JP2012058210A - Contact probe and electronic circuit testing device employing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact probe which has a stable contact resistance during an electrical measurement and is capable of performing a normal measurement at all the time, and of which the service life is prolonged.SOLUTION: A contact probe has a conductive plunger and a conductive spring for axially energizing the plunger. The spring has a tight winding part and a coarse winding part of which the outer diameter is set smaller than that of the tight winding part. The plunger has a sliding part which is arranged at one or both ends of the spring and with which at least one of the plungers is inserted to the spring. The tight winding part of the spring is disposed in such a manner that the sliding part of the plunger is brought into contact therewith.

Description

  The present invention relates to a contact probe and an electronic circuit test apparatus using the contact probe, and more particularly to a contact probe used when inspecting electrical characteristics of a semiconductor device, a wafer or the like, and an electronic circuit test apparatus using the contact probe.

  An electronic circuit testing apparatus using a contact probe for bringing an electrode terminal into contact with an electronic device or a circuit board and temporarily bringing the electrode terminal into conduction with an external device is disclosed. For example, when inspecting a circuit board, the contact probe performs electrical measurement by elastically bringing a needle-like plunger into contact with an electrode terminal of the circuit board.

  FIG. 14 is a cross-sectional view showing an example of a conventional contact probe and an electronic circuit test apparatus using the same. As shown in FIG. 14, an electronic circuit test apparatus 50 using a contact probe includes a probe holder 2 and a relay substrate 6 stacked on the probe holder 2, and the contact probe 1 is placed in the probe holder 2. Is housed. The contact probe 1 includes a plunger 3 that is brought into contact with the pad 7a of the inspection object 7 and a spring 5 that biases the plunger 3 in the protruding direction. The spring 5 has a tightly wound portion 5 a and a coarsely wound portion 5 b, and is provided in a portion from the portion where the tightly wound portion 5 a of the spring 5 contacts the shaft portion 3 a of the plunger 3 to the relay substrate 6. Then, the tightly wound portion 5 a is brought into contact with the relay substrate 6, and the protruding portion 3 b of the plunger 3 is brought into contact with the pad 7 a of the device under test 7 to obtain electrical connection. (For example, refer to Patent Document 1).

  FIG. 15 is a cross-sectional view showing another example of a conventional contact probe and an electronic circuit test apparatus using the same. As shown in FIG. 15, an electronic circuit test apparatus 60 using a contact probe includes a probe holder 2 including a lower probe holder 2a and an upper probe holder 2b stacked on the lower probe holder 2a, and an upper probe holder. 2b and a relay substrate 6 stacked on top of 2b. A contact probe 10 is accommodated in the probe holder 2. The contact probe 10 includes a pair of plungers 3 and 4 and a spring 5 that urges the pair of plungers 3 and 4 in directions opposite to each other. The spring 5 has a tightly wound portion 5a and a coarsely wound portion 5b. The tightly wound portion 5a of the spring 5 is fixed to the shaft portion 4a of one plunger 4, and the shaft of the other plunger 3 is fixed. The portion 3a is configured to be slidably contacted, the tip portion 4b of one plunger 4 is brought into contact with the relay substrate 6, and the protruding portion 3b of the other plunger 3 is made to contact the pad 7a of the device under test 7. To make an electrical connection. (For example, refer to Patent Document 2).

Japanese Patent No. 3326095 (see page 2-3, FIG. 1) Japanese translation of PCT publication No. 2004-503783 (see page 5-6, FIG. 2)

However, in the conventional contact probe and the electronic circuit test apparatus using the same, the spring 5 is bent in the probe holder 2 at the time of measurement, so that the shaft portion 3a of the plunger 3 is connected to the tightly wound portion 5a of the spring 5. It is a structure which makes an electrical connection by making it contact an inner peripheral part. For this reason, when the coarsely wound portion 5b of the spring 5 is slid, the side surface of the roughly wound portion 5b of the spring 5 is rubbed against the inner surface of the probe holder 2 to cause wear damage, and the spring characteristics are deteriorated and durability is increased. There was a problem that the property became low.
In addition, the electrical contact state between the shaft portion 3a of the plunger 3 and the inner surface of the tightly wound portion 5a of the spring 5 may vary depending on the curved state of the spring 5, and the contact resistance value may become unstable.

(Object of invention)
The present invention solves the above-described problem, has a stable contact resistance in electrical measurement, can always perform normal measurement, and has a long-life contact probe and an electronic circuit test apparatus using the contact probe. The purpose is to provide.

