JP2012052911A - Liquid level detector - Google Patents

Liquid level detector Download PDF

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JP2012052911A
JP2012052911A JP2010195729A JP2010195729A JP2012052911A JP 2012052911 A JP2012052911 A JP 2012052911A JP 2010195729 A JP2010195729 A JP 2010195729A JP 2010195729 A JP2010195729 A JP 2010195729A JP 2012052911 A JP2012052911 A JP 2012052911A
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liquid level
frame
circuit board
movable contact
float
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JP2012052911A5 (en
JP5523252B2 (en
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Kenji Kubo
賢二 久保
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a liquid level detector that is to be incorporated into a fuel pump module to be arranged within a fuel tank, is enhanced in fitting ease and in the ease of being inserted into the fuel tank by virtue of its smaller size, and is reduced in price by cutting back the number of components used and that of steps of the working process.SOLUTION: A liquid level detector that detects variations in liquid level in a fuel tank with a float floating on the liquid surface in the tank comprises: a fitting member disposed on a fuel pump module; a float arm oscillatablly fitted to a frame fitted to the fitting member and linked to the float; a movable contact disposed on and co-moving with the float arm; and an electroconductive pattern that causes the movable contact to slide, further provided with a circuit board fitted to the frame and a lead wire that sends the electricity, whose quantity varies with the sliding of the electroconductive pattern caused by the movable contact, of the circuit board to outside. A through hole penetrating both the frame and the circuit board is provided and the lead wire passing this through hole is connected to the electroconductive pattern and the movable contact.

Description

この発明は、燃料を貯蔵する燃料タンクの開口部に保持されて燃料を燃料タンクの外へ送出するための燃料ポンプモジュールに装着されて、燃料タンク内の液面レベルを検出する液面検出装置に関するものである。   The present invention relates to a liquid level detection device that is mounted on a fuel pump module that is held in an opening of a fuel tank that stores fuel and that sends the fuel out of the fuel tank, and detects a liquid level in the fuel tank. It is about.

従来の液面検出装置は、燃料タンク内の燃料液面に浮くフロート、フロートと組み付けられるフロートアーム、フロートアームを保持するとともにフロートアームの回動支点である軸受部を備えたアームホルダ、アームホルダの軸受部を軸支する上フレームおよび下フレーム、フレームに固定される回路基板、回路基板上を摺動する接点などを備え、燃料タンク内の液面変動によってフロートが上下動し、この上下動に伴ってフロートアームを介して接点が回路基板上を摺動し、液面高さに応じた信号を出力することで燃料タンク内の液面を検出するようになっている。(例えば、特許文献1参照)   A conventional liquid level detecting device includes a float that floats on a fuel level in a fuel tank, a float arm that is assembled with the float, an arm holder that holds the float arm and includes a bearing portion that is a pivotal fulcrum of the float arm, and an arm holder The upper and lower frames that pivotally support the bearings, the circuit board that is fixed to the frame, and the contacts that slide on the circuit board. The float moves up and down due to liquid level fluctuations in the fuel tank. Accordingly, the contact point slides on the circuit board via the float arm, and the liquid level in the fuel tank is detected by outputting a signal corresponding to the liquid level. (For example, see Patent Document 1)

特許第3981858号号公報Japanese Patent No. 3981858

液面検出装置は、燃料ポンプモジュールに組み付けられて燃料タンク内に配置されており、組み付け性の向上、小型化による燃料タンクへの挿入性を向上させると共に、また低コスト化が求められている。   The liquid level detection device is assembled in a fuel pump module and arranged in a fuel tank, and it is required to improve the ease of assembly, improve the ease of insertion into the fuel tank by downsizing, and reduce the cost. .

