JP2012053067A - Spectroscopic module - Google Patents

Spectroscopic module Download PDF

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JP2012053067A
JP2012053067A JP2011251704A JP2011251704A JP2012053067A JP 2012053067 A JP2012053067 A JP 2012053067A JP 2011251704 A JP2011251704 A JP 2011251704A JP 2011251704 A JP2011251704 A JP 2011251704A JP 2012053067 A JP2012053067 A JP 2012053067A
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light
spectroscopic
predetermined surface
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main body
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JP5097294B2 (en
JP2012053067A5 (en
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Katsumi Shibayama
勝己 柴山
Takafumi Yoshino
隆文 能野
Tomohito Suzuki
智史 鈴木
Teichman Helmut
テイチマン ヘルムート
Hilal Dietmar
ヒラル ディエトマル
Starkel Ulrich
スタルケル ウルリッチ
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Hamamatsu Photonics KK
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Abstract

PROBLEM TO BE SOLVED: To provide a spectroscopic module with high reliability.SOLUTION: A spectroscopic module includes a body part 2 for transmitting light, a spectroscopic part 3 for dispersing the light L1 entering the body part 2 from the front face 2a of the body part 2 and reflecting it to the side of the front face 2a, a photodetection element 4 supported on the front face 2a for detecting the light L2 dispersed and reflected by the spectroscopic part 3, a wiring 9 formed on the front face 2a having a plurality of pad parts 9a to which an external terminal of the photodetection element 4 is electrically connected, a plurality of pads 9b for taking out an output signal of the photodetection element 4 to the outside and a plurality of connecting parts 9c for connecting each corresponding pair of the pad parts 9a and the pad parts 9b, and a light absorption layer 6 formed on the front face 2a in such a manner as to cover the connecting part 9c and expose the pad parts 9a and the pad parts 9b, having a light passing hole 6a through which the light L1 travels to the spectroscopic part 3 and a light passing hole 6b through which the light L2 travels to the photodetection element 4.

Description

本発明は、光を分光して検出する分光モジュールに関する。   The present invention relates to a spectroscopic module that spectrally detects light.

従来の分光モジュールとして、例えば特許文献１には、光を透過させる支持体と、支持体に光を入射させる入射スリット部と、支持体に入射した光を分光して反射する凹面回折格子と、凹面回折格子によって分光されて反射された光を検出するダイオードと、を備えるものが開示されている。   As a conventional spectroscopic module, for example, Patent Document 1 discloses a support that transmits light, an incident slit portion that allows light to enter the support, a concave diffraction grating that spectrally reflects and reflects light incident on the support, And a diode that detects light reflected and reflected by a concave diffraction grating.

特許第３１１９９１７号公報Japanese Patent No. 319917

しかしながら、上述したような分光モジュールにあっては、入射スリット部及びダイオードが支持体に取り付けられるに際し、入射スリット部とダイオードとの相対的な位置関係にずれが生じ、分光モジュールの信頼性が低下するおそれがある。   However, in the spectral module as described above, when the incident slit portion and the diode are attached to the support, the relative positional relationship between the incident slit portion and the diode is shifted, and the reliability of the spectral module is reduced. There is a risk.

そこで、本発明は、このような事情に鑑みてなされたものであり、信頼性の高い分光モジュールを提供することを目的とする。   Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide a highly reliable spectral module.

上記目的を達成するために、本発明に係る分光モジュールは、光を透過させる本体部と、本体部の所定の面から本体部に入射した光を分光して所定の面側に反射する分光部と、所定の面上に支持され、分光部によって分光されて反射された光を検出する光検出素子と、所定の面に形成され、光検出素子の外部端子が電気的に接続された複数の第１のパッド部、光検出素子の出力信号を外部に取り出すための複数の第２のパッド部、及び対応する第１のパッド部と第２のパッド部とを接続する複数の接続部を有する配線と、接続部を覆い且つ第１及び第２のパッド部を露出させるように所定の面に形成され、分光部に進行する光が通過する第１の光通過孔、及び光検出素子に進行する光が通過する第２の光通過孔を有する第１の光吸収層と、を備える。   To achieve the above object, a spectroscopic module according to the present invention includes a main body that transmits light, and a spectroscopic unit that splits light incident on the main body from a predetermined surface of the main body and reflects the light to a predetermined surface. And a plurality of light detection elements that are supported on a predetermined surface and detect light that is split and reflected by the spectroscopic unit, and are formed on the predetermined surface and electrically connected to external terminals of the light detection elements A first pad portion, a plurality of second pad portions for taking out an output signal of the light detection element to the outside, and a plurality of connection portions for connecting the corresponding first pad portion and the second pad portion. A first light passage hole that is formed on a predetermined surface so as to cover the wiring, the connection portion, and expose the first and second pad portions, and the light that travels to the spectroscopic portion, and the light detection element. A first light absorption layer having a second light passage hole through which light passing through Obtain.

