

  The light intensity distribution formed in the pixel block 24A by the distributed light beam group is acquired at each pixel. For example, as shown in FIG. 7, the light rays of the subject 80 that enter from both sides of the annular opening 82 are the light rays 86a and 86b from the first viewpoint and the second viewpoint, respectively. This is a light beam having a so-called parallax, in which the incident angle to 84 varies depending on the distance. As shown in FIG. 7, the light rays 86a and 86b of the first viewpoint and the second viewpoint are condensed at the same point by the imaging optical system 84, but after the condensing, the microlenses 32a of the microlens array 32 are collected. Are redistributed into the corresponding pixel block 24A to become the first viewpoint image 88a and the second viewpoint image 88b, and the rays from the first viewpoint and the second viewpoint can be separated, respectively.

  The light intensity pixel signal of each viewpoint image is extracted for each microlens (each pixel block), and after being connected, image processing is performed to reconstruct an image focused at an arbitrary distance. it can. In addition, since any viewpoint image within the aperture width of the imaging lens can be reconstructed, it is possible to calculate distance image information from a plurality of viewpoints by the principle of triangulation. In general, when distance image information is calculated from a plurality of arbitrary viewpoints, the distance resolution is improved in proportion to the focal length of the imaging system and the separation distance between the viewpoints.

  Next, the accuracy when estimating the distance from the parallax image will be described.

  In general, when distance image information is calculated from a plurality of arbitrary viewpoints, the distance resolution is improved in proportion to the focal length of the imaging system and the separation distance between the viewpoints.

ここで、ｆは結像レンズの焦点距離、Ｂはカメラ（視点）の離間距離、ｘ^ｌ、ｘ^ｒはそれぞれのカメラ（視点）において検出された同一の被写体の点の座標を示し、ｘ^ｌ−ｘ^ｒ は視差量を意味する。 In stereo matching between two cameras (the right viewpoint camera (r) and the left viewpoint camera (L)), the distance Z is obtained by the equation (1).

Here, f is the focal length of the imaging lens, B is the separation distance of the camera (viewpoint), x ^l and x ^r are the coordinates of the same subject point detected by each camera (viewpoint), and x ^l -x ^r denotes the amount of parallax.

ここで、Δｄは検出可能な最も小さい視差、例えば画素ごとにマッチング探索を行う場合は、１画素のサイズ、またサブピクセル探索を行い、１画素の１／４までマッチング精度があるとすると、Δｄ＝画素サイズ×１／４となる。焦点距離ｆが小さい程、精度は悪化し、また視点（カメラ）間距離が離れるほど精度は悪化する。例えば、マッチング精度が1画素単位としたとき、画素ピッチ１．４μｍにおいては、検出可能な最も小さい視差Δｄ＝１．４μｍとなり、このとき被写体までの距離Ｚ＝１ｍ、開口の離間距離がＢ＝５ｍｍ、ｆ＝５ｍｍとすると、位置推定精度ΔＺは５．６ｃｍ程度になる。 The distance resolution ΔZ is determined by the equation (2).

Here, Δd is the smallest parallax that can be detected. For example, when a matching search is performed for each pixel, if the size of one pixel or subpixel search is performed and the matching accuracy is up to 1/4 of one pixel, Δd = Pixel size x 1/4. As the focal length f is smaller, the accuracy deteriorates, and as the distance between the viewpoints (cameras) increases, the accuracy deteriorates. For example, when the matching accuracy is one pixel unit, the smallest detectable parallax Δd = 1.4 μm at a pixel pitch of 1.4 μm. At this time, the distance Z to the subject is 1 m, and the opening separation distance is B = If 5 mm and f = 5 mm, the position estimation accuracy ΔZ is about 5.6 cm.

  Next, an image processing method for estimating a distance from a parallax image will be described.