  In order to achieve the above object, a contact probe according to the present invention includes a conductive plunger and a conductive spring that urges the plunger in the axial direction. The spring is a tightly wound portion and the tightly wound portion. A coarse winding portion set to a value smaller than the outer diameter of the spring, and the plunger is disposed at one or both ends of the spring, and at least one of the plungers is inserted into the spring. The contact winding portion of the spring is disposed so that the sliding portion of the plunger contacts.

  In addition, the plunger has a protruding portion that protrudes from the spring, a fitting portion that fits into the tightly wound portion, and a large-diameter portion that is provided at a boundary portion between the protruding portion and the fitting portion. It is characterized by.

  The sliding portion is provided at an end portion of the fitting portion of the plunger.

  Further, the sliding portion is bent so that a tip portion thereof is in contact with the spring.

  An electronic circuit test apparatus according to the present invention includes a plan having the above-described contact probe, a probe holder that accommodates the contact probe so that the protruding portion of the plunger is exposed, and a through hole that penetrates the protruding portion of the plunger. A jar stopper is provided.

  Further, the inner diameter of the through hole provided in the plunger stopper is set to a smaller value than the outer diameter of the large diameter portion of the plunger.

  The electronic circuit test apparatus according to the present invention includes a plurality of the contact probes, and the probe holder accommodates the contact probes so that the spring is exposed.

  As described above, the contact probe of the present invention and the electronic circuit test apparatus using the contact probe always ensure a stable contact resistance by bringing the sliding portion of the plunger into contact with the tightly wound portion of the spring. Normal electrical measurement can be performed.

  In addition, the diameter of the coarsely wound portion of the spring is made smaller than the diameter of the tightly wound portion, and the sliding portion of the plunger is passed through the spring, thereby suppressing the bending and buckling of the sbling during sliding. it can. As a result, friction between the inner surface of the probe holder and the coarsely wound portion of the spring can be reduced, so that the slidability of the spring is improved and damage due to wear of the spring is reduced and durability is improved. Therefore, the life of the contact probe can be extended.

It is a schematic sectional drawing which shows the contact probe in the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the spring in the 1st Embodiment of this invention. It is a schematic side view which shows the 1st plunger in the 1st Embodiment of this invention. It is a schematic side view which shows the 2nd plunger in the 1st Embodiment of this invention. It is a schematic side view which shows the other example of the 1st plunger in the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the electronic circuit testing apparatus using the contact probe in FIG. It is a schematic sectional drawing which shows the principal part of the electronic circuit testing apparatus using multiple contact probes in FIG. It is a schematic sectional drawing which shows the contact probe in the 2nd Embodiment of this invention. It is a schematic side view which shows the plunger in the 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the electronic circuit testing apparatus using the contact probe in FIG. It is a schematic sectional drawing which shows the contact probe in the 3rd Embodiment of this invention. It is a schematic side view which shows the plunger in the 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the electronic circuit testing apparatus using multiple contact probes in FIG. It is a schematic sectional drawing which shows the principal part of the contact probe and electronic circuit testing apparatus using the same in a prior art. It is a schematic sectional drawing which shows the principal part of the electronic circuit testing apparatus using the contact probe in a prior art.

  FIGS. 1 to 7 are views showing a first embodiment of the present invention, FIGS. 8 to 10 are views showing a second embodiment, and FIGS. 11 to 13 are views showing a third embodiment. Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic cross-sectional view showing a contact probe in the first embodiment. As shown in FIG. 1, the contact probe 20 according to the present embodiment has a conductive first plunger 12, a second plunger 13, and first and second plungers 12, 13 that are opposite to each other. And a conductive spring 11 that biases in the axial direction. A first plunger 12 is provided at one end of the spring 11, and a second plunger 13 is provided at the other end of the spring 11. Further, the second plunger 13 is provided with a sliding portion 13a inserted into the spring 11, and the close contact winding portion 11b is arranged on the spring 11 so that the sliding portion 13a is slidably contacted. ing.

  FIG. 2 is a schematic sectional view showing the spring 11 in this embodiment. As shown in FIG. 2, the spring 11 is a coil spring, and has a coarsely wound portion 11a and tightly wound portions 11b and 11c. Closely wound portions 11b and 11c are provided on both sides of the coarsely wound portion 11a. The outer diameter b of the tightly wound portions 11b and 11c is set to the same value, and the outer diameter a of the coarsely wound portion 11a is set to a smaller value than the outer diameter b of the tightly wound portions 11b and 11c. The spring 11 is made of a conductive material such as metal.