また、第１の光吸収層と配線との間には、電気絶縁層が形成されていてもよい。   Further, an electrical insulating layer may be formed between the first light absorption layer and the wiring.

また、配線は、所定の面側に光反射防止層を有していてもよい。   Moreover, the wiring may have a light reflection preventing layer on a predetermined surface side.

また、本体部は、所定の面と略直交する方向に積層された複数の光透過部材を有していてもよい。   The main body may have a plurality of light transmitting members stacked in a direction substantially orthogonal to a predetermined surface.

また、光透過部材のうち、所定の面を有する第１の光透過部材は、板状に形成されていてもよい。   Moreover, the 1st light transmissive member which has a predetermined surface among the light transmissive members may be formed in plate shape.

また、所定の面と略直交する方向において隣り合う光透過部材間には、分光部に進行する光が通過する第３の光通過孔、及び光検出素子に進行する光が通過する第４の光通過孔を有する第２の光吸収層が形成されていてもよい。   In addition, a third light passage hole through which light traveling to the spectroscopic section passes and a fourth light through which light traveling to the light detection element pass between adjacent light transmitting members in a direction substantially orthogonal to the predetermined surface. A second light absorption layer having a light passage hole may be formed.

また、光透過部材のうち、分光部が設けられた第２の光透過部材は、曲面部分を有し、分光部は、曲面部分の外側表面に形成された回折層、及び回折層の外側表面に形成された反射層を有していてもよい。   Of the light transmitting members, the second light transmitting member provided with the spectroscopic portion has a curved portion, the spectroscopic portion is formed on the outer surface of the curved portion, and the outer surface of the diffraction layer. You may have the reflection layer formed in.

本発明によれば、信頼性を向上させることが可能となる。   According to the present invention, reliability can be improved.

第１の実施形態の分光モジュールの平面図である。It is a top view of the spectroscopy module of a 1st embodiment. 図１に示されたII−II線に沿っての断面図である。It is sectional drawing along the II-II line | wire shown by FIG. 第２の実施形態の分光モジュールの縦断面図である。It is a longitudinal cross-sectional view of the spectroscopy module of 2nd Embodiment. 他の実施形態の分光モジュールの縦断面図である。It is a longitudinal cross-sectional view of the spectroscopy module of other embodiment. 他の実施形態の分光モジュールの縦断面図である。It is a longitudinal cross-sectional view of the spectroscopy module of other embodiment. 他の実施形態の分光モジュールの分光部周辺の縦断面図である。It is a longitudinal cross-sectional view around the spectroscopic part of the spectroscopic module of another embodiment.

以下、本発明の好適な実施形態について、図面を参照して詳細に説明する。なお、各図において同一又は相当部分には同一符号を付し、重複する説明を省略する。
［第１の実施形態］ DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.
[First Embodiment]

図１及び２に示されるように、分光モジュール１は、光を透過させる本体部２と、本体部２の前面（所定の面）２ａから本体部２に入射した光Ｌ１を分光して前面２ａ側に反射する分光部３と、前面２ａ上に支持され、分光部３によって分光されて反射された光Ｌ２を検出する光検出素子４と、を備えている。分光モジュール１は、光Ｌ１を分光部３で複数の光Ｌ２に分光し、その光Ｌ２を光検出素子４で検出することにより、光Ｌ１の波長分布や特定波長成分の強度等を測定するものである。   As shown in FIGS. 1 and 2, the spectroscopic module 1 includes a main body 2 that transmits light, and light L1 incident on the main body 2 from the front surface (predetermined surface) 2a of the main body 2 to split the front surface 2a. And a photodetecting element 4 that is supported on the front surface 2a and detects the light L2 that is split and reflected by the spectroscopic unit 3. The spectroscopic module 1 measures the wavelength distribution of the light L1, the intensity of a specific wavelength component, etc. by splitting the light L1 into a plurality of light L2 by the spectroscopic unit 3 and detecting the light L2 by the light detecting element 4. It is.