しかし、上述の従来例では、上フレームを有しているため高さ方向が厚く、小型化に限界がある上に、部品点数が増加してしまい、また上フレームと下フレームを固定するための溶着作業があるため製造に手間がかかる等の問題点があった。   However, in the above-described conventional example, since the upper frame is provided, the height direction is thick, there is a limit to downsizing, the number of parts increases, and the upper frame and the lower frame are fixed. There are problems such as time-consuming manufacturing due to welding work.

この発明は、上記のような問題点を解決するためになされたもので、小型化による燃料タンクへの挿入性の向上、部品点数および作業工程の削減による低価格な液面検出装置の提供を行うものである。   The present invention has been made to solve the above-described problems, and provides a low-priced liquid level detection device by improving the insertability into a fuel tank by downsizing and reducing the number of parts and work processes. Is what you do.

この発明に係わる液面検出装置は、燃料を燃料タンク外へ送出するための燃料ポンプモジュールに装備され、燃料タンク内の液面に浮上したフロートによって燃料タンク内の液面変動を検知する液面検出装置において、上記燃料ポンプモジュールに設けた取り付け部材、この取り付け部材に取り付けられたフレーム、このフレームに揺動自在に取り付けられるともに上記フロートに連結されたフロートアーム、このフロートアームに設けられ上記液面変動に応じてこのフロートアームと共動する可動接点、この可動接点を摺動させる導電パターンを有し、上記フレームに取り付けられた回路基板、および上記可動接点が上記導電パターンを摺動することにより変化する上記回路基板の電気量を、外部へ送出するリード線を備え、上記フレームへの上記回路基板の取り付け時に形成された重合部分に、両者を貫通し上記リード線を貫挿する貫通孔を設け、この貫通孔部において、上記リード線を上記導電パターンと上記可動接点とに、それぞれ接続したものである。   A liquid level detection device according to the present invention is provided in a fuel pump module for sending fuel out of a fuel tank, and detects a liquid level fluctuation in the fuel tank by a float floating on the liquid level in the fuel tank. In the detection device, an attachment member provided on the fuel pump module, a frame attached to the attachment member, a float arm that is swingably attached to the frame and connected to the float, and the liquid provided to the float arm A movable contact that cooperates with the float arm in accordance with surface fluctuation, a conductive pattern that slides the movable contact, a circuit board attached to the frame, and the movable contact slides on the conductive pattern A lead wire for sending the amount of electricity of the circuit board, which changes depending on In the overlapped part formed at the time of mounting the circuit board, a through hole is provided that penetrates both and penetrates the lead wire, and in the through hole portion, the lead wire is connected to the conductive pattern and the movable contact, Each is connected.

この発明の液面検出装置によれば、従来例のような上フレームが不要となり、またリード線を回路基板に設けた回路基板の貫通孔から挿通させ回路基板に直接接続することで、リード線を保持し、回路基板への接続のための端子、さらに端子を保持する端子受け部を廃止することが可能となり、小型化による燃料タンクへの挿入性が向上し、また部品点数の削減、作業工程の削減が可能な液面検出装置を提供できる。   According to the liquid level detection device of the present invention, the upper frame as in the conventional example is not required, and the lead wire is directly connected to the circuit board by inserting the lead wire from the through hole of the circuit board provided in the circuit board. , The terminal for connecting to the circuit board, and the terminal receiving part that holds the terminal can be abolished, the insertion into the fuel tank is improved by downsizing, the number of parts is reduced, and the work A liquid level detection device capable of reducing the number of processes can be provided.

この発明の実施の形態1における液面検出装置の外観斜視図である。It is an external appearance perspective view of the liquid level detection apparatus in Embodiment 1 of this invention. この発明の実施の形態1における液面検出装置の分解斜視図である。It is a disassembled perspective view of the liquid level detection apparatus in Embodiment 1 of this invention. 図2を矢印A方向に見た正面図である。It is the front view which looked at FIG. 2 in the arrow A direction. 図3における背面図である。FIG. 4 is a rear view in FIG. 3. 図3におけるV−V線を矢印方向に見た断面図である。It is sectional drawing which looked at the VV line in FIG. 3 in the arrow direction. 液面検出装置を取り付け部材に取り付ける際の説明図で、(a)は取り付け前の状態図、(b)は取り付け後の状態図である。It is explanatory drawing at the time of attaching a liquid level detection apparatus to an attachment member, (a) is a state figure before attachment, (b) is a state figure after attachment.