  FIG. 3 is a schematic side view showing the first plunger 12 in the present embodiment. The first plunger 12 protrudes from the spring 11 and a fitting portion 12 a that fits into the tightly wound portion 11 b of the spring 11. 12 d of protrusions, the large diameter part 12c provided in the boundary part of the protrusion part 12d, and the fitting part 12a, the boss | hub part 12b provided in the fitting part 12a, and the front-end | tip part 12e of the protrusion part 12d are provided. The tip end portion 12e of the projecting portion 12d is a portion that comes into contact with an electrode of a measurement object (not shown).

  The outer diameter of the fitting portion 12a is smaller than the inner diameter of the tightly wound portion 11b of the spring 11, and the outer diameter of the large diameter portion 12c is set to a value larger than the inner diameter of the tightly wound portion 11b of the spring 11. The outer diameter of the boss portion 12b is set to a value larger than the inner diameter of the tightly wound portion 11b of the spring 11 and smaller than the outer diameter of the large diameter portion 12c. The plunger 12 is made of a copper alloy that is conductively plated or a noble metal material.

  FIG. 4 is a schematic cross-sectional view showing the second plunger 13 in the present embodiment. As shown in FIG. 4, the blanker 13 has a fitting portion 13c that fits into the tightly wound portion 11b of the spring 11, a protruding portion 13e that protrudes from the spring 11, and a boundary portion between the protruding portion 13e and the fitting portion 13c. 13d, a boss 13b provided on the fitting part 13c, and a sliding part 13a provided on the end of the fitting part 13c (on the opposite side to the large diameter part 13d). The sliding portion 13a is inserted into the spring 11 and is slidably disposed with the tightly wound portion 11b.

  The outer diameter of the sliding portion 13a is smaller than the inner diameter of the coarsely wound portion 11a of the spring 11, the outer diameter of the fitting portion 13c is larger than the inner diameter of the coarsely wound portion 11a, and smaller than the inner diameter of the tightly wound portion 11c of the spring 11. Is set. The outer diameter of the boss 13b is set to a value larger than the inner diameter of the tightly wound portion 11c of the spring 11 and smaller than the outer diameter of the large-diameter portion 13d. Further, the sliding portion 13a is bent at the boundary with the fitting portion 13c so that the central axis n of the sliding portion 13a is inclined at a predetermined angle with respect to the central axis m of the fitting portion 13c. It arrange | positions so that the close_contact | adherence winding part 11b of 11 may be slidably contacted. In addition, the material of the plunger 13 is the same as that of the plunger 12, but is obtained by applying a conductive plating to a copper alloy or a noble metal material.

  FIG. 5 shows another example of the second plunger. As shown in FIG. 5, the sliding portion 23 a of the second blanker 23 is bent so that the central axis j becomes the central axis k at a predetermined position in the length direction, and the tightly wound portion 11 b of the spring 11. Is arranged so as to be slidable in contact with each other. The rest of the configuration is the same as that of the second plunger 13, and the description thereof will be omitted. In addition, although the example of inclining the center axis | shaft of a sliding part was demonstrated about the bending method of a sliding part, it should just be bent so that the contact | adherence winding part 11b of the spring 11 may be slidably contacted.

  As described above, in the contact probe 20 according to this embodiment, the fitting portion 12a of the first plunger 12 is fixed to the tightly wound portion 11b of the spring 11 as shown in FIG. The fitting portion 13 c is fixed to the tightly wound portion 11 c of the spring 11. Further, the sliding portion 13 a of the second plunger 13 is inserted into the coarsely wound portion 11 a of the spring 11 and is disposed so as to be slidably contacted with the tightly wound portion 11 b of the spring 11. In this manner, the sliding portion 13a of the blanker 13 is bent and always brought into contact with the tightly wound portion 11b of the spring 11. Thus, the electrical connection can be ensured and stable contact resistance can be ensured.

  FIG. 6 is a schematic cross-sectional view showing a main part of an electronic circuit testing apparatus using the contact probe 20 in the present embodiment. An electronic circuit test apparatus 100 shown in FIG. 5 includes a probe holder 15 that holds a contact probe 20, a plunger stopper 14, and a printed wiring board 16.

