JP2012052079A - Dot tape paste - Google Patents

Dot tape paste Download PDF

Info

Publication number
JP2012052079A
JP2012052079A JP2010210053A JP2010210053A JP2012052079A JP 2012052079 A JP2012052079 A JP 2012052079A JP 2010210053 A JP2010210053 A JP 2010210053A JP 2010210053 A JP2010210053 A JP 2010210053A JP 2012052079 A JP2012052079 A JP 2012052079A
Authority
JP
Japan
Prior art keywords
paste
tape
glue
dot
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010210053A
Other languages
Japanese (ja)
Inventor
Fumiaki Jo
文彬 徐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TATA Corp KK
Original Assignee
TATA Corp KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TATA Corp KK filed Critical TATA Corp KK
Priority to JP2010210053A priority Critical patent/JP2012052079A/en
Publication of JP2012052079A publication Critical patent/JP2012052079A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve a problem that a conventional tape paste has often caused irregularity of pasting and been inconvenient because of using only paste in form of large dots.SOLUTION: A dot tape paste does not cause irregularity of pasting by using paste in form of large and small dots even if being cut in any lengths and used and can be used to paste various objects.

Description

本発明は大小の点状ののりをテープに備え付けてあるため、そのテープを塗布装置に装着することで様々なものを貼り付けることが出来る。  In the present invention, since a large and small dotted glue is provided on a tape, various things can be attached by attaching the tape to a coating device.

従来のテープのりは同じ大きさの点状ののりだけしか、テープに備え付けることが出来なかった。  The conventional tape glue can only be attached to the tape with a spot-like glue of the same size.

本発明は二次加工することで、大小の点状ののりをテープに備え付けることが出来、その結果様々なものを貼り付けることが出来るようになった。また塗布装置に装着することで安易に自由な長さに切り取ることが出来る。  By subjecting the present invention to secondary processing, large and small dotted glue can be provided on the tape, and as a result, various things can be pasted. In addition, it can be easily cut to a free length by mounting on a coating device.

点点テープのりの全体図  Overall view of dotted tape glue 点点テープのりの側面図  Side view of dotted tape glue 点点テープのりの塗布装置図  Dot-point tape glue coating equipment diagram 点点テープのりの使用図１  Use of point tape glue Figure 1 点点テープのりの使用図２  Use of point tape glue Figure 2 小さい点状ののりの一次加工完了図  Primary processing complete drawing of small point-like paste 二次加工用の大きい点状ののりの図  Illustration of large point glue for secondary processing 二次加工完了図  Secondary processing completed drawing

以下、本発明を実施するための形態を図１〜図８に基づいて説明する。  Hereinafter, embodiments for carrying out the present invention will be described with reference to FIGS.

図１は点点テープのりの全体図で、１は大きい点状ののり、２は小さい点状ののり、３は１と２を備え付けるためのテープである。  FIG. 1 is an overall view of a point-point tape glue. 1 is a large spot-like glue, 2 is a small spot-like glue, and 3 is a tape for attaching 1 and 2.

図２は点点テープのりの側面図で、大きい点状ののり１と小さい点状ののり２がテープ３に備え付けてある状態である。  FIG. 2 is a side view of the point tape glue, in which a large dot glue 1 and a small dot glue 2 are provided on the tape 3.

図３は点点テープのりを塗布装置４に装着した状態である。  FIG. 3 shows a state in which a point tape glue is mounted on the coating device 4.

図４は点点テープのりを封筒５に貼り、自由な長さに切り取った様子である。  FIG. 4 shows a state in which a point tape glue is pasted on the envelope 5 and cut to a free length.

図５は点点テープのりと封筒５を貼り付けた様子である。封筒以外にもポスターや写真にきれいに貼り付けることが出来る。  FIG. 5 shows a state in which the dot tape glue and the envelope 5 are attached. In addition to envelopes, it can be neatly pasted on posters and photos.

図６は小さい点状ののり２をテープ３に一次加工として貼付した状態である。  FIG. 6 shows a state in which a small spot-like paste 2 is attached to the tape 3 as a primary process.

図７は二次加工用の大きい点状ののり１の図である。  FIG. 7 is a diagram of a large point-like paste 1 for secondary processing.

図８は図６に図７の大きい点状ののり１を二次加工として、テープ３に貼付した状態である。  FIG. 8 shows a state in which the large spot-like paste 1 shown in FIG.

Claims (2)

大小の点状ののりを貼り付けたテープのり。  Tape glue with large and small dotted glue. 請求項１のテープのりを塗布装置に装着することで様々なものを容易に接着することが可能なテープ状ののり。  A tape-like paste capable of easily adhering various things by attaching the tape paste of claim 1 to a coating apparatus.
JP2010210053A 2010-09-01 2010-09-01 Dot tape paste Pending JP2012052079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010210053A JP2012052079A (en) 2010-09-01 2010-09-01 Dot tape paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010210053A JP2012052079A (en) 2010-09-01 2010-09-01 Dot tape paste

Publications (1)

Publication Number Publication Date
JP2012052079A true JP2012052079A (en) 2012-03-15

Family

ID=45905773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010210053A Pending JP2012052079A (en) 2010-09-01 2010-09-01 Dot tape paste

Country Status (1)

Country Link
JP (1) JP2012052079A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020122104A (en) * 2019-01-31 2020-08-13 株式会社トンボ鉛筆 Transfer adhesive tape and transfer tool

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020122104A (en) * 2019-01-31 2020-08-13 株式会社トンボ鉛筆 Transfer adhesive tape and transfer tool
JP7194992B2 (en) 2019-01-31 2022-12-23 株式会社トンボ鉛筆 Adhesive transfer tape and transfer tool

Similar Documents

Publication Publication Date Title
WO2014152479A3 (en) Package with resealable opening
EP2807994A3 (en) Wound dressing formed with a two-sided adhesive band
MY175783A (en) Production method for laminate film, laminate film, and production method for semiconductor device employing same
SG11201902647VA (en) Thin film affixing device
EP2562737A3 (en) Pressure-sensitive adhesive label and label issuing device
JP2012052079A (en) Dot tape paste
CN204714894U (en) A kind of coating clamp
CN201895981U (en) Adhesive tape
EP2803949A3 (en) Scale holding device and encoder
CN203256541U (en) Electrostatic adsorption wallpaper
JP3213296U (en) Adhesive tape for carrying luggage
CN203858945U (en) Insulated sheet manufactured by drawing die
CN103834311A (en) Adhesive tape provided with directional rope
CN204417397U (en) A kind of transparent adhesive tape
CN209675620U (en) It is a kind of to store item with the matched charging cable of plate
CN203428615U (en) Adsorption adhesive tape using device
CN203513559U (en) Adhesive tape for processing follow-up film and wafer
CN205115360U (en) Film sticky tape
CN202880555U (en) Scotch tape provided with cutting blade
JP3201437U (en) Tape cutter
CN204417399U (en) A kind of transparent adhesive tape
JP3162003U (en) Adhesive tape with mount
CN203487078U (en) Adhesive tape for machining semiconductor wafers
CN104610882A (en) Adhesive tape provided with length indication layer
CN202390354U (en) Transparent double faced adhesive tape