  As image matching processing for finding corresponding points from a plurality of parallax images and calculating the amount of parallax, for example, a well-known template matching method for examining the degree of similarity or difference between two images can be used (reference: digital image processing). , Supervised by the Digital Image Processing Editorial Board, published by the CG-ARTS Association). Further, when calculating the displacement position more precisely, by interpolating the similarity and similarity obtained for each pixel unit with a continuous fitting function or the like, by obtaining a subpixel position that gives the saddle point of the fitting function, The amount of deviation can be obtained with high accuracy. These methods are well known (literature: digital image processing, supervised by the Digital Image Processing Editing Committee, published by the CG-ARTS Association).

  As described above, according to this embodiment, the distance resolution can be improved and the thickness can be reduced.

  Further, according to the present embodiment, the image in the pixel block below the microlens obtained from the annular entrance aperture is also an annular shape, and a plurality of viewpoints separated by the aperture distance can be processed to obtain multiple images. Separation performance of parallax images is improved.

(Second Embodiment)
FIG. 8 shows a solid-state imaging device according to the second embodiment, and FIG. 9 shows an imaging element module included in the solid-state imaging device.

  The solid-state imaging device 1A according to the second embodiment has a configuration in which the imaging element module 20 is replaced with an imaging element module 20A shown in FIG. 9 in the solid-state imaging device 1 shown in FIG. The imaging element module 20 </ b> A has a configuration in which the visible light reflection layer 38 is replaced with a stray light absorption layer 37 in the imaging element module 20 illustrated in FIG. 2.

  As described above, in the solid-state imaging device 1A according to the second embodiment configured as described above, incident light incident on the imaging device 1A from the subject is only the plane reflection plate 14 and the reflection plates 16a, 16b, and 16c in the process of image formation. It is reflected and enters the image sensor module 20A. In this case, in order to prevent reflection of stray light other than a desired light beam, stray light incident on a portion other than the entrance window (region where the transmission layer 36 is formed) to the image sensor module 20A is absorbed by the stray light absorption layer 37. .

  The stray light absorbing layer 37 means a layer that has been subjected to non-reflective or low-reflective black treatment, and is formed of a paint or the like in which a black pigment or the like is dispersed in a dispersion medium having a similar refractive index. . In addition, it can form with the same material as the visible light absorption member 17 stray light absorption layer 37 demonstrated in 1st Embodiment.

  As in the first embodiment, the second embodiment can improve the distance resolution and can be thinned.

  Further, according to the present embodiment, the image in the pixel block below the microlens obtained from the annular entrance aperture is also an annular shape, and a plurality of viewpoints separated by the aperture distance can be processed to obtain multiple images. Separation performance of parallax images is improved.

(Third embodiment)
A solid-state imaging device according to the third embodiment will be described with reference to FIG. FIG. 10 is a perspective view of a solid-state imaging device 1B according to the third embodiment. The solid-state imaging device 1B according to the third embodiment is different from the solid-state imaging device shown in FIG. 1 or 3 only in the opening. In the third embodiment, unlike the first embodiment, the opening 13a provided on the first surface of the visible light transmitting member 12 is annular and not a single piece but a plurality of circular shapes. It has become. The plurality of openings 13a are provided in the circumferential direction. Then, subject light from each viewpoint direction enters from these openings 13a.

  Light from the same subject enters through a plurality of openings 13a on the outer periphery of the reflective imaging lens, and is separated into each region in the pixel block as a light ray group having parallax in the pixel in the corresponding pixel block by the microlens. Then enter. Distribution of incident light rays to pixels is made by a difference in incident angle to the microlens, and a difference in incident angle to the microlens reflects distance information. As shown in FIG. 11, the light intensity distribution formed in the pixel block is similar to the opening of the first imaging lens, and the same number of light spots as the numerical aperture are formed. For example, as shown in FIG. 10, when eight openings of the first imaging lens are formed on the circumference, the light spot below one micro lens 32a has eight light spots as shown in FIG. The light spot is arranged in a circumferential shape.

  Similar to the first embodiment, the third embodiment can improve the distance resolution and can be thinned.