  The probe holder 15 is a member that is supported by housing the contact probe 20 so that the protruding portion 12d of the first plunger 12 is exposed. The plunger stopper 14 is fixed to one surface and the other surface is fixed to the other surface. The printed wiring board 16 is fixed. The plunger stopper 14 is provided with a through hole 14a, and the protruding portion 12d of the first plunger 12 passes through the through hole 14a. The inner diameter d of the through hole 14 a is set to a value smaller than the outer diameter of the large diameter portion 12 c of the first plunger 12. For this reason, the large diameter portion 12d of the first plunger 12 interferes with the plunger stopper 14, thereby preventing the first plunger 12 from falling off. Note that the protrusion 13 e of the second plunger 13 is brought into contact with the printed wiring board 16 and the contact probe 20 is held by the probe holder 15.

As described above, the electronic circuit mounting 100 of the present embodiment accommodates and uses the contact probe 20, thereby setting the diameter of the coarsely wound portion 11a of the spring 11 to a value smaller than the diameter of the tightly wound portion 11b. Since the sliding portion 13a of the plunger 13 of the second plunger 13 penetrates the rough winding portion 11a of the spring 11, the bending and buckling of the rough winding portion 11a is suppressed during operation, and the spring 11 is worn by friction with the probe holder 15. Damage can be reduced. Thereby, durability can be improved and the life of the contact probe 20 can be extended.
Further, at the time of measurement, it is possible to perform normal measurement by preventing the detachable first plunger 12 from falling off. Further, when the worn first plunger 12 is replaced, the first plunger 12 can be easily removed by removing the plunger stopper 14 from the probe holder 15.

  FIG. 7 is a schematic cross-sectional view showing another example of the electronic circuit measurement device according to the present embodiment. As shown in FIG. 7, in the electronic circuit measuring device 200, a plurality of contact probes 20 are arranged at a predetermined interval p and accommodated in the probe holder 17. The probe holder 17 accommodates the contact probe 20 so as to expose the spring 11 and has a structure that does not hold the spring 11. The other points are the same as those of the electronic circuit measuring apparatus 100.

  In the electronic circuit measuring device 200, the outer diameter of the coarsely wound portion 11a of the spring 11 of the contact probe 20 is set to a value smaller than the outer diameter of the tightly wound portions 11b and 11c, and the sliding of the second plunger 13 is performed. Since the moving portion 13a passes through the coarsely wound portion 11a of the spring 11, the bending and buckling of the coarsely wound portion 11a can be suppressed during measurement. Thereby, even if the probe holder 17 does not hold the spring 11, it is possible to prevent the occurrence of a short circuit that occurs when the adjacent contact probes 20 come into contact with each other. In addition, since the value of the thickness c of the probe holder 17 can be reduced, the member cost of the electronic circuit measuring device 200 can be reduced. In the electronic circuit measurement device 200, a stable contact resistance can be ensured similarly to the electronic circuit measurement device 100.

(Second Embodiment)
The contact probe and the electronic circuit test apparatus in the second embodiment are different from the first embodiment in that there is one plunger, and the others are substantially the same as those in the first embodiment. Therefore, the same components are assigned the same numbers, and detailed description thereof is omitted.

  FIG. 8 is a schematic cross-sectional view showing a contact probe in the second embodiment. As shown in FIG. 8, the contact probe 30 according to the present embodiment includes a plunger 22 having conductivity and a conductive spring 11 that biases the plunger 22 in the axial direction. The spring 11 includes a coarsely wound portion 11a and tightly wound portions 11b and 11c on both sides thereof, and the description thereof is omitted because it is similar to the first embodiment. The plunger 22 is fixed to the tightly wound portion 11b of the spring 11, and a sliding portion 22a provided on the plunger 22 is disposed so as to be slidably in contact with the tightly wound portion 11c.

  FIG. 9 is a schematic side view showing the plunger 22 in the present embodiment. As shown in FIG. 9, the plunger 22 has a fitting portion 22c that fits into the tightly wound portion 11b of the spring 11, a protruding portion 22e that protrudes from the spring 11, and a boundary between the protruding portion 22e and the fitting portion 22c. The large diameter portion 22d provided in the portion and the sliding protruding from one end of the fitting portion 22c (opposite the end contacting the large diameter portion 22d) and slidably disposed on the tightly wound portion 11c of the spring 11 Part 22a. Further, the fitting portion 22c is provided with a boss portion 22b, and the protruding portion 22e is provided with a tip portion 22f. Note that the tip 22f of the protrusion 22e is a portion that contacts an electrode of an object not shown.