本体部２は、前面２ａと略直交する方向に積層された光透過部材（第１の光透過部材）２１、光透過部材２２及び光透過部材（第２の光透過部材）２３を有している。光透過部材２１，２２は、ＢＫ７、パイレックス（登録商標）、石英等の光透過性ガラス等によって長方形薄板状に形成されている。光透過部材２３は、光透過部材２１，２２と同一の材料、光透過性樹脂、光透過性の無機・有機ハイブリッド材料、或いはレプリカ成型用の光透過性低融点ガラス等によって半球状に形成されており、例えば、光透過部材２１，２２と同一の材料からなる場合には、光学樹脂やダイレクトボンディングによって光透過部材２２に貼り合わされている。光透過部材２３は、分光部３によって分光されて反射された光Ｌ２を光検出素子４の光検出部４ａに結像するレンズとして機能する。 Body 2, the front surface 2a and the light transmitting member which is laminated in a direction substantially perpendicular (first light transmitting member) 2 1, the light transmitting member 2 2 and the light transmitting member (second light transmitting member) 2 3 Have. The light transmitting members 2 1 and 2 2 are formed in a rectangular thin plate shape using BK7, Pyrex (registered trademark), light transmitting glass such as quartz, or the like. Light transmitting member 2 3, the light transmitting member 2 1, 2 2 of the same material, transparent resin, light-transmissive inorganic-organic hybrid materials, or hemispherical shape by light-transmissive low-melting glass for replica molding It is formed on, for example, if made of a light transmitting member 2 1, 2 2 of the same material are bonded to the light transmitting member 2 2 by an optical resin or direct bonding. Light transmitting member 2 3 functions as a lens for focusing the light L2 that is dispersed and reflected by the spectroscopic portion 3 on the light detecting portion 4a of the light detecting element 4.

分光部３は、光透過部材２３の外側表面に形成された回折層１４、及び回折層１４の外側表面に形成された反射層５を有する反射型グレーティングである。回折層１４は、鋸歯状断面のブレーズドグレーティング、矩形状断面のバイナリグレーティング、正弦波状断面のホログラフィックグレーティング等であって、例えば、光透過部材２３の外側表面に感光性樹脂を塗布し、石英等からなる光透過性モールド（グレーティングの鋳型）を用いて感光性樹脂をＵＶ硬化させることで形成される。回折層１４は、ＵＶ硬化後に加熱キュアすると、より一層安定した素材となる。反射層５は、膜状であって、例えば、回折層１４の外側表面にＡｌやＡｕ等を蒸着することで形成される。なお、回折層１４の材料は、感光性樹脂に限定されず、感光性ガラス、感光性の無機・有機ハイブリッド材料、或いは熱で変形するような樹脂、ガラス若しくは無機・有機ハイブリッド材料等であってもよい。 Spectroscopic portion 3, the light transmitting member 2 3 outer surface which is formed in the diffraction layer 14, and a reflection type grating having a reflection layer 5 formed on the outer surface of the diffracting layer 14. Diffracting layer 14 is blazed gratings serrated cross section, a binary grating rectangular cross section, a holographic grating or the like of the sinusoidal cross-section, for example, a photosensitive resin is applied to the outer surface of the light transmitting member 2 3, It is formed by UV-curing a photosensitive resin using a light-transmitting mold (grating mold) made of quartz or the like. The diffraction layer 14 becomes a more stable material when heated and cured after UV curing. The reflective layer 5 is in the form of a film, and is formed, for example, by evaporating Al, Au, or the like on the outer surface of the diffraction layer 14. The material of the diffractive layer 14 is not limited to a photosensitive resin, and may be a photosensitive glass, a photosensitive inorganic / organic hybrid material, or a resin, glass or inorganic / organic hybrid material that is deformed by heat. Also good.