以下、図面に基づいて、この発明の実施の形態を説明する。
なお、各図間において、同一符号は同一あるいは相当部分を示す。
Embodiments of the present invention will be described below with reference to the drawings.
In addition, the same code | symbol shows the same or an equivalent part between each figure.

実施の形態1.
実施の形態1における液面検出装置は、図に示すように、フレーム前面開口部1cと燃料タンク内に配置される燃料ポンプモジュールに配設された取り付け部材10でフロートアーム7を挟みこむことで、フレーム背面壁部1dの裏側を露出させた状態で当該フレーム1を取り付け部材10に取り付け、リード線をフレーム背面壁部1dからフレーム貫通孔および回路基板貫通孔に挿通して回路基板2に直接接続するようにしたものである。
Embodiment 1 FIG.
As shown in the drawing, the liquid level detection device in the first embodiment sandwiches the float arm 7 between the frame front opening 1c and the mounting member 10 disposed in the fuel pump module disposed in the fuel tank. The frame 1 is attached to the mounting member 10 with the back side of the frame back wall 1d exposed, and lead wires are inserted from the frame back wall 1d through the frame through hole and the circuit board through hole and directly into the circuit board 2. It is intended to be connected.

図1において、液面検出装置は、燃料タンク(図示しない)内に配設される取り付け部材10に装着される構成であり、取り付け部材10は、例えば図示しない燃料ポンプモジュールを形成するサブタンクで、取り付け部材10は平板としているが、曲面であっても良い。   In FIG. 1, the liquid level detection device is configured to be attached to an attachment member 10 disposed in a fuel tank (not shown), and the attachment member 10 is, for example, a sub tank that forms a fuel pump module (not shown). The attachment member 10 is a flat plate, but may be a curved surface.

実施の形態1における液面検出装置は、図1から図5に示すように構成されている。
すなわち、液面検出装置は、燃料タンク(図示しない)内の燃料液面に浮くフロート8と、このフロート8に結合(連結)されたフロートアーム7と、このフロートアーム7とフロート8とを保持するプッシュナット9(図1)と、フロートアーム7の回動支点である軸受部3aを有しフロートアーム7を揺動自在に保持するアームホルダ3と、このアー
ムホルダ3の軸受部3aを後述するアームホルダ軸受部用支持部1fによって支持(軸支
)するフレーム1と、このフレーム1に後述するようにして固定され、導電パターン2bと回路基板貫通孔2a、2bが配設された回路基板2と、この回路基板2上を摺動接触す
る可動接点4と、この可動接点4と回路基板2を電気的に導通させるための導電スプリング5と、この導電スプリングの一端と導電パターン2bの一端とにそれぞれ後述するようにして接続され、液面変動に伴い回路基板2上を摺動する可動接点4による電気量の変化、例えば電流の変化(電気信号)を外部へ送出するためのリード線6a、6bなどで構成されている。
The liquid level detection apparatus according to Embodiment 1 is configured as shown in FIGS.
That is, the liquid level detection device holds a float 8 floating on a fuel level in a fuel tank (not shown), a float arm 7 coupled (connected) to the float 8, and the float arm 7 and the float 8. A push nut 9 (FIG. 1), an arm holder 3 having a bearing portion 3a which is a pivot point of the float arm 7, and holding the float arm 7 in a swingable manner, and a bearing portion 3a of the arm holder 3 will be described later. A frame 1 that is supported (supported) by a supporting portion 1f for arm holder bearings, and a circuit board that is fixed to the frame 1 as will be described later and is provided with conductive patterns 2b and circuit board through holes 2a and 2b. 2, a movable contact 4 slidably contacting on the circuit board 2, a conductive spring 5 for electrically connecting the movable contact 4 and the circuit board 2, and one end of the conductive spring A change in the amount of electricity by the movable contact 4 that is connected to one end of the conductive pattern 2b as described later and slides on the circuit board 2 in accordance with the liquid level change, for example, a change in electric current (electric signal) is sent to the outside. For example, the lead wires 6a and 6b are used.

