CN203513559U - Adhesive tape for processing follow-up film and wafer - Google Patents
Adhesive tape for processing follow-up film and wafer Download PDFInfo
- Publication number
- CN203513559U CN203513559U CN201320836942.4U CN201320836942U CN203513559U CN 203513559 U CN203513559 U CN 203513559U CN 201320836942 U CN201320836942 U CN 201320836942U CN 203513559 U CN203513559 U CN 203513559U
- Authority
- CN
- China
- Prior art keywords
- film
- thickness
- adhesive tape
- follow
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Adhesive Tapes (AREA)
Abstract
The utility model discloses an adhesive tape for processing a follow-up film and a wafer. The adhesive tape comprises a follow-up film, a demolding film and an adhesive layer, wherein the follow-up film is arranged on the demolding film; the adhesive layer is arranged between the follow-up film and the demolding film; the thickness of the adhesive layer is smaller than that of the demolding film; the thickness of the follow-up film is smaller than that of the demolding film; the follow-up film is made of a polypropylene (PP) material; the thickness of the demolding film is 4-110nm; the thickness of the follow-up film is 3-100mm. According to the adhesive tape, the glue thickness is small, the wafer can be processed conveniently, and the adhesive tape has a practical value.
Description
Technical field
The utility model relates to a kind of for following the adhesive tape of film and wafer processing.
Background technology
Adhesive tape of a great variety, have many uses, but common configuration is single, and some inconveniences are processed for wafer, and thickness is thicker, produces complicated.
Utility model content
The utility model overcomes above-mentioned defect, provides a kind of for following the adhesive tape of film and wafer processing.
Technical scheme:
A kind of for following the adhesive tape of film and wafer processing, described adhesive tape comprises then film, mould release film and adhesive layer, described then film is located on described mould release film, between described then film and described mould release film, be provided with adhesive layer, the thickness of described adhesive layer is less than the thickness of mould release film, the described then thickness of film is less than the thickness of mould release film, and the described then material of film is PP material.
Further, described mould release film thickness 4-110 micron.
Further, described then film 3-100 micron.
Beneficial effect: glue thickness of the present utility model is less, convenient for wafer processing, there is practical value.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Description of reference numerals
20 adhesive tapes; 11 mould release films; 12 adhesive layer; 13 follow film.
Embodiment
A kind of for following the adhesive tape of film and wafer processing, described adhesive tape comprises then film, mould release film and adhesive layer, described then film is located on described mould release film, between described then film and described mould release film, be provided with adhesive layer, the thickness of described adhesive layer is less than the thickness of mould release film, the described then thickness of film is less than the thickness of mould release film, and the described then material of film is PP material.
Further, described mould release film thickness 4-110 micron.
Further, described then film 3-100 micron.
Beneficial effect: glue thickness of the present utility model is less, convenient for wafer processing, there is practical value.
Claims (3)
1. one kind for the then adhesive tape of film and wafer processing, it is characterized in that: described adhesive tape comprises then film, mould release film and adhesive layer, described then film is located on described mould release film, between described then film and described mould release film, be provided with adhesive layer, the thickness of described adhesive layer is less than the thickness of mould release film, the described then thickness of film is less than the thickness of mould release film, and the described then material of film is PP material.
2. according to claim 1 a kind of for the then adhesive tape of film and wafer processing, it is characterized in that: described mould release film thickness 4-110 micron.
3. according to claim 2 a kind of for the adhesive tape that then film and wafer are processed, it is characterized in that: described then film 3-100 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320836942.4U CN203513559U (en) | 2013-12-18 | 2013-12-18 | Adhesive tape for processing follow-up film and wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320836942.4U CN203513559U (en) | 2013-12-18 | 2013-12-18 | Adhesive tape for processing follow-up film and wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203513559U true CN203513559U (en) | 2014-04-02 |
Family
ID=50372516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320836942.4U Expired - Fee Related CN203513559U (en) | 2013-12-18 | 2013-12-18 | Adhesive tape for processing follow-up film and wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203513559U (en) |
-
2013
- 2013-12-18 CN CN201320836942.4U patent/CN203513559U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20141218 |
|
| EXPY | Termination of patent right or utility model |