光検出素子４は、長尺状のフォトダイオードがその長手方向と略直交する方向に一次元配列されてなる光検出部４ａを有するフォトダイオードアレイである。光検出素子４は、フォトダイオードの一次元配列方向が光透過部材２１，２２の長手方向と略一致し且つ光検出部４ａが本体部２の前面２ａ側を向くように配置されている。なお、光検出素子４は、フォトダイオードアレイに限定されず、Ｃ−ＭＯＳイメージセンサやＣＣＤイメージセンサ等であってもよい。 The light detection element 4 is a photodiode array having a light detection unit 4a in which long photodiodes are arranged one-dimensionally in a direction substantially orthogonal to the longitudinal direction. The light detection element 4 is arranged such that the one-dimensional arrangement direction of the photodiodes substantially coincides with the longitudinal direction of the light transmitting members 2 1 and 2 2 and the light detection portion 4a faces the front surface 2a side of the main body portion 2. . The light detection element 4 is not limited to a photodiode array, and may be a C-MOS image sensor, a CCD image sensor, or the like.

本体部２の前面２ａ（すなわち、光透過部材２１の前面）には、分光部３に進行する光Ｌ１が通過する光通過孔（第１の光通過孔）６ａ、及び光検出素子４の光検出部４ａに進行する光Ｌ２が通過する光通過孔（第２の光通過孔）６ｂを有する光吸収層（第１の光吸収層）６が形成されている。光通過孔６ａは、光透過部材２１，２２の長手方向と略直交する方向に延在するスリットである。光吸収層６は、光通過孔６ａ，６ｂを有するようにパターニングされて、ＣｒＯ、ＣｒＯを含む積層膜、或いはブラックレジスト等によって一体成形される。 The front plane 2a of the body portion 2 (i.e., the front surface of the light transmitting member 2 1), the light transmitting hole (the first light passage hole) of the light L1 proceeding to the spectroscopic portion 3 passes 6a, and the light detecting element 4 A light absorption layer (first light absorption layer) 6 having a light passage hole (second light passage hole) 6b through which the light L2 traveling to the light detection unit 4a passes is formed. The light passage hole 6a is a slit extending in a direction substantially orthogonal to the longitudinal direction of the light transmitting members 2 1 and 2 2 . The light absorption layer 6 is patterned so as to have light passage holes 6a and 6b, and is integrally formed with a laminated film containing CrO, CrO, a black resist, or the like.

本体部２の前面２ａと略直交する方向において隣り合う光透過部材２１，２２間には、分光部３に進行する光Ｌ１が通過する光通過孔（第３の光通過孔）７ａ、及び光検出素子４の光検出部４ａに進行する光Ｌ２が通過する光通過孔（第４の光通過孔）７ｂを有する光吸収層（第２の光吸収層）７が形成されている。光吸収層７は、光透過部材２１の後面に形成されており、光吸収層７が形成された光透過部材２１と光透過部材２２とは、界面で反射を起こさないように屈折率を合わせた光学樹脂８によって貼り合わされている。光吸収層７は、光通過孔７ａ，７ｂを有するようにパターニングされて、ＣｒＯ、ＣｒＯを含む積層膜、或いはブラックレジスト等によって一体成形される。 Between the light transmitting members 2 1 and 2 2 adjacent to each other in the direction substantially orthogonal to the front surface 2a of the main body 2, a light passage hole (third light passage hole) 7a through which the light L1 traveling to the spectroscopic unit 3 passes, And the light absorption layer (2nd light absorption layer) 7 which has the light passage hole (4th light passage hole) 7b through which the light L2 which advances to the light detection part 4a of the photon detection element 4 passes is formed. Light absorbing layer 7 is formed on the rear surface of the light transmitting member 2 1, and the light transmitting member 2 1 and the light transmitting member 2 2 where the light-absorbing layer 7 is formed, the refractive so as not to cause reflection at the interface The optical resin 8 is bonded together at the same rate. The light absorption layer 7 is patterned so as to have the light passage holes 7a and 7b, and is integrally formed with a laminated film containing CrO, CrO, or a black resist.