フレーム1は、フレーム前面開口部1cとフレーム背面壁部1dとを有し、このフレーム背面壁部1dには、回路基板2を組み込む(嵌め込む)ための回路基板嵌め込み用凹部1eが形成されている。
また、この回路基板嵌め込み用凹部1eに隣接する部分のフレーム背面壁部1dには、軸受部3aを支持(軸支)するアームホルダ軸受部用支持部1fが設けられ、このアームホ
ルダ軸受部用支持部1fに軸受部3aを圧入することにより、フロートアーム7は、軸方
向に固定されながらアームホルダ軸受部用支持部1fを中心に回動自在(揺動自在)に支持されている。
The frame 1 has a frame front opening 1c and a frame rear wall 1d, and a circuit board fitting recess 1e for incorporating (fitting) the circuit board 2 is formed in the frame rear wall 1d. Yes.
The frame back wall 1d adjacent to the circuit board fitting recess 1e is provided with an arm holder bearing support 1f that supports (supports) the bearing 3a. By press-fitting the bearing portion 3a into the support portion 1f, the float arm 7 is supported rotatably (swingable) around the arm holder bearing portion support portion 1f while being fixed in the axial direction.

さらに、回路基板2が組み付けられるフレーム前面開口部1cには、回路基板押さえ部1g、11gが突設され、この回路基板押さえ部は、回路基板2をフレーム1に組み付けた際、回路基板2が外れないように固定する。
このほかフレーム1には、後述するように、リード線保持部1h、液面検出装置保持用レール1j、11j、導電スプリング取り付け軸1s、リード線用フレーム貫通孔1a、1b等を備えている。
Further, circuit board pressing portions 1g and 11g project from the frame front surface opening 1c to which the circuit board 2 is assembled. When the circuit board 2 is assembled to the frame 1, the circuit board pressing portion 1g and 11g project. Secure it so that it does not come off.
In addition, as will be described later, the frame 1 includes a lead wire holding portion 1h, liquid level detection device holding rails 1j and 11j, a conductive spring mounting shaft 1s, lead wire frame through holes 1a and 1b, and the like.

なお、アームホルダ3に組み付けられる可動接点4は、図示しないアームホルダ3の背面に組みつけられ、例えば熱溶着によってアームホルダ3に固定される。   In addition, the movable contact 4 assembled | attached to the arm holder 3 is assembled | attached to the back surface of the arm holder 3 which is not shown in figure, and is fixed to the arm holder 3 by heat welding, for example.

導電パターン2b、可動接点4、導電スプリング5間は、次のようにして接続される。
フレーム1に設けたアームホルダ軸受部用支持部1fに、アームホルダ3の軸受部3a
を圧入し、アームホルダ3がアームホルダ軸受部用支持部1fを中心に回動自由に固定された後、アームホルダ軸受部用支持部1f付近で、導電のための導電スプリング5を接続する。この際、導電スプリング5の一端5aは回路基板2を摺動する可動接点4に、また、もう一方の他端5bは、後述するように回路基板2へ接続されるが、まず回路基板貫通孔2bに挿通され仮固定される。
The conductive pattern 2b, the movable contact 4, and the conductive spring 5 are connected as follows.
The arm holder bearing support portion 1 f provided on the frame 1 is connected to the bearing portion 3 a of the arm holder 3.
The arm holder 3 is fixed to be freely rotatable about the arm holder bearing support 1f, and then a conductive spring 5 for electrical conduction is connected in the vicinity of the arm holder bearing support 1f. At this time, one end 5a of the conductive spring 5 is connected to the movable contact 4 that slides on the circuit board 2, and the other end 5b is connected to the circuit board 2 as described later. 2b is inserted and temporarily fixed.