  The outer diameter of the sliding portion 22a is smaller than the inner diameter of the coarsely wound portion 11a of the spring 11, the outer diameter of the fitting portion 22c is smaller than the inner diameter of the tightly wound portion 11b of the spring 11, and the outer diameter of the larger diameter portion 22d is the spring 11. Is set to a value larger than the inner diameter of the tightly wound portion 11b. The outer diameter of the boss portion 22b is set to a value larger than the inner diameter of the tightly wound portion 11b of the spring 11 and smaller than the large diameter portion 22d.

  Further, the sliding portion 22a is bent at the boundary with the fitting portion 22c so that the central axis n of the sliding portion 22a is inclined at a predetermined angle with respect to the central axis m of the fitting portion 22c. It arrange | positions so that the close_contact | adherence winding part 11c of 11 may be slidably contacted. The plunger 22 is made of a copper alloy that is conductively plated or a noble metal material.

  As described above, the contact probe 30 according to the present embodiment ensures the electrical connection by bending the sliding portion 22a of the blanker 22 and always contacting the tightly wound portion 11c of the spring 11 and stable contact resistance. Can be secured.

  FIG. 10 is a schematic cross-sectional view showing a main part of an electronic circuit test apparatus using the contact probe 30 in the present embodiment. An electronic circuit test apparatus 300 shown in FIG. 10 includes a probe holder 15 that holds a contact probe 30, a plunger stopper 14, and a printed wiring board 16.

  The probe holder 15 is a member that is supported by accommodating the contact probe 30 so that the protruding portion 22e of the plunger 22 is exposed. The plunger stopper 14 is fixed to one surface, and the printed wiring board is disposed to the other surface. 16 is fixed. The plunger stopper 14 is provided with a through hole 14a, and the protruding portion 22e of the plunger 22 passes through the through hole 14a. The inner diameter d of the through hole 14 a is set to a value smaller than the outer diameter of the large diameter portion 22 d of the plunger 22. For this reason, the large diameter portion 22d of the plunger 22 interferes with the plunger stopper 14, thereby preventing the plunger 22 from falling off. Note that the end 11 d of the tightly wound portion 11 c of the spring 11 is brought into contact with the printed wiring board 16, and the contact probe 30 is held by the probe holder 15.

  As described above, the electronic circuit mounting 300 according to the present embodiment accommodates and uses the contact probe 30, thereby setting the diameter of the coarsely wound portion 11a of the spring 11 to a value smaller than the diameter of the tightly wound portion 11b. Since the sliding portion 22a of the jar 22 penetrates the rough winding portion 11a of the spring 11, curving and buckling of the rough winding portion 11a is suppressed during measurement, and wear damage of the spring 11 due to friction with the probe holder 15 is reduced. can do. Thereby, durability can be improved and the life of the contact probe 30 can be extended. Further, at the time of measurement, it is possible to perform normal measurement by preventing the detachable plunger 22 from falling off, and when replacing the worn plunger 22, the plunger stopper 14 is removed from the probe holder 15. The plunger 22 can be easily extracted by removing it.

(Third embodiment)
The contact probe and the electronic circuit test apparatus according to the third embodiment are different from those of the second embodiment in the shape of the sliding portion of the plunger and the shape of the tip of the tightly wound portion of the spring. Is almost the same. Therefore, the same components are assigned the same numbers, and detailed description thereof is omitted.

  FIG. 11 is a schematic cross-sectional view showing a contact probe in the third embodiment. As shown in FIG. 11, the contact probe 40 according to the present embodiment includes a plunger 32 having conductivity and a conductive spring 21 that urges the plunger 32 in the axial direction. The spring 21 includes a coarsely wound portion 11a and tightly wound portions 11b and 21c on both sides thereof. The tightly wound portion 21c is formed so that the outer diameter decreases toward the tip end portion 21d. The rest is the same as in the first embodiment, and a description thereof will be omitted. A plunger 32 is fixed to the tightly wound portion 11b of the spring 11, and a sliding portion 32a provided on the plunger 32 is arranged so as to be slidably in contact with the tightly wound portion 11c.

  FIG. 12 is a schematic side view showing the plunger 32 in the present embodiment. As shown in FIG. 12, the sliding portion 32a of the plunger 32 is bent so that the central axis j is the central axis k at a predetermined position in the length direction, and slides with the tightly wound portion 21c of the spring 21. It is arranged to make contact possible. The rest is the same as the plunger 22 of the second embodiment, and a description thereof will be omitted. In addition, although the example of inclining the center axis | shaft of a sliding part was demonstrated about the bending method of a sliding part, it should just be bent so that the contact | adherence winding part 11c of the spring 11 may be slidably contacted.