光吸収層６の前面は粗面とされており、その前面には、ＡｌやＡｕ等の単層膜、或いはＴｉ−Ｐｔ−Ａｕ、Ｔｉ−Ｎｉ−Ａｕ、Ｃｒ−Ａｕ等の積層膜からなる配線９が形成されている。配線９は、光通過孔６ｂの周囲に配置された複数のパッド部（第１のパッド部）９ａ、光透過部材２１，２２の長手方向における端部に配置された複数のパッド部（第２のパッド部）９ｂ、対応するパッド部９ａとパッド部９ｂとを接続する複数の接続部９ｃを有している。パッド部９ａには、光検出素子４の外部端子がフリップチップボンディングによって電気的に接続されており、パッド部９ｂには、光検出素子４の出力信号を外部に取り出すためのフレキシブルプリント基板１１がワイヤボンディングによって電気的に接続されている。光検出素子４は、光検出部４ａが光吸収層６の光通過孔６ｂと対向した状態で本体部２の前面２ａ上に支持されており、光検出部４ａと前面２ａとの間には、アンダーフィル樹脂として界面で反射を起こさないように屈折率を合わせた光学樹脂１２が充填されている。 The front surface of the light absorption layer 6 is a rough surface, and the front surface is made of a single layer film such as Al or Au, or a laminated film such as Ti—Pt—Au, Ti—Ni—Au, or Cr—Au. A wiring 9 is formed. The wiring 9 includes a plurality of pad portions (first pad portions) 9a disposed around the light passage hole 6b, and a plurality of pad portions disposed at end portions in the longitudinal direction of the light transmitting members 2 1 and 2 2 ( (Second pad portion) 9b and a plurality of connecting portions 9c for connecting the corresponding pad portion 9a and the pad portion 9b. An external terminal of the light detection element 4 is electrically connected to the pad portion 9a by flip chip bonding, and a flexible printed board 11 for taking out an output signal of the light detection element 4 to the outside is provided on the pad portion 9b. They are electrically connected by wire bonding. The light detection element 4 is supported on the front surface 2a of the main body 2 with the light detection portion 4a facing the light passage hole 6b of the light absorption layer 6, and between the light detection portion 4a and the front surface 2a. The underfill resin is filled with an optical resin 12 having a refractive index adjusted so as not to cause reflection at the interface.

なお、光吸収層６と配線９との間には、ＳｉＯ２、ＳｉＮ、或いはＳｉＯＮ等によって電気絶縁層が膜状に形成されていることが好ましい。光吸収層６がブラックレジストからなる場合には、光吸収層６にカーボンが含まれるため、熱等の影響によってブラックレジストが変質して導電性を有し、電気絶縁層が形成されていないと、ショートするおそれがあるからである。 In addition, it is preferable that an electrical insulating layer is formed in a film shape between the light absorption layer 6 and the wiring 9 using SiO 2 , SiN, SiON, or the like. When the light absorption layer 6 is made of a black resist, since the light absorption layer 6 contains carbon, the black resist is altered by the influence of heat or the like to have conductivity, and an electrical insulating layer is not formed. This is because there is a risk of short circuit.

以上のように構成された分光モジュール１においては、光Ｌ１は、光吸収層６の光通過孔６ａを介して本体部２の前面２ａから入射し、光透過部材２１、光吸収層７の光通過孔７ａ、光透過部材２２，２３を進行して分光部３に到達し、分光部３によって複数の光Ｌ２に分光される。分光された光Ｌ２は、分光部３によって本体部２の前面２ａ側に反射され、光透過部材２３，２２、光吸収層７の光通過孔７ｂ、光透過部材２１、光吸収層６の光通過孔６ｂを進行して光検出素子４の光検出部４ａに到達し、光検出素子４によって検出される。 In the spectroscopic module 1 configured as described above, the light L1 is incident from the front surface 2a of the main body 2 through the light passage hole 6a of the light absorption layer 6, and the light transmission member 2 1 and the light absorption layer 7 The light passes through the light passage hole 7a and the light transmitting members 2 2 and 2 3 to reach the spectroscopic unit 3 and is split into a plurality of lights L2 by the spectroscopic unit 3. The split light L2 is reflected by the spectroscopic unit 3 to the front surface 2a side of the main body 2, and the light transmitting members 2 3 and 2 2 , the light passing hole 7b of the light absorbing layer 7, the light transmitting member 2 1 and the light absorbing layer. 6 passes through the light passage hole 6 b and reaches the light detection portion 4 a of the light detection element 4, and is detected by the light detection element 4.