次に、リード線6a、6bの接続固定について説明する。
フレームの貫通孔1a、1bおよび回路基板の貫通孔2a、2bは、回路基板2をフレ
ーム1の回路基板嵌め込み用凹部1eに重ね合わせ嵌めこみ取り付けた時、図5に示すよ
うにその重合部分の同一軸線上に両者が貫通する状態となるようそれぞれ設けられている。
Next, connection and fixing of the lead wires 6a and 6b will be described.
The through-holes 1a and 1b of the frame and the through-holes 2a and 2b of the circuit board are formed when the circuit board 2 is overlapped and attached to the circuit board fitting recess 1e of the frame 1 as shown in FIG. They are respectively provided so that both penetrate through the same axis.

そして、リード線6aは、フレーム貫通孔1aから回路基板貫通孔2aへ貫挿し、またリード線6bは、フレーム貫通孔1bから回路基板貫通孔2bへ貫挿し、後述する接続用電極パターンTa、Tbにおいて、それぞれ半田により接続固定される。
すなわち、リード線6a、6bは、フレーム貫通孔1a、1b及び回路基板貫通孔2a、2bへ挿通した後、回路基板2の一部に設けられたリード線及び導電スプリングとの接続の為の接続用電極パターンTa、Tb(端子ではなく電極パターンの一部で構成)にそれぞれ半田にて接続される。この時、リード線6bが挿通するフレーム貫通孔1b及び回路基板貫通孔2bには、リード線6bと同時に導電スプリング5の他端5bが回路基板貫通孔側から挿通し半田付けされる。
つまり、リード線6aは、フレーム貫通孔1aから回路基板貫通孔2aへ挿通し、接続用電極パターンTaで半田により接続固定される。リード線6bは、フレーム貫通孔1bから回路基板貫通孔2bを挿通し、また同時に導電スプリングの他端5bは、回路基板貫通孔2bからフレーム貫通孔1bへ挿通した後、接続用導電パターンTbで半田により接続固定される。
The lead wire 6a is inserted from the frame through hole 1a into the circuit board through hole 2a, and the lead wire 6b is inserted from the frame through hole 1b into the circuit board through hole 2b. In FIG. 2, each of them is connected and fixed by solder.
That is, the lead wires 6a and 6b are inserted into the frame through holes 1a and 1b and the circuit board through holes 2a and 2b, and then connected to lead wires and conductive springs provided in a part of the circuit board 2. Electrode patterns Ta and Tb (configured by part of the electrode pattern instead of the terminal) are connected by solder. At this time, the other end 5b of the conductive spring 5 is inserted from the circuit board through hole side and soldered to the frame through hole 1b and the circuit board through hole 2b through which the lead wire 6b is inserted, simultaneously with the lead wire 6b.
That is, the lead wire 6a is inserted from the frame through hole 1a to the circuit board through hole 2a, and is connected and fixed by the connecting electrode pattern Ta by solder. The lead wire 6b is inserted into the circuit board through hole 2b from the frame through hole 1b. At the same time, the other end 5b of the conductive spring is inserted into the frame through hole 1b from the circuit board through hole 2b and then connected to the conductive pattern Tb for connection. The connection is fixed by soldering.

以上のように構成することにより、リード線6a、6bを保持し、回路基板2と接続するための端子の廃止が可能となり、また端子を保持する端子受け部も同時に廃止可能となり、部品点数および作業工程の削減、小型化が実現可能となる。   By configuring as described above, the terminals for holding the lead wires 6a and 6b and connecting to the circuit board 2 can be eliminated, and the terminal receiving part for holding the terminals can be eliminated at the same time. Reduction of work processes and downsizing can be realized.