(Fourth embodiment)
A solid-state imaging device according to the fourth embodiment is shown in FIG. The solid-state imaging device 1C according to the fourth embodiment is similar to the first embodiment shown in FIG. 1 except that the imaging element module 20 is not embedded in the visible light transmitting member 12, and the second imaging optical system 10 It is the structure joined to the surface.

  Thereby, it is not necessary to process the concave portion for embedding the imaging element module 20 in the visible light transmitting member 12, and the processing of the folded optical lens becomes easy.

  As in the first embodiment, the fourth embodiment can improve the distance resolution and can be thinned.

  Further, according to the present embodiment, the image in the pixel block below the microlens obtained from the annular entrance aperture is also an annular shape, and a plurality of viewpoints separated by the aperture distance can be processed to obtain multiple images. Separation performance of parallax images is improved.

  As described above, according to each embodiment, by using a reflective optical system for the imaging optical system, the optical system can be thinned even when an optical system having a long focal length is used to improve the distance resolution. enable. In addition, although the reflection type optical system tends to have a large lens aperture, an increase in the lens aperture length contributes to an improvement in distance resolution, so that the camera can be made thin and highly accurate at the same time. In addition, as a characteristic of the reflection type optical system, an image with little chromatic aberration is obtained, so that the search accuracy of corresponding points in the image processing of parallax images is improved, and the accuracy of distance resolution is improved.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the invention described in the claims and equivalents thereof as well as included in the scope and gist of the invention.

DESCRIPTION OF SYMBOLS 1 Solid-state imaging device 1A Solid-state imaging device 1B Solid-state imaging device 1C Solid-state imaging device 10 1st imaging optical system 12 Visible light transmission member 13 Aperture 14 Planar reflecting plate 16a, 16b, 16c Reflecting plate 17 Visible light absorption member 20 Imaging element Module 21 Image sensor 22 Semiconductor substrate 24 Pixel 24A Pixel block 26 Color filter 28 Micro lens 32 Micro lens array 32a Micro lens 34 Visible light transmitting substrate 36 Transmitting layer 37 Stray light absorbing layer 38 Reflecting layer 39 Spacer resin 42 Electrode pad 44 Through electrode 46 Bump 50 Chip 60 Light shielding cover 62 Module electrode

Claims (8)

A disc-shaped flat reflector provided on the first surface and having an opening in the outer peripheral portion and a second surface facing the first surface are inclined along the radial direction and have different diameters. A plurality of reflectors provided in a plurality of annular regions formed on the substrate, and reflects light from a subject incident through the opening between the plurality of reflectors and the planar reflector. An imaging optical system that propagates toward the central portion and forms an image at the central portion;
An imaging device having an imaging region having a plurality of pixel blocks each including a plurality of pixels, receiving light from the imaging optical system and converting it into image data, and between the imaging optical system and the imaging device A visible light transmitting substrate provided on the imaging element, a microlens array having a plurality of microlenses provided on a surface on the imaging element side of the visible light transmitting substrate and corresponding to the plurality of pixel blocks, and An image processing module for processing image data acquired by the image sensor, and an image sensor module provided at a central portion of the second surface of the imaging optical system,
A solid-state imaging device comprising:   2. The solid-state imaging according to claim 1, wherein the imaging optical system further includes a visible light transmitting member that is provided between the planar reflecting plate and the plurality of reflecting plates and that propagates the light. apparatus.   The solid-state imaging device according to claim 2, wherein the imaging element module is embedded in the visible light transmitting member.   The solid-state imaging device according to claim 2, wherein the imaging element module is provided on the second surface.   5. The solid-state imaging device according to claim 1, wherein the number of the openings is one, and the shape of the opening is an annular shape.   The solid-state imaging device according to claim 1, wherein a plurality of the openings are provided.   The imaging device module further includes a visible light reflecting layer provided in a region other than the region where the microlens array is provided on a surface of the visible light transmitting substrate opposite to the imaging device. The solid-state imaging device according to claim 1.   The imaging device module further includes a visible light absorbing layer provided in a region other than the region where the microlens array is provided on a surface of the visible light transmitting substrate opposite to the imaging device. The solid-state imaging device according to claim 1.

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