以上説明したように、分光モジュール１では、分光部３に進行する光Ｌ１が通過する光通過孔６ａ、及び光検出素子４の光検出部４ａに進行する光Ｌ２が通過する光通過孔６ｂを有する光吸収層６がパターニングによって一体成形される。そのため、光通過孔６ａと光通過孔６ｂとの相対的な位置関係にずれが生じるのを防止することができる。しかも、光吸収層６によって、迷光の発生が抑制され、また、迷光が吸収されるため、光検出素子４の光検出部４ａに迷光が入射するのを抑制することができる。従って、分光モジュール１によれば、信頼性を向上させることが可能となる。   As described above, in the spectroscopic module 1, the light passing hole 6a through which the light L1 traveling to the spectroscopic unit 3 passes and the light passing hole 6b through which the light L2 traveling to the light detecting unit 4a of the photodetecting element 4 passes. The light absorption layer 6 is integrally formed by patterning. Therefore, it is possible to prevent the relative positional relationship between the light passage hole 6a and the light passage hole 6b from being shifted. In addition, the generation of stray light is suppressed by the light absorption layer 6, and the stray light is absorbed, so that the stray light can be prevented from entering the light detection unit 4 a of the light detection element 4. Therefore, according to the spectroscopic module 1, the reliability can be improved.

また、本体部２は、その前面２ａと略直交する方向に積層された光透過部材２１〜２３を有しており、更に、前面２ａを有する光透過部材２１は、板状に形成されている。これにより、本体部２に対する光吸収層６の形成や光検出素子４の実装を容易化することができる。 The main body portion 2 has a light-transmitting member 2 1 to 2 3 laminated in the direction of the front surface 2a and substantially perpendicular, further, the light transmitting member 2 1 having a front surface 2a is formed in a plate shape Has been. Thereby, formation of the light absorption layer 6 with respect to the main-body part 2 and mounting of the photon detection element 4 can be facilitated.

また、本体部２の前面２ａと略直交する方向において隣り合う光透過部材２１，２２間には、分光部３に進行する光Ｌ１が通過する光通過孔７ａ、及び光検出素子４の光検出部４ａに進行する光Ｌ２が通過する光通過孔７ｂを有する光吸収層７が形成されている。これにより、広がりながら本体部２を進行する光Ｌ１，Ｌ２を、所望の領域に到達するように制限することができると共に、光検出素子４に迷光が入射するのをより一層効果的に抑制することができる。 Further, between the light transmitting members 2 1 and 2 2 adjacent to each other in the direction substantially orthogonal to the front surface 2 a of the main body 2, the light passing hole 7 a through which the light L 1 traveling to the spectroscopic unit 3 passes and the light detecting element 4 A light absorption layer 7 having a light passage hole 7b through which the light L2 traveling to the light detection unit 4a passes is formed. Accordingly, the lights L1 and L2 that travel through the main body 2 while spreading can be limited so as to reach a desired region, and the light detection element 4 can be more effectively suppressed from entering stray light. be able to.

また、光吸収層６の前面（すなわち、本体部２の前面２ａの反対側の面）には、光検出素子４と電気的に接続された配線９が形成されている。これにより、配線９による迷光の乱反射等を防止することができる。
［第２の実施形態］ A wiring 9 electrically connected to the light detection element 4 is formed on the front surface of the light absorption layer 6 (that is, the surface opposite to the front surface 2a of the main body 2). Thereby, irregular reflection of stray light by the wiring 9 can be prevented.
[Second Embodiment]

第２の実施形態の分光モジュール１は、配線９が本体部２の前面２ａに形成されている点で、上述した第１の実施形態の分光モジュール１と異なっている。   The spectroscopic module 1 according to the second embodiment is different from the spectroscopic module 1 according to the first embodiment described above in that the wiring 9 is formed on the front surface 2 a of the main body 2.

すなわち、図３に示されるように、配線９は、本体部２の前面２ａに形成されており、配線９の接続部９ｃは光吸収層６に覆われ、配線９のパッド部９ａ，９ｂは光吸収層６から露出している。これにより、本体部２に対する配線９の密着性が高くなるため、配線９の断線等を防止することができる。   That is, as shown in FIG. 3, the wiring 9 is formed on the front surface 2 a of the main body 2, the connection portion 9 c of the wiring 9 is covered with the light absorption layer 6, and the pad portions 9 a and 9 b of the wiring 9 are It is exposed from the light absorption layer 6. Thereby, since the adhesiveness of the wiring 9 with respect to the main-body part 2 becomes high, the disconnection etc. of the wiring 9 can be prevented.

また、配線９は、ＣｒＯ等の単層膜、或いはＣｒ−ＣｒＯ等の積層膜からなる光反射防止層１３を本体部２の前面２ａ側に有している。これにより、配線９による迷光の乱反射等を防止することができる。   Further, the wiring 9 has a light reflection preventing layer 13 made of a single layer film such as CrO or a laminated film such as Cr—CrO on the front surface 2 a side of the main body 2. Thereby, irregular reflection of stray light by the wiring 9 can be prevented.

本発明は、上述した第１及び第２の実施形態に限定されるものではない。   The present invention is not limited to the first and second embodiments described above.

例えば、図４に示されるように、本体部２は、半球状のレンズがその平面部分と略直交し且つ互いに略平行な２つの平面で切り落とされた形状であってもよい。この場合には、半球状のレンズの平面部分が本体部２の前面２ａとされ、半球状のレンズの曲面部分に分光部３が形成される。   For example, as shown in FIG. 4, the main body 2 may have a shape in which a hemispherical lens is cut off in two planes that are substantially orthogonal to the plane portion and substantially parallel to each other. In this case, the flat surface portion of the hemispherical lens is the front surface 2a of the main body portion 2, and the spectroscopic portion 3 is formed on the curved surface portion of the hemispherical lens.

また、図５に示されるように、本体部２は、半球状のレンズがその平面部分と略直交し且つ互いに略平行な２つの面で切り落とされた形状の光透過部材２２の平面部分に、長方形薄板状の光透過部材２１が光学樹脂やダイレクトボンディングによって貼り合わされたものであってもよい。この場合には、光透過部材２１の前面が本体部２の前面２ａとされ、光透過部材２２の曲面部分に分光部３が形成される。 Further, as shown in FIG. 5, the main body portion 2, the planar portion of the light transmitting member 2 2 in the form of hemispherical lenses was cut off by two planes substantially parallel to each other the plane portion substantially perpendicular to and , rectangular thin plate-like light transmitting member 2 1 may be those bonded with an optical resin or direct bonding. In this case, the front surface of the light transmitting member 2 1 is the front plane 2a of the body portion 2, the spectroscopic portion 3 is formed in a curved portion of the light transmitting member 2 2.

また、図６に示されるように、レンズとして機能する光透過部材２３と回折層１４とは、例えば、レプリカ成型用の光透過性低融点ガラス等によって一体的に形成されていてもよい。これにより、製造工程を簡略化することができると共に、光透過部材２３と回折層１４との相対的な位置関係にずれが生じるのを防止することができる。 Further, as shown in FIG. 6, the light transmitting member 2 3 functioning as a lens and the diffraction layer 14 is, for example, may be integrally formed by a light transmitting low melting glass for replica molding. Thus, it is possible to simplify the manufacturing process, it is possible to prevent the shift occurs in the relative positional relationship between the light transmitting member 2 3 and the diffraction layer 14.

１…分光モジュール、２…本体部、２ａ…前面（所定の面）、２１…光透過部材（第１の光透過部材）、２２…光透過部材、２３…光透過部材（第２の光透過部材）、３…分光部、４…光検出素子、５…反射層、６…光吸収層（第１の光吸収層）、６ａ…光通過孔（第１の光通過孔）、６ｂ…光通過孔（第２の光通過孔）、７…光吸収層（第２の光吸収層）、７ａ…光通過孔（第３の光通過孔）、７ｂ…光通過孔（第４の光通過孔）、９…配線、９ａ…パッド部（第１のパッド部）、９ｂ…パッド部（第２のパッド部）、９ｃ…接続部、１３…光反射防止層、１４…回折層。 DESCRIPTION OF SYMBOLS 1 ... Spectroscopic module, 2 ... Main-body part, 2a ... Front surface (predetermined surface), 2 1 ... Light transmission member (1st light transmission member), 2 2 ... Light transmission member, 2 3 ... Light transmission member (2nd) 3 ... spectral part, 4 ... light detection element, 5 ... reflection layer, 6 ... light absorption layer (first light absorption layer), 6a ... light passage hole (first light passage hole), 6b: Light passage hole (second light passage hole), 7: Light absorption layer (second light absorption layer), 7a: Light passage hole (third light passage hole), 7b: Light passage hole (fourth) , 9... Wiring, 9 a... Pad part (first pad part), 9 b... Pad part (second pad part), 9 c... Connection part, 13. .