また、導電スプリング5と回路基板2の半田付けと、リード線6a、6bと回路基板2の半田付けという半田付け工程が不要となり、半田付け工程を一度にまとめることが可能となる。   Further, the soldering process of soldering the conductive spring 5 and the circuit board 2 and the soldering of the lead wires 6a and 6b and the circuit board 2 is not necessary, and the soldering process can be integrated at a time.

リード線6a、6bをフレーム背面壁部1dの裏側から挿通させた後、フレーム1に配設されたリード線保持部1hに引っ掛け保持させることにより、リード線6a、6bが燃料タンク内の液面による振動などで他部品と接触することによる断線、皮膜破れなどを防止できる。 After the lead wires 6a and 6b are inserted from the back side of the frame rear wall portion 1d, the lead wires 6a and 6b are hooked and held on the lead wire holding portion 1h disposed on the frame 1, so that the lead wires 6a and 6b are liquid surfaces in the fuel tank. It is possible to prevent disconnection and film tearing caused by contact with other parts due to vibration caused by

この発明における液面検出装置の構成は、フレーム前面開口部1cから回路基板2、アームホルダ3など各部品が組みつけられ、また燃料ポンプモジュールに配設される取り付け部材10に取り付けられる際、フレーム前面開口部1cが、取り付け部材10と当接し、フレーム背面壁部1dの裏側が露出する形となる。   The configuration of the liquid level detection device according to the present invention is such that when the parts such as the circuit board 2 and the arm holder 3 are assembled from the frame front opening 1c and are attached to the attachment member 10 provided in the fuel pump module, the frame The front opening 1c comes into contact with the attachment member 10, and the back side of the frame rear wall 1d is exposed.

この発明における液面検出装置のリード線6a、6b接続構造は、上記のように、液面検出装置が取り付け部材10に、フレーム背面壁部1dの裏側が露出した状態で取り付けられるために可能な構成となっている。   The lead wire 6a, 6b connection structure of the liquid level detection device according to the present invention is possible because the liquid level detection device is attached to the mounting member 10 with the back side of the frame rear wall portion 1d exposed as described above. It has a configuration.

フロート8を保持するフロートアーム7の一端は、燃料タンク内の燃料液面に浮くフロート8に配設された図示しない貫通孔に挿通され、プッシュナット9で抜け止めされる。もう一方の他端は、上記フレーム1に配設されたアームホルダ軸受部用支持部1fに回動自由に組み付けられているアームホルダ3に圧入固定されており、燃料タンク内の液面変動に伴うフロート8の上下変動が、フロートアーム7を介してアームホルダ3に、またアームホルダ3に組み付けられている可動接点4へ伝えられる。   One end of the float arm 7 that holds the float 8 is inserted into a through hole (not shown) provided in the float 8 that floats on the fuel level in the fuel tank, and is prevented from being detached by a push nut 9. The other end of the other end is press-fitted and fixed to an arm holder 3 that is rotatably attached to an arm holder bearing support 1f disposed on the frame 1, and the liquid level in the fuel tank is changed. The accompanying vertical movement of the float 8 is transmitted to the arm holder 3 via the float arm 7 and to the movable contact 4 assembled to the arm holder 3.

以上のように構成された液面検出装置では、液面高さをフロート8が検知し、フロートアーム7を介して可動接点4に伝えられ、回路基板2上を摺動接触することで、燃料タンク内の液面高さが電気信号に変換され、導電スプリング5、リード線6a、6bを介して外部へ出力される。   In the liquid level detection apparatus configured as described above, the float 8 detects the liquid level height, is transmitted to the movable contact 4 via the float arm 7, and is brought into sliding contact with the circuit board 2, thereby The liquid level in the tank is converted into an electric signal, which is output to the outside through the conductive spring 5 and the lead wires 6a and 6b.