  FIG. 13 is a schematic cross-sectional view showing a main part of an electronic circuit test apparatus using the contact probe 40 in the present embodiment. As shown in FIG. 13, in the electronic circuit measuring device 400, a plurality of contact probes 40 are arranged at a predetermined interval p and accommodated in the probe holder 17. The probe holder 17 holds the contact winding part 21c of the spring 21, and accommodates the contact probe 40 so as to expose the rough winding part 11a and the contact winding part 11b. Other points are the first embodiment. Since it is almost the same as the electronic circuit measuring apparatus 200 in FIG.

  In the electronic circuit measuring device 400, the outer diameter of the coarsely wound portion 11a of the spring 21 of the contact probe 40 is set to a value smaller than the outer diameter of the tightly wound portions 11b and 21c, and the sliding portion 32a of the plunger 32 is set. However, since the coarsely wound portion 11a of the spring 21 is inserted, it is possible to suppress the bending and buckling of the coarsely wound portion 11a during measurement. Thereby, even if the probe holder 17 does not hold the coarsely wound portion 11a and the tightly wound portion 11b of the spring 21, it is possible to prevent occurrence of a short circuit caused by contact between adjacent contact probes 40. In addition, since the value of the thickness c of the probe holder 17 can be reduced, the member cost of the electronic circuit measurement device 400 can be reduced. In the electronic circuit measurement device 400, a stable contact resistance can be ensured similarly to the electronic circuit measurement device 300. Further, since the outer diameter of the tip 21d of the tightly wound portion 21c of the spring 21 is formed smaller than the outer diameter of the tightly wound portion 21, the electrical connection with the wiring board 16 can be ensured.

  The electronic circuit measurement apparatus using one contact probe 40 is different from the electronic circuit measurement apparatus 300 in the second embodiment in the contact probe used, and the other parts are substantially the same, and thus the description thereof is omitted.

  Moreover, in each embodiment, although demonstrated in the example which provided the close_contact | adherence winding part on both sides of the rough winding part of a spring, it is not limited to this, A sliding of a plunger on one side of a rough winding part A tightly wound portion that is in contact with the portion may be provided, and the other side may be a coarsely wound portion.

11, 21 Spring 11a Coarse winding part 11b, 11c, 21c Close contact winding part 12 First plunger 12a Fitting part 12b Boss part
12c Large diameter part 12d Protruding part
12e Tip portion 13, 23 Second plunger 13a, 23a Sliding portion 13b Boss portion
13c Fitting part 13d Large diameter part 13e Protrusion part 14 Plunger stopper 14a Through hole 15, 17 Probe holder
16 Printed wiring board 17 Probe holder 20, 30, 40 Contact probe 22, 32 Plunger 22a, 32a Sliding part 22b Boss part
22c fitting part 22d large diameter part 12e protrusion part
12f Tip portion 100, 200, 300, 400 Electronic circuit test apparatus

Claims (7)

  A conductive plunger and a conductive spring that urges the plunger in the axial direction are provided, and the spring is set to a smaller value than the tightly wound portion and the outer diameter of the tightly wound portion. The plunger is disposed at one end or both ends of the spring, and has at least one sliding portion through which the plunger is inserted into the spring. The contact probe is arranged so that the sliding portion of the plunger contacts.   The plunger includes a protruding portion protruding from the spring, a fitting portion fitted to the tightly wound portion, and a large-diameter portion provided at a boundary portion between the protruding portion and the fitting portion. The contact probe according to claim 1.   The contact probe according to claim 1, wherein the sliding portion is provided at an end portion of the fitting portion of the plunger.   The contact probe according to any one of claims 1 to 3, wherein the sliding portion is bent so that a tip portion thereof is in contact with the spring.   5. The contact probe according to claim 1, a probe holder that accommodates the contact probe so that the protruding portion of the plunger is exposed, and a penetration that penetrates the protruding portion of the plunger. An electronic circuit testing apparatus comprising a plunger stopper having a hole.   The electronic circuit test according to claim 5, wherein an inner diameter of the through hole provided in the plunger stopper is set to a smaller value than an outer diameter of a large diameter portion of the plunger. apparatus. The contact probe according to any one of claims 1 to 4, comprising a plurality of contact probes, wherein the probe holder accommodates the contact probes so that the spring is exposed. Electronic circuit test equipment.