Claims (7)

光を透過させる本体部と、
前記本体部の所定の面から前記本体部に入射した光を分光して前記所定の面側に反射する分光部と、
前記所定の面上に支持され、前記分光部によって分光されて反射された光を検出する光検出素子と、
前記所定の面に形成され、前記光検出素子の外部端子が電気的に接続された複数の第１のパッド部、前記光検出素子の出力信号を外部に取り出すための複数の第２のパッド部、及び対応する第１のパッド部と第２のパッド部とを接続する複数の接続部を有する配線と、
前記接続部を覆い且つ前記第１及び前記第２のパッド部を露出させるように前記所定の面に形成され、前記分光部に進行する光が通過する第１の光通過孔、及び前記光検出素子に進行する光が通過する第２の光通過孔を有する第１の光吸収層と、を備えることを特徴とする分光モジュール。 A main body that transmits light;
A spectroscopic unit that splits light incident on the main body from a predetermined surface of the main body and reflects the light to the predetermined surface;
A light detecting element that is supported on the predetermined surface and detects light reflected and reflected by the spectroscopic unit;
A plurality of first pad portions formed on the predetermined surface and electrically connected to external terminals of the light detection elements, and a plurality of second pad portions for taking out output signals of the light detection elements to the outside And a wiring having a plurality of connecting portions for connecting the corresponding first pad portion and the second pad portion,
A first light passage hole formed on the predetermined surface so as to cover the connection portion and expose the first and second pad portions, and through which light traveling to the spectroscopic portion passes, and the light detection A spectroscopic module comprising: a first light absorption layer having a second light passage hole through which light traveling to the element passes. 前記第１の光吸収層と前記配線との間には、電気絶縁層が形成されていることを特徴とする請求項１記載の分光モジュール。   The spectroscopic module according to claim 1, wherein an electrical insulating layer is formed between the first light absorption layer and the wiring. 前記配線は、前記所定の面側に光反射防止層を有することを特徴とする請求項１又は２記載の分光モジュール。   The spectroscopic module according to claim 1, wherein the wiring has a light reflection preventing layer on the predetermined surface side. 前記本体部は、前記所定の面と略直交する方向に積層された複数の光透過部材を有することを特徴とする請求項１〜３のいずれか一項記載の分光モジュール。   The spectroscopic module according to claim 1, wherein the main body has a plurality of light transmission members stacked in a direction substantially orthogonal to the predetermined surface. 前記光透過部材のうち、前記所定の面を有する第１の光透過部材は、板状に形成されていることを特徴とする請求項４記載の分光モジュール。   The spectroscopic module according to claim 4, wherein the first light transmitting member having the predetermined surface among the light transmitting members is formed in a plate shape. 前記所定の面と略直交する方向において隣り合う前記光透過部材間には、前記分光部に進行する光が通過する第３の光通過孔、及び前記光検出素子に進行する光が通過する第４の光通過孔を有する第２の光吸収層が形成されていることを特徴とする請求項４又は５記載の分光モジュール。   Between the light transmitting members adjacent in the direction substantially orthogonal to the predetermined surface, a third light passage hole through which the light traveling to the spectroscopic section passes and a light through which traveling to the light detection element passes. 6. The spectral module according to claim 4, wherein a second light absorption layer having four light passage holes is formed. 前記光透過部材のうち、前記分光部が設けられた第２の光透過部材は、曲面部分を有し、
前記分光部は、前記曲面部分の外側表面に形成された回折層、及び前記回折層の外側表面に形成された反射層を有することを特徴とする請求項４〜６のいずれか一項記載の分光モジュール。 Of the light transmitting member, the second light transmitting member provided with the spectroscopic portion has a curved surface portion,
The said spectroscopic part has the diffraction layer formed in the outer surface of the said curved-surface part, and the reflective layer formed in the outer surface of the said diffraction layer, It is any one of Claims 4-6 characterized by the above-mentioned. Spectroscopic module.
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JPS626126A (en) * 1985-07-03 1987-01-13 Shimadzu Corp Sensor for analyzing light spectrum
JPH04294223A (en) * 1990-12-04 1992-10-19 Carl Zeiss:Fa Diode-line type spectrochemical analyzer
JP2000065642A (en) * 1998-03-11 2000-03-03 Gretag Macbeth Ag Spectrometer
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