次に、以上のように構成された液面検出装置が、図示しない燃料ポンプモジュールに配設された取り付け部材10に装着される動作を図6によって説明する。   Next, the operation of mounting the liquid level detection device configured as described above on the mounting member 10 provided in the fuel pump module (not shown) will be described with reference to FIG.

フレーム1の上下にそれぞれ配設された液面検出装置保持用レール1j、11jは、取り付け部材10の上下位置にそれぞれ配設された液面検出装置本体取り付けガイド10a
に沿って挿入され、このガイドに配設された当接部10bに当接するまで挿入される。
The liquid level detection device holding rails 1j and 11j respectively disposed on the upper and lower sides of the frame 1 are liquid level detection device main body mounting guides 10a disposed on the upper and lower positions of the mounting member 10, respectively.
Is inserted until it abuts against the abutting portion 10b disposed in the guide.

液面検出装置保持用レール1j、11jが、液面検出装置本体取り付けガイドガイド10aに沿って挿入される際、フレーム1に配設された爪部1k、11kは、ガイド10aに配設された係止部10cに接触し、内側に弾性変形しながら挿入される。   When the liquid level detection device holding rails 1j and 11j are inserted along the liquid level detection device main body mounting guide guide 10a, the claw portions 1k and 11k provided on the frame 1 are provided on the guide 10a. It contacts the locking portion 10c and is inserted while being elastically deformed inside.

液面検出装置保持用レール1j、11jが当接部10bに当接されると同時に、弾性変
形しながら挿入されていた爪部1k、11kが、係止部10cの内側を通り抜け、元の形
状に戻ると同時に、爪部1k、11kと係止部10cが当接しフレーム1が抜け止めされ
る。
At the same time that the liquid level detection device holding rails 1j and 11j are brought into contact with the contact portion 10b, the claw portions 1k and 11k that are inserted while being elastically deformed pass through the inside of the locking portion 10c to return to the original shape. At the same time, the claw portions 1k and 11k and the locking portion 10c come into contact with each other and the frame 1 is prevented from coming off.

以上のように、この発明の実施の形態によれば、小型化による燃料タンクへの挿入性の向上、部品点数および作業工程削減により製造コストを低減でき、低コストの液面検出装置の提供が可能となる。   As described above, according to the embodiment of the present invention, it is possible to reduce the manufacturing cost by improving the insertability to the fuel tank by reducing the size, reducing the number of parts and the work process, and providing a low-cost liquid level detection device. It becomes possible.

1 フレーム
1a、1b リード線用フレーム貫通孔
1c フレーム前面開口部
1d フレーム背面壁部
1e 回路基板嵌め込み用凹部
1f アームホルダ軸受部用支持部
1g、11g 回路基板押さえ部
1h リード線保持部
1j、11j 液面検出装置保持用レール
1k、11k 爪部
1s 導電スプリング取り付け軸
2 回路基板
2b 導電パターン
2a、2b 回路基板貫通孔
3 アームホルダ
3a アームホルダ軸受部
4 可動接点
5 導電スプリング
5a、5b 導電スプリング端子
6 6a、6b リード線
7 フロートアーム
8 フロート
9 プッシュナット
10 取り付け部材10
10a 液面検出装置本体取り付け用ガイド
10b 当接部
10c 係止部。
DESCRIPTION OF SYMBOLS 1 Frame 1a, 1b Frame through-hole for lead wires 1c Frame front opening 1d Frame back wall 1e Circuit board fitting recess 1f Arm holder bearing support 1g, 11g Circuit board presser 1h Lead wire holding part 1j, 11j Rail for holding liquid level detection device 1k, 11k Claw part 1s Conductive spring mounting shaft 2 Circuit board 2b Conductive pattern 2a, 2b Circuit board through hole 3 Arm holder 3a Arm holder bearing part 4 Movable contact 5 Conductive spring 5a, 5b Conductive spring terminal 6 6a, 6b Lead wire 7 Float arm 8 Float 9 Push nut 10 Mounting member 10
10a Liquid level detection device main body mounting guide 10b Contact portion 10c Locking portion.

Claims (3)

燃料を燃料タンク外へ送出するための燃料ポンプモジュールに装備され、燃料タンク内の液面に浮上したフロートによって燃料タンク内の液面変動を検知する液面検出装置において、
上記燃料ポンプモジュールに設けた取り付け部材、この取り付け部材に取り付けられたフレーム、このフレームに揺動自在に取り付けられるともに上記フロートに連結されたフロートアーム、このフロートアームに設けられ上記液面変動に応じてこのフロートアームと共動する可動接点、この可動接点を摺動させる導電パターンを有し、上記フレームに取り付けられた回路基板、および上記可動接点が上記導電パターンを摺動することにより変化する上記回路基板の電気量を、外部へ送出するリード線を備え、上記フレームへの上記回路基板の取り付け時に形成された重合部分に、両者を貫通し上記リード線を貫挿する貫通孔を設け、この貫通孔部において、上記リード線に上記導電パターンと上記可動接点とをそれぞれ接続したこと特徴とする液面検出装置。
In a liquid level detection device that is equipped in a fuel pump module for sending fuel out of a fuel tank and detects a liquid level fluctuation in the fuel tank by a float that floats on the liquid level in the fuel tank,
A mounting member provided in the fuel pump module, a frame attached to the mounting member, a float arm that is swingably attached to the frame and connected to the float, and provided in the float arm according to the liquid level fluctuation A movable contact that cooperates with the float arm, a conductive pattern that slides the movable contact, a circuit board attached to the frame, and the movable contact that changes as the movable contact slides on the conductive pattern Provided with a lead wire that sends out the amount of electricity of the circuit board to the outside, a through hole that penetrates both the lead wires through the overlapping portion formed when the circuit board is attached to the frame is provided. In the through hole portion, the conductive pattern and the movable contact are respectively connected to the lead wire; That the liquid level detection device.
上記フロートアームと上記回路基板とを取り付けた上記フレームの取り付け面側を、上記取り付け部材へ直付けしたことを特徴とする請求項1記載の液面検出装置。   2. The liquid level detection device according to claim 1, wherein an attachment surface side of the frame to which the float arm and the circuit board are attached is directly attached to the attachment member. 上記フレームに、上記リード線を保持するリード線保持部を設けたことを特徴とする請求項2記載の液面検出装置。   The liquid level detection device according to claim 2, wherein the frame is provided with a lead wire holding portion for holding the lead wire.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014112549A1 (en) * 2013-01-18 2014-07-24 矢崎総業株式会社 Liquid level sensor mounting structure, and liquid level sensor

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Publication number Priority date Publication date Assignee Title
JP2000193512A (en) * 1998-12-28 2000-07-14 Nippon Seiki Co Ltd Liquid level detecting device
JP2007240274A (en) * 2006-03-07 2007-09-20 Denso Corp Liquid level detector

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Publication number Priority date Publication date Assignee Title
JP2000193512A (en) * 1998-12-28 2000-07-14 Nippon Seiki Co Ltd Liquid level detecting device
JP2007240274A (en) * 2006-03-07 2007-09-20 Denso Corp Liquid level detector

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Publication number Priority date Publication date Assignee Title
WO2014112549A1 (en) * 2013-01-18 2014-07-24 矢崎総業株式会社 Liquid level sensor mounting structure, and liquid level sensor
JP2014137317A (en) * 2013-01-18 2014-07-28 Yazaki Corp Attachment structure of liquid level sensor and the liquid level sensor
CN104937383A (en) * 2013-01-18 2015-09-23 矢崎总业株式会社 Liquid level sensor mounting structure, and liquid level